CN118816165A

CN118816165A - COB light source device and assembly method thereof, and photographic light

Info

Publication number: CN118816165A
Application number: CN202411267536.XA
Authority: CN
Inventors: 林璧光
Original assignee: Guangdong Nanguang Television Equipment Co ltd
Current assignee: Guangdong Nanguang Television Equipment Co ltd
Priority date: 2024-09-11
Filing date: 2024-09-11
Publication date: 2024-10-22
Anticipated expiration: 2044-09-11
Also published as: CN118816165B

Abstract

The present application discloses a COB light source device and its assembly method and a photography light. The COB light source device includes a light source assembly, a heat dissipation assembly and a thermally conductive adhesive. The light source assembly includes a substrate and a light source part. The substrate includes a mounting surface and a connection surface that are arranged opposite to each other along its thickness direction. The light source part is installed on the mounting surface. The heat dissipation assembly is arranged on the side of the substrate away from the light source part along the thickness direction, and includes a temperature averaging plate. The temperature averaging plate is spaced from the connection surface in the thickness direction, and cooperates with the connection surface to form a glue-filled space. The thermally conductive adhesive is filled in the glue-filled space. The connection surface includes a central area and a peripheral area arranged outside the central area. In the thickness direction, the central area is closer to the temperature averaging plate than the peripheral area, and the distance from the peripheral area to the temperature averaging plate is greater than the distance from the central area to the temperature averaging plate, so that part of the thermally conductive adhesive can flow from the central area to the peripheral area during the connection process between the substrate and the connection surface. The COB light source device of the technical solution of the present application can meet the heat dissipation requirements of COB light source devices with higher power.

Description

COB light source device, assembling method thereof and photographic lamp

Technical Field

The application relates to the technical field of COB light source devices, in particular to a COB light source device, an assembling method thereof and a photographic lamp.

Background

At present, along with the continuous development of the film industry, the power of the photographic lamp is larger and larger, and the power consumption of the photographic lamp is larger and larger, so that a large amount of heat is generated in the use process of the COB light source of the photographic lamp, if the COB light source heat cannot be timely discharged, the use efficiency of the COB light source can be influenced, and the service life of the COB light source can be greatly shortened.

Disclosure of Invention

The embodiment of the application provides a COB light source device, an assembling method thereof and a photographic lamp, which can meet the heat dissipation requirement of the COB light source device with larger power.

In a first aspect, an embodiment of the present application provides a COB light source device, which is applicable to a photographic lamp, where the COB light source device includes a light source assembly, a heat dissipation assembly, and a heat conductive adhesive;

The light source assembly comprises a substrate and a light source piece, wherein the substrate comprises a mounting surface and a connecting surface which are oppositely arranged along the thickness direction of the substrate, and the light source piece is mounted on the mounting surface; the heat dissipation assembly is arranged on one side of the substrate, which is away from the light source piece, along the thickness direction and comprises a temperature equalizing plate, wherein the temperature equalizing plate is spaced from the connecting surface in the thickness direction and is matched with the connecting surface to form a glue filling space; the heat conducting glue is filled in the glue filling space so as to guide the heat transferred from the light source piece to the substrate to the temperature equalizing plate;

The connecting surface comprises a central area and a peripheral area arranged on the outer side of the central area, in the thickness direction, the central area is closer to the temperature equalizing plate than the peripheral area, and the distance from the peripheral area to the temperature equalizing plate is larger than the distance from the central area to the temperature equalizing plate, so that part of the heat conducting glue can flow from the central area to the peripheral area in the process of connecting the substrate and the connecting surface.

In some of these embodiments, the peripheral region gradually increases in distance from the temperature equalizing plate in the thickness direction in a direction of a center of the connection face toward an outer side.

In some embodiments, the peripheral area is an arc surface, and the arc surface is convexly arranged towards the direction of the temperature equalizing plate; or alternatively

The peripheral area is an inclined surface, and the inclined surface is arranged in an inclined manner along the direction of the center of the connecting surface to the outside and along the direction away from the temperature equalizing plate in the thickness direction.

In some embodiments, a distance from the peripheral region to the temperature equalizing plate in the thickness direction is L1, and the condition is satisfied: l1 is more than or equal to 0.15 mm less than or equal to 0.45 mm; and/or the number of the groups of groups,

Along the thickness direction, the thickness of the heat-conducting glue is L2, and the following conditions are satisfied: l2 is more than or equal to 0.05 mm less than or equal to 0.15 mm.

In some embodiments, each Wen Banbao comprises a plate body and a heat pipe;

The plate body is spaced from the connecting surface in the thickness direction and is matched with the connecting surface to form the glue filling space, a penetrating groove is formed in a concave manner on the plate surface of the plate body forming the glue filling space, and the penetrating groove is communicated with the glue filling space;

the heat pipe is provided with a heat exchange flow passage for flowing a heat exchange medium, and is penetrated in the penetrating groove, and part of the heat pipe is exposed through the penetrating groove so as to be in direct contact with the heat conducting glue.

In some embodiments, the peripheral area is provided with a plurality of first connecting holes, and the temperature equalizing plate is provided with a plurality of second connecting holes; the light source device further includes a plurality of first screws;

The first threaded piece sequentially penetrates through the first connecting hole and the second connecting hole, so that the peripheral area is in threaded connection with the temperature equalizing plate.

In some embodiments, the central area is provided with a third connecting hole, and the temperature equalizing plate is provided with a fourth connecting hole; the light source device further includes a second screw;

The second threaded piece penetrates through the third connecting hole and the fourth connecting hole, so that the central area is in threaded connection with the temperature equalizing plate.

In a second aspect, an embodiment of the present application provides an assembling method of the COB light source device described above, including:

coating the heat-conducting glue on the surface of the temperature equalization plate;

placing the substrate on a plate surface of the uniform temperature plate coated with the heat-conducting glue;

The central area of the connecting surface is in threaded connection with the temperature equalizing plate;

and the peripheral area of the connecting surface is in threaded connection with the temperature equalizing plate.

In some embodiments, the substrate is in a cuboid structure, and the peripheral region is provided with a plurality of first connecting holes, wherein the plurality of first connecting holes at least comprise a first sub-connecting hole, a second sub-connecting hole, a third sub-connecting hole, a fourth sub-connecting hole, a fifth sub-connecting hole and a sixth sub-connecting hole; the first sub-connecting holes, the second sub-connecting holes, the third sub-connecting holes and the fourth sub-connecting holes are respectively arranged at four corners of the peripheral area, the first sub-connecting holes and the second sub-connecting holes are arranged at intervals in the length direction of the substrate, the fifth sub-connecting holes are positioned between the first sub-connecting holes and the second sub-connecting holes along the length direction, the third sub-connecting holes and the fourth sub-connecting holes are arranged at intervals in the length direction, and the sixth sub-connecting holes are positioned between the third sub-connecting holes and the fourth sub-connecting holes along the length direction; the step of connecting the peripheral area of the connecting surface with the temperature equalizing plate in a threaded manner comprises the following steps:

providing a plurality of first screws;

The first threaded piece sequentially penetrates through the fifth sub-connecting hole and the temperature equalizing plate, and the first threaded piece sequentially penetrates through the sixth sub-connecting hole and the temperature equalizing plate;

The first threaded piece sequentially penetrates through the first sub-connecting hole and the temperature equalizing plate, and the first threaded piece sequentially penetrates through the fourth sub-connecting hole and the temperature equalizing plate;

The first threaded piece sequentially penetrates through the second sub-connecting hole and the temperature equalizing plate, and the first threaded piece sequentially penetrates through the third sub-connecting hole and the temperature equalizing plate.

In a third aspect, an embodiment of the present application provides a photographic lamp, including a housing and a COB light source device as described above;

The shell is provided with a containing cavity and a light outlet hole communicated with the containing cavity, the COB light source device is contained in the containing cavity, and light rays emitted by the light source part can pass through the light outlet hole.

According to the COB light source device, the assembling method thereof and the photographic lamp, compared with the peripheral area, the central area is closer to the temperature equalizing plate in the thickness direction, and the distance from the peripheral area to the temperature equalizing plate is larger than the distance from the central area to the temperature equalizing plate, so that the space from the peripheral area to the temperature equalizing plate is larger than the space from the central area to the temperature equalizing plate in the thickness direction, and therefore part of heat-conducting glue can flow from the central area to the peripheral area in the process of connecting the substrate and the connecting surface.

Thus, when the central region and the temperature equalizing plate are connected, the heat conductive adhesive flows toward the outer peripheral region under the extrusion of the central region and the temperature equalizing plate, and the space from the outer peripheral region to the temperature equalizing plate in the thickness direction is relatively large. Therefore, after the peripheral area is connected with the temperature equalization plate, a space is reserved for the heat conduction glue to continuously flow outwards, the heat conduction glue is effectively prevented from being accumulated in the central area or the junction of the peripheral area and the central area, the thickness of the whole heat conduction glue is uniform, the heat conduction glue located in the central area or the peripheral area and the central area is prevented from being larger than that of the heat conduction glue located in other positions, heat in the central area can be rapidly transferred to the temperature equalization plate through the heat conductivity, and the whole heat dissipation effect of the light source part is more uniform, so that the heat dissipation requirement of a high-power photographic lamp is met.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic cross-sectional view of a COB light source device according to an embodiment of the application;

FIG. 2 is a schematic cross-sectional view of the light source assembly of FIG. 1;

FIG. 3 is a schematic cross-sectional view of another embodiment of a COB light source device according to the present application;

FIG. 4 is a schematic cross-sectional view of the light source assembly of FIG. 3;

FIG. 5 is a schematic view of an embodiment of a light source module according to the present application;

FIG. 6 is a schematic view of the light source assembly of FIG. 5 from another perspective;

FIG. 7 is a schematic view of another embodiment of a light source module according to the present application;

FIG. 8 is a schematic structural view of an embodiment of a temperature uniformity plate according to the present application;

fig. 9 is a schematic flow chart of an assembling method of a COB light source device according to an embodiment of the application;

Fig. 10 is a flowchart illustrating an assembling method of a COB light source device according to an embodiment of the application.

Reference numerals illustrate:

100. COB light source device; 10A, filling a glue space; 10. a light source assembly; 11. a substrate; 111. a mounting surface; 112. a connection surface; 1121. a central region; 1121A, a third connection hole; 1122. a peripheral region; 1122A, a first connection hole; 1122B, a first sub-connection hole; 1122C, a second sub-connection hole; 1122D, a third sub-coupling hole; 1122E, fourth sub-coupling hole; 1122F, fifth sub-coupling hole; 1122G, a sixth sub-connection hole; 12. a light source member; 20. a heat dissipation assembly; 21. a temperature equalizing plate; 21A, a second connection hole; 21B, fourth connecting holes; 211. a plate body; 212. a heat pipe; 30. and (5) heat-conducting glue.

The achievement of the objects, functional features and advantages of the present application will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the present application more apparent, the following detailed description of the embodiments of the present application will be given with reference to the accompanying drawings.

When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the application. Rather, they are merely examples of apparatus and methods consistent with some aspects of the application as detailed in the accompanying claims.

In the description of the present application, it should be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art. Furthermore, in the description of the present application, unless otherwise indicated, "a plurality" means two or more. "and/or", describes an association relationship of an association object, and indicates that there may be three relationships, for example, a and/or B, and may indicate: a exists alone, A and B exist together, and B exists alone. The character "/" generally indicates that the context-dependent object is an "or" relationship.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description presented herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1, the application provides a photography luminaire, which is a common lighting device used in various scenes such as film, video, advertisement shooting, live broadcasting and the like, and is used for performing operations such as lighting on a shooting object so as to meet shooting requirements of various scenes. In an embodiment of the present application, the photography luminaire includes a case (not shown in the drawings) and the COB light source apparatus 100.

The shell is provided with a containing cavity and a light outlet. The COB light source device 100 is accommodated in the accommodating cavity, and light emitted by the COB light source device 100 can pass through the light emitting hole. Wherein, the COB light source apparatus 100 achieves higher luminous density and brightness by adopting a manner in which a plurality of LED chips are closely arranged.

Along with the continuous development of the video industry, for example, the space for shooting scenes is enlarged, the power requirement on the photographic lamp is increased, for example, the power is required to reach 500W-10000W, the heat consumption of the photographic lamp is increased due to the large power, so that a large amount of heat is generated by the COB light source device 100 in the use process, and if the heat of the COB light source device 100 cannot be timely discharged, the devices in the COB light source device 100 are overheated and damaged, and the service life of the COB light source device 100 is greatly shortened.

Referring to fig. 1-2, the COB light source device 100 of the present embodiment includes a light source assembly 10, a heat dissipation assembly 20, and a heat conductive adhesive 30. The light source assembly 10 can emit light to provide a desired light to a photographing object, and the emitted light can pass through the light emitting hole. Specifically, the light source assembly 10 includes a substrate 11 and a light source member 12, the light source member 12 being mounted on the substrate 11.

The substrate 11 is used as a heat dissipation and installation structure, can play a role in installing the light source component 12, and enables the overall heat distribution of the light source component 12 to be more uniform, wherein the substrate 11 can be of a cuboid structure, a cube structure and the like, so that the shape is more regular to facilitate processing and manufacturing. The material of the substrate 11 may be a metal material, for example, an aluminum material, so that the substrate 11 has the advantages of higher thermal conductivity, and the like, and can rapidly supply and discharge the heat generated by the light source member 12 during operation. The substrate 11 includes a mounting surface 111 and a connection surface 112, and the mounting surface 111 and the connection surface 112 are disposed opposite to each other in the thickness direction.

The light source member 12 may include a plurality of closely arranged LED chips to emit a desired light through the LED chips, and the light emitted from the light source member 12 may pass through the light emitting hole, where the plurality of LED chips may be LED chips with different color temperatures and different colors, and the embodiment is not limited thereto. The light source 12 is mounted on the mounting surface 111. The plurality of LED chips may be attached to the mounting surface 111, so that the light source 12 is mounted on the mounting surface 111, and the plurality of LED chips can be integrated.

The heat dissipation assembly 20 is used for dissipating heat transferred from the light source 12 to the substrate 11. Specifically, the heat dissipation assembly 20 is disposed on one side of the substrate 11 away from the light source member 12 along the thickness direction, and the heat dissipation assembly 20 includes a temperature equalizing plate 21, so that the temperature equalizing plate has the advantages of rapid heat conduction and heat diffusion, that is, the heat generated by the light source member 12 during operation can be rapidly transferred and diffused, thereby effectively reducing the temperature of the light source member 12 during operation. It should be noted that, when the power requirement of the light source assembly 10 is high, for example, 500W-10000W, the temperature equalizing plate 21 needs to be provided to achieve rapid heat dissipation, and on the basis of low power, a conventional metal heat conducting plate is selected. The temperature equalizing plate 21 is spaced from the connection surface 112 in the thickness direction, and is formed with a glue filling space 10A in cooperation with the connection surface 112.

Illustratively, the heat dissipating assembly 20 may further include a heat sink (not shown) in heat-transferring connection with a side of the temperature equalization plate 21 away from the substrate 11 to rapidly dissipate heat on the temperature equalization plate 21 by using the heat sink, wherein the heat sink may be an air-cooled type heat sink, for example, including a heat sink group and a heat dissipating fan, the heat sink group being in heat-transferring connection with the temperature equalization plate 21 and including a plurality of heat dissipating fins, and then accelerating a flow rate of ambient air flow by using operation of the heat dissipating fan to rapidly dissipate heat transferred from the temperature equalization plate 21 to the plurality of heat dissipating fins.

The heat-conducting glue 30 may be a heat-conducting silica gel, so as to have advantages of higher heat conductivity, better heat-conducting stability, etc., and of course, the heat-conducting glue 30 may also be in other colloid forms with heat-conducting properties, which is not limited in this embodiment. The heat-conducting glue 30 is filled in the glue filling space 10A and serves as a heat-conducting channel between the substrate 11 and the temperature-equalizing plate 21, so that heat transferred from the light source member 12 to the substrate 11 is guided to the temperature-equalizing plate 21, and the heat dissipation efficiency of the light source member 12 is enhanced.

The connection surface 112 includes a central region 1121 and a peripheral region 1122, the central region 1121 is located at the central position of the connection surface 112, and the peripheral region 1122 is disposed outside the central region 1121.

It is understood that the central region 1121 corresponds to the light source member 12 in the thickness direction, and the heat generation amount of the central region 1121 is larger than that of the peripheral region 1122 because the light source member 12 is the main heat generation source. The inventors found in the development process that, when the connection surface 112 is connected to the temperature equalization plate 21 and the central region 1121 is connected to the temperature equalization plate 21, the heat-conducting glue 30 flows toward the outer peripheral region 1122 under the extrusion of the central region 1121 and the temperature equalization plate 21, and then the outer peripheral region 1122 is connected to the temperature equalization plate 21, so as to achieve the fixed connection of the connection surface 112 and the temperature equalization plate 21. However, if the space between the peripheral region 1122 and the temperature uniformity plate 21 is small in the thickness direction, the heat conductive paste 30 may stay and accumulate at the boundary between the peripheral region 1122 and the central region 1121, or may even directly stay and accumulate at the central region 1121, so that the thickness of the heat conductive paste 30 in the space between the central region 1121 and the temperature uniformity plate 21 in the thickness direction may be affected to be thicker and thicker than the thickness of the heat conductive paste 30 in the space between the peripheral region 1122 and the temperature uniformity plate 21. Generally, the thicker the heat conductive paste 30, the worse the heat conductive effect, which tends to cause the heat of the central region 1121 with high heat generation amount to be unable to be discharged in time, and the heat dissipation effect is affected.

Accordingly, the present embodiment solves the above-described problems by setting the following, specifically: in the thickness direction, the central region 1121 is closer to the temperature uniformity plate 21 than the peripheral region 1122, and the distance from the peripheral region 1122 to the temperature uniformity plate 21 is greater than the distance from the central region 1121 to the temperature uniformity plate 21, so that the space from the peripheral region 1122 to the temperature uniformity plate 21 is greater than the space from the central region 1121 to the temperature uniformity plate 21 in the thickness direction, so that part of the heat conductive paste 30 can flow from the central region 1121 to the peripheral region 1122 during the connection of the substrate 11 to the connection surface 112.

In this way, when the central region 1121 is connected to the temperature-equalizing plate 21, the heat conductive paste 30 flows toward the outer peripheral region 1122 under the pressing of the central region 1121 and the temperature-equalizing plate 21, and the space from the outer peripheral region 1122 to the temperature-equalizing plate 21 is relatively large in the thickness direction. Therefore, after the peripheral region 1122 is connected with the temperature equalization plate 21, there is still enough space for the heat-conducting glue 30 to continue to flow outwards, so that the heat-conducting glue 30 is effectively prevented from accumulating in the central region 1121 or the junction between the peripheral region 1122 and the central region 1121, the overall thickness of the heat-conducting glue 30 is relatively uniform, and the heat-conducting glue 30 located in the central region 1121 or the peripheral region 1122 and the central region 1121 is prevented from being relatively thicker than the heat-conducting glue 30 located in other positions. In this way, the heat in the central region 1121 can be rapidly transferred to the temperature equalizing plate 21 through the heat conductivity, and the overall heat dissipation effect of the light source 12 is more uniform, so as to meet the heat dissipation requirement of the high-power photography lamp.

Referring to fig. 1-2 in combination, in some embodiments, the peripheral region 1122 is gradually increased in distance from the temperature uniformity plate 21 in the thickness direction in a direction of the center of the connecting surface 112 toward the outside.

So set up, can make peripheral district 1122 in the space of thickness direction to samming board 21, the outside direction is in the gradual expansion setting along the center of junction surface 112 for heat conduction glue 30 can flow to peripheral district 1122 comparatively smoothly, can prevent like this that peripheral district 1122 from having local regional stenosis to samming board 21's space in the thickness direction, and lead to heat conduction glue 30 circulation not smooth emergence to stop the condition emergence, with reduce heat conduction glue 30 stay in central district 1121 and cause the probability that stacks and make self thickness increase, in order to guarantee the good heat conduction effect of heat conduction glue 30 to central district 1121.

Of course, in other embodiments, the distance from the peripheral region 1122 to the temperature equalizing plate 21 in the thickness direction may be gradually increased in the direction of the center of the connecting surface 112 to the outside, and then the distance may be kept unchanged, which does not cause local narrowing of the space from the peripheral region 1122 to the temperature equalizing plate 21 in the thickness direction.

Referring to fig. 1,2 and 6, further, the peripheral region 1122 has an arc surface, and the arc surface is disposed to face the direction of the temperature uniformity plate 21. The arc-shaped surface with regular shape can smoothly flow the heat conducting glue 30 to the outer edge of the peripheral area 1122, so that the heat conducting glue 30 can flow more smoothly, accumulation is avoided, the arc-shaped surface with regular shape is convenient for workshop processing and manufacturing, and the production efficiency is greatly improved.

Referring to fig. 3-5, the peripheral region 1122 is an inclined surface, and the inclined surface is disposed obliquely in a direction away from the temperature uniformity plate 21 in the thickness direction along the center of the connection surface 112 in an outward direction. The arrangement is that the inclined plane with regular shape can smoothly flow the heat conduction glue 30 at the outer edge of the peripheral region 1122, so that the heat conduction glue 30 can flow more smoothly, accumulation is avoided, the inclined plane with regular shape is convenient for workshop processing and manufacturing, and the production efficiency is greatly improved.

Still further, the peripheral region 1122 is a surface formed by cutting a portion of the connection surface 112. It will be appreciated that the higher precision of the machining means of the cutting allows for higher dimensional accuracy of the finished peripheral region 1122, thereby facilitating an increase in the dimensional accuracy and tolerance level of the entire joint face 112.

Of course, the present application is not limited thereto, and the substrate 11 may be directly formed into the central region 1121 and the peripheral region 1122 by one-step molding, so that the number of processing steps can be reduced and the manufacturing efficiency can be improved.

Referring to fig. 1 and 3 in combination, in some embodiments, the distance from the peripheral region 1122 to the temperature uniformity plate 21 in the thickness direction is L1, which satisfies the condition: l1 is more than or equal to 0.15 mm less than or equal to 0.45 mm.

The distance L1 here refers to a distance when the peripheral region 1122 is not connected to the temperature equalization plate 21, and when the peripheral region 1122 is connected to the temperature equalization plate 21, the peripheral region 1122 deforms to a certain extent toward the temperature equalization plate 21, so that after the peripheral region 1122 is connected to the temperature equalization plate 21, the distance between the peripheral region 1122 and the temperature equalization plate 21 is smaller than the distance when the peripheral region 1122 is not connected to the temperature equalization plate 21.

On the basis that L1 is greater than or equal to 0.15 mm and less than or equal to 0.45 mm, the heat conducting glue 30 can flow to the peripheral region 1122 as much as possible, even to the outer edge of the peripheral region 1122, and the heat conducting efficiency of the heat conducting glue 30 can be ensured while the damage of the circuit of the substrate 11 can be reduced.

Specifically, if L1 is less than 0.15 mm, the space between the peripheral region 1122 and the temperature uniformity plate 21 in the thickness direction is small, and a large space cannot be reserved so that the heat conductive paste 30 flows to the peripheral region 1122. If L1 is greater than 0.45 mm, the peripheral region 1122 needs to be deformed to a larger extent to be in surface contact with the heat conductive paste 30 when connected to the temperature equalizing plate 21, so that the heat conductive effect is ensured, but since the substrate 11 itself has a printed circuit, if the substrate 11 is deformed to a larger extent, the printed circuit is affected, and the substrate 11 is damaged. Furthermore, if the distance between the peripheral region 1122 and the temperature uniformity plate 21 is too large, even if the substrate 11 is greatly deformed, a gap may still exist between the peripheral region 1122 and the heat conductive paste 30, which may cause the heat conductive paste 30 not to fill the paste filling space 10A, and the heat conductive efficiency may be affected.

Illustratively, the specific value of L1 may be 0.15 mm, 0.20 mm, 0.25 mm, 0.30 mm, 0.35 mm, 0.40 mm, or 0.45 mm, etc., which is not limited by the present embodiment.

Referring to fig. 1 and 3 in combination, in some embodiments, the thickness of the heat conductive paste 30 is L2 along the thickness direction, which satisfies the following conditions: l2 is more than or equal to 0.05 mm less than or equal to 0.15 mm.

The thickness L2 here refers to the thickness in the filling space after the central region 1121 and the temperature equalization plate 21 are connected and the peripheral region 1122 and the temperature equalization plate 21 are connected, and the flow of the heat conductive paste 30 is stopped.

On the basis of L2 being 0.05 mm or more and 0.15 mm or less, the heat conductive effect of the heat conductive paste 30 on the substrate 11, particularly on the central region 1121, can be ensured.

Specifically, if L2 is greater than 0.15 mm, the thickness of the heat conductive adhesive 30 is excessively large, which affects the heat transfer efficiency from the connection surface 112 to the temperature uniformity plate 21, and the heat transfer effect is poor. If L2 is less than 0.05 mm, the thickness of the heat-conducting glue 30 is too small, which may cause bubbles in the heat-conducting glue 30, and no heat-conducting channel formed by the heat-conducting glue 30 exists between the temperature-equalizing plate 21 and the substrate 11, so that the overall heat transfer efficiency between the temperature-equalizing plate 21 and the substrate 11 is affected.

Illustratively, the specific value of L2 may be 0.05 mm, 0.08 mm, 0.10 mm, 0.12 mm, 0.15 mm, or the like, which is not limited by the present embodiment.

Referring to FIG. 5, in some embodiments, the area ratio of the peripheral region 1122 in the connecting surface 112 is greater than the area ratio of the central region 1121 in the connecting surface 112. It will be appreciated that if the area ratio of the central region 1121 in the connection surface 112 is greater than the area ratio of the peripheral region 1122 in the connection surface 112, the area of the central region 1121 may be excessively large, which may cause the heat conductive paste 30 to flow from the central region 1121 to the peripheral region 1122 in a too long path, so that the heat conductive paste 30 may be easily accumulated in the central region 1121 or at the boundary between the central region 1121 and the peripheral region 1122, thereby affecting the heat dissipation of the central region 1121.

Based on this, in the present embodiment, by making the area occupation of the central region 1121 smaller, the path of the heat conductive paste 30 flowing from the central region 1121 to the peripheral region 1122 is made shorter, so that the probability that the heat conductive paste 30 is accumulated in the central region 1121 or the junction of the central region 1121 and the peripheral region 1122 can be reduced, the thickness of the partial region is avoided to be thicker, and the heat transfer effect to the central region 1121 is ensured.

Referring to fig. 1-4 in combination, in some embodiments, the central region 1121 is equidistant from the platen 21 in the thickness direction at each location in the outward direction of the center of the connecting surface 112. In this way, the thickness of the heat-conducting glue 30 filled in the space from the central area 1121 to the temperature equalizing plate 21 can be kept as uniform as possible, so that the heat-conducting effect of the heat-conducting glue 30 on the central area 1121 is uniform, and the local temperature of the central area 1121 is prevented from being too high.

Meanwhile, on the basis that the distances from the central area 1121 to the temperature equalization plate 21 along the thickness direction are equal at all positions of the central area 1121 in the direction of the center of the connecting surface 112 to the outside, the central area 1121 can be arranged in a plane, so that when the substrate 11 is placed on the temperature equalization plate 21, the substrate 11 can be horizontally placed on the temperature equalization plate 21 by depending on the central area 1121, and then the subsequent connection operation of the central area 1121 and the temperature equalization plate 21 is carried out, so that the assembly is very convenient and easy.

In some embodiments, the projection is performed along the thickness direction of the substrate 11, and the projection of the connection surface 112 is located within the temperature uniformity plate 21. In this way, compared with the projection portion of the connection surface 112 being located outside the temperature uniformity plate 21, the present embodiment can make the entire substrate 11 contact the temperature uniformity plate 21 through the heat conductive adhesive 30, so that the heat transfer efficiency of the substrate 11 to the temperature uniformity plate 21 can be improved.

Referring to fig. 8, in some embodiments, the temperature uniformity plate 21 includes a plate body 211 and heat pipes 212. The plate body 211 may have a substantially rectangular parallelepiped structure, and the plate body 211 may be made of copper, aluminum, stainless steel, or the like, which is not limited in this embodiment. The plate body 211 is spaced from the connection surface 112 in the thickness direction, and cooperates with the connection surface 112 to form the glue filling space 10A.

The heat pipe 212 may be made of copper material, so as to have good heat conductivity and corrosion resistance. The heat pipe 212 is disposed through the plate body 211, wherein the heat pipe 212 may be disposed through the plate body 211, and the heat pipe 212 is completely connected with the heat conductive adhesive 30 of the plate body 211 by heat transfer. The heat pipe 212 has a heat exchange flow path for the heat exchange medium to flow.

Referring to fig. 8, further, a board surface of the board body 211 forming the glue filling space 10A is concavely formed with a through groove, and the through groove is communicated with the glue filling space 10A.

The heat pipe 212 is disposed through the through groove, and a portion of the heat pipe 212 can be exposed through the through groove to directly contact with the heat conductive adhesive 30. In this way, compared with the heat pipe 212 indirectly connected with the heat conductive adhesive 30 through the plate body 211, the heat dissipation effect of the light source 12 can be further improved by the direct contact between the heat pipe 212 and the heat conductive adhesive 30 to improve the heat exchange efficiency of the temperature equalizing plate 21 and the heat conductive adhesive 30.

Referring to fig. 8, in some structural forms, the surface of the heat pipe 212 exposed to the through groove is a plane and is flush with the surface of the temperature equalization plate 21 facing the substrate 11. The surface of the temperature equalization plate 21 facing the substrate 11 is a plane, so that the substrate 11 can be tightly attached to the temperature equalization plate 21 through the heat conducting glue 30, effective heat transfer is guaranteed, and the heat dissipation effect on the light source piece 12 is further improved.

Specifically, the heat pipe 212 may be first inserted into the through slot, and then the portion of the heat pipe 212 protruding from the slot opening of the through slot is cut, so that the surface of the heat pipe 212 exposed from the through slot is a plane, thus the machining accuracy is higher, the machining difficulty is lower, and the machining is convenient.

In some configurations, the COB light source apparatus 100 further includes a filler (not shown) disposed between the outer tube wall of the heat tube 212 and the wall of the through-slot to achieve a fixed connection between the heat tube 212 and the wall of the through-slot.

The filler may be a heat-conducting caulking adhesive, so that the excellent heat-conducting property of the heat-conducting caulking adhesive can be utilized to further improve the heat exchange efficiency of the heat pipe 212 and the plate body 211. Of course, in other embodiments, the filler may also be solder, as the application is not limited in this regard.

Referring to fig. 6-8, in some embodiments, the peripheral region 1122 is provided with first connection holes 1122A, and the first connection holes 1122A are disposed through the substrate 11, where the first connection holes 1122A include a plurality of first connection holes 1122A arranged at intervals along the circumferential direction of the substrate 11. The temperature equalizing plate 21 is provided with second connection holes 21A, the second connection holes 21A include a plurality of, and one second connection hole 21A corresponds to one first connection hole 1122A. The COB light source apparatus 100 further includes a first screw (not shown), which includes a plurality of first screws, and one first screw is sequentially inserted into one first connection hole 1122A and one second connection hole 21A.

Therefore, the connection strength of the substrate 11 and the temperature equalization plate 21 can be improved, and the problem that the local heat transfer efficiency between the substrate 11 and the temperature equalization plate 21 is low due to unstable local connection between the substrate 11 and the temperature equalization plate is avoided, so that the overall heat transfer efficiency of the substrate 11 and the temperature equalization plate 21 is effectively ensured, and the heat dissipation requirement of a high-power photographic lamp is met.

Referring to fig. 6-8, further, the central region 1121 is provided with a third connecting hole 1121A, and the temperature equalizing plate 21 is provided with a fourth connecting hole 21B. The COB light source apparatus 100 further includes a second screw (not shown) penetrating the third and fourth connection holes 1121A and 21B to screw the central region 1121 to the temperature uniformity plate 21. It will be appreciated that the light source member 12 may be provided with a relief port opposite to and in communication with the third connecting hole 1121A for the second screw member to pass through.

In this way, in the actual assembly process, the second screw member may be first inserted into the third connecting hole 1121A and the fourth connecting hole 21B, so that the heat conductive adhesive 30 overflows to the peripheral area 1122, and when the heat conductive adhesive 30 gradually overflows to the peripheral area 1122 and flows to the outer edge of the peripheral area 1122, the first screw member is then inserted into the first connecting hole 1122A and the second connecting hole 21A, so that the heat conductive adhesive 30 is prevented from accumulating in the central area 1121 or the junction between the central area 1121 and the peripheral area 1122, and the overall thickness of the heat conductive adhesive 30 is uniform.

And, on the basis that the central area 1121 and the temperature equalization plate 21 have a connection relationship, the connection strength of the substrate 11 and the temperature equalization plate 21 can be further improved, and the problem that the local heat transfer efficiency between the substrate 11 and the temperature equalization plate 21 is lower due to unstable local connection between the substrate 11 and the temperature equalization plate 21 is avoided, so that the overall heat transfer efficiency of the substrate 11 and the temperature equalization plate 21 is effectively ensured, and the heat dissipation requirement of a high-power photographic lamp is met.

The present application also provides a method for assembling the COB light source device 100, and the method for assembling the COB light source device 100 provided by the present application is described in detail below with reference to specific embodiments.

Referring to fig. 9, a flow chart of an assembling method of a COB light source device 100 according to an embodiment of the application is shown. The assembly method of the embodiment of the present application may include the following steps S101 to S104.

S101, coating the heat-conducting glue 30 on the surface of the temperature equalizing plate 21.

Specifically, a coating tool (not shown in the figure) may be provided, for example, a coating sheet, where the coating sheet is placed on the surface of the temperature equalization plate 21, and a coating channel through which the heat conducting glue 30 flows is formed on the coating sheet, so that when the surface of the coating sheet facing away from the temperature equalization plate 21 is coated with the heat conducting glue 30, the heat conducting glue 30 flows along the coating channel to the surface of the temperature equalization plate 21, and finally the coating sheet is removed from the temperature equalization plate 21. The thickness of the heat-conducting glue 30 may be determined by the thickness of the coating channel, that is, the thickness of the coating channel is approximately equal to the thickness of the heat-conducting glue 30, so that the coating sheet of the coating channel with the corresponding thickness may be selected according to the required thickness of the heat-conducting glue 30.

S102, placing the substrate 11 on the surface of the temperature equalization plate 21 coated with the heat-conducting glue 30.

Specifically, when the substrate 11 is placed on the plate surface of the temperature equalization plate 21, the pre-fixing between the substrate 11 and the temperature equalization plate 21 may be achieved by using the viscosity of the heat-conducting glue 30, for example, when the central area 1121 is a plane and the plate surface of the temperature equalization plate 21 is a plane, the central area 1121 may be placed on the plate surface of the temperature equalization plate 21 first, so as to achieve pre-fixing.

S103, the central region 1121 of the connection surface 112 is screwed to the temperature equalization plate 21.

Specifically, the second screw may be sequentially inserted through the third and fourth connection holes 1121A and 21B, to achieve the screw connection of the central region 1121 and the temperature equalization plate 21. When the central region 1121 and the temperature equalization plate 21 are in threaded connection, the heat conducting glue 30 between the central region 1121 and the temperature equalization plate 21 can be extruded by the substrate 11 and the temperature equalization plate 21, so that the heat conducting glue 30 flows to the space between the peripheral region 1122 and the temperature equalization plate 21, and the heat conducting glue 30 is prevented from being accumulated at the central region 1121 or at the junction of the central region 1121 and the peripheral region 1122.

S104, the peripheral region 1122 of the connection surface 112 is screwed to the temperature equalization plate 21.

Specifically, the first screw may be sequentially inserted through the first connection hole 1122A and the second connection hole 21A, so that the peripheral region 1122 is screwed with the temperature uniformity plate 21. After the peripheral region 1122 is screwed with the temperature equalizing plate 21, the substrate 11 and the temperature equalizing plate 21 can be completely fixed, and at this time, when the photographic lamp works, the heat of the light source 12 sequentially passes through the substrate 11 and the heat conducting glue 30 and is finally transferred to the temperature equalizing plate 21.

It will be appreciated that, if the peripheral region 1122 is screwed with the temperature uniformity plate 21, and then the central region 1121 is screwed with the temperature uniformity plate 21, the heat-conducting glue 30 between the peripheral region 1122 and the temperature uniformity plate 21 will flow to the space between the central region 1121 and the temperature uniformity plate 21, so that the heat-conducting glue 30 between the central region 1121 and the temperature uniformity plate 21 cannot overflow outwards, and even the thickness of the heat-conducting glue 30 between the central region 1121 and the temperature uniformity plate 21 may be larger.

Therefore, in the embodiment of the application, the central area 1121 and the temperature equalization plate 21 are connected by threads, so that the heat conducting glue 30 between the central area 1121 and the temperature equalization plate 21 can overflow outwards, and the thickness of the whole heat conducting glue 30 is relatively uniform because the distance from the central area 1121 to the temperature equalization plate 21 is larger than that from the peripheral area 1122 to the temperature equalization plate 21, and a space is reserved between the peripheral area 1122 and the temperature equalization plate 21 to enable the heat conducting glue 30to go outwards, thereby effectively reducing the heat conducting glue 30to be accumulated at the central area 1121 or at the junction between the central area 1121 and the peripheral area 1122, effectively avoiding the heat conducting glue 30to be accumulated at the junction between the central area 1121 or the peripheral area 1122 and the central area 1121, preventing the heat conducting glue 30 between the central area 1121 and the peripheral area 1122 from being relatively larger than that of the other positions, so that the heat conducting glue 30 of the central area 1121 can rapidly pass through the central area 1121 or the junction between the peripheral area 1122 and the central area 1121 is relatively larger, and the heat conducting glue 30 is required to be transferred to the heat dissipation device of a uniform heat dissipation device 12, and the heat dissipation device can be more uniform.

Referring to fig. 5to 6 in combination, further, the substrate 11 has a rectangular parallelepiped structure, and the peripheral region 1122 has a plurality of first connection holes 1122A, wherein the plurality of first connection holes 1122A at least includes a first sub-connection hole 1122B, a second sub-connection hole 1122C, a third sub-connection hole 1122D, a fourth sub-connection hole 1122E, a fifth sub-connection hole 1122F, and a sixth sub-connection hole 1122G; the first sub-connection hole 1122B, the second sub-connection hole 1122C, the third sub-connection hole 1122D, and the fourth sub-connection hole 1122E are respectively disposed at four corners of the peripheral region 1122, the first sub-connection hole 1122B and the second sub-connection hole 1122C are arranged at intervals in the length direction of the substrate 11, the fifth sub-connection hole 1122F is located between the first sub-connection hole 1122B and the second sub-connection hole 1122C in the length direction, the third sub-connection hole 1122D and the fourth sub-connection hole 1122E are arranged at intervals in the length direction, and the sixth sub-connection hole 1122G is located between the third sub-connection hole 1122D and the fourth sub-connection hole 1122E in the length direction; wherein the peripheral region 1122 of the connection surface 112 is screwed to the temperature equalization plate 21.

Referring to fig. 10, in step S104, the method specifically includes: s201, providing a plurality of first screws.

Specifically, the outer surfaces of the plurality of first screws have external threads, and accordingly, the first, second, third and fourth sub-connection holes 1122B, 1122C, 1122D and 1122E have internal threads that mate with the external threads of the first screws.

S202, the fifth sub-connection hole 1122F and the temperature equalizing plate 21 are sequentially inserted through the first screw, and the sixth sub-connection hole 1122G and the temperature equalizing plate 21 are sequentially inserted through the first screw.

The first screw inserted through the fifth sub-connection hole 1122F is actually inserted through the second connection hole 21A of the temperature equalizing plate 21 opposite to the fifth sub-connection hole 1122F when the temperature equalizing plate 21 is inserted, and the first screw inserted through the sixth sub-connection hole 1122G is actually inserted through the second connection hole 21A of the temperature equalizing plate 21 opposite to the sixth sub-connection hole 1122G when the temperature equalizing plate 21 is inserted.

Specifically, it can be understood that the path distance between the fifth sub-connection hole 1122F and the sixth sub-connection hole 1122G is shorter in the width direction of the substrate 11 than the path distance between the first sub-connection hole 1122B and the fourth sub-connection hole 1122E and the path distance between the second sub-connection hole 1122C and the third sub-connection hole 1122D in the diagonal direction of the substrate 11. Therefore, after step S103, the heat-conducting glue 30 located in the central region 1121 flows toward the peripheral region 1122, and the heat-conducting glue 30 flowing along the paths of the fifth sub-connection hole 1122F and the sixth sub-connection hole 1122G reaches the peripheral region 1122 faster because the path distance between the fifth sub-connection hole 1122F and the sixth sub-connection hole 1122G is shorter, so that even if the heat-conducting glue 30 located near the fifth sub-connection hole 1122F and the sixth sub-connection hole 1122G flows toward the central region 1121 after step S202 is implemented, the heat-conducting glue 30 is prevented from colliding and accumulating in the central region 1121.

S203, the first screw is sequentially inserted into the first sub-connection hole 1122B and the temperature equalizing plate 21, and the first screw is sequentially inserted into the fourth sub-connection hole 1122E and the temperature equalizing plate 21.

When the temperature equalizing plate 21 is inserted, the first screw inserted into the first sub-connection hole 1122B is actually inserted into the second connection hole 21A of the temperature equalizing plate 21 opposite to the first sub-connection hole 1122B, and when the temperature equalizing plate 21 is inserted into the first screw inserted into the fourth sub-connection hole 1122E, the first screw inserted into the fourth sub-connection hole 1122E is actually inserted into the second connection hole 21A of the temperature equalizing plate 21 opposite to the fourth sub-connection hole 1122E.

Specifically, the step S203 is provided after the step S202, so that the heat conductive paste 30 flowing along the paths of the first sub-connection hole 1122B and the fourth sub-connection hole 1122E has a longer time to flow out to the peripheral region 1122, and at this time, when the step S203 is implemented, the heat conductive paste 30 has actually flowed to a position close to the first sub-connection hole 1122B and the second sub-connection hole 1122C, so that even after the step S203 is completed, this portion of the heat conductive paste 30 can be prevented from colliding with the heat conductive paste 30 located near the fifth sub-connection hole 1122F and at the sixth sub-connection hole 1122G to be accumulated at the central region 1121. In addition, when the heat conductive paste 30 does not flow to the peripheral region 1122, the positions of the first and second sub-connection holes 1122B and 1122C in the peripheral region 1122 are also prevented from being connected to the temperature equalizing plate 21, and the heat conductive paste 30 flowing along the paths of the first and fourth sub-connection holes 1122B and 1122E is prevented from flowing into the peripheral region 1122 in a space.

Moreover, after the first and fourth sub-connection holes 1122B and 1122E diagonally arranged are locked, it is possible to ensure that the substrate 11 and the temperature uniformity plate 21 are not easily deviated from each other, so that the subsequent connection step is facilitated.

S204, the first screw is sequentially inserted into the second sub-connection hole 1122C and the temperature equalizing plate 21, and the first screw is sequentially inserted into the third sub-connection hole 1122D and the temperature equalizing plate 21.

When the temperature equalizing plate 21 is inserted, the first screw inserted into the second sub-connecting hole 1122C is actually inserted into the second connecting hole 21A of the temperature equalizing plate 21 opposite to the second sub-connecting hole 1122C, and when the temperature equalizing plate 21 is inserted into the first screw inserted into the third sub-connecting hole 1122D, the first screw inserted into the third sub-connecting hole 1122D is actually inserted into the second connecting hole 21A of the temperature equalizing plate 21 opposite to the third sub-connecting hole 1122D.

Similarly, after step S202, the heat conductive paste 30 flowing along the paths of the second sub-connection hole 1122C and the third sub-connection hole 1122D can be allowed to flow out to the peripheral region 1122 for a long time, and at this time, when step S204 is implemented, the heat conductive paste 30 is actually already flowing to a position close to the second sub-connection hole 1122C and the third sub-connection hole 1122D, so that even after step S204 is completed, the heat conductive paste 30 is prevented from colliding with the heat conductive paste 30 located near the second sub-connection hole 1122C and at the third sub-connection hole 1122D and accumulating at the central region 1121. In addition, when the heat conductive paste 30 does not flow to the peripheral region 1122, the positions of the second and third sub-connection holes 1122C and 1122D in the peripheral region 1122 are also prevented from being connected to the temperature equalizing plate 21, and the heat conductive paste 30 flowing to the peripheral region 1122 in a path between the second and third sub-connection holes 1122C and 1122D is prevented from being spatially separated.

In the embodiment of the present application, the fifth sub-connection hole 1122F and the sixth sub-connection hole 1122G, which have relatively short paths, are locked first, and then the first sub-connection hole 1122B and the fourth sub-connection hole 1122E, and the second sub-connection hole 1122C and the third sub-connection hole 1122D, which have relatively long paths, are locked second, so that the probability of stacking the heat-conducting glue 30 in the central area 1121 can be effectively reduced, the heat-conducting effect of the heat-conducting glue 30 on the central area 1121 can be improved, and the heat-dissipating effect of the central area 1121 can be further improved.

Of course, in other embodiments, the step S203 may be replaced with the locking operation of the first sub-connection hole 1122B and the second sub-connection hole 1122C, and correspondingly, the step S204 may be replaced with the locking operation of the third sub-connection hole 1122D and the fourth sub-connection hole 1122E, which is not limited to the present application.

The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present application, it should be understood that, if there is an azimuth or positional relationship indicated by terms such as "upper", "lower", "left", "right", etc., based on the azimuth or positional relationship shown in the drawings, it is only for convenience of describing the present application and simplifying the description, but it is not indicated or implied that the apparatus or element referred to must have a specific azimuth, be constructed and operated in a specific azimuth, and thus terms describing the positional relationship in the drawings are merely illustrative and should not be construed as limitations of the present patent, and specific meanings of the terms described above may be understood by those skilled in the art according to specific circumstances.

The foregoing description of the preferred embodiments of the application is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the application.

Claims

1. A COB light source apparatus, which is adapted to a photographic lamp, comprising:

The light source assembly comprises a substrate and a light source piece, wherein the substrate comprises a mounting surface and a connecting surface which are oppositely arranged along the thickness direction of the substrate, and the light source piece is mounted on the mounting surface;

The heat dissipation assembly is arranged on one side of the substrate, which is away from the light source piece, along the thickness direction and comprises a temperature equalizing plate, wherein the temperature equalizing plate is spaced from the connecting surface in the thickness direction and is matched with the connecting surface to form a glue filling space; and

The heat-conducting glue is filled in the glue filling space so as to guide the heat transferred from the light source piece to the substrate to the temperature equalizing plate;

2. The COB light source apparatus of claim 1, wherein the peripheral region gradually increases in distance from the temperature equalizing plate in the thickness direction in a direction of a center of the connection face toward the outside.

3. The COB light source apparatus of claim 2, wherein the peripheral zone is an arcuate surface, the arcuate surface being convexly disposed toward the temperature equalization plate; or alternatively

4. The COB light source apparatus of claim 2, wherein the distance from the peripheral region to the temperature-equalizing plate in the thickness direction is L1, satisfying the condition: l1 is more than or equal to 0.15 mm less than or equal to 0.45 mm; and/or the number of the groups of groups,

5. The COB light source apparatus of claim 1, wherein the temperature-equalizing plate comprises:

the plate body is spaced from the connecting surface in the thickness direction and matched with the connecting surface to form the glue filling space, a penetrating groove is formed in a concave manner on the plate surface of the plate body forming the glue filling space, and the penetrating groove is communicated with the glue filling space; and

The heat pipe is provided with a heat exchange flow channel for flowing a heat exchange medium, and is penetrated in the penetrating groove, and part of the heat pipe is exposed through the penetrating groove so as to be in direct contact with the heat conducting glue.

6. The COB light source apparatus as claimed in any one of claims 1 to 5, wherein the peripheral region is provided with a plurality of first connection holes, and the temperature equalizing plate is provided with a plurality of second connection holes; the light source device further includes:

The first threaded pieces sequentially penetrate through the first connecting holes and the second connecting holes, so that the peripheral area is in threaded connection with the temperature equalizing plate.

7. The COB light source apparatus of claim 6 wherein the central region is provided with a third connection hole and the temperature equalizing plate is provided with a fourth connection hole; the light source device further includes:

and the second threaded piece is arranged in the third connecting hole and the fourth connecting hole in a penetrating way so that the central area is in threaded connection with the temperature equalizing plate.

8. A method of assembling the COB light source apparatus of any one of claims 1-7, wherein the method of assembling comprises:

9. The method of assembling a COB light source apparatus of claim 8, wherein the substrate has a rectangular parallelepiped configuration, and the peripheral region has a plurality of first connection holes including at least a first sub-connection hole, a second sub-connection hole, a third sub-connection hole, a fourth sub-connection hole, a fifth sub-connection hole, and a sixth sub-connection hole; the first sub-connecting holes, the second sub-connecting holes, the third sub-connecting holes and the fourth sub-connecting holes are respectively arranged at four corners of the peripheral area, the first sub-connecting holes and the second sub-connecting holes are arranged at intervals in the length direction of the substrate, the fifth sub-connecting holes are positioned between the first sub-connecting holes and the second sub-connecting holes along the length direction, the third sub-connecting holes and the fourth sub-connecting holes are arranged at intervals in the length direction, and the sixth sub-connecting holes are positioned between the third sub-connecting holes and the fourth sub-connecting holes along the length direction; the step of connecting the peripheral area of the connecting surface with the temperature equalizing plate in a threaded manner comprises the following steps:

providing a plurality of first screws;

10. A photographic lamp, comprising:

the shell is provided with a containing cavity and a light outlet hole communicated with the containing cavity; and

The COB light source apparatus of any one of claims 1-7, accommodated in the accommodation chamber, and the light emitted from the light source member can pass through the light exit hole.