CN117506701A - Surface status identification method, system, thinning method and thinning machine for film supporting table - Google Patents

Abstract

The invention discloses a method, a system, a thinning method and a thinning machine for identifying the profile state of a wafer carrying platform, wherein when one wafer carrying platform is thinned, the thinning method firstly acquires real-time data obtained by detecting the profile of the wafer carrying platform in rotation in real time by a first height measuring assembly; determining a first difference value between real-time data and standard data, wherein the standard data is height data obtained by measuring the profile of a standard wafer carrying platform with the profile state meeting the requirement by the first height measuring assembly; finally, determining whether at least one first difference exceeds a first threshold; if yes, determining that the profile state of the wafer carrying platform is not in accordance with the requirement; if not, determining that the profile state of the wafer bearing platform meets the requirement. In the thinning process, the real-time data of the profile height of the wafer carrying platform detected in real time is compared with the standard data, so that whether the profile state of the wafer carrying platform meets the requirement can be effectively identified, and effective data support is provided for improving the thinning quality of the wafer.

Description

Surface status recognition method, system, thinning method and thinning machine for film supporting table

Technical field

The invention relates to the field of semiconductor device processing, in particular to a surface status recognition method, system, thinning method and thinning machine for a wafer support table.

Background technique

When thinning through a thinning machine, structures disclosed in Chinese invention patents such as CN116652767A and CN115338717A can be used. During thinning, a wafer is placed concentrically on a wafer support table. The wafer stage adsorbs and fixes the wafer and drives the wafer to rotate. At the same time, the main shaft of the grinding mechanism drives the grinding disc downward to contact the top surface of the wafer and exerts a certain amount of pressure to achieve thinning.

During the thinning process, the height of the profile (top surface) of the wafer support table is measured through the first height measurement component and the height of the top surface of the wafer on the wafer support table is measured through the second height measurement component, and based on the measurement Calculate the thickness of the wafer from the obtained profile height of the wafer stage and the height of the top surface of the wafer. Therefore, the profile state of the wafer support table is an important factor affecting the thickness measurement accuracy, and it is also an important factor affecting the total thickness deviation of the wafer after thinning. However, the existing technology lacks identification of the profile state of the wafer support table. .

Contents of the invention

The purpose of the present invention is to solve the above-mentioned problems existing in the prior art and provide a surface status recognition method, system, thinning method and thinning machine for a film-bearing table.

The purpose of the present invention is achieved through the following technical solutions:

For the thinning method, when thinning a film-bearing table, follow the following steps to determine whether the surface condition of the film-bearing table meets the requirements:

S1, obtain the real-time data measured by the first height-measuring component. The real-time data is the height data obtained by the first height-measuring component detecting the profile of the rotating film-bearing table in real time;

S2, determine the first difference between the real-time data and the standard data. The standard data is the height data obtained by measuring the height of the profile of the standard film-bearing table whose profile state meets the requirements by the first height-measuring component;

S3. Determine whether at least one of the first differences exceeds the first threshold; if so, determine that the profile state of the film receiving table does not meet the requirements; if not, determine that the profile state of the film receiving table meets the requirements. .

Preferably, the standard data is the average value of the height measured by the first height measuring component during one rotation of the standard film-bearing stage.

Preferably, in S3, when it is determined that at least one of the first differences exceeds the first threshold, it is determined that when the film-bearing stage rotates for one revolution, in the data measured by the first height measuring component The maximum value and the minimum value of The number of first differences calculated during one revolution of the film-bearing table that is greater than the first threshold is used to determine whether the profile state of the film-bearing table meets the requirements.

Preferably, if it is determined that the number of the first differences calculated during one revolution of the film-bearing stage that is greater than the first threshold is greater than all the data measured by the first height-measuring component when the film-bearing stage rotates one circle, If at least 10% of the amount is exceeded, it is determined that the surface condition of the film-bearing table does not meet the requirements.

Preferably, the thinning method also includes S4: when it is determined that the profile state of the wafer platform does not meet the requirements, after the current wafer on the wafer platform is thinned, stop the thinning machine, and The profile state of the film-bearing platform is adjusted to meet the requirements before thinning is performed.

Preferably, the S4 includes the following steps:

S41, use measuring equipment to determine whether the film receiving table is leveled. If not, adjust the leveling mechanism of the film supporting table to level the film supporting table and then perform S42; if so, perform S43;

S42, again measure the height of the top surface of the film-bearing platform through the first height measuring component and determine the profile state of the film-bearing platform. If it is determined that the profile state of the film-bearing platform meets the requirements, the reduction The thin machine resumes work; if it is determined that the profile state of the film-bearing table does not meet the requirements, execute S43;

S43, use the grinding mechanism to grind the surface of the film supporting table;

S44, the surface of the film supporting table is ground into a tapered shape through the grinding mechanism;

S45, repeat S42-S44.

Preferably, the thinning machine includes a plurality of sheet-bearing stages arranged evenly around the circumference, and the plurality of sheet-bearing stages are distributed around the axis of the indexing stage. When the plurality of sheet-bearing stages are leveled, the dividing The indexing table drives a plurality of the film-bearing tables to rotate sequentially through the second detection head of the second height-measuring assembly. The distance from the axis of the second detection head to the axis of the indexing table is equal to the distance from the axis of the film-bearing table to the centimeter. The distance between the axis of the measuring platform and the process of a film-bearing platform moving past the second detection head, a real-time height curve is formed based on the data measured by the second height measuring component, and the real-time height curve and the standard height curve are Fitting is performed to determine the errors of the two curves. If the errors of the two curves are determined to be within the third threshold range, it is determined that the profile state of the film-bearing table meets the requirements. Otherwise, it is determined that the profile state of the film-bearing table does not meet the requirements. Meet the requirements.

The method for identifying the profile status of the film-bearing table includes the following steps:

S1, when a film-bearing table is rotating for thinning, real-time data measured by the first height-measuring component are obtained. The real-time data is obtained by the first height-measuring component detecting the profile of the rotating film-bearing table in real time. altitude data;

S2, determine the first difference between the real-time data and the standard data. The standard data is the height data obtained by measuring the height of the profile of the standard film-bearing table whose profile state meets the requirements by the first height-measuring component;

S3. Determine whether at least one of the first differences exceeds the first threshold; if so, determine that the profile state of the film receiving table does not meet the requirements; if not, determine that the profile state of the film receiving table meets the requirements. .

The profile status identification system of the film loading table includes:

The data acquisition unit is used to obtain real-time data measured by the first height measuring component when a film-bearing table is rotating for thinning. The real-time data is measured by the first height-measuring component on the profile of the rotating film-bearing table. Height data detected in real time;

Difference calculation unit, used to determine the first difference between the real-time data and the standard data. The standard data is the height measurement performed by the first height measurement component on the profile of the standard film-bearing table whose profile status meets the requirements. Obtained height data;

a state judgment unit, used to determine whether at least one of the first differences exceeds a first threshold; if so, determine that the profile state of the film receiving table does not meet the requirements; if not, determine the profile status of the film receiving table The surface status meets the requirements.

A thinning machine includes a processor and a memory. The memory stores a program that can be executed by the processor. When the program is executed, the thinning method as described above or the film-bearing table as described above are implemented. Surface status identification method.

The advantages of the technical solution of the present invention are mainly reflected in:

During the thinning process, the present invention compares the real-time detected profile height data of the wafer support table with the standard data, and can effectively identify whether the profile status of the wafer support table meets the requirements, thereby improving the wafer quality. The thinning quality provides effective data support.

The present invention adopts the average data value during one rotation of the standard film-bearing table as the standard data, which is beneficial to improving the judgment accuracy.

During the judgment process, the present invention combines the difference between the maximum value and the minimum value of the data during one rotation of the film platform to determine the profile state of the film platform, and further combines the limit on the amount of abnormal data to effectively reduce the amount of abnormal data. In case of misjudgment, the accuracy of judgment can be improved.

When the profile abnormality is determined, the present invention can restore the film-bearing table in different abnormal states to a state that meets the requirements through a reasonable processing flow, thereby ensuring the thinning quality.

When the thinning machine has multiple sheet-bearing stages, the present invention can quickly and efficiently determine the profile status of the multiple sheet-bearing stages, thereby conducive to reducing the difficulty of equipment debugging and improving equipment debugging efficiency.

Description of drawings

Figure 1 is a schematic flow chart of the first embodiment of the present invention for determining whether the profile of the film receiving table meets the requirements;

Figure 2 is a schematic flow chart of a second embodiment of the present invention for determining whether the profile of the film receiving table meets the requirements;

Figure 3 is a schematic flow chart of trimming the film-bearing table when it is determined that the profile of the film-bearing table does not meet the requirements in the present invention;

Figure 4 is a first schematic diagram for determining the longitudinal height of the main axis in the present invention;

Figure 5 is a second schematic diagram for determining the longitudinal height of the main axis in the present invention;

Figure 6 is a schematic diagram of detecting the profile status of the film receiving tables when there are three film supporting tables on the indexing table according to the present invention.

Detailed ways

The objects, advantages and features of the present invention will be illustrated and explained by the following non-limiting description of preferred embodiments. These embodiments are only typical examples of applying the technical solutions of the present invention. Any technical solutions formed by adopting equivalent substitutions or equivalent transformations fall within the scope of protection claimed by the present invention.

In the description of the scheme, it should be noted that the terms "center", "upper", "lower", "left", "right", "front", "back", "vertical", "horizontal", " The orientations or positional relationships indicated by "inner", "outside", etc. are based on the orientations or positional relationships shown in the drawings, and are only for convenience and simplicity of description, and do not indicate or imply that the device or element referred to must have a specific orientation. , are constructed and operated in specific orientations and therefore should not be construed as limitations of the invention. Furthermore, the terms “first”, “second” and “third” are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

The thinning method disclosed in the present invention will be described below with reference to the accompanying drawings. Theoretically, if the profile state of the film-bearing table 1 meets the requirements, then during the rotation process of the film-bearing table 1, the first height measuring component measures The obtained height values should ideally be the same. Therefore, if during the rotation of the film-bearing stage 1, the heights at different positions measured by the first height-measuring component are consistent with the shape of the first height-measuring component. If the heights measured at the required profiles of the film receiving platform 1 are different, it can be determined that the profile state of the film receiving platform 1 does not meet the requirements. At this time, the profile of the film receiving platform 1 is deformed and /Or the profile of the film-bearing platform 1 is not horizontal (the axis of the film-bearing platform 1 is not perpendicular to the horizontal plane).

Therefore, as shown in Figure 1, when a film supporting table 1 is thinned, follow the following steps to check whether the profile state of the chip supporting table 1 meets the requirements:

S1, obtain the real-time data measured by the first height-measuring component. The real-time data is the height data obtained by the first height-measuring component detecting the profile of the rotating film-bearing table 1 in real time;

S2, determine the first difference between the real-time data and the standard data. The standard data is the height data obtained by the first height measurement component measuring the height of the profile of the standard film-bearing table 1 whose profile meets the requirements. ; When the first height measuring component measures the real-time data and the standard data, the detection position on the film supporting table is the same.

S3, determine whether at least one of the first differences exceeds the first threshold; if so, determine that the profile state of the film receiving table 1 does not meet the requirements; if not, determine the profile state of the film receiving table 1 Meet the requirements.

Due to the influence of various vibrations and other factors during thinning, when the actual height measurement of the standard film supporting table 1 is carried out through the first height measurement component, the measured data will fluctuate to a certain extent. Therefore, in order to avoid errors, all In the above S2, the standard data is preferably the average value of the height measured by the first height measuring component during one rotation of the standard film-bearing stage 1 . That is, subsequently, each measured real-time data can be compared with the standard data.

Since the measurement value of the first height measuring component will fluctuate to a certain extent, misjudgment may easily occur if it is determined that the profile state of the film receiving table 1 does not meet the requirements based on only one or two abnormal data. Therefore, as shown in Figure 2, in order to improve detection accuracy, in S3, when it is determined that at least one of the first differences exceeds the first threshold, it is also determined that the film receiving table 1 rotates once When, the maximum value and the minimum value in the data measured by the first height measurement component are determined to determine whether the second difference between the maximum value and the minimum value exceeds the second threshold. If so, then determine the film receiving stage 1 The profile state does not meet the requirements; if not, determine the number of first differences calculated during one rotation of the film-bearing table that is greater than the first threshold, and determine the profile state of the film-bearing table accordingly. does it reach the requirement.

Specifically, if it is determined that the number of the first differences calculated during one revolution of the film-bearing stage 1 is greater than the first threshold value when the film-bearing stage 1 rotates one revolution, all height measurement components measured by the first height measuring component will If at least 10% of the data amount is obtained, it is determined that the profile state of the film-bearing table 1 does not meet the requirements; otherwise, it is determined that the profile state of the film-bearing table 1 meets the requirements.

When it is determined that the profile state of the film-bearing table 1 does not meet the requirements, it is obviously necessary to adjust the profile state of the film-bearing table 1. Therefore, as shown in Figure 3, the thinning method also includes S4 , when it is determined that the profile state of the wafer platform 1 does not meet the requirements, after the current wafer on the wafer platform 1 has been thinned, the thinning machine is stopped, and the profile state of the wafer platform 1 is The condition is adjusted to meet the requirements before thinning.

Specific adjustments include the following steps:

S41, use measuring equipment to determine whether the film receiving table 1 is leveled. If not, the film supporting table 1 is not leveled. Therefore, adjust the leveling mechanism of the film supporting table 1 to level the film supporting table 1. Execute S42; if yes, that is, the film receiving table is leveled. At this time, the profile state of the film receiving table 1 does not meet the requirements due to profile deformation. Therefore, the profile needs to be trimmed, that is, perform S43; in this step , a level can be placed on the film receiving table 1 to determine whether the film holding table 1 is leveled.

S42, again use the first height measuring component to measure the height of the top surface of the film receiving platform 1 and determine the profile state of the film receiving platform 1. If it is determined that the profile state of the film receiving platform 1 meets the requirements, then The thinning machine resumes operation; if not, it can also be determined that the profile state of the film receiving table 1 does not meet the requirements due to profile deformation, so S43 is executed.

S43, the profile surface of the film supporting table 1 is ground flat by the grinding mechanism. At this time, the grinding disc 3 of the grinding mechanism passes through the center of the chip supporting table 1.

In S44, the profile surface of the film receiving table is ground into a tapered shape through the grinding mechanism and then S45 is executed. At this time, the profile surface of the film supporting table has only a small taper, and the highest point of the profile surface is the midpoint of the profile surface. During specific implementation, the leveling mechanism of the film-bearing table 1 can be adjusted so that the side of the profile of the film-bearing table 1 close to the spindle 2 is higher than the other side of the profile, and then the film-bearing table is allowed to rotate and pass through The grinding mechanism grinds the tilted portion of the film receiving table 1. At this time, after the film supporting table is ground into a tapered shape, the film supporting table 1 is then leveled. Of course, in another implementation mode, after the surface of the film supporting table is smoothed, the grinding plate leveling assembly on the main shaft can be adjusted to adjust the grinding disk to a tilted state. At this time, the lower surface of the grinding plate is close to the chip supporting table. One side is higher than the opposite side, and then the leveled film-bearing table is ground by the adjusted grinding disc, so that the profile of the film-bearing table is ground into a tapered shape.

S45, repeat S42-S44.

Through this adjustment process, two abnormal situations, namely the non-leveling of the film supporting table 1 and the deformation of the profile of the film supporting table 1, can be effectively solved. Moreover, after grinding the profile of the wafer platform 1 into a tapered shape, the wafer can be deformed by the slight deformation when the wafer is adsorbed on the wafer platform 1, so that during the thinning process, the wafer can It will not move due to the friction of the grinding disc, ensuring the stable adsorption and fixation of the wafer, which is beneficial to improving the thinning quality.

After grinding the wafer table 1, if the thickness of the wafer before thinning is determined by subtracting the thickness of the wafer from the previously determined longitudinal coordinate of the spindle, the grinding disc 3 on the spindle 2 and the wafer on the wafer table 1 The distance that the spindle 2 needs to move downward when contacting, because the height of the chip supporting table 1 is reduced after grinding, after the spindle 2 moves downward according to the above-mentioned distance required, the grinding disc 3 on the main shaft 2 cannot contact the grinding plate 3 on the chip supporting table 1 The wafer is in contact, which will cause the grinding disc 3 to be unable to thin the wafer for a period of time, reducing the efficiency.

Therefore, after grinding the chip table 1, it is necessary to re-determine the spindle longitudinal coordinates corresponding to the chip table 1 (define the axial direction of the spindle 2 as the longitudinal direction). As shown in Figure 4, manually control the spindle 2 down The grinding disc 3 moved thereon is in contact with the top surface of the tool setting block 4 on the chip holding table 1. The downward movement height S1 of the spindle 2 and the height H1 of the tool setting block 4 determined at this time are added to obtain the chip holding table. The new spindle longitudinal coordinate corresponding to stage 1. When the thinning machine resumes thinning, use the new spindle longitudinal coordinate to subtract the thickness of the wafer before thinning to obtain the distance that spindle 2 needs to move downward during this thinning. After the spindle 2 moves downward by the distance that needs to be moved, , the grinding disc 3 on the spindle 2 is in contact with the top surface of the wafer on the wafer support table 1, and subsequent thinning can be carried out according to a predetermined process.

Moreover, during each subsequent thinning, as shown in Figure 5, the new spindle longitudinal coordinate is determined based on the wafer thickness measured when the previous thinning was completed on the wafer stage 1 and the actual downward movement distance of the spindle 2. The wafer thickness T measured when thinning is completed is added to the actual downward movement distance S2 of the spindle 2 to obtain a new spindle longitudinal coordinate; and then based on the new spindle longitudinal coordinate, it is determined that the spindle 2 moves downward from the longitudinal origin to the main axis. When the grinding disc 3 on the wafer 2 contacts the top surface of the wafer on the wafer stage 1, it needs to move downward. Finally, the spindle 2 is moved downward by the distance needed to be moved downward and grinded. This can effectively avoid subtracting the thickness of the wafer before thinning from the fixed spindle longitudinal coordinate to obtain the distance that the spindle 2 needs to move downward when thinning. The problem of idle stroke caused by not considering the wear of the grinding disc 3 is not taken into account.

Furthermore, the loss amount of the grinding disc 3 after one thinning can be determined based on the two adjacent longitudinal coordinates of the spindle. This method is simpler to calculate. The total loss of the grinding disc 3 can be obtained by summing the losses after each thinning. amount, and then it can be determined whether the total loss reaches the set threshold. If so, it is determined that the grinding disc 3 needs to be replaced. Otherwise, the grinding disc 3 can continue to be used.

In addition, during the thinning process, the thinning machine may have only one sheet-bearing platform 1. More preferably, the thinning machine includes a plurality of sheet-bearing platforms 1 arranged evenly around the circumference. For example, the thinning machine may be It is the structure disclosed in the Chinese invention patent CN115338717A. As shown in Figure 6, a plurality of the film-bearing stages 1 are distributed around the axis of the indexing table 5. The multiple film-bearing stages 1 are assembled in the thinning machine. After leveling, the indexing stage 5 drives a plurality of the wafer-carrying stages 1 to rotate sequentially past the second detection head 6 of the second height-measuring component, which is used to measure the top surface height of the wafer. , the distance from the axis of the second detection head 6 to the axis of the indexing table 5 is equal to the distance from the axis of the film-bearing table 1 to the axis of the indexing table 5. When it is determined that a film-bearing table 1 rotates to the second detection When the head 6 is downward, the second detection head 6 moves downward to hit the film support table 1. At this time, the trajectory 7 drawn by the second detection head on the film support table 1 is through the film support table 1. The arc at the center of the table. When the film receiving table 1 rotates and passes through the film receiving table 1, the second detection head 6 moves upward, and when a film receiving table 1 moves past the second detection head 6 In the process, a real-time height curve is formed based on the data measured by the second height measurement component, and the real-time height curve is fitted to the standard height curve corresponding to the standard film-bearing stage 1 to determine the error of the two curves. , if it is determined that the error between the two curves is within the third threshold range, it is determined that the profile state of the film receiving table 1 meets the requirements; otherwise, it is determined that the profile state of the film receiving table 1 does not meet the requirements. In this way, the profile status of multiple film-bearing stages 1 can be quickly identified and determined, thereby improving efficiency. The standard height curve is also determined by rotating the standard film-bearing stage 1 past the second detection head 6 and based on the data measured by the second measurement component during this period. At the same time, the specific method of determining the error between the real-time height curve and the standard height curve through curve fitting is a known technology and will not be described in detail here; the third threshold can be set as needed and is not limited here. Of course, when there are multiple film-bearing stages, it is also possible to use the first height-measuring component to detect the profile of the rotating film-bearing stage when each film-bearing stage rotates to the first height-measuring component, and measure the shape of the rotating film-bearing stage according to the first height-measuring component. The real-time measured data of high components is used to judge the profile status of each film-bearing table.

Example 2

This embodiment discloses a method for identifying the profile status of the film supporting table 1, which includes the following steps:

S1, when a film-bearing table 1 is rotating for thinning, real-time data measured by the first height-measuring component are obtained. The real-time data is the real-time detection of the profile of the rotating film-bearing table 1 by the first height-measuring component. Obtained height data;

S2, determine the first difference between the real-time data and the standard data. The standard data is the height data obtained by the first height measurement component measuring the height of the profile of the standard film-bearing table 1 whose profile meets the requirements. ;

S3, determine whether at least one of the first differences exceeds the first threshold; if so, determine that the profile state of the film receiving table 1 does not meet the requirements; if not, determine the profile state of the film receiving table 1 Meet the requirements.

Example 3

This embodiment discloses a profile status identification system for the film supporting table 1, which includes:

The data acquisition unit is used to obtain real-time data measured by the first height measuring component when a film-bearing table 1 is rotating for thinning. The real-time data is the shape of the first height-measuring component to the rotating film-bearing table 1. Height data obtained from real-time detection of the surface;

The difference calculation unit is used to determine the first difference between the real-time data and the standard data. The standard data is the profile of the standard film-bearing table 1 whose profile state meets the requirements measured by the first height measurement component. High obtained altitude data;

a state judgment unit, used to determine whether at least one of the first differences exceeds a first threshold; if so, determine that the profile state of the film receiving table 1 does not meet the requirements; if not, determine that the film receiving table 1 The surface condition meets the requirements.

Example 4

This embodiment discloses a thinning machine, which includes a processor and a memory. The memory stores a program that can be executed by the processor. When the program is executed, the thinning method as described above or the thinning method as described above is implemented. Method for identifying the profile status of the film-bearing table 1.

The present invention still has multiple implementation modes, and all technical solutions formed by adopting equivalent transformation or equivalent transformation fall within the protection scope of the present invention.

Claims (10)

1. The thinning method is characterized in that: when one piece bearing table is thinned, determining whether the profile state of the piece bearing table meets the requirement according to the following steps:

s1, acquiring real-time data measured by a first height measurement assembly, wherein the real-time data is height data obtained by detecting the profile of a rotating wafer carrying platform in real time by the first height measurement assembly;

s2, determining a first difference value between the real-time data and standard data, wherein the standard data is height data obtained by measuring the profile of a standard wafer carrying platform with the profile state meeting the requirement by the first height measurement assembly;

s3, determining whether at least one first difference exceeds a first threshold; if yes, determining that the profile state of the wafer carrying platform does not meet the requirement; if not, determining that the profile state of the wafer bearing platform meets the requirement.

2. The thinning method according to claim 1, characterized in that: the standard data is a mean of heights measured by the first height measurement assembly during one revolution of the standard wafer carrier.

3. The thinning method according to claim 1, characterized in that: in the step S3, when it is determined that at least one first difference exceeds the first threshold, it is determined that a maximum value and a minimum value in data measured by the first height measurement assembly are the maximum value and the minimum value when the wafer carrying platform rotates one circle, it is determined whether a second difference between the maximum value and the minimum value exceeds a second threshold, and if yes, it is determined that the profile state of the wafer carrying platform does not meet the requirement; if not, determining the number of the first difference values which are larger than a first threshold value in the process of rotating the wafer carrying platform for one circle, and determining whether the profile state of the wafer carrying platform meets the requirement according to the number.

4. A thinning method according to claim 3, characterized in that: and if the number of the first difference values larger than the first threshold value in the first difference value calculated in the process of rotating the wafer carrying platform for one circle is determined to be larger than at least 10% of all data amounts measured by the first height measuring assembly in one circle, determining that the profile state of the wafer carrying platform is not in accordance with the requirement.

5. The method of claim 1, further comprising S4, stopping the thinning machine after the current wafer on the wafer support is thinned when the profile state of the wafer support is determined to be unsatisfactory, and thinning the wafer after the profile state of the wafer support is adjusted to be satisfactory.

6. The thinning method according to claim 5, characterized in that: the step S4 comprises the following steps:

s41, determining whether the wafer bearing table is leveled or not through a measuring device, and if not, adjusting a leveling mechanism of the wafer bearing table to enable the wafer bearing table to be leveled, and then executing S42; if yes, executing S43;

s42, measuring the top surface height of the wafer carrying platform through the first height measuring assembly again, determining the profile state of the wafer carrying platform, and if the profile state of the wafer carrying platform is determined to meet the requirement, enabling the thinning machine to resume working; if the molded surface state of the wafer carrying platform is determined to be not in accordance with the requirement, S43 is executed;

s43, grinding the molded surface of the wafer bearing table through a grinding mechanism;

s44, grinding the molded surface of the wafer bearing table into a cone shape through a grinding mechanism;

s45, repeating S42-S44.

7. The thinning method according to any one of claims 1 to 6, wherein: the thinning machine comprises a plurality of piece bearing tables which are uniformly distributed in a circumferential manner, the piece bearing tables are distributed around the axis of the dividing table, after the piece bearing tables are leveled, the dividing table drives the piece bearing tables to sequentially rotate to pass through a second detection head of a second height measurement assembly, the distance from the axis of the second detection head to the axis of the dividing table is equal to the distance from the axis of the piece bearing table to the axis of the dividing table, in the process that one piece bearing table moves to pass through the second detection head, a real-time height curve is formed according to data measured by the second height measurement assembly, the real-time height curve is fitted with a standard height curve to determine errors of the two curves, if the errors of the two curves are determined to be within a third threshold range, the molded surface state of the piece bearing table is determined to meet the requirements, and otherwise, the molded surface state of the piece bearing table is determined to be not met.

8. The method for identifying the profile state of the wafer carrying platform is characterized by comprising the following steps of:

s1, when one wafer carrying platform rotates to thin, acquiring real-time data measured by a first height measurement assembly, wherein the real-time data is height data obtained by the first height measurement assembly through real-time detection of the molded surface of the wafer carrying platform in rotation;

s2, determining a first difference value between the real-time data and standard data, wherein the standard data is height data obtained by measuring the profile of a standard wafer carrying platform with the profile state meeting the requirement by the first height measurement assembly;

s3, determining whether at least one first difference exceeds a first threshold; if yes, determining that the profile state of the wafer carrying platform does not meet the requirement; if not, determining that the profile state of the wafer bearing platform meets the requirement.

9. The profile state identification system of the wafer carrying platform is characterized by comprising:

the data acquisition unit is used for acquiring real-time data measured by the first height measurement assembly when one wafer carrying platform rotates to thin, wherein the real-time data is height data obtained by the first height measurement assembly through real-time detection of the molded surface of the wafer carrying platform in rotation;

the difference value calculation unit is used for determining a first difference value between the real-time data and standard data, wherein the standard data is height data obtained by measuring the profile of a standard wafer carrying platform with the profile state meeting the requirement by the first height measurement assembly;

a state judging unit for determining whether at least one of the first differences exceeds a first threshold; if yes, determining that the profile state of the wafer carrying platform does not meet the requirement; if not, determining that the profile state of the wafer bearing platform meets the requirement.

10. The thinning machine comprises a processor and a memory, wherein the memory stores a program which can be executed by the processor, and the thinning machine is characterized in that: the program, when executed, implements the thinning method according to any one of claims 1 to 7 or the profile state recognition method of the wafer stage according to claim 8.