CN118027601A - Dielectric constant adjustable composite materials, flexible transmission line dielectric materials and electronic devices - Google Patents
Dielectric constant adjustable composite materials, flexible transmission line dielectric materials and electronic devices Download PDFInfo
- Publication number
- CN118027601A CN118027601A CN202211372078.7A CN202211372078A CN118027601A CN 118027601 A CN118027601 A CN 118027601A CN 202211372078 A CN202211372078 A CN 202211372078A CN 118027601 A CN118027601 A CN 118027601A
- Authority
- CN
- China
- Prior art keywords
- composite material
- resin
- porous ceramic
- dielectric constant
- material according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C08L27/18—Homopolymers or copolymers or tetrafluoroethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
本发明提供了一种介电常数可调复合材料、柔性传输线介质材料及电子设备，其中复合材料包含树脂基体和分布于树脂基体中的多孔陶瓷颗粒，树脂基体包含高分子聚合物，高分子聚合物选自氟系树脂、环氧树脂、酚醛树脂、双马来酰亚胺树脂、氰酸酯树脂、聚酰亚胺树脂和丙烯酸树脂中的至少一种，基于复合材料的总质量，多孔陶瓷颗粒的质量百分含量为5～30wt％、孔隙率为10％～50％、粒径为5～30μm、孔径<5μm。利用多孔陶瓷颗粒中的孔隙调节复合材料的介电常数和介电损耗，实现介电常数可调，同时保持低介电损耗。
The present invention provides a composite material with adjustable dielectric constant, a flexible transmission line dielectric material and an electronic device, wherein the composite material comprises a resin matrix and porous ceramic particles distributed in the resin matrix, the resin matrix comprises a high molecular polymer, the high molecular polymer is selected from at least one of fluorine resin, epoxy resin, phenolic resin, bismaleimide resin, cyanate resin, polyimide resin and acrylic resin, and based on the total mass of the composite material, the mass percentage of the porous ceramic particles is 5-30wt%, the porosity is 10%-50%, the particle size is 5-30μm, and the pore size is <5μm. The pores in the porous ceramic particles are used to adjust the dielectric constant and dielectric loss of the composite material, so that the dielectric constant can be adjusted while maintaining low dielectric loss.
Description
Technical Field
The invention relates to the technical field of composite materials, in particular to a dielectric constant adjustable composite material, a flexible transmission line dielectric material and electronic equipment.
Background
In wireless terminal products, a resin material is often used for a case or a structural member thereof, but the dielectric constant of the resin material is generally high. The antenna region of a wireless terminal product typically requires a material with a relatively low dielectric constant. A common way to change the dielectric constant of a resin material in the prior art is to add glass fibers or hollow glass microspheres to the resin material.
However, the current glass fiber-based composite material has higher dielectric constant and dielectric loss; the composite material based on the hollow glass beads has lower dielectric constant but higher electric loss.
Disclosure of Invention
The invention aims to provide a composite material with adjustable dielectric constant, a flexible transmission line dielectric material and electronic equipment, so that the dielectric constant of the composite material is adjustable and low dielectric loss is maintained.
The specific technical scheme is as follows:
In a first aspect the present invention provides a dielectric constant adjustable composite material comprising a resin matrix and porous ceramic particles distributed in the resin matrix,
The resin matrix comprises a high molecular polymer, wherein the high molecular polymer is at least one of fluorine resin, epoxy resin, phenolic resin, bismaleimide resin, cyanate resin, polyimide resin and acrylic resin;
Based on the total mass of the composite material, the mass percentage of the porous ceramic particles is 5-30wt%, the porosity is 10% -50%, the particle size is 5-30 μm, and the pore diameter is <5 μm.
In one embodiment of the present invention, the fluorine-based resin is at least one selected from Polytetrafluoroethylene (PTFE), tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer (PFA), and fluorinated ethylene propylene copolymer (FEP).
In one embodiment of the invention, the resin matrix further comprises plasticizers, stabilizers, lubricants, flame retardants and reinforcing fibers.
In one embodiment of the present invention, the plasticizer is selected from at least one of phthalate esters, alkyl sulfonate esters, and phosphate ester plasticizers; the stabilizer is at least one selected from hindered phenols, amines and phosphite stabilizers; the lubricant is at least one selected from hydrocarbon, fatty acid and fatty acid amide lubricants; the reinforcing fiber is at least one selected from carbon fiber and aramid fiber.
In one embodiment of the invention, the porous ceramic comprises at least one of SiO 2、Al2O3、SiC、ZrO2、AlN、Si3N4, BN, cordierite and mullite.
In one embodiment of the invention, the composite material has a dielectric constant of 2 to 5 and a dielectric loss of < 0.01.
In one embodiment of the present invention, the porous ceramic particles have a particle size of 5 to 8 μm.
A second aspect of the invention provides a flexible transmission line dielectric material comprising the composite material of any of the preceding aspects.
A third aspect of the present invention provides a motherboard bracket for a wireless terminal, comprising the composite material of any one of the preceding aspects.
A fourth aspect of the invention provides a rear cover for a wireless terminal comprising the composite material of any of the preceding aspects.
In one embodiment of the invention, the porous ceramic comprises at least one of (Ba, sr) TiO 3、Pb(Zr,Ti)O3、(Na,K)NbO3 or CaCu 3Ti4O12.
In one embodiment of the invention, the composite material has a dielectric constant of 30 to 300 and a dielectric loss of < 0.01.
A fifth aspect of the invention provides a center for a wireless terminal comprising the composite of any of the preceding aspects.
A sixth aspect of the invention provides an electronic device comprising the composite material of any of the preceding aspects.
The invention has the beneficial effects of
According to the dielectric constant adjustable composite material, the flexible transmission line dielectric material and the electronic equipment, the porous ceramic particles are added into the resin matrix, the mass percentage content, the porosity, the particle size and the pore diameter of the porous ceramic particles are regulated and controlled cooperatively within the range of the invention, and the dielectric constant and the dielectric loss of the composite material are regulated by utilizing the pores in the porous ceramic particles, so that the dielectric constant of the composite material can be reduced or increased, the dielectric constant of the composite material is adjustable, and meanwhile, the dielectric loss is kept low, thereby being more beneficial to being applied to parts with different requirements on dielectric constants and dielectric losses, such as a main board bracket, a rear cover, a middle frame and a flexible transmission line dielectric of the wireless terminal equipment, and improving the application degree of the composite material in wireless terminal products. Of course, it is not necessary for any one product or method of practicing the invention to achieve all of the advantages set forth above at the same time.
Drawings
In order to more clearly illustrate the invention or the technical solutions of the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it being obvious that the drawings in the description below are only some embodiments of the invention, and that other embodiments may be obtained according to these drawings by a person skilled in the art.
FIG. 1 is a schematic structural diagram of a dielectric constant adjustable composite material according to an embodiment of the present invention;
Fig. 2 is a schematic structural view of a motherboard bracket for a wireless terminal according to an embodiment of the present invention;
FIG. 3 is a schematic view of the first plastic structural member of FIG. 2;
FIG. 4 is a schematic view of the first metal structure of FIG. 2;
fig. 5 is a schematic structural view of a rear cover for a wireless terminal according to an embodiment of the present invention;
fig. 6 is a schematic structural view of a middle frame for a wireless terminal according to an embodiment of the present invention;
FIG. 7 is a schematic view of the second plastic structural member of FIG. 6;
fig. 8 is a schematic structural view of the second metal structural member in fig. 6.
Reference numerals:
The main board comprises a resin matrix-1, porous ceramic particles-2, a main board bracket-3 for a wireless terminal, a first plastic structural component-, 4, a first metal structural component-5, a rear cover-6 for the wireless terminal, a middle frame-7 for the wireless terminal, a second plastic structural component-8 and a second metal structural component-9.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by the person skilled in the art based on the present invention are included in the scope of protection of the present invention.
In existing wireless terminal products, resin materials are often used for the housing or structural member thereof. For example, antenna areas of wireless terminal products require lower dielectric constant materials to improve antenna reflow, or to enhance capacitive coupling, but conventional resin materials typically have higher dielectric constants and poorer mechanical properties. For example, in the prior art, glass fibers are added to the resin material to improve the strength of the resin material, but in the application field of wireless terminal products, the dielectric loss of the composite material formed by mixing the resin material and the glass fibers is often high, which causes the loss of the antenna performance. For another example, in the prior art, hollow glass beads are added as filler in the resin material, but the hollow glass beads generally have larger particle sizes of more than 15 μm due to process limitations, and the mechanical properties are affected by the excessively large particle sizes.
In view of this, the first aspect of the present invention provides a composite material with an adjustable dielectric constant. As shown in fig. 1, the composite material comprises a resin matrix 1 and porous ceramic particles 2 distributed in the resin matrix 1, the resin matrix 1 comprising a high molecular polymer. Wherein the high molecular polymer may be at least one selected from the group consisting of fluorine-based resins, epoxy resins, phenolic resins, bismaleimide resins, cyanate resins, polyimide resins, and acrylic resins. Based on the total mass of the composite material, the mass percentage of the porous ceramic particles 2 is 5-30wt%, the porosity is 10% -50%, the particle size is 5-30 μm, and the pore diameter is <5 μm.
According to the composite material with the adjustable dielectric constant, at least one of fluorine resin, epoxy resin, phenolic resin, bismaleimide resin, cyanate resin, polyimide resin and acrylic resin is selected as a resin matrix, porous ceramic particles are added into the resin matrix, the mass percentage content, the porosity, the particle size and the pore diameter of the porous ceramic particles are cooperatively regulated and controlled within the range, and the dielectric constant and the dielectric loss of the composite material are regulated by utilizing the pores in the porous ceramic particles, so that the dielectric constant of the composite material can be reduced or increased, the dielectric constant of the composite material is adjustable, and meanwhile, the dielectric loss is kept low, so that the composite material is more beneficial to being applied to parts with different requirements on the dielectric constant and the dielectric loss, such as a main board bracket, a rear cover, a middle frame and a flexible transmission line medium of wireless terminal equipment, and the application degree of the composite material in wireless terminal products is improved.
Compared with the existing solid ceramic filler, the porous ceramic particles serving as the filler can effectively reduce the weight ratio of the composite material, and can effectively reduce the weight of a structural member in practical application; the existing hollow glass beads are extremely easy to break when being subjected to external pressure because of thinner wall thickness, and the porous ceramic particles have continuous frameworks, so that the hollow glass beads have higher compressive strength compared with the existing hollow glass beads. In addition, the porous ceramic particles can obtain smaller particle sizes through mechanical processing, for example, the porous ceramic particles with particle sizes smaller than 10 mu m can be applied to thinner composite materials, and the mechanical properties of the composite materials are improved; the pores of the porous ceramic particles can increase the surface area of the filler, enhance the binding force between the ceramic particles and the resin, and enable the composite material to have larger mechanical strength.
In one embodiment of the present invention, the fluorine-based resin is selected from at least one of Polytetrafluoroethylene (PTFE), tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer (PFA), fluorinated ethylene propylene copolymer (FEP). The invention utilizes the characteristic of low dielectric constant of the fluorine resin to further reduce the dielectric constant of the resin matrix, thereby being beneficial to obtaining the composite material with low dielectric constant.
In one embodiment of the present invention, the resin matrix further comprises plasticizers, stabilizers, lubricants and reinforcing fibers. According to the invention, the plasticizer, the stabilizer, the lubricant and the reinforcing fiber are added into the resin matrix, so that the plastic forming performance, the stability, the lubricity and the mechanical property of the composite material can be effectively improved.
The specific kinds of the plasticizer, the stabilizer, the lubricant and the reinforcing fiber are not particularly limited as long as the object of the present invention can be achieved. For example, the plasticizer is selected from at least one of phthalate esters, alkyl sulfonate esters, and phosphate ester plasticizers; the stabilizer is at least one selected from hindered phenols, amines and phosphite stabilizers; the lubricant is at least one of hydrocarbon, fatty acid and fatty acid amide lubricants; the reinforcing fiber is at least one selected from carbon fiber and aramid fiber. The present invention is not particularly limited in the amount of the plasticizer, stabilizer, lubricant and reinforcing fiber added to the composite material as long as the object of the present invention can be achieved. For example, the plasticizer is 5 to 10wt%, the stabilizer is 0.05 to 2wt%, the lubricant is 0.5 to 1wt%, and the reinforcing fiber is 5 to 30wt%, based on the total mass of the composite.
The resin matrix of the invention can also comprise a flame retardant to improve the flame retardant effect of the composite material. The specific kind of the flame retardant is not particularly limited in the present invention, as long as the object of the present invention can be achieved. For example, the flame retardant is at least one selected from the group consisting of Sb 2O3 and halogenated anhydrides.
In one embodiment of the present invention, the porous ceramic comprises at least one of SiO 2、Al2O3、SiC、ZrO2、AlN、Si3N4, BN, cordierite and mullite, and the low dielectric constant characteristic of the ceramic material is used to facilitate the production of a composite material with low dielectric constant and low dielectric loss.
In one embodiment of the invention, the dielectric constant of the composite material is 2-5, the dielectric loss is less than 0.01, and the composite material is used in the corresponding antenna areas of the middle frame, the main board bracket and the rear cover of the wireless terminal product, so that the antenna performance of the wireless terminal product can be effectively improved.
The specific method for determining the dielectric constant of the composite material is not particularly limited in the present invention, as long as the object of the present invention can be achieved. For example, the dielectric constant of the composite material is calculated using a Maxwell-Garnett model, which has the formula:
Wherein,
Epsilon: integral dielectric constant of composite material
Epsilon m: dielectric constant of resin matrix
Epsilon d: dielectric constant of porous ceramic particles
Volume fraction of resin matrix
Porous ceramic particle volume fraction.
Or using an impedance analyzer, a vector network analyzer tests the dielectric constant of the composite material.
In one embodiment of the invention, the porous ceramic particles have a particle size of 5 to 8 μm. Without being limited by any theory, the particle size of the porous ceramic particles is regulated within the range, so that on one hand, the smaller particle size is beneficial to improving the mechanical property of the composite material, and on the other hand, the composite material and the copper layer are beneficial to being pressed when the flexible transmission line dielectric material, such as a flexible circuit board, is prepared.
A second aspect of the present invention provides a flexible transmission line dielectric material comprising a composite material according to any of the preceding aspects, such that the dielectric constant and dielectric loss of the flexible transmission line dielectric material are effectively reduced, thereby reducing the insertion loss of the flexible transmission line.
A third aspect of the present invention provides a motherboard bracket 3 for a wireless terminal, as shown in fig. 2 to 4, where the motherboard bracket 3 for a wireless terminal includes a first plastic structural member 4 and a first metal structural member 5, and the first metal structural member 5 may be embedded in the first plastic structural member 4. The first plastic structural member 4 comprises the composite material in any of the foregoing schemes, so that the dielectric constant and dielectric loss of the motherboard bracket for the wireless terminal are effectively reduced, and the dielectric loss of the motherboard bracket for the wireless terminal is reduced.
A fourth aspect of the present invention provides a rear cover 6 for a wireless terminal, as shown in fig. 5, in which the rear cover 6 for a wireless terminal comprises the composite material according to any one of the foregoing aspects, so that the dielectric constant and dielectric loss of the rear cover for a wireless terminal are effectively reduced, thereby reducing the dielectric loss of the rear cover for a wireless terminal.
In one embodiment of the invention, the porous ceramic comprises at least one of (Ba, sr) TiO 3、Pb(Zr,Ti)O3、(Na,K)NbO3 or CaCu 3Ti4O12. The characteristic of higher dielectric constant of the ceramic material is utilized, so that the composite material with high dielectric constant and low dielectric loss is obtained.
In one embodiment of the invention, the dielectric constant of the composite material is 30-300, the dielectric loss is less than 0.01, and the composite material is used in the corresponding area of the middle frame of a wireless terminal product, so that the reflux of the antenna can be effectively improved, the radiation efficiency of the antenna can be improved, and the capacitive coupling can be enhanced.
A fifth aspect of the present invention provides a middle frame 7 for a wireless terminal, as shown in fig. 6 to 8, comprising the composite material of any one of the foregoing aspects, wherein the middle frame 7 for a wireless terminal comprises a second plastic structural member 8 and a second metal structural member 9, and the second metal structural member 9 can be embedded in the second plastic structural member 8. The second plastic structural member 9 comprises a composite material according to any of the preceding aspects, such that the radio terminal center is made dielectric constant tunable while maintaining low dielectric losses.
The method for producing the porous ceramic particles is not particularly limited as long as the object of the present invention can be achieved. For example, by existing partial sintering processes, or by purchasing commercially available porous ceramic particles. The invention can select porous ceramic particles with the required particle size through a particle size screening tool (such as a screen).
It will be appreciated that the porosity and pore size of the porous ceramic is generally affected by the sintering conditions during sintering, e.g., the porosity of the porous ceramic decreases with increasing forming pressure, sintering temperature, or sintering time; the porosity and pore size of the porous ceramic can also be affected by the addition of pore formers and foaming agents. Therefore, the porosity and the pore diameter of the porous ceramic can be adjusted by adjusting the process parameters.
The present invention is not particularly limited in the preparation process of the composite material as long as the object of the present invention can be achieved. For example, by the following method:
And (3) heating and melting the resin matrix, stirring and mixing the resin matrix and porous ceramic particles in a mixer according to a certain proportion, and transferring the mixed materials into an extruder for extrusion molding to obtain the composite material.
The heating temperature and stirring time of the present invention are not particularly limited, and may be determined according to the melting point or softening point of the high molecular polymer, as long as the object of the present invention can be achieved.
A sixth aspect of the invention provides an electronic device comprising the composite material of any of the preceding aspects, the composite material having an adjustable dielectric constant while maintaining low dielectric loss.
The electronic device of the present invention is not particularly limited, and may be any electronic device known in the art. In some embodiments, the electronic device may include, but is not limited to, a notebook computer, a pen-input computer, a mobile computer, an electronic book player, a portable telephone, a portable facsimile machine, a portable copier, a portable printer, a headset, a video recorder, a liquid crystal television, a portable cleaner, a portable CD player, a mini-compact disc, a transceiver, an electronic notepad, a calculator, a memory card, a portable audio recorder, a radio, a backup power source, a motor, an automobile, a motorcycle, a power assisted bicycle, a lighting fixture, a toy, a game machine, a clock, an electric tool, a flashlight, a camera, a household large-sized battery, a lithium ion capacitor, and the like.
Examples
Hereinafter, embodiments of the present invention will be described in more detail with reference to examples and comparative examples. The various tests and evaluations were carried out according to the following methods. Unless otherwise specified, "parts" and "%" are mass references.
Test method and apparatus:
particle size test of porous ceramic particles:
The particle size of the porous ceramic particles was measured using a laser particle sizer. The particle size in the present invention refers to the average particle size of the porous ceramic particles.
Pore diameter and porosity test of porous ceramic particles
1. The porosity is obtained by adopting an Archimedes drainage method;
2. The aperture is obtained by adopting a scanning electron microscope to conduct morphology observation test.
The pore size in the present invention means the average pore size of the porous ceramic particles, and the porosity in the present invention means the average porosity of the porous ceramic particles.
Composite material dielectric loss test
The dielectric loss of the composite material is tested by adopting a coaxial method.
Mechanical strength test of composite material
The tensile strength of the composite material was tested according to the national standard GB 1040-92.
Example 1-1
< Preparation of porous ceramic particles >
Mixing Al 2O3 powder and SiO 2 powder according to the mass ratio of 2.55:1 to obtain raw material powder, and mixing the raw material powder, pore-forming agent starch and sintering aid magnesium oxide according to the mass ratio of 88:7:5 to obtain mixed powder; mixing the obtained mixed powder and deionized water according to the mass ratio of 40:60, and then ball-milling and mixing for 6 hours to obtain slurry; drying the slurry, adding 5wt% polyvinyl alcohol water solution for granulating, sieving, placing into a muffle furnace at 500 ℃ for discharging glue for 12h, and sintering in a high-temperature sintering furnace at 1600 ℃ for 3h to obtain porous ceramic particles.
< Preparation of composite Material >
The preparation method comprises the steps of heating epoxy resin, plasticizer butyl benzyl phthalate, stabilizer tetra [ beta- (3, 5-di-tert-butyl, 4-hydroxyphenyl) propionic acid ] pentaerythritol, lubricant oxidized polyethylene wax and porous ceramic particles obtained in the steps in a mixer according to the mass ratio of 70:8:1:1:20, mechanically stirring to enable all components to be melted and mixed uniformly, putting the mixed materials into a mould, pressing and forming, wherein the pressure is 4MPa, the curing temperature is 100 ℃, and demoulding to obtain the composite material. The mass percentage of the porous ceramic particles in the composite material is 20wt%.
Examples 1 to 2 to 1 to 3
The procedure of example 1-1 was repeated except that the mass percentage of the porous ceramic particles was adjusted as shown in Table 1.
Examples 1 to 4 to 1 to 5
The procedure of example 1-1 was repeated except that the porous ceramic particles were subjected to particle size screening so as to adjust the particle sizes of the porous ceramic particles as shown in Table 1.
Examples 1 to 6 to 1 to 7
The procedure of example 1-1 was repeated, except that the sintering temperature was controlled so as to adjust the porosity of the porous ceramic particles as shown in Table 1.
Examples 1 to 8 to 1 to 9
The procedure of example 1-1 was repeated except that the types of the resin substrates were adjusted as shown in Table 1.
Examples 1 to 10 to 1 to 12
The procedure of example 1-1 was repeated except that the type of the porous ceramic was changed as shown in Table 1.
Example 2-1
< Preparation of porous ceramic particles >
Mixing (Ba, sr) TiO 3 powder, pore-forming agent starch and sintering aid magnesium oxide according to the mass ratio of 88:7:5 to obtain mixed powder; mixing the obtained mixed powder and deionized water according to the mass ratio of 40:60, and then ball-milling and mixing for 6 hours to obtain slurry; drying the slurry, adding 5wt% polyvinyl alcohol water solution for granulating, sieving, placing into a muffle furnace at 500 ℃ for discharging glue for 12h, and sintering in a high-temperature sintering furnace at 1400 ℃ for 3h to obtain porous ceramic particles.
< Preparation of composite Material >
The preparation method comprises the steps of heating epoxy resin, plasticizer butyl benzyl phthalate, stabilizer tetra [ beta- (3, 5-di-tert-butyl, 4-hydroxyphenyl) propionic acid ] pentaerythritol, lubricant oxidized polyethylene wax and porous ceramic particles obtained in the steps in a mixer according to the mass ratio of 70:8:1:1:20, mechanically stirring to enable all components to be melted and mixed uniformly, putting the mixed materials into a mould, pressing and forming, wherein the pressure is 4MPa, the curing temperature is 100 ℃, and demoulding to obtain the composite material. The mass percentage of the porous ceramic particles in the composite material is 20wt%.
Examples 2-2 to 2-3
The procedure of example 2-1 was repeated except that the mass percentage of the porous ceramic particles was adjusted as shown in Table 2.
Examples 2 to 4 to 2 to 5
The procedure of example 2-1 was repeated, except that the porous ceramic particles were subjected to particle size screening so as to adjust the particle sizes of the porous ceramic particles as shown in Table 2.
Examples 2 to 6 to 2 to 7
The procedure of example 2-1 was repeated, except that the porosity of the porous ceramic particles was adjusted as shown in Table 2 by controlling the sintering temperature parameters.
Examples 2 to 8 to 2 to 9
The procedure of example 2-1 was repeated except that the types of the resin substrates were adjusted as shown in Table 2.
Comparative example 1
The procedure of example 1-1 was repeated except that the filler was changed to hollow glass beads as shown in Table 1.
Comparative example 2
The procedure of example 1-1 was repeated except that the filler was glass fiber as shown in Table 1.
The components and physical parameters of the composite materials prepared in each example and comparative example are shown in tables 1 to 2
TABLE 1
TABLE 2
Referring to Table 1, it can be seen from examples 1-1 to examples 1-12 and comparative example 1 that the composite material of the present invention has lower dielectric loss while maintaining a lower dielectric constant, compared to the existing hollow glass microsphere-based composite material.
It can be seen from examples 1-1 to 1-7, examples 1-10 to 1-12 and comparative example 2 that the dielectric constant and dielectric loss of the composite material of the present invention are significantly reduced compared to the existing glass fiber-based composite material.
The type of resin matrix will also generally affect the properties of the composite material, and it can be seen from examples 1-8 and examples 1-9 that by using the resin matrix of the present invention, a composite material having a lower dielectric constant and dielectric loss can also be obtained.
Referring to Table 2, it can be seen from examples 2-1 to examples 2-9 and comparative example 1 that the composite material of the present invention has an improved dielectric constant and lower dielectric loss compared to the conventional hollow glass microsphere-based composite material.
It can be seen from examples 2-1 to examples 2-9 and comparative example 2 that the composite material of the present invention has a higher dielectric constant and lower dielectric loss than the existing glass fiber-based composite material.
It can be further seen from examples 1-1 to 1-12 and examples 2-1 to 2-9 that the invention is more beneficial to being applied to parts with different requirements on dielectric constants and dielectric losses, such as a main board bracket, a rear cover, a middle frame, a flexible transmission line medium, and the like of wireless terminal equipment by adding porous ceramic particles into a resin matrix, and by synergistically adjusting the mass percentage content, the porosity, the particle size and the pore diameter of the porous ceramic particles within the above ranges, and adjusting the dielectric constants and the dielectric losses of the composite material by utilizing the pores in the porous ceramic particles, the dielectric constants of the composite material can be reduced or increased, so that the dielectric constants of the composite material can be adjusted while keeping low dielectric losses, and the application degree of the composite material in wireless terminal products is improved.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
In this specification, each embodiment is described in a related manner, and identical and similar parts of each embodiment are all referred to each other, and each embodiment mainly describes differences from other embodiments.
The foregoing is merely a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention are included in the protection scope of the present invention.
Claims (14)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211372078.7A CN118027601A (en) | 2022-11-03 | 2022-11-03 | Dielectric constant adjustable composite materials, flexible transmission line dielectric materials and electronic devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211372078.7A CN118027601A (en) | 2022-11-03 | 2022-11-03 | Dielectric constant adjustable composite materials, flexible transmission line dielectric materials and electronic devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118027601A true CN118027601A (en) | 2024-05-14 |
Family
ID=90991911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211372078.7A Pending CN118027601A (en) | 2022-11-03 | 2022-11-03 | Dielectric constant adjustable composite materials, flexible transmission line dielectric materials and electronic devices |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118027601A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119704720A (en) * | 2025-02-27 | 2025-03-28 | 绍兴文理学院 | A high-strength temperature-stable composite dielectric material and its preparation method and application |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4882455A (en) * | 1985-03-27 | 1989-11-21 | Ibiden Co., Ltd. | Electronic circuit substrates |
| WO1992018213A1 (en) * | 1991-04-12 | 1992-10-29 | E.I. Du Pont De Nemours And Company | High dielectric constant flexible ceramic composite |
| JPH07182921A (en) * | 1990-12-06 | 1995-07-21 | Matsushita Electric Works Ltd | Composite dielectric and printed circuit board |
| US6091375A (en) * | 1996-06-25 | 2000-07-18 | Sumitomo Electric Industries, Ltd. | Radome |
| US20030214793A1 (en) * | 2002-04-01 | 2003-11-20 | Katsuyuki Uchida | Ceramic electronic component and method for making the same |
| JP2004297020A (en) * | 2002-04-01 | 2004-10-21 | Murata Mfg Co Ltd | Ceramic electronic component and its manufacturing method |
| US20080124516A1 (en) * | 2004-03-19 | 2008-05-29 | Ngk Insulators, Ltd. | Method for Producing Porous Ceramic Structure |
| CN112759868A (en) * | 2019-10-21 | 2021-05-07 | 中国科学院上海硅酸盐研究所 | High-thermal-conductivity fluororesin/h-BN/CLAT composite dielectric material with adjustable dielectric constant and preparation method thereof |
-
2022
- 2022-11-03 CN CN202211372078.7A patent/CN118027601A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4882455A (en) * | 1985-03-27 | 1989-11-21 | Ibiden Co., Ltd. | Electronic circuit substrates |
| JPH07182921A (en) * | 1990-12-06 | 1995-07-21 | Matsushita Electric Works Ltd | Composite dielectric and printed circuit board |
| WO1992018213A1 (en) * | 1991-04-12 | 1992-10-29 | E.I. Du Pont De Nemours And Company | High dielectric constant flexible ceramic composite |
| US6091375A (en) * | 1996-06-25 | 2000-07-18 | Sumitomo Electric Industries, Ltd. | Radome |
| US20030214793A1 (en) * | 2002-04-01 | 2003-11-20 | Katsuyuki Uchida | Ceramic electronic component and method for making the same |
| JP2004297020A (en) * | 2002-04-01 | 2004-10-21 | Murata Mfg Co Ltd | Ceramic electronic component and its manufacturing method |
| US20080124516A1 (en) * | 2004-03-19 | 2008-05-29 | Ngk Insulators, Ltd. | Method for Producing Porous Ceramic Structure |
| CN112759868A (en) * | 2019-10-21 | 2021-05-07 | 中国科学院上海硅酸盐研究所 | High-thermal-conductivity fluororesin/h-BN/CLAT composite dielectric material with adjustable dielectric constant and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119704720A (en) * | 2025-02-27 | 2025-03-28 | 绍兴文理学院 | A high-strength temperature-stable composite dielectric material and its preparation method and application |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7368769B2 (en) | Laminate and circuit board | |
| WO2012151820A1 (en) | Composite material, high-frequency circuit baseboard made therefrom and production method thereof | |
| CN111114069B (en) | Ceramic/polytetrafluoroethylene composite medium substrate and preparation method thereof | |
| CN115594512B (en) | PTFE-ceramic slurry for high-frequency microwaves and sintering film thereof, and preparation method and application thereof | |
| JP7421156B1 (en) | Dielectric and its manufacturing method | |
| CN114621543B (en) | High-frequency prepreg, high-frequency copper-clad plate and preparation method of high-frequency prepreg and high-frequency copper-clad plate | |
| CN112812476A (en) | Polytetrafluoroethylene composite material and preparation method and application thereof | |
| CN118027601A (en) | Dielectric constant adjustable composite materials, flexible transmission line dielectric materials and electronic devices | |
| CN115305031B (en) | Hydrocarbon bonding sheet with low dielectric and high Tg and high-frequency copper-clad plate prepared from same | |
| JP7534688B2 (en) | Composition, fluororesin sheet and method for producing same | |
| JP2024144644A (en) | Composition, fluororesin sheet and method for producing same | |
| JP7568991B2 (en) | Fluororesin sheets, copper-clad laminates, circuit boards and antennas | |
| TWI696666B (en) | Resin composition, prepreg for printed circuit and metal-clad laminate | |
| CN112677617A (en) | Preparation method of novel flexible copper clad laminate | |
| WO2021132055A1 (en) | Dispersion liquid | |
| JP2024084724A (en) | Composition, sheet and method for producing same | |
| JP2025137452A (en) | Sheet, copper clad laminate, circuit board, and method for manufacturing the sheet | |
| JP2024110392A (en) | Dielectric, copper clad laminate and their manufacturing method | |
| WO2025053138A1 (en) | Sheet, method for producing same, metal-clad laminate, circuit board, and antenna | |
| WO2025187578A1 (en) | Composition, paste-like composition, sheet, metal-clad laminate, circuit board, and method for producing sheet | |
| JP2025039524A (en) | Sheets, metal clad laminates, circuit boards and antennas | |
| CN115648766A (en) | PTFE foam copper-clad plate and preparation method thereof | |
| CN114341257A (en) | Composition, method for producing antenna, and molded article | |
| WO2025070380A1 (en) | Composition, sheet, and metal-clad laminate | |
| CN115895015A (en) | A kind of in-situ fiber reinforced microcellular foam material and its preparation method and application |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Country or region after: China Address after: Unit 3401, unit a, building 6, Shenye Zhongcheng, No. 8089, Hongli West Road, Donghai community, Xiangmihu street, Futian District, Shenzhen, Guangdong 518040 Applicant after: Honor Terminal Co.,Ltd. Address before: 3401, unit a, building 6, Shenye Zhongcheng, No. 8089, Hongli West Road, Donghai community, Xiangmihu street, Futian District, Shenzhen, Guangdong Applicant before: Honor Device Co.,Ltd. Country or region before: China |