CN118055564A - Flexible circuit board with resistance circuit layer and preparation method thereof - Google Patents
Flexible circuit board with resistance circuit layer and preparation method thereof Download PDFInfo
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- CN118055564A CN118055564A CN202211459538.XA CN202211459538A CN118055564A CN 118055564 A CN118055564 A CN 118055564A CN 202211459538 A CN202211459538 A CN 202211459538A CN 118055564 A CN118055564 A CN 118055564A
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- Prior art keywords
- layer
- circuit
- substrate
- circuit layer
- circuit board
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- 238000002360 preparation method Methods 0.000 title claims abstract description 5
- 239000000758 substrate Substances 0.000 claims abstract description 82
- 229910052751 metal Inorganic materials 0.000 claims abstract description 41
- 239000002184 metal Substances 0.000 claims abstract description 41
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 27
- 238000005520 cutting process Methods 0.000 claims abstract description 26
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 24
- 239000011889 copper foil Substances 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 claims abstract description 12
- 239000010410 layer Substances 0.000 claims description 297
- 239000000463 material Substances 0.000 claims description 31
- 239000012790 adhesive layer Substances 0.000 claims description 28
- 239000003292 glue Substances 0.000 claims description 10
- 239000011241 protective layer Substances 0.000 claims description 10
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 238000005275 alloying Methods 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910052796 boron Inorganic materials 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229910052717 sulfur Inorganic materials 0.000 claims description 3
- 239000011593 sulfur Substances 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 229910052720 vanadium Inorganic materials 0.000 claims description 3
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 2
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 abstract description 5
- 238000013459 approach Methods 0.000 abstract description 3
- 238000005452 bending Methods 0.000 abstract description 3
- 239000004642 Polyimide Substances 0.000 description 8
- 229920001721 polyimide Polymers 0.000 description 8
- 239000004831 Hot glue Substances 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 229920006267 polyester film Polymers 0.000 description 4
- 238000003475 lamination Methods 0.000 description 3
- -1 Polyethylene terephthalate Polymers 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- 239000003522 acrylic cement Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000011540 sensing material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/043—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a moving tool for milling or cutting the conductive material
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The application provides a flexible circuit board with a resistance circuit layer and a preparation method thereof. The circuit substrate is provided with the metal substrate comprising the metal layer, and then the circuit layer and the resistance circuit layer are manufactured simultaneously in a circular knife die cutting mode, and the resistance circuit layer can replace the traditional thermistor by utilizing the Resistance Type (RTD) temperature sensor principle, so that the process flow is short, the manufacturing procedure is simple, and the cost is low; meanwhile, the occupied space of the temperature sensing module can be reduced, and miniaturization of products is facilitated; quality and reliability problems caused by SMT approach can also be avoided. And moreover, the bottom of the resistance circuit layer is provided with a copper foil layer (namely a reinforcing layer) without a circuit layer, so that the strength of the resistance circuit layer can be effectively improved, and the reliability in use is improved. In addition, the shape of the resistance circuit layer is a continuous bending shape (namely a wavy or serpentine structure), so that typesetting utilization rate can be improved, and line width and line distance are larger.
Description
Technical Field
The application relates to the technical field of circuit boards, in particular to a flexible circuit board with a resistance circuit layer and a preparation method thereof.
Background
The normal operating temperature of the battery module is approximately-30-55 deg.c, and if the temperature is out of the range, the battery module limits the discharge power to protect the battery module. In the related art, the battery module can collect the temperature inside the battery module through the thermistor arranged on the flexible circuit board, so that the safety protection of the battery module is realized. The thermistor can be connected to the flexible circuit board in an SMT (surface mount technology) mode, a reinforcing sheet is arranged at the thermistor to protect the thermistor, the thermistor is packaged through dispensing, and the reinforcing sheet is required to be adhered to the back of the thermistor region, so that the whole process is long and complex. In addition, the temperature-sensitive thermistor is easy to generate welding bubbles and reliability problems when being installed by adopting an SMT process, for example, the thermistor is easy to crack under a high-temperature environment.
Disclosure of Invention
In view of the above, the present application proposes a method for manufacturing a flexible circuit board having a resistive circuit layer to solve at least one of the above problems.
An embodiment of the present application provides a method for manufacturing a flexible circuit board having a resistive circuit layer, including the steps of:
Laminating a circuit substrate and a metal substrate, wherein the circuit substrate comprises a copper-clad plate, the copper-clad plate comprises a first base material layer and a copper foil layer arranged on the first base material layer, the metal substrate comprises a metal layer, a second base material layer and a first bonding layer which are sequentially arranged, and the first bonding layer is arranged between the second base material layer and the copper foil layer;
the copper foil layer which is not covered by the metal substrate is subjected to die cutting through a die cutting machine to form a circuit layer, the metal layer is subjected to die cutting to form a resistance circuit layer, the copper foil layer covered by the metal substrate is used as a reinforcing layer, and the position of the reinforcing layer corresponds to the position of the resistance circuit layer;
And insulating glue is arranged between the circuit layer and the reinforcing layer, and conductive glue is arranged between the circuit layer and the resistance circuit layer, so that the flexible circuit board is obtained.
In one embodiment, the material of the metal layer includes at least one of nickel, nickel alloy, copper and platinum, and the thickness of the metal layer is 1 μm to 4 μm.
In one embodiment, the alloying elements of the nickel alloy include at least one of phosphorus, boron, sulfur, titanium, vanadium, chromium, manganese, iron, zinc, and copper.
In one embodiment, the resistance circuit layer is continuously bent along a preset direction, and the bending angle is 90 °.
In one embodiment, the die cutting machine is a circular knife die cutting machine.
In one embodiment, the copper-clad plate further comprises a second adhesive layer arranged between the first substrate layer and the copper foil layer.
In one embodiment, the circuit substrate further comprises a build-up circuit board. The build-up circuit board comprises at least one build-up conductive circuit layer and at least one dielectric layer, wherein the outermost build-up conductive circuit layer is arranged on the surface of the first substrate layer, which is away from the circuit layer, and each dielectric layer is arranged between two adjacent build-up conductive circuit layers.
In one embodiment, the method of preparing further comprises: and a protective layer is arranged on the outer side of the resistance circuit layer. The protective layer comprises a third substrate layer and a third bonding layer, wherein the third bonding layer covers the surface of the circuit layer, which is away from the first substrate layer, and covers the surface of the resistance circuit layer.
An embodiment of the application provides a flexible circuit board with a resistance circuit layer, which comprises an inner layer circuit board and an outer layer resistance circuit board. The inner layer circuit board comprises a first substrate layer, and a circuit layer and a reinforcing layer which are arranged on the first substrate layer. The outer resistance circuit board comprises a resistance circuit layer, a second substrate layer and a first bonding layer which are sequentially arranged, wherein the first bonding layer is positioned between the second substrate layer and the circuit layer, and the position of the reinforcing layer corresponds to the position of the resistance circuit layer. Insulating glue is arranged between the circuit layer and the reinforcing layer, and conductive glue is arranged between the circuit layer and the resistance circuit layer.
In one embodiment, the inner layer circuit board further comprises a build-up layer circuit board. The build-up circuit board comprises at least one build-up conductive circuit layer and at least one dielectric layer, wherein the outermost build-up conductive circuit layer is arranged on the surface of the first substrate layer, which is away from the circuit layer, and each dielectric layer is arranged between two adjacent build-up conductive circuit layers.
The circuit substrate is provided with the metal substrate comprising the metal layer, and then the circuit layer and the resistance circuit layer are manufactured simultaneously in a circular knife die cutting mode, and the resistance circuit layer can replace the traditional thermistor by utilizing the Resistance Type (RTD) temperature sensor principle, so that the process flow is short, the manufacturing procedure is simple, and the cost is low; meanwhile, the occupied space of the temperature sensing module can be reduced, and miniaturization of products is facilitated; quality and reliability problems caused by SMT approach can also be avoided. And moreover, the bottom of the resistance circuit layer is provided with a copper foil layer (namely a reinforcing layer) without a circuit layer, so that the strength of the resistance circuit layer can be effectively improved, and the reliability in use is improved. In addition, the shape of the resistance circuit layer is a continuous bending shape (namely a wavy or serpentine structure), so that typesetting utilization rate can be improved, and line width and line distance are larger.
Drawings
Fig. 1 is a schematic cross-sectional view of an intermediate obtained after lamination of a circuit substrate and a metal substrate according to an embodiment of the present application.
Fig. 2 is a schematic cross-sectional view of an intermediate obtained after lamination of a circuit substrate and a metal substrate according to another embodiment of the present application.
Fig. 3 is a schematic cross-sectional view of an intermediate obtained after lamination of a circuit substrate and a metal substrate according to another embodiment of the present application.
Fig. 4 is a top view of the intermediate shown in fig. 1 or fig. 2 or fig. 3.
Fig. 5 is a schematic cross-sectional view of the intermediate shown in fig. 1 after die cutting.
Fig. 6 is a top view of the structure shown in fig. 5.
Fig. 7 is a schematic cross-sectional view of the structure of fig. 5 with an insulating paste and a conductive paste.
Fig. 8 is a top view of the structure shown in fig. 7.
Fig. 9 is a schematic cross-sectional view of a flexible circuit board in one embodiment after a protective layer is disposed on the outside of the structure shown in fig. 7.
Fig. 10 is a schematic cross-sectional view of a flexible circuit board according to another embodiment of the present application.
Description of the main reference signs
Flexible circuit board 100
Circuit board 10
Metal substrate 20
Intermediate 30
Copper-clad plate 11
First substrate layer 110
Copper foil layer 111
Second adhesive layer 112
Line layer 113
Stiffening layer 114
Insulating cement 115
Build-up circuit board 12
Build-up conductive trace layer 121
Dielectric layer 122
Metal layer 21
Second substrate layer 22
First adhesive layer 23
Resistive circuit layer 24
Conductive adhesive 25
Protective layer 40
Third substrate layer 41
Third adhesive layer 42
Inner layer circuit board 50
Outer layer resistor circuit board 60
The following detailed description will further illustrate embodiments of the application in conjunction with the above-described drawings.
Detailed Description
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which embodiments of the application belong. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of embodiments of the application.
It will be understood that when a layer is referred to as being "on" another layer, it can be directly on the other layer or intervening layers may be present therebetween. In contrast, when a layer is referred to as being "directly on" another layer, there are no intervening layers present.
In addition, descriptions such as those related to "first," "second," and the like in this disclosure are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
Embodiments of the present application are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments (and intermediate configurations) of the present application. Thus, differences in the shapes of the illustrations as a result, of manufacturing processes and/or tolerances, are to be expected. Thus, embodiments of the application should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. The regions illustrated in the figures are merely schematic in nature and their shapes are not intended to illustrate the actual shape of a device and are not intended to limit the scope of the present application.
Some embodiments of the present application are described in detail below with reference to the accompanying drawings. The following embodiments and features of the embodiments may be combined with each other without collision.
Referring to fig. 1 to 9, in one aspect, the present application provides a method for manufacturing a flexible circuit board 100 having a resistive circuit layer 24, which includes the following steps.
In step S10, referring to fig. 1, the circuit substrate 10 and the metal substrate 20 are pressed together to obtain an intermediate 30.
The circuit substrate 10 comprises a copper-clad plate 11, wherein the copper-clad plate 11 comprises a first base material layer 110 and a copper foil layer 111 arranged on the first base material layer 110. The material of the first substrate layer 110 may be, but is not limited to, polyimide (PI) or a polyester film (Polyethylene terephthalate, PET). In this embodiment, the material of the first substrate layer 110 is PI.
The metal substrate 20 includes a metal layer 21, a second base material layer 22, and a first adhesive layer 23 sequentially disposed, and the first adhesive layer 23 is located between the second base material layer 22 and the copper foil layer 111. The material of the second substrate layer 22 may be, but is not limited to, polyimide (PI) or polyester film (PET). In this embodiment, the material of the second substrate layer 22 is PI. The first adhesive layer 23 may be, but is not limited to, an acrylic hot melt Adhesive (AD), an epoxy adhesive, an acryl adhesive, or the like, and in this embodiment, the first adhesive layer 23 is an acrylic hot melt adhesive. In some embodiments, the first adhesive layer 23 may be omitted.
In some embodiments, as shown in fig. 2, the copper-clad laminate 11 further includes a second adhesive layer 112 disposed between the first substrate layer 110 and the copper foil layer 111. In other embodiments, the second adhesive layer 112 may be omitted. The second adhesive layer 112 may be, but is not limited to, an acrylic hot melt adhesive, an epoxy adhesive, an acrylic adhesive, or the like, and in this embodiment, the second adhesive layer 112 is an acrylic hot melt adhesive.
In some embodiments, as shown in fig. 3, the circuit substrate further includes a build-up circuit board 12. The build-up circuit board 12 includes at least one build-up conductive circuit layer 121 and at least one dielectric layer 122, and the outermost build-up conductive circuit layer 121 is disposed on the surface of the first substrate layer 110 facing away from the copper foil layer 111 and can be electrically connected to the copper foil layer 111 through a conductive structure (not shown). Each dielectric layer 122 is disposed between two adjacent build-up conductive circuit layers 121, and a conductive structure (not shown) is formed in each dielectric layer 122, and the two adjacent build-up conductive circuit layers 121 are electrically connected to each other through the conductive structure. The material of the dielectric layer 122 may be conventional or non-conventional in the art, and the present application is not limited thereto.
A top view of the intermediate body 30 is shown in fig. 4. In this embodiment, the dimension of the metal substrate 20 (smaller than the dimension of the circuit substrate 10) is smaller than the dimension of the circuit substrate 10, and the projection of the metal substrate 20 toward the circuit substrate 10 is located in the circuit substrate 10 along the arrangement direction of the metal substrate 20 and the circuit substrate 10 (the thickness direction of the intermediate body 30).
In some embodiments, the material of the metal layer 21 includes at least one of nickel, nickel alloy, copper, and platinum. The metal layer 21 is used for forming the resistance circuit layer 24 later, and the metal temperature sensing material made of the above material can enable the formed resistance circuit layer 24 to have a proper resistance value, so that the resistance circuit layer 24 can play a role similar to a resistance temperature sensor (RTD).
Further, the alloying elements of the nickel alloy include at least one of phosphorus, boron, sulfur, titanium, vanadium, chromium, manganese, iron, zinc, and copper. The addition amount of these alloying elements is not limited in the present application, and the composition of the desired resistance value can be obtained according to design choice. If the nickel alloy layer has the same thickness and width as the nickel layer, the nickel alloy layer will have a higher resistance value and a thicker resistive circuit layer 24 can be designed, which thicker resistive circuit layer 24 is less likely to be subject to open defects than a thin resistive circuit layer 24.
The larger the thickness of the metal layer 21, the smaller the resistance value determined by the sectional area of the formed resistance circuit layer 24. In some embodiments, the thickness of the metal layer 21 is 1 μm to 4 μm. Thus, the strength of the subsequently formed resistance circuit layer 24 can be ensured, so that the resistance circuit layer 24 is not easy to fail in use, and the resistance value determined by the sectional area of the resistance circuit layer 24 is not too small.
In step S20, referring to fig. 5, a circuit layer 113 is formed by die-cutting the copper foil layer at a portion not covered by the metal substrate 20 by a die-cutting machine (not shown), and a resistive circuit layer 24 is formed by die-cutting the metal layer 21. The copper foil layer 111 covered with the metal substrate 20 serves as a reinforcing layer 114, and the position of the reinforcing layer 114 corresponds to the position of the resistance circuit layer 24, that is, to the position of the second base material layer 22 or the first adhesive layer 23. The bottom of the resistance circuit layer 24 is provided with the reinforcing layer 114, so that the strength of the resistance circuit layer 24 can be effectively improved, and the reliability in use is improved.
In this embodiment, the die-cutting machine is a circular knife die-cutting machine, and the intermediate 30 can be die-cut by the circular knife die-cutting machine. The round knife die cutting can extrude materials through the cutting edge and the backing roller, and the die cutting processing is carried out by utilizing the continuous rotation of the hob, so that the die cutting purpose is achieved. The round knife die cutting can complete the compounding and processing of the multi-layer materials in one technological process. The circuit layer 113 and the resistor circuit layer 24 can be formed simultaneously by adopting a circular knife die cutting method, so that the manufacturing flow is greatly reduced.
As shown in fig. 6, the resistive circuit layer 24 is shaped as a continuous bend (i.e., a wave or serpentine) with a bend angle of preferably 90 °. The pattern of the resistor circuit layer 24 is arranged in a serpentine structure, so that typesetting utilization rate can be improved, and line width and line spacing are large. The resistive circuit layer 24 may be finely designed using laser trimming (LASER TRIMMING) to form a 90 bend angle. According to(Rs represents the resistance per unit area of the metal material, L represents the material length, and w represents the material width), the resistance of the resistance circuit layer 24 can be adjusted by adjusting the length and width of the resistance circuit layer 24.
In step S30, referring to fig. 7 and 8, an insulating adhesive 115 is disposed between the circuit layer 113 and the stiffening layer 114 to electrically insulate the circuit layer 113 and the stiffening layer 114, and a conductive adhesive 25 is disposed between the circuit layer 113 and the resistive circuit layer 24 to electrically connect the circuit layer 113 and the resistive circuit layer 24, so as to obtain the flexible circuit board 100. In the thickness direction, the insulating paste 115 may extend to the first adhesive layer 23, and the conductive paste 25 may extend to the second substrate layer 22.
In step S40, referring to fig. 9, a protective layer 40 may be further disposed on the outer side of the resistive circuit layer 24 to prevent the flexible circuit board 100 from being affected by external moisture or scratch by foreign matters. In this embodiment, the protective layer 40 is a cover-lay (CVL), which may include a third substrate layer 41 and a third adhesive layer 42. The third adhesive layer 42 covers the surface of the circuit layer 113 facing away from the first substrate layer 110 and covers the surface of the resistive circuit layer 24. In this embodiment, the third substrate layer 41 is made of PI, and the third adhesive layer 42 is made of an acrylic hot melt adhesive. In other embodiments, the materials of the third substrate layer 41 and the third adhesive layer 42 can be adjusted as required.
Referring to fig. 7, another aspect of the present application provides a flexible circuit board 100 having a resistive circuit layer 24, which includes an inner circuit board 50 and an outer resistive circuit board 60. The inner circuit board 50 includes a first substrate layer 110, and a circuit layer 113 and a reinforcing layer 114 disposed on the first substrate layer 110. The outer resistance circuit board 60 includes a resistance circuit layer 24, a second base material layer 22 and a first adhesive layer 23 sequentially disposed, the first adhesive layer 23 is located between the second base material layer 22 and the circuit layer 113, and the position of the reinforcing layer 114 corresponds to the position of the resistance circuit layer 24 (i.e. corresponds to the position of the second base material layer 22 or the first adhesive layer 23). An insulating glue is disposed between the circuit layer 113 and the reinforcing layer 114, and a conductive glue 25 is disposed between the circuit layer 113 and the resistive circuit layer 24 to electrically connect the circuit layer 113 and the resistive circuit layer 24. In the thickness direction, the insulating paste 115 may extend to the first adhesive layer 23, and the conductive paste 25 may extend to the second substrate layer 22.
As shown in fig. 9, a protective layer 40 may be further disposed on the outer side of the resistive circuit layer 24, so as to prevent the flexible circuit board 100 from being attacked by external moisture or scratched by foreign matters. In this embodiment, the protective layer 40 is a cover-lay (CVL), which may include a third substrate layer 41 and a third adhesive layer 42. The third adhesive layer 42 covers the surface of the circuit layer 113 facing away from the first substrate layer 110 and covers the surface of the resistive circuit layer 24. In this embodiment, the third substrate layer 41 is made of PI, and the third adhesive layer 42 is made of an acrylic hot melt adhesive. In other embodiments, the materials of the third substrate layer 41 and the third adhesive layer 42 can be adjusted as required.
As shown in fig. 10, the inner circuit board 50 may further include a build-up circuit board 12, where the build-up circuit board 12 includes at least one build-up conductive circuit layer 121 and at least one dielectric layer 122, and the outermost build-up conductive circuit layer 121 is disposed on a surface of the first substrate layer 110 facing away from the circuit layer 113 and can be electrically connected to the circuit layer 113 through a conductive structure (not shown). Each dielectric layer 122 is disposed between two adjacent build-up conductive circuit layers 121, and a conductive structure (not shown) is formed in each dielectric layer 122, and the two adjacent build-up conductive circuit layers 121 are electrically connected to each other through the conductive structure. The material of the dielectric layer 122 may be conventional or non-conventional in the art, and the present application is not limited thereto.
The metal substrate 20 comprising the metal layer 21 is arranged on the circuit substrate 10, then the circuit layer 113 and the resistance circuit layer 24 are manufactured simultaneously by adopting a circular knife die cutting mode, the resistance circuit layer 24 can replace the traditional thermistor by utilizing the Resistance Type (RTD) temperature sensor principle, the process flow is short, the manufacturing procedure is simple, and the cost is low; meanwhile, the occupied space of the temperature sensing module can be reduced, and miniaturization of products is facilitated; quality and reliability problems caused by SMT approach can also be avoided. In addition, the bottom of the resistance circuit layer 24 is provided with a copper foil layer (i.e. the reinforcing layer 114) without the circuit layer 113, so that the strength of the resistance circuit layer 24 can be effectively improved, and the reliability in use is improved. In addition, the shape of the resistor circuit layer 24 is a continuous bent shape (i.e. a wavy or serpentine structure), which can improve typesetting utilization rate and has a larger line width and line spacing.
The above description is of some embodiments of the application, but in practice the application is not limited to these embodiments. Other modifications and variations to the present application will be apparent to those of ordinary skill in the art in light of the present teachings.
Claims (10)
1. A preparation method of a flexible circuit board with a resistance circuit layer is characterized by comprising the following steps:
Laminating a circuit substrate and a metal substrate, wherein the circuit substrate comprises a copper-clad plate, the copper-clad plate comprises a first base material layer and a copper foil layer arranged on the first base material layer, the metal substrate comprises a metal layer, a second base material layer and a first bonding layer which are sequentially arranged, and the first bonding layer is arranged between the second base material layer and the copper foil layer;
The copper foil layer which is not covered by the metal substrate is subjected to die cutting through a die cutting machine to form a circuit layer, the metal layer is subjected to die cutting to form a resistance circuit layer, the copper foil layer covered by the metal substrate is used as a reinforcing layer, and the position of the reinforcing layer corresponds to the position of the resistance circuit layer;
And insulating glue is arranged between the circuit layer and the reinforcing layer, and conductive glue is arranged between the circuit layer and the resistance circuit layer, so that the flexible circuit board is obtained.
2. The method of claim 1, wherein the metal layer comprises at least one of nickel, nickel alloy, copper, and platinum, and the metal layer has a thickness of 1 μm to 4 μm.
3. The method of claim 2, wherein the alloying elements of the nickel alloy comprise at least one of phosphorus, boron, sulfur, titanium, vanadium, chromium, manganese, iron, zinc, and copper.
4. The method of claim 1, wherein the resistive circuit layer is continuously bent and extended in a predetermined direction at an angle of 90 °.
5. The method of manufacturing according to claim 1, wherein the die cutting machine is a circular knife die cutting machine.
6. The method of manufacturing of claim 1, wherein the copper-clad laminate further comprises a second adhesive layer disposed between the first substrate layer and the copper foil layer.
7. The method of claim 1, wherein the circuit substrate further comprises a build-up circuit board, the build-up circuit board comprises at least one build-up conductive trace layer and at least one dielectric layer, the outermost build-up conductive trace layer is disposed on a surface of the first substrate layer facing away from the trace layer, and each dielectric layer is disposed between two adjacent build-up conductive trace layers.
8. The method of manufacturing of claim 1, further comprising: and a protective layer is arranged on the outer side of the resistance circuit layer, the protective layer comprises a third substrate layer and a third bonding layer, and the third bonding layer covers the surface of the circuit layer, which is away from the first substrate layer, and covers the surface of the resistance circuit layer.
9. A flexible circuit board with a resistance circuit layer is characterized by comprising an inner layer circuit board and an outer layer resistance circuit board; the inner circuit board comprises a first substrate layer, a circuit layer and a reinforcing layer, wherein the circuit layer and the reinforcing layer are arranged on the first substrate layer; the outer-layer resistance circuit board comprises a resistance circuit layer, a second substrate layer and a first bonding layer which are sequentially arranged, the first bonding layer is positioned between the second substrate layer and the circuit layer, and the position of the reinforcing layer corresponds to the position of the resistance circuit layer; insulating glue is arranged between the circuit layer and the reinforcing layer, and conductive glue is arranged between the circuit layer and the resistance circuit layer.
10. The flexible circuit board of claim 9, wherein the inner circuit board further comprises a build-up circuit board comprising at least one build-up conductive trace layer and at least one dielectric layer, wherein the outermost build-up conductive trace layer is disposed on a surface of the first substrate layer facing away from the trace layer, and wherein each dielectric layer is disposed between two adjacent build-up conductive trace layers.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211459538.XA CN118055564A (en) | 2022-11-17 | 2022-11-17 | Flexible circuit board with resistance circuit layer and preparation method thereof |
| TW112107686A TWI849778B (en) | 2022-11-17 | 2023-03-02 | Flexible circuit board with resistance circuit layer and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211459538.XA CN118055564A (en) | 2022-11-17 | 2022-11-17 | Flexible circuit board with resistance circuit layer and preparation method thereof |
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| CN118055564A true CN118055564A (en) | 2024-05-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202211459538.XA Pending CN118055564A (en) | 2022-11-17 | 2022-11-17 | Flexible circuit board with resistance circuit layer and preparation method thereof |
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| TW (1) | TWI849778B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006005149A (en) * | 2004-06-17 | 2006-01-05 | Furukawa Circuit Foil Kk | Conductive substrate and circuit board material with resistive layer |
| EP2693852A4 (en) * | 2011-03-31 | 2014-09-03 | Jx Nippon Mining & Metals Corp | METALLIC SHEET HAVING AN ELECTRO-RESISTIVE LAYER, AND CIRCUIT BOARD USING SAID SHEET |
| CN107567178A (en) * | 2017-07-24 | 2018-01-09 | 深圳市深印柔性电路有限公司 | Reinforced type FPC harden structures based on pasted sheet type thermistor |
| CN112055478B (en) * | 2020-07-22 | 2021-07-27 | 厦门市铂联科技股份有限公司 | FPC product processing method |
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2022
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| TWI849778B (en) | 2024-07-21 |
| TW202423213A (en) | 2024-06-01 |
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