CN118201211A - New stepped transparent circuit board - Google Patents
New stepped transparent circuit board Download PDFInfo
- Publication number
- CN118201211A CN118201211A CN202410591792.8A CN202410591792A CN118201211A CN 118201211 A CN118201211 A CN 118201211A CN 202410591792 A CN202410591792 A CN 202410591792A CN 118201211 A CN118201211 A CN 118201211A
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- electrode
- bridge
- bridge electrode
- grating
- substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Insulated Conductors (AREA)
Abstract
The invention provides a novel stepped transparent circuit board, which comprises: the device comprises a substrate, a base electrode, a grating, a primary bridge electrode, a bridge-type leading electrode, a secondary bridge electrode, a double-line bridge electrode and a tertiary bridge electrode; the first-stage bridge electrode, the bridge connecting electrode, the second-stage bridge electrode, the double-wire bridge electrode and the third-stage bridge electrode are sequentially connected in series to form a stepped bridge electrode; the base electrodes are arranged on two sides of the surface of the substrate, and two ends of the stepped bridge electrode are respectively arranged on the base electrodes on two sides; the grating support is arranged between the substrate and the stepped bridge electrode, and an interval space is formed between the stepped bridge electrode and the substrate, and is used for isolating the stepped bridge electrode from the substrate.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a novel stepped transparent circuit board.
Background
The transparent and high-transmittance circuit board has wide application prospect in ultrathin flexible display or large-screen bendable display, and current manufacturers all pursue high transmittance without reducing the conductivity of materials, so that the adoption of a narrow-line-width circuit which cannot be distinguished by human eyes is an important development direction.
However, the narrow-line-width circuit has higher requirements for the processing technology, not only the processing precision, but also the material quality, and the narrow-line-width circuit is easy to cause line damage in the processes of exposure etching and the like, so that the service life of the circuit board is reduced.
Disclosure of Invention
The invention provides a novel stepped transparent circuit board which is used for solving the defect of low service life of the transparent circuit board in the prior art.
The invention provides a novel stepped transparent circuit board, which comprises: the device comprises a substrate, a base electrode, a grating, a primary bridge electrode, a bridge-type leading electrode, a secondary bridge electrode, a double-line bridge electrode and a tertiary bridge electrode;
The primary bridge electrode, the bridge-type leading electrode, the secondary bridge electrode, the double-wire bridge electrode and the tertiary bridge electrode are sequentially connected in series to form a stepped bridge electrode;
The base electrodes are arranged on two sides of the surface of the substrate, and two ends of the stepped bridge electrode are respectively arranged on the base electrodes on the two sides;
The grating support is arranged between the substrate and the stepped bridge electrode, and a spacing space is formed between the stepped bridge electrode and the substrate and used for isolating the stepped bridge electrode from the substrate.
According to the novel stepped transparent circuit board provided by the invention, the bridge type lead electrode comprises: a bridge-type leading-down electrode and a bridge-type leading-up electrode;
One end of the bridge-type leading-down electrode is connected with the primary bridge electrode, the other end of the bridge-type leading-down electrode is connected with one end of the bridge-type leading-up electrode, and the other end of the bridge-type leading-up electrode is connected with the secondary bridge electrode;
The bridge connection lower electrode and the bridge connection upper electrode are used for connecting the primary bridge electrode and the secondary bridge electrode at the step structure.
According to the invention, the novel stepped transparent circuit board is provided, and the double-wire bridge electrode comprises: a double-wire bridge electrode expansion section and a double-wire bridge electrode contraction section;
The double-wire bridge electrode expansion section and the double-wire bridge electrode contraction section form a closed loop;
One end of the closed loop is connected with the secondary bridge electrode, and the other end of the closed loop is connected with the tertiary bridge electrode;
The closed loop is used for communicating the secondary bridge electrode with the tertiary bridge electrode through a plurality of lines.
According to the novel stepped transparent circuit board provided by the invention, the three-stage bridge electrode comprises: a horizontal bridge extension electrode, an arc bridge electrode, and a vertical bridge electrode;
One end of the horizontal bridge type extension electrode is connected with one end of the double-wire bridge type electrode, and the other end of the horizontal bridge type extension electrode is sequentially connected with the arc bridge type electrode and the vertical bridge type electrode in series and then is arranged on the base electrode;
the horizontal bridge extension electrode, the arc bridge electrode and the vertical bridge electrode are used for forming a multi-thread turning structure so as to connect the double-line bridge electrode and the base electrode.
The invention provides a novel stepped transparent circuit board, which comprises a first-stage grating and a second-stage grating;
the primary grating is arranged between the primary bridge electrode and the substrate, and the secondary grating is arranged between the secondary bridge electrode and the substrate;
The primary grating is used for supporting a spacing space between the primary bridge electrode and the substrate, and the secondary grating is used for supporting a spacing space between the secondary bridge electrode and the substrate;
the height of the secondary grating is larger than that of the primary grating, so that the secondary bridge electrode and the primary bridge electrode form a step shape.
According to the novel stepped transparent circuit board provided by the invention, the secondary grating comprises a vertical comb grating and a trapezoidal comb grating;
The vertical comb grating and the trapezoidal comb grating are used for supporting the secondary bridge electrode, the duty ratio of the vertical comb grating and the trapezoidal comb grating is larger than 36%, the height is 8-12 microns, and the period is 600-1200 nanometers.
According to the novel stepped transparent circuit board provided by the invention, the width of the primary grating is 200 nanometers to 800 nanometers, and the height is 1.0 micrometers to 5.0 micrometers.
According to the novel stepped transparent circuit board provided by the invention, the bridge leading lower electrode and the bridge leading upper electrode have an initial angle of less than 30 degrees with the horizontal direction.
According to the novel stepped transparent circuit board provided by the invention, the primary bridge electrode forms an arbitrary angle with the grating, and the width of the primary bridge electrode is 3.0-5.0 micrometers wider than that of the base electrode.
According to the novel stepped transparent circuit board provided by the invention, the substrate is made of high-purity glass or ultrathin glass, and the surface of the substrate is covered with the buffer layer.
The invention provides a novel stepped transparent circuit board, which comprises: the device comprises a substrate, a base electrode, a grating, a primary bridge electrode, a bridge-type leading electrode, a secondary bridge electrode, a double-line bridge electrode and a tertiary bridge electrode; the first-stage bridge electrode, the bridge connecting electrode, the second-stage bridge electrode, the double-wire bridge electrode and the third-stage bridge electrode are sequentially connected in series to form a stepped bridge electrode; the base electrodes are arranged on two sides of the surface of the substrate, and two ends of the stepped bridge electrode are respectively arranged on the base electrodes on two sides; the grating support is arranged between the substrate and the stepped bridge electrode, and an interval space is formed between the stepped bridge electrode and the substrate, and is used for isolating the stepped bridge electrode from the substrate.
Drawings
In order to more clearly illustrate the invention or the technical solutions of the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a novel stepped transparent circuit board according to an embodiment of the present invention.
Reference numerals:
1. A substrate; 2. a first-order grating; 3. a base electrode; 4. a first-stage bridge electrode; 5. bridge type leading-down electrode; 6. bridge-type leading up electrode; 7. a secondary bridge electrode; 8. a vertical comb grating; 9. a trapezoidal comb grating; 10. a double-wire bridge electrode expansion section; 11. a two-wire bridge electrode shrink section; 12. a horizontal bridge extension electrode; 13. arc bridge electrodes; 14. a vertical bridge electrode; 15. and thickening the base electrode.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Fig. 1 is a schematic structural diagram of a novel stepped transparent circuit board according to an embodiment of the present invention.
As shown in fig. 1, the novel stepped transparent circuit board provided by the embodiment of the present invention includes: the device comprises a substrate 1, a base electrode, a grating, a primary bridge electrode 4, a bridge connection electrode, a secondary bridge electrode 7, a double-wire bridge electrode and a tertiary bridge electrode; the primary bridge electrode 4, the bridge connecting electrode, the secondary bridge electrode 7, the double-wire bridge electrode and the tertiary bridge electrode are sequentially connected in series to form a stepped bridge electrode; the base electrodes are arranged on two sides of the surface of the substrate 1, and two ends of the stepped bridge electrode are respectively arranged on the base electrodes on two sides; the grating support is disposed between the substrate 1 and the stepped bridge electrode, and a space is formed between the stepped bridge electrode and the substrate 1, and the space is used for isolating the stepped bridge electrode from the substrate 1.
In a specific implementation process, the material of the substrate 1 may include high-purity glass or ultra-thin glass, the surface of the substrate 1 is covered with a buffer layer, the substrate 1 fixes the high-strength flexible glass on the surface of the silicon substrate through adhesive, and a step-type transparent circuit board is obtained by adding a transparent electrode on the transparent glass substrate 1 through multiple etching, exposure, imprinting and other processes, adopting a base electrode as an electrode directly connected with the transparent glass, and adding a bridge metal electrode on a base conductive line. The material of the base electrode comprises copper, silver and other metal materials or copper-magnesium alloy, and the base electrode comprises a base electrode 3 (with the width of 3.0-30 micrometers and the thickness of 20-50 micrometers) on the left side and a thickened base electrode 15 on the right side in fig. 1. And in various bridge electrode processing modes, a BCB layer can be deposited on the surface of the substrate with the grating, and the BCB layer is a high-performance material with excellent thermal stability, chemical stability, electrical insulation and mechanical strength and can be used as an additional protective layer. Then depositing a metal material, cleaning, washing away BCB, and leaving a metal electrode to form a stepped bridge electrode, wherein the stepped bridge electrode is connected with blazed gratings and the like.
The step bridge electrodes are composed of bridge electrodes with different heights, the height of the first-stage bridge electrode 4 is lower than that of the second-stage bridge electrode 7, the height of the second-stage bridge electrode 7 can be the same as or different from that of the third-stage bridge electrode, and the height of the double-line bridge electrode is higher than that of the second-stage bridge electrode 7, so that the step bridge electrodes with different heights are formed on the whole structure. The primary bridge electrode 4 forms an arbitrary angle with the grating, and the width of the primary bridge electrode 4 is 3.0-5.0 microns wider than the base electrode. The primary bridge electrode 4 of the stepped bridge electrode is connected with the leading electrode through the bridge, the circuit is further pulled up to form the secondary bridge electrode 7, the secondary bridge electrode 7 is lifted step by step, and the double-wire bridge electrode is additionally arranged for preventing circuit breakage.
The invention adopts a single structure at the on-line Louis damage position, can better ensure the process safety, and can reduce the damage of temperature to the circuit and effectively prolong the service life of the transparent circuit board because the bridge electrode of each part has an interval space with the substrate 1.
Further, the bridging electrode includes: a bridge-type lead-down electrode 5 and a bridge-type lead-up electrode 6; one end of the bridge-type leading-down electrode 5 is connected with the primary bridge-type electrode 4, the other end of the bridge-type leading-down electrode 5 is connected with one end of the bridge-type leading-up electrode 6, and the other end of the bridge-type leading-up electrode 6 is connected with the secondary bridge-type electrode 7; the bridging lower electrode 5 and the bridging upper electrode 6 are used to connect the primary bridge electrode 4 and the secondary bridge electrode 7 at the stepped structure. The three-stage bridge electrode includes: a horizontal bridge extension electrode 12, an arc bridge electrode 13, and a vertical bridge electrode 14; one end of the horizontal bridge type extension electrode 12 is connected with one end of the double-wire bridge type electrode, and the other end of the horizontal bridge type extension electrode 12 is sequentially connected with the arc-shaped bridge type electrode 13 and the vertical bridge type electrode 14 in series and then is arranged on the base electrode 3; the horizontal bridge extension electrode 12, the arc bridge electrode 13 and the vertical bridge electrode 14 are used to form a multi-threaded turn structure to connect the two-wire bridge electrode with the base electrode.
Specifically, the bridging electrode serves to connect the primary bridge electrode 4 and the secondary bridge electrode 7, and raise the height of the secondary bridge electrode 7 so as to form a stepped structure. The electrode connection part is a part easy to break, so that the multi-thread mode is adopted, when breaking occurs, small parts can be replaced timely, and the cost can be reduced while the replacement is convenient. The three-stage bridge electrode has the same function, and can better monitor and replace the damaged part by arranging three structures at the turning part. Wherein, the initial angle between the bridge-type leading lower electrode 5 and the bridge-type leading upper electrode 6 and the horizontal direction is less than 30 degrees.
Similarly, the two-wire bridge electrode includes: a double-wire bridge electrode expansion section 10 and a double-wire bridge electrode contraction section 11; the double-wire bridge electrode expansion section 10 and the double-wire bridge electrode contraction section 11 form a closed loop; one end of the closed loop is connected with the secondary bridge electrode 7, and the other end of the closed loop is connected with the tertiary bridge electrode; the closed loop is used to communicate the secondary bridge electrode 7 with the tertiary bridge electrode via a plurality of lines.
Specifically, the two-wire bridge electrode expansion section 10 and the two-wire bridge electrode contraction section 11 can be connected, when any part of the two-wire bridge electrode expansion section and the two-wire bridge electrode contraction section breaks, the use of the electrode is not affected, and the multiple parts can be subjected to channel compensation, so that continuous operation is ensured. The closed loop may be circular with a radius of more than 20 microns, elliptical ring, etc.
Further, the grating in the present embodiment includes a primary grating 2 and a secondary grating; the first-stage grating 2 is arranged between the first-stage bridge electrode 4 and the substrate 1, and the second-stage grating is arranged between the second-stage bridge electrode 7 and the substrate 1; the first-stage grating 2 is used for supporting a spacing space formed between the first-stage bridge electrode 4 and the substrate 1, and the second-stage grating is used for supporting a spacing space formed between the second-stage bridge electrode 7 and the substrate 1; the height of the secondary grating is larger than that of the primary grating 2, so that the secondary bridge electrode 7 and the primary bridge electrode 4 form a step shape. The secondary grating comprises a vertical comb grating 8 and a trapezoid comb grating 9; the vertical comb grating 8 and the trapezoidal comb grating 9 are used for supporting the secondary bridge electrode 7, the duty ratio of the vertical comb grating 8 to the trapezoidal comb grating 9 is more than 36%, the height is 8-12 micrometers, and the period is 600-1200 nanometers. The first-order grating 2 has a width of 200 nm to 800 nm and a height of 1.0 micron to 5.0 microns.
Specifically, the primary bridge electrode 4 and the secondary bridge electrode 7 of different heights are supported by the primary grating 2 and the secondary grating, and better light reflection can be achieved. Through setting up and the size to first order grating 2 and second grade grating duty cycle, can adjust the light path direction better, satisfy different demands, and then guarantee the quality and the precision of circuit board better.
The apparatus embodiments described above are merely illustrative, wherein the elements illustrated as separate elements may or may not be physically separate, and the elements shown as elements may or may not be physical elements, may be located in one place, or may be distributed over a plurality of network elements. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment. Those of ordinary skill in the art will understand and implement the present invention without undue burden.
From the above description of the embodiments, it will be apparent to those skilled in the art that the embodiments may be implemented by means of software plus necessary general hardware platforms, or of course may be implemented by means of hardware. Based on this understanding, the foregoing technical solution may be embodied essentially or in a part contributing to the prior art in the form of a software product, which may be stored in a computer readable storage medium, such as ROM/RAM, a magnetic disk, an optical disk, etc., including several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute the method described in the respective embodiments or some parts of the embodiments.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410591792.8A CN118201211B (en) | 2024-05-14 | 2024-05-14 | Stepped transparent circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410591792.8A CN118201211B (en) | 2024-05-14 | 2024-05-14 | Stepped transparent circuit board |
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| Publication Number | Publication Date |
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| CN118201211A true CN118201211A (en) | 2024-06-14 |
| CN118201211B CN118201211B (en) | 2024-07-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202410591792.8A Active CN118201211B (en) | 2024-05-14 | 2024-05-14 | Stepped transparent circuit board |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1899002A (en) * | 2003-12-26 | 2007-01-17 | 三井金属矿业株式会社 | Printed-circuit board, its manufacturing method and circuit device |
| US20160315134A1 (en) * | 2015-04-22 | 2016-10-27 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing circuit board, method for manufacturing light-emitting device,and light-emitting device |
| CN115842059A (en) * | 2023-01-06 | 2023-03-24 | 电子科技大学 | Air channel diode with bridge structure and preparation method thereof |
| CN117939793A (en) * | 2024-01-29 | 2024-04-26 | 沈泽宇 | Manufacturing method of transparent circuit board |
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2024
- 2024-05-14 CN CN202410591792.8A patent/CN118201211B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1899002A (en) * | 2003-12-26 | 2007-01-17 | 三井金属矿业株式会社 | Printed-circuit board, its manufacturing method and circuit device |
| US20160315134A1 (en) * | 2015-04-22 | 2016-10-27 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing circuit board, method for manufacturing light-emitting device,and light-emitting device |
| CN115842059A (en) * | 2023-01-06 | 2023-03-24 | 电子科技大学 | Air channel diode with bridge structure and preparation method thereof |
| CN117939793A (en) * | 2024-01-29 | 2024-04-26 | 沈泽宇 | Manufacturing method of transparent circuit board |
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| Publication number | Publication date |
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| CN118201211B (en) | 2024-07-12 |
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Effective date of registration: 20260106 Address after: 266000 Shandong Province Qingdao City Laoshan District Zhuzhou Road 177 Huite Industrial Park Building 2 Patentee after: Guojing Shengtai (Qingdao) Digital Display Technology Co.,Ltd. Country or region after: China Address before: 519000 Guangdong Province, Hengqin New Area, Zhuhai City, No. 2515, Ring Island North Road, Unit 2, 907 Office Patentee before: Guojing Technology (Guangdong Hengqin Guangdong Macao Deep Cooperation Zone) Co.,Ltd. Country or region before: China Patentee before: Guojing Hechuang (Qingdao) Technology Co.,Ltd. |
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