[go: up one dir, main page]

CN117812849A - An anti-deformation graphics card integrated circuit board and its preparation process - Google Patents

An anti-deformation graphics card integrated circuit board and its preparation process Download PDF

Info

Publication number
CN117812849A
CN117812849A CN202410204040.1A CN202410204040A CN117812849A CN 117812849 A CN117812849 A CN 117812849A CN 202410204040 A CN202410204040 A CN 202410204040A CN 117812849 A CN117812849 A CN 117812849A
Authority
CN
China
Prior art keywords
spraying
value
integrated circuit
circuit board
historical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202410204040.1A
Other languages
Chinese (zh)
Other versions
CN117812849B (en
Inventor
蒋世俊
李春旺
廖雪平
刘壹顺
饶瑶
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beilide Electronic Technology Shenzhen Co ltd
Original Assignee
Beilide Electronic Technology Shenzhen Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beilide Electronic Technology Shenzhen Co ltd filed Critical Beilide Electronic Technology Shenzhen Co ltd
Priority to CN202410204040.1A priority Critical patent/CN117812849B/en
Publication of CN117812849A publication Critical patent/CN117812849A/en
Application granted granted Critical
Publication of CN117812849B publication Critical patent/CN117812849B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3465—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention relates to the technical field of preparation of display card integrated circuit boards, and provides a preparation process of an anti-deformation display card integrated circuit board, which comprises the following steps: carrying out chemical etching, copper coating and drilling on the surface of the display card integrated circuit board; carrying out pad spraying on the display card integrated circuit board to obtain a spraying area; comprising the following steps: acquiring a spraying state of the tin-lead alloy, and acquiring the spraying coverage rate of the tin-lead alloy based on the spraying state; acquiring a display card integrated circuit board with qualified spraying coverage, setting spraying parameters based on a spraying contact angle data model, spraying a spraying region, completing spraying work, calculating a wetting value of the spraying region, and comparing the wetting value with a wetting threshold; and coating printing soldering paste on a bonding pad of the display card integrated circuit board, and then placing the printed soldering paste in reflow soldering equipment to heat and cool the soldering paste to obtain the display card integrated circuit board.

Description

Anti-deformation display card integrated circuit board and preparation process thereof
Technical Field
The invention relates to the technical field of preparation of display card integrated circuit boards, in particular to a deformation-resistant display card integrated circuit board and a preparation process thereof.
Background
The integrated circuit board of the display card, also called as the PCB board of the display card, is the circuit board of the display card, similar to the PCB board of the main board. It is responsible for connecting other components on the graphics card, similar to the action of a motherboard. The display card integrated circuit board mainly comprises a display chip, a display memory, a power supply module and the like;
in the preparation process of the display card integrated circuit board, spraying plating is required to be carried out on a designated area on the surface of the display card integrated circuit board, then tin paste is coated, small electronic components such as a plug-in capacitor, a resistor and the like are attached to the display card integrated circuit board, then the electronic components enter a welding furnace, and pins of the miniature electronic components are firmly welded on the display card integrated circuit board in a reflow soldering mode;
in the process of welding the pins of the electronic components, the pins of the electronic components are welded on the spraying coating area on the surface of the display card integrated circuit board through solder paste, and the area size and the spraying coating thickness of the spraying coating area on the surface of the display card integrated circuit board are important factors influencing the connection of the pins of the electronic components and the display card integrated circuit board, so that the area size and the spraying coating thickness of the spraying coating area on the surface of the display card integrated circuit board are required to be accurately and effectively controlled in the preparation process of the display card integrated circuit board, and the welding stability of the pins of the electronic components and the display card integrated circuit board in the subsequent preparation process is better ensured.
Disclosure of Invention
The invention aims to provide an anti-deformation display card integrated circuit board and a preparation process thereof, so as to solve the problems in the background.
The aim of the invention can be achieved by the following technical scheme:
a preparation process of a deformation-resistant display card integrated circuit board comprises the following steps:
step one: carrying out chemical etching, copper coating and drilling on the surface of the display card integrated circuit board;
step two: carrying out pad spraying on the display card integrated circuit board to obtain a spraying area; comprising the following steps:
a1: acquiring a spraying state of the tin-lead alloy, acquiring the spraying coverage rate of the tin-lead alloy based on the spraying state, and marking the obtained product as PF;
a2: judging whether the spraying coverage PF is in a preset spraying coverage value range [ PFx, PFy ]; wherein PFx is less than 1 and less than PFy;
if the spraying coverage rate PF is smaller than a preset spraying coverage rate value PFx, a spraying coverage rate failure signal is obtained;
if the spraying coverage PF is larger than a preset spraying coverage value PFx, a spraying coverage exceeding signal is obtained;
if the spraying coverage PF is in a preset spraying coverage value range [ PFx, PFy ], the spraying coverage is qualified, and a spraying area with qualified spraying coverage is obtained;
a3: acquiring a display card integrated circuit board with qualified spraying coverage rate, setting spraying parameters based on a spraying contact angle data model, spraying a spraying region, completing spraying work, acquiring a spraying thickness value of the spraying region, marking as PH, calculating to acquire a spraying contact angle value JC, simultaneously acquiring a spraying temperature value PW, calculating to acquire a wetting value of the spraying region, and marking as RS;
a4: comparing the wetness value RS with a wetness threshold RSy;
if the wetting value RS is smaller than the wetting threshold RSy, generating a spraying failure signal;
if the wetting value RS is larger than or equal to the wetting threshold RSy, generating a spraying qualified signal;
step three: and coating printing soldering paste on a bonding pad of the display card integrated circuit board, and then placing the printed soldering paste in reflow soldering equipment to heat and cool the soldering paste to obtain the display card integrated circuit board.
As a further scheme of the invention: the deposition parameters include a deposition time value Tp, a deposition pressure value Py, and a deposition temperature value PW.
As a further scheme of the invention: acquiring historical spraying coverage rate and spraying distance values, and marking as PLf and Jf respectively;
by fitting the historical deposition coverage PLf and deposition distance value Jf to the equation of the impact of deposition coverage to deposition distanceThe deposition distance influence coefficient a and the deposition coverage correction factor b are calculated and obtained.
As a further scheme of the invention: if the spray coverage exceeds the standard signal or the spray coverage does not reach the standard signal is obtained, the spray coverage is adjusted based on an influence relation formula of the spray coverage and the spray coverage.
As a further scheme of the invention: the construction mode of the thermal spraying contact angle data model is as follows:
s1: acquiring historical spraying data at a spraying distance JF under the condition that the spraying area is qualified;
s2: acquiring historical spraying parameters in a state that the wettability value of a spraying area in the historical spraying data is qualified, wherein the parameters comprise a historical spraying time value Tps and a historical spraying pressure value Pys; simultaneously, acquiring a historical spraying thickness value PHs under the historical spraying parameters; calculating to obtain a spraying time influence coefficient m, a spraying pressure influence coefficient n and a spraying thickness correction factor f;
s3: acquiring a historical spray thickness value PHs and a historical spray contact angle value JCs when the historical spray thickness value PHs are obtained from the historical spray data; calculating to obtain an influence coefficient u of the spraying contact angle and a spraying contact angle correction factor v;
s4: obtaining a spray contact angle value based on the spray time influence coefficient m, the spray pressure influence coefficient n, the spray thickness correction factor f, the spray contact angle influence coefficient u, and the spray contact angle correction factor v:。
as a further scheme of the invention: s2: fitting the historical deposition time values Tps, the historical deposition pressure values Pys, and the historical deposition thickness values PHs toAnd calculating to obtain a spraying time influence coefficient m, a spraying pressure influence coefficient n and a spraying thickness correction factor f.
As a further scheme of the invention: s3: historical deposition contact angle values JCs for historical deposition thickness values PHs and PHs are fit to the formulaAnd calculating to obtain a spraying contact angle influence coefficient u and a spraying contact angle correction factor v between the spraying contact angle and the spraying thickness.
As a further scheme of the invention: the wettability value RS of the deposition region is calculated from the deposition contact angle value JC and the deposition temperature PW: wherein,h is the thermal spraying temperature influence coefficient.
As a further scheme of the invention: if a spraying failure signal is obtained: the deposition data is adjusted to adjust the deposition temperature RS and/or the deposition contact angle value JC.
The anti-deformation display card integrated circuit board is prepared by the preparation process.
The invention has the beneficial effects that:
according to the invention, the spray coating area on the display card integrated circuit board is detected, so that the qualification rate of the spray coating area is ensured, and the connection stability of pins of the electronic component and the spray coating area is further ensured when the solder paste is coated and welded; secondly, in the spraying process, the thickness of a tin-lead alloy layer sprayed in the spraying process is obtained, and the wettability is a decisive factor for determining the stability of welding of pins of subsequent electronic components and the spraying area because of the wettability of the spraying area determined by the spraying thickness, so that the wettability of the whole spraying area needs to be ensured, and the spraying layer qualified in spraying can be obtained through calculating the wettability threshold value, so that the stability of subsequent tin paste in the welding process is further ensured.
Drawings
The invention is further described below with reference to the accompanying drawings.
FIG. 1 is a schematic illustration of a preparation process flow of the present invention;
FIG. 2 is a schematic diagram of a spray contact angle model construction flow in the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
Referring to fig. 1, the present invention is a process for preparing a deformation-resistant integrated circuit board of a graphics card, comprising:
step one: carrying out chemical etching, copper coating and drilling on the surface of the display card integrated circuit board;
step two: carrying out pad spraying on the display card integrated circuit board to obtain a spraying area; comprising the following steps:
a1: acquiring a spraying state of the tin-lead alloy, acquiring the spraying coverage rate of the tin-lead alloy based on the spraying state, and marking the obtained product as PF;
a2: judging whether the spraying coverage PF is in a preset spraying coverage value range [ PFx, PFy ]; wherein PFx is less than 1 and less than PFy;
if the spraying coverage rate PF is smaller than a preset spraying coverage rate value PFx, a spraying coverage rate failure signal is obtained;
if the spraying coverage PF is larger than a preset spraying coverage value PFx, a spraying coverage exceeding signal is obtained;
if the spraying coverage PF is in a preset spraying coverage value range [ PFx, PFy ], the spraying coverage is qualified, and a spraying area with qualified spraying coverage is obtained;
in the subsequent welding process of the pins of the electronic component and the display card integrated circuit, the pins and the spraying areas are required to be tightly welded and fixed through the solder paste, so that the spraying area is required to reach a preset standard, and the connection stability of the pins of the electronic component and the spraying areas can be effectively ensured when the solder paste is coated and welded;
a3: the method comprises the steps of obtaining a display card integrated circuit board with qualified spraying coverage rate, setting spraying parameters based on a spraying contact angle data model, spraying a spraying area, and completing spraying work, wherein the spraying parameters comprise a spraying time value Tp, a spraying pressure value Py and a spraying temperature value PW; obtaining a spraying thickness value of a spraying region, marking the spraying thickness value as PH, calculating a spraying contact angle value JC, simultaneously obtaining a spraying temperature value PW, calculating a wetting value of the spraying region, and marking the wetting value as RS;
a4: comparing the wetness value RS with a wetness threshold RSy;
if the wetting value RS is smaller than the wetting threshold RSy, generating a spraying failure signal;
if the wetting value RS is larger than or equal to the wetting threshold RSy, generating a spraying qualified signal; obtaining a spraying coating area with a qualified wetting value RS;
because the pins of the electronic components are welded with tin-lead alloy sprayed on the display card integrated circuit board through tin paste, the wettability of the sprayed area determines the main factor of the welding stability of the tin paste, if the wettability of the sprayed area is not good, the tin paste cannot be well attached to the sprayed area during welding, the phenomenon of poor welding such as cold welding and cold welding easily occurs, the use of the whole display card integrated circuit board is influenced, the qualification rate is reduced, and the sprayed area with good wettability can effectively improve the welding reliability, reduce welding defects, ensure the welding stability, and further improve the overall stability and qualification rate of the display card integrated circuit board;
step three: and coating printing soldering paste on a bonding pad of the display card integrated circuit board, and then placing the printed soldering paste in reflow soldering equipment to heat and cool the soldering paste to obtain the display card integrated circuit board.
In the preparation process of the display card integrated circuit board, the spraying data of the spraying area is obtained and detected by detecting the spraying area of the spraying coating of the tin-lead alloy, so that the coverage of the spraying area is ensured to meet the requirement, and the stability of the subsequent welding of the pins of the electronic components and the spraying area through the solder paste is ensured; further, the thickness of the tin-lead alloy layer sprayed in the spraying process is obtained, and the wettability is a decisive factor for determining the stability of welding of the pins of the subsequent electronic components and the spraying region because of the wettability of the spraying region determined by the spraying thickness, so that the wettability of the whole spraying region needs to be ensured, and the spraying qualified sprayed layer can be further obtained through calculating the wettability threshold value, so that the stability of the subsequent solder paste in the welding process is further ensured.
Example two
When spraying, the spraying distance has a certain influence on the spraying coverage rate, so when a spraying coverage rate exceeding signal or a spraying coverage rate not reaching signal is obtained, the spraying distance is adjusted based on an influence relation formula of the spraying coverage rate and the spraying distance;
the method for obtaining the influence relation formula of the spraying coverage rate and the spraying distance comprises the following steps:
acquiring historical spraying coverage rate and spraying distance values, and marking as PLf and Jf respectively;
by fitting the historical deposition coverage PLf and deposition distance value Jf to the equation of the impact of deposition coverage to deposition distanceCalculating to obtain a spraying distance influence coefficient a and a spraying coverage rate correction factor b;
if the spraying coverage rate is unqualified, the spraying coverage rate can be directly adjusted, so that the spraying coverage rate meets the standard, the wetting degree of the spraying area after the spraying is finished can better meet the requirement of solder paste welding, and the connection stability of the pins of the electronic component and the display card integrated circuit board is ensured.
Example III
Based on the embodiment, under the condition that the spraying coverage rate is qualified, the spraying parameters are required to be selected, so that the moisture of the spraying area is further ensured to be qualified; therefore, it is necessary to ensure accuracy of the deposition time, deposition pressure, and deposition temperature in the deposition process, and therefore, in the deposition process, a deposition contact angle data model is constructed for setting deposition parameters based on the history data; so that the wettability of the spraying area after the spraying is finished can better meet the requirements of solder paste welding;
specifically, the construction mode of the thermal spraying contact angle data model is as follows:
s1: acquiring historical spraying data at a spraying distance JF under the condition that the spraying area is qualified;
s2: acquiring historical spraying parameters in a state that the wettability value of a spraying area in the historical spraying data is qualified, wherein the parameters comprise a historical spraying time value Tps and a historical spraying pressure value Pys; simultaneously, acquiring a historical spraying thickness value PHs under the historical spraying parameters; calculating to obtain a spraying time influence coefficient m, a spraying pressure influence coefficient n and a spraying thickness correction factor f;
wherein the historical deposition time values Tps, the historical deposition pressure values Pys, and the historical deposition thickness values PHs are fit toCalculating to obtain a spraying time influence coefficient m, a spraying pressure influence coefficient n and a spraying thickness correction factor f;
s3: acquiring a historical spray thickness value PHs and a historical spray contact angle value JCs when the historical spray thickness value PHs are obtained from the historical spray data; calculating to obtain an influence coefficient u of the spraying contact angle and a spraying contact angle correction factor v;
wherein the historical deposition contact angle values JCs for the historical deposition thickness values PHs and PHs are fit to the formulaCalculating to obtain a spraying contact angle influence coefficient u and a spraying contact angle correction factor v between the spraying contact angle and the spraying thickness;
s4: obtaining a spray contact angle value based on the spray time influence coefficient m, the spray pressure influence coefficient n, the spray thickness correction factor f, the spray contact angle influence coefficient u, and the spray contact angle correction factor v:。
the thermal spraying contact angle data model is a model for further calculating the contact property between the surface of the thermal spraying region and the solder paste liquid drop based on the thickness of the thermal spraying region; the spraying contact angle is the included angle between the surface of the spraying area and the solder paste liquid drop, and in the calculation of the spraying contact angle, the size of the spraying contact angle of the spraying area is inversely related to the spraying thickness under the condition that other factors are certain, so that the spraying thickness is in the range of a preset value, and the smaller the contact angle of the solder paste in the spraying area is, the better wettability is indicated;
further, after the spray contact angle is obtained, in the spray process, the influence of the spray temperature on the spray thickness of the spray region needs to be calculated;
therefore, in spraying the sprayed region, it is necessary to provide a spraying temperature value, a spraying time value, and a spraying pressure value based on the acceptable wettability value RS to ensure that the wettability of the sprayed region meets the spraying standard after the spraying is completed; the spraying efficiency of the display card integrated circuit board in the spraying process is further improved.
Example IV
Based on the above embodiment, after the deposition is performed by providing the deposition time and the deposition pressure by the deposition contact angle data model, it is necessary to detect the deposition region where the deposition is completed;
based on this, the following detection scheme is provided in this embodiment:
q1: obtaining a spraying thickness value of a spraying region, marking the spraying thickness value as PH, calculating to obtain a spraying contact angle value JC, simultaneously obtaining a spraying temperature value PW, and calculating to obtain a wetting value RS of the spraying region;
q2: comparing the wetness value RS with a wetness threshold RSy;
if the wetting value RS is smaller than the wetting threshold RSy, generating a spraying failure signal;
if the wetting value RS is larger than or equal to the wetting threshold RSy, generating a spraying qualified signal;
q3: if a spraying failure signal is obtained: adjusting the spraying data, and adjusting the spraying temperature RS and/or the spraying contact angle value JC;
specific: in the adjusting process, the spraying temperature RS is preferably selected and adjusted, and the spraying temperature can improve the wettability of tin-lead alloy in the spraying area in the spraying process; therefore, when the humidity value RS of the spraying area is unqualified, the spraying temperature value is preferentially adjusted, and because the spraying temperature can increase the humidity within a certain range, after the spraying temperature exceeds the temperature threshold value, the spraying material is easy to react or decompose, therefore, when the spraying temperature reaches the preset value, the humidity value still cannot reach the humidity threshold value standard, the spraying contact angle value JC is further adjusted, and the factor affecting the spraying contact angle value JC is the spraying thickness value, and the spraying time and the spraying pressure are determined for the spraying thickness, and therefore, after the spraying temperature is adjusted to the spraying temperature threshold value, the spraying thickness is increased by adopting a mode of adjusting the spraying pressure, and the spraying contact angle value is further increased, so that the humidity value of the spraying area meets the standard;
the reason why the deposition time and the deposition pressure are selectively adjusted when the deposition thickness is adjusted, and the deposition pressure is preferentially adjusted is that if the deposition time is selectively increased to increase the deposition thickness, the deposition rate is affected, and the rate of the graphics card integrated circuit board in the process of manufacturing is reduced.
Based on the feedback adjustment of the spraying temperature, spraying pressure or spraying time in the embodiment, calculating the wettability value of the sprayed area, if the qualified wettability value data is obtained, fitting the adjusted spraying pressure value, spraying time value and spraying temperature value into a spraying contact angle data model, re-verifying and constructing the spraying contact angle data model to update the accuracy of the whole spraying contact angle data model and ensure the accuracy of the spraying parameter determination in the subsequent spraying process; the qualification rate of the subsequent spraying process is better ensured;
the spray coating area on the display card integrated circuit board is detected to ensure the qualification rate of the spray coating area and further ensure the connection stability of pins of the electronic component and the spray coating area when the solder paste is coated and welded; secondly, in the spraying process, the thickness of a tin-lead alloy layer sprayed in the spraying process is obtained, and the wettability is a decisive factor for determining the stability of welding of pins of a subsequent electronic component and a spraying area because the spraying thickness determines the wettability of the spraying area, so that the wettability of the whole spraying area needs to be ensured, and a spraying layer qualified in spraying can be obtained through calculating a wetting threshold value, so that the stability of the subsequent solder paste in the welding process is further ensured;
secondly, after the spraying moisture value is unqualified, the spraying pressure value, the spraying time value and the spraying temperature value which are adjusted can be fitted into a spraying contact angle data model after the spraying area is adjusted, and the spraying contact angle data model is re-verified and constructed so as to update the accuracy of the whole spraying contact angle data model and ensure the accuracy of the spraying parameter determination in the follow-up spraying process; and the qualification rate of the subsequent spraying process is better ensured.
Example five
The deformation-resistant display card integrated circuit board is prepared by the preparation process in the embodiment.
The foregoing describes one embodiment of the present invention in detail, but the description is only a preferred embodiment of the present invention and should not be construed as limiting the scope of the invention. All equivalent changes and modifications within the scope of the present invention are intended to be covered by the present invention.

Claims (10)

1.一种抗变形的显卡集成电路板的制备工艺，其特征在于，包括：1. A process for preparing a deformation-resistant integrated circuit board for a graphics card, characterized by comprising: 步骤一：对显卡集成电路板的表面进行化学刻蚀、覆铜和钻孔；Step 1: Carry out chemical etching, copper coating and drilling on the surface of the graphics card integrated circuit board; 步骤二：对显卡集成电路板进行焊盘喷镀获得喷镀区域；包括：Step 2: Perform pad spraying on the graphics card integrated circuit board to obtain the spraying area; including: A1：获取锡铅合金的喷镀状态，基于喷镀状态获取锡铅合金的喷镀覆盖率，并标记为PF；A1: Obtain the spraying state of the tin-lead alloy, obtain the spraying coverage of the tin-lead alloy based on the spraying state, and mark it as PF; A2：判断喷镀覆盖率PF是否处于预设喷镀覆盖率值域［PFx，PFy］内；其中，PFx＜1＜PFy；A2: Determine whether the spray coverage rate PF is within the preset spray coverage value range [PFx, PFy]; where, PFx<1<PFy; 若喷镀覆盖率PF小于预设喷镀覆盖率值PFx，则获得喷镀覆盖率未达标信号；If the sputtering coverage rate PF is less than the preset sputtering coverage rate value PFx, a signal that the sputtering coverage rate does not meet the standard is obtained; 若喷镀覆盖率PF大于预设喷镀覆盖率值PFx，则获得喷镀覆盖率超标信号；If the sputtering coverage rate PF is greater than the preset sputtering coverage rate value PFx, a signal that the sputtering coverage rate exceeds the standard is obtained; 若喷镀覆盖率PF在预设喷镀覆盖率值域［PFx，PFy］内，则表示喷镀覆盖率合格，得到喷镀覆盖率合格的喷镀区域；If the spraying coverage PF is within the preset spraying coverage value range [PFx, PFy], it means that the spraying coverage is qualified, and a spraying area with qualified spraying coverage is obtained; A3：获取喷镀覆盖率合格的显卡集成电路板，基于喷镀接触角度数据模型设置喷镀参数，对喷镀区域进行喷镀，完成喷镀工作，获得喷镀区域的喷镀厚度值并标记为PH，计算获得喷镀接触角度值JC，同时获取喷镀温度值PW，计算获得喷镀区域的润湿度值，并标记为RS；A3: Obtain the graphics card integrated circuit board with qualified spray coverage, set the spray parameters based on the spray contact angle data model, spray the spray area, complete the spray work, obtain the spray thickness value of the spray area and mark it is PH, calculate the sputtering contact angle value JC, and at the same time obtain the sputtering temperature value PW, calculate the humidity value of the sputtering area, and mark it as RS; A4：将润湿度值RS与润湿度阈值RSy进行比较；A4: Compare the humidity value RS with the humidity threshold RSy; 若润湿度值RS小于润湿度阈值RSy，则生成喷镀不合格信号；If the wettability value RS is less than the wettability threshold RSy, a sputtering failure signal is generated; 若润湿度值RS大于等于润湿度阈值RSy，则生成喷镀合格信号；得到润湿度值RS合格的喷镀区域；If the humidity value RS is greater than or equal to the humidity threshold RSy, a spraying qualified signal is generated; the spraying area with a qualified humidity value RS is obtained; 步骤三：在显卡集成电路板的焊盘上涂覆印刷焊膏，然后置于回流焊设备中，对焊膏进行加热和冷却，获得显卡集成电路板。Step 3: Coat the printed solder paste on the pad of the graphics card integrated circuit board, and then place it in the reflow soldering equipment to heat and cool the solder paste to obtain the graphics card integrated circuit board. 2.根据权利要求1所述的一种抗变形的显卡集成电路板的制备工艺，其特征在于，喷镀参数包括喷镀时间值Tp、喷镀压力值Py和喷镀温度值PW。2. The preparation process of an anti-deformation graphics card integrated circuit board according to claim 1, characterized in that the sputtering parameters include a sputtering time value Tp, a sputtering pressure value Py and a sputtering temperature value PW. 3.根据权利要求2所述的一种抗变形的显卡集成电路板的制备工艺，其特征在于，获取历史喷镀覆盖率和喷镀距离值，并分别标记为PLf和Jf；3. The preparation process of a deformation-resistant graphics card integrated circuit board according to claim 2, characterized in that historical spraying coverage and spraying distance values are obtained and marked as PLf and Jf respectively; 通过将历史喷镀覆盖率PLf和喷镀距离值Jf拟入至喷镀覆盖率与喷镀距离的影响关系公式中，计算获得喷镀距离影响系数a和喷镀覆盖率修正因子b。By incorporating the historical spraying coverage rate PLf and the spraying distance value Jf into the formula of the relationship between the spraying coverage rate and the spraying distance , the spraying distance influence coefficient a and the spraying coverage correction factor b are calculated. 4.根据权利要求3所述的一种抗变形的显卡集成电路板的制备工艺，其特征在于，若获得喷镀覆盖率超标信号或喷镀覆盖率未达标信号，则基于喷镀覆盖率与喷镀距离的影响关系公式，调整喷镀距离。4. The preparation process of a deformation-resistant graphics card integrated circuit board according to claim 3, characterized in that if a signal that the sputtering coverage rate exceeds the standard or a signal that the sputtering coverage rate does not meet the standard is obtained, then based on the spraying coverage rate and The influence relation formula of spraying distance, adjust the spraying distance. 5.根据权利要求4所述的一种抗变形的显卡集成电路板的制备工艺，其特征在于，喷镀接触角度数据模型的构建方式为：5. The preparation process of a deformation-resistant graphics card integrated circuit board according to claim 4, characterized in that the construction method of the sputtering contact angle data model is: S1：获取喷镀区域合格状态下，在喷镀距离Jf时的历史喷镀数据；S1: Obtain the historical spraying data at the spraying distance Jf when the spraying area is qualified; S2：获取历史喷镀数据中喷镀区域的润湿度值合格状态下的历史喷镀参数，包括历史喷镀时间值Tps和历史喷镀压力值Pys；同时，获取历史喷镀参数下的历史喷镀厚度值PHs；计算获得喷镀时间影响系数m、喷镀压力影响系数n和喷镀厚度修正因子f；S2: Obtain the historical spraying parameters when the humidity value of the spraying area in the historical spraying data is qualified, including the historical spraying time value Tps and the historical spraying pressure value Pys; at the same time, obtain the historical spraying parameters under the historical spraying parameters. Plating thickness value PHs; calculate the influence coefficient m of spraying time, the influence coefficient n of spraying pressure and the correction factor f of spraying thickness; S3：获取历史喷镀数据中的历史喷镀厚度值PHs及历史喷镀厚度值PHs时的历史喷镀接触角度值JCs；计算获得喷镀接触角度的影响系数u和喷镀接触角度修正因子v；S3: Obtain the historical spraying thickness value PHs in the historical spraying data and the historical spraying contact angle value JCs when the historical spraying thickness value PHs is used; calculate and obtain the influence coefficient u of the spraying contact angle and the spraying contact angle correction factor v ; S4：基于喷镀时间影响系数m、喷镀压力影响系数n和喷镀厚度修正因子f和喷镀接触角度影响系数u和喷镀接触角度修正因子v获得喷镀接触角度值：。S4: Obtain the spraying contact angle value based on the spraying time influence coefficient m, spraying pressure influence coefficient n, spraying thickness correction factor f, spraying contact angle influence coefficient u and spraying contact angle correction factor v: . 6.根据权利要求5所述的一种抗变形的显卡集成电路板的制备工艺，其特征在于，S2中：将历史喷镀时间值Tps、历史喷镀压力值Pys和历史喷镀厚度值PHs拟入至计算获得喷镀时间影响系数m、喷镀压力影响系数n和喷镀厚度修正因子f。6. The preparation process of a deformation-resistant graphics card integrated circuit board according to claim 5, characterized in that, in S2: historical spraying time value Tps, historical spraying pressure value Pys and historical spraying thickness value PHs planned to enter The influence coefficient m of spraying time, the influence coefficient n of spraying pressure and the correction factor f of spraying thickness are calculated and obtained. 7.根据权利要求5所述的一种抗变形的显卡集成电路板的制备工艺，其特征在于，S3中：将历史喷镀厚度值PHs及历史喷镀厚度值PHs时的历史喷镀接触角度值JCs拟入至公式计算获得喷镀接触角度与喷镀厚度之间的喷镀接触角度影响系数u和喷镀接触角度修正因子v。7. The preparation process of a deformation-resistant graphics card integrated circuit board according to claim 5, characterized in that, in S3: the historical spraying thickness value PHs and the historical spraying contact angle when the historical spraying thickness value PHs are The values JCs are plugged into the formula The influence coefficient u of the spray contact angle and the spray contact angle correction factor v between the spray contact angle and the spray thickness are calculated and obtained. 8.根据权利要求5所述的一种抗变形的显卡集成电路板的制备工艺，其特征在于，喷镀区域的润湿度值RS由喷镀接触角度值JC和喷镀温度PW计算获得：其中，，h为喷镀温度影响系数。8. The preparation process of a deformation-resistant graphics card integrated circuit board according to claim 5, characterized in that the humidity value RS of the spraying area is calculated by the spraying contact angle value JC and the spraying temperature PW: wherein , , h is the influence coefficient of spraying temperature. 9.根据权利要求1所述的一种抗变形的显卡集成电路板的制备工艺，其特征在于，A4中，若获得喷镀不合格信号：则对喷镀数据进行调整，调整喷镀温度RS和/或喷镀接触角度值JC。9. A process for preparing a deformation-resistant graphics card integrated circuit board according to claim 1, characterized in that, in A4, if a spraying failure signal is obtained: the spraying data is adjusted, and the spraying temperature RS and/or the spraying contact angle value JC are adjusted. 10.一种抗变形的显卡集成电路板，其特征在于，该抗变形的显卡集成电路板由上述权利要求1-9任一项所述的制备工艺制备得到。10. A deformation-resistant integrated circuit board for a graphics card, characterized in that the deformation-resistant integrated circuit board for a graphics card is prepared by the preparation process described in any one of claims 1 to 9.
CN202410204040.1A 2024-02-23 2024-02-23 A deformation-resistant graphics card integrated circuit board and its preparation process Active CN117812849B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202410204040.1A CN117812849B (en) 2024-02-23 2024-02-23 A deformation-resistant graphics card integrated circuit board and its preparation process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202410204040.1A CN117812849B (en) 2024-02-23 2024-02-23 A deformation-resistant graphics card integrated circuit board and its preparation process

Publications (2)

Publication Number Publication Date
CN117812849A true CN117812849A (en) 2024-04-02
CN117812849B CN117812849B (en) 2024-04-30

Family

ID=90434771

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202410204040.1A Active CN117812849B (en) 2024-02-23 2024-02-23 A deformation-resistant graphics card integrated circuit board and its preparation process

Country Status (1)

Country Link
CN (1) CN117812849B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118480837A (en) * 2024-05-08 2024-08-13 台州雅仕美医疗科技有限公司 Personalized customized planting bridge and preparation method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1781348A (en) * 2003-12-05 2006-05-31 三井金属矿业株式会社 Printed wiring board, its manufacturing method, and circuit device
US20130313009A1 (en) * 2012-05-22 2013-11-28 Samsung Techwin Co., Ltd. Printed circuit board and method of manufacturing the same
CN214154945U (en) * 2020-12-15 2021-09-07 东莞联桥电子有限公司 Multilayer circuit board that rolls over is prevented in resistance to compression
CN215729534U (en) * 2021-10-08 2022-02-01 倍利得电子科技(深圳)有限公司 Display card with anti-static breakdown mechanism
CN115315076A (en) * 2022-07-29 2022-11-08 四创电子股份有限公司 Multilayer pcb manufacturing method of embedded heat dissipation pipeline
CN217932569U (en) * 2022-07-19 2022-11-29 沥拓科技(深圳)有限公司 Integrated circuit embedded computer mainboard

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1781348A (en) * 2003-12-05 2006-05-31 三井金属矿业株式会社 Printed wiring board, its manufacturing method, and circuit device
US20130313009A1 (en) * 2012-05-22 2013-11-28 Samsung Techwin Co., Ltd. Printed circuit board and method of manufacturing the same
CN103428988A (en) * 2012-05-22 2013-12-04 三星泰科威株式会社 Printed circuit board and method of manufacturing the same
CN214154945U (en) * 2020-12-15 2021-09-07 东莞联桥电子有限公司 Multilayer circuit board that rolls over is prevented in resistance to compression
CN215729534U (en) * 2021-10-08 2022-02-01 倍利得电子科技(深圳)有限公司 Display card with anti-static breakdown mechanism
CN217932569U (en) * 2022-07-19 2022-11-29 沥拓科技(深圳)有限公司 Integrated circuit embedded computer mainboard
CN115315076A (en) * 2022-07-29 2022-11-08 四创电子股份有限公司 Multilayer pcb manufacturing method of embedded heat dissipation pipeline

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118480837A (en) * 2024-05-08 2024-08-13 台州雅仕美医疗科技有限公司 Personalized customized planting bridge and preparation method thereof

Also Published As

Publication number Publication date
CN117812849B (en) 2024-04-30

Similar Documents

Publication Publication Date Title
CN110866358B (en) Simulation model correction method for reflow soldering process based on measured temperature data
CN117812849B (en) A deformation-resistant graphics card integrated circuit board and its preparation process
JP5098648B2 (en) Method and apparatus for manufacturing printed wiring board
US6857361B2 (en) Method and apparatus for printing solder paste of different thickness on lands on printed circuit board
CN110213900A (en) PCB printing press visible detection method and system based on CCD identification
CN113068326B (en) A kind of welding quality processing method and device, circuit board
CN114682870A (en) POP hybrid welding process and system
CN117202533A (en) SMT substrate mounting and connecting production surface mounting technology
JP3128891B2 (en) Component mounting method and component mounting device
JP2005072268A (en) Metallic resistor
Lentz et al. How does Surface Finish affect solder paste performance
CN110473681B (en) Chemical fine resistance adjusting method and corrosive agent for nickel-phosphorus layer embedded resistor
JP2006019554A (en) Electronic component mounting apparatus and electronic component mounting method
JP2005072268A5 (en)
CN109860063A (en) The boring method of the double pin device reflow soldering steel mesh in bottom
CN108055789A (en) Prevent the production technology of MIC dysfunctions
CN108356374A (en) A kind of soldering of printed boards method containing unleaded BGA device
CN117615568A (en) Intelligent wearing FPC anti-continuous tin production process
WO2019050388A1 (en) Led precision assembly method
WO2020189108A1 (en) Component installation device and component installation method, mounting substrate manufacturing system and mounting substrate manufacturing method, and installed component inspection device
JP5990775B2 (en) Electronic component mounting system, electronic component mounting apparatus, and electronic component mounting method
JPH0334391A (en) Solder coating of printed wiring board
JPH11238960A (en) Printed circuit board and method of soldering the printed circuit board
US20240375202A1 (en) Fluxing calibration
CN109526155B (en) Manufacturing method of solder joint cold solder joint

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant