CN1173212C - Bonding device for chip on glass in liquid crystal display - Google Patents

Abstract

A device for bonding chip on glass in LCD(liquid crystal display) device is provided to reduce an interference of a signal generated inter data line by sticking an LCD drive chip on a glass of an LCD device directly. A bonding head unit and a worktable unit is connected with a chip carriage unit . A robot unit operates in X-Y axis. A bonding head assembled in the bonding head unit descends on a slide in case the robot unit supplies with an IC(integrated circuit) chip. The IC chip is bonded on a glass for an appointed second in an appointed range of temperature.

Description

Bonding device for chips on glass in liquid crystal displays

Technical field

The present invention relates to a chip-on-glass bonding device in a liquid crystal display, and more specifically, to a chip-on-glass bonding device in a liquid crystal display, which can directly drive the LCD (liquid crystal display) chip Bonded to TFT glass of LCD devices.

Background technique

Figure 14a shows a block diagram of a prototype LCD (Liquid Crystal Display). Generally, most LCD devices are sold as prototypes in the market as they become thin, light, and compact. As shown in the figure, the LCD driver chip is first packaged not by QFP method, but by TAP (tape automatic bonding) method, and mounted on the PCB. Thereafter, the external leads of the chip are bent and then connected to the TFT glass.

Next, Fig. 14b shows a structural diagram of an LCD, wherein the LCD is made thinner, lighter and smaller by means of the chip-on-glass method for directly packaging the LCD driver chip on the TFT glass. As shown in Figure 14c, this kind of LCD forms a metallization layer on both sides of the TFT glass, and then the LCD driver chip is bonded on the metallization layer. The LCD driver chip is bonded by a SBB COG (tapped bump bonded chip on glass) method, that is, a conductive polymer is placed on the gold bump formed on each solder joint of the chip while passing Polymerization is bonded.

However, conductive polymers have a disadvantage of increasing manufacturing costs due to the need to be very precise when the conductive polymer is placed on each pad.

Conductive polymers have another disadvantage in that they are poorly conductive since their electrical resistance is 10 to 100 times higher than that of various other common materials, and once the conductive polymer is polymerized and bonded to the chip, it is difficult to repair.

                     

Therefore, the object of the present invention is to provide a chip-on-glass bonding device in a liquid crystal display, which can directly bond an LCD (liquid crystal display) driver chip to the glass of the LCD device.

In order to achieve the above object, the present invention provides a chip-on-glass bonding device in a liquid crystal display, wherein the bonding material is tightly applied on the TFT glass, and is melted by the high-temperature heat of a heating plate to bond each driving chip. Knot on glass. The bonding material is made of polystyrene resin, ethylene acetate resin (EVA) or ethylene acetyl resin as a thermoplastic resin family, or phenol resin, urea resin, melanin resin, alkyd resin as a thermosetting resin family Resin, polyester resin, silicone resin, epoxy resin, urethane resin or furan methanol resin.

Description of drawings

Other objects and advantages of the present invention can be more fully understood from the following detailed description made in conjunction with the accompanying drawings, in the accompanying drawings:

Fig. 1 shows a partial sectional front view, showing the assembled state of the present invention;

Fig. 2 shows a partial sectional side view showing the assembled state of the present invention;

Figure 3 shows an enlarged front view of the bonding head unit of the present invention;

Figure 4 shows an enlarged side view of the bonding head unit of the present invention;

Figure 5 shows a front view of the bench unit of the present invention;

Figure 6 shows a plan view of the bench unit of the present invention;

Figure 7 shows a plan view of the chip transfer unit of the present invention;

Figure 8 shows a side view of the chip transfer unit of the present invention;

Figure 9 shows a front view of the robotic cell operating on the X-Y axis;

Figure 10 shows a side view of the robotic cell operating on the X-Y axis;

Figure 11 shows a side view, showing the state of ACF bonded on the glass;

Fig. 12 shows a side view, showing the state of COG type IC chip bonding;

Fig. 13 shows the partial sectional enlarged side view of each main part of the present invention;

14a to 14c show structural views of a liquid crystal display (LCD) using a conventional TAP.

Detailed ways

The present invention will now be described in detail in connection with preferred embodiments with reference to the accompanying drawings. For reference, like reference numerals designate corresponding parts throughout the several views.

The invention includes a bonding head unit, a working table unit and a chip transfer element, so as to bond the driving chip on the TFT glass. The driver chip is moved automatically by a robotic unit operating on the X-Y axis.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

Fig. 1 shows a partial sectional front view, showing the assembly state of the present invention; Fig. 2 shows a partial sectional side view, showing the assembly state of the present invention; Fig. 3 shows the enlarged front view of the bonding head unit of the present invention; Fig. 4 shows the enlarged side view of bonding head unit of the present invention; Fig. 5 shows the front view of workbench unit of the present invention; Fig. 6 shows the plane view of workbench unit of the present invention; Fig. 7 shows the present invention Plan view of the chip transfer unit; FIG. 8 shows a side view of the chip transfer unit of the present invention; FIG. 9 shows a front view of the robot cell operating on the X-Y axis; FIG. 10 shows a side view of the robot cell operating on the X-Y axis ; Fig. 11 shows a side view, showing the state that ACF is bonded on the glass; Fig. 12 shows a side view, showing the state of COG (chip on glass) type IC chip bonding; Fig. 13 shows the state of the present invention Partial cross-sectional enlarged side views of main parts; and FIGS. 14a to 14c show structural views of a liquid crystal display (LCD) using a conventional TAP.

First, as shown in FIGS. 3 and 4 , the air cylinder 28 is fixed on the support 11 on the sliding bearing 12 formed on both sides, and the plate 10 to be connected with the bonding head 29 is arranged below the air cylinder 28 .

At this time, the temperature generated by the bonding head 29 is applied differently depending on the operating conditions, but it is preferably applied within a temperature range of 170° C. to 220° C. for 5 to 10 seconds.

Secondly, preferably, according to the bonding material, the pressure is 2Mpa, 40kg/cm ² .

The bonding head 29 is vertically slidably moved along the slide rail 46 by operating the air cylinder 28 .

Figures 5 and 6 show front and plan views of the bench unit. A milling jig 32 is assembled on the plate platform 31 , and the camera 47 is assembled on the platform support 30 , so that the operator can constantly observe the state of bonding of the glass 52 , the bonding material 53 and the driver chip 45 .

7 and 8 show a plan view and a side view of a chip transfer unit. The key part (key) (not shown) where chip pin 37 is fixed is fixed on another plate 10 and absorbs the driver chip 45 stored in the robot unit 48 under vacuum conditions, and simultaneously moves along the side by operating the air cylinder 28. to move. Thereafter, the critical part is automatically moved to the bonding head to be sucked under vacuum. The chip transfer unit is returned to its original position by the air cylinder 28 and dropped. Thereafter, the operator adjusts the position of the chip transfer unit through the camera 47 , and then sticks the driver chip 45 on the glass surface placed on the workbench unit 49 .

Figures 9 and 10 show front and plan views of the robotic cell operating on the X-Y axis. The connecting plate 42 can rotate laterally by rotating the ball screw 39 connected to the motor bracket 44 .

Secondly, a plurality of driving chips 45 are located on the connection plate 42 and transferred by the chip transfer unit 50 .

At this time, polystyrene resin, ethylene acetate resin (EVA) or ethylene acetyl resin as thermoplastic resin family, or phenol resin, urea resin, melanin resin, alkyd resin as thermosetting resin family are used. Adhesive materials made of resin, polyester resin, silicone resin, epoxy resin, urethane resin or furan methanol resin. The bonding material is tightly applied on the glass, and is melted by the high-temperature heat of the heating plate to bond the driver chip on the glass.

The above bonding can be accomplished by continuously manipulating the robot unit 48 , the chip transfer unit 50 , the stage unit 49 and the bonding head unit 51 .

The operation and effects of the present invention will be described in more detail as follows.

First, the operator places the plurality of driving chips 45 on the board 10 working on the X-Y axis by manipulating the ball screw 39 assembled on the robot unit 48, and waits for the next step.

At this time, the heating plate 17 and the bonding head 29 assembled to the bonding head unit 51 are raised along the slide rail 46 by operating the air cylinder 28 .

Thereafter, the case 19 and the backing plate 13 integrally formed with the chip transfer unit 50 are moved to the driving chip 45 on the board 10 by operating the air cylinder 28 .

Next, in the chip transfer unit 50, the vacuum cushion 38 is fixed to the rotating driver 36 connected to the mounting bracket, so that the driving chip 45 is momentarily sucked under vacuum and moved by the supplied air.

The driving chip sucked under vacuum is moved onto the bonding head 29 to be sucked under vacuum, and the chip transfer unit 50 returns to its original position.

Next, the bonder 29 is dropped by operating the air cylinder 28 .

At this time, the driving chip 45 will not move because the bonding material 53 is bonded to the surface of the glass 52 .

Next, the operator adjusts the imprinted ITO lines (not shown) on the glass 52 and the bumps of the drive chip 45 using the X, Y and θ stages to make them the same through the camera 47 installed under the stage unit 49 . Thereafter, when the operator presses a switch (not shown), the slide rail 46 moves backward by operating the air cylinder 28, and the bonding head 29 falls, thereby heat-pressing the glass and driving the chip.

Then, after a prescribed time, a working cycle ends as the bonding head 29 rises, and then the bonding device returns to the initial position.

Industrial Applicability

As described above, according to the structure of the LCD panel of the present invention, signal interference and EMI phenomenon generated between a plurality of data lines installed on the glass of the COG type LCD panel can be reduced, Signal distortion is reduced.

While the invention has been described with reference to specific illustrated embodiments, it is not to be limited by the embodiments but only by the appended claims. It should be understood that those skilled in the art can change or modify the embodiments without departing from the scope and spirit of the present invention.

Claims (5)

1. the adhering device of glass top chip in a LCD (LCD) device, it is on glass to be used for that directly the LCD chip for driving is bonded in LCD device TFT, and this adhering device comprises bonding head unit, countertop unit, chip delivery unit and robot cell,

Wherein, bonding head unit and countertop unit are connected on the chip delivery unit, on glass chip for driving is bonded in TFT, and when chip for driving is supplied with by the robot cell who operates on the X-Y axis, being assembled into the head that bonds on the bonder unit falls along slide rail, make chip for driving on glass through being bonded in for 5～10 seconds under 170 ℃～220 ℃ temperature by means of binding material, described binding material is made by thermoplastic resin family or thermosetting resin family.

2. adhering device as claimed in claim 1, it is characterized in that, video camera is installed on the platform support that is connected on the tabular platform of countertop unit, regulates the position arrangement of chip for driving and glass to allow the operator, confirms this position arrangement by watch-dog simultaneously.

3. adhering device as claimed in claim 1, it is characterized in that, the critical component that chip pin is fixed on the chip delivery unit is fixed on the plate, and chip for driving among the robot cell is left in absorption under vacuum condition, laterally move by the operation cylinder simultaneously, and move to countertop unit.

4. adhering device as claimed in claim 1 is characterized in that, the robot cell is lateral rotation by the rotation that is connected in the ball-screw that connects plate and electric machine support.

5. adhering device as claimed in claim 1 is characterized in that, the heat of high temperature of described binding material by bonding head melted and chip for driving be bonded on glass.

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