CN117810214A - A white light emitting module - Google Patents

Abstract

The present application relates to the field of semiconductor light-emitting device technology, and in particular to a white light-emitting module, which includes a chip layer. The chip layer includes a plurality of blue-light chips, and the blue-light chips produce uniform blue light; a base plate, and a chip layer is provided on one side of the base plate. The chips are evenly spaced; the fluorescent layer includes a red fluorescent layer and a green fluorescent layer. The red fluorescent layer and the green fluorescent layer are stacked and arranged on the side of the base plate close to the blue light chip, and are respectively provided with multiple through holes. The red fluorescent layer The through holes of the layer, the through holes of the green phosphor layer and the gaps between adjacent blue light chips are equal in the orthographic projection area of the base plate and partially overlap; the light mixing layer is arranged on the side of the phosphor layer facing away from the base plate. The present application has the effect of alleviating the problem of poor white light mixing and uneven color in related white light emitting devices.

Description

White light emitting module

Technical Field

The present disclosure relates to the field of semiconductor light emitting device technology, and in particular, to a white light emitting module.

Background

With the continuous progress of technology, LED light sources have been remarkably developed and widely used in various fields. The LED light source has advantages of high efficiency, long life, low power consumption, environmental protection, etc., and gradually replaces the conventional light emitting devices such as incandescent lamps and fluorescent lamps. In the last decades, there have been intensive studies and improvements in LED technology, especially in the development of white LED light sources.

The application of the white light LED light source is very wide, and is commonly used in the fields of indoor illumination, automobile illumination, display screens, backlight sources and the like. However, in the process of manufacturing a white LED light source, a white light effect is usually achieved by mixing three basic colors of LEDs of red light, green light and blue light. This method, while capable of producing white light to some extent, has some problems. Because the light emitting characteristics of the red light, the green light and the blue light are different, the three lights are directly regulated, the intensity and the color temperature of the three colors of lights are difficult to accurately regulate, the color of the mixed white light is not uniform enough, and color difference or color distortion can occur.

Disclosure of Invention

In order to alleviate the problem of poor color mixing and uneven color of white light in a related white light emitting device, the application provides a white light emitting module.

The white light emitting module adopts the following technical scheme:

a white light emitting module comprises

The chip layer comprises a plurality of blue light chips, and the blue light chips generate uniform blue light;

the blue light chips are uniformly arranged at intervals;

the fluorescent layer comprises a red fluorescent layer and a green fluorescent layer, the red fluorescent layer and the green fluorescent layer are arranged in a layer-by-layer mode, the red fluorescent layer and the green fluorescent layer are arranged on one side, close to the blue light chip, of the bottom plate, and a plurality of through holes are respectively formed in the fluorescent layer, and the through holes of the red fluorescent layer, the through holes of the green fluorescent layer and gaps of adjacent blue light chips are equal in orthographic projection area of the bottom plate and partially coincide with each other;

the light mixing layer is arranged on one side of the fluorescent layer, which is away from the bottom plate.

By adopting the technical scheme, the fluorescent layer, the chip layer and the partially overlapped through holes which are arranged in a stacked manner can realize that the blue light chip reaches the light mixing layer in various paths and finally form uniform white light. Specifically, the blue light emitted by the blue light chip can directly reach the light mixing layer, or can reach the light mixing layer after being converted by one or two fluorescent layers. The light-mixing layer is reached through different paths and a plurality of graded lights are formed in the light-mixing layer, and the combination of these different paths and graded lights finally results in the formation of uniform white light.

Optionally, the overlapping portion of the through hole of the red fluorescent layer, the through hole of the green fluorescent layer and the adjacent blue light chip gap on the orthographic projection of the bottom plate is greater than or equal to one half of the orthographic projection area of the through hole on the bottom plate.

By adopting the technical scheme, the light ratio of the blue light emitted by the blue light chip through one or two layers of fluorescent layers is increased, the blue light ratio of the direct irradiation to the light mixing layer is reduced, the bad lighting effects of blue light and high color temperature are avoided, more blue light is converted through fluorescent materials, the emission efficiency and quantity of gradual change light are improved, and the finally mixed white light is more uniform and natural.

Optionally, the through holes are distributed in the fluorescent layer at intervals.

Through adopting above-mentioned technical scheme, the interval distribution of through-hole can avoid the local specialization of light for luminous effect is more even and natural, has eliminated the problem such as local colour difference and luminance inadequately. In addition, the through holes are distributed in the middle of the fluorescent layer, so that the stability and the reliability of the fluorescent layer can be improved. The through holes are distributed at different positions of the fluorescent layer, so that the risks of aging and failure caused by excessive blue light irradiation of fluorescent materials in certain areas can be reduced, and the service life and maintenance period of the LED illumination product can be prolonged.

Optionally, transparent packaging glue is filled in the gap between the through hole and the blue light chip.

By adopting the technical scheme, the transparent packaging adhesive can protect the blue light chip and the fluorescent layer from pollution and mechanical damage, and can prevent impurities such as air, moisture, grease and the like from entering the through hole and the fluorescent layer, thereby reducing the optical performance of the fluorescent layer. And the transparent packaging adhesive has the characteristics of high transparency and low refractive index, and is beneficial to improving the light transmission efficiency. In addition, the transparent packaging adhesive can also buffer the through holes and the fluorescent layer from being influenced by mechanical shock and physical impact, so that the service life of the transparent packaging adhesive is prolonged.

Optionally, the light mixing layer is made of transparent polycarbonate.

By adopting the technical scheme, the transparent polycarbonate material has excellent transparency and can effectively transmit light. Light entering the light mixing layer can pass through the light mixing layer with the highest transparency as possible, so that the scattering and loss of the light are reduced, and the light conversion efficiency is improved. The transparent polycarbonate material also has good heat resistance, can stably work in a wide temperature range, reduces the attenuation of optical performance and the change of color, and ensures that the product can stably emit high-quality white light in various environments.

Optionally, the thickness of the light mixing layer is in a range of two to three times that of the fluorescent layer.

By adopting the technical scheme, the proper thickness of the light mixing layer can increase the time and opportunity of light mixing, which is helpful for the light of different paths to be more fully mixed and finally realize high-quality white light emission. And the light is uniformly diffused in the light mixing layer, so that a local dark area or a bright area can be avoided, white light seen from the surface of a product is more uniform, and the optical effect is improved. In addition, the excessive thickness can increase the loss of light, and the proper thickness of the light mixing layer can increase the propagation distance of the light in the light mixing layer and reduce the proportion of the lost light, thereby improving the light utilization rate and the luminous effect of the product.

Optionally, the surface of the light mixing layer is provided with a microstructure.

By adopting the technical scheme, the microstructure can generate multiple reflection and scattering on the surface, so that light rays can interact with the inside of the light mixing layer more, the light ray mixing efficiency is improved, and efficient white light emission is realized. Meanwhile, the microstructure can enable light to be diffused at a wider angle and position after multiple scattering, so that the light is prevented from being concentrated or offset in a specific area, and the visible white light is more uniform.

Optionally, the orthographic projection area of the fluorescent layer on the bottom plate is greater than or equal to the area of the bottom plate.

By adopting the technical scheme, the orthographic projection area of the fluorescent layer is larger than or equal to the area of the bottom plate, so that the light rays can be ensured to be transmitted more fully in the fluorescent layer. After the light enters the fluorescent layer, if the orthographic projection area of the fluorescent layer is smaller than the area of the bottom plate, part of the light may be reflected or refracted out on the bottom plate, resulting in energy loss. When the orthographic projection area of the fluorescent layer is larger than or equal to the area of the bottom plate, light rays can be reflected and converted more inside the fluorescent layer, and the utilization rate of the light rays is improved. In addition, the orthographic projection area of the fluorescent layer is larger than or equal to the area of the bottom plate, so that the influence of edge effect can be reduced, and the overall luminous effect and consistency are improved.

Optionally, the wavelength range of the blue light chip is 450-470 nanometers.

By adopting the technical scheme, blue light in the wavelength range has better matching in the absorption and emission spectrum range of the fluorescent layer, which is beneficial to better penetrating the fluorescent layer, so that more blue light can be converted, and the emission effect and quality of white light are improved. And the blue light in the wavelength range has higher brightness and luminous flux, so that the overall luminous brightness and luminous flux can be improved, and the lighting effect is brighter and clearer. In addition, the color temperature and the color rendering index of the LED lighting product are reduced.

Optionally, a white paint is coated on one side of the bottom plate, which is close to the blue light chip.

By adopting the technical scheme, the white paint serving as the reflecting layer can help reflect and disperse light, so that more uniform light distribution is realized, the luminous effect is improved, and the local brightness difference and the non-uniformity are reduced. Meanwhile, the white paint is a material with high reflectivity, and can reflect part of light rays after fluorescence conversion back to the fluorescent layer, so that the optical efficiency is improved. In addition, through adding the white paint layer on the bottom plate, can improve heat dissipation rate and temperature distribution uniformity, reduce the hot spot temperature, reduce the life-span damage of LED.

In summary, the present application includes at least one of the following beneficial technical effects:

1. through the arrangement of the laminated fluorescent layer, the chip layer and the partially overlapped through holes, the blue light released by the blue light chip can reach the light mixing layer in various paths, so that various gradual change lights are formed to be mixed in the light mixing layer, and the effect of generating white light with uniform color is achieved;

2. the arrangement and the overlapping area of the through holes are limited, the blue light duty ratio on different paths is adjusted, the emission efficiency of gradual change light is improved, and the effect that white light formed by final mixing is more uniform and natural is achieved;

3. through the limitation to the thickness material of the light mixing layer, the light mixing efficiency and the light transmission efficiency are balanced, and the effects of increasing the light transmission distance and improving the light mixing efficiency are achieved.

Drawings

Fig. 1 is a schematic diagram of a white light emitting module according to an embodiment of the application.

Fig. 2 is a cross-sectional view of a white light emitting module according to an embodiment of the disclosure.

Fig. 3 is a light path diagram of a white light emitting module according to an embodiment of the present application.

Fig. 4 is a top view of a red phosphor layer in an embodiment of the present application.

Fig. 5 is a schematic view of a light mixing layer in an embodiment of the present application.

Fig. 6 is a cross-sectional view of a light mixing layer in an embodiment of the present application.

Reference numerals illustrate:

1. a chip layer; 11. a blue light chip 2 and a bottom plate; 3. a fluorescent layer; 31. a red fluorescent layer; 32. a green phosphor layer; 33. a through hole; 4. a light mixing layer; 41. microstructure.

Detailed Description

The present application is described in further detail below with reference to the accompanying drawings.

The embodiment of the application discloses a white light emitting module.

Referring to fig. 1, a white light emitting module includes four layer structures, namely a bottom plate 2, a chip layer 1, a fluorescent layer 3 and a light mixing layer 4 from bottom to top. The base plate 2 is the basis for the overall light module, not only providing structural support, but also carrying the circuit structure for connecting and controlling the chip. The side of the base plate 2, which is close to the chip layer 1, is coated with a layer of white paint. The white paint has high reflectivity, can serve as a reflecting layer, can reflect light rays after fluorescence conversion back to the fluorescent layer 3, improves optical efficiency, and reduces energy loss. In addition, the presence of white paint also helps to improve heat dissipation. By adding a white paint layer on the base plate 2, the surface area of the base plate 2 can be increased, and the heat dissipation capacity can be improved, so that the heat dissipation performance can be improved. Good temperature environment is provided, the existence of hot spot temperature is reduced, the aging speed of the chip is further slowed down, and the service life is prolonged.

The chip layer 1 includes a plurality of blue light chips 11 uniformly distributed on one side of the base plate 2. The light emitted by these blue light chips 11 has a specific wavelength range between 450-470 nanometers. The blue light in this wavelength range is well matched to the absorption and emission spectral range of the phosphor layer 3, which means that more blue light can pass through the phosphor layer 3 and be converted, thereby improving the emission effect and quality of white light.

Secondly, blue light in this wavelength range has a higher brightness and luminous flux. Therefore, the use of such a blue light chip 11 can increase the overall light emission luminance and luminous flux, so that the illumination effect is brighter and clearer.

In addition, by selecting blue light in the wavelength range of 450-470 nanometers, the overall color temperature can be reduced, thereby making the light more similar to the color temperature of natural light. Blue light in the wavelength range of 450-470 nanometers has a higher color rendering index, and the color rendering index can be improved, so that color details can be better reduced.

The side of the chip layer 1 facing away from the bottom plate 2 is provided with a fluorescent layer 3, and the fluorescent layer 3 can convert blue light into light with other wavelengths and mix the blue light to form white light. The orthographic projection area of the fluorescent layer 3 on the bottom plate 2 is larger than or equal to the area of the bottom plate 2, so that the light can be ensured to spread more fully in the fluorescent layer 3.

When light enters the phosphor layer 3, if the orthographic projection area of the phosphor layer 3 is smaller than the area of the base plate 2, a part of the light may be reflected or refracted on the base plate 2, resulting in energy loss. In this case, the light cannot completely enter the inside of the fluorescent layer 3 to be reflected and converted, so that part of the light cannot be effectively absorbed and converted into light of other wavelengths by the fluorescent layer 3. Therefore, both the energy and light utilization may be limited. In contrast, when the orthographic projection area of the fluorescent layer 3 is equal to or larger than the area of the base plate 2, the light can be reflected and converted more inside the fluorescent layer 3. This means that the fluorescent layer 3 is able to more fully absorb and utilize the energy of the light, converting it to the desired wavelength. As a result, the light utilization efficiency is improved and the energy loss is reduced.

In addition, in the edge region around the light emitting unit, the brightness and color of the light may be changed due to scattering and reflection of the light, which is called an edge effect. The edge effect may be more pronounced if the forward projected area of the phosphor layer 3 is smaller than the area of the bottom plate 2, and the forward projected area of the phosphor layer 3 being equal to or larger than the area of the bottom plate 2 also helps to reduce the effect of the edge effect. Thereby improving the overall luminous effect and consistency.

The fluorescent layer 3 includes a red fluorescent layer 31 and a green fluorescent layer 32, referring to fig. 2, a plurality of through holes 33 are formed in the red fluorescent layer 31 and the green fluorescent layer 32, the through holes 33 of the red fluorescent layer 31, the through holes 33 of the green fluorescent layer 32, and gaps between adjacent blue light chips 11 are equal to each other in the orthographic projection area of the bottom plate 2 and partially overlap, and the overlapping area is equal to or greater than one half of the orthographic projection area of the through holes 33 on the bottom plate 2.

Referring to fig. 3, blue light emitted from the blue light chip 11 may reach the light mixing layer 4 through various paths, wherein some light may reach the light mixing layer 4 directly, some may reach the light mixing layer 4 through one of the red fluorescent layer 31 and the green fluorescent layer 32, and some may reach the light mixing layer 4 through two of the red fluorescent layer 32 and the green fluorescent layer 32. After conversion by the phosphor layer 3, these light rays can form graded light rays of a variety of different wavelengths.

In the light mixing layer 4, these different wavelengths of light will mix together to form uniform white light. Due to the design and the position of the through holes 33, the fluorescent layer 3 can better convert blue light, and the light rays with different wavelengths are more uniformly mixed together, so that the color performance and uniformity of the white light emitting module are improved.

The ratio of the area of the through hole 33 of the red fluorescent layer 31, the through hole 33 of the green fluorescent layer 32 and the overlapping part of the gaps between the adjacent blue light chips 11 on the orthographic projection of the bottom plate 2 to the orthographic projection area of the through hole 33 on the bottom plate 2 determines the light ratio of the blue light emitted by the blue light chips 11 in different paths in the white light emitting module. When this ratio exceeds one half, it means that the light ratio passing through one or both of the fluorescent layers 3 increases, while the blue light ratio impinging on the light-mixing layer 4 decreases.

The design scheme effectively avoids bad illumination effects of white light with bluish color and high color temperature. By increasing the overlapping area of the through holes 33, more blue light can be converted by the fluorescent layer 3, thereby improving the emission efficiency and the number of gradation lights. In this way, the white light formed in the light-mixing layer 4 will be more uniform and natural.

The gap between the through hole 33 and the blue light chip 11 is filled with transparent packaging glue. The transparent packaging adhesive has multiple functions, and firstly, the most main function of the transparent packaging adhesive is to play an isolating and protecting role. It can effectively prevent foreign substances from entering the through hole 33 and the fluorescent layer 3, and prevent them from being contaminated or damaged. In this way, the optical properties of the phosphor layer 3 can be better maintained, thereby providing better guarantees for the device performance.

And secondly, the transparent packaging adhesive also has the characteristics of high transparency and low refractive index, is favorable for improving the light transmission efficiency, and can minimize the reflection and scattering of light, so that the brightness of the device is higher, and the use effect is better.

In addition, the transparent encapsulation adhesive can also buffer the through holes 33 and the fluorescent layer 3 from mechanical shock and physical impact, and prolong the service life of the device. This is particularly important for devices that need to be used in harsh environments. By adding transparent encapsulation glue between the through hole 33 and the fluorescent layer 3, the damage rate of the device can be effectively reduced, thereby reducing the maintenance cost and the replacement frequency.

Referring to fig. 4, the through holes 33 are arranged in a checkerboard pattern on the red fluorescent layer 31 at intervals, and the green fluorescent layer 32 and the chip layer 1 are also arranged in a similar manner. This arrangement can improve illumination performance and reliability.

First, by distributing the through holes 33 in a checkerboard pattern at intervals, localized specialization of light can be avoided. When the through holes 33 are uniformly distributed, the paths of the light passing through the through holes 33 are more uniform, so that the luminous effect is more natural and uniform, the problems of partial color difference, insufficient brightness and the like can be eliminated, and the quality of the whole light is improved.

Secondly, distributing the through holes 33 in the phosphor layer 3 helps to improve the stability and reliability of the phosphor layer 3. By distributing the through holes 33 at intervals in the phosphor layer 3, the risk of aging and failure of the phosphor material in certain areas due to too much blue light irradiation can be reduced. The distribution mode can uniformly disperse the irradiation of blue light, ensure longer service life of the fluorescent layer 3 and reduce maintenance period.

The side of the fluorescent layer 3 facing away from the chip layer 1 is provided with a light mixing layer 4, and the light mixing layer 4 has the main function of mixing light rays with different colors together to form uniform white light. The light mixing layer 4 is made of transparent polycarbonate, and the transparent polycarbonate has good transparency and light transmission capability, so that light entering the light mixing layer 4 can be transmitted as efficiently as possible, the scattering and loss of the light are reduced, and the light conversion efficiency is improved.

In addition, the transparent polycarbonate material can stably work in a wide temperature range, and can help reduce the attenuation of optical performance and the change of color. This is important for long-term use of the product, since it ensures a longer service life of the product and maintains stable performance throughout the service life.

The thickness of the light mixing layer 4 is between two and three times of that of the fluorescent layer 3, and the light transmission loss is increased due to the fact that the light mixing layer 4 is too thick, so that the brightness of white light is reduced; too thin a light mixing layer 4 may not have a sufficient light mixing distance, and insufficient mixing may result in color distortion or reduced uniformity.

In this embodiment, a light-mixing layer 4 design of twice the thickness is chosen. Such a thickness may increase the time and chance of light mixing, helping the light of different paths to mix more thoroughly, ultimately achieving high quality white light emission. In addition, the light is uniformly diffused in the light mixing layer 4, which helps to avoid local dark or bright areas, so that white light seen from the surface of the product is more uniform, and the optical effect is improved.

On the other hand, the thickness of the light mixing layer 4 can increase the distance of light traveling in the light mixing layer, so that the proportion of lost light is reduced, the light utilization rate and the luminous effect of the product are improved, and the brightness and the energy efficiency of the product are improved.

Referring to fig. 5 and 6, microstructures 41 are disposed on the surface of the light mixing layer 4, and the microstructures 41 can generate multiple reflection and scattering on the surface, so that light interacts with the interior of the light mixing layer 4 more, the light mixing efficiency is improved, and a more uniform white light emitting effect is achieved. By the design of the microstructure 41, light can be diffused at a wider range of angles and positions after multiple scattering. This diffusion effect helps to avoid light concentration or deflection in specific areas, thereby making the white light seen from the product surface more uniform. The presence of microstructures 41 allows light to travel more paths and interact repeatedly with the material within light-mixing layer 4, further promoting mixing of the light.

The implementation principle of the white light emitting module in the embodiment of the application is as follows:

according to the embodiment of the application, the laminated fluorescent layer 3, the chip layer 1 and the partially overlapped through holes 33 are arranged, the purpose that blue light released by the blue light chip 11 reaches the light mixing layer 4 in various paths is achieved, and various light with different colors and gradual changes is formed to be mixed in the light mixing layer 4, so that a white light effect with uniform color is generated.

In order to adjust the duty ratio of blue light on different paths and improve the emission efficiency of gradual change light, the transmission path and amount of the blue light are controlled by precisely limiting the arrangement and overlapping area of the through holes 33, so that the blue light is mixed with light rays of other colors, and uniform and natural white light is finally formed.

In addition, in order to balance the mixing efficiency and the propagation efficiency of light, the thickness and the material of the light mixing layer 4 are limited, and the proper thickness and material selection of the light mixing layer 4 are adopted, so that the propagation distance of the light is increased, and meanwhile, the interaction between the light and the internal material of the light mixing layer 4 is improved, the mixing efficiency of the light is improved, the light can be fully interacted in the light mixing layer 4, uniform white light is formed, and the finally formed white light is more uniform and natural.

The foregoing are all preferred embodiments of the present application, and are not intended to limit the scope of the present application in any way, therefore: all equivalent changes in structure, shape and principle of this application should be covered in the protection scope of this application.

Claims (10)

1. A white light emitting module, characterized in that it includes Chip layer (1), the chip layer (1) includes a plurality of blue light chips (11), and the blue light chips (11) generate uniform blue light; A base plate (2), a chip layer (1) being arranged on one side of the base plate (2), and the blue light chips (11) being arranged at even intervals; Fluorescent layer (3). The fluorescent layer (3) includes a red fluorescent layer (31) and a green fluorescent layer (32). The red fluorescent layer (31) and the green fluorescent layer (32) are stacked and arranged on The bottom plate (2) is close to the side of the blue light chip (11), and is provided with a plurality of through holes (33). The through holes (33) of the red fluorescent layer (31), the green fluorescent layer The orthographic projection areas of the through hole (33) of (32) and the adjacent blue light chip (11) on the bottom plate (2) are equal and partially overlap; Light mixing layer (4), the light mixing layer (4) is provided on the side of the fluorescent layer (3) facing away from the bottom plate (2). 2. A white light emitting module according to claim 1, characterized in that the through hole (33) of the red fluorescent layer (31), the through hole (33) of the green fluorescent layer (32) and the corresponding The overlapping portion of the gap adjacent to the blue light chip (11) on the orthographic projection of the bottom plate (2) is greater than or equal to one-half of the orthographic projection area of the through hole (33) on the bottom plate (2). 3. A white light emitting module according to claim 1, characterized in that the through holes (33) are distributed at intervals in the fluorescent layer (3). 4. The white light emitting module according to claim 1, characterized in that a transparent packaging glue is filled in the gap between the through hole (33) and the blue light chip (11). 5. A white light emitting module according to claim 1, characterized in that the light mixing layer (4) is made of transparent polycarbonate. 6. A white light emitting module according to claim 1, characterized in that the thickness of the light mixing layer (4) ranges from two to three times the thickness of the fluorescent layer (3). 7. The white light emitting module according to claim 1, characterized in that a microstructure (41) is provided on the surface of the light mixing layer (4). 8. A white light emitting module according to claim 1, characterized in that the orthographic projection area of the fluorescent layer (3) on the bottom plate (2) is greater than or equal to the area of the bottom plate (2). 9. A white light emitting module according to claim 1, characterized in that the wavelength range of the blue light chip (11) is 450-470 nanometers. 10. A white light emitting module according to claim 1, characterized in that the side of the bottom plate (2) close to the blue light chip (11) is coated with white paint.