CN118714795A

CN118714795A - Cooling device, cooling system and electronic equipment

Info

Publication number: CN118714795A
Application number: CN202310353948.4A
Authority: CN
Inventors: 佘振宇; 王超; 谭祥辉; 闫涛
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2023-03-25
Filing date: 2023-03-25
Publication date: 2024-09-27
Also published as: WO2024199186A1

Abstract

The embodiment of the application provides a cooling device, a cooling system and electronic equipment, relates to the field of heat dissipation, and aims to solve the problem that a heating element is poor in heat dissipation effect in a compact space. The cooling device includes: a first housing, a second housing, and a middle housing; the middle shell is provided with a plurality of jet holes. The first shell and the second shell are respectively positioned at two opposite sides of the middle shell, the first shell and the middle shell enclose a jet flow cavity, and the second shell and the middle shell enclose a boiling cavity; the jet hole is communicated with the jet cavity and the boiling cavity; the surface of the second shell, which faces away from the middle shell, comprises a heating element veneer; the cooling device also comprises a liquid inlet channel and a liquid outlet channel, wherein the liquid inlet channel is communicated with the jet flow cavity, and the liquid outlet channel is communicated with the boiling cavity. The cooling device is used for radiating heat of the heating element.

Description

Cooling device, cooling system and electronic equipment

Technical Field

The present application relates to the field of heat dissipation technologies, and in particular, to a cooling device, a cooling system, and an electronic device.

Background

Along with the development of technology, electronic equipment's function increases gradually, and the inner space reduces gradually, and traditional forced air cooling system is difficult to satisfy the inside heating element's of electronic equipment heat dissipation demand in compact space, leads to current forced air cooling system's cooling effect relatively poor.

Disclosure of Invention

The application provides a cooling device, a cooling system and electronic equipment, thereby alleviating the problem of poor heat dissipation effect of a heating element in a compact space.

In a first aspect, there is provided a cooling device comprising: the first casing, second casing and middle part casing. The middle shell is provided with a plurality of jet holes; the first shell and the second shell are respectively positioned at two opposite sides of the middle shell, the first shell and the middle shell enclose a jet flow cavity, and the second shell and the middle shell enclose a boiling cavity; the jet hole is communicated with the jet cavity and the boiling cavity; the surface of the second shell, which faces away from the middle shell, comprises a heating element veneer; the cooling device also comprises a liquid inlet channel and a liquid outlet channel, wherein the liquid inlet channel is communicated with the jet flow cavity, and the liquid outlet channel is communicated with the boiling cavity.

The heating element veneers can be attached to the surface of the heating element, and then the area where the heating element veneers are located in the second shell can absorb heat of the heating element. The liquid inlet channel is communicated with the jet flow cavity, so that the liquid working medium can enter the jet flow cavity through the liquid inlet channel and then flow to the middle shell. The middle shell is provided with a plurality of jet holes, the jet holes can be communicated with the jet flow cavity and the boiling cavity, and then liquid working medium in the jet flow cavity can enter the boiling cavity through the jet holes. The liquid outlet channel is communicated with the boiling cavity, so that working medium can enter the liquid outlet channel from the boiling cavity and be discharged from the liquid outlet. Wherein, be provided with a plurality of jet holes on the middle part casing, and then liquid working medium can be divided into stranded liquid working medium on the middle part casing, consequently, after liquid working medium passes through the middle part casing, can improve the coverage area of liquid working medium to this area that is erodeed that can increase heating element wainscot place region makes liquid working medium and heating element wainscot place region can fully contact, and then can improve the cooling effect of liquid working medium to heating element wainscot place region, with this cooling device that can improve.

In some embodiments, a surface of the second housing proximate the middle housing includes a heat dissipating contact surface; the cooling device further comprises a plurality of cooling strengthening structures, and the cooling strengthening structures are arranged on the heat dissipation contact surface at intervals.

The cooling strengthening structures and the areas where the cooling contact surfaces are located can jointly absorb heat generated by the heating element by arranging a plurality of cooling strengthening structures on the cooling contact surfaces. When the liquid working medium enters the boiling cavity, the liquid working medium can be contacted with the area where the heat radiation contact surface is located and can be contacted with a plurality of cooling strengthening structures, so that the heat exchange area of the liquid working medium and the cooling device can be increased, and the cooling effect of the cooling device on the heating element is better as the heat exchange area is larger. Therefore, the cooling effect of the cooling device on the heating element can be improved by providing the cooling enhancing structure on the heat radiation contact surface.

In some embodiments, the cooling enhancing structure is spaced from the middle housing along a first direction, wherein the first direction is a direction in which the first housing, the middle housing, and the second housing are disposed in sequence.

Wherein, through making cooling strengthening structure and second casing interval setting can improve boiling chamber volume to can be convenient for liquid working medium get into boiling chamber, thereby can be convenient for liquid working medium and heat dissipation contact surface fully contact, and then can improve the cooling effect of liquid working medium to the region at heat dissipation contact surface place, with this cooling effect that can improve cooling device to heating element.

In some embodiments, the orthographic projection of the jet aperture on the heat sink contact surface is offset from the location of the cooling enhancement structure.

After the liquid working medium enters the boiling cavity through the jet hole, the liquid working medium can jet to the bottom of the cooling strengthening structure, so that the liquid working medium can fully enter the boiling cavity to fully contact with the heat dissipation contact surface and the cooling strengthening structure, and the cooling effect of the cooling device on the heating element can be improved.

In some embodiments, the cooling device further includes a plurality of hole extension portions, the plurality of hole extension portions are located on a surface of the middle housing facing the second housing, orthographic projections of outer walls of the plurality of hole extension portions on the middle housing are respectively arranged around the plurality of jet holes, an extension channel is arranged in the Kong Yanchang portion, one end of the extension channel is communicated with the jet hole surrounded by the hole extension portion where the extension channel is located, and the other end of the extension channel faces the heat dissipation contact surface.

Wherein, liquid working medium can enter the extension channel after passing through the jet hole. Therefore, after the liquid working medium leaves the jet hole, the hole extension part can restrict the liquid working medium to flow towards the heat radiation contact surface, and prevent the liquid working medium from dispersing towards the periphery of the hole extension part, so that the flow speed of the liquid working medium can be improved, and the speed of liquid flushing the heat radiation contact surface and the cooling strengthening structure can be improved, so that the cooling speed of the heating element can be improved.

In some embodiments, an end of the bore extension distal from the middle housing is flush with an end of the cooling enhancement structure distal from the heat sink contact surface.

Wherein the hole extension portion extends into the boiling chamber, and thus the hole extension portion occupies the space in the boiling chamber. Wherein, the bigger the boiling cavity is, the more favorable the liquid working medium to enter the boiling cavity. Through making the one end that middle part casing was kept away from to hole extension and the one end parallel and level that the cooling strengthening structure kept away from the heat dissipation contact surface, can avoid hole extension to occupy too much space in the boiling chamber, be unfavorable for liquid working medium to get into the boiling chamber. In addition, the longer the length of the hole extension portion, the longer the time the liquid working medium is constrained by the hole extension portion, and the faster the flow velocity of the liquid working medium when the liquid working medium flows out from the extension channel. Through making the hole extension keep away from the one end parallel and level of the one end that the heat dissipation contact surface was kept away from to the cooling enhancement structure, can make the extension passageway have longer length, and then when guaranteeing that liquid working medium flows by the extension passageway, liquid working medium has faster velocity of flow to this can guarantee the radiating effect of liquid working medium to heat dissipation contact surface place region and cooling enhancement structure.

In some embodiments, the liquid inlet channel and the liquid outlet channel are both located within the first housing; the middle shell is provided with a first reflux port, the first reflux port is arranged around the plurality of jet holes, and the first reflux port is communicated with the boiling cavity and the liquid outlet channel.

The liquid working medium enters the jet cavity through the liquid inlet channel, then enters the boiling cavity through the jet hole on the second shell, contacts with the area where the heating element is faced, can form a gas-liquid two-phase working medium after radiating the heating element, and can enter the liquid outlet channel through the first backflow port and then be discharged through the liquid outlet channel. The working medium entering the boiling cavity is discharged from the first backflow port, the temperature of the gas-liquid two-phase working medium discharged from the first backflow port is higher than that of the liquid working medium flowing through the jet port, the first backflow port is arranged around the jet part, the jet port positioned at the edge on the first backflow port and the second shell is adjacent to other jet ports, the distance between the first backflow port and the jet port is far away from other jet ports, and therefore the temperature of the gas-liquid two-phase working medium discharged from the first backflow port influences the temperature of the liquid working medium entering from the jet port, the heat dissipation effect of the liquid working medium on the area where the heating element is located can be improved, and the heat dissipation effect of the cooling device on the heating element can be improved.

In some embodiments, the middle housing includes a jet portion and a first return portion disposed one revolution along an edge of the jet portion, the plurality of jet apertures disposed on the jet portion, the first return aperture disposed on the first return portion; the first shell is provided with a first groove and a first converging cavity, and the jet flow part covers the notch of the first groove to form a jet flow cavity; the liquid inlet channel is communicated with the first groove; the first converging cavity is arranged along part of the edge of the notch of the first groove and is communicated with the first reflux port and the liquid outlet channel.

The liquid inlet channel is communicated with the first groove, the jet flow part covers the notch of the first groove to form a jet flow cavity, so that liquid working medium can enter the first groove, namely the jet flow cavity, from the liquid inlet channel, then the liquid working medium can flow to the notch of the first groove and enter the boiling cavity through the jet flow hole on the jet flow part. After the liquid working medium cools the area where the heating element is faced, the gas-liquid two-phase working medium can flow to the periphery of the area where the heating element is faced, and is converged in the first converging cavity through the first backflow port, and then enters the liquid outlet channel from the first converging cavity.

In some embodiments, the liquid inlet channel is located in the first housing and the liquid outlet channel is located in the middle housing; the middle shell is also provided with a second reflux port, the second reflux port is arranged around the plurality of jet holes, and the second reflux port is communicated with the boiling cavity and the liquid outlet channel.

The liquid outlet channel is arranged at the periphery of all jet holes, and the second reflux port is adjacent to the jet holes at the edge of the second shell and is far away from other jet holes, so that the heat exchange quantity between the liquid working medium passing through the jet holes and the gas-liquid working medium passing through the second reflux port can be reduced, the liquid working medium passing through the jet holes can have lower temperature, and the cooling effect of the cooling device on the heating element can be improved.

In some embodiments, the middle shell comprises a jet flow part and a second converging part, the second converging part is arranged along at least part of the edge of the jet flow part, a plurality of jet holes are arranged on the jet flow part, a second converging cavity is arranged in the second converging part, a second backflow port is arranged on one side of the second converging part facing the second shell, and the second converging cavity is communicated with the second backflow port and the liquid outlet channel; the first shell is provided with a second groove, and the jet part covers the notch of the second groove to form a jet cavity; the liquid inlet channel is communicated with the second groove.

The liquid inlet channel is communicated with the second groove, and the jet part covers the notch of the second groove to form a jet cavity, so that the liquid working medium can enter the second groove, namely the jet cavity from the liquid inlet channel. Then the liquid working medium can flow to the notch of the second groove, enters the boiling cavity through the jet hole on the jet part, after the liquid working medium cools the area where the heating element is faced, the gas-liquid two-phase working medium can flow to the periphery of the area where the heating element is faced, and is converged in the first converging cavity through the second backflow port, and then enters the liquid outlet channel through the second converging cavity.

In some embodiments, the liquid inlet channel is located in the first housing and the liquid outlet channel is located in the second housing.

Wherein, through setting up the feed liquor passageway in first casing, and the drain passageway sets up in the second casing, and then can set up feed liquor passageway and drain passageway respectively in different structures, thereby can avoid taking place the heat transfer between the liquid working medium of lower temperature in the feed liquor passageway and the higher gas-liquid two-phase working medium of temperature in the drain passageway, thereby can guarantee that the liquid working medium in the feed liquor passageway has lower temperature, and then can improve the heat transfer effect between liquid working medium and the heating element wainscot place region, and then can improve cooling device to heating element's cooling effect.

In some embodiments, a third groove is formed on the first shell, and the middle shell covers the notch of the third groove to form a jet cavity; the liquid inlet channel is communicated with the third groove; the second shell is provided with a boiling groove, and the middle shell covers the notch of the boiling groove to form a boiling cavity; the liquid outlet channel is communicated with the boiling tank.

The liquid inlet channel is communicated with the third groove, and the jet part covers the notch of the third groove to form a jet cavity, so that the liquid working medium can enter the third groove, namely the jet cavity, through the liquid inlet channel. Then the liquid working medium can flow to the notch of the third groove, enters the boiling groove through the jet hole on the jet part, and can be discharged from the liquid outlet channel after contacting the area where the heating element is faced. At this time, the gas-liquid two-phase working medium can directly enter the liquid outlet channel from the boiling tank, so that the path of the gas-liquid two-phase working medium can be shortened, and the gas-liquid two-phase working medium is conveniently discharged.

In a second aspect, a cooling system is provided, which comprises the cooling device provided in some embodiments above, a liquid inlet pipe and a liquid outlet pipe, wherein the liquid inlet pipe is connected to a liquid inlet channel of the cooling device; the liquid outlet pipe is connected with the liquid outlet channel of the cooling device.

The liquid inlet pipe is connected to the liquid inlet channel, so that the liquid working medium can enter the liquid inlet channel from the liquid inlet pipe, the liquid outlet pipe is communicated with the liquid outlet channel, and the liquid outlet channel can discharge the gas-liquid two-phase working medium to the liquid outlet pipe. The cooling system includes the cooling device provided by some of the above embodiments, and thus, the cooling system includes all the advantageous effects of the cooling device provided by some of the above embodiments, which are not described herein.

In a third aspect, an electronic device is provided that includes a heat generating element and a cooling system provided by some of the embodiments above, the heat generating element facing of a cooling device of the cooling system being in contact with an outer surface of the heat generating element.

The electronic device includes the cooling system provided by some of the above embodiments, and therefore, the electronic device includes all the beneficial effects of the cooling system provided by some of the above embodiments, which are not described herein.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device 4000 according to some embodiments;

FIG. 2 is a block diagram of a cooling system according to some embodiments;

FIG. 3 is a block diagram of the cooling device of FIG. 2;

FIG. 4 is an exploded view of the cooling device of FIG. 2;

FIG. 5 is a cross-sectional view of the cooling device of FIG. 2 along section line A-A';

FIG. 6 is another cross-sectional view of the cooling device of FIG. 2 along section line A-A';

FIG. 7 is a schematic illustration of a jet hole offset from a cooling enhancement structure according to some embodiments;

FIG. 8 is another schematic illustration of a jet aperture offset from a cooling enhancement structure according to some embodiments;

FIG. 9 is another cross-sectional view of the cooling device of FIG. 2 along section line A-A';

FIG. 10 is a partial enlarged view at B in FIG. 9;

FIG. 11 is another schematic structural view of a cooling device;

FIG. 12 is a structural exploded view of a cooling device according to some embodiments;

FIG. 13 is another schematic structural view of the cooling device of FIG. 12;

FIG. 14 is a block diagram of the first housing of FIG. 12;

FIG. 15 is a block diagram of the middle housing of FIG. 12;

FIG. 16 is a block diagram of the second housing of FIG. 12;

FIG. 17 is a structural exploded view of a cooling device according to some embodiments;

FIG. 18 is another schematic structural view of the cooling device of FIG. 17;

FIG. 19 is another schematic view of the cooling device of FIG. 17;

FIG. 20 is another schematic structural view of the cooling device of FIG. 17;

FIG. 21 is a schematic view of a further construction of the cooling device of FIG. 17;

FIG. 22 is another schematic structural view of a cooling device according to some embodiments;

FIG. 23 is an exploded view of the cooling device of FIG. 22;

FIG. 24 is another schematic view of the cooling device of FIG. 22;

FIG. 25 is a cross-sectional view of the cooling device of FIG. 22;

Fig. 26 is a structural view of the cooling device of fig. 22 at another view angle.

Detailed Description

The following description of the embodiments of the present disclosure will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present disclosure. All other embodiments obtained by one of ordinary skill in the art based on the embodiments provided by the present disclosure are within the scope of the present disclosure.

In the description of the present specification, the terms "some embodiments (some embodiments)", "examples (examples)", or "some examples (some examples)", etc. are intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The terms "first" and "second" are used below for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the embodiments of the present disclosure, unless otherwise indicated, the meaning of "a plurality" is two or more.

As used herein, "perpendicular", "equal" includes the stated case as well as the case that is similar to the stated case, the range of which is within an acceptable deviation range as determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system). For example, "vertical" includes absolute vertical and near vertical, where the acceptable deviation range for near vertical may also be, for example, deviations within 5 °. "equal" includes absolute equal and approximately equal, where the difference between the two, which may be equal, for example, is less than or equal to 5% of either of them within an acceptable deviation of approximately equal.

As used herein, "approximately" or "approximately" includes the stated values as well as average values within an acceptable deviation range for the particular value as determined by one of ordinary skill in the art in view of the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system).

It will be understood that when a layer or element is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may also be present between the layer or element and the other layer or substrate.

The electronic device is provided with a plurality of power elements which cooperate with each other so that the electronic device can realize various functions.

By way of example, common electronic devices are servers, hosts, and the like. Power elements such as a CPU (Central Processing Unit ), an APU (ACCELERATED PROCESSING UNIT, acceleration processor), a GPU (Graphics Processing Unit, graphics processor), and a power supply may be provided in the electronic device, which are not illustrated herein.

In order not to affect the normal operation of the electronic device, a heat dissipation system is usually arranged in the electronic device, and the heat dissipation system can dissipate heat for the power element.

A conventional heat dissipation system may include a heat dissipation member to which a heating element may be attached, and a fan to which a flow of air may be provided to remove heat from the heat dissipation member to dissipate the heat from the heating element. The heat dissipation element can comprise any one of a copper plate, a heat pipe and a vapor chamber. In some examples, the heat dissipation capacity of the heat dissipation system may be increased by adding heat dissipation fins to the heat dissipation member, increasing the area of the heat dissipation fins, or increasing the fan air volume.

However, as electronic devices are gradually miniaturized, the space inside the electronic devices is gradually reduced, and the conventional heat dissipation system between the heat generating elements is gradually difficult to meet the heat dissipation requirement of the heat generating elements in the electronic devices in a compact space.

Based on this, the application provides an electronic device.

Fig. 1 is a schematic structural diagram of an electronic device according to some embodiments.

Referring to fig. 1, an electronic device 4000 may include a housing 3000, a plurality of power elements 2000 and a cooling system 1000, wherein the plurality of power elements and the cooling system 1000 may be disposed in an accommodating space enclosed by the housing 3000.

At least one of the plurality of power elements 2000 is a heat generating element 2001, and in fig. 1, one heat generating element is taken as an example, and some embodiments of the present application are exemplarily described.

The heating element 2001 may be a semiconductor device such as a CPU (Central Processing Unit, CPU), for example.

The present application provides a cooling system 1000. The cooling system 1000 may include a cooling device 100, a liquid inlet pipe 200, and a liquid outlet pipe 300.

Fig. 2 is a block diagram of a cooling system 1000 according to some embodiments.

Please refer to fig. 2, wherein, for convenience of description of the embodiments below, an XYZ coordinate system is established. Specifically, one width direction of the cooling device 100 is defined as an X-axis direction, one length direction of the cooling device 100 is defined as a Y-axis direction, and a height direction of the cooling device 100 is defined as a Z-axis direction. It will be appreciated that the coordinate system of the cooling device 100 may be flexibly set according to actual needs, which is not specifically limited herein.

Wherein, a liquid pipeline (not shown in the figure) is disposed in the cooling device 100, the liquid inlet pipe 200 is connected with one end of the liquid pipeline, the liquid outlet pipe 300 is connected with the other end of the liquid pipeline, the liquid working medium can enter the liquid pipeline of the cooling device 100 from the liquid inlet pipe 200, the liquid working medium can exchange heat with the heating element through the cooling device 100, and after the heating element is cooled, the liquid working medium can be discharged from the liquid outlet pipe 300.

In some examples, a power device (not shown) may be further disposed within the electronic apparatus 4000 (as shown in fig. 1), where the power device is connected to an end of the liquid inlet pipe 200 remote from the cooling device 100 and an end of the liquid outlet pipe 300 remote from the cooling device 100. The power device can provide power for the flow of the liquid working medium so as to send the liquid working medium into the liquid inlet pipe 200, the cooling device 100 and the liquid outlet pipe 300, in addition, the liquid working medium flowing out of the liquid outlet pipe 300 can enter the power device, and then the liquid working medium can circulate in the liquid inlet pipe 200, the cooling device 100 and the liquid outlet pipe 300.

By way of example, the power means may be a water pump.

Fig. 3 is a structural view of the cooling device 100 in fig. 2.

Referring to fig. 3, the cooling device 100 may further include a heating element facing 1211, and the heating element facing 1211 may be attached to an outer surface of the heating element 2001 (shown in fig. 1), so that the cooling device 100 may exchange heat between the heating element facing 1211 and the heating element 2001 to absorb heat of the heating element 2001. When the liquid working medium can flow through the area where the heating element facing 1211 is located, heat of the heating element 2001 can be transferred to the liquid working medium in the liquid pipeline through the heating element facing 1211, so that the liquid working medium can radiate heat of the heating element 2001, wherein after the liquid working medium absorbs the heat, a gas-liquid two-phase working medium can be formed, and the gas-liquid two-phase working medium can further reach the liquid outlet pipe 300 (as shown in fig. 2). The gas-liquid two-phase working medium can be cooled through the liquid outlet pipe 300, the power device and the liquid inlet pipe 200 to form a liquid working medium, and the liquid working medium can enter the cooling device 100 again to cool the heating element 2001.

The region of the heat-generating element facing 1211 refers to a region of the cooling device 100 in which the heat-generating element facing 1211 is formed.

The present application provides a cooling device 100.

Fig. 4 is an exploded view of the structure of the cooling device 100 of fig. 2.

Referring to fig. 4, the cooling apparatus 100 may include: a first housing 110, a second housing 120, and a middle housing 130.

The first housing 110 and the second housing 120 are respectively located at two opposite sides of the middle housing 130. The first housing 110, the middle housing 130, and the second housing 120 are sequentially disposed along a first direction F1, as shown in fig. 4, a direction indicated by an arrow F1 is a first direction, where the first direction F1 may be parallel to the Z-axis direction.

In some examples, the first housing 110 and the middle housing 130 may be connected by welding; the middle housing 130 and the second housing 120 may be connected by welding, and at this time, the first housing 110, the middle housing 130 and the second housing 120 may be all made of metal materials.

In other examples, the first housing 110 and the middle housing 130 may be connected by a clamping connection, a bolt connection, or the like. The middle shell 130 and the second shell 120 can be connected by clamping, bolting and the like.

The cooling device 100 further comprises a liquid inlet channel 160 and a liquid outlet channel 170. The liquid inlet channel 160 may be in communication with the liquid inlet pipe 200 (as shown in fig. 2), so that the liquid working medium in the liquid inlet pipe 200 may enter the liquid inlet channel 160. The liquid outlet channel 170 may be in communication with the liquid outlet pipe 300 (as shown in fig. 2), and thus the working fluid in the liquid outlet channel 170 may enter the liquid outlet pipe 300.

Fig. 5 is a cross-sectional view of the cooling device 100 of fig. 2 along the section line A-A'. Wherein arrows in the liquid inlet channel 160, the jet flow chamber 140, the boiling chamber 150 and the liquid outlet channel 170 represent the flow direction of the working medium.

Referring to fig. 5, the first housing 110 and the middle housing 130 enclose a jet cavity 140, and the second housing 120 and the middle housing 130 enclose a boiling cavity 150. The second housing 120 is provided with a plurality of jet holes 1310. The jet aperture 1310 communicates the jet cavity 140 with the boiling cavity 150.

The surface of the second housing 120 facing away from the middle housing 130 includes a heating element facing 1211. The heating element overlay 1211 may be in contact with the heating element 2001 (shown in fig. 1).

The second housing 120 includes a contact portion 121 disposed opposite to the middle housing 130, where a surface of the contact portion 121 facing away from the middle housing 130 is a heating element facing 1211, and an area where the heating element facing 1211 is located is the contact portion 121.

The second housing 120 can absorb heat from the heat generating element 2001 through the heat generating element facing 1211, and thus, the area where the heat generating element facing 1211 is located has a higher temperature than other locations of the second housing 120.

The inlet channel 160 communicates with the jet cavity 140 and the outlet channel 170 (shown in fig. 4) communicates with the boiling cavity 150.

The liquid inlet channel 160 is in communication with the jet cavity 140, so that the liquid working medium can enter the jet cavity 140 through the liquid inlet channel 160 and then flow onto the jet part 131.

The middle shell 130 is provided with a plurality of jet holes 1310, the jet holes 1310 can be communicated with the jet cavity 140 and the boiling cavity 150, and then liquid working medium in the jet cavity 140 can enter the boiling cavity 150 through the jet holes 1310. In the boiling chamber 150, when the liquid working medium jet flows to the area where the heating element faced 1211 is located, the liquid working medium can exchange heat with the area where the heating element faced 1211 is located, and at this time, the liquid working medium absorbs heat to generate boiling, and part of the liquid working medium changes phase into gaseous working medium. The heat of the area where the heating element facing 1211 is located is absorbed by the liquid working medium, the temperature is reduced, and the heating element facing 1211 can absorb the heat of the heating element 2001, so as to cool the heating element 2001.

The liquid outlet channel 170 (as shown in fig. 4) is in communication with the boiling chamber 150, so that the gas-liquid two-phase working medium can enter the liquid outlet channel 170 from the boiling chamber 150. The liquid outlet channel 170 may also be connected to the liquid outlet pipe 300 (as shown in fig. 2), so that the gas-liquid two-phase working medium may enter the liquid outlet pipe 300 from the liquid outlet channel 170. The gas-liquid two-phase working medium can enter the power device and the liquid inlet pipe 200 through the liquid outlet pipe 300, and the cooling is realized in the liquid outlet pipe 300, the power device and the liquid inlet pipe 200 to form a liquid working medium, and the liquid working medium can enter the cooling device 100 again to cool the heating element 2001, so that one cycle is completed.

Wherein the liquid working substance may be split into multiple streams of liquid working substance after passing through the middle housing 130 through the plurality of jet holes 1310 on the middle housing 130.

If the cross-sectional area of the liquid inlet channel 160 is smaller than the area of the area where the plurality of jet holes 1310 are located, after the liquid working medium passes through the middle housing 130, the coverage area of the liquid working medium can be increased, so that the area where the heating element faced 1211 is located, which is flushed by the liquid working medium, can be increased, so that the area where the liquid working medium and the heating element faced 1211 are located can be fully contacted, and further, the cooling effect of the liquid working medium on the area where the heating element faced 1211 is located can be improved, and therefore, the cooling effect of the cooling device 100 on the heating element 2001 can be improved.

If the cross-sectional area of the inlet passage 160 is greater than or equal to the area of the region where all of the jet holes 1310 are located. As shown in fig. 4, the middle housing 130 includes a jet part 131, all jet holes 1310 are disposed on the jet part 131, and the jet part 131 is the area where all jet holes 1310 are located. At this time, the sum of the areas of all the jet holes 1310 is smaller than the cross-sectional area of the liquid inlet channel 160, so that when the liquid working medium enters the boiling chamber 150 through the middle housing 130, the flow velocity of the liquid working medium can be increased, and further, the velocity of the liquid working medium in flushing the area where the heating element facing 1211 is located can be increased, so that the cooling effect of the liquid working medium on the area where the heating element facing 1211 is located can be increased, and thus, the cooling effect of the cooling device 100 on the heating element 2001 can be increased.

In addition, the cooling device 100 includes the first housing 110, the second housing 120 and the middle housing 130, so that the cooling device 100 has a relatively simple structure and is convenient for miniaturization, and the cooling device 100 can be applied to electronic devices (such as servers and hosts) with compact space. Of course, the cooling device 100 provided in the embodiment of the present application may be enlarged, so that the present application is applicable to large-sized electronic devices.

In some examples, a soaking layer may be provided on the heating element facing 1211, where the soaking layer may be in contact with the heating element 2001 (shown in fig. 1). Wherein the soaking layer can uniformly disperse the heat absorbed by the heating element 2001 and transfer the heat to the area of the heating element facing 1211, so that the heat absorbed by the heating element facing 1211 can be more uniform all over the area. When the liquid working medium washes the area of the heating element facing 1211 to cool the area of the heating element facing 1211, the cooling effect of the liquid working medium on the area of the heating element facing 1211 can be approximately the same, so that the local temperature of the area of the heating element facing 1211 is prevented from being too high, and the problem of the local temperature of the heating element 2001 is improved.

By way of example, the material of the soaking layer may include graphene.

In some embodiments, the plurality of jet holes 1310 may be distributed in an array on the middle housing 130, so that a plurality of liquid working media passing through the jet part 131 may be uniformly injected into the boiling chamber 150, so that the contact between the liquid working media and the area where the heating element facing 1211 is located is more sufficient, and thus the cooling effect of the cooling device 100 may be improved.

In some examples, the area of the region of the middle housing 130 where all of the jet holes 1310 are located (i.e., the jet part 131) is larger than the cross-sectional area of the inlet channel 160.

In some examples, the sum of the aperture areas of all of the jet apertures 1310 is less than the cross-sectional area of the inlet channel 160. By this arrangement, when the liquid working fluid enters the jet cavity 140 through the jet hole 1310, the flow rate of the liquid working fluid can be increased, so that the cooling effect of the cooling device 100 can be improved.

In some examples, the heating values of the heating elements 2001 in the electronic device are different, so that the aperture or the aperture distribution density of the jet holes 1310 of the cooling device 100 to which the different heating elements 2001 are attached can be made different, so that the flow rate of the liquid working medium passing through the jet holes 1310 can be adjusted, and the cooling effect of the cooling device 100 can be adjusted.

For example, for a heating element 2001 with a larger heating value, the distribution density of holes of the jet holes 1310 of the cooling device 100 attached to the heating element 2001 is smaller, so that the sum of the areas of all the jet holes 1310 can be reduced, and then the flow velocity of the liquid working medium after passing through the plurality of jet holes 1310 on the jet part 131 can be improved, so that the velocity of the liquid working medium flushing the area where the heating element facing 1211 is located can be improved, and thus the cooling effect of the liquid working medium on the area where the heating element facing 1211 is located can be improved, and thus the cooling effect of the cooling device 100 on the heating element 2001 can be improved.

For example, for a heating element 2001 with a larger heating value, the aperture of the jet hole 1310 of the cooling device 100 attached to the heating element 2001 is smaller, so that the sum of the areas of all jet holes 1310 can be reduced, and then the flow velocity of the liquid working medium after passing through the plurality of jet holes 1310 on the jet part 131 can be improved, so that the velocity of the liquid working medium flushing the area where the heating element 1211 is located can be improved, and thus the cooling effect of the liquid working medium on the area where the heating element 1211 is located can be improved, and thus the cooling effect of the cooling device 100 on the heating element 2001 can be improved.

Fig. 6 is another cross-sectional view of the cooling device 100 of fig. 2 along the section line A-A'.

Referring to fig. 6, in some embodiments, a surface of the second housing 120 adjacent to the middle housing 130 includes a heat dissipating contact surface 1212. The heat sink contact surface 1212 may enclose the boiling chamber 150, and as an example, the heat sink contact surface 1212 may be disposed opposite the jet aperture 1310.

The second housing 120 includes a contact portion 121 disposed opposite to the middle housing 130, where a surface of the contact portion 121 facing away from the middle housing 130 is a heat generating element facing surface 1211, and a surface of the contact portion 121 facing toward the middle housing 130 is a heat dissipating contact surface 1212. At this time, the area of the heat dissipation contact surface 1212 and the area of the heating element facing 1211 in the second housing 120 are all the contact portions 121.

The cooling device 100 further includes a plurality of cooling enhancing structures 180, and the plurality of cooling enhancing structures 180 are disposed at intervals on the heat dissipation contact surface 1212.

The plurality of cooling enhancing structures 180 are arranged at intervals, and the liquid working medium can be jetted to the heat dissipation contact surface 1212 through the intervals between the adjacent cooling enhancing structures 180 to be in contact with the heat dissipation contact surface 1212.

By providing the plurality of cooling enhancing structures 180 on the heat dissipating contact surface 1212, the cooling enhancing structures 180 can absorb heat generated by the heat generating element 2001 together with the area (i.e., the contact portion 121) of the heat generating element facing 1211. When the liquid working medium enters the boiling cavity 150, the liquid working medium can contact with the heat dissipation contact surface 1212 and the plurality of cooling enhancement structures 180, so that the heat exchange area of the liquid working medium and the cooling device 100 can be increased, and the larger the heat exchange area is, the better the cooling device 100 can cool the heating element 2001. Therefore, the cooling effect of the cooling device 100 on the heat generating element 2001 can be improved by providing the cooling enhancing structure on the heat radiation contact surface 1212.

In some examples, the cooling enhancement structure 180 may be a nanowire cluster.

In other examples, the cooling enhancement structure 180 may be columnar, such as cylindrical or prismatic. In fig. 6, the cooling reinforcement structure 180 is illustrated as a column shape, and some embodiments of the present application are illustrated.

For example, the plurality of cooling enhancing structures 180 may be disposed on the heat dissipation surface 1212 in an array, so that the plurality of cooling enhancing structures 180 may be uniformly distributed on the heat dissipation surface 1212, and thus, the heat absorbed by each cooling enhancing structure 180 by the contact portion 121 may be substantially balanced, so that the temperature of each contact portion 121 may be substantially balanced.

When the liquid working medium enters the boiling cavity 150, the liquid working medium can cool the cooling enhancing structures 180 and the contact portions 121, and the temperatures of the cooling enhancing structures 180 are approximately the same, so that the cooling effect of the liquid working medium on the cooling enhancing structures 180 is approximately the same, and the cooling effect of the liquid working medium on the contact portions 121 is approximately the same, so that the heat absorbed from the heating element 2001 by the contact portions 121 is approximately balanced, the cooling effect of the cooling device 100 on the heating element 2001 is approximately the same, and the phenomenon of local overheating of the heating element 2001 can be improved, and the cooling effect of the heating element 2001 can be improved.

In some examples, the outer surface of the cooling enhancement structure 180 is provided with micro-holes. By this arrangement, the area of the outer surface of the cooling enhancing structure 180 can be increased, and the heat exchange area between the cooling enhancing structure 180 and the liquid working medium can be increased, so that the cooling effect of the cooling device 100 on the heating element 2001 can be improved.

For example, the cooling enhancing structure 180 may be integrally formed with the middle case 130, and in this case, the cooling enhancing structure 180 may be formed simultaneously with the middle case 130.

With continued reference to fig. 6, in some embodiments, the cooling enhancing structure 180 is spaced from the middle housing 130 along a first direction F1, wherein the first direction F1 is a direction in which the first housing 110, the middle housing 130, and the second housing 120 are sequentially disposed. Wherein each of the cooling enhancing structures 180 is spaced apart from the middle case 130 along the first direction F1. At this time, an end of the cooling enhancing structure 180 facing away from the heat dissipation contact surface 1212 and the jet portion 131 have a space therebetween in the first direction F1, and thus a receiving space is formed between the cooling enhancing structure 180 and the jet portion 131.

The cooling reinforcement structure 180 and the jet portion 131 are arranged at intervals in the first direction F1, so that the volume of the boiling cavity 150 can be increased, and the liquid working medium can enter the boiling cavity 150 conveniently, so that the liquid working medium can be contacted with the contact portion 121 fully, the cooling effect of the liquid working medium on the contact portion 121 can be improved, and the cooling effect of the cooling device 100 on the heating element 2001 can be improved.

In addition, after the liquid working medium contacts with the contact portion 121 and the cooling enhancing structure 180, the liquid working medium absorbs heat, and part of the liquid working medium may boil, thereby forming a gas-liquid two-phase working medium. At this time, the gaseous working substance moves toward the direction of the jet part 131, and a large amount of gaseous working substance can be collected in the top space of the boiling chamber 150 and discharged through the liquid outlet channel 170. The "top space of the boiling chamber 150" refers to a space of the boiling chamber 150 near to the jet part 131, and the gaseous working medium can be discharged conveniently by providing a containing space between the cooling enhancing structure 180 and the jet part 131.

FIG. 7 is a schematic illustration of an offset placement of the jet holes 1310 with respect to the cooling enhancement structure 180 in accordance with some embodiments. Of these, only the jet portion 131, and part of the cooling reinforcement structure 180 and part of the contact portion 121 are illustrated in fig. 7.

Referring to fig. 7, in some embodiments, the orthographic projection of the jet hole 1310 on the heat dissipation contact surface 1212 is staggered from the position of the cooling enhancing structure 180, so that after the liquid working medium enters the boiling chamber 150 through the jet hole 1310, the liquid working medium can jet to the bottom of the cooling enhancing structure 180, and thus the liquid working medium can fully enter the boiling chamber 150 to fully contact with the contact portion 121 and the cooling enhancing structure 180, and further the cooling effect of the cooling device 100 on the heating element 2001 can be improved.

FIG. 8 is another schematic illustration of an offset placement of the jet holes 1310 with the cooling enhancement structure 180 in accordance with some embodiments.

Referring to fig. 8, the orifice 1310 may be a circular orifice or a square orifice, and in fig. 8, some embodiments of the present application are illustrated using the orifice 1310 as a circular orifice.

The cooling enhancing structure 180 may be cylindrical or prismatic, and in fig. 8, some embodiments of the present application are illustrated using the cooling enhancing structure 180 as a cylindrical shape.

In some examples, at least a portion of the jet aperture 1310 is orthographically projected onto the heat sink contact surface 1212 at a central region of the area enclosed by the four cooling enhancement structures 180. For example, four cooling enhancement structures 180 may enclose a rectangular region, and the orthographic projection of the jet aperture 1310 onto the heat sink contact surface 1212 may be located in the middle region of the rectangular region.

Fig. 9 is a further cross-sectional view of the cooling device of fig. 2 along section line A-A'.

Referring to fig. 9, the cooling device 100 further includes a plurality of hole extensions 132, the plurality of hole extensions 132 are located on a surface of the middle housing 130 facing the second housing 120, and orthographic projections of outer walls of the plurality of hole extensions 132 on the middle housing 130 are respectively disposed around the plurality of jet holes 1310. Wherein Kong Yanchang portion 132 protrudes from a surface of middle housing 130 facing away from first housing 110.

Wherein an orthographic projection of the outer wall of one of the orifice extensions 132 onto the middle housing 130 is disposed one revolution around one of the orifice 1310.

Fig. 10 is a partial enlarged view at B in fig. 9.

Referring to fig. 10, kong Yanchang portion 132 is provided with an extension channel 1320, one end of extension channel 1320 communicates with a jet hole 1310 surrounded by hole extension portion 132 where it is located, and the other end of extension channel 1320 faces heat dissipation contact surface 1212.

Wherein liquid working fluid, after passing through orifice 1310, enters extension channel 1320. Therefore, after the liquid working medium leaves the jet hole 1310, the Kong Yanchang portion 132 can restrict the liquid working medium from flowing toward the contact portion 121, and prevent the liquid working medium from scattering toward the periphery of the hole extension portion 132, so that the flowing speed of the liquid working medium can be increased, and further, the speed of the liquid flushing the contact portion 121 and the cooling enhancing structure 180 can be increased, so that the cooling speed of the heating element 2001 can be increased.

In some examples, the lengths of the plurality of extension channels 1320 in the first direction F1 are the same, such that the flow rates of the plurality of liquid working fluids after exiting the extension channels 1320 may be substantially the same.

Fig. 11 is another structural schematic diagram of the cooling device 100, in which only a portion of the middle housing 130 and a portion of the second housing 120 are illustrated in fig. 11.

Referring to FIG. 11, in some embodiments, the end of Kong Yanchang portion 132 distal to middle housing 130 is flush with the end of cooling enhancement structure 180 distal to heat sink contact surface 1212. At this time, all the ends of the hole extension portions 132 away from the jet portion 131 are located at the reference plane C, and all the ends of the cooling enhancing structures 180 away from the heat dissipation contact surface 1212 are also located at the reference plane C.

Wherein the Kong Yanchang portion 132 extends into the boiling chamber 150, the Kong Yanchang portion 132 occupies space within the boiling chamber 150. Wherein, the bigger the boiling chamber 150, the more favorable the liquid working medium to enter the boiling chamber 150. By making the end of the hole extension 132 away from the jet 131 flush with the end of the cooling enhancing structure 180 away from the heat dissipation contact surface 1212, it is possible to avoid the hole extension 132 occupying too much space in the boiling chamber 150, which is detrimental to the entry of the liquid working medium into the boiling chamber 150.

In addition, the longer the length of Kong Yanchang portion 132, the longer the time that the liquid working substance is constrained by orifice extension 132, and the faster the flow rate of the liquid working substance as it exits extension channel 1320. By enabling the end of the hole extension portion 132 far away from the jet portion 131 to be flush with the end of the cooling enhancing structure 180 far away from the heat dissipation contact surface 1212, the extension channel 1320 can have a longer length, so that when the liquid working medium flows out of the extension channel 1320, the liquid working medium has a faster flow velocity, and the cooling effect of the liquid working medium on the heat dissipation contact surface 1212 and the cooling enhancing structure 180 can be ensured.

For example, kong Yanchang portion 132 may be integrally formed with middle housing 130, in which case Kong Yanchang portion 132 may be formed simultaneously with middle housing 130.

Next, the structure of the first housing 110, the middle housing 130, and the second housing 120 will be described.

Fig. 12 is a structural exploded view of the cooling device 100 according to some embodiments.

Referring to fig. 12, in some examples, the inlet channel 160 and the outlet channel 170 are both located in the first housing 110.

For example, the first housing 110 may further include a liquid inlet portion, and for convenience of description, the liquid inlet portion disposed on the first housing 110 is defined as a first liquid inlet portion 113, and the first liquid inlet portion 113 may enclose the liquid inlet channel 160.

For example, the first housing 110 may further include a liquid outlet portion, and for convenience of description, the liquid outlet portion disposed on the first housing 110 is defined as a first liquid outlet portion 114, and the first liquid outlet portion 114 may define a liquid outlet channel 170.

Wherein, one end of the liquid outlet channel 170 is provided with a liquid outlet 171, and at this time, the liquid outlet 171 is disposed on the first housing 110, wherein the liquid outlet 171 is used for communicating with the liquid outlet pipe 300 (as shown in fig. 2).

The middle shell 130 is provided with a first backflow port 133, the first backflow port 133 is arranged around the jet part 131, and the first backflow port 133 is communicated with the boiling cavity 150 and the liquid outlet channel 170.

The liquid working medium enters the jet cavity 140 through the liquid inlet channel 160, then enters the boiling cavity 150 through the jet hole 1310 on the jet part 131, contacts the contact part 121, and after radiating the heating element 2001, a gas-liquid two-phase working medium can be formed, the gas-liquid two-phase working medium can flow around the contact part 121, and the first return opening 133 around the jet part 131 enters the liquid outlet channel 170 and then is discharged from the liquid outlet channel 170. The working medium entering the boiling cavity 150 enters through the jet hole 1310, the working medium exiting the boiling cavity 150 is exhausted through the first return hole 133, and the temperature of the gas-liquid two-phase working medium exhausted through the first return hole 133 is higher than that of the liquid working medium flowing through the jet hole 1310, and by arranging the first return hole 133 around the jet part 131, the first return hole 133 can be adjacent to the jet hole 1310 at the edge of the jet part 131 and is far away from other jet holes 1310, so that the temperature of the gas-liquid two-phase working medium flowing out of the first return hole 133 affects the temperature of the liquid working medium entering through the jet hole 1310, and the heat dissipation effect of the liquid working medium on the contact part 121 can be improved, and the heat dissipation effect of the cooling device 100 on the heating element 2001 can be improved.

Fig. 13 is another structural schematic diagram of the cooling device 100 of fig. 12. In fig. 13, the first housing 110 and the middle housing 130 are cross-sectioned.

Referring to fig. 13, in some embodiments, the middle housing 130 includes a jet portion 131 and a first backflow portion 520, the first backflow portion 520 is disposed along an edge of the jet portion 131, a plurality of jet holes 1310 are disposed on the jet portion 131, and the first backflow port 133 is disposed on the first backflow portion 520.

The first housing 110 is provided with a first groove 111, and the jet part 131 covers the notch of the first groove 111 to form a jet cavity 140. For example, the first housing 110 may further include a first groove portion 112, the first groove portion 112 may enclose the first groove 111, and the jet portion 131 covers the notch of the first groove 111, where the first groove portion 112 and the jet portion 131 together enclose the jet cavity 140.

The liquid inlet channel 160 is communicated with the first groove 111.

In some examples, one end of the liquid inlet channel 160 is located around the first groove 111, and the other end of the liquid inlet channel 160 extends to the bottom of the first groove 111 and communicates with the first groove 111.

In other examples, one end of the liquid inlet channel 160 is located around the first groove 111, and the other end of the liquid inlet channel 160 extends to the groove side wall of the first groove 111 and communicates with the first groove 111.

By way of example, the first fluid intake 113 may include a first end 1131 and a second end 1132, the first end 1131 may be configured for connection with a fluid intake 200 (shown in fig. 2). One end of the liquid inlet channel 160 may be used as the liquid inlet 161, and the liquid inlet 161 is disposed at the first end 1131. Wherein the first end 1131 may be located around the first groove portion 112, where the orthographic projection of the first end 1131 on the middle housing 130 is located outside of the orthographic projection of the first groove portion 112 on the middle housing 130 (as shown in fig. 13). The second end 1132 of the first liquid inlet portion 113 may extend to the first groove portion 112, and the liquid inlet channel 160 surrounded by the first liquid inlet portion 113 may be communicated with the first groove 111, so that the liquid inlet channel 160 may be communicated with the jet cavity 140.

The first housing 110 is further provided with a first converging cavity 410, and the first converging cavity 410 is disposed along a part of edges of the notch of the first groove 111 and is communicated with the first backflow port 133 and the liquid outlet channel 170.

The gas-liquid two-phase working medium in the boiling cavity 150 may be collected in the first converging cavity 410 through the first return port 133, and then enter the liquid outlet channel 170 from the first converging cavity 410 (as shown in fig. 12).

In some examples, the first housing 110 may further include a first confluence part 420, and the first confluence part 420 may enclose a first confluence cavity 410. The side of the first confluence part 420 facing the middle case 130 may be provided with an opening, which may communicate with the first backflow port 133, such that the first confluence chamber 410 communicates with the first backflow port 133.

Illustratively, the orthographic projection of the opening on the middle housing 130 overlaps the first return opening 133.

In some examples, the opening provided to the first bus portion 420 may have a bar shape and extend along an extension trace of the first bus portion 420.

In some examples, the first return port 133 may be in a bar shape and extend along an extension trace of a portion of the first confluence part 420. In other examples, the first return port 133 may include a plurality of first converging ports.

The first housing 110 may further include a spacer 510, the spacer 510 being connected between the first groove portion 112 and the first confluence portion 420, the spacer 510 being disposed along the notch of the first groove 111 one round, and the first confluence portion 420 being disposed along a portion of the edge of the spacer 510 remote from the first groove portion 112. By arranging the spacing portion 510, the first converging portion 420 and the first groove portion 112 can be arranged at intervals, so that the temperature of the gas-liquid two-phase working medium in the first converging cavity 410 can be prevented from influencing the temperature of the liquid working medium in the first groove 111, and the cooling effect of the cooling device 100 can be improved.

In some examples, the middle housing 130 may have a plate shape, and the jet part 131 may be located at a middle region of the middle housing 130. Wherein, the orthographic projection of the first groove part 112 on the middle housing 130 may entirely cover the plurality of jet holes 1310 on the jet part 131. So configured, liquid working fluid entering jet cavity 140 may all enter boiling cavity 150 through a plurality of jet orifices 1310 in jet section 131.

Fig. 14 is a structural view of the first housing 110 of fig. 12.

Referring to fig. 14, for example, the groove bottom of the first groove portion 112 may be substantially rectangular, the first bus bar portion 420 may include a first bus bar 421, a second bus bar 422, a third bus bar 423, and a fourth bus bar 424, and the first bus bar 421, the second bus bar 422, the third bus bar 423, and the fourth bus bar 424 may be disposed along four edges of the groove bottom of the first groove portion 112, respectively. The first converging cavity 410 in the first converging section 421 is communicated with the first converging cavity 410 in the fourth converging section 424 through the first converging cavity 410 in the second converging section 422 and the first converging cavity 410 in the third converging section 423 in sequence.

The two ends of the first converging portion 420 are a third end 431 and a fourth end 432, respectively, and in an example, one end of the first converging portion 421 away from the second converging portion 422 is the third end 431, and one end of the fourth converging portion 424 away from the third converging portion 423 is the fourth end 432. The third end 431 and the fourth end 432 are disposed at an interval, and the first liquid inlet portion 113 may extend to communicate with the first groove portion 112 through the interval between the third end 431 and the fourth end 432.

The first liquid outlet 114 may be disposed on a side of the first converging portion 420 facing away from the first groove 112. The first liquid outlet 114 is disposed on a side of the third bus segment 423 facing away from the first groove 112.

In some examples, the liquid outlet 171 and the liquid inlet 161 may be oriented in different directions, respectively. For example, the liquid outlet 171 and the liquid inlet 161 face in opposite directions.

In some embodiments, the number of liquid outlets 171 may be one or more. In the case where the number of the liquid outlets 171 is one, the cooling device 100 is connected to one liquid outlet pipe through one liquid outlet 171, and at this time, the cooling device 100 has a simple structure and can be applied to a server having a small internal space.

The height H1 of the first liquid inlet portion 113 is smaller than the height H2 of the first confluence portion 420, and the height H3 of the first liquid outlet portion 114 is smaller than the height H2 of the first confluence portion 420. By doing so, the thickness of the first housing 110 in the first direction F1 can be reduced, so that the thickness of the cooling device 100 in the first direction F1 can be reduced, whereby the cooling device 100 can be made suitable for use in electronic equipment having a small space.

As shown in fig. 14, H1 may be equal to H2 and equal to H3.

Wherein, "the height H1 of the first liquid inlet portion 113" refers to a distance between an end of the first liquid inlet portion 113 away from the middle housing 130 and the middle housing 130. The "height H2 of the first confluence part 420" refers to a distance between an end of the first liquid inlet portion 113 remote from the middle case 130 and the middle case 130. The "height H3 of the first liquid outlet 114" refers to the distance between the end of the first liquid outlet 114 remote from the middle housing 130 and the middle housing 130.

In some examples, the first converging portion 420 may enclose a first space, and at this time, the first groove portion 112 may be disposed in the first space.

In some examples, a distance between a portion of the first groove portion 112 for forming a groove bottom of the first groove 111 and the middle case 130 is smaller than a height H2 of the first confluence portion 420, and at this time, a plurality of reinforcing ribs may be provided on a sidewall of the first confluence portion 420 toward the first groove portion 112, and the reinforcing ribs may extend in the first direction. Among them, the support strength of the first confluence part 420 can be improved by providing the reinforcing ribs on the first liquid outlet part 114.

In some examples, the first housing 110 may further include a heat insulating portion, which may be filled in the first space, and may be made of a low heat conductive material, wherein the heat insulating portion may reduce heat exchange between the liquid working substance in the liquid inlet channel 160 and the gas-liquid two-phase working substance in the liquid outlet channel 170.

As shown in fig. 14, in other examples, a distance between a portion of the first groove portion 112 for forming a groove bottom of the first groove 111 and the middle case 130 is equal to a height H2 of the first confluence portion 420.

The first housing 110 is described above, and the middle housing 130 is described next.

Fig. 15 is a structural view of the middle housing 130 of fig. 12.

Referring to fig. 10, the middle housing 130 is provided with a first backflow port 133, and the first backflow port 133 may be disposed around the jet portion 131. In some examples, the number of the first return ports 133 may be plural, and the plural first return ports 133 may be disposed along the jet part 131 for one week. For example, the first return port 133 may have a bar shape.

For example, the plurality of jet holes 1310 on the jet part 131 are arranged in an array, and all the jet holes 1310 are located in a rectangular area, for example, the number of the first return holes 133 is four, and the four first return holes 133 may be respectively arranged along four edges of the rectangular area. For example, the four first return ports 133 are respectively communicated with a first converging cavity 410 surrounded by a first converging section 421 (as shown in fig. 13), a first converging cavity 410 surrounded by a second converging section 422, a first converging cavity 410 surrounded by a third converging section 423, and a first converging cavity 410 surrounded by a fourth converging section 424. At this time, the orthographic projections of the first, second, third and fourth merging segments 421, 422, 423 and 424 on the middle case 130 may cover the four first return ports 133, respectively.

The middle housing 130 may include a jet portion 131 and a first backflow portion 520, where an area enclosed between an edge of the jet portion 131 and an edge of the middle housing 130 is the first backflow portion 520, and the first confluence portion is provided with the first backflow port 133.

The middle housing 130 is described above, and the second housing 120 is described next.

Fig. 16 is a structural view of the second housing 120 of fig. 12.

Referring to fig. 16, in some examples, the second housing 120 is provided with a boiling tank 122, and in examples, the second housing 120 may include a boiling portion 123, and the boiling portion 123 may enclose the boiling tank 122.

Referring to fig. 13, the middle housing 130 covers the notch of the boiling tank 122 to form a boiling chamber 150, and the bottom of the boiling tank 122 serves as a heat dissipation contact surface 1212 (as shown in fig. 9). While the portion of the boiling part 123 forming the bottom of the boiling groove 122 may be the contact part 121. The surface of the contact 121 facing away from the middle housing 130 may then act as a heating element facing 1211.

The jet flow portion 131 and the first backflow portion 520 of the second housing 120 cover the notch of the boiling tank 122, so that the jet flow hole 1310 on the jet flow portion 131 can be communicated with the boiling cavity 150, the liquid working medium can enter the boiling cavity 150, the first backflow port 133 can be communicated with the boiling cavity 150, and then the gas-liquid two-phase working medium in the boiling cavity 150 can be discharged from the first backflow port 133.

In the case where the second housing 120 further includes the cooling enhancing structure 180, the cooling enhancing structure 180 may be provided at the bottom of the boiling tank 122.

In some examples, the second housing 120 may further include a second connection portion 125 disposed along the notch of the boiling tank 122 for one revolution, and the second connection portion 125 may be used to connect with the middle housing 130.

In some of the above embodiments, the embodiments of the present application are described taking the example that the liquid inlet channel 160 and the liquid outlet channel 170 are both located in the first housing 110.

Fig. 17 is a structural exploded view of a cooling device 100 according to some embodiments. Among them, for convenience of description of the embodiments below, an XYZ coordinate system is established in fig. 17. Specifically, one width direction of the cooling device 100 is defined as an X-axis direction, one length direction of the cooling device 100 is defined as a Y-axis direction, and a height direction of the cooling device 100 is defined as a Z-axis direction. It will be appreciated that the coordinate system of the cooling device 100 may be flexibly set according to actual needs, which is not specifically limited herein.

Referring to fig. 17, in some other embodiments, the liquid inlet channel 160 is located in the first housing 110, and the liquid outlet channel 170 is located in the middle housing 130.

In some examples, the first housing 110 may include a second liquid inlet 118, and the second liquid inlet 118 may enclose a liquid inlet channel 160.

The middle housing 130 may include a liquid outlet portion, and for convenience of description, the liquid outlet portion disposed on the middle housing 130 is defined as a second liquid outlet portion 137. The second liquid outlet 137 may enclose a liquid outlet channel 170.

The liquid inlet channel 160 and the liquid outlet channel 170 are respectively disposed on the first housing 110 and the middle housing 130, so that heat exchange between the liquid working medium in the liquid inlet channel 160 and the gas-liquid two-phase working medium in the liquid outlet channel 170 can be reduced.

Fig. 18 is another structural schematic diagram of the cooling device 100 of fig. 17. In fig. 18, arrows in the liquid inlet channel 160, the jet flow chamber 140, the boiling chamber 150, and the liquid outlet channel 170 indicate the flow direction of the working fluid.

Referring to fig. 18, the middle housing 130 is further provided with a second backflow port 134, where the second backflow port 134 is disposed around the plurality of jet holes 1310, that is, the second backflow port 134 is disposed around the jet portion 131. The second return port 134 communicates with the boiling chamber 150 and the outlet passage 170.

The gas-liquid two-phase working medium in the boiling cavity 150 may enter the liquid channel 170 through the second backflow port 134, where the second backflow port 134 is located around the jet portion 131, and then the second backflow port 134 is adjacent to the jet hole 1310 located at the edge of the jet portion 131 and is far away from other jet holes 1310, so that the heat exchange amount between the liquid working medium passing through the jet hole 1310 and the gas-liquid two-phase working medium passing through the second backflow port 134 can be reduced, so that the liquid working medium passing through the jet hole 1310 has a low temperature, and further the cooling effect of the cooling device 100 on the heating element 2001 (as shown in fig. 1) can be improved.

In some embodiments, the first housing 110 is provided with a second groove 116, and the jet part 131 covers the notch of the second groove 116 to form the jet cavity 140. By way of example, the first housing 110 may include a second groove portion 117, and the second groove portion 117 may enclose the second groove 116.

In some examples, jet 131 may be plate-shaped and the orthographic projection of second groove portion 117 onto jet 131 may cover all of jet aperture 1310, so that liquid working fluid entering jet cavity 140 may all enter boiling cavity 150 through jet aperture 1310.

The liquid inlet channel 160 is communicated with the second groove 116, so that the liquid inlet channel 160 is communicated with the jet cavity 140.

The middle housing 130 is provided with a second converging cavity 430, the second converging cavity 430 is disposed along at least a part of edges of the notch of the second groove 116, and the second converging cavity 430 is communicated with the second backflow port 134 and the liquid outlet channel 170.

For example, the middle housing 130 may further include a second confluence part 440, the second confluence part 440 may be disposed along at least part of the edge of the jet part 131, and the second confluence part 440 may enclose the second confluence chamber 430. The second return port 134 is disposed at a side of the second converging portion 440 facing the second housing 120.

For example, the second return port 134 may have a bar shape and extend along an extension trace of the second confluence part 440. At this time, the number of the second return ports 134 may be one or more.

For example, the second return port 134 may include a plurality of second sink apertures.

The second liquid outlet 137 is connected to the second converging portion 440, and is located at a side of the second converging portion 440 away from the second groove 117. The second confluence chamber 430 surrounded by the second confluence portion 440 is communicated with the liquid outlet passage 170 surrounded by the second groove portion 117. Wherein, the end of the second liquid outlet 137 facing away from the second converging portion 440 is provided with a liquid outlet 171, and the liquid outlet 171 is communicated with the liquid outlet channel 170. Wherein the outlet 171 may be adapted to communicate with the outlet tube 300 (shown in fig. 2).

The liquid working medium can enter the second groove 116 through the liquid inlet channel 160, so as to enter the jet cavity 140, and then flow to the notch of the second groove 116, so as to enter the boiling cavity 150 through the jet hole 1310 on the jet part 131. After entering the boiling cavity 150, the liquid working medium can wash the contact portion 121, dissipate heat of the contact portion 121 to form a gas-liquid two-phase working medium, then the gas-liquid two-phase working medium can flow to the periphery of the contact portion 121, enter the second converging cavity 430 through the second backflow port 134, enter the liquid outlet channel 170 through the second converging cavity 430, and are discharged through the liquid outlet channel 170.

In some examples, one end of the feed channel 160 extends to the bottom of the second groove 116 and communicates with the second groove 116, and the other end of the feed channel 160 faces away from the bottom of the second groove 116.

For example, the second liquid inlet 118 may be disposed perpendicular or approximately perpendicular to the bottom of the second groove 116. The end of the second liquid inlet 118 facing away from the second groove 116 is provided with a liquid inlet 161.

In some examples, second groove portion 117 is spaced apart from second converging portion 440 to reduce heat exchange between the liquid working substance in jet cavity 140 and the gas-liquid two-phase working substance in liquid outlet channel 170.

For example, the first housing 110 further includes a flange 119, the flange 119 is disposed along an edge of a notch of the second groove 116, and the flange 119 is located between the second groove 117 and the second converging portion 440, wherein the second groove 116 and the second converging portion 440 may be disposed at a distance by disposing the flange 119, so that the jet cavity 140 and the liquid channel 170 may be disposed at a distance.

Illustratively, the flange 119 may be used in connection with the edge of the jet 131.

In some examples, a plurality of reinforcing ribs extending in the first direction F1 may be provided on the outer wall of the second confluence part 440, whereby the supporting strength of the second liquid outlet part 137 may be improved.

Fig. 19 is another structural schematic diagram of the cooling device 100 of fig. 17.

Referring to fig. 19, in some examples, the second confluence part 440 may be disposed around the second groove part 117 one turn.

For example, the second return port 134 (shown in fig. 18) may be provided one turn around the diffraction flow portion 131.

The second converging portion 440 and the jet portion 131 of the middle housing 130 may enclose a second space, and the first housing 110 may be located in the second space, so that the first housing 110 may be conveniently located.

In some examples, the height of the second groove portion 117 is smaller than the height of the second confluence portion 440, and at this time, a portion of the second groove portion 117 for forming the groove bottom of the second groove 116 and the second confluence portion 440 may enclose a second space. The height of the second confluence part 440 refers to: the distance between the end of the second converging portion 440 away from the plane of the jet portion 131 and the plane of the jet portion 131, and the height of the second groove portion 117 refers to: the second groove portion 117 is distant from the distance between the end of the jet portion 131 and the jet portion 131.

The second liquid inlet portion 118 may be disposed in the second space, so that the thickness of the cooling device 100 in the Z-axis direction may be reduced, and the cooling device 100 may be further suitable for electronic devices with smaller internal space.

In the case where the liquid inlet channel 160 is located in the first housing 110 and the liquid outlet channel 170 is located in the middle housing 130, the middle housing 130 may further include a first connection portion 139, and the first connection portion 139 may be disposed along a side of the second confluence portion 440 away from the second groove portion 117 for one turn.

In some of the above examples, the first housing 110 and the middle housing 130 are described, and the second housing 120 is described next.

Fig. 20 is another structural schematic diagram of the cooling device 100 of fig. 17, in which in fig. 20, the first housing 110 and the middle housing 130 are subjected to a cross-sectional process.

Referring to fig. 20, in some examples, the second housing 120 is provided with a boiling tank 122, and the middle housing 130 may cover the notch of the boiling tank 122.

By way of example, the second housing 120 may include a boiling part 123 and a second connection part 125 disposed along the boiling part 123 for one turn. Wherein the second connection portion 125 may be connected with the first connection portion 139. Boiling portion 123 may enclose boiling tank 122, jet portion 131 covers the notch of boiling tank 122, and jet aperture 1310 may communicate jet cavity 140 with boiling cavity 150.

The second return port 134 is located at the notch of the boiling tank 122, and thus the second return port 134 can communicate the liquid outlet channel 170 with the boiling chamber 150.

In some examples, a portion of the boiling part 123 for forming the bottom of the boiling groove 122 may be the contact part 121.

Fig. 21 is a schematic view of a further structure of the cooling device 100 of fig. 17.

Referring to fig. 21, the surface of the contact portion 121 facing away from the middle housing 130 is a heating element facing 1211, and the heating element facing 1211 may be used to attach to the heating element 2001, so that the contact portion 121 may exchange heat with the heating element 2001.

In some of the above embodiments, the embodiments of the present application are described taking the example that the inlet channel 160 is located in the first housing 110 and the outlet channel 170 is located in the middle housing 130.

Fig. 22 is another structural schematic diagram of a cooling device 100 according to some embodiments.

Referring to fig. 22, in some other embodiments, the liquid inlet channel 160 is located in the first housing 110, and the liquid outlet channel 170 is located in the second housing 120.

In some examples, the first housing 110 may further include a third liquid inlet 193, and the third liquid inlet 193 may enclose the liquid inlet channel 160.

In some examples, the second housing 120 may further include a third liquid outlet 126, and the third liquid outlet 126 may enclose a liquid outlet channel 170.

Wherein, through setting up feed liquor passageway 160 in first casing 110, and liquid passageway 170 sets up in second casing 120, and then can set up feed liquor passageway 160 and liquid passageway 170 respectively on different structures to can reduce the heat transfer between the liquid working medium of lower temperature in feed liquor passageway 160 and the higher gas-liquid two-phase working medium of temperature in liquid passageway 170, thereby can guarantee that the liquid working medium in feed liquor passageway 160 has lower temperature, and then can improve the heat transfer effect between liquid working medium and the contact 121, and then can improve cooling device 100 and to the cooling effect of heating element 2001.

Fig. 23 is a structural exploded view of the cooling device 100 in fig. 22.

Referring to fig. 23, in some embodiments, a third groove 190 is provided on the first housing 110. As an example, the first housing 110 may include a third groove portion 191, and the third groove portion 191 may enclose the third groove 190.

In some examples, the first housing 110 may further include a first mounting portion 192, the first mounting portion 192 may be disposed along a notch of the third groove 190 for one revolution, and the first mounting portion 192 may be used to connect with an edge of the middle housing 130.

Fig. 24 is another structural schematic diagram of the cooling device 100 of fig. 22. In fig. 25, the first housing 110 and the middle housing 130 are cross-sectioned.

Referring to fig. 24, the middle housing 130 may cover the notch of the third groove 190 to form the jet cavity 140. Illustratively, the jet 131 covers the slot of the third recess 190.

In some examples, the middle housing 130 may have a plate shape, wherein the jet part 131 may be located at a middle region of the middle housing 130.

In some examples, the orthographic projection of third groove portion 191 onto middle housing 130 may cover all of orifices 1310 on jet portion 131, at which point liquid working fluid entering jet cavity 140 may all enter boiling cavity 150 through orifices 1310.

The liquid inlet channel 160 is connected to the third groove 190, so that the liquid inlet channel 160 can be connected to the jet cavity 140.

Illustratively, one end of the feed channel 160 extends to the bottom of the third recess 190 and communicates with the third recess 190, thereby placing the feed channel 160 in communication with the jet cavity 140. The other end of the liquid inlet channel 160 faces the direction away from the bottom of the third groove 190, and the end of the liquid inlet channel 160 away from the bottom of the third groove 190 may be used to connect with the liquid inlet pipe 200 (as shown in fig. 2), and the end of the liquid inlet channel 160 away from the bottom of the third groove 190 may be provided with a liquid inlet 161, and the liquid inlet 161 may be used to communicate with the liquid inlet pipe 200.

For example, the third liquid inlet 193 may be perpendicular or approximately perpendicular to the bottom of the third groove 190.

Referring to fig. 24, a boiling tank 122 is disposed on the second housing 120. By way of example, the second housing 120 may include a boiling portion 123, and the boiling portion 123 may enclose a boiling tank 122.

The middle housing 130 covers the notch of the boiling tank 122 to form a boiling chamber 150, and the jet part 131 covers the notch of the boiling tank 122 as an example. The portion of the boiling part 123 that forms the bottom of the boiling groove 122 may be the contact part 121, and the bottom of the boiling groove 122 may be the heat radiation contact surface 1212.

The liquid outlet channel 170 is communicated with the boiling tank 122, so that the liquid outlet channel 170 can be communicated with the boiling cavity 150.

The liquid inlet channel 160 is connected to the third groove 190, and the jet portion 131 covers the notch of the third groove 190 to form the jet cavity 140, so that the liquid working medium can enter the third groove 190 from the liquid inlet channel 160. The liquid working medium can flow to the notch of the third groove 190, enter the boiling groove 122 through the jet hole on the jet part 131, and can be discharged from the liquid outlet channel 170 after contacting with the contact part 121.

In some examples, the second housing 120 may further include a second mounting portion 124, and the second mounting portion 124 may be disposed along an edge of the boiling portion 123 for one revolution, wherein the edge of the boiling portion 123 may also be understood as a notch of the boiling groove 122. Wherein the second mounting portion 124 may be coupled to an edge of the middle case 130.

Fig. 25 is a cross-sectional view of the cooling device 100 of fig. 22. In fig. 16, arrows in the liquid inlet channel 160, the jet flow chamber 140, the boiling chamber 150, and the liquid outlet channel 170 indicate the flow direction of the working fluid.

Referring to fig. 25, in some examples, the orthographic projection of the boiling portion 123 on the middle housing 130 may cover all of the jet holes 1310 on the jet portion 131, and all of the liquid working fluid flowing to the jet portion 131 may enter the boiling chamber 150 through the jet holes 1310.

In some examples, the third liquid outlet 126 may be disposed on the boiling portion 123. For example, the third liquid outlet portion 126 may be provided at a portion of the boiling portion 123 for forming a tank sidewall of the boiling tank 122. One end of the liquid outlet channel 170 surrounded by the third liquid outlet portion 126 extends to the side wall of the boiling tank 122, and is communicated with the boiling tank 122, and the other end extends to the outer surface of the second housing 120.

For example, an end of the liquid outlet channel 170 away from the boiling tank 122 may be used as the liquid outlet 171, and the liquid outlet 171 may be disposed at an end of the third liquid outlet portion 126 away from the boiling portion 123.

In some examples, the second housing 120 may be provided with a plurality of liquid outlet channels 170, and for example, the number of liquid outlet channels 170 may be two.

The liquid working medium can enter the third groove 190 through the liquid inlet channel 160, thus entering the jet cavity 140, and then flows to the notch of the third groove 190 to enter the boiling cavity 150 through the jet hole 1310 on the jet part 131. After entering the boiling cavity 150, the liquid working medium can wash the contact portion 121 to dissipate heat of the contact portion 121 to form a gas-liquid two-phase working medium, and then the gas-liquid two-phase working medium can flow to the periphery of the contact portion 121 and be discharged through the liquid outlet channel 170 on the second housing 120, wherein the liquid outlet channel 170 is arranged on the second housing 120, so that the path through which the gas-liquid two-phase working medium is discharged can be shortened, and the gas-liquid two-phase working medium is discharged advantageously.

Fig. 26 is a structural view of the cooling device 100 of fig. 22 at another viewing angle.

Referring to fig. 26, a portion of the boiling portion 123 forming a bottom of the boiling groove 122 may be used as the contact portion 121, and a surface of the contact portion 121 facing away from the middle housing 130 may be used as the heating element facing 1211.

While the application has been described with reference to certain preferred embodiments, it will be understood by those skilled in the art that various changes and substitutions of equivalents may be made and equivalents will be apparent to those skilled in the art without departing from the scope of the application. Therefore, the protection scope of the application is subject to the protection scope of the claims.

Claims

1. A cooling device, comprising: a first housing, a second housing, and a middle housing;

the middle shell is provided with a plurality of jet holes;

The first shell and the second shell are respectively positioned at two opposite sides of the middle shell, the first shell and the middle shell enclose a jet cavity, and the second shell and the middle shell enclose a boiling cavity; the jet hole is communicated with the jet cavity and the boiling cavity; the surface of the second shell, which faces away from the middle shell, comprises a heating element veneer;

The cooling device further comprises a liquid inlet channel and a liquid outlet channel, wherein the liquid inlet channel is communicated with the jet flow cavity, and the liquid outlet channel is communicated with the boiling cavity.

2. A cooling device according to claim 1, wherein,

The surface of the second shell, which is close to the middle shell, comprises a heat dissipation contact surface;

the cooling device further comprises a plurality of cooling strengthening structures, and the cooling strengthening structures are arranged on the heat dissipation contact surface at intervals.

3. A cooling device according to claim 2, wherein,

The cooling strengthening structure and the middle shell are arranged at intervals along a first direction, wherein the first direction is the direction in which the first shell, the middle shell and the second shell are sequentially arranged.

4. A cooling device according to claim 2 or 3, wherein,

Orthographic projection of the jet hole on the heat dissipation contact surface is staggered with the position of the cooling strengthening structure.

5. A cooling device according to claim 4, wherein,

The cooling device further comprises a plurality of hole extension parts, the hole extension parts are positioned on the surface of the middle shell, which faces the second shell, orthographic projections of the outer walls of the hole extension parts on the middle shell are respectively arranged around the plurality of jet holes for a circle, an extension channel is arranged in the Kong Yanchang part, one end of the extension channel is communicated with the jet hole surrounded by the hole extension part where the extension channel is positioned, and the other end of the extension channel faces the heat dissipation contact surface.

6. A cooling device according to claim 5, wherein,

And one end of the hole extension part, which is far away from the middle shell, is flush with one end of the cooling strengthening structure, which is far away from the heat radiation contact surface.

7. A cooling device according to any one of claims 1 to 6, wherein,

The liquid inlet channel and the liquid outlet channel are both positioned in the first shell;

the middle shell is provided with a first backflow port, the first backflow port is arranged around the plurality of jet holes, and the first backflow port is communicated with the boiling cavity and the liquid outlet channel.

8. A cooling device according to claim 7, wherein,

The middle shell comprises a jet flow part and a first backflow part, the first backflow part is arranged along the edge of the jet flow part for a circle, the jet flow holes are arranged on the jet flow part, and the first backflow port is arranged on the first backflow part;

The first shell is provided with a first groove and a first converging cavity, and the jet flow part covers the notch of the first groove to form the jet flow cavity; the liquid inlet channel is communicated with the first groove;

The first converging cavity is arranged along part of the edge of the notch of the first groove and is communicated with the first reflux port and the liquid outlet channel.

9. A cooling device according to any one of claims 1 to 6, wherein,

The liquid inlet channel is positioned in the first shell, and the liquid outlet channel is positioned in the middle shell;

the middle shell is also provided with a second reflux port, the second reflux port is arranged around the plurality of jet holes, and the second reflux port is communicated with the boiling cavity and the liquid outlet channel.

10. A cooling device according to claim 9, wherein,

The middle shell comprises a jet flow part and a second converging part, the second converging part is arranged along at least part of the edge of the jet flow part, the jet flow holes are arranged on the jet flow part, a second converging cavity is arranged in the second converging part, the second backflow port is arranged on one side, facing the second shell, of the second converging part, and the second converging cavity is communicated with the second backflow port and the liquid outlet channel;

the first shell is provided with a second groove, and the jet flow part covers the notch of the second groove to form the jet flow cavity; the liquid inlet channel is communicated with the second groove.

11. A cooling device according to any one of claims 1 to 6, wherein,

The liquid inlet channel is positioned in the first shell, and the liquid outlet channel is positioned in the second shell.

12. A cooling device according to claim 11, wherein,

A third groove is formed in the first shell, and the middle shell covers the notch of the third groove to form the jet flow cavity; the liquid inlet channel is communicated with the third groove;

The second shell is provided with a boiling groove, and the middle shell covers the notch of the boiling groove to form the boiling cavity; the liquid outlet channel is communicated with the boiling tank.

13. A cooling system, comprising:

the cooling device of any one of claims 1-12;

The liquid inlet pipe is connected with a liquid inlet channel of the cooling device;

and the liquid outlet pipe is connected with the liquid outlet channel of the cooling device.

14. An electronic device, characterized in that,

A heating element;

the cooling system of claim 13, wherein a heating element facing of a cooling device of the cooling system is in contact with an outer surface of the heating element.