CN118689290B

CN118689290B - Power supply device, load and electronic equipment

Info

Publication number: CN118689290B
Application number: CN202310294700.5A
Authority: CN
Inventors: 丛武龙; 周敏; 周子颖
Original assignee: Delta Electronics Shanghai Co Ltd
Current assignee: Delta Electronics Shanghai Co Ltd
Priority date: 2023-03-23
Filing date: 2023-03-23
Publication date: 2025-10-31
Anticipated expiration: 2043-03-23
Also published as: CN118689290A

Abstract

This application provides a power supply device, a load, and an electronic device. The electronic device includes: a system board; a load disposed on a first side of the system board, the load including a power supply area, the power supply area including load pins arranged in multiple rows and columns; and at least one column of output capacitors disposed on a second side of the system board. The power supply area includes at least one row as a first row, the first row including multiple load pin groups arranged sequentially along a second direction, each load pin group including at least two load pins of the same polarity, and each load pin group having the opposite polarity to its adjacent load pin group. In the first row, the first load pin of each load pin group along the second direction is a first position pin, and the two ends of the vertical projection of each column of output capacitors onto the power supply area are located on both sides of the center line of at least one first position pin in the third direction. This application is beneficial for improving the power supply capability to the load.

Description

Power supply device, load and electronic equipment

Technical Field

The application relates to the technical field of power electronics, in particular to a power supply device, a load and electronic equipment.

Background

With the rapid development of mobile internet, big data and artificial intelligence, more and more mass data needs to be processed, analyzed and calculated, and the computing capability of a processor (such as a CPU, a GPU, a DPU and the like) chip is also higher and higher. While the higher the computational power, the more power supply means need to supply a sufficiently larger supply current to the processor chip. The most common power supply is the horizontal power supply shown in fig. 1 and 2, and the power supply device 103 is disposed on the same side of the system board 101 as the processor chip 102. The power supply 103 connects the Vo pin (power supply output pin 1031) of the power supply 103 and the Vo pin (load input pin 1021) of the processor chip 102 together and connects the GND (power supply ground pin 1032) of the power supply 103 and the GND (load ground pin 1022) of the processor chip 102 together by way of the system board 101 trace (PCB trace) in order to transfer current to the processor chip 102. The Vo pins and the GND pins of the processor chip 102 are generally staggered so as to obtain a better decoupling effect, so that the PCB trace under the processor chip 102 forms a zigzag shape so as to connect the Vo pins and the GND pins together respectively. In order to ensure stable and reliable power supply of the processor chip 102, a certain number of output capacitors 104 must be placed at the position opposite to the processor on the back of the system board 101, the output capacitors 104 are electrically connected with the processor chip 102 through the system board via 1011, and the system board via 1011 can interconnect the processor chip 102 on the front of the system board 101 with the output capacitors 104 on the back, and also can interconnect multiple layers of wiring inside the system board 101, which is equivalent to providing more paths for current to pass to the processor chip 102, increasing the flow area and reducing the flow resistance so as to meet the power supply requirement of large current.

However, even with the system board vias 1011 interconnecting the multi-layer traces inside the system board 101, this distance L from the power device 103 to the pins of the processor chip 102 creates a very significant loss in higher current power applications. Through simulation and actual measurement, when the current of the processor chip 102 reaches about 500A, the loss of the system board 101 with horizontal power supply reaches 5.1% of the total output power. When the current of the processor reaches 1000A, the system board 101 losses reach 10.2% of the overall output power. These losses have severely reduced the power efficiency of the system.

Currently, vertical power supply is a possible solution to solve the problem of loss caused by high-current horizontal power supply. A conventional electronic device structure for supplying power vertically is shown in fig. 3. Unlike horizontal power supply, the power supply device 103 and the processor chip 102 for vertical power supply are vertically distributed and are respectively placed on the upper side and the lower side of the system board 101, so that the power supply device 103 is closer to the processor chip 102, and the current output by the power supply device 103 directly reaches the processor chip 102 after passing through the system board 101, so that the loss caused by the long wiring distance from the power supply device 103 to the processor chip 102 in horizontal power supply application is greatly reduced, and the loss value can be reduced to below 1% from 5% -10%.

However, vertical power supply is also required to meet the following requirements.

In requirement 1, since the back surface of the system board 101 needs to be connected to the output capacitor 104, and the pins of the power supply device 103 need to be connected to the back surface of the system board 101, and the output capacitor 104 and the power supply device 103 are disposed perpendicular to the processor chip 102, the output capacitor 104 and the power supply device 103 need to be disposed reasonably and avoid each other.

Demand 2, needs to meet the placement requirements of output capacitor 104. Since the processor chip 102 has multiple Vo pins and GND pins, adjacent Vo pins and GND pins may be referred to as a pin pair, in principle, each pin pair requires the output capacitor 104 to be placed near the back of the motherboard in order to perform better filtering.

The current path from the power supply 103 to the processor chip 102 is, in the requirement 3, pins of the power supply 103, system board vias 1011 on the soldering surface, system board 101 wiring, and the processor chip 102. Since the number of vias 1011 of the system board 101 has a limit of maximum current capacity, and at most 1 via 1011 is placed between pins of adjacent processor chips 102 on the system board 101, the number of vias 1011 is close to and limited to the number of pins of the processor chips 102. The pins of the power supply 103 therefore need to connect as many vias 1011 as possible in close proximity so that the current value passed by a single via 1011 does not exceed the physical limit that the system board via 1011 can withstand.

In order to meet the above-mentioned demand, a schematic diagram of another electronic device as shown in fig. 4 is proposed in the related art. To meet requirement 1, the output capacitor 104 is integrated in the power supply device 103 in the prior art, so that the output capacitor 104 is not directly placed on the system board 101, and pins of the power supply device 103 are not required to be placed avoiding the output capacitor 104. In order to solve the problem 3, the pins of the power supply device 103 and the pins of the processor chips 102 are arranged in the same way and are connected in a one-to-one correspondence, and because the corresponding system board via holes 1011 are arranged near the pins of each processor chip 102, the power supply device 103 can be fully connected with the system board via holes 1011.

However, the structure shown in fig. 3 does not well satisfy requirement 2, and since the output capacitor 104 is integrated into the power supply device 103, as shown in fig. 4, the output capacitor 104 needs to be connected to the system board 101 through the PCB 1033 of the power supply device 103 and the pins 1031,1032 of the power supply device 103. The connection impedance is large in this way, and the filtering effect is affected, so that the power supply device 103 needs to integrate more output capacitors 104 to achieve the originally expected filtering effect.

It should be noted that the information disclosed in the foregoing background section is only for enhancement of understanding of the background of the application and thus may include information that does not form the prior art that is already known to those of ordinary skill in the art.

Disclosure of Invention

In view of the problems in the related art, an object of the present application is to provide a power supply device, a load, and an electronic apparatus, which are beneficial to improving the power supply capability to the load.

The first aspect of the present application provides an electronic device, including:

the system board comprises a first surface and a second surface which are oppositely arranged along a first direction;

The load is arranged on the first surface of the system board and comprises a power supply area, and the power supply area comprises load pins which are arranged in a plurality of rows along the second direction and a plurality of columns along the third direction;

At least one column of output capacitors, each column of output capacitors being arranged on the second surface of the system board along the third direction;

at least one row of the power supply area is a first row, the first row comprises a plurality of load pin groups which are sequentially arranged along the second direction, each load pin group comprises at least two load pins with the same polarity, and the polarity of each load pin group is opposite to that of the adjacent load pin group;

In the first arrangement row, a first load pin of each load pin group along the second direction is a first position pin, and two ends of the vertical projection of each output capacitor in the power supply area are positioned at two sides of the central line of at least one first position pin in the third direction;

wherein the first direction, the second direction and the third direction are perpendicular to each other.

A second aspect of the present application provides a power supply apparatus for supplying power to a load on a system board, the system board including a first face and a second face disposed opposite to each other in a first direction;

the load is arranged on the first surface of the system board, and comprises a power supply area, wherein the power supply area comprises load pins which are arranged in a plurality of rows along a second direction and a plurality of columns along a third direction;

The power supply device is arranged on the second surface of the system board, one side of the power supply device, facing the system board, is provided with a plurality of power supply pins, and each power supply pin is connected to the load pins with the same polarity through the conductive structure of the system board;

at least one column of output capacitors is connected between the power supply device and the load in parallel, and each column of output capacitors is arranged on the second surface of the system board along the third direction;

A third aspect of the application provides a load comprising:

the power supply area comprises load pins which are arranged in a plurality of rows along a second direction and a plurality of columns along a third direction;

At least one row of the power supply area is a first row, the first row comprises a plurality of load pin groups which are sequentially arranged along the second direction, each load pin group comprises at least two load pins with the same polarity, and the polarity of each load pin group is opposite to that of the adjacent load pin group; the power supply area further comprises at least one second arrangement row, the load pin arrangement of the second arrangement row is offset by one load pin along the second direction compared with the load pin arrangement of the first arrangement row, and the at least one first arrangement row is arranged adjacent to the at least one second arrangement row;

wherein the second direction and the third direction are perpendicular to each other.

A fourth aspect of the present application provides an electronic device, including the load according to the third aspect, further including a power supply device, at least one column of output capacitors, and a system board, where the system board includes a first surface and a second surface that are disposed opposite to each other along a first direction, the load is disposed on the first surface of the system board, and the power supply device and the output capacitors are disposed on the second surface of the system board.

The power supply device, the load and the electronic equipment provided by the application have the following advantages:

By adopting the application, the output capacitor for filtering is arranged on the back of the system board, the output capacitor is closer to the load input pin and the load grounding pin, the filtering effect is better, and the output capacitor and the power supply device are reasonably arranged and mutually avoided. The positions of the power supply output pins and the power supply grounding pins of the power supply device correspond to the conductive structures with the same polarity, and all the conductive structures can be used for current passing without exceeding the current passing capacity. The output capacitors can be opposite in homopolar and are orderly arranged, and the pins of the power supply device are easier to lead out.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the detailed description of non-limiting embodiments, made with reference to the following drawings.

FIG. 1 is a schematic diagram of a prior art horizontally powered electronic device;

FIG. 2 is a schematic diagram of the electronic device of FIG. 1 from another perspective, showing pins of a horizontally powered load;

FIG. 3 is a schematic diagram of a prior art vertically powered electronic device;

FIG. 4 is a schematic diagram of a related art vertically powered electronic device;

FIG. 5 is an enlarged view of the inside of the circle in FIG. 4;

FIG. 6 is a side view of an electronic device according to an embodiment of the application;

FIG. 7 is a schematic structural diagram of the electronic device of FIG. 6 from another perspective, showing one arrangement of power supply areas for a load;

FIG. 8 is a schematic view of a first array row of power supply areas of the load shown in FIG. 7;

FIG. 9 is a schematic illustration of a second alignment of power supply regions of the load shown in FIG. 7;

FIGS. 10 (a) and 10 (b) are schematic diagrams of an arrangement of wires in a power supply area of a load according to an embodiment of the present application;

fig. 11 (a) and 11 (b) are schematic structural views of an electronic device according to another embodiment of the present application, showing a schematic view of another arrangement wiring of a power supply area of a load;

Fig. 12 is a schematic structural view of an electronic device according to still another embodiment of the present application, showing a schematic view of still another arrangement of power supply areas of loads;

reference numerals:

Prior Art

101. Power supply output pin of system board 1031

1011. Power supply grounding pin of system board via 1032

102. PCB of power supply device for processor chip 1033

1021. Load input pin 1034 power supply device PCB board via hole

1022. Load ground pin 104 output capacitance

103. Power supply device

The application is that

1. System board 23 load pin set

11. First side 231 first position pins

12. Second surface 3 power supply device

13. Conductive structure 31 power supply output pin

2. Load 32 power supply ground pin

21. Load input pin 4 output capacitor

22. Load grounding pin

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments can be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus a repetitive description thereof will be omitted. "or", "or" in the specification may each mean "and" or ". Although the terms "upper", "lower", "between", etc. may be used in this specification to describe various exemplary features and components of the application, these terms are used herein for convenience only, e.g., in terms of the orientation of the examples depicted in the drawings. Nothing in this specification should be construed as requiring a particular three-dimensional orientation of the structure in order to fall within the scope of the application. Although the terms "first" or "second" etc. may be used herein to describe certain features, these features should be interpreted in a descriptive sense only and not for purposes of limitation as to the number and importance of the particular features.

Fig. 6 to 10 show a structure of an electronic device according to an embodiment of the application. In this embodiment, the electronic device 100 includes a system board 1, a load 2, at least one column of output capacitors 4, and a power supply device 3, where the output capacitors 4 are connected between the power supply device 3 and the load 2, and are used for filtering energy input to the load 2. The z-direction shown in fig. 6 is defined as a first direction, the x-direction is defined as a second direction, and the y-direction shown in fig. 7 is defined as a third direction. The first direction z, the second direction x and the third direction y are perpendicular to each other. The load 2 is, for example, a processor chip, which includes CPU, GPU, TPU or NPU, and in other alternative embodiments, the load 2 may be another type of electronic device, component, or assembly that needs to be powered, which falls within the scope of the present application. The system board 1 is a PCB board, and includes a first surface 11 and a second surface 12 that are disposed opposite to each other along a first direction z, and in the view of fig. 6, the first surface 11 is an upper surface of the system board 1, and the second surface 12 is a lower surface, which may also be referred to as a back surface, of the system board 1.

As shown in fig. 6, the load 2 is disposed on the first surface 11 of the system board 1, and the load 2 includes a rectangular power supply area, as shown in fig. 7, where the power supply area includes load pins arranged in a plurality of rows along the second direction x and a plurality of columns along the third direction y, i.e., the second direction x is a row direction, and the third direction y is a column direction. Preferably, the power supply area comprises at least three rows of load pins, including a plurality of load input pins 21 and a load ground pin 22. Each column of the output capacitors 4 is arranged on the second side 12 of the system board 1 along the third direction y. The power supply device 3 is disposed on the second surface 12 of the system board 1, and a plurality of power supply pins are disposed on a side of the power supply device 3 facing the system board 1, and each power supply pin is connected to the load pins with the same polarity through the conductive structure 13 of the system board 1. The conductive structures 13 include vias or blind buried vias.

The power supply area comprises at least one first arrangement row, and the first arrangement row can be one row or a plurality of rows. As shown in fig. 7, in this embodiment, y=1, y=3, and y=5 correspond to three rows of one or more rows. As shown in fig. 8, the first arrangement row includes a plurality of load pin groups 23 sequentially arranged along the second direction x, each load pin group 23 includes at least two load pins with the same polarity, and each load pin group 23 has a polarity opposite to that of an adjacent load pin group 23. Therefore, in the first arrangement row, the load pin groups 23 with different polarities may be staggered in the x-direction, which is beneficial for staggered decoupling. And, each occurrence of the load pins with the same polarity is continuous, and the continuity is not less than 2 times.

Within each dashed box in fig. 8 is a load pin group 23, the first load pin group 23 comprising two load input pins 21, the second load pin group 23 comprising two load ground pins 22, the third load pin group 23 comprising two load input pins 21, and so on. In this embodiment, in the first arrangement row, the pin number of each group of the load input pins 21 is the same, the pin number of each group of the load ground pins 22 is the same, and the pin number of each group of the load input pins 21 is the same as the pin number of each group of the load ground pins 22, but the application is not limited thereto. The number of load pins in each load pin group 23 is not limited to 2, but may be 3, 4, or more as long as the number of load pins in each load pin group 23 is greater than or equal to 2. In the first arrangement row, a first load pin of each load pin group 23 along the second direction x is defined as a first position pin 231, and a leftmost pin in each dashed box in fig. 8 is defined as the first position pin 231. The power supply area may include one first arrangement row or a plurality of first arrangement rows, and when the power supply area includes a plurality of first arrangement rows, each of the first arrangement rows has the same arrangement form.

As can be seen in connection with fig. 7 and 8, each column of the output capacitors 4 is located on both sides of the center line of at least one of the first position pins 231 in the third direction at both ends of the vertical projection of the power supply area. In this embodiment, the perpendicular projection of the output capacitor 4 in the power supply region refers to the perpendicular projection of the output capacitor 4 in the xy plane along the third direction z. For example, in the view of fig. 7, the first column output capacitor 4 is located at both ends of the vertical projection of the power supply region on the left and right sides of the center line of the first position pin 231 of the first load pin group 23 in the third direction. The two ends of the vertical projection of the second column output capacitor 4 in the power supply area are located on the left and right sides of the center line of the first position pin 231 of the second load pin group 23 in the third direction, and so on. In this embodiment, the number of columns of the output capacitors 4 is equal to the number of load pin groups 23 in a first row, that is, for one first row, each of the first position pins 231 of the load pin groups 23 corresponds to one column of the output capacitors 4, and two ends of the vertical projection of each column of the output capacitors 4 in the power supply area are respectively located on the left and right sides of the corresponding center line of the first position pin 231 in the third direction. In other alternative embodiments, fewer columns of output capacitors 4 may be provided, for example, only the first load pin group 23, the first position pin 231 of the third load pin group 23 corresponds to one column of output capacitors 4, and so on, which are all within the scope of the present application. In the third direction y, the vertical projection of the output capacitor 4 in the power supply area is located between two adjacent rows of the load pins. And one row of output capacitors 4 is arranged between every two adjacent rows of load pins. In different embodiments, the number of rows of the output capacitor 4 may also be increased or decreased as required. When the number of the output capacitors 4 is large, a better filtering effect can be obtained.

Therefore, as shown in fig. 6, the output capacitor 4 for filtering is placed on the back of the system board 1, and the output capacitor 4 is closer to the load input pin 21 and the load ground pin 22, the filtering effect is better, and the output capacitor 4 and the power supply device 3 are reasonably placed so as to avoid each other. As shown in fig. 7, two poles (two ends) of the output capacitor 4 may be neatly distributed on two sides of the center line of the head pins of the first arrangement row in the third direction y, the power supply pins of the power supply device 3 are connected with the system board 1 more regularly, and more conductive structures 13 may carry the current of the power supply device 3. The structure of the electronic equipment can effectively improve the vertical power supply capacity of the power supply device 3 to the load 2, so that the power supply device 3 can provide larger vertical power supply current for the load 2.

As shown in fig. 7, the power supply area further includes a second arrangement row, where the second arrangement row may be one or more rows, such as two rows corresponding to y=2 and y=4 in fig. 7. When the power supply area comprises a plurality of second arrangement rows, the arrangement forms of the plurality of second arrangement rows are the same. The first arrangement rows and the second arrangement rows are alternately arranged in the third direction y, but the present application is not limited thereto. Fig. 9 exemplarily shows a structure of one second arrangement row. The load pin arrangement of the second arrangement row is offset by one load pin along the second direction x compared to the load pin arrangement of the first arrangement row. The polarity of the first load pin and the polarity of the second load pin of the second arrangement row along the second direction x are opposite. As can be seen from comparing fig. 9 and fig. 8, the load pins of the first arrangement row are shifted to the right by one load pin as the load pins of the corresponding position of the second arrangement row, and one load pin with the opposite polarity is determined as the first load pin of the second arrangement row according to the polarity of the second load pin located in the second arrangement row after shifting. In the example of fig. 9, because the second load pin in the second arrangement row after the offset is the load input pin 21, the first load pin in the second arrangement row is the load ground pin 22. The number of the second arrangement rows can be selected and set according to the requirement. In different embodiments, all rows of the power supply area may be first arranged rows, or include a combination of one or more first arranged rows and one or more second arranged rows, where the first arranged rows and the second arranged rows may be staggered in the third direction y, for example, the 1 st, 3 rd, 5 th row first arranged rows, the 2 nd, 4 th row second arranged rows, or may be randomly arranged, for example, the 1 st, 2 nd, 5 th row first arranged rows, the 3 rd, 4 th row second arranged rows, or the 1 st, 2 nd, 4 th, 5 th row first arranged rows, the 3 rd row second arranged rows.

Fig. 10 shows the connection of the load pins of fig. 7. As can be seen from fig. 10, by adopting this arrangement, the first load input pins 21 or the load ground pins 22 of each first arrangement row can be finally interconnected together through the zigzag wiring, so that the situation of being unable to communicate is avoided, and the wiring design of the system board 1 is facilitated. The conductive structures 13 of each column are connected by zigzag wiring and have the same polarity, and at least two adjacent conductive structures of the columns have the same polarity, which is beneficial to layout design. In the structure with the first arrangement rows and the second arrangement rows at the same time, the output capacitors 4 can be placed more flexibly, and the staggering is formed in the second direction x and the staggering is also formed in the third direction y.

As shown in fig. 10 (a) and 10 (b), the power supply pins of the power supply device 3 include a power supply output pin 31 (denoted as Vo in the drawing) and a power supply ground pin 32 (denoted as GND in the drawing), and each power supply pin is respectively disposed between two adjacent columns of the output capacitors 4, thereby providing a positional relationship in which three of the load pin, the output capacitor 4 and the power supply pin are advantageous for vertical power supply in space. The power supply output pin 31 and the load input pin 21 are both Vo polarity, and the power supply ground pin 32 and the load ground pin 22 are both GND polarity. The power supply output pins 31 and the power supply ground pins 32 are staggered in the second direction x. In the second direction x, the length of each power supply pin is less than or equal to the center-to-center distance between two adjacent first position pins 231 minus the length D of the output capacitor 4. In this embodiment, the center-to-center distance between two adjacent first position pins 231 is equal to 2×pitch (pitch represents the center-to-center distance between two adjacent load pins), so that the length D of each power supply pin is equal to or less than 2×pitch-D in the second direction x, and the center-to-center distance between two adjacent power supply pins is 2×pitch.

As shown in fig. 10 (a) and 10 (b), the system board 1 is provided with a plurality of columns of the conductive structures 13 at positions corresponding to the power supply areas, each column of the conductive structures 13 is located at one side of one column of the output capacitors 4, and each of the conductive structures 13 is aligned with an adjacent one of the output capacitors 4 in the second direction x. The polarity of the load pins of a column adjacent to the first side of the vertical projection of the output capacitor 4 in the power supply area is the same, the polarity of the load pins of a column adjacent to the second side is the same, and the polarity of the load pins of the column on the first side is opposite to the polarity of the load pins of the column on the second side. For example, a column of load pins (x=2) adjacent to the right side of the first column of output capacitors 4 are all load input pins 21, a column of load pins (x=2) adjacent to the left side of the second column of output capacitors 4 are all load input pins 21, a column of load pins (x=4) adjacent to the right side of the second column of output capacitors 4 are all load ground pins 22, a column of load pins (x=4) adjacent to the left side of the third column of output capacitors 4 are all load ground pins 22, and a column of load pins (x=6) adjacent to the right side of the third column of output capacitors 4 are all load input pins 21.

As shown in fig. 10 (a) and 10 (b), in this embodiment, the same column of the conductive structures 13 is connected to the power supply pins of the same polarity, so that the output capacitors 4 may be disposed in column alignment between the two columns of the conductive structures 13. For example, in the view of fig. 10 (a) and 10 (b), the first column of conductive structures 13 are each connected to the power supply output pin 31 through zigzag wiring, the second column of conductive structures 13 are each connected to the power supply output pin 31 through zigzag wiring, and the third column of conductive structures 13 are each connected to the power supply ground pin 32 through zigzag wiring. The positions of the power supply output pin 31 and the power supply grounding pin 32 of the power supply device 3 correspond to the conductive structures 13 with the same polarity, and all the conductive structures 13 can be conducted without exceeding the current-conducting capacity. The output capacitors 4 can be opposite in homopolar and are orderly arranged, and the pins of the power supply device 3 are easier to lead out. In the second direction x, the capacitance pins of two adjacent output capacitors 4 opposite to each other are of the same polarity. Each of the power supply pins has the same polarity as the pin of the output capacitor 4 adjacent thereto. For example, in the view angles of fig. 10 (a) and 10 (b), in the second direction x, the right end of the first column output capacitor 4 is opposite to the left end of the second column output capacitor 4, and the polarities are the same. The right end of the second column output capacitor 4 is opposite to the left end of the third column output capacitor 4, and has the same polarity, and so on, the following column output capacitors 4 have the same characteristics. The space between two adjacent columns of output capacitors 4 can be reserved for the pins of the power supply device 3 to be connected. Another feature of the arrangement of fig. 10 (a) and fig. 10 (b) is that the first arrangement rows and the second arrangement rows are staggered, and besides the above-mentioned benefits, staggered arrangement of pins with different polarities can be formed in the Y direction, so that the output capacitors can be arranged along the Y direction even by rotating 90 degrees, which improves flexibility of arrangement of the output capacitors and is more beneficial to design of a system.

Fig. 11 (a) and fig. 11 (b) are schematic diagrams of another electronic device and a power supply area arrangement manner therein according to an embodiment of the present application. This embodiment differs from the arrangement shown in fig. 10 (a) and 10 (b) in that the arrangement of the first arrangement row is different. In the arrangement shown in fig. 11 (a) and 11 (b), y=1, y=2, y=4, y=6 is a first arrangement row, and y=3 and y=5 is a second arrangement row. In the first arrangement, the first load pin group 23 comprises three load ground pins 22, the second load pin group 23 comprises two load input pins 21, the third load pin group 23 comprises four load ground pins 22, the fourth load pin group 23 comprises three load input pins 21, and the fifth load pin group 23 comprises two load ground pins 22. Accordingly, the first arrangement row in fig. 11 (a) and 11 (b) also satisfies an arrangement rule including a plurality of load pin groups 23 arranged in order along the second direction, each of the load pin groups 23 including at least two load pins of the same polarity, and each of the load pin groups 23 being opposite in polarity to the adjacent load pin groups 23. Also, the number of load pins included in different load pin groups 23 having the same polarity may be different, and the number of load pins included in different load pin groups 23 having different polarities may be different. The load pin arrangement of the second arrangement row is offset by one load pin along the second direction x compared with the load pin arrangement of the first arrangement row, and the polarity of a first load pin and a second load pin of the second arrangement row along the second direction is opposite.

As shown in fig. 11 (a) and 11 (b), both ends of the vertical projection of each column of the output capacitors 4 on the power supply area are located on both sides of the center line of at least one of the first position pins 231 in the third direction. For example, in the view angles of fig. 11 (a) and 11 (b), the two ends of the vertical projection of the first column output capacitor 4 in the power supply area are located on the left and right sides of the center line of the first position pin 231 of the first load pin group 23 in the third direction. The two ends of the vertical projection of the second column output capacitor 4 in the power supply area are located on the left and right sides of the center line of the first position pin 231 of the second load pin group 23 in the third direction, and so on. In this embodiment, the number of columns of the output capacitors 4 is equal to the number of load pin groups 23 in a first row, that is, for one first row, each of the first position pins 231 of the load pin groups 23 corresponds to one column of the output capacitors 4, and two ends of the vertical projection of each column of the output capacitors 4 in the power supply area are respectively located on the left and right sides of the corresponding center line of the first position pin 231 in the third direction. In the third direction y, the vertical projection of the output capacitor 4 in the power supply area is located between two adjacent rows of the load pins. And one row of output capacitors 4 is arranged between every two adjacent rows of load pins. In different embodiments, the number of rows and columns of the output capacitor 4 may be increased or decreased as required. When the number of the output capacitors 4 is large, a better filtering effect can be obtained.

The arrangement mode also has good load power supply performance. Specifically, the output capacitor 4 for filtering is placed on the back of the system board 1, and the output capacitor 4 is closer to the load input pin 21 and the load grounding pin 22, so that the filtering effect is better, and the output capacitor 4 and the power supply device 3 are reasonably placed and avoid each other. The two poles of the output capacitor 4 can be distributed on two sides of the center line of the head pin in the third direction y in order, the power supply pins of the power supply device 3 are connected with the system board 1 more regularly, the regularly distributed pins of the power supply device can be manufactured by adopting a simpler process, the production cost is reduced, and meanwhile, more conductive structures 13 can bear the current of the power supply device 3 in the connection. The structure of the electronic equipment can effectively improve the vertical power supply capacity of the power supply device 3 to the load 2, so that the power supply device 3 can provide larger vertical power supply current for the load 2.

As can be seen from fig. 11 (a) and 11 (b), by adopting this arrangement, the first load input pins 21 or the load ground pins 22 of each first arrangement row can be finally interconnected together through the zigzag wiring, so that no situation of being unable to communicate occurs, and the wiring design of the system board 1 is facilitated. The conductive structures 13 of each column are connected by zigzag wiring and have the same polarity, and at least two adjacent conductive structures of the columns have the same polarity, which is beneficial to layout design. In the structure with the first arrangement rows and the second arrangement rows at the same time, the output capacitors 4 can be placed more flexibly, and the staggering is formed in the second direction x and the staggering is also formed in the third direction y.

As shown in fig. 11 (a) and 11 (b), each power supply pin is respectively disposed between two adjacent columns of the output capacitors 4. The power supply output pins 31 and the power supply ground pins 32 are staggered in the second direction x. In the second direction x, the length of each power supply pin is less than or equal to the center-to-center distance between two adjacent first position pins 231 minus the length D of the output capacitor 4. In this embodiment, the center-to-center spacing between the first position pin 231 of the first load pin group 23 and the first position pin 231 of the second load pin group 23 is equal to 3×pitch (pitch represents the center-to-center spacing between two adjacent load pins, see the examples of fig. 10 (a) and 10 (b)), and thus, in the second direction x, the length of the first power supply pin is equal to or less than 3×pitch-D. Through improving the centre-to-centre spacing of two adjacent first position pins, power supply unit's biggest pin length also can obtain increasing, does benefit to the preparation of power supply unit pin like this, has reduced the production degree of difficulty, has improved the production yields.

As shown in fig. 11 (a) and 11 (b), the system board 1 is provided with a plurality of columns of the conductive structures 13 at positions corresponding to the power supply areas, each column of the conductive structures 13 is located at one side of one column of the output capacitors 4, and each of the conductive structures 13 is aligned with an adjacent one of the output capacitors 4 in the second direction. The polarity of the load pins of a column adjacent to the first side of the vertical projection of the output capacitor 4 in the power supply area is the same, the polarity of the load pins of a column adjacent to the second side is the same, and the polarity of the load pins of the column on the first side is opposite to the polarity of the load pins of the column on the second side. For example, a column of load pins (x=2) adjacent to the right side of the first column of output capacitors 4 are all load ground pins 22, a column of load pins (x=3) adjacent to the left side of the second column of output capacitors 4 are all load ground pins 22, a column of load pins (x=5) adjacent to the right side of the second column of output capacitors 4 are all load input pins 21, a column of load pins (x=5) adjacent to the left side of the third column of output capacitors 4 are all load input pins 21, a column of load pins (x=7) adjacent to the right side of the third column of output capacitors 4 are all load ground pins 22, and so on.

As shown in fig. 11 (a) and 11 (b), in this embodiment, the same column of conductive structures 13 is connected to the same polarity of the power supply pins, so that the output capacitors 4 may be disposed in column alignment between the two columns of conductive structures 13. For example, in the view angles of fig. 11 (a) and 11 (b), the first column of conductive structures 13 are each connected to the power supply ground pin 32 through zigzag lines, the second column of conductive structures 13 are each connected to the power supply ground pin 32 through zigzag lines, the third column of conductive structures 13 are each connected to the power supply ground pin 32 through zigzag lines, the fourth column of conductive structures 11 are each connected to the power supply output pin 31 through zigzag lines, and the fifth column of conductive structures 11 are each connected to the power supply output pin 31 through zigzag lines. The positions of the power supply output pin 31 and the power supply grounding pin 32 of the power supply device 3 correspond to the conductive structures 13 with the same polarity, and all the conductive structures 13 can be conducted without exceeding the current-conducting capacity. The output capacitors 4 can be opposite in homopolar and are orderly arranged, and the pins of the power supply device 3 are easier to lead out. In the second direction x, the capacitance pins of two adjacent output capacitors 4 opposite to each other are of the same polarity. Each of the power supply pins has the same polarity as the pin of the output capacitor 4 adjacent thereto. For example, in the view angles of fig. 11 (a) and 11 (b), in the second direction x, the right end of the first column output capacitor 4 is opposite to the left end of the second column output capacitor 4, and the polarities are the same. The right end of the second column output capacitor 4 is opposite to the left end of the third column output capacitor 4, and has the same polarity, and so on, the following column output capacitors 4 have the same characteristics. The space between two adjacent columns of output capacitors 4 can be reserved for the pins of the power supply device 3 to be connected.

As shown in fig. 12, a schematic diagram of still another arrangement of the power supply area according to still another embodiment of the present application is shown. The arrangement is different from the arrangement shown in fig. 10 (a) and 10 (b) and 11 (a) and 11 (b) in that each row in the power supply area is the first arrangement row, that is, there is no second arrangement row, and the polarities of the load pins in the same column in the power supply area are the same. This structure also has the main advantages of the structures of fig. 10 (a) and 10 (b) and 11 (a) and 11 (b). The output capacitor 4 for filtering is placed on the back of the system board 1, the output capacitor 4 is closer to the load input pin 21 and the load grounding pin 22, the filtering effect is best, and the output capacitor 4 and the power supply device 3 are reasonably placed and mutually avoided. The two poles of the output capacitor 4 can be distributed on two sides of the center line of the head pin in the third direction y, the power supply pin of the power supply device 3 is connected with the system board 1 more regularly, and more conductive structures 13 can bear the current of the power supply device 3. The polarity of the load pins of a column adjacent to the first side of the vertical projection of the output capacitor 4 in the power supply area is the same, the polarity of the load pins of a column adjacent to the second side is the same, and the polarity of the load pins of the column on the first side is opposite to the polarity of the load pins of the column on the second side. The same column of the conductive structures 13 is connected to the power supply pins of the same polarity. In the second direction x, the capacitance pins of two adjacent output capacitors 4 opposite to each other are of the same polarity. In addition to advantages similar to those of fig. 10 (a) and 10 (b) and fig. 11 (a) and 11 (b), this orderly and regular arrangement facilitates the design of internal traces of the processor, especially larger-sized and more-leaded processor chips.

As shown in fig. 10-11, the embodiment of the present application further provides a power supply device 3, where the power supply device 3 is used to supply power to a load 2 on a system board 1, and the system board 1 includes a first surface 11 and a second surface 12 that are oppositely disposed along a first direction; the load 2 is arranged on a first surface of the system board, the load 2 comprises a power supply area, the power supply area comprises load pins which are arranged in a plurality of rows along a second direction and are arranged in a plurality of columns along a third direction, the power supply device 3 is arranged on a second surface of the system board, one side of the power supply device 3, which faces the system board, is provided with a plurality of power supply pins, each power supply pin is connected to the load pins with the same polarity through a conductive structure of the system board 1, at least one column of output capacitors is connected between the power supply device 3 and the load 2, each column of output capacitors is arranged on the second surface of the system board along the third direction, at least one column of output capacitors is arranged in a first arrangement row in the power supply area, the first arrangement row comprises a plurality of load pin groups which are sequentially arranged along the second direction, each load pin group comprises at least two load pins with the same polarity, each load pin group is opposite to the adjacent load pin groups, each load pin group is connected to the load pin group through a conductive structure of the system board 1, each column of output capacitor is arranged in the first arrangement row, each load pin is arranged on the first column of load pins is arranged along the first direction, the first column of load pins is arranged on the first column of load pins, and second column of load pins are arranged along the first column of the first column is perpendicular to the second column, and the second column of load pins are arranged along the first column, and the first column is arranged along the first column, and the column, and the power column is arranged. The pins of the power supply device can be orderly arranged, the production and the manufacture are easy, the manufacturing cost is reduced, and the power supply device is easy to weld with a system board because the pins are orderly, and the production efficiency is improved.

10-12, The embodiment of the application further provides a load 2, which comprises a power supply area, wherein the power supply area comprises load pins which are arranged in a plurality of rows along a second direction and are arranged in a plurality of columns along a third direction, at least one first arrangement row is arranged in the power supply area and comprises a plurality of load pin groups which are sequentially arranged along the second direction, each load pin group comprises at least two load pins with the same polarity, each load pin group has the polarity opposite to that of the adjacent load pin group, the power supply area further comprises at least one second arrangement row, the load pin arrangement of the second arrangement row is offset by one load pin along the second direction compared with the load pin arrangement of the first arrangement row, the at least one first arrangement row is adjacent to the at least one second arrangement row, and the second direction and the third direction are perpendicular to each other. The load can lead pins with the same polarity to be more concentrated through a specific pin arrangement mode, the pins with different polarities are arranged in a staggered mode, convenience is brought to placement of the filter capacitor, meanwhile, the combination of the first arrangement row and the second arrangement row is convenient for the system board to connect the pins with the same polarity through Z-shaped wiring, and the board card design is convenient.

In some embodiments, the power supply area includes at least two rows of the first arrangement rows and at least two rows of the second arrangement rows, and the first arrangement rows and the second arrangement rows are alternately arranged. In some embodiments, each of the load pin groups of the first arrangement row contains the same number of the load pins.

As shown in fig. 10-12, the present application further provides an electronic device 100, including the load 2, a power supply device 3, at least one column of output capacitors 4, and a system board 1, where the system board 1 includes a first surface 11 and a second surface 12 that are opposite to each other along a first direction, the load 2 is disposed on the first surface 11 of the system board 1, and the power supply device 3 and the output capacitors 4 are disposed on the second surface 12 of the system board 1.

The foregoing is a further detailed description of the application in connection with the preferred embodiments, and it is not intended that the application be limited to the specific embodiments described. It will be apparent to those skilled in the art that several simple deductions or substitutions may be made without departing from the spirit of the application, and these should be considered to be within the scope of the application.

Claims

1. An electronic device, comprising:

2. The electronic device of claim 1, further comprising:

The power supply device is arranged on the second surface of the system board, a plurality of power supply pins are arranged on one side, facing the system board, of the power supply device, the power supply pins are connected to the load pins with the same polarity through conductive structures of the system board respectively, and the output capacitor is connected between the power supply device and the load.

3. The electronic device of claim 1, wherein each row in the power supply area is the first arrangement row, and wherein the polarity of the load pins of a same column in the power supply area is the same.

4. The electronic device of claim 1, wherein the power region further comprises at least one second arrangement row having a load pin arrangement offset from the load pin arrangement of the first arrangement row by one load pin in the second direction, and wherein,

And the polarity of the first load pins and the polarity of the second load pins of the second arrangement row along the second direction are opposite.

5. The electronic device of claim 1, wherein for a first row of the first arrangement, the first position pins of each load pin group correspond to a column of the output capacitors, and two ends of a vertical projection of each column of the output capacitors in the power supply area are respectively located at two sides of a center line of the corresponding first position pin in the third direction.

6. The electronic device of claim 1, wherein in the third direction, a perpendicular projection of the output capacitance at the power supply region is located between two adjacent rows of the load pins.

7. The electronic device of claim 6, wherein the at least one column of output capacitances comprises a plurality of columns of output capacitances, and wherein in the third direction, one row of output capacitances is disposed between every two adjacent rows of load pins.

8. The electronic device of claim 1, wherein a column of the load pins of each column of the output capacitors adjacent to a first side of the vertical projection of the power supply region has the same polarity, a column of the load pins adjacent to a second side has the same polarity, and the column of the load pins of the first side is opposite to the column of the load pins of the second side.

9. The electronic device of claim 2, wherein the power supply pins of the power supply means comprise power supply output pins and power supply ground pins, the power supply output pins and the power supply ground pins being staggered in the second direction.

10. The electronic device of claim 9, wherein the at least one column of output capacitors comprises a plurality of columns of output capacitors, and each power supply pin is respectively disposed between two adjacent columns of output capacitors.

11. The electronic device of claim 10, wherein in the second direction, a length of each of the power supply pins is less than or equal to a center-to-center distance of two adjacent first position pins minus a length of the output capacitance.

12. The electronic device of claim 10, wherein the conductive structure comprises a via or a blind buried via;

The system board is provided with a plurality of columns of conductive structures at positions corresponding to the power supply areas, each column of conductive structures is positioned at one side of one column of output capacitors, and each conductive structure is aligned with the adjacent output capacitor in the second direction.

13. The electronic device of claim 12, wherein the same column of the conductive structures is connected to the power pins of the same polarity.

14. The electronic device of claim 1, wherein the at least one column of output capacitances comprises a plurality of columns of output capacitances, and wherein in the second direction, two adjacent output capacitances have opposite capacitance pins of the same polarity.

15. The electronic device of claim 2, wherein each of the power supply pins and the pins of the output capacitors adjacent thereto have the same polarity.

16. The electronic device of claim 1, wherein the load pins comprise load input pins and load ground pins, and wherein in the first row, the pin count of each group of the load input pins is the same, and the pin count of each group of the load ground pins is the same.

17. The electronic device of claim 1, wherein the power supply area comprises a plurality of first rows, and wherein load pins of the plurality of first rows are in a same arrangement;

the power supply region includes at least 3 rows and at least 6 columns of load pins, and the at least one column of output capacitances includes at least 2 rows and at least 2 columns of output capacitances.

18. The electronic device of claim 1, wherein the load is a processor chip comprising CPU, GPU, TPU or NPU.

19. A power supply device for supplying power to a load on a system board, the system board comprising a first face and a second face disposed opposite in a first direction;

At least one column of output capacitors is connected between the power supply device and the load, and each column of output capacitors is arranged on the second surface of the system board along the third direction;

20. A load, comprising:

21. The load of claim 20, wherein at least two rows of the first arrangement and at least two rows of the second arrangement are included in the power supply area, and the first arrangement and the second arrangement are alternately arranged.

22. The load of claim 20, wherein each of the load pin groups of the first arrangement row contains the same number of the load pins.

23. An electronic device comprising the load of any one of claims 20 to 22, further comprising a power supply device, at least one array of output capacitors, and a system board, the system board comprising a first side and a second side disposed opposite along a first direction, the load being disposed on the first side of the system board, the power supply device and the output capacitors being disposed on the second side of the system board.