CN118139404A - Mounting device and mounting method - Google Patents

Abstract

A mounting device and a mounting method configured to achieve high-precision mounting are provided. A mounting device can be provided, the mounting device including a bonding actuator having: a housing; a sliding member, which is accommodated in the housing in a non-contact state and is provided with a head; a coil and a yoke in a non-contact state; two voice coil motors (VCMs) driven in the X-axis direction, three VCMs driven in the Y-axis direction, and one VCM driven in the Z-axis direction. The coil can be fixed to the housing, and the yoke can be fixed to the sliding member. The bonding actuator can perform bonding while adjusting the relative position and parallelism of the chip and the wafer by driving the sliding member in six axial directions, and the six axial directions include the X-axis direction, the Y-axis direction, the Z-axis direction, the Tx direction, the Ty direction, and the Tz direction.

Description

Mounting device and mounting method

Cross Reference to Related Applications

The present application claims the priority of japanese patent application No.2022-193407 filed by the japanese patent office at 12/month 2 of 2022 and korean patent application No.10-2023-0045181 filed at 4/month 6 of 2023, the disclosures of each of which are incorporated herein by reference in their entireties.

Technical Field

The present disclosure relates to a mounting apparatus and a mounting method.

Background

In order to reduce power consumption and increase driving speed, a layering process of a semiconductor device is advancing. A process of stacking semiconductor chips such as chip on chip (CoC) and chip on wafer (CoW), or a chip bonding process (i.e., a process of mounting semiconductor packages) is changing from a conventional connection method of realizing connection between contacts using wire bonding between contacts to a connection method using flip chip or Through Silicon Via (TSV) electrodes.

In a conventional connection method of realizing connection between contacts by wire bonding between the contacts, a bonding accuracy of several tens μm is sufficient. However, the flip chip in which the bump and the pad are in direct contact with each other requires several μm, and in particular, sub-micron accuracy is required for bonding the chip through the TSV electrode. Furthermore, to directly bond metals, high temperature/pressure is often required during bonding. In a high-precision die bonding apparatus, a slight change in the structure in terms of mechanical/thermal properties is a factor that hinders precision.

Further, for direct bonding without the insertion bump, a bonding accuracy of several hundred nm or less is required. In direct bonding, local nanoscale irregularities of the wafer may also affect bonding accuracy. Therefore, it is necessary to align the slopes between the surfaces so that the distance between the joining surfaces becomes uniform.

In a conventional mounting apparatus for high-precision die bonding, the mounting apparatus recognizes alignment marks provided on the bonding surface phases of a lower bonding object and an upper bonding object by a vertical dual-field optical system interposed between the lower bonding object held on a bonding stage and the upper bonding object held on a bonding head.

The vertical dual-field optical system is integrated with a camera for recognizing an upper side and a camera for recognizing a lower side, and has a driving shaft at least in a horizontal plane so as to traverse a gap between the lower bonding object and the upper bonding object immediately before the lower bonding object and the upper bonding object are bonded. Based on the recognition result of the vertical dual-field optical system, the object to be joined is positioned and then joined. The vertical two-field optical system retracted for bonding is inserted again, and after bonding, an alignment mark provided on the upper surface of the upper bonding object is recognized. The post-installation positional deviation is calculated from the recognition results before and after the joining, and when joining the next layer, the layer is installed by aiming the position minus the calculated positional deviation. By so doing, accumulation of errors caused by mounting the layers can be prevented.

However, such a conventional mounting device has the following task for a high-precision joining process. Because the vertical dual field optical system is deformed over time due to thermal/mechanical stress, using the same optical parameters during pre-and post-installation identification may lead to errors.

In order to solve such a problem, in an apparatus according to some conventional techniques, reference marks have been prepared on a bonding stage. According to such an apparatus, by identifying the reference mark before identifying the installation result, deformation (for example, elongation mainly due to heat) of the vertical two-field optical system is identified, and the deformation is canceled when the installation result is identified. Therefore, errors due to changes in the optical system over time can be suppressed.

However, in such a device, even if errors of the optical system are suppressed, the bonding heads have different heights when the chips are recognized and bonded. Accordingly, there may be a problem that an error may occur with respect to the target coordinates calculated based on the result obtained by the alignment mark due to an error such as with movement or vibration with movement or disturbance.

Hydrostatic bearings may be used for bond heads requiring higher precision bonding equipment. The hydrostatic bearing may be used to hold the movable unit holding the chip in a non-contact state and to achieve high motion accuracy. Thus, high mounting accuracy can be achieved.

However, in a bearing gap of several μm of the hydrostatic bearing, shake smaller than submicron may occur due to vibration or pressure fluctuation from the outside. Therefore, as described above, in an apparatus requiring more accurate joining accuracy of several hundred nm or less, an error factor that cannot be ignored in accuracy may occur.

In addition, the bonding apparatus may have a means for fixing the surface of the chip parallel to the wafer using a hydrostatic spherical bearing during the bonding process. The hydrostatic spherical bearing may be provided on a lower portion of the wafer chuck serving as the wafer side or on an upper portion of the bonding head serving as the chip side. The parallel fixing device using the hydrostatic spherical bearing includes a passive type that fixes the bonding head by firmly pressing the bonding head against a chuck holding the wafer to make the surface of the chip parallel to the wafer before the chip is adsorbed, and an active type that detects how much the wafer and the chip are not parallel using a sensor and sequentially adjusts the deviation using a driving source such as piezoelectricity. Active type is used when more precise adjustment is required.

However, when the surface of the chip and the wafer are adjusted to be parallel to each other, the movable unit of the hydrostatic spherical bearing floats several μm from the fixed unit due to the hydrostatic pressure, and lands after the adjustment, thereby causing a minute error during the landing movement.

The present disclosure aims to solve at least one of these problems, and provides a mounting apparatus and a mounting method configured to achieve high-precision mounting.

Disclosure of Invention

According to some example embodiments of the present disclosure, a mounting apparatus and a mounting method configured to achieve high-precision mounting may be provided.

According to an example embodiment, a mounting apparatus may include: a head configured to support a first member; a stage configured to support a second member; at least one sensor configured to sense a deviation in position of the first member and the second member and a parallelism between the first member and the second member; and an engagement actuator configured to adjust a relative position and a relative parallelism of the first member and the second member based on the deviation and parallelism of the positions sensed by the at least one sensor, wherein the engagement actuator comprises: a housing; a slider which is accommodated in a housing in a noncontact state and is provided with the head; at least two X1-axis motors driven in the X-axis direction, at least three Y1-axis motors driven in the Y-axis direction, and at least one Z1-axis motor driven in the Z-axis direction, each of the at least two X1-axis motors, the at least three Y1-axis motors, and the at least one Z1-axis motor having a coil and a yoke in a non-contact state, the coil being fixed to the housing and the yoke being fixed to the slider; and a controller configured to join the first member to the second member in a state in which relative positions and relative parallelism of the first member and the second member are adjusted by driving the slider in six axial directions including an X-axis direction, a Y-axis direction, a Z-axis direction, a Tx direction, a Ty direction, and a Tz direction, and wherein two directions orthogonal to each other on a horizontal plane are defined as the X-axis direction and the Y-axis direction, and a direction orthogonal to the horizontal plane is defined as the Z-axis direction, and the Tx direction, the Ty direction, and the Tz direction are defined as rotational directions for the X-axis direction, the Y-axis direction, and the Z-axis direction, respectively.

The mounting device may further include at least one detector configured to detect a movement amount of the slider, wherein the controller is further configured to drive the slider based on the movement amount of the slider detected by the detector, and control the relative positions and the relative parallelism of the first member and the second member.

The detector may include: a first pair of Y-Z axis two-dimensional encoders configured to face each other in an X axis direction and detect a first position in the Y axis direction and the Z axis direction; and a second pair of X-Z axis two-dimensional encoders configured to face each other in the Y axis direction and detect a second position in the X axis direction and the Z axis direction; and the controller may be further configured to recognize the posture of the slider using the values detected by the first pair of Y-Z axis two-dimensional encoders and the second pair of X-Z axis two-dimensional encoders, and to control the posture of the slider in the six axial directions.

The detector may include: each of the first pair of Y-Z axis two-dimensional encoders includes a Y-Z axis two-dimensional encoder scale, each of the second pair of X-Z axis two-dimensional encoders includes an X-Z axis two-dimensional encoder scale, the Y-Z axis two-dimensional encoder scale and the X-Z axis two-dimensional encoder scale being mounted on one rigid body of the slider, and a sensor head configured to read the Y-Z axis two-dimensional encoder scale and the X-Z axis two-dimensional encoder scale; and the controller is configured to: the control amounts of each of the X1 axis motors, each of the Y1 axis motors, and the Z1 axis motor with respect to the position of the first member are calculated, respectively, based on the relationship between the position where the first member is held and the position of the sensor head, and each of the X1 axis motors, each of the Y1 axis motors, and the Z1 axis motor are controlled in common.

The slide may be supported on the housing by a cylinder.

The slider may include a body portion to which the yoke is fixed and a plurality of hinges configured to connect the body portion and the cylinder.

The mounting device may further include a pressure sensor configured to sense a pressure of each base of the cylinder.

Each of the X1 axis motor, the Y1 axis motor, and the Z1 axis motor may be configured to move in an axial direction other than the driving direction within a range of a gap between the coil and the yoke.

The Z1 axis motor may be configured to adjust the relative position and relative parallelism of the first member and the second member and apply pressure when joining the first member to the second member.

Each of the X1 axis motor, the Y1 axis motor, and the Z1 axis motor may include a magnet fixed to a yoke.

According to an example embodiment, a mounting apparatus may include: an engagement head configured to support the first member; and a joining station configured to support a second member to be attached to the first member; wherein the joint head includes a housing, a slider provided with a head that adsorbs the first member, a cylinder that suspends and supports the slider in a noncontact state, and a plurality of VCNs (voice coil motors), and wherein each of the plurality of VCMs includes a coil provided at the housing and a yoke provided at the slider.

In each of the plurality of VCMs, the cross-sectional shape of the yoke is U-shaped.

The plurality of VCMs includes two VCMs driven in an X-axis direction, three VCMs driven in a Y-axis direction, and one VCM driven in a Z-axis direction.

The plurality of VCMs drive the sliders in six axial directions having an X-axis direction, a Y-axis direction, a Z-axis direction, a Tx direction, a Ty direction, and a Tz direction.

The bond head also includes a pressure sensor that senses the pressure of the cylinder.

The engagement head further includes an encoder that detects an amount of movement of the slider.

The slider includes: a body to which the yoke is attached; a piston rod slidably and movably installed in the cylinder body; and a hinge connecting the body and the piston rod.

The hinge includes: a first hinge mounted between the lower surface of the piston rod and the plate-like member, and a second hinge provided between the body and the plate-like member and symmetrically provided around a tilt axis extending in the longitudinal direction of the piston rod.

The plate-like member has a square shape, and the number of the second hinges is four.

According to an example embodiment, an installation method may include: supporting the first member by the head; supporting the second member through the stage; detecting positional deviations of the first member and the second member, and parallelism between the first member and the second member; and joining the first member to the second member in a state in which the relative positions and the relative parallelism of the first member and the second member are adjusted by: the present invention provides a magnetic head device including a housing, a slider supported on the housing in a noncontact state and provided with a head, and a coil and a yoke provided in a noncontact state, the coil being fixed to the housing and the yoke being fixed to the slider, and the slider being driven in six axial directions including an X-axis direction, a Y-axis direction, a Z-axis direction, a Tx direction, a Ty direction, and a Tz direction by an engagement actuator, the engagement actuator including at least two X1-axis motors driven in the X-axis direction, at least three Y1-axis motors driven in the Y-axis direction, and at least one Z1-axis motor driven in the Z-axis direction, wherein two directions orthogonal to each other in a horizontal plane are defined as the X-axis direction and the Y-axis direction, and directions orthogonal to the horizontal plane are defined as the Z-axis direction, and Tx direction, ty direction, and Tz direction are defined as a rotation direction for each of the X-axis direction, the Y-axis direction, and the Z-axis direction.

The advantages and effects of the present application are not limited to the foregoing and may be more readily understood in describing some example embodiments of the present disclosure.

Drawings

The foregoing and other aspects, features, and advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings in which:

fig. 1 is a diagram showing a schematic configuration of a mounting device according to an example embodiment of the present disclosure;

Fig. 2 is a diagram schematically illustrating an engagement head included in the mounting apparatus shown in fig. 1 according to an example embodiment;

fig. 3 is a diagram illustrating a configuration of the slider shown in fig. 2 according to an example embodiment;

fig. 4 is a diagram illustrating a configuration of the cylinder shown in fig. 2 according to an example embodiment;

fig. 5 is a diagram illustrating a configuration of a Voice Coil Motor (VCM) shown in fig. 2 according to an example embodiment;

fig. 6 is a view showing a section along VI-VI of fig. 5;

FIG. 7 is a diagram illustrating a portion of the construction of the encoder shown in FIG. 2, according to an example embodiment;

Fig. 8 is an enlarged view illustrating a hinge part shown in fig. 2 according to an example embodiment;

Fig. 9 is a diagram illustrating the operation of the hinge;

fig. 10 is a diagram illustrating a detection value of the encoder shown in fig. 2 according to an example embodiment;

FIG. 11 is a block diagram schematically illustrating a controller according to an example embodiment of the present disclosure;

And

Fig. 12 is a flowchart illustrating an installation method according to an example embodiment of the present disclosure.

Detailed Description

Hereinafter, some example embodiments of the present disclosure will be described below with reference to the accompanying drawings. The following description and drawings may be omitted and simplified for clarity of description. In addition, in each drawing, the same elements are given the same reference numerals, and repetitive description may be omitted as necessary.

Example embodiments of the present disclosure may relate to a three-dimensional mounting device (e.g., a chip bonder or a die bonder) that stacks and bonds components such as semiconductor chips or interposers. Additionally, example embodiments of the present disclosure may relate to bond heads for aligning and bonding semiconductor chips.

As described above, when a hydrostatic bearing or a spherical bearing is used to ensure reproducibility of X-Y accuracy or parallelism of chips and wafers, it may be difficult to ensure X-Y accuracy or parallelism of several hundred nm or less for direct bonding. In the case of hydrostatic bearings, it may be difficult to ensure X-Y accuracy or parallelism due to fine vibrations in the air gap. In the case of spherical bearings, it may be difficult to ensure X-Y accuracy or parallelism due to errors caused by adjustment/fixation. In direct bonding, it may be necessary to ensure parallelism between bonding surfaces more accurately than in the case of bump connection. Accordingly, the following example embodiments are presented. The following example embodiments are some examples of the present disclosure. Accordingly, the example embodiments of the present disclosure are not limited to the following example embodiments.

Fig. 1 is a diagram showing a schematic configuration of a mounting device according to an exemplary embodiment of the present disclosure. Referring to fig. 1, the mounting apparatus 1 may be a three-dimensional mounting apparatus that aligns the position of the joining object and mounts the joining object on the upper side and the lower side using a vertical dual-field optical system. In the example embodiment shown in fig. 1, the bonding object on the lower side may be a wafer W2, and the bonding object on the upper side may be a chip W1. According to some example embodiments, the bonding object may be a wafer, a die, an interposer, or the like.

As shown in fig. 1, the mounting apparatus 1 may include a bonding head 10, a bonding stage 20, and a vertical dual field of view optical system 30. Each component of the mounting device 1 may be provided on the base frame 40. The base frame 40 may be a reference structure (alternatively, a base structure) of the mounting device 1. The base frame 40 may have a rectangular parallelepiped shape including, for example, a base 41, side frames 42, and an upper frame 43. The side frames 42 may support the upper frame 43 on the base 41. Meanwhile, the base frame 40 may be deformed into a different shape when each component of the mounting apparatus 1 is provided.

An active isolator 50 may be positioned below the base frame 40. The active isolator 50 is a vibration isolation device for eliminating vibrations caused by disturbances at the installation site of the mounting device 1. As the active isolator 50, for example, a device including an accelerometer, a displacement sensor, an actuator, and a damper may be used. The active isolator 50 may attenuate relatively high frequency vibrations through a damper, detect vibrations in the base frame 40, and move the base frame 40 through an actuator to counteract the vibrations, thereby reducing or eliminating the vibrations.

Here, for convenience of description, an X-Y-Z orthogonal coordinate system is assumed. In the example embodiment shown in fig. 1, a direction orthogonal to the upper surface of the base 41 may be defined as a Z-axis direction, and two directions orthogonal to each other in a horizontal plane parallel to the upper surface of the base 41 may be defined as an X-axis direction and a Y-axis direction. The +z-axis direction is defined as the upward direction, and the-Z-axis direction is defined as the downward direction. On the other hand, the upward and downward directions are for convenience of description of the mounting device 1, and are not intended to limit the direction in which the mounting device 1 is arranged when used.

Hereinafter, each component of the mounting apparatus 1 will be described.

< Bonding head >

The bonding head 10 may be used as a bonding tool that supports the chip W1 and bonds the chip W1 to the wafer W2. Although not specifically shown in fig. 1, the bonding head 10 may include a head 13 and a bonding actuator. The head includes, for example, a suction device, and can suck and hold the chip W1.

The engagement actuators may move the heads in parallel in the X-axis direction, the Y-axis direction, and the Z-axis direction, respectively. In addition, the engagement actuators may rotate the head 13 in rotational directions (e.g., tx direction, ty direction, and Tz direction) for the X axis, Y axis, and Z axis, respectively. In other words, the engagement actuator may drive the head in six axial directions (e.g., an X-axis direction, a Y-axis direction, a Z-axis direction, a Tx direction, a Ty direction, and a Tz direction). Accordingly, the bonding head 10 can adjust the relative position and parallelism (PARAL LEL ISM) of the upper chip W1 and the lower wafer W2. In addition, the bonding head 10 may bond the chip W1 to the wafer W2. The configuration of the engagement actuator provided in the engagement head 10 will be described in detail below.

< Joining station >

The bonding stage 20 may hold the wafer W2. The bonding station 20 may include a wafer chuck 21 and a drive mechanism 22. The wafer chuck 21 may adsorb and support the wafer W2. The drive mechanism 22 may be fixed to the base 41. The driving mechanism 22 can move the wafer chuck 21 in parallel in the X-axis direction and the Y-axis direction. Therefore, the bonding stage 20 can move the wafer W2 in the X-axis direction and the Y-axis direction. Meanwhile, the driving mechanism 22 may move the wafer chuck 21 in parallel in the Z-axis direction, or may rotate the wafer chuck 21 in the Tx direction, the Ty direction, and the Tz direction, which are rotational directions for the X-axis direction, the Y-axis direction, and the Z-axis direction, respectively.

< Vertical Dual-field optical System >

The vertical dual-field optical system 30 may be interposed between the chip W1 and the wafer W2, and may capture images of the chip W1 and the wafer W2 at the same time. However, the vertical double-field optical system 30 is not limited to being interposed between the upper chip W1 and the lower wafer W2, and is not limited to capturing images of both the upper chip W1 and the lower wafer W2. For example, the vertical dual-field optical system 30 may be interposed between the left chip W1 and the right wafer W2, and may capture images of the left chip W1 and the right wafer W2 at the same time. In other words, the vertical dual-field optical system 30 can simultaneously capture images of the chip W1 and the wafer W2 in two directions (e.g., left and right directions, and up and down directions) opposite to each other.

The vertical dual field optical system 30 may include an optical portion 31 and a drive mechanism 32. The drive mechanism 32 may be secured to the base frame 40. The drive mechanism 32 may be fixed to, for example, the upper frame 43. The driving mechanism 32 may move the optical portion 31 in parallel in the X-axis direction, the Y-axis direction, and the Z-axis direction, respectively. Meanwhile, the driving mechanism 32 may rotate the optical portion 31 in the Tx direction, the Ty direction, and the Tz direction, which are rotational directions for the X-axis direction, the Y-axis direction, and the Z-axis direction, respectively.

The vertical dual-field optical system 30 may include an image sensor that generates an image by capturing a first alignment mark formed on the chip W1 and a second alignment mark formed on the wafer W2 at the same time. In addition, the vertical dual-field optical system 30 may include a sensor that detects parallelism between the first bonding surface of the chip W1 and the second bonding surface of the wafer W2. The sensor may be, for example, an autocollimator using a laser as the detection light. At least one of the bonding head 10 and the bonding stage 20 may adjust the relative positions and parallelism of the chip W1 and the wafer W2 based on the image acquired by the image sensor and the parallelism detected by the sensor, and then bond the chip W1 to the wafer W2.

On the other hand, an optical system other than the vertical dual-field optical system 30 may be employed as long as an image of the alignment marks of the chip W1 and the wafer W2 can be captured and parallelism between the bonding surfaces of the chip W1 and the wafer W2 can be detected.

Here, the operation of the mounting apparatus 1 will be described. First, the chip W1 may be transferred to the bonding head 10 by, for example, a robot, and the chip W1 may be vacuum-held by a lower head (lower head). In addition, the wafer W2 may be transferred to the wafer chuck 21 by, for example, a robot, and the wafer W2 may be vacuum-held. In addition, the driving mechanism 22 may move the bonding stage 20 so that the target portion of the wafer W2 to be bonded to the chip W1 may be moved to the lower portion of the bonding head 10.

After clamping the chip W1 and the wafer W2, the vertical dual-field optical system 30 may calculate a target position of bonding based on alignment marks or pads of the chip W1 and the wafer W2. In addition, the vertical dual-field optical system 30 may detect the relative inclination (e.g., parallelism between bonding surfaces) of the chip W1 and the wafer W2, and calculate the inclination angle when the bonding head 10 performs bonding. That is, the vertical two-field optical system 30 can calculate values of the bonding head 10 in the X-axis direction, the Y-axis direction, the Z-axis direction, the Tx direction, the Ty direction, and the Tz direction during bonding.

The bonding head 10 may control its posture and bond the chip W1 to the wafer W2 based on values in the X-axis direction, the Y-axis direction, the Z-axis direction, the Tx direction, the Ty direction, and the Tz direction calculated by the vertical dual-field optical system 30. In addition, the bonding head 10 can control the bonding load according to the chip W1.

< Joining actuator >

An engagement actuator provided in the engagement head 10 for performing engagement will be described in detail with reference to the drawings. Fig. 2 is a diagram showing a schematic configuration of the bonding head 10 according to an exemplary embodiment of the present disclosure. Fig. 3 is a diagram illustrating the slider 12 of fig. 2. Fig. 4 is a diagram illustrating the cylinder 14 of fig. 2.

As shown in fig. 2, the joint head 10 may include a housing 11 as a fixed unit and a slider 12 as an operation unit as main configurations. The housing 11 may be a box-shaped member in which at least a bottom surface thereof (e.g., a surface in the-Z axis direction) is released (e.g., open). In the example embodiment shown in fig. 2, the side surface of the housing 11 in the ±y-axis direction is also released in addition to the bottom surface of the housing 11. That is, the housing 11 may be a frame body having two side surfaces in the ±x axis direction and an upper surface (+surface in the Z axis direction) connecting the two side surfaces.

The slider 12 may be accommodated in the housing 11. The tip of the slider 12 is provided with a head 13 having an adsorption mechanism of the chip W1. The head 13 may protrude from the bottom surface of the housing 11.

By inserting the cylinder 14 as a hydrostatic bearing, the slider 12 can be suspended and supported in a non-contact state. As shown in fig. 4, the cylinder 14 may be an air bearing cylinder including a cylinder body 141, a piston rod 142, and an air bearing 143.

The cylinder 141 has a cylindrical shape, and may be provided on the upper surface (+surface in the Z-axis direction) of the housing 11. Within the cylinder 141, a piston rod 142 provided on the upper surface of the slider 12 may be slidably mounted. An air bearing 143 may be disposed within the cylinder 141 to surround the piston rod 142. By supplying air to the air bearing 143 by the regulator, the air may be interposed between the cylinder 141 and the piston rod 142. Therefore, the thrust deviation occurring in the contact type cylinder due to the resistance of the elastic body for inner seal (such as an O-ring) can be eliminated.

As shown in fig. 4, the cylinder 14 may include an upper base 144 and a lower base 145.

For example, a regulator that manually regulates the air flow rate may be connected to the upper base 144. The upper base 144 may be controlled to a constant pressure by a regulator. Meanwhile, for example, an electro-pneumatic regulator may be connected to the lower base 145. The electro-pneumatic regulator may regulate the pressure of the lower base 145 by regulating the air flow rate.

By adjusting the pressure of the lower base 145 by the air bearing 143 in a state where air is interposed between the cylinder 141 and the piston rod 142, the piston rod 142 can be moved in the Z-axis direction (i.e., up-down direction) without being in contact with the cylinder 141.

The cylinder 14 may generate a force corresponding to the self weight of the slider 12 disposed at the lower portion to offset the self weight of the slider 12. In addition, the cylinder 14 may apply a pressure (e.g., bonding load) required to bond the chip W1 and the wafer W2 to the chip W1. On the other hand, the engagement load may be applied by a Voice Coil Motor (VCM) in the Z-axis direction described below, and may be applied by both the cylinder 14 and the VCM.

Further, the bond head 10 may include a pressure sensor for sensing the pressure of each seat of the cylinder 14. Thus, the pressure of each seat of the cylinder 14 may be monitored. Meanwhile, as described above, the cylinder 14 may be of a double-acting type or a single-acting type. In addition, the cylinder 14 may have a degree of freedom not only in the Z-axis direction but also in the Tz direction.

As described above, in the example embodiments of the present disclosure, the air bearing may be used to drive the force in a non-contact type, so that the force generated by friction as in the contact type cylinder may be reduced or prevented. However, since there is no contact point thereon, when a load is applied, the posture of the bonding head 10 may collapse, and the position of the mounted chip W1 may shift, or the parallel state of the chip W1 and the wafer W2 may change. Therefore, it is desirable to perform attitude control so that the attitude does not change even during control of the engagement load.

Accordingly, when the engagement load is applied, the pressure of the lower base 145 that performs dead-weight cancellation using the electro-pneumatic regulator can be reduced, so that the weight of the slider 12 can be used as the engagement load and can be applied. Therefore, instead of controlling the load by increasing the pressure of the upper base 144, the burden on the hinges 15 and 16 can be reduced, and the holding performance of the posture of the joint head 10 can be easily ensured.

In addition, when the weight of the slider 12 is smaller than the required engagement load, the engagement load can be adjusted by lowering the pressure of the lower base 145 performing dead-weight cancellation with the electro-pneumatic regulator and increasing the pressure of the upper base 144.

Referring to fig. 2 and 3, the joint head 10 includes a plurality of VCMs 17. Here, an example in which six VCMs 17a to 17f are provided may be shown. Meanwhile, in fig. 2, some of the six VCMs 17a to 17f may be hidden by other members. The VCMs 17a to 17f may include coils 171a to 171f serving as driving units in a noncontact state, respectively, and yokes (yoke) 172a to 172f serving as movable units, respectively. The marks of the VCMs 17a to 17f and the coils 171a to 171f correspond to the positions where the yokes 172a to 172f are provided, respectively, and their descriptions may be omitted in the drawings. Not all of the six VCMs 17 a-17 f are specifically depicted in the figures, as the illustration of one VCM is applicable to other VCMs as well.

As shown in fig. 3, yokes 172a to 172f may be provided at the slider 12. On the other hand, the coils 171a to 171f may be provided at the housing 11 in positions corresponding to each of the yokes 172a to 172f fixed to the slider 12, respectively. In other words, the coil 171 as a driving unit may be fixed to the housing 11 as a fixed unit, and the yoke 172 as a movable unit may be fixed to the slider 12 as an operation unit. When the plurality of VCMs 17a to 17f, the plurality of coils 171a to 171f, and the plurality of yokes 172a to 172f are respectively marked, their combinations may be marked as VCM 17, coil 171, and yoke 172.

The VCM 17 is a single-axis motor configured to perform direct motion in one direction. Of the VCMs 17a to 17f, two VCMs 17c and 17e are X1-axis motors driven in the X-axis direction, three VCMs 17b, 17d and 17f are Y1-axis motors driven in the Y-axis direction, and one VCM 17a is a Z1-axis motor driven in the Z-axis direction. On the other hand, the single-axis motor is not limited to a linear motor using the electromagnetic force of the VCM as a driving source, and a linear actuation mechanism having a different configuration may be employed as the single-axis motor. In addition, the bond head 10 may include at least two X1 axis motors, at least three Y1 axis motors, and at least one Z1 axis motor, although the present disclosure is not necessarily limited to this configuration.

Fig. 5 is a diagram showing the construction of the VCM. Referring to fig. 5, the configuration of VCM 17d is shown as representative of two VCMs 17c and 17e driven in the X-axis direction and three VCMs 17b, 17d, and 17f driven in the Y-axis direction. Fig. 6 is a view showing a cross section along the VI-VI direction of fig. 5.

As shown in fig. 5 and 6, the yoke 172d may be a member having a U-shaped cross-section member. The yoke 172d may generally include a metal having high magnetic permeability. The magnets 173d may be fixed to both opposite surfaces of the yoke 172d, respectively, by magnetic attraction. The coil 171d may be formed of a wire, and may generate a magnetic field depending on a direction of current through electrical connection. The coil 171d may be electrically connected to a magnetic circuit formed by the magnet 173d so as to drive the yoke 172d in a desired (or alternatively, a predetermined) driving direction.

In addition, the coil 171d may extend in the Z-axis direction. Therefore, even if the slider 12 is moved in the Z-axis direction by the VCM 17a driven in the Z-axis direction, the driving force in the X-axis direction or the Y-axis direction can be maintained. The movement direction of the other VCMs 17b to 17f can be defined as the longitudinal direction by the VCM 17a driven in the Z-axis direction. On the other hand, each of the VCMs 17 can also be passively moved in an axial direction other than the control direction within the range of the gap between the coil 171 and the yoke 172 in the noncontact state.

In this way, a so-called "moving magnet method" in which a magnet 173 is provided at a yoke 172 as a movable unit may be employed. In this case, it is not necessary to supply electric power to the yoke 172, and no wiring needs to be provided. However, when the noncontact power supply is performed, a coil may be provided at the operation unit to suppress the weight of the operation unit that engages the actuator, and a yoke and a magnet may be provided at the fixing unit.

On the other hand, as described above, when pressurization is required to bond the chip W1 to the wafer W2 and adjust the position of the slider 12, the VCM 17a driven in the Z-axis direction may have a thrust force capable of applying pressure to the chip W1.

In addition, referring to fig. 2 and 3, an encoder 18 may be provided in a central portion of a main body 19 constituting the slider 12. Encoder 18 may be a detector configured to detect the amount of movement of slider 12. At the same time, at least one encoder 18 may be provided, but according to some example embodiments, multiple encoders may be provided. Here, the encoder 18 may be a linear encoder including a two-dimensional (2D) encoder scale (2D encoder scale) provided in the slider 12. A 2D encoder scale (2D encoder scale) may be read by a sensor head provided at the housing 11.

Fig. 7 is a diagram illustrating a portion of the construction of the encoder illustrated in fig. 2 according to an example embodiment. In fig. 7, a layout of a 2D encoder scale and a sensor head constituting the encoder 18 may be shown. The 2D encoder scale and sensor head may provide a position detection sensor.

As shown in fig. 7, encoder 18 may include a pair of X-Z axis 2D encoder scales 181, a pair of Y-Z axis 2D encoder scales 182, an X axis sensor head 183, a Y axis sensor head 184, and a Z axis sensor head 185. The pair of X-Z axis 2D encoder scales 181 and the pair of Y-Z axis 2D encoder scales 182 may all be mounted on one rigid body. In the example embodiment shown in fig. 3, each 2D encoder scale may be disposed on four sides of the square column member 191 extending along the longitudinal direction (e.g., Z-axis direction) of the piston rod 142.

The X-Z axis 2D encoder scale 181 may be disposed to face each other in the Y axis direction, and may be used to detect its position in the X axis direction and the Z axis direction. The X-Z axis 2D encoder scale 181 may be disposed along the width direction of the X axis and arranged to extend in the Z axis direction. Two sensor heads, namely, an X-axis sensor head 183 and a Z-axis sensor head 185, may be provided for one X-Z axis 2D encoder scale 181.

The Y-Z axis 2D encoder scale 182 may be disposed to face each other in the X-axis direction, and may be used to detect its position in the Y-axis direction and the Z-axis direction. The Y-Z axis 2D encoder scale 182 may be disposed along the width direction of the Y axis and disposed to extend in the Z axis direction. Two sensor heads, a Y-axis sensor head 184 and a Z-axis sensor head 185, may be provided for one Y-Z axis 2D encoder scale 182.

The sensor head may be, for example, an optical sensor having a light emitting unit and a light receiving unit, which are arranged to insert (or sandwich) encoder scales 181 and 182, respectively, between the light emitting unit and the light receiving unit. In addition, the X-Z axis 2D encoder scale 181 and the Y-Z axis 2D encoder scale 182 may have, for example, light transmitting portions and light shielding portions repeatedly formed at fixed intervals in the X axis direction and the Y axis direction. The amount of drive (e.g., the relative movement of slider 12) can be detected from the counted number of signals on the pulses obtained by the sensor head.

The movement amounts in the X-axis direction, the Y-axis direction, and the Tz direction can be detected from the detection values of the X-axis sensor head 183 and the Y-axis sensor head 184. The movement amounts in the Z-axis direction, the Ty direction, and the Tx direction can be detected from the detection values of the Z-axis sensor head 185.

Meanwhile, in the example embodiment, the encoder 18 that detects the relative displacement amount of the slider 12 may be a detector that detects the movement amount of the slider 12, and may also be used to detect the absolute position of the slider 12. The controller described below can recognize the posture of the slider 12 engaging the actuator, and use the detection values detected by the encoder 18 to control the posture of the slider 12 in the six axial directions.

In addition to the piston rod 142, yoke 172 and encoder scales 181 and 182 as described above, the slider 12 may also include hinges 15 and 16 and a body 19. The main body 19 is a member having a frame-like shape. The yokes 172b and 172c may be disposed on an outer side surface of the body 19 in the +x axis, and the yokes 172d, 172e and 172f may be disposed on an outer side surface of the body 19 in the-X axis. In addition, the yoke 172a may be disposed on the upper surface of the body 19.

In addition, hinges 15 and 16 may be provided between the piston rod 142 and the body 19. Fig. 8 is an enlarged view showing a portion where the hinges 15 and 16 shown in fig. 2 are provided according to an example embodiment. In addition, fig. 9 is a diagram showing the operation of the hinges 15 and 16.

As shown in fig. 8, a hinge 15 may be installed on a lower surface of the piston rod 142. The hinge 15 may include a tilting shaft extending in a longitudinal direction (e.g., a Z-axis direction) of the piston rod 142, and may be rotatable about the tilting shaft. The tilt axis is indicated in fig. 9 by a dashed line through the piston rod 142.

A square plate-like member 192 centering on the tilt axis may be provided at a lower portion of the hinge 15. Four hinges 16 may be provided between the plate member 192 and the upper surface of the body 19. The hinges 16 may be symmetrically arranged about the tilt axis. Hinge 16 may perform a parallel movement of body 19 relative to piston rod 142.

As shown in fig. 9, the hinges 15 and 16 may be elastically deformed corresponding to the movement amounts of the main body 19 in five axial directions (for example, the X-axis direction, the Y-axis direction, the Tx direction, the Ty direction, and the Tz direction) other than the Z-axis direction in the downward direction. Hinges 15 and 16 may be connecting portions that complement the difference between the degrees of freedom of cylinder 14 and the degrees of freedom of body 19.

In the case where the slider 12 is moved with a small movement amount, when a rolling tool using a ball or needle having a sufficiently large circumferential length in the rolling direction is used for the movement amount, it may be difficult to supply lubricant to the contact portion of the rolling tool, and thus the fretting (Fretting) phenomenon may be easily caused. In addition, when a sliding tool is used as the connection portion, a change in static friction or dynamic friction may occur between the two opposing surfaces, and thus, if very high accuracy is required (such as adjusting the relative positions or parallelism of the chip W1 and the wafer W2), the sliding tool may not be a suitable tool. Accordingly, the hinge tool configured to perform elastic deformation as described above may be employed as the connection portion.

In addition, the hinges 15 and 16 may have such a strength that the strength does not bend against a load caused by acceleration or self weight when an engagement load is applied to the cylinder 14 or when moving in the Z-axis direction. On the other hand, an air tube may be used to apply a negative pressure required to adsorb the chip W1 by the head 13, and a layout in which a tensile force (e.g., tensile stress) is negligible may be performed when controlling the slider 12. In addition, a vacuum port may be provided in the cylinder 14, and a vacuum path may be provided in the assembly of the piston rod 142 and the hinges 15 and 16, so that a negative pressure for sucking the chip W1 to the head 13 is applied by excluding the interference.

In the joint head 10 including the above-described configuration, as shown in fig. 3, the center portion (e.g., center) of the cylindrical piston rod 142, the tilt axes of the hinges 15, the center portion (e.g., center) of the rectangle where the arrangement positions of the four hinges 16 are regarded as vertexes when the four hinges 16 are viewed from the Z-axis direction, the center portion (e.g., center) of the square column member in which the X-Z-axis 2D encoder scale 181 and the Y-Z-axis 2D encoder scale 182 are provided, and the center portion (e.g., center) of the head 13 may be provided on the same straight line parallel to the Z axis.

Here, with reference to fig. 10, 11, and 12, a mounting method using the bonding head 10 will be described. Fig. 10 is a diagram provided to show detection values of the encoder of fig. 2. At the upper end of fig. 10, a view when the encoder portion of fig. 2 is viewed from above may be shown, and at the lower end of fig. 10, a view when the encoder portion is viewed in the X-axis direction may be shown.

Fig. 11 is a block diagram schematically illustrating a controller according to an example embodiment of the present disclosure. Fig. 12 is a flowchart illustrating an installation method according to an example embodiment of the present disclosure.

As described above, the encoder 18 may include eight position detection sensors including four position detection sensors for detecting the X-axis direction, the Y-axis direction, and the Tz direction, and four position detection sensors for detecting the Z-axis direction, the Tx direction, and the Ty direction.

As shown in fig. 10, on each side of the square column member 191 of the slider 12 to be controlled, an X-Z axis 2D encoder scale 181 and a Y-Z axis 2D encoder scale 182 may be installed. The square columnar member 191 may be formed of a material having a low thermal expansion rate (e.g., a rigid body that is not susceptible to heat). The X-axis sensor head 183, the Y-axis sensor head 184, and the Z-axis sensor head 185 may also be formed of materials having the same low thermal expansion rate. Therefore, the positional relationship between the X-Z axis 2D encoder scale 181 and the Y-Z axis 2D encoder scale 182, the X-axis sensor head 183, the Y-axis sensor head 184, and the Z-axis sensor head 185 may be difficult to change.

Meanwhile, it is assumed that the positional relationship between each position detection sensor is known or measured in advance. In addition, it is assumed that the position of the center of gravity of the control target and the relative distance of each scale are known. Meanwhile, the control target may refer to the entire slider 12 provided with a yoke, an encoder scale, or the like.

The two X-axis sensor heads 183 facing each other in the Y-axis direction may output detection values Sx1 and Sx2. In addition, two Y-axis sensor heads 184 facing each other in the X-axis direction may output detection values Sy1 and Sy2. In addition, the two X-axis sensor heads 183 may output detection values Sz 1 and Sz2, respectively, and the two Y-axis sensor heads 184 may output detection values Sz3 and Sz4, respectively.

As shown in fig. 11, the controller 60 that performs attitude control in six axial directions of the control target may include a coordinate converter 61, a Single Input Single Output (SISO) controller 62, a force converter 63, a coordinate generator 64, and a calculation unit 65. Hereinafter, with reference to fig. 11 and 12, an installation method according to an example embodiment will be described, and a configuration of the controller 60 will be described.

As shown in fig. 12, first, a chip W1 may be supported by a bonding head 10, and a wafer W2 may be supported on a bonding stage 20 (S11), and the bonding stage 20 may be moved so that the chip W1 is located on a mounting area of the wafer W2 (S12). The positional deviation and parallelism deviation of the chip W1 and the wafer W2 may be detected using a vertical dual-field optical system (S13), and a target position (e.g., chip position) of the chip W1 may be determined (S14).

After that, the relative positions and parallelism of the chip W1 and the wafer W2 can be adjusted by the above-described bonding actuator (S15). For example, the coordinate converter 61 shown in fig. 11 may convert the coordinates of the target position of the chip W1 into coordinates (CG position) of the target center of gravity of the control target. The SISO controller 62 may perform proportional-integral-derivative (PID) control and generate control signals (e.g., X Ctrl, Y Ctrl, Z Ctrl, tx Ctrl, ty Ctrl, and Tz Ctrl) for moving the center of gravity of the control target to the target center of gravity.

The force transducer 63 may generate command signals for a driver such as the VCM 17 based on the control signals. For example, the force converter 63 may convert a control signal for controlling the position of the center of gravity of the control target into a command signal representing the position of the VCM 17. A command signal may be sent to each of the VCMs 17 of the bond head 10.

When the VCM 17 is driven based on the command signal and the target is controlled to move, a detection value may be output by each of the position detection sensors of the encoder 18. The detection value may be supplied to the coordinate generator 64. The coordinate generator 64 may calculate the coordinates (CG coordinates) of the current barycentric position of the control target based on the detection value (e.g., the position of the encoder). The calculation unit 65 may calculate the difference between the current center of gravity position and the target center of gravity position, and may control a servo loop that generates a command signal for a driver such as the VCM 17 by applying the difference.

Meanwhile, the position of the control target in the Z-axis direction may be variable with respect to the sensor head. When the center of gravity of the control target of the sensor head is changed, the amount of shake at the target position of the chip W1 may also be changed. Therefore, the positional deviation of the chip W1 from the position in the Z-axis direction can be estimated, and the control signal can be calculated. Instead of controlling the plurality of VCMs 17 individually in the servo loop, command signals of six VCMs 17 may be sequentially calculated in one servo loop.

That is, based on the relationship between the X-axis 2D encoder scale 181, the X-axis sensor head 183, and the Z-axis sensor head 185, and the relationship between the Y-axis 2D encoder scale 182, the Y-axis sensor head 184, and the Z-axis sensor head 185, the controller 60 may generate commands for the driver of each of the VCMs 17 from the target position of the chip W1.

When the control of six degrees of freedom is performed using only the value of each sensor head, it may be difficult to determine an accurate position because the target position of the final chip W1 is shifted. On the other hand, according to the method of the example embodiment of the present disclosure described above, oscillation caused by disturbance in the position of each of the VCMs 17 can be easily suppressed with a filter, thereby improving control performance and performing more accurate control.

Referring back to fig. 12, the bonding head 10 may bond the chip W1 and the wafer W2 (S16). For example, at least one of the air cylinder 14 and the VCM 17a for driving the slider 12 in the Z-axis direction may apply pressure for bonding the chip W1 and the wafer W2 to bond the chip W1 and the wafer W2. As described above, a semiconductor device including the chip W1 and the wafer W2 can be manufactured.

As described above, the joint head 10 may be provided with the hydrostatic bearing, the articulating tool, the plurality of non-contact driving sources, and the plurality of position detection sensors may be provided to determine the positions of six degrees of freedom with high accuracy. Therefore, the relative positions and parallelism of the chip W1 and the wafer W2 can be adjusted with high accuracy.

For example, when an X-Y-Z stage is used as the bonding stage 20, control of the plurality of axes may be performed by dividing the plurality of axes and mechanically connecting each of the plurality of axes so that the Y-axis stage may be mounted on the X-axis stage and the Z-axis stage may be mounted on the Y-axis stage. However, these techniques may be complicated in construction, and when mechanical deformation is performed, the final movement accuracy of the operation unit may be deteriorated. To solve this problem, the operation unit may be constantly monitored using a laser interferometer, but it may be difficult to make the configuration of the apparatus compact.

On the other hand, in some example embodiments of the present disclosure, position detection sensors (e.g., encoder 18 and motor (i.e., VCM 17)) may be mounted on an operating unit (e.g., slider 12). In addition, the moving portion can be driven in a non-contact state, and thus interference due to friction is not caused. Therefore, control of the operation unit can be improved, and high-precision mounting can be achieved. In addition, the joint 10 according to some example embodiments may have a compact structure, and may have increased rigidity.

According to some example embodiments, any of the functional blocks shown in the figures and described above (e.g., controller 60) may perform various functions including functions not discussed herein, and may be implemented as processing circuitry, such as hardware including logic circuitry, hardware/software combinations of executing software, or combinations thereof. For example, processing circuitry may include, but is not limited to, a Central Processing Unit (CPU), an Arithmetic Logic Unit (ALU), a digital signal processor, a microcomputer, a Field Programmable Gate Array (FPGA), a programmable logic unit, a microprocessor, an Application Specific Integrated Circuit (ASIC), and the like. The controller 60 may operate based on instructions stored in memory or may operate based on preprogrammed functions. The processing circuitry may include electrical components such as at least one of transistors, resistors, capacitors, and the like. The processing circuitry may include electrical components such as logic gates including at least one of AND gates, OR gates, NAND gates, NOT gates, AND the like.

The present disclosure is not limited to the above-described example embodiments, and may be appropriately changed without departing from the spirit. In other words, the present disclosure is not limited to the above-described example embodiments and drawings, and is intended to be limited by the appended claims. Accordingly, various alternatives, modifications, or variations may be devised by those skilled in the art without departing from the scope of the present disclosure, which is defined by the appended claims, and such alternatives, modifications, or variations are to be interpreted as being included within the scope of the present disclosure.

Claims (20)

1. A mounting device, comprising: a head configured to support the first member; a stage configured to support the second member; a sensor configured to sense a deviation in positions of the first member and the second member and a degree of parallelism between the first member and the second member; and an engagement actuator configured to adjust the relative position and relative parallelism of the first member and the second member based on the deviation of the position and the parallelism sensed by the sensor, Wherein, the engagement actuator comprises, case, a slider which is accommodated in the housing in a non-contact state and on which the head is provided, at least two X1-axis motors driven in the X-axis direction, at least three Y1-axis motors driven in the Y-axis direction, and at least one Z1-axis motor driven in the Z-axis direction, each of the at least two X1-axis motors, the at least three Y1-axis motors, and the at least one Z1-axis motor having a coil and a yoke in a non-contact state, the coil being fixed to the housing and the yoke being fixed to the slide, and a controller configured to couple the first member to the second member in a state where the relative position and relative parallelism of the first member and the second member are adjusted by driving the slide in six axial directions, the six axial directions including an X-axis direction, a Y-axis direction, a Z-axis direction, a Tx direction, a Ty direction, and a Tz direction, and Among them, two directions orthogonal to each other on the horizontal plane are defined as the X-axis direction and the Y-axis direction, and the direction orthogonal to the horizontal plane is defined as the Z-axis direction, and the Tx direction, the Ty direction and the Tz direction are defined as rotation directions relative to the X-axis direction, the Y-axis direction and the Z-axis direction, respectively. 2. The mounting device according to claim 1, further comprising: at least one detector configured to detect the amount of movement of the sliding member, The controller is further configured to drive the slider based on the movement amount of the slider detected by the at least one detector, and control the relative position and relative parallelism of the first member and the second member. 3. The mounting device according to claim 2, wherein: The at least one detector includes: a first pair of Y-Z axis two-dimensional encoders, which are configured to face each other in the X-axis direction and detect a first position in the Y-axis direction and the Z-axis direction; and a second pair of X-Z axis two-dimensional encoders, which are configured to face each other in the Y-axis direction and detect a second position in the X-axis direction and the Z-axis direction; and The controller is also configured to identify the posture of the slide using values detected by the first pair of Y-Z axis two-dimensional encoders and the second pair of X-Z axis two-dimensional encoders, and control the posture of the slide in the six axial directions. 4. The mounting device according to claim 3, wherein: The at least one detector comprises: Each of the first pair of Y-Z axis two-dimensional encoders includes a Y-Z axis two-dimensional encoder scale, Each of the second pair of X-Z axis two-dimensional encoders includes an X-Z axis two-dimensional encoder scale, the Y-Z axis two-dimensional encoder scale and the X-Z axis two-dimensional encoder scale are mounted on a rigid body of the slider, and a sensor head configured to read the Y-Z axis two-dimensional encoder scale and the X-Z axis two-dimensional encoder scale, and The controller is configured to: calculating, based on a relationship between a position at which the first member is held and a position of the sensor head, a control amount of each of the at least two X1-axis motors, each of the at least three Y1-axis motors, and the at least one Z1-axis motor relative to the position of the first member, and Each of the at least two X1-axis motors, each of the at least three Y1-axis motors, and the at least one Z1-axis motor are collectively controlled. 5. The mounting device according to claim 1, wherein the slide is supported on the housing by a cylinder. 6 . The mounting device of claim 5 , wherein the slide member includes a body portion to which the yoke is fixed and a plurality of hinges configured to connect the body portion and the cylinder. 7. The mounting device according to claim 5, further comprising: A pressure sensor is configured to sense the pressure of each seat of the cylinder. 8. The mounting device according to claim 1, wherein each of the at least two X1-axis motors, the at least three Y1-axis motors, and the at least one Z1-axis motor is configured to move in an axial direction other than a driving direction within the range of a gap between the coil and the yoke. 9. The mounting device according to claim 1, wherein the at least one Z1-axis motor is configured to adjust the relative position and relative parallelism of the first member and the second member, and to apply pressure when joining the first member to the second member. 10. The mounting device according to claim 1, wherein: Each of the at least two X1-axis motors, the at least three Y1-axis motors, and the at least one Z1-axis motor includes a magnet fixed to the yoke. 11. A mounting device, comprising: an engagement head configured to support a first member; and a joining stage configured to support a second member to be attached to the first member; The bonding head includes a housing, a sliding member provided with a head for adsorbing the first member, a cylinder for suspending and supporting the sliding member in a non-contact state, and a plurality of voice coil motors, and Each of the plurality of voice coil motors includes a coil disposed at the housing and a yoke disposed at the sliding member. 12. The mounting device according to claim 11, wherein: In each of the plurality of voice coil motors, a cross-sectional shape of the yoke is a U-shape. 13. The mounting device according to claim 11, wherein: The plurality of voice coil motors include two voice coil motors driven in an X-axis direction, three voice coil motors driven in a Y-axis direction, and one voice coil motor driven in a Z-axis direction. 14. The mounting device according to claim 11, wherein: The plurality of voice coil motors drives the slider in six axial directions including an X-axis direction, a Y-axis direction, a Z-axis direction, a Tx direction, a Ty direction, and a Tz direction. 15. The mounting device according to claim 11, wherein: The engagement head also includes a pressure sensor that senses pressure of the cylinder. 16. The mounting device according to claim 11, wherein: The bonding head further includes an encoder that detects a movement amount of the slider. 17. The mounting device according to claim 11, wherein: The slider includes a body to which the yoke is attached, a piston rod movably installed in a cylinder in a slidable manner, and a hinge connecting the body and the piston rod. 18. The mounting device according to claim 17, wherein: The hinge includes a first hinge installed between a lower surface of the piston rod and a plate-like member, and a second hinge provided between the body and the plate-like member and symmetrically disposed about an inclined axis extending in a longitudinal direction of the piston rod. 19. The mounting device according to claim 18, wherein: The plate-like member has a square shape, and the number of the second hinges is four. 20. An installation method, comprising: supporting the first member via the head; supporting the second member via the stage; detecting a positional deviation between the first member and the second member and a parallelism between the first member and the second member; and The first member is joined to the second member by adjusting the relative position and relative parallelism of the first member and the second member through the following steps: A device having a housing, a slider supported on the housing in a non-contact state and provided with the head, and a coil and a yoke provided in a non-contact state, the coil being fixed to the housing, and the yoke being fixed to the slider, and The sliding member is driven in six axial directions by a joint actuator based on the detected position deviation and the parallelism, the six axial directions including an X-axis direction, a Y-axis direction, a Z-axis direction, a Tx direction, a Ty direction, and a Tz direction, the joint actuator including at least two X1-axis motors driven in the X-axis direction, at least three Y1-axis motors driven in the Y-axis direction, and at least one Z1-axis motor driven in the Z-axis direction, In which, two directions orthogonal to each other on a horizontal plane are defined as the X-axis direction and the Y-axis direction, and a direction orthogonal to the horizontal plane is defined as a Z-axis direction, and the Tx direction, the Ty direction, and the Tz direction are defined as rotation directions for each of the X-axis direction, the Y-axis direction, and the Z-axis direction.