CN118005428A - A silver-plated structure for ceramic sheets and a silver-plated method for ceramic sheets - Google Patents
A silver-plated structure for ceramic sheets and a silver-plated method for ceramic sheets Download PDFInfo
- Publication number
- CN118005428A CN118005428A CN202211399900.9A CN202211399900A CN118005428A CN 118005428 A CN118005428 A CN 118005428A CN 202211399900 A CN202211399900 A CN 202211399900A CN 118005428 A CN118005428 A CN 118005428A
- Authority
- CN
- China
- Prior art keywords
- ceramic
- waterproof paper
- silver plating
- paper
- silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
- C04B41/5116—Ag or Au
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/4572—Partial coating or impregnation of the surface of the substrate
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
- C04B41/88—Metals
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to the technical field of electronic ceramic silver plating, and discloses a silver plating structure for a ceramic plate and a silver plating method for the ceramic plate, wherein the ceramic plate is placed in waterproof paper, a central line is arranged at the symmetrical central position of the waterproof paper, and the central line divides the waterproof paper into a first waterproof paper and a second waterproof paper; the first waterproof paper and the second waterproof paper on two sides of the central line are respectively provided with folding lines in parallel, the distance between the two folding lines corresponds to the thickness of the ceramic sheet, so that the thickness of the ceramic sheet is effectively controlled in the silver plating process, and hollow holes are respectively arranged on the first waterproof paper and the second waterproof paper by taking the central line as a symmetrical axis; the ceramic plate is placed on the first waterproof paper and pressed on the hollow hole, and the size of the hollow hole corresponds to the silver plating area required in the ceramic plate, so that the silver plating area of the ceramic plate can be regulated and controlled conveniently.
Description
Technical Field
The invention relates to the technical field of electronic ceramic silver plating, in particular to a silver plating structure for a ceramic plate and a silver plating method for the ceramic plate.
Background
Electronic ceramics are ceramics that can utilize electric and magnetic properties in the electronics industry. Has wide application in energy, household appliances, automobiles and the like. The silver plating technology of electronic ceramics is a key for controlling the quality of the electronic ceramics and improving the electrical performance of the electronic ceramics. At present, the electronic ceramic silver plating technology mainly comprises silver spraying, silver dipping, screen printing, electroplating and vacuum coating. Silver spraying is the most commonly used silver plating method, and a silver plating layer obtained by silver spraying is high in binding force and good in surface quality, but the paste is seriously wasted and the steps are complicated. The silver leaching is that after the ceramic is leached by a silver leaching machine, a centrifugal machine is used for completing a silver throwing process, so that silver paste is uniformly attached to the surface of a substrate, and then silver burning is carried out. The screen printing is to print silver paste on the surface of the ceramic screen and then sinter at high temperature, so that the silver layer is separated from the ceramic block, the performance of the product is invalid, surface bubbles can appear when the thickness is increased, and the stability of the product is affected. The appearance and the binding force of the electroplated silver plating can meet the requirements, but the thickness of the plating layer in the hole is difficult to control. The vacuum coating has high adhesive force but higher cost. It can be seen that the existing ceramic silver plating technology has the problems of complicated steps and high cost.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention aims to provide a silver plating structure for a ceramic wafer and a silver plating method for the ceramic wafer, so as to solve the technical problems that silver plating steps are complicated and the silver plating area and the silver plating thickness of the ceramic cannot be regulated and controlled in the prior art.
The invention is realized by the following technical scheme:
a silver plating structure for ceramic plates comprises waterproof paper and ceramic plates silver plated by the waterproof paper; setting a central line at the symmetrical center position of the waterproof paper, dividing the waterproof paper into a first waterproof paper and a second waterproof paper by the central line, taking the central line as a symmetrical axis, respectively setting folding lines on the first waterproof paper and the second waterproof paper at two sides of the central line in parallel, and respectively setting hollow holes on the first waterproof paper and the second waterproof paper by taking the central line as the symmetrical axis; the ceramic plate is placed on the first waterproof paper and pressed on the hollow hole, and one side, close to the folding line, of the ceramic plate is aligned with the folding line.
Preferably, the waterproof paper is plastic paper, cellophane or waxed paper.
Preferably, the distance between the fold lines on the first and second waterproof papers corresponds to the thickness of the ceramic sheet.
Preferably, the hole surface size of the hollow hole corresponds to the silver plating area size of the ceramic plate.
Preferably, the areas of the first waterproof paper and the second waterproof paper are both larger than the area of the ceramic sheet.
Preferably, the area of the ceramic plate is larger than the area of the hole surface of the hollow hole.
Preferably, the waterproof paper and hollow hole structures include circles, squares, rectangles and parallelograms.
The silver plating method for the ceramic chip is based on the silver plating structure for the ceramic chip, and comprises the following steps of:
Selecting a ceramic plate, placing the ceramic plate on one side of a first waterproof paper of the waterproof paper, aligning the lower edge of one side of the ceramic plate with a fold line on the first waterproof paper, and pressing the ceramic plate on a hollow hole of the first waterproof paper;
Folding the second waterproof paper along the central line, and aligning the folding line on the second waterproof paper with the upper edge of one side of the ceramic plate;
pressing the second waterproof paper onto the ceramic sheet so that the second waterproof paper overlaps the first waterproof paper; wherein the hollow holes of the first waterproof paper and the second waterproof paper correspond to the positions of the ceramic plates;
Dipping silver paste by using a brushing workpiece, and uniformly smearing the silver paste on ceramic plates in hollow holes of the first waterproof paper and the second waterproof paper to form silver plating surfaces;
And after silver paste on two sides of the ceramic sheet is coated, drying the waterproof sheet with the silver paste ceramic sheet at a certain temperature, taking the ceramic sheet out of the waterproof sheet after the silver plating surface of the ceramic is dried, calcining the ceramic sheet at a high temperature, and naturally cooling the ceramic sheet after the calcining is finished to finish silver plating.
Preferably, the waterproof sheet 1 with the silver paste ceramic sheet is dried for 6 to 12 hours at 60 to 80 ℃.
Preferably, the ceramic sheet is calcined at 700-800 ℃ for 2-4 hours.
Compared with the prior art, the invention has the following beneficial technical effects:
The invention provides a silver plating structure for ceramic plates, which is characterized in that the ceramic plates are placed in waterproof paper, the waterproof paper is provided with a central line at the symmetrical central position, and the central line divides the waterproof paper into a first waterproof paper and a second waterproof paper; the first waterproof paper and the second waterproof paper on two sides of the central line are respectively provided with folding lines in parallel, the distance between the two folding lines corresponds to the thickness of the ceramic sheet, so that the thickness of the ceramic sheet is effectively controlled in the silver plating process, and hollow holes are respectively arranged on the first waterproof paper and the second waterproof paper by taking the central line as a symmetrical axis; the ceramic plate is placed on the first waterproof paper and pressed on the hollow hole, and the size of the hollow hole corresponds to the silver plating area required in the ceramic plate, so that the silver plating area of the ceramic plate can be regulated and controlled conveniently.
Furthermore, the waterproof paper is plastic paper, glass paper or waxed paper, plays a supporting role in silver plating of the ceramic sheet, and can effectively prevent uneven plating caused by silver and liquid penetrating into the paper.
Further, the distance between the folding lines on the first waterproof paper and the second waterproof paper corresponds to the thickness of the ceramic plate, so that the thickness of the ceramic plate is effectively controlled in the silver plating process, and the silver plating efficiency and quality are improved.
Further, the size of the hole surface of the hollow hole corresponds to the size of the silver plating area of the ceramic plate, so that the silver plating area of the ceramic plate can be regulated and controlled conveniently.
Further, the areas of the first waterproof paper and the second waterproof paper are larger than the area of the ceramic plate, so that the ceramic plate can be completely wrapped by the first waterproof paper and the second waterproof paper, and silver plating is facilitated.
Further, the area of the ceramic plate is larger than the area of the hole surface of the hollow hole, silver plating can be conveniently carried out on the ceramic plate through the hollow hole, a plurality of hollow holes can be formed in the first waterproof paper and the second waterproof paper, the coverage area of the plurality of hollow holes is smaller than that of the ceramic plate, silver plating work can be conveniently carried out on the ceramic plate, and silver plating efficiency is improved.
Further, the structure of waterproof paper and hollow hole includes circular, square, rectangle and parallelogram for waterproof paper and hollow hole's structure can more demand carry out nimble use, has improved the practicality.
A method for plating silver on ceramic chip uses plastic paper, glass paper, wax paper and other low-cost materials as raw materials, uses geometric symmetry method and hollow design with controllable size to obtain a hollow structure, matches the silver plating area of ceramic with the hollow structure, does not need silver spraying, silver dipping, printing, electroplating and coating, and only adopts a smearing method to complete silver plating through calcining in air atmosphere, and the silver plating area is adjustable and applicable to ceramics with various specifications and types, thereby ensuring that the silver plating step of ceramics is simple and the silver plating is low in cost.
Drawings
FIG. 1 is a schematic diagram of a silver plating structure for a ceramic wafer in accordance with the present invention;
FIG. 2 is a front view of a ceramic wafer in a silver plated configuration in accordance with the present invention;
fig. 3 is a schematic structural view of a ceramic sheet wrapped with waterproof paper after being folded in half;
fig. 4 is a side view of a ceramic sheet wrapped with waterproof paper in the present invention after being folded in half.
FIG. 5 is a schematic design diagram of a square ceramic silver plating apparatus for plating silver on round ceramics according to example 1 of the present invention;
FIG. 6 is a schematic design diagram of a square ceramic silver plating apparatus for silver plating of a square ceramic according to embodiment 2 of the present invention;
FIG. 7 is a schematic diagram showing a circular ceramic silver plating apparatus according to example 3 of the present invention for circular ceramic silver plating;
fig. 8 is a schematic design diagram of a circular ceramic silver plating apparatus for silver plating of square ceramics in example 4 of the present invention.
In the figure: 1-waterproof paper; 2-center line; 3-hollow holes; 4-folding lines; 5-ceramic plates; 11-a first water-repellent paper; 12-second waterproof paper.
Detailed Description
In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The invention is described in further detail below with reference to the attached drawing figures:
the invention aims to provide a silver plating structure for a ceramic wafer and a silver plating method for the ceramic wafer, so as to solve the technical problems that the silver plating step is complicated, and the silver plating area and the silver plating thickness of the ceramic cannot be regulated and controlled in the prior art.
Specifically, according to fig. 1, 2, 3 and 4, the present invention provides a silver plating structure for ceramic sheets, comprising a waterproof paper 1 and a ceramic sheet 5 silver-plated with the waterproof paper 1; a central line 2 is arranged at the symmetrical central position of the waterproof paper 1, the central line 2 divides the waterproof paper 1 into a first waterproof paper 11 and a second waterproof paper 12 in a bisection way, the central line 2 is taken as a symmetrical axis, fold lines 4 are respectively arranged on the first waterproof paper 11 and the second waterproof paper 12 at two sides of the central line 2 in parallel, and hollow holes 3 are respectively arranged on the first waterproof paper 11 and the second waterproof paper 12 by taking the central line 2 as a symmetrical axis; the ceramic sheet 5 is placed on the first waterproof paper 11 and pressed on the hollow hole 3, and one side of the ceramic sheet 5, which is close to the fold line 4, is aligned with the fold line 4.
Specifically, the waterproof paper 1 is plastic paper, cellophane or waxed paper and is used as a supporting material for ceramic silver plating, and the waterproof paper can effectively prevent uneven plating caused by silver and liquid penetrating into the paper.
Specifically, the distance between the fold lines 4 on the first and second waterproof papers 11 and 12 corresponds to the thickness of the ceramic sheet 5.
Specifically, the hole surface size of the hollow hole 3 corresponds to the silver plating area size of the ceramic sheet 5.
Specifically, the areas of the first and second waterproof papers 11 and 12 are each larger than the area of the ceramic sheet 5.
Specifically, the area of the ceramic sheet 5 is larger than the area of the hole surface of the hollow hole 3.
Specifically, the structures of the waterproof paper 1 and the hollow hole 3 include a circle, a square, a rectangle, and a parallelogram.
In the invention, the center line is positioned at the symmetrical axis of the waterproof paper 1 and is used for positioning the hollow structure and the folding line;
The hollow hole is the hollow part of size determination and adjustable size, is located inside the main part, and the shape of hollow hole 3 can be adjusted according to ceramic silvering area, and hollow hole 3 uses central line 2 as the symmetry axis and divides waterproof paper 1 into two symmetrical parts, namely first waterproof paper 11 and second waterproof paper 12, and hollow hole 3 symmetric distribution is in first waterproof paper 11 and second waterproof paper 12, and hollow hole 3 appears in pairs with central line 2 as the symmetry axis for expose ceramic silvering area, and ceramic exposure area is used for silvering.
The fold lines 4 are base lines of the waterproof paper 1 folded by taking the central line 2 as a symmetry axis, the fold lines 4 are positioned on the surface of the waterproof paper 1, the fold lines are arranged in pairs by taking the central line 2 as the symmetry axis, the distance between the fold lines 4 and the central line 2 is one half of the thickness of the ceramic sheet 5, and the distance between the fold lines 4 arranged in pairs is equal to the thickness of the ceramic sheet 5.
The hollow holes 3 are hollowed out on the first waterproof paper 11 and the second waterproof paper 12 according to silver plating areas by adopting devices such as a paper knife, scissors and a puncher, and the hollow holes 3 are arranged on the main body in pairs by taking the central line 2 as a symmetrical axis.
The shape of the hollow hole 3 comprises a circle, a square, a rectangle and a parallelogram, the area of the hollow hole is equal to the silver plating area of the ceramic, and the area range is 1mm 2～314mm2.
The distance between the fold line 4 and the central line 2 is determined according to the thickness of the ceramic sheet 5, the distance between the fold line 4 and the central line 2 is one half of the thickness of the ceramic sheet 5, the distance between the fold lines 4 appearing in pairs is equal to the thickness of the ceramic sheet 5, and the thickness of the ceramic sheet 5 ranges from 0.1mm to 1.0mm
The invention also provides a silver plating method for the ceramic wafer, which is based on the silver plating structure for the ceramic wafer and comprises the following steps:
Selecting a ceramic sheet 5, placing the ceramic sheet 5 on one side of the first waterproof paper 11 of the waterproof paper 1, aligning the lower edge of one side of the ceramic sheet 5 with the fold line 4 on the first waterproof paper 11, and pressing the ceramic sheet on the hollow hole 3 of the first waterproof paper 11;
Folding the second waterproof paper 12 in half along the central line 2, and aligning the fold line 4 on the second waterproof paper 12 with the upper edge of one side of the ceramic sheet 5;
Pressing the second waterproof paper 12 against the ceramic sheet 5 so that the second waterproof paper 12 overlaps the first waterproof paper 11; wherein the hollow holes 3 of the first waterproof paper 11 and the second waterproof paper 12 correspond to the positions of the ceramic plates 5;
dipping silver paste by using a brushing workpiece, and uniformly brushing the silver paste on the ceramic plates 5 in the hollow holes 3 of the first waterproof paper 11 and the second waterproof paper 12 to form silver plating surfaces;
after silver paste on two sides of the ceramic piece 5 is coated, the waterproof piece 1 with the silver paste ceramic piece 5 is dried at a certain temperature, after the silver plating surface of the ceramic is dried, the ceramic piece 5 is taken out of the waterproof piece 1, the ceramic piece 5 is calcined at a high temperature, and after the calcination is finished, the ceramic piece 5 is naturally cooled, so that silver plating is finished.
Specifically, the waterproof sheet 1 with the silver paste ceramic sheet 5 is dried for 6 to 12 hours at the temperature of 60 to 80 ℃.
Specifically, the ceramic sheet is placed at 700-800 ℃ and calcined for 2-4 hours.
Examples
The ceramic silver plating device and method and the beneficial effects thereof are further explained and illustrated by the provision of a plurality of embodiments.
The embodiment is based on the ceramic silver plating device, and by respectively detecting lead-containing ceramic PbTiO 3, lead-free ceramic BaTiO 3, pressure-resistant ceramic Al 2O3 and pressure-sensitive ceramic ZnO at 20 ℃, wherein the ceramics are disc-shaped, the specification of the ceramics is 0.8mm thick and the area is 314mm 2, the square ceramic silver plating device is used for plating silver on round ceramics, the silver plating area is 12.56mm 2, and the silver plating thickness is 0.1mm, the invention can achieve the preset aim, ensure the bonding property and the thickness consistency of silver plating layers, and simultaneously test the breakdown field strength (BDS) of samples, which corresponds to the embodiments 1-4.
Example 1
Silver plating is carried out by adopting a lead-containing ceramic PbTiO3 sample, and as shown in FIG. 5, a design schematic diagram of a square ceramic silver plating device is used for circular ceramic silver plating; placing the ceramic sheet 5 on one side of the first waterproof paper 11 of the waterproof paper 1, aligning the lower edge of one side of the ceramic sheet 5 with the fold line 4 on the first waterproof paper 11, and pressing the ceramic sheet on the hollow hole 3 of the first waterproof paper 11;
Folding the second waterproof paper 12 in half along the central line 2, and aligning the fold line 4 on the second waterproof paper 12 with the upper edge of one side of the ceramic sheet 5;
Pressing the second waterproof paper 12 against the ceramic sheet 5 so that the second waterproof paper 12 overlaps the first waterproof paper 11; wherein the hollow holes 3 of the first waterproof paper 11 and the second waterproof paper 12 correspond to the positions of the ceramic plates 5;
dipping silver paste by using a brushing workpiece, and uniformly brushing the silver paste on the ceramic plates 5 in the hollow holes 3 of the first waterproof paper 11 and the second waterproof paper 12 to form silver plating surfaces;
after silver paste on two sides of the ceramic piece 5 is coated, the waterproof piece 1 with the silver paste ceramic piece 5 is dried at a certain temperature, after the silver plating surface of the ceramic is dried, the ceramic piece 5 is taken out of the waterproof piece 1, the ceramic piece 5 is calcined at a high temperature, and after the calcination is finished, the ceramic piece 5 is naturally cooled, so that silver plating is finished.
Samples of lead-containing ceramic PbTiO 3 were evaluated for silver coating adhesion, thickness uniformity and BDS.
The results obtained are shown in tables 1 to 3.
Example 2
This example is different from example 1 in that silver plating is performed by using a lead-free ceramic BaTiO 3 sample, as shown in fig. 6, a schematic design diagram of a square ceramic silver plating apparatus is used for silver plating of square ceramics; and the silver plating layer was evaluated for bondability, thickness uniformity and BDS.
The results obtained are shown in tables 1 to 3.
Example 3
This example differs from example 1 in that a pressure-resistant ceramic Al 2O3 sample was used for silver plating, as shown in fig. 7, a schematic design diagram of a circular ceramic silver plating apparatus for circular ceramic silver plating; and the silver plating layer was evaluated for bondability, thickness uniformity and BDS.
The results obtained are shown in tables 1 to 3.
Example 4
This example differs from example 1 in that silver plating was performed using a pressure sensitive ceramic ZnO sample, as shown in fig. 8, a schematic design of a circular ceramic silver plating apparatus for square ceramic silver plating. And the silver plating layer was evaluated for bondability, thickness uniformity and BDS.
The results obtained are shown in tables 1 to 3.
TABLE 1 silver plating bondability test results
Note that: 1. after the silver plating of the ceramic is finished, naturally waiting for ten days to carry out the binding detection, wherein the binding is judged by whether the silver plating layer falls off, the binding is poor when the silver plating layer falls off, and the binding is good when the silver plating layer does not fall off.
2. The non-falling off means that the silver plating area and thickness are changed. In examples 1 to 4, the silver plating area was kept at 12.56mm 2, and the silver plating thickness was kept at 0.1mm.
TABLE 2 silver plating thickness detection results
| Index (I) | Example 1 | Example 2 | Example 3 | Example 4 |
| Silver plating thickness 1 | 0.10 | 0.10 | 0.09 | 0.10 |
| Silver plating thickness 2 | 0.10 | 0.10 | 0.10 | 0.10 |
| Silver plating thickness 3 | 0.11 | 0.10 | 0.10 | 0.10 |
| Silver plating thickness 4 | 0.09 | 0.11 | 0.10 | 0.11 |
| Silver plating thickness 5 | 0.10 | 0.10 | 0.10 | 0.11 |
| Average value of silver plating thickness | 0.10 | 0.10 | 0.10 | 0.10 |
| Standard deviation of | 0.0063 | 0.0040 | 0.0040 | 0.0049 |
| Relative standard deviation | 0.063 | 0.039 | 0.041 | 0.047 |
Note that: 1. and after the silver plating of the ceramic is finished, measuring the thickness of the silver plating by adopting a vernier caliper.
TABLE 3 BDS detection results
| Index (I) | Example 1 | Example 2 | Example 3 | Example 4 |
| BDS results 1 | 215 | 99 | 1021 | 432 |
| BDS results 2 | 212 | 101 | 1019 | 430 |
| BDS results 3 | 210 | 102 | 1025 | 433 |
| BDS results 4 | 216 | 102 | 1017 | 429 |
| BDS results 5 | 217 | 101 | 1022 | 436 |
| Mean value of BDS results | 214 | 102 | 1021 | 432 |
| Standard deviation of | 2.61 | 1.96 | 2.71 | 2.45 |
| Relative standard deviation | 0.012 | 0.019 | 0.0026 | 0.0057 |
Note that: and immediately detecting the BDS of the ceramic by adopting a ferroelectric tester after the silver plating thickness of the ceramic is detected.
As can be seen from examples 1 to 4, the ceramic silver plating device of the invention is used for completing the detection of ceramic silver plating and the combination thereof, silver plating thickness and BDS, and the results show that the device has higher accuracy and lower deviation degree. After silver plating of four typical ceramic samples, the silver plating has a shedding phenomenon, which indicates that the silver plating has better combination property by adopting the device and the method. As can be seen from silver plating thickness detection results, the standard deviation and the relative standard deviation are respectively smaller than 0.010 and 0.10, and the results show that the silver plating thickness is uniform by adopting the device and the method, and the requirement of uniform silver plating thickness can be met. The standard deviation and the relative standard deviation of the BDS detection results are respectively smaller than 3 and 0.05, which indicates that the BDS test can achieve the aims of improving the accuracy of the ceramic BDS detection results and reducing the deviation degree of the results after silver plating is completed by adopting the device and the method.
According to the embodiment and the comparison of the detection results, the ceramic silver plating device and the method provided by the invention can realize the aims that the silver plating area is adjustable and is suitable for various ceramics, the ceramics are simple and low-cost silver plating can be realized, the accuracy of the ceramic BDS detection results can be improved, and the deviation degree of the results can be reduced.
Finally, it should be noted that: the above embodiments are only for illustrating the technical aspects of the present invention and not for limiting the same, and although the present invention has been described in detail with reference to the above embodiments, it should be understood by those of ordinary skill in the art that: modifications and equivalents may be made to the specific embodiments of the invention without departing from the spirit and scope of the invention, which is intended to be covered by the claims.
Claims (10)
1. A silver plating structure for ceramic plates, which is characterized by comprising waterproof paper (1) and ceramic plates (5) plated with the waterproof paper (1); a central line (2) is arranged at the symmetrical central position of the waterproof paper (1), the central line (2) divides the waterproof paper (1) into a first waterproof paper (11) and a second waterproof paper (12) in a flat way, the central line (2) is taken as a symmetrical axis, folding lines (4) are respectively arranged in parallel on the first waterproof paper (11) and the second waterproof paper (12) at two sides of the central line (2), and hollow holes (3) are respectively arranged on the first waterproof paper (11) and the second waterproof paper (12) by taking the central line (2) as the symmetrical axis; the ceramic sheet (5) is placed on the first waterproof paper (11) and pressed on the hollow hole (3), and one side, close to the fold line (4), of the ceramic sheet (5) is aligned with the fold line (4).
2. A silver plating construction for ceramic wafers according to claim 1, characterized in that the water-resistant paper (1) is plastic paper, cellophane or waxed paper.
3. A silver plating construction for ceramic wafers according to claim 1, characterized in that the distance between the fold lines (4) on the first and second water-repellent papers (11, 12) corresponds to the thickness of the ceramic wafer (5).
4. A silver plating construction for ceramic wafers according to claim 1, characterized in that the hole surface size of the hollow holes (3) corresponds to the silver plating area size of the ceramic wafers (5).
5. A silver plating construction for ceramic wafers according to claim 1, characterized in that the areas of the first and second water-repellent papers (11, 12) are each larger than the area of the ceramic wafer (5).
6. A silver plating construction for ceramic wafers according to claim 1, characterized in that the area of the ceramic wafer (5) is larger than the area of the aperture face of the hollow aperture (3).
7. A silver plating construction for ceramic wafers according to claim 1, characterized in that the construction of the waterproof paper (1) and hollow holes (3) comprises circles, squares, rectangles and parallelograms.
8. A method for silver plating of ceramic wafers, based on a silver plating structure for ceramic wafers according to any one of claims 1 to 7, characterized by comprising the steps of:
Selecting a ceramic sheet (5), placing the ceramic sheet (5) on one side of a first waterproof paper (11) of the waterproof paper (1), aligning the lower edge of one side of the ceramic sheet (5) with a fold line (4) on the first waterproof paper (11), and pressing the ceramic sheet on a hollow hole (3) of the first waterproof paper (11);
Folding the second waterproof paper (12) in half along the central line (2), and aligning the fold line (4) on the second waterproof paper (12) with the upper edge of one side of the ceramic sheet (5);
Pressing the second water-repellent paper (12) against the ceramic sheet (5) so that the second water-repellent paper (12) overlaps the first water-repellent paper (11); wherein the hollow holes (3) of the first waterproof paper (11) and the second waterproof paper (12) correspond to each other in the position of the ceramic sheet (5);
dipping silver paste by using a brushing workpiece, and uniformly smearing the silver paste on ceramic plates (5) in hollow holes (3) of the first waterproof paper (11) and the second waterproof paper (12) to form silver plating surfaces;
After silver paste on two sides of the ceramic piece (5) is coated, the waterproof piece (1) with the silver paste ceramic piece (5) is dried at a certain temperature, after the silver plating surface of the ceramic is dried, the ceramic piece (5) is taken out of the waterproof piece (1), then the ceramic piece (5) is calcined at a high temperature, and after the calcination is finished, the ceramic piece (5) is naturally cooled, so that silver plating is finished.
9. A method for silver plating of ceramic wafers according to claim 1, characterized in that the water-proof wafer 1 with the silver paste ceramic wafer (5) is dried for 6-12 h at 60-80 ℃.
10. A method for silver plating of ceramic wafers according to claim 1, characterized in that the ceramic wafer (5) is calcined at 700-800 ℃ for 2-4 hours.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211399900.9A CN118005428B (en) | 2022-11-09 | 2022-11-09 | Silver plating structure for ceramic wafer and silver plating method for ceramic wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211399900.9A CN118005428B (en) | 2022-11-09 | 2022-11-09 | Silver plating structure for ceramic wafer and silver plating method for ceramic wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN118005428A true CN118005428A (en) | 2024-05-10 |
| CN118005428B CN118005428B (en) | 2025-11-11 |
Family
ID=90957062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211399900.9A Active CN118005428B (en) | 2022-11-09 | 2022-11-09 | Silver plating structure for ceramic wafer and silver plating method for ceramic wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118005428B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5563764A (en) * | 1993-12-24 | 1996-10-08 | Ngk Spark Plug Co., Ltd. | Ceramic substrate having lower electrode for forming thin-film condenser |
| CN103633238A (en) * | 2013-11-20 | 2014-03-12 | 常州波速传感器有限公司 | Continuous silver printing method for side faces and fronts of ceramic wafers |
| CN106004198A (en) * | 2016-05-27 | 2016-10-12 | 福建省德化县锦福陶瓷有限公司 | Manufacturing method for pottery or porcelain with silver decorations |
| CN111253173A (en) * | 2020-03-19 | 2020-06-09 | 南京以太通信技术有限公司 | Method for manufacturing electrode by coating shielding |
| CN112159253A (en) * | 2020-09-26 | 2021-01-01 | 深圳市海里表面技术处理有限公司 | Resistance ceramic silver plating process for 5G communication and ceramic chip |
| CN114105683A (en) * | 2021-12-06 | 2022-03-01 | 无锡市高宇晟新材料科技有限公司 | Silver coating tool and silver coating method for communication ceramic device |
-
2022
- 2022-11-09 CN CN202211399900.9A patent/CN118005428B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5563764A (en) * | 1993-12-24 | 1996-10-08 | Ngk Spark Plug Co., Ltd. | Ceramic substrate having lower electrode for forming thin-film condenser |
| CN103633238A (en) * | 2013-11-20 | 2014-03-12 | 常州波速传感器有限公司 | Continuous silver printing method for side faces and fronts of ceramic wafers |
| CN106004198A (en) * | 2016-05-27 | 2016-10-12 | 福建省德化县锦福陶瓷有限公司 | Manufacturing method for pottery or porcelain with silver decorations |
| CN111253173A (en) * | 2020-03-19 | 2020-06-09 | 南京以太通信技术有限公司 | Method for manufacturing electrode by coating shielding |
| CN112159253A (en) * | 2020-09-26 | 2021-01-01 | 深圳市海里表面技术处理有限公司 | Resistance ceramic silver plating process for 5G communication and ceramic chip |
| CN114105683A (en) * | 2021-12-06 | 2022-03-01 | 无锡市高宇晟新材料科技有限公司 | Silver coating tool and silver coating method for communication ceramic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN118005428B (en) | 2025-11-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0495035B1 (en) | Method of applying metallized contacts to a solar cell | |
| EP0362404B1 (en) | Method of producing laminated ceramic electronic parts | |
| CN114105651B (en) | Manufacturing method of pyroelectric ultrathin ceramic chip and application of pyroelectric ultrathin ceramic chip to sensor | |
| CN118005428B (en) | Silver plating structure for ceramic wafer and silver plating method for ceramic wafer | |
| KR20170066370A (en) | Method for manufacturing electronic circuit substrate, and electronic circuit substrate obtained thereby | |
| CN107658230A (en) | A kind of regulation and control method of ceramic chips and ltcc substrate surface roughness | |
| JP2007051969A (en) | Method and apparatus for positioning columnar structure | |
| CN210995071U (en) | Fixing platform for thin and flexible film substrate | |
| US5563764A (en) | Ceramic substrate having lower electrode for forming thin-film condenser | |
| CN112530695A (en) | Ceramic chip in multilayer ceramic capacitor and preparation method thereof | |
| CN107172820A (en) | The method that the copper-clad plates of 2.2≤Dk ＜ 6.5 are made using ion implanting plating mode | |
| JP2001230306A (en) | Ceramic substrate | |
| JPS6351396B2 (en) | ||
| JP7429516B2 (en) | Ceramic sheet and its manufacturing method | |
| CN100446873C (en) | Surface coating device and soaking paint method for chip elements | |
| CN111540688B (en) | Preparation method for metalizing side wall of LTCC substrate and LTCC substrate | |
| CN115431201A (en) | Manufacturing method of LTCC component side printing clamp and clamp | |
| CN106158183B (en) | Chip component preparation method and chip component | |
| CN221387249U (en) | Spin coating glue leveling fixture and semiconductor spin coating glue leveling equipment including the fixture | |
| CN100484643C (en) | Method for coating plate parts surface | |
| CN115188859B (en) | Method for printing coating and solar cell | |
| CN114390733A (en) | Ceramic heater | |
| CN218495020U (en) | C-type electrode sheet type thin film igniter | |
| CN102468296A (en) | Application of 99.6% alumina ceramic film substrate | |
| CN114835512B (en) | High-reliability small-size sapphire Mo-Mn metallization method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |