CN118431104B - Table control method and device and wafer slotting equipment - Google Patents
Table control method and device and wafer slotting equipment Download PDFInfo
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- CN118431104B CN118431104B CN202410896124.6A CN202410896124A CN118431104B CN 118431104 B CN118431104 B CN 118431104B CN 202410896124 A CN202410896124 A CN 202410896124A CN 118431104 B CN118431104 B CN 118431104B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- Computer Hardware Design (AREA)
- Plasma & Fusion (AREA)
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- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Abstract
The disclosure relates to the technical field of integrated circuits, and in particular relates to a table control method and device and wafer slotting equipment. The table control method comprises the following steps: identifying a wafer, acquiring target slotting pattern information of the wafer, and generating an initial cutting path based on the target slotting pattern information, wherein the initial cutting path comprises a plurality of mutually parallel cutting paths, and the directions of any two adjacent cutting paths are opposite; acquiring direction information of each cutting channel and a starting point coordinate value and an ending point coordinate value in the extending direction of the cutting channel; determining a numerical relationship between the coordinate value of each cutting lane and the coordinate value of an adjacent cutting lane based on the direction information, the start point coordinate value and the end point coordinate value; correcting a starting point coordinate value or an ending point coordinate value of each cutting path based on the numerical relation; generating a control command based on the initial cutting path, the corrected starting point coordinate value and the corrected end point coordinate value of each cutting path, and controlling the movement of the table according to the control command.
Description
Technical Field
The disclosure relates to the technical field of integrated circuits, and in particular relates to a table control method and device and wafer slotting equipment.
Background
Grooving a wafer is an important process step in the semiconductor manufacturing process. The grooving process is mainly used to form specific channels or structures on a wafer, so that chips on the wafer can be separated by using knife wheel cutting in the subsequent process.
The wafer grooving equipment is key equipment for realizing the process, and the main working flow of the wafer grooving equipment comprises the steps of wafer loading, coating, alignment correction, grooving processing, cleaning, inspection and the like. Specifically, firstly, the wafer slotting device can automatically load a wafer to be processed on a workbench disc, and the image acquisition of the wafer is carried out through a camera device, and the upper computer carries out steps such as identification and calculation. The wafer grooving apparatus then uses a grinding wheel or laser beam that rotates at high speed to grooving the wafer. After slotting is completed, the wafer slotting equipment can also be automatically cleaned and checked to ensure that the machining result meets the requirements.
In the technique of cutting slots, multiple table movements may be involved. Therefore, in order to improve the processing efficiency of the semiconductor, a technical solution capable of improving the moving efficiency of the platen is needed.
Disclosure of Invention
Accordingly, it is necessary to provide a platen control method and apparatus, and a wafer slotting device, which can improve platen moving efficiency.
In one aspect, a method for controlling a platen for laser grooving of a wafer is provided, where the platen is used to carry the wafer, and the method for controlling the platen includes:
identifying a wafer, acquiring target slotting pattern information of the wafer, and generating an initial cutting path based on the target slotting pattern information, wherein the initial cutting path comprises a plurality of mutually parallel cutting paths, and the cutting directions of any two adjacent cutting paths are opposite;
acquiring the direction information of each cutting channel and the starting point coordinate value and the end point coordinate value of the extending direction of each cutting channel;
Determining a numerical relationship between the coordinate value of each cutting lane and the coordinate value of an adjacent cutting lane based on the direction information, the start point coordinate value and the end point coordinate value;
Correcting a starting point coordinate value or an ending point coordinate value of each cutting channel based on the numerical relation;
Generating a control instruction based on the initial cutting path, the corrected starting point coordinate value and the corrected end point coordinate value of each cutting path, and controlling the table to move according to the control instruction.
In one embodiment, the direction information includes a first direction, and the correcting the start coordinate value or the end coordinate value of each of the dicing streets based on the numerical relation includes:
And correcting the end point coordinate value of the current cutting channel to be the start point coordinate value of the next cutting channel under the condition that the direction information of the current cutting channel is the first direction and the end point coordinate value of the current cutting channel is smaller than the start point coordinate value of the next cutting channel.
In one embodiment, the correcting the start coordinate value or the end coordinate value of each cutting track based on the numerical relation includes:
When the direction information of the current cutting channel is the first direction and the terminal point coordinate value of the current cutting channel is larger than the terminal point coordinate value of the last cutting channel, if the terminal point coordinate value of the current cutting channel is larger than the terminal point coordinate value of the last cutting channel, correcting the terminal point coordinate value of the current cutting channel to the terminal point coordinate value of the last cutting channel so as to prolong the current cutting channel; if the starting point coordinate value of the current cutting channel is smaller than the ending point coordinate value of the last cutting channel, the starting point coordinate value and the ending point coordinate value of the current cutting channel are unchanged.
In one embodiment, the direction information includes a second direction, and the correcting the start coordinate value or the end coordinate value of each of the dicing streets based on the numerical relation includes:
And correcting the end point coordinate value of the current cutting channel to be the start point coordinate value of the next cutting channel under the condition that the direction information of the current cutting channel is in the second direction and the end point coordinate value of the current cutting channel is larger than the start point coordinate value of the next cutting channel so as to prolong the current cutting channel.
In one embodiment, the correcting the start coordinate value or the end coordinate value of each cutting track based on the numerical relation includes:
When the direction information of the current cutting lane is the second direction and the terminal point coordinate value of the current cutting lane is smaller than the terminal point coordinate value of the next cutting lane, if the terminal point coordinate value of the current cutting lane is smaller than the terminal point coordinate value of the last cutting lane, correcting the terminal point coordinate value of the current cutting lane to the terminal point coordinate value of the last cutting lane so as to prolong the current cutting lane; if the starting point coordinate value of the current cutting channel is larger than the ending point coordinate value of the last cutting channel, the starting point coordinate value and the ending point coordinate value of the current cutting channel are unchanged.
In one embodiment, the correcting the start coordinate value or the end coordinate value of each cutting track based on the numerical relation includes:
And correcting the coordinate value of the starting point of the last cutting track to the coordinate value of the ending point of the last cutting track.
In one embodiment, the control system of the stage includes an X-axis and a Y-axis perpendicular to each other, the generating a control command based on the initial scribe line path, the corrected start coordinate value and the corrected end coordinate value of each scribe line, and controlling the stage to move according to the control command includes:
and controlling the X axis of the control system to move along the extending direction of the cutting channel, and controlling the Y axis of the control system to move when the table passes through the end point before the cutting channel is corrected for the cutting channel with the end point coordinate value corrected.
In one aspect, there is provided a table tray control apparatus including:
The identifying device is used for identifying a wafer, acquiring target slotting pattern information of the wafer and generating an initial cutting path based on the target slotting pattern information, wherein the initial cutting path comprises a plurality of mutually parallel cutting paths, and the directions of any two adjacent cutting paths are opposite;
the acquisition device is used for acquiring the direction information of each cutting channel and the starting point coordinate value and the end point coordinate value in the extending direction of the cutting channel;
determining means for determining a numerical relationship between the coordinate value of each of the dicing lanes and the coordinate value of an adjacent dicing lane based on the direction information, the start point coordinate value, and the end point coordinate value;
Correction means for correcting a start point coordinate value or an end point coordinate value of each of the dicing lanes based on the numerical relation;
And the moving device is used for generating a control instruction based on the initial cutting path, the corrected starting point coordinate value and the corrected end point coordinate value of each cutting path and controlling the table to move according to the control instruction.
In one aspect, there is provided a wafer slotting apparatus comprising:
the tray is used for placing the wafer;
The control system is connected with the table plate;
The upper computer is connected with the control system, and the upper computer controls the control system according to the table disc control method in any embodiment.
In one embodiment, the wafer slotting device comprises:
the grooving device is positioned above the table plate and connected with the upper computer, and is used for carrying out grooving process on the wafer;
The camera device is located above the table plate and connected with the upper computer, and the camera device is used for photographing the wafer.
According to the table control method and device and the wafer grooving equipment, the numerical relation between the coordinate value of the current cutting channel and the coordinate value of the adjacent cutting channel is calculated, so that the starting point coordinate value or the end point coordinate value of each cutting channel is corrected. By correcting the starting point coordinate value or the end point coordinate value of the cutting channel, when the control system moves the table disc along the cutting channel direction, the mechanical shaft of the control system can have one acceleration action and one deceleration action, the acceleration and deceleration time of the movement of the table disc is reduced, the acceleration and deceleration start-stop actions of the control system are reduced, the slotting process efficiency is improved, and the service life of the control system is prolonged.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments or the conventional techniques of the present disclosure, the drawings required for the descriptions of the embodiments or the conventional techniques will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present disclosure, and other drawings may be obtained according to the drawings without inventive effort to those of ordinary skill in the art.
FIGS. 1 to 5 are views showing a table moving method in the related art;
FIG. 6 is a schematic diagram of a wafer grooving apparatus provided in one embodiment;
FIG. 7 is a schematic diagram of a connection relationship of a wafer slotting device according to an embodiment;
FIG. 8 is a flowchart of a method for controlling a platen according to one embodiment;
FIG. 9 is a schematic diagram of a control system provided in one embodiment;
FIG. 10 is a flowchart of a method for controlling a platen according to another embodiment;
FIGS. 11-16 are schematic diagrams of control systems provided in various embodiments;
fig. 17 is a schematic view of a table control device according to an embodiment.
Reference numerals illustrate: wafer grooving equipment-100; a tray-110; a control system-120; the upper computer-130; grooving device-140; an image pickup device-150; a light source controller-160; a switch-170; wafer-200.
For a better description and illustration of embodiments and/or examples of those inventions disclosed herein, reference may be made to one or more of the accompanying drawings. Additional details or examples used to describe the drawings should not be construed as limiting the scope of the disclosed invention, the presently described embodiments and/or examples, and any of the presently understood modes of carrying out the invention.
Detailed Description
In order that the disclosure may be understood, a more complete description of the disclosure will be rendered by reference to the appended drawings. Preferred embodiments of the present disclosure are shown in the drawings. This disclosure may, however, be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used in the description of the disclosure herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure.
In various embodiments, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and include, for example, either permanently connected, removably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in the embodiments may be understood by those of ordinary skill in the art according to the specific circumstances.
It will be understood that when an element or layer is referred to as being "on," "adjacent to," "connected to" another element or layer, it can be directly on, adjacent to, connected to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly adjacent to," "directly connected to" another element or layer, there are no intervening elements or layers present. It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present embodiment.
Spatially relative terms, such as "under", "below", "beneath", "under", "above", "over" and the like, may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use and operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "under" or "beneath" other elements would then be oriented "on" the other elements or features. Thus, the exemplary terms "below" and "under" may include both an upper and a lower orientation. Furthermore, the device may also include an additional orientation (e.g., rotated 90 degrees or other orientations) and the spatial descriptors used herein interpreted accordingly.
As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Also, as used herein, the term "and/or" includes any and all combinations of the associated listed items.
Embodiments of the embodiments are described herein with reference to schematic illustrations that are idealized embodiments of the present specification, such that variations of the illustrated shapes due to, for example, manufacturing techniques are contemplated. Thus, embodiments of the present embodiments should not be limited to the particular shapes of regions illustrated herein, but rather include deviations in shapes that result, for example, from manufacturing techniques. The regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a device in relation to a position and are not intended to limit the scope of the present embodiments.
As described in the background, in the technique of cutting the slot, a plurality of stage movements are involved. Referring to fig. 1 and 2, the slotting direction of all cutting lanes can be kept consistent when the table moves. Alternatively, referring to fig. 3 and 4, the grooving directions of the respective cutting lanes may be inconsistent. At this time, the slotting directions of the adjacent cutting lanes can be opposite, and the wafer carried by the table disc reciprocates in the slotting process. In the related art, the number of movements of the table is often reduced by adopting a manner that the slotting directions of the cutting channels on the wafer are inconsistent, so as to improve the cutting efficiency.
However, in the related art, when the stage moves, it is often necessary to provide a plurality of acceleration and deceleration in the control system of the stage. Referring to fig. 5, for example, the control system may include an X-axis mechanical axis and a Y-axis mechanical axis perpendicular to each other, and the control system sets an X-axis acceleration at a start position P1 of the current cutting lane, sets an X-axis deceleration at a movement toward an end position P2 of the current cutting lane, and finally stops at the end position P2. When the current cutting path is cut and the next cutting path needs to be grooved, the X axis and Y axis acceleration are set to be accelerated and decelerated together to move the table disc to the target position P3, and the process is repeated. In the related art, the control system involves multiple acceleration and deceleration, so that the acceleration and deceleration time of the movement of the table is increased, the acceleration and deceleration start-stop actions of the control system are also increased, the slotting process efficiency is reduced, and the service life of the control system is further shortened.
Based on this, referring to fig. 6 and 7, in one embodiment, a wafer slotting apparatus 100 is provided. The wafer slotting device 100 includes: a platen 110, a control system 120, and an upper computer 130.
The platen 110 is used to hold a wafer 200. The platen 110 may have a flat upper surface and the wafer 200 may be placed on the upper surface of the platen 110. As an example, the wafer slotting device 100 may include a robot that places the wafer 200 on the upper surface of the platen 110. Of course, a wafer holder may be provided on the platen 110 to prevent movement of the wafer 200. For example, the wafer holding device may include a vacuum suction device or the like.
The wafer slotting device 100 may have a slotting means 140 to make the wafer 200 produce a plurality of saw lanes. The slotting device 140 may be located above the platen 110. The slotting device 140 is used to slotting the wafer 200, for example, the slotting device 140 may slotting the surface of the wafer 200 along dicing lanes. As an example, the slotting device 140 may comprise a laser or the like. As the platen 110 moves, the laser emits laser light, thereby performing a grooving process on the wafer 200.
The control system 120 may include a system that controls the movement of the table tray 110. As an example, the control system 120 may include a plurality of moving mechanical axes. In addition, the control system 120 may also include a control card or programmable logic controller (Programmable Logic Controller, PLC), or the like. For example, the control system 120 may include an X-axis and a Y-axis that are perpendicular to each other. Of course, the control system 120 may also include a TH axis. It will be appreciated that during the grooving process, the control system 120 controls the movement of the plurality of mechanical axes such that the platen 110 carries the wafer 200 for common movement. At this time, the slotting device 140 may be fixed such that the slotting device 140 slots along the dicing streets at the surface of the wafer 200.
The wafer slotting device 100 may be provided with a camera 150. The image pickup device 150 is located above the platen 110. The camera 150 is used to photograph the wafer 200, thereby identifying the wafer 200. For example, the image pickup device 150 may include a camera or the like.
In addition, the wafer slotting device 100 may further comprise a light source controller 160 and a switch 170. The light source controller 160 may assist the image capture device 150 in image capture recognition.
The upper computer 130 may include a computer that issues control instructions. Referring to fig. 7, the upper computer 130 is connected to the control system 120, the slotting device 140, the camera device 150 and the switch 170. The control system 120 moves according to the control command sent by the host computer 130. The slotting device 140 is connected to the serial port of the upper computer 130, and emits a laser beam according to the set frequency and energy according to the control command sent by the upper computer 130. The camera device 150 is connected to a network card (e.g., POE (Power Over Ethernet) network card) of the upper computer 130, the camera device 150 obtains an image of the wafer 200 and sends the image to the upper computer 130, and the upper computer 130 can perform image processing and analysis to obtain target slotting pattern information and generate an initial cutting path based on the target slotting pattern information. The target grooving pattern information may include grooving information such as grooving position, grooving shape, grooving size, or the like. The light source controller 160 communicates with the upper computer 130 through the switch 170, thereby setting lighting timing and brightness. The switch 170 is connected to a host port of the host computer 130.
Illustratively, the upper computer 130 may include a personal computer, a notebook computer, a smart phone, or a tablet computer. The upper computer 130 may execute the tray control method formed by the embodiments and the combinations thereof in the present specification, or the upper computer 130 calculates the initial tray movement path according to the image obtained by the image capturing device 150 by using the related technology, and optimizes the initial tray movement path by using the tray control method formed by the embodiments and the combinations thereof in the present specification, so as to form a better tray path. The wafer slotting device 100 provided in this embodiment can reduce acceleration and deceleration time of the movement of the table 110, and reduce acceleration and deceleration start-stop actions of the control system 120, thereby improving slotting process efficiency and prolonging service life of the control system 120.
Referring specifically to fig. 8 to 10, in one embodiment, a platen control method for laser grooving of a wafer is provided and applied to the host computer 130. The table control method comprises the following steps:
Step S2: identifying a wafer, acquiring target slotting pattern information of the wafer, and generating an initial cutting path based on the target slotting pattern information, wherein the initial cutting path comprises a plurality of mutually parallel cutting paths, and the cutting directions of any two adjacent cutting paths are opposite.
Step S4: and acquiring the direction information of each cutting channel and the starting point coordinate value and the end point coordinate value in the extending direction of the cutting channel based on the initial cutting channel path.
Step S6: based on the direction information, the start point coordinate value and the end point coordinate value, a numerical relation between the coordinate value of each cutting lane and the coordinate value of the adjacent cutting lane is determined.
Step S8: and correcting the starting point coordinate value or the end point coordinate value of each cutting path based on the numerical relation.
Step S10: and generating a control command based on the corrected start point coordinate value or end point coordinate value of each cutting lane, and controlling the table 110 to move according to the control command.
In step S2, the camera 150 may be matched with the host computer 130 to identify the wafer 200 and obtain the target grooving pattern information of the wafer 200. For example, the camera device 150 photographs the wafer 200, and the upper computer 130 may perform image processing and analysis on the obtained photograph and obtain the target slotting pattern information. After the target slotting pattern information is obtained, an initial kerf path can be generated. The initial scribe line path includes a plurality of scribe lines parallel to each other, and each scribe line may have corresponding scribe direction information, i.e., a first direction or a second direction. Specifically, in the initial scribe line path, the direction information of the scribe line represents the moving direction information of the table 110. For example, when the direction information of the current scribe line is the first direction, it indicates that the platen 110 moves along the first direction with the wafer 200 to realize the wafer scribe.
In this embodiment, adjacent cutting tracks have opposite direction information, so that the moving distance of the table 110 can be reduced, and the slotting efficiency can be improved.
In step S4, each scribe line has an extending direction. In the extending direction, each scribe line has a start coordinate value and an end coordinate value. It can be understood that the starting point coordinate value of each scribe line corresponds to the starting point position of the table 110 during the laser grooving process, and the ending point coordinate value of each scribe line corresponds to the ending point position of the table 110 during the laser grooving process.
In step S6, each scribe line is regarded as a current scribe line, and a numerical relationship between the coordinate values of the scribe lines and the coordinate values of the adjacent scribe lines is determined. For example, the current scribe line may have a lower scribe line and an upper scribe line on both sides. The next cutting lane may be the cutting lane that needs to be grooved after the grooving process is performed on the current cutting lane. The last scribe line may be a scribe line that has been subjected to grooving before the grooving process is performed on the current scribe line.
After determining the direction information of the current cutting lane, the numerical relationship between the coordinate values of the current cutting lane and the coordinate values of the adjacent cutting lanes can be compared. As an example, the numerical relationship may be a magnitude relationship between coordinate values or a positional relationship of coordinate values on coordinate axes. For example, when comparing the numerical relationships, the magnitude relationship between the end coordinate value of the current track and the start coordinate value of the next track can be compared. Or when comparing the numerical value relationship, the magnitude relationship between the current start point coordinate value of the cutting track and the last end point coordinate value of the cutting track can be also compared. For example, when comparing the numerical relationships, a difference between the end coordinate value of the current scribe line and the start coordinate value of the next scribe line may be calculated. If the difference is greater than zero, it indicates that the end coordinate value of the current cutting track is greater than the start coordinate value of the next cutting track. The embodiment is not limited to a specific way of comparing the numerical relationships.
In step S8, the start point coordinate value or the end point coordinate value of each scribe line is corrected. For example, after obtaining the numerical relationship of the coordinate value of the current dicing lane and the coordinate value of the adjacent dicing lane (the previous dicing lane and/or the next dicing lane), the start point coordinate value of the current dicing lane may be set as the end point coordinate value of the previous dicing lane, or the end point coordinate value of the current dicing lane may also be set as the start point coordinate value of the next dicing lane. Therefore, the coordinate value of the starting point of the current cutting channel is consistent with the coordinate value of the ending point of the last cutting channel, or the coordinate value of the ending point of the current cutting channel is consistent with the coordinate value of the starting point of the next cutting channel.
In step S10, the host computer 130 generates a control command based on the initial scribe line path, the corrected start point coordinate value or end point coordinate value of each scribe line, and transmits the control command to the control system 120. The control system 120 moves the table tray 110 according to the received control command. Meanwhile, the slotting device 140 performs slotting processing on the wafer 200.
In this embodiment, by calculating the numerical relationship between the coordinate values of the current cutting lane and the coordinate values of the adjacent cutting lanes, the starting point coordinate values or the ending point coordinate values of the current cutting lane are corrected, and when the control system 120 moves the table 110 along the extending direction of the cutting lanes, the mechanical axis (for example, the X axis) of the control system 120 moving along the extending direction of the cutting lanes may have one acceleration action and one deceleration action.
In addition, in the present embodiment, operations such as straightening and positioning the wafer 200 may be performed by the image capturing device 150, so as to obtain more accurate coordinate values.
Referring to fig. 10, a specific platen control method is described below by various embodiments and combinations thereof.
In one embodiment, referring to fig. 11, the direction information of the current scribe line is the first direction, and step S8 includes:
step S80: and under the condition that the direction information of the current cutting channel is in the first direction and the terminal coordinate value of the current cutting channel is smaller than the starting point coordinate value of the next cutting channel, correcting the terminal coordinate value of the current cutting channel to be the starting point coordinate value of the next cutting channel so as to prolong the current cutting channel.
And under the condition that the coordinate value of the end point of the current cutting channel is smaller than the coordinate value of the start point of the next cutting channel, the length of the current cutting channel is shorter than the length of the next cutting channel. The end point coordinate value of the current cutting channel is corrected to the start point coordinate value of the next cutting channel, so that the end point coordinate value of the current cutting channel is consistent with the start point coordinate value of the next cutting channel. At this time, the current dicing lane is lengthened. For example, the current cutting lane obtains a first extension that is located between the original end point and the modified end point of the current cutting lane.
Illustratively, as the control system 120 moves, the upper computer 130 may control the X-axis drive table 110 to accelerate in the X-direction (i.e., the extending direction of the current cutting lane) when moving to the starting point of the current cutting lane, and to maintain a constant velocity when moving to the original end point, and eventually decelerate when approaching the corrected end point (i.e., when the X-axis moves into the first extension segment). In this process, when the stage 110 passes the end point before correction, the Y-axis drive stage 110 is controlled to move. For example, for a scribe line whose end point coordinate value is corrected, when the X-axis driving stage 110 moves to the end point before the scribe line correction (i.e., the original end point), the Y-axis may drive the stage 110 in a linked manner to accelerate. As the platen 110 approaches the corrected end point, the Y-axis may slow down until the Y-axis speed drops to zero. Thus, the X-axis and Y-axis can move together the console tray 110 from the position where the current dicing lane is located to the position where the starting point of the next dicing lane is located. Thereafter, since the table 110 has reached the start of the next dicing lane at this time, the grooving process can be continued.
In one embodiment, step S8 further comprises:
Step S82: and under the condition that the direction information of the current cutting channel is in the first direction and the coordinate value of the end point of the current cutting channel is larger than the coordinate value of the start point of the next cutting channel, if the coordinate value of the start point of the current cutting channel is larger than the coordinate value of the end point of the last cutting channel, correcting the coordinate value of the start point of the current cutting channel to the coordinate value of the end point of the last cutting channel so as to prolong the current cutting channel. If the starting point coordinate value of the current cutting channel is smaller than the ending point coordinate value of the last cutting channel, the starting point coordinate value and the ending point coordinate value of the current cutting channel are unchanged.
In one example, referring to fig. 12, if the start coordinate value of the current track is greater than the end coordinate value of the last track, it indicates that the length of the last track is greater than the length of the current track. At this time, the coordinate value of the start point of the current cutting lane is corrected to the coordinate value of the end point of the last cutting lane, so that the coordinate value of the start point of the current cutting lane is consistent with the coordinate value of the end point of the last cutting lane. At this time, the current dicing lane is lengthened. For example, the current cut obtains a second extension segment that is located between the original start point and the modified start point of the current cut. Illustratively, after the grooving process for the last scribe line is completed, the platen 110 is moved to the corrected start point by the acceleration and deceleration of the Y axis. This causes the table 110 to move to the current cutting lane and perform the grooving process. By correcting the coordinate values, the table is accelerated and decelerated only once in the processing of the current cutting path, and the acceleration and deceleration times and time of the table 110 are reduced, so that the slotting efficiency is improved, and the service life of the control system 120 is prolonged.
In another example, referring to fig. 13, when the direction information of the current scribe line is the first direction and the end point coordinate value of the current scribe line is greater than the start point coordinate value of the next scribe line, and the start point coordinate value of the current scribe line is less than the end point coordinate value of the last scribe line, it means that the length of the current scribe line is greater than the next scribe line, and the length of the current scribe line is greater than the last scribe line. At this time, the start point coordinate value and the end point coordinate value of the current cutting track are not changed, or the correction amplitude of the start point coordinate value and the end point coordinate value of the current cutting track is zero.
In one embodiment, the direction information includes a second direction, and step S8 includes:
Step S84: and under the condition that the direction information of the current cutting channel is in the second direction and the coordinate value of the end point of the current cutting channel is larger than the coordinate value of the start point of the next cutting channel, correcting the coordinate value of the end point of the current cutting channel to be the coordinate value of the start point of the next cutting channel.
Referring to fig. 14, in the case that the direction information of the current scribe line is the second direction and the end coordinate value of the current scribe line is greater than the start coordinate value of the next scribe line, the length of the current scribe line is shorter than the length of the next scribe line. At this time, the end point coordinate value of the current cutting lane is corrected to the start point coordinate value of the next cutting lane, so as to prolong the current cutting lane. For example, the current scribe line obtains the first extension so that the end coordinate value of the current scribe line coincides with the start coordinate value of the next scribe line.
In one embodiment, step S8 includes:
Step S86: and under the condition that the direction information of the current cutting channel is in the second direction and the coordinate value of the end point of the current cutting channel is smaller than the coordinate value of the start point of the next cutting channel, if the coordinate value of the start point of the current cutting channel is smaller than the coordinate value of the end point of the last cutting channel, correcting the coordinate value of the start point of the current cutting channel to the coordinate value of the end point of the last cutting channel so as to prolong the current cutting channel. If the starting point coordinate value of the current cutting channel is larger than the ending point coordinate value of the last cutting channel, the starting point coordinate value and the ending point coordinate value of the current cutting channel are unchanged.
In an example, referring to fig. 15, when the direction information of the current scribe line is the second direction, the end point coordinate value of the current scribe line is smaller than the start point coordinate value of the next scribe line, and the start point coordinate value of the current scribe line is also smaller than the end point coordinate value of the last scribe line, the start point coordinate value of the current scribe line is corrected to the end point coordinate value of the last scribe line to extend the current scribe line. For example, the current scribe line obtains the second extension so that the coordinate value of the start point of the current scribe line coincides with the coordinate value of the end point of the last scribe line.
In another example, referring to fig. 16, when the direction information of the current scribe line is the second direction, the end point coordinate value of the current scribe line is smaller than the start point coordinate value of the next scribe line, and the start point coordinate value of the current scribe line is larger than the end point coordinate value of the previous scribe line, the start point coordinate value and the end point coordinate value of the current scribe line are not changed.
It is understood that, in the case that the direction information of the current cutting lane is the second direction, the moving process of the X-axis and the Y-axis of the control system 120 may correspond to the moving process of the control system 120 in the case that the direction information of the current cutting lane is the first direction.
In the embodiments and the embodiments obtained by combining the above embodiments, by determining the direction information of the current cutting lane, the coordinate values of the current cutting lane, and the coordinate values of the adjacent cutting lanes, it may be determined whether the extension section can be set at the start point coordinate or the end point coordinate of the current cutting lane so that the start point coordinate value or the end point coordinate value of the current cutting lane is consistent with the end point coordinate value or the start point coordinate value of the adjacent cutting lane. If an extension section can be set at the current cutting path, the control system 120 can reduce the start and stop actions of acceleration and deceleration, and the acceleration and deceleration time of the movement of the table 110 can be reduced in the grooving process, so that the grooving efficiency is improved, and the service life of the control system 120 is prolonged.
In one example, step S8 includes:
step S88: and correcting the coordinate value of the starting point of the last cutting track to the coordinate value of the ending point of the last cutting track.
It is understood that the end point coordinate value of the last scribe line does not need to be corrected. At this time, regardless of the direction of the last scribe line, the start/stop actions of the control system 120 can be reduced by correcting the start coordinate value of the last scribe line to the end coordinate value of the last scribe line.
It should be understood that the term "the stage moves to the start point or the end point" in the present application means that the point on the stage corresponding to the start slotting cut point of the wafer moves to the start point or the end point.
In one embodiment, as shown in fig. 17, there is provided a stage control apparatus including: identification means, acquisition means, determination means, correction means, and movement means, wherein:
the identifying device is used for identifying the wafer, acquiring target slotting pattern information of the wafer, and generating an initial cutting path based on the target slotting pattern information, wherein the initial cutting path comprises a plurality of mutually parallel cutting paths, and the cutting directions of any two adjacent cutting paths are opposite.
The acquisition device is used for acquiring the direction information of each cutting channel and the starting point coordinate value and the end point coordinate value in the extending direction of the cutting channel;
The determining device is used for determining the numerical relation between the coordinate value of each current cutting channel and the coordinate value of the adjacent cutting channel based on the direction information, the starting point coordinate value and the end point coordinate value;
correction means for correcting a start point coordinate value or an end point coordinate value of each of the dicing lanes based on the numerical relation;
and a moving means for generating a control command based on the initial track path, the corrected start coordinate value and end coordinate value of each track, and controlling the table 110 according to the control command.
In addition, the correction device may be further used to perform the method related to one or more of the steps S80 to 88.
For specific limitations of the table control device, reference may be made to the above limitations of the table control method, and no further description is given here. The above-described respective modules in the stage control device may be implemented in whole or in part by software, hardware, and a combination thereof. The above modules may be embedded in hardware or may be independent of a processor in the computer device, or may be stored in software in a memory in the computer device, so that the processor may call and execute operations corresponding to the above modules.
The technical features of the above embodiments may be arbitrarily combined, and for brevity, all of the possible combinations of the technical features of the above embodiments are not described, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples merely represent a few embodiments of the present disclosure, which are described in more detail and are not to be construed as limiting the scope of the claims. It should be noted that variations and modifications can be made by those skilled in the art without departing from the spirit of the disclosure, which are within the scope of the disclosure. Accordingly, the scope of protection of the present disclosure should be determined by the following claims.
Claims (10)
1. A platen control method for laser grooving of a wafer, the platen being for carrying the wafer, the platen control method comprising:
identifying a wafer, acquiring target slotting pattern information of the wafer, and generating an initial cutting path based on the target slotting pattern information, wherein the initial cutting path comprises a plurality of mutually parallel cutting paths, and the cutting directions of any two adjacent cutting paths are opposite;
acquiring the direction information of each cutting channel and the starting point coordinate value and the end point coordinate value of the extending direction of each cutting channel;
Determining a numerical relationship between the coordinate value of each cutting lane and the coordinate value of an adjacent cutting lane based on the direction information, the start point coordinate value and the end point coordinate value;
Correcting a starting point coordinate value or an ending point coordinate value of each cutting channel based on the numerical relation;
Generating a control instruction based on the initial cutting path, the corrected starting point coordinate value and the corrected end point coordinate value of each cutting path, and controlling the table to move according to the control instruction;
the direction information includes a first direction and a second direction; the correcting the starting point coordinate value or the end point coordinate value of each cutting path based on the numerical relation comprises the following steps:
when the direction information of the current cutting channel is the first direction and the terminal coordinate value of the current cutting channel is smaller than the starting coordinate value of the next cutting channel, correcting the terminal coordinate value of the current cutting channel to be the starting coordinate value of the next cutting channel so as to prolong the current cutting channel;
When the direction information of the current cutting channel is the first direction and the terminal point coordinate value of the current cutting channel is larger than the terminal point coordinate value of the next cutting channel, if the terminal point coordinate value of the current cutting channel is larger than the terminal point coordinate value of the last cutting channel, correcting the terminal point coordinate value of the current cutting channel to the terminal point coordinate value of the last cutting channel so as to prolong the current cutting channel; if the starting point coordinate value of the current cutting channel is smaller than the ending point coordinate value of the last cutting channel, the starting point coordinate value and the ending point coordinate value of the current cutting channel are unchanged;
When the direction information of the current cutting channel is the second direction and the terminal coordinate value of the current cutting channel is larger than the starting coordinate value of the next cutting channel, correcting the terminal coordinate value of the current cutting channel to be the starting coordinate value of the next cutting channel so as to prolong the current cutting channel;
When the direction information of the current cutting channel is in the second direction and the terminal point coordinate value of the current cutting channel is smaller than the terminal point coordinate value of the next cutting channel, if the terminal point coordinate value of the current cutting channel is smaller than the terminal point coordinate value of the last cutting channel, correcting the terminal point coordinate value of the current cutting channel to the terminal point coordinate value of the last cutting channel so as to prolong the current cutting channel; if the starting point coordinate value of the current cutting channel is larger than the ending point coordinate value of the last cutting channel, the starting point coordinate value and the ending point coordinate value of the current cutting channel are unchanged;
The control system of the table comprises an X axis and a Y axis which are perpendicular to each other, the control instruction is generated based on the initial cutting path, the corrected starting point coordinate value and the corrected end point coordinate value of each cutting path, and the table is controlled to move according to the control instruction, and the control system comprises:
and controlling the X axis of the control system to move along the extending direction of the cutting channel, and controlling the Y axis of the control system to move when the table passes through the end point before the cutting channel is corrected for the cutting channel with the end point coordinate value corrected.
2. The table control method according to claim 1, wherein in a case where the direction information of a current cut is a first direction and an end point coordinate value of the current cut is smaller than a start point coordinate value of a next cut, correcting the end point coordinate value of the current cut to the start point coordinate value of the next cut so as to lengthen the current cut, so that the current cut obtains a first extension section between the end point coordinate value before correction and the end point coordinate value after correction of the current cut;
the controlling the X-axis of the control system to move along the extending direction of the cutting path, and controlling the Y-axis of the control system to move when the table passes the end point before the cutting path is corrected for the cutting path with the end point coordinate value corrected, comprising:
And controlling the X axis to keep constant speed when moving to the end point coordinate value before correction, and decelerating in the first extension section.
3. The stage control method according to claim 2, wherein the controlling the X-axis to maintain a constant speed while moving to the end point coordinate value before correction, decelerating in the first extension section, comprises:
and when the table is subjected to the end point coordinate value before correction, controlling the Y axis to drive the table to move.
4. The stage control method according to claim 3, wherein the Y-axis is controlled to decelerate until the velocity of the Y-axis drops to zero when the stage approaches the corrected end point coordinate value.
5. The method of claim 1, wherein correcting the start coordinate value or the end coordinate value of each of the dicing streets based on the numerical relationship comprises:
And correcting the coordinate value of the starting point of the last cutting track to the coordinate value of the ending point of the last cutting track.
6. A table control apparatus, characterized in that the table control apparatus uses the table control method according to any one of claims 1 to 5, the table control apparatus comprising:
The identifying device is used for identifying a wafer, acquiring target slotting pattern information of the wafer and generating an initial cutting path based on the target slotting pattern information, wherein the initial cutting path comprises a plurality of mutually parallel cutting paths, and the cutting directions of any two adjacent cutting paths are opposite;
the acquisition device is used for acquiring the direction information of each cutting channel and the starting point coordinate value and the end point coordinate value in the extending direction of the cutting channel;
determining means for determining a numerical relationship between the coordinate value of each of the dicing lanes and the coordinate value of an adjacent dicing lane based on the direction information, the start point coordinate value, and the end point coordinate value;
Correction means for correcting a start point coordinate value or an end point coordinate value of each of the dicing lanes based on the numerical relation;
And the moving device is used for generating a control instruction based on the initial cutting path, the corrected starting point coordinate value and the corrected end point coordinate value of each cutting path and controlling the table to move according to the control instruction.
7. A wafer grooving apparatus, comprising:
the tray is used for placing the wafer;
The control system is connected with the table plate;
the upper computer is connected with the control system, and the upper computer controls the control system according to the table disc control method as set forth in any one of claims 1-5.
8. The wafer slotting device of claim 7, wherein the wafer slotting device comprises:
The slotting device is positioned above the table plate and connected with the upper computer, and is used for slotting the wafer;
The camera device is located above the table plate and connected with the upper computer, and the camera device is used for photographing the wafer.
9. The wafer slotting device of claim 8, wherein the wafer slotting device comprises:
and the light source controller is used for assisting the image pickup device to carry out image acquisition and identification.
10. The wafer slotting device of claim 9, wherein the wafer slotting device comprises:
and the switch is connected with the upper computer, and the light source controller is communicated with the upper computer through the switch.
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| CN115799174A (en) * | 2021-09-09 | 2023-03-14 | 重庆康佳光电技术研究院有限公司 | Method and apparatus for forming scribe line, and computer-readable storage medium |
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| US6676878B2 (en) * | 2001-01-31 | 2004-01-13 | Electro Scientific Industries, Inc. | Laser segmented cutting |
| JP6607639B2 (en) * | 2015-12-24 | 2019-11-20 | 株式会社ディスコ | Wafer processing method |
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| CN115799174A (en) * | 2021-09-09 | 2023-03-14 | 重庆康佳光电技术研究院有限公司 | Method and apparatus for forming scribe line, and computer-readable storage medium |
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