CN117577008A

CN117577008A - Display panel

Info

Publication number: CN117577008A
Application number: CN202311490863.7A
Authority: CN
Inventors: 刘超
Original assignee: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Current assignee: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date: 2023-11-09
Filing date: 2023-11-09
Publication date: 2024-02-20

Abstract

The embodiment of the application provides a display panel. The display panel comprises a display area, a non-display area, a binding area in the non-display area, a binding terminal arranged in the binding area and a flip chip film. The binding terminals comprise two-dimensional lattice sub-terminals, wherein the continuous sub-terminals in the first direction are connected with the same signal source and form terminal groups, and the terminal groups are arranged at intervals in the second direction. In this embodiment of the application, this terminal group is including first binding terminal and second binding terminal, through binding terminal and second binding terminal with above-mentioned first binding terminal and set up to the terminal group structure that corresponds to guarantee when counterpointing laminating and binding, increase its area of laminating relatively, and the effectual precision of binding of improvement and the comprehensive properties of binding quality and panel.

Description

Display panel

Technical Field

The present invention relates to the field of display panel design and manufacturing technologies, and in particular, to a display panel.

Background

Along with the development of the display panel preparation technology, people put forward higher requirements on the display effect and the comprehensive performance of the display panel.

A display panel and device that normally operates are typically assembled and tested from a number of different functional components to ultimately form a device that is available to a user. In general, the components inside the display device include a display component and a driving component, where the display component is electrically connected to the driving component and provides a driving control signal to the display component through the driving component. When the display device is connected to the driving device, the display device and the driving device are typically bonded together by using a flip chip film (Chip on film or flex, COF) bonding technique as provided in the prior art. The COF binding can better correspondingly adhere and bind binding terminals of the driving component and the display component for the rigid material of the driving component and the display component. However, when the COF bonding technique described above is applied to flexible components such as flexible panels and flexible circuit boards, the flexible components are easily bent or deformed. When the two flexible components are bound, the binding terminals between the two flexible components are easy to bend or deform, the alignment is inaccurate, the bonding area between the two flexible components is reduced, and therefore binding failure is caused, and the binding effect is not ideal. The reliability of the display panel and the display device is reduced, which is unfavorable for further improving the comprehensive performance of the device.

Disclosure of Invention

The embodiment of the invention provides a display panel. The problem that in the prior art, when the flexible display panel and the device are bound, the binding effect between binding terminals is not ideal is effectively solved.

In order to solve the above technical problems, an embodiment of the present invention provides a display panel, including:

the display area, the non-display area, and the binding area located in the non-display area;

the binding terminal is arranged in the binding area;

the flip chip film is electrically connected with the binding region through the binding terminal;

the binding terminals comprise sub terminals arranged in a two-dimensional lattice mode, the continuous sub terminals are connected with the same signal source and form terminal groups in the first direction, and the terminal groups are arranged at intervals in the second direction.

According to an embodiment of the invention, the terminal group comprises a first binding terminal arranged on a display substrate of the display panel and a second binding terminal opposite to the first binding terminal and arranged on the flip-chip film, wherein the first binding terminal on the display substrate is electrically bound and connected with the second binding terminal on the flip-chip film, and the binding area is larger than or equal to 3500 square micrometers.

According to an embodiment of the present invention, an area of the first bonding terminal on the display substrate is greater than or equal to an area of the second bonding terminal on the flip chip film.

According to an embodiment of the present invention, the first bonding terminal on the display substrate and the second bonding terminal on the flip chip film are both configured in a rectangular structure.

According to an embodiment of the present invention, the rectangular structure of the first binding terminal includes two first sides disposed opposite to each other and two second sides disposed opposite to each other, the rectangular structure of the second binding terminal includes two third sides disposed opposite to each other and two fourth sides disposed opposite to each other, the first sides have a length L1, the second sides have a length L2, the third sides have a length L3, the fourth sides have a length L4,

the area of the binding is K, where K satisfies the following formula,

K＝[L3+(L1-L3)/2-γ-M1]*[L4+(L2-L4)/2-η-M2]，

wherein γ is the alignment precision of the first binding terminal and the second binding terminal in the first direction, η is the alignment precision of the first binding terminal and the second binding terminal in the second direction, M1 is the expansion and contraction deviation of the third side, and M2 is the expansion and contraction deviation of the fourth side.

According to an embodiment of the present invention, the first bonding terminals on the display substrate and the second bonding terminals on the flip chip film are arranged in an array in the first direction;

in the same row along the first direction, adjacent first binding terminals are spaced apart by a distance S1, wherein M1 is less than or equal to S1+ (L1-L3)/2;

in the same column along the second direction, two adjacent first binding terminals are separated by a distance S2, wherein M2 is less than or equal to S2+ (L2-L4)/2.

According to one embodiment of the invention, the ratio of L2/L1 to L4/L3 ranges from 1 to 3.

According to an embodiment of the invention, the first direction is perpendicular to the second direction; wherein,

the first side and the third side are arranged parallel to the first direction;

the second side and the fourth side are arranged parallel to the second direction.

According to an embodiment of the present invention, S2 is 18um to 22um, and the distance between two adjacent second binding terminals is S3, and S3 is 23um to 27um.

According to an embodiment of the present invention, in the same column along the second direction, projection portions of the second bonding terminals adjacent to two rows along the first direction in the second direction overlap.

According to an embodiment of the present invention, each of the sub-terminals includes a lead, the leads of the sub-terminals in the same column along the second direction are led out from the same side, and the leads are electrically connected to the display area.

According to a second aspect of the embodiments of the present invention, there is also provided a display device including the display panel provided in the embodiments of the present application.

The embodiment of the invention has the beneficial effects that: compared with the prior art, the embodiment of the application provides a display panel. The display panel comprises a display area, a non-display area, a binding area in the non-display area, a binding terminal arranged in the binding area and a flip chip film. The binding terminals comprise two-dimensional lattice sub-terminals, wherein the continuous sub-terminals in the first direction are connected with the same signal source and form terminal groups, and the terminal groups are arranged at intervals in the second direction. In this embodiment of the application, this terminal group is including first binding terminal and second binding terminal, through binding terminal and second binding terminal with above-mentioned first binding terminal and set up to the terminal group structure that corresponds to guarantee when counterpointing laminating and binding, increase its area of laminating relatively, and the effectual precision of binding of improvement and the comprehensive properties of binding quality and panel.

Drawings

In order to more clearly illustrate the embodiments or the technical solutions in the prior art, the following description will briefly introduce the drawings that are required to be used in the embodiments or the description of the prior art, it is obvious that the drawings in the following description are only some embodiments of the application, and other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a binding structure of a display device according to the prior art;

fig. 2 is a schematic structural diagram of a display device according to an embodiment of the present application;

fig. 3 is a schematic structural and layout diagram of the second binding terminal provided in the embodiment of the present application;

fig. 4 is a schematic diagram of the first binding terminal and the second binding terminal provided in the embodiment of the present application when performing alignment binding;

fig. 5 is a schematic diagram of a binding effect of a binding terminal with a partial rectangular structure provided in an embodiment of the present application.

Detailed Description

The following disclosure provides various embodiments or examples of implementing various features of the invention in conjunction with the accompanying drawings in the examples of the invention. In order to simplify the present disclosure, components and arrangements of specific examples are described below. In addition, the examples of the various specific processes and materials provided herein are those of ordinary skill in the art and will recognize other process applications. All other embodiments obtained by those skilled in the art without making any inventive effort are within the scope of the present invention.

In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.

Flexible display devices are widely used in various fields such as display, because they can be bent or deformed to some extent. In the preparation of the flexible device, it is often necessary to bind the flexible device to enable transmission of control signals. As shown in fig. 1, fig. 1 is a schematic diagram of a binding structure of a display device provided in the prior art. When two different components are electrically connected through the flip chip film 203, the terminal 101 on the COF is generally configured as a vertical strip structure, and when the vertical strip-shaped terminal 101 is aligned and bound, the flexible panel is deformed due to bending and the like, so that binding problems such as binding failure and the like occur, which is not beneficial to further improving the comprehensive performance of the device.

The embodiment of the application provides a display panel, which improves the binding structure in the device to effectively improve the binding effect of the device and improve the quality and the comprehensive performance of the device.

Fig. 2-3 show a schematic structural diagram of a display device provided in an embodiment of the present application, and fig. 3 shows a schematic structural and arrangement diagram of the second binding terminal provided in an embodiment of the present application. Specifically, the display panel includes a flip chip film 203 and a flexible circuit board 201. The display panel and the flexible circuit board 201 are respectively disposed on two sides of the flip chip film 203, and are electrically connected through the flip chip film 203. In the following embodiments, the display panel and the circuit board are described by taking a flexible display panel and a flexible circuit board, respectively, as examples.

Specifically, when the display panel is bound to the flexible circuit board 201, the display panel further includes a display substrate 202, for example, an array substrate corresponding to the display substrate, and different wires are disposed on the display substrate 202 to realize transmission of control signals and ensure normal operation of the display panel.

Further, the display substrate 202 includes a display area, a non-display area, and a binding area 205 disposed in the non-display area and near the edge area. In the binding area 205, a binding structure 206 is disposed on the display substrate 202. In this embodiment, in order to achieve better binding between the display substrate 202 and the flip-chip film 203, a plurality of sub-terminals 40 are disposed in the binding structure 206. The sub-terminals 40 are arranged in a two-dimensional array, such as a two-dimensional array. And the sub-terminals 40 are connected to the same signal source and constitute a terminal group 50.

When each of the sub-terminals 40 and the corresponding terminal set 50 are disposed, the sub-terminal 40 includes a first bonding terminal 2061 disposed on the display substrate 202 and a second bonding terminal 2041 disposed on the flip-chip film 203 and bonded to the first bonding terminal. In this way, the first bonding terminal 2061 and the second bonding terminal 2041 form a terminal set, so as to realize transmission of electrical signals between different film layers. In the following embodiment, fig. 2 only illustrates an arrangement schematic diagram of the first bonding terminals 2061 on the display substrate, and the second bonding terminals on the flip-chip film and the first bonding terminals form a terminal group, so that the structure of the second bonding terminals can be set with reference to the first bonding terminals.

In this embodiment, the first bonding terminal 2061 and the second bonding terminal 2041 may be disposed along the first direction X, and the array is disposed at the corresponding positions of the display substrate and the flip chip film. Referring to fig. 2, a first direction X and a second direction Y form an angle therebetween, for example, the first direction X may be set to be a horizontal direction, and the second direction Y may be set to be a vertical direction, and the first direction X and the second direction Y are perpendicular to each other.

In this embodiment, in the two-dimensional area formed by the first direction X and the second direction Y, because each sub-terminal 40 is mutually independent, after the first binding terminal 2061 and the second binding terminal 2041 corresponding to the sub-terminal 40 are bound and formed into the terminal groups in alignment, adjacent terminal groups are mutually independent, so that the problem that the binding of other terminal groups is affected due to inaccurate alignment of one terminal group in the binding process is effectively avoided, the problem of mutual interference between different binding terminals is effectively avoided, the binding yield is improved, and the normal operation of the display panel is ensured.

In the following embodiment, when the first binding terminal 2061 and the second binding terminal 2041 are provided, the first binding terminal 2061 and the second binding terminal 2041 are in one-to-one correspondence and are electrically connected. Meanwhile, when the structures of the first binding terminal and the second binding terminal are set, the rectangular structures are taken as examples for illustration of the first binding terminal and the second binding terminal.

Further, the rectangular structure includes a long side and a short side. The ratio of the length of the long side to the length of the short side is set between 1 and 3, for example, the long side of the rectangular structure is 2 times of the wide side, so that the binding terminals are ensured to have larger contact and connection area. Meanwhile, the binding effect among other binding terminals can be effectively prevented from being influenced after the binding failure of one binding terminal. Optionally, the first binding terminal 2061 and the second binding terminal 2041 may be configured in a shape of a circle, an ellipse, a regular polygon, or an irregular polygon, which will not be described herein. .

Fig. 4 is a schematic diagram of the first binding terminal and the second binding terminal provided in the embodiment of the present application when performing alignment binding, as shown in fig. 4.

For the rectangular structure corresponding to the first binding terminal 2061, the first binding terminal 2061 includes two oppositely disposed first sides L1 and two oppositely disposed second sides L2. The first side L1 is disposed parallel to the first direction X, and the second side L2 is disposed parallel to the second direction Y. If the first side L1 is a side ab and a side cd of the rectangular structure, the first side L1 and the third side L3 are short sides, and the second side L2 and the fourth side L4 are long sides.

For the rectangular structure corresponding to the second binding terminal 2041, the second binding terminal 2041 includes two third sides L3 disposed opposite to each other, and two fourth sides L4 disposed opposite to each other. The third side L3 is disposed parallel to the first direction X, and the fourth side L4 is disposed parallel to the second direction Y. Meanwhile, the first side L1 and the third side L3 are parallel to each other, and the second side L2 and the fourth side L4 are parallel to each other. Thereby forming the binding structure of fig. 4.

In the embodiment of the application, in order to ensure the binding effect of the first binding terminal and the second binding terminal, the ratio L2/L1 between the second side L2 and the first side L1 is set to 1-3, and the ratio L4/L3 between the corresponding fourth side L4 and the third side L3 is set to 1-3. Thereby ensuring the binding effect between different binding terminals.

Further, in the embodiment of the present application, when the first binding terminal 2061 and the second binding terminal 2041 are bound, the binding area where they overlap is K. Wherein the binding area K satisfies the following formula:

K＝[L3+(L1-L3)/2-γ-M1]*[L4+(L2-L4)/2-η-M2]。

because flexible membrane layer itself can take place flexible deformation when binding flexible base plate, and appear certain swelling and shrinking, and in the binding process, can also have the influence of factors such as the counterpoint precision error of binding the terminal. Therefore, in determining the above-mentioned bound overlapping area K, the above-mentioned influencing factors need to be considered to obtain an accurate overlapping area K.

Specifically, in the embodiment of the present application, when determining the above overlapping area K, γ is the alignment precision of the first binding terminal 2061 and the second binding terminal 2041 in the first direction X, η is the alignment precision of the first binding terminal 2061 and the second binding terminal 2041 in the second direction, M1 is the expansion deviation of the third side L3, and M2 is the expansion deviation of the fourth side L4. Therefore, the bound overlapping area K is accurately calculated through the formula.

Furthermore, in order to obtain a better binding effect, the binding overlapping area K of the binding structure formed by different binding terminals after binding is required to be larger than or equal to 3500 square micrometers.

See in detail in fig. 5. For the embodiment of the present application, by controlling the lengths of different sides of the first binding terminal and the second binding terminal, for example, the first side l1=105 μm, the third side l3=95 μm, the second side l2=105 μm, and the fourth side l4=95 μm, further, the specific values of γ and η may be selected to be different values according to different types of devices, for example, in the embodiment of the present application, the alignment accuracy γ is 8.06 micrometers, and the alignment accuracy η is 20 micrometers. The overlapping area calculated at this time:

k = [95+ (105-95)/2-8.06-M1 ] [95+ (105-95)/2-20-M2 ]. Gtoreq.3500 square microns.

The expansion and contraction deviation of the third side and the fourth side of the second binding terminal 2041 is 8 micrometers, and the value of the overlapping area K is 6044 square micrometers and is far greater than 3500 square micrometers, so that the binding effect of different binding terminals after binding is effectively ensured.

As shown in fig. 5, fig. 5 is a schematic diagram of a binding effect of a binding terminal with a partial rectangular structure provided in an embodiment of the present application. In combination with the structure in fig. 4, in this embodiment of the present application, the first binding terminal and the second binding terminal are arranged in a row in the first direction and the second direction, and are bound correspondingly.

In the same row along the first direction X, the adjacent two first binding terminals 2061 are spaced apart by a distance S1;

in the same column along the second direction Y, two adjacent first bonding terminals 2061 are spaced apart by a distance S2.

In the embodiment of the present application, the distance S1 is set to 23um to 27um, and the distance S2 is set to 18um to 22um. Alternatively, the distance S1 is 25 μm and the distance S2 is 20 μm.

Further, in calculating the overlapping area K after binding the binding terminals, considering the expansion and contraction deviation of the second binding terminals on the flexible film layer, in order to ensure that the first binding terminals 2061 and the second binding terminals 2041 correspond to each other with binding precision, in order to prevent the second binding terminals 2041 of one row or one line from being bound to the first binding terminals 2061 of an adjacent row or one adjacent column due to the expansion and contraction of the size, in this embodiment of the present application, the expansion and contraction deviation M1 of the third side edge of the second binding terminals 2041: m1+.s1+ (L1-L3)/2, and the collapsible bias M2 of the fourth side of the second binding terminal 2041: M2.ltoreq.S2+ (L2-L4)/2. Thereby ensuring that the first binding terminal 2061 and the second binding terminal 2041 are correspondingly bound and improving the binding precision.

Further, as shown in fig. 3 and fig. 5, the first binding terminal and the second binding terminal are correspondingly arranged, and therefore, the arrangement mode and the appearance structure of the first binding terminal are the same as or similar to those of the second binding terminal, and are applicable to different flexible panels, which are not described herein.

Further, the second bonding terminals 2041 are arranged in an array along the first direction and the second direction. And the second binding terminal 2041 includes a main body 301 and a lead 302. The main body 301 mainly realizes binding between different binding terminals, and the lead 302 mainly realizes signal transmission. When set, the leads 302 are led out from the left side of the main body 301 and extend to the other side of the flip chip film. If the lead 302 is led out from the second bonding terminal 2041, it extends below the flip chip film 203 and is electrically connected to the lighting test bonding terminal on the flip chip film 203, so as to realize the communication of the internal circuit of the flip chip film. The corresponding lead wires of the first binding terminals are led out from the same side edge and are electrically connected to the display area of the display panel, so that control signals are transmitted.

Specifically, when the leads 302 are provided, the leads 302 are led out from the same side of the main body 301, for example, from the left side of each of the second bonding terminals 2041, in the same column, and extend toward the flexible circuit board. In this embodiment, the lead 302 is led out from the intersection point of the two intersecting sides of the second binding terminal 2041. In this way, the lead terminal of the lead 302 can be directly connected to the intersection of the second bonding terminal 2041, thereby reducing unnecessary connection points and improving the display quality of the display panel.

Further, the leads 302 may be spaced apart and disposed in parallel, such as in each binding terminal, with the lead 302 aligned with the left side 402 of the body 301 and extending downward, and in a different two second binding terminal, the lead 302 is parallel to the first side of the other body 301.

Referring to fig. 3, since the leads 302 are led out from the same side of the second bonding terminal 2041, the second terminal 2041 near the bottom needs to be moved sideways to the right side in the same column, thereby providing space for avoidance and routing of the leads 302. In this embodiment, the horizontal distance between the first sides of the second binding terminals 2041 of two adjacent rows is the same.

Thus, in this column, from top to bottom, the second binding terminals 2041 in the first row to the second binding terminals 2041 in the last row of the bottom correspond to sequentially moving the second binding terminals 2041 in the first row rightward by the same distance, alternatively, in the same column, the distance between two adjacent leads can be regarded as the moving distance, wherein the distance between the two adjacent leads is set to 10um to 20um, and in detail, in fig. 5, the distance between the two adjacent leads is 15 um. And ultimately form the arrangement of the embodiments of the present application.

Optionally, in the same column, the moving distance between the two adjacent second bonding terminals 2041 may be set to be different, specifically, may be set according to the requirements of different products and the size of the flip chip film, which is not described herein.

In this embodiment, when the plurality of different second binding terminals 2041 are disposed, in the same column, the second binding terminals 2041 in two adjacent rows are at the same corresponding position on the same side, for example, at the bottom horizontal position of the second binding terminal 2041, and their corresponding projection portions overlap. Specifically, as in the first column, the projection of the second binding terminals 2041 in the first row in the second direction Y partially overlaps the projection of the second binding terminals 2041 in the second row in the second direction Y.

Further, in the embodiment of the present application, each first binding terminal 2061 may be configured with the same size, each second binding terminal 2041 is configured with the same size, and the rectangular area of the second binding terminal 2041 is smaller than the rectangular area of the first binding terminal 2061. As shown in fig. 3, after the bonding, the second bonding terminal 2041 is located entirely within the entire area of the first bonding terminal 2061. Thereby ensuring a high binding effect.

Further, in this embodiment of the present application, when the display substrate and the corresponding first binding terminal 2061 and second binding terminal 2041 in the flexible circuit board are set, the second binding terminal on the flexible circuit board 2041 may be further symmetrically set with respect to the center line of the binding region, so as to ensure that the two side regions have the same contact effect. Meanwhile, when the second binding terminal is arranged, the leads corresponding to each column can be arranged on the same side, or the leads corresponding to the odd columns are arranged on the left side of the binding terminal, and the leads corresponding to the even columns are arranged on the right side of the binding terminal, so that the leads in different columns are arranged on different sides to more reasonably arrange the leads in different areas, and the binding performance and the wiring effect of the binding terminals are improved. And will not be described in detail here.

Specifically, in order to ensure the binding effect between the binding terminals with different amounts, after the binding is completed, the side edges of the different sides of the second binding terminal with smaller area are the same as the distance between the corresponding side edges of the first binding terminal, that is, the second binding terminal 2041 is symmetrically arranged in the first binding terminal 2061, so that the binding effect is improved, and the problem that the binding of the component fails after the component is deformed is prevented. Meanwhile, in the embodiment of the present application, at least one alignment mark 501 is further disposed on one side or two sides of the second bonding terminal 2041 of the flip chip film, which is close to the edge. The alignment mark 501 mainly plays a role of alignment to improve the binding efficiency and quality. The number of the alignment marks 501, and the positions and shapes of the alignment marks 501 are not particularly limited.

Further, in this embodiment of the present application, a display device is further provided, where the display device includes a display panel provided in this embodiment of the present application, and a connection manner between the display panel and a corresponding component inside the device may be performed according to a manner provided in this embodiment of the present application, so as to effectively improve a binding effect and quality thereof, and improve a comprehensive performance of a device at the same time.

In the embodiment of the application, the display panel can be applied to any rigid or flexible product or component with functions of display, touch control and the like, such as a computer, electronic paper, a display, a notebook computer, a digital photo frame and the like, and the specific type of the display panel is not particularly limited.

In summary, the foregoing has described in detail a display panel provided by the embodiments of the present invention, and specific examples are applied to illustrate the principles and embodiments of the present invention, and the description of the foregoing embodiments is only for helping to understand the technical solution and core idea of the present invention; although the present invention has been described with reference to the preferred embodiments, it should be understood that the invention is not limited to the particular embodiments described, but can be modified and altered by persons skilled in the art without departing from the spirit and scope of the invention.

Claims

1. A display panel, comprising:

the binding terminal is arranged in the binding area;

2. The display panel of claim 1, wherein the terminal group comprises a first binding terminal disposed on a display substrate of the display panel, and a second binding terminal opposite to the first binding terminal and disposed on the flip-chip film, the first binding terminal on the display substrate is electrically bound to the second binding terminal on the flip-chip film, and the bound area is greater than or equal to 3500 square micrometers.

3. The display panel of claim 2, wherein an area of the first bonding terminal on the display substrate is greater than or equal to an area of the second bonding terminal on the flip chip film.

4. The display panel according to claim 3, wherein the first bonding terminal on the display substrate and the second bonding terminal on the flip chip film are each provided in a rectangular structure.

5. The display panel of claim 4, wherein the rectangular structure of the first binding terminal comprises two first sides disposed opposite each other and two second sides disposed opposite each other, the rectangular structure of the second binding terminal comprises two third sides disposed opposite each other and two fourth sides disposed opposite each other, the first sides have a length of L1, the second sides have a length of L2, the third sides have a length of L3, the fourth sides have a length of L4,

the area of the binding is K, where K satisfies the following formula,

K＝[L3+(L1-L3)/2-γ-M1]*[L4+(L2-L4)/2-η-M2]，

6. The display panel according to claim 5, wherein the first bonding terminals on the display substrate and the second bonding terminals on the flip-chip film are arranged in an array in the first direction;

7. The display panel of claim 5, wherein the ratio of L2/L1 and L4/L3 is in the range of 1 to 3.

8. The display panel of claim 5, wherein the first direction is perpendicular to the second direction; wherein,

the first side and the third side are arranged parallel to the first direction;

9. The display panel of claim 6, wherein S1 is set to 23um to 27um and S2 is set to 18um to 22um.

10. A display panel according to claim 3, wherein in the same column along the second direction, projection portions of the second bonding terminals of two rows adjacent along the first direction in the second direction overlap.

11. The display panel of claim 5, wherein each of the sub-terminals includes a lead, the leads of the sub-terminals in a same column along the second direction being led out from a same side, the leads being electrically connected to the display area.