CN117234005A - Backlight modules and display modules - Google Patents
Backlight modules and display modules Download PDFInfo
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- CN117234005A CN117234005A CN202311324743.XA CN202311324743A CN117234005A CN 117234005 A CN117234005 A CN 117234005A CN 202311324743 A CN202311324743 A CN 202311324743A CN 117234005 A CN117234005 A CN 117234005A
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Abstract
The application provides a backlight module and a display module, wherein the backlight module comprises a shell, a light source, a light guide plate and a flexible circuit board, wherein the light source, the light guide plate and the flexible circuit board are positioned in the shell; the flexible circuit board is positioned on one side of the light guide plate, which is close to the bottom of the shell, and is provided with a first side of the light source and a second side, which is far away from the light source, along a second direction perpendicular to the first direction; the first side and the light guide plate are adhered by a first double-sided adhesive tape, and the first double-sided adhesive tape covers the part of the first side except the light source; the second side is provided with a thermal function layer, the thermal function layer is a heat dissipation layer or a heat insulation layer or a composite layer formed by the heat dissipation layer and the heat insulation layer, the thermal function layer is bonded with the second side of the flexible circuit board, and the second end, far away from the light source, of the light guide plate is bonded with the bottom of the shell through second double-sided adhesive tape. The flexible circuit board is arranged on the heat functional layer at the second side and used for accelerating heat dissipation or heat insulation, thereby solving the problem of heat generation of the lamp socket of the backlight module.
Description
Technical Field
The present application relates to a backlight module, and more particularly to a backlight module and a display module.
Background
In the liquid crystal display module, the liquid crystal display panel cannot emit light, so that the liquid crystal display panel needs to be matched with the backlight assembly for use. In order to meet the requirement of light and thin liquid crystal display modules, the placement mode of LEDs (Light Emitting Diode, light emitting diodes) of the backlight source of the liquid crystal display module is generally side-entry. In order to reduce the frame, the backlight source adopts an inverse structure design, namely, an LED_FPC (Light Emitting Diode _ Flexible Printed Circuit, a flexible circuit board of a light emitting diode) is fixed below the light guide plate. The anti-group structure is in the complete machine fall the in-process, the circumstances that light guide plate and LED_FPC separate appears easily to appear the lamp stand light leak, can also appear because of light guide plate and LED_FPC separate, the light guide plate aversion striking LED appears the dead lamp phenomenon of LED, perhaps the light guide plate aversion striking chase appears the cracked phenomenon of light guide plate.
Disclosure of Invention
The embodiment of the application aims to provide a backlight module and a display module, which are used for solving the problem that a light guide plate is easily separated from an LED_FPC in the falling process of the backlight module. The specific technical scheme is as follows:
the application provides a backlight module, which comprises a shell, a light source, a light guide plate and a part of flexible circuit board, wherein the light source, the light guide plate and the part of flexible circuit board are positioned in the shell; the flexible circuit board is positioned on one side of the light guide plate, which is close to the bottom of the shell, and is perpendicular to the plane where the light guide plate is positioned along a second direction, the flexible circuit board is provided with a first side and a second side which are arranged in opposite directions, the first side is a side close to the light source, and the second side is a side away from the light source; the first side and the light guide plate are adhered by a first double-sided adhesive tape, and the first double-sided adhesive tape covers the part of the first side except the light source; the second side is provided with a thermal function layer, the thermal function layer is a heat dissipation layer or a heat insulation layer or a composite layer formed by the heat dissipation layer and the heat insulation layer, the thermal function layer is bonded with the second side of the flexible circuit board, and the second end, far away from the light source, of the light guide plate is bonded with the bottom of the shell through second double-sided adhesive tape.
According to the backlight module provided by the first aspect of the application, the backlight module can also have the following technical characteristics:
in some embodiments, the flexible circuit board comprises a first cover film, a first adhesive layer, a first electroplated layer, a first copper foil layer, a substrate layer, a second copper foil layer, a second electroplated copper layer, a second adhesive layer and a second cover film which are sequentially stacked, wherein the first cover film is positioned on the first side, and the second cover film is positioned on the second side; the first electroplated copper layer is provided with a first wiring layer and a first grounding layer which are formed by etching, the first wiring layer is insulated from the first grounding layer, and the first grounding layer is arranged around the first wiring layer; the second electroplated copper layer is provided with a second grounding layer formed by etching; the second covering film and the second adhesive layer are provided with at least one first window, the first window is a first copper leakage area, and the first window and the second grounding layer are arranged oppositely; the first grounding layer and/or the second grounding layer are/is electrically connected with a grounding pin of the flexible circuit board.
In some embodiments, the extending direction of the first window is parallel to the extending direction of the second ground layer, and is spaced apart from the extending direction of the second ground layer.
In some embodiments, the first cover film and the first adhesive layer include a plurality of second windows, the second windows are second copper leakage areas, the second copper leakage areas are provided with bonding pads, and the light source is electrically connected with the bonding pads.
In some embodiments, the flexible circuit board includes at least one first conductive via through which the first ground layer and the second ground layer are electrically connected.
In some embodiments, the flexible circuit board includes a plurality of second conductive vias, the second electroplated copper layer further having an etched second trace layer, the first trace layer and the second trace layer being electrically connected through the second conductive vias.
In some embodiments, the first double-sided tape is provided with an avoidance portion, and the avoidance portion is opposite to the light source; or the first double faced adhesive tape is arranged in the area between the two boundary lines of the light source along the first direction and the same side boundary line of the flexible circuit board.
In some embodiments, the thermal-functional layer covers at least the first copper-leakage region.
In some embodiments, a protective layer is disposed on a side of the thermal functional layer facing away from the light guide plate, and the protective layer is bonded to the thermal functional layer.
In some embodiments, the heat dissipation layer is formed by laminating a third double-sided adhesive tape and a heat dissipation material, or the heat dissipation layer is a heat dissipation adhesive layer; the heat insulation layer is formed by laminating the third double-sided adhesive tape and a heat insulation material; the heat insulation layer in the composite layer is close to the second covering film, the composite layer is formed by laminating the third double-sided adhesive, the heat insulation material and the heat radiation material, or the heat radiation layer in the composite layer is close to the second covering film, and the composite layer is formed by laminating the heat radiation double-sided adhesive layer and the heat insulation material.
The second aspect of the present application provides a display module, where the display module includes a display panel and the backlight module described above, and the backlight module is disposed on a surface of the display panel away from the display side.
The embodiment of the application has the beneficial effects that:
according to the backlight module and the display module provided by the embodiment of the application, the part of the flexible circuit board of the backlight module is positioned below the light guide plate, so that the distance of the flexible circuit board beyond the first end of the light guide plate is reduced, the space of the frame occupied by the flexible circuit board is reduced, and the frame is reduced. The first side of the flexible circuit board is adhered with the light guide plate through the first double-sided adhesive tape, and the flexible circuit board is fixed. The second side of flexible circuit board is provided with thermal functional layer, and thermal functional layer is used for accelerating heat dissipation or thermal-insulated to solve the problem that backlight unit lamp stand generates heat, improve user experience.
Of course, it is not necessary for any one product or method of practicing the application to achieve all of the advantages set forth above at the same time.
Drawings
In order to more clearly illustrate the embodiments of the application or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the application, and other embodiments may be obtained according to these drawings to those skilled in the art.
Fig. 1 is a schematic structural diagram of a display module according to an embodiment of the present application;
FIG. 2 is a schematic cross-sectional view of a first end of the display module of FIG. 1;
FIG. 3 is a schematic cross-sectional view of the second end of the display module;
FIG. 4 is a schematic view of a first side of a flexible circuit board;
FIG. 5 is a schematic diagram of a second side of the flexible circuit board;
FIG. 6 is a schematic diagram of a stacked structure of a flexible circuit board in one position;
FIG. 7 is a schematic view of a laminated structure of a flexible circuit board in another position;
fig. 8 is a schematic view of temperature observation of a side of the flexible circuit board facing away from the flexible circuit board in the solutions 1 and 4;
fig. 9 is a schematic diagram showing temperature observation of one side of the flexible circuit board attached in the embodiment 1 and the embodiment 4;
fig. 10 is a schematic view of temperature observation of a side of the flexible circuit board facing away from the flexible circuit board in the schemes 2 and 4;
fig. 11 is a schematic view of temperature observation of a side of the flexible circuit board attached in the embodiments 2 and 4;
fig. 12 is a schematic view of temperature observation of a side of the flexible circuit board facing away from the flexible circuit board in the case of the embodiments 3 and 4;
fig. 13 is a schematic view of temperature observation of the side of the flexible circuit board attached in the embodiment 3 and the embodiment 4.
The reference numerals are as follows:
a display panel 100; an array substrate 101; an opposing substrate 102; an optical adhesive 103; a glass cover plate 104; an upper polarizer 105; a lower polarizer 106;
a backlight module 200; a housing 201; a light source 202; a light guide plate 203; a first end 203a; a second end 203b;
a flexible circuit board 204; a first side 204a; a second fenestration 204a1; a second side 204b; a first fenestration 204b1; a main body 204c; a bending portion 204d; a golden finger 204e; ground pin 204e1; a first wiring layer 2041; a first ground layer 2042; a second ground layer 2043; a second wiring layer 2044; a first conductive via 2045; a second conductive via 2046; pad 2047;
a first cover film a1; a first adhesive layer a2; a first plating layer a3; a first copper foil layer a4; a base material layer a5; a second copper foil layer a6; a second electroplated copper layer a7; a second adhesive layer a8; a second cover film a9;
a thermal functional layer 205; a first double sided adhesive 206; a second double sided adhesive 207; a light shielding adhesive 208; a light enhancement sheet 209; an upper light enhancement film 209a; a lower light enhancement film 209b; a diffusion sheet 210; a reflection sheet 211; a main FPC 212; a copper foil 213; COF 214; binding mylar 215; elevating the sheet 216; a housing 217; a first direction X; a second direction Y.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. Based on the embodiments of the present application, all other embodiments obtained by the person skilled in the art based on the present application are included in the scope of protection of the present application.
When the backlight source of the backlight module 200 adopts a reversed structure, that is, the led_fpc is fixed below the light guide plate 203, the prism sheet 209 and the diffusion sheet 210 do not need to be avoided, which is favorable for reducing the frame, but when the backlight module 200 falls down carelessly, the separation of the light guide plate 203 and the led_fpc is easy to occur. The light guide plate 203 is separated from the LED_FPC, so that not only can the phenomenon of light leakage of a lamp socket occur, but also the phenomenon that the light guide plate 203 impacts an LED, so that the LED dies, even the phenomenon that the light guide plate 203 impacts an iron frame occurs, and the phenomenon that the light guide plate 203 breaks occurs.
In order to solve the above technical problems, the present application provides a display module, as shown in fig. 1, the display module includes a display panel 100 and a backlight module 200, and the backlight module 200 is disposed on a surface of the display panel 100 away from a display side. The display module may be a display screen or the display module may be a component of an electronic device. The electronic device may include a cell phone, a car navigator, a display, a notebook computer, a tablet computer, a television, or the like.
Taking the display panel 100 as an example of the liquid crystal display panel 100, the backlight module 200 is located at one side of the liquid crystal display panel 100, and the liquid crystal display panel 100 may include, for example, an array substrate 101 and an opposite substrate 102, where liquid crystal is disposed between the array substrate 101 and the opposite substrate 102. Under the power-on condition, the backlight module 200 can emit light, and the light is emitted to the liquid crystal display panel 100 after undergoing the steps of convergence, diffusion, and the like. The liquid crystal of the liquid crystal display panel 100 can correspondingly control the transmission degree of light, so as to display images.
Specifically, a lower polarizer 106 is disposed on a side of the array substrate 101 away from the opposite substrate 102, an upper polarizer 105 and a glass cover plate 104 are sequentially disposed on a side of the opposite substrate 102 away from the array substrate 101, and the glass cover plate 104 and the upper polarizer 105 are bonded by an optical adhesive 103.
As shown in fig. 1-3, the backlight module 200 includes a housing 201, a light source 202, a light guide plate 203 and a flexible circuit board 204, wherein the light source 202 is disposed at a first end 203a of the light guide plate 203, and the light source 202 is electrically connected to the flexible circuit board 204 along a first direction X, which is parallel to a long side direction of a plane where the light guide plate 203 is disposed. The flexible circuit board 204 is partially located on a side of the light guide plate 203 near the bottom of the housing 201, along a second direction Y, the second direction Y is perpendicular to a plane on which the light guide plate 203 is located, and the flexible circuit board 204 has a first side 204a and a second side 204b disposed opposite to each other, where the first side 204a is a side near the light source 202, and the second side 204b is a side away from the light source 202. The first side 204a is adhered to the light guide plate 203 by a first double-sided adhesive tape 206, and the first double-sided adhesive tape 206 covers a portion of the first side 204a except the light source 202. The second side 204b is provided with a thermal functional layer 205, the thermal functional layer 205 is a heat dissipation layer or a heat insulation layer or a composite layer formed by the heat dissipation layer and the heat insulation layer, the thermal functional layer 205 is adhered to the second side 204b of the flexible circuit board 204, and the second end 203b of the light guide plate 203, which is far away from the light source 202, is adhered to the bottom of the housing 201 through a second double-sided adhesive 207.
In this embodiment, a portion of the flexible circuit board 204 is located at a side of the light guide plate 203 near the bottom of the housing 201, i.e., a portion of the flexible circuit board 204 is located below the light guide plate 203, so that the distance between the flexible circuit board 204 and the first end 203a of the light guide plate 203 is reduced, and therefore, the space of the frame occupied by the flexible circuit board 204 is reduced, which is beneficial to reducing the frame. The first side 204a of the flexible circuit board 204 is adhered to the light guide plate 203 through the first double-sided adhesive 206, so as to fix the flexible circuit board 204.
The first double-sided tape 206 covers a portion of the first side 204a of the flexible circuit board 204 other than the light source 202, and in one embodiment, an avoiding portion may be disposed on the first double-sided tape 206, where the avoiding portion is opposite to the light source 202. By arranging the avoiding portion on the first double-sided tape 206, the light source 202 is not covered by the first double-sided tape 206, so that light emitted by the light source 202 is irradiated to the light guide plate 203, and is transmitted to the display panel 100 which cannot emit light autonomously through the light guide plate 203, such as the liquid crystal display panel 100, and the backlight module 200 is used for lighting a screen.
In another embodiment, the position of the first double-sided tape 206 may be controlled to avoid the light source 202, for example, the first double-sided tape 206 is disposed between two boundary lines of the light source 202 along the first direction and the same boundary line of the flexible circuit board 204.
The second side 204b of the flexible circuit board 204 is provided with a thermal functional layer 205, and the thermal functional layer 205 is used for accelerating heat dissipation or heat insulation, so that the problem that the lamp socket of the backlight module 200 heats is solved, and the user experience is improved.
Specifically, the thermal functional layer 205 is a heat dissipation layer, for example, the heat dissipation layer may be a graphite sheet, a copper foil, an aluminum foil, a heat conductive single-sided adhesive, a heat conductive double-sided adhesive, or the like. The heat dissipation layer can accelerate the heat transfer of one side of the flexible circuit board 204 to the outside, reduce the temperature of the lamp socket position of the backlight module 200, and solve the problem of heating of the lamp socket of the backlight module 200. Alternatively, the thermal functional layer 205 may be a thermal insulating layer, such as a polymer thermal insulating film, an aerogel thermal insulating film, or the like. The heat insulating layer can reduce the transmission speed of heat to the lamp socket position, solves the problem that backlight module 200 lamp socket generates heat. Or when the heat functional layer 205 is a composite layer formed by a heat dissipation layer and a heat insulation layer, on one hand, the heat transfer speed to the lamp socket position can be reduced, and on the other hand, the heat transferred to the lamp socket position can be rapidly exported, so that the problem of heating at the lamp socket position of the backlight module 200 is further solved.
As shown in fig. 2, the first end 203a of the light guide plate 203 is bonded to the flexible circuit board 204, but the flexible circuit board 204 is not bonded to the bottom of the housing 201, and the backlight module 200 does not generate downward force on the flexible circuit board 204 during the falling process of the backlight module 200, so that the flexible circuit board 204 and the light guide plate 203 are not easy to separate, thereby solving the problem of light leakage of the lamp socket caused by separation of the flexible circuit board 204 and the light guide plate 203 during the falling process. Meanwhile, as shown in fig. 3, the second end 203b of the light guide plate 203 is opposite to the first end 203a, and the second end 203b is adhered to the bottom of the housing 201 by a second double-sided tape 207, which also can play a role in fixing the light guide plate 203. On the one hand, in the whole machine drop test (directional vertical drop and roller drop), the light leakage phenomenon caused by the separation of the light guide plate 203 and the flexible circuit board 204 due to the dead weight of the light guide plate 203 can be prevented, the problem of the light guide plate 203 cracking caused by the displacement of the light guide plate 203 can also be prevented, on the other hand, the second side 204b of the flexible circuit board 204 is contacted with the thermal function layer 205, the problem of burning at the position of the lamp socket of the module can be effectively avoided, the optical quality of the backlight module 200 is improved, for example, the problems of light leakage, lamp shadow, yellowing and the like are avoided, and the display effect of the display device is improved.
The first double-sided adhesive 206 and the second double-sided adhesive 207 may be the same type of double-sided adhesive, or different types of double-sided adhesive.
The housing 201 may be a metal housing 201, such as iron, steel, aluminum, copper, etc., and may form a path for discharging static electricity, so as to reduce the damage of static electricity to the backlight module 200.
Fig. 4 is a schematic structural diagram of the first side 204a of the flexible circuit board 204, and fig. 5 is a schematic structural diagram of the second side 204b of the flexible circuit board 204. The flexible circuit board 204 includes a main body portion 204c, a bending portion 204d and a golden finger 204e, wherein the main body portion 204c is a portion where the light source 202 is disposed, the bending portion 204d connects the main body portion 204c and the golden finger 204e, and the golden finger 204e is bent outside the housing 201 through the bending portion 204d, that is, a portion of the flexible circuit board 204 is located in the housing 201, and the housing 201 includes a bottom wall and a side wall connected to the bottom wall, and the bottom wall and the side wall form a space for accommodating the light source 202, the light guide plate 203 and the flexible circuit board 204. The bottom of the case 201, i.e., the inner side of the bottom wall, i.e., the side not in contact with the outside.
Fig. 6 and 7 are schematic diagrams of the laminated structure of the flexible circuit board 204. The flexible circuit board 204 includes a first cover film a1, a first adhesive layer a2, a first electroplated layer a3, a first copper foil layer a4, a base material layer a5, a second copper foil layer a6, a second electroplated copper layer a7, a second adhesive layer a8 and a second cover film a9, which are sequentially stacked, the first cover film a1 is located on the first side 204a, and the second cover film a9 is located on the second side 204b.
As shown in fig. 4, the first electroplated copper layer has a first wiring layer 2041 and a first grounding layer 2042 formed by etching, the first wiring layer 2041 and the first grounding layer 2042 are insulated, and the first grounding layer 2042 is disposed around the first wiring layer 2041. As shown in fig. 5, the second electroplated copper layer a7 has a second ground layer 2043 formed by etching; the second covering film a9 and the second adhesive layer a8 have at least one first window 204b1, the first window 204b1 is a first copper leakage area, and the first window 204b1 is disposed opposite to the second ground layer 2043. The first and second ground layers 2042, 2043 are electrically connected to the ground pin 204e1 of the flexible circuit board 204.
The first ground layer 2042 surrounds the first routing layer 2041, optionally, the first ground layer 2042 is disposed within a peripheral boundary line of the flexible circuit board 204 and is disposed close to the peripheral boundary line thereof, so that more space is provided inside the first ground layer 2042 for disposing the first routing layer 2041, which is convenient for manufacturing the first ground layer 2042 and the first routing layer 2041, and is beneficial for improving the manufacturing yield of the flexible circuit board 204.
The second ground layer 2043 may be disposed within and close to the peripheral boundary line of the flexible circuit board 204, so as to facilitate the manufacture of the second ground layer 2043 and improve the manufacturing yield of the flexible circuit board 204.
Based on the cooperation of the first grounding layer 2042 and the second grounding layer 2043, static electricity can be directly or indirectly led out through the first grounding layer 2042 and the second grounding layer 2043 connected to the grounding pin 204e1 without using the metal housing 201, so that the damage of static electricity to the backlight module 200 is reduced.
On the other hand, as shown in fig. 5 and 7, at least one first opening 204b1 is formed on the second cover film a9 and the second adhesive layer a8, so that the second electroplated copper layer a7 inside the second adhesive layer a8 is exposed, that is, the first opening 204b1 corresponds to the first copper leakage area and is opposite to the second grounding layer 2043, and the second side 204b of the flexible circuit board 204 is in contact with the thermal functional layer 205, so that the problem of burning at the lamp socket position of the backlight module 200 can be effectively avoided, and the optical taste of the backlight module 200 and the display effect of the display device are improved. The number of the first windows 204b1 may be plural, such as two, three, four, etc., and the larger the number of the first windows 204b1 is, the larger the area for contact with the thermal function layer 205 is, the more effective heat dissipation is facilitated.
In some embodiments, the first ground layer 2042 and the second ground layer 2043 are metal wiring layers disposed continuously, and are generally in a shape of a Chinese character 'hui', and the first ground layer 2042 and the second ground layer 2043 are not in a strict sense due to the existence of the golden finger 204e and the bending portion 204 d. As shown in fig. 4 and 5, the shapes of the first ground layer 2042 and the second ground layer 2043 are not necessarily identical, the first ground layer 2042 may be in a shape of a Chinese character 'hui', and the second ground layer 2043 further includes metal traces disposed at the positions of the bending portion 204d and the gold finger 204e and is electrically connected with the ground pin 204e1 at the position of the gold finger 204 e. In this case, the first ground layer 2042 is not directly electrically connected to the ground pin 204e1, but is indirectly electrically connected to the ground pin 204e1 through the second ground layer 2043.
Of course, the flexible circuit board 204 includes not only the ground pin 204e1 but also other pins such as a positive pin, a negative pin, and the like.
In some embodiments, as shown in fig. 5, the extending direction of the first window 204b1 is parallel to the extending direction of the second ground layer 2043 and is spaced apart.
The extending direction of the first window 204b1 is the same as the extending direction of the second ground layer 2043, so that the area of the first copper leakage area formed by exposing the first window 204b1 is larger, the contact area between the first copper leakage area and the thermal function layer 205 can be increased, the heat dissipation capability of the flexible circuit board 204 is improved, and the problem of heat generation of the lamp socket of the backlight module 200 is solved.
In some embodiments, as shown in fig. 4, the first cover film a1 and the first adhesive layer a2 include a plurality of second windows 204a1, the second windows 204a1 are second copper leakage areas, the second copper leakage areas are provided with bonding pads 2047, and the light source 202 is electrically connected with the bonding pads 2047.
By opening the first cover film a1 and the first adhesive layer a2 with the plurality of second windows 204a1, the first electroplated copper layer inside the first adhesive layer a2 is exposed, that is, the second windows 204a1 correspond to the second copper leakage areas and are opposite to the first wiring layer 2041, so that the light source 202 is electrically connected with the first wiring layer 2041 through the bonding pads 2047. The light source 202 and the bonding pad 2047 can be electrically connected by welding, and the welding is beneficial to improving the connection stability.
The light source 202 may be an LED, such as a mini-LED, micro-LED, or the like.
As shown in fig. 4 and 5, the flexible circuit board 204 includes at least one first conductive hole 2045, and the first ground layer 2042 and the second ground layer 2043 are electrically connected through the first conductive hole 2045. The first ground layer 2042 and the second ground layer 2043 are electrically connected through the first conductive hole 2045, which can reduce the space occupied by wiring, simplify the wiring difficulty, and facilitate reducing the overall size of the flexible circuit board 204.
As shown in fig. 4 and 5, the first ground layer 2042 and the second ground layer 2043 are disposed opposite each other. The two are opposite to each other, and the first conductive hole 2045 is directly formed into a through hole in the vertical direction, so that the opening area of the first conductive hole 2045 can be reduced, and the design difficulty of the first conductive hole 2045 is reduced.
In some embodiments, as shown in fig. 5, the flexible circuit board 204 includes a plurality of second conductive vias 2046, the second electroplated copper layer a7 further has a second wiring layer 2044 etched, and the first wiring layer 2041 and the second wiring layer 2044 are electrically connected through the second conductive vias 2046.
In this embodiment, the second side 204b of the flexible circuit board 204 is further provided with a second wiring layer 2044, and the first wiring layer 2041 and the second wiring layer 2044 are electrically connected through the second conductive hole 2046, so that the space occupied by wiring can be reduced, the wiring difficulty is simplified, and the overall size of the flexible circuit board 204 is reduced.
In some embodiments, the backlight module 200 further includes a reflective sheet 211 disposed on a side of the light guide plate 203 near the housing 201, a diffusion sheet 210, a light enhancement sheet 209 and a light shielding adhesive 208 disposed on a side of the light guide plate 203 far away from the housing 201, wherein the diffusion sheet 210, the light enhancement sheet 209 and the light shielding adhesive 208 are sequentially disposed along a direction far away from the housing 201, and the light enhancement sheet 209 includes an upper light enhancement sheet 209a and a lower light enhancement sheet 209 b. The backlight module 200 further includes a housing 217, a diffusion sheet 210, a light enhancement sheet 209, a light shielding adhesive 208, a light guide plate 203, a reflective sheet 211, a flexible circuit board 204, a light source, and the like are all disposed in the housing 217.
The display module further comprises a main FPC 212, the main FPC 212 is electrically connected with the display panel 100 through a COF 214 (Chip On Flex or Chip On Film), and a copper foil 213 is disposed On one side of the COF 214 away from the main FPC 212 to play a role in shielding radio frequency signal interference. The backlight module 200 has a mylar (mylar) 215 for fixing the light-shielding glue 208 on the housing 201, preventing the light-shielding glue 208 from being separated from the housing 201, and the raised sheet 216 is disposed between the backlight module 200 and the display panel 100, so as to fill the step between the display panel 100 and the backlight module 200.
In some embodiments, the thermal function layer 205 covers at least the first copper leakage region.
To enhance the heat dissipation or thermal insulation effect of the thermal functional layer 205, the thermal functional layer 205 may entirely cover the second side 204b of the flexible circuit board 204. The heat functional layer 205 contacts with the first copper leakage area, so that the middle transfer process is reduced, and on the other hand, the heat transfer rate to the heat functional layer 205 can be accelerated due to the good heat conducting capability of copper, and the problem of heat generation of the lamp socket of the backlight module 200 is solved.
In some embodiments, a protective layer is disposed on a side of the thermal functional layer 205 facing away from the light guide plate 203, and the protective layer is bonded to the thermal functional layer 205. The protective layer is attached to the outer side of the thermal function layer 205, so that the risk of falling off of the heat dissipation layer or the heat insulation layer formed by the heat dissipation material or the heat insulation material can be reduced, and the service life of the thermal function layer 205 can be prolonged.
Optionally, the heat dissipation layer may be formed by stacking a third double-sided adhesive tape and a heat dissipation material, or the heat dissipation layer is a heat dissipation adhesive layer.
When the heat dissipation layer is formed by compounding the third double faced adhesive tape and the heat dissipation material, the third double faced adhesive tape is used for respectively adhering the heat dissipation material and the second covering film a9, the single side of the protection layer is provided with a glue material and adheres to the heat dissipation material, the effect of preventing the heat dissipation material from falling off is achieved, the protection layer is not glued to one side of the bottom of the shell 201, the protection layer is prevented from adhering to the bottom of the shell 201, the shell 201 does not generate downward acting force on the flexible circuit board 204 in the falling process of the backlight module 200, and accordingly the flexible circuit board 204 and the light guide plate 203 are not separated, and light leakage of a lamp socket is avoided.
The heat dissipation layer is a heat dissipation adhesive layer, the adhesive surface of the heat dissipation adhesive layer is adhered to the second covering film a9, and the adhesive-free surface of the heat dissipation adhesive layer is adhered to the adhesive surface of the protective layer. The surface of the protective layer facing the bottom of the shell 201 is also a glue-free surface, so that the heat dissipation glue layer is prevented from being bonded with the bottom of the shell 201, and the shell 201 does not generate downward acting force on the flexible circuit board 204 in the falling process of the backlight module 200, so that the light leakage of the lamp socket caused by detachment of the flexible circuit board 204 and the light guide plate 203 is avoided.
Or alternatively, the heat insulation layer is formed by laminating a third double-sided adhesive tape and a heat insulation material. When the heat insulation layer is formed by compounding the third double-sided adhesive tape and the heat insulation material, the third double-sided adhesive tape is used for respectively adhering the heat insulation material and the second covering film a9, and the single side of the protective layer is provided with the adhesive material and adheres to the heat insulation material, so that the effect of preventing the heat insulation material from falling off is achieved.
Or, alternatively, the heat insulation layer in the composite layer is arranged close to the second covering film a9, the composite layer is formed by laminating a third double faced adhesive tape, a heat insulation material and a heat dissipation material, or the heat dissipation layer in the composite layer is arranged close to the second covering film a9, and the composite layer is formed by laminating a heat dissipation double faced adhesive tape and a heat insulation layer.
The insulating layer in the composite layer is formed by laminating a third double-sided adhesive tape and a heat insulation material, the composite layer is formed by laminating the insulating layer and a heat radiation material, the third double-sided adhesive tape is used for respectively bonding the insulating material and the second covering film a9, a single side of the protective layer is provided with a glue material and is bonded with the heat radiation material, the effect of preventing the heat radiation material from falling off is achieved, the protective layer is not glued to one side of the bottom of the shell 201, the protective layer is prevented from being bonded to the bottom of the shell 201, the shell 201 does not generate downward acting force on the flexible circuit board 204 in the falling process of the backlight module 200, and accordingly the flexible circuit board 204 and the light guide plate 203 cannot be separated to cause light leakage of a lamp socket.
The composite layer is formed by laminating a heat-radiating double-sided adhesive layer and a heat-insulating material, and the heat-radiating double-sided adhesive layer is arranged close to the second covering film a 9. The heat dissipation double-sided adhesive layer is respectively bonded with the second covering film a9 and the heat insulation material, the adhesive material is arranged on one side of the protective layer and bonded with the heat insulation material, the effect of preventing the heat insulation material from falling off is achieved, the protective layer is not bonded with the bottom of the shell 201 towards one side of the bottom of the shell 201, the shell 201 does not generate downward acting force on the flexible circuit board 204 in the falling process of the backlight module 200, and accordingly the flexible circuit board 204 and the light guide plate 203 are not separated to cause light leakage of a lamp socket.
The scheme of taking the thermal function layer 205 as the third double sided adhesive tape, the heat insulating material and the protective layer is the scheme one, the scheme of taking the thermal function layer 205 as the heat dissipation single sided adhesive tape, the scheme of taking the heat insulating material and the protective layer as the scheme three, the scheme of taking the thermal function layer 205 as the third double sided adhesive tape, the heat insulating material, the heat dissipation material and the protective layer is the scheme four, wherein the protective layers are single sided adhesive tapes, and temperature observation is respectively carried out on one side attached to the flexible circuit board 204 and one side away from the flexible circuit board 204, and the observation results are shown in the following table and fig. 8-13:
comparing the data in the table and the results in fig. 8-13, it is found that the solution 4 can more effectively solve the problem of heat generation of the lamp socket of the backlight module 200 than the solutions 2, 3 and 1.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
In this specification, each embodiment is described in a related manner, and identical and similar parts of each embodiment are all referred to each other, and each embodiment mainly describes differences from other embodiments. In particular, for system embodiments, since they are substantially similar to method embodiments, the description is relatively simple, as relevant to see a section of the description of method embodiments.
The foregoing description is only of the preferred embodiments of the present application and is not intended to limit the scope of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application are included in the protection scope of the present application.
Claims (11)
1. The backlight module is characterized by comprising a shell, a light source, a light guide plate and a flexible circuit board, wherein the light source, the light guide plate and the flexible circuit board are positioned in the shell, the light source is arranged at the first end of the light guide plate, and the light source is electrically connected with the flexible circuit board along a first direction, and the first direction is parallel to the long side direction of the plane where the light guide plate is positioned;
the flexible circuit board is positioned on one side of the light guide plate, which is close to the bottom of the shell, and is perpendicular to the plane where the light guide plate is positioned along a second direction, the flexible circuit board is provided with a first side and a second side which are arranged in opposite directions, the first side is a side close to the light source, and the second side is a side away from the light source;
the first side and the light guide plate are adhered by a first double-sided adhesive tape, and the first double-sided adhesive tape covers the part of the first side except the light source;
the second side is provided with a thermal function layer, the thermal function layer is a heat dissipation layer or a heat insulation layer or a composite layer formed by the heat dissipation layer and the heat insulation layer, the thermal function layer is bonded with the second side of the flexible circuit board, and the second end, far away from the light source, of the light guide plate is bonded with the bottom of the shell through second double-sided adhesive tape.
2. The backlight module according to claim 1, wherein the flexible circuit board comprises a first cover film, a first adhesive layer, a first electroplated layer, a first copper foil layer, a substrate layer, a second copper foil layer, a second electroplated copper layer, a second adhesive layer and a second cover film which are sequentially stacked, wherein the first cover film is positioned on the first side, and the second cover film is positioned on the second side;
the first electroplated copper layer is provided with a first wiring layer and a first grounding layer which are formed by etching, the first wiring layer is insulated from the first grounding layer, and the first grounding layer is arranged around the first wiring layer;
the second electroplated copper layer is provided with a second grounding layer formed by etching;
the second covering film and the second adhesive layer are provided with at least one first window, the first window is a first copper leakage area, and the first window and the second grounding layer are arranged oppositely;
the first grounding layer and/or the second grounding layer are/is electrically connected with a grounding pin of the flexible circuit board.
3. The backlight module according to claim 2, wherein the extending direction of the first window is parallel to the extending direction of the second ground layer and is spaced apart from the extending direction of the second ground layer.
4. The backlight module according to claim 2, wherein the first cover film and the first adhesive layer comprise a plurality of second windows, the second windows are second copper leakage areas, bonding pads are arranged on the second copper leakage areas, and the light source is electrically connected with the bonding pads.
5. A backlight module according to claim 2, wherein the flexible circuit board comprises at least one first conductive via, and the first ground layer and the second ground layer are electrically connected through the first conductive via.
6. The backlight module according to claim 2, wherein the flexible circuit board comprises a plurality of second conductive vias, the second electroplated copper layer further comprises a second wiring layer formed by etching, and the first wiring layer and the second wiring layer are electrically connected through the second conductive vias.
7. The backlight module according to any one of claims 2 to 6, wherein the first double-sided adhesive tape is provided with an avoiding portion, and the avoiding portion is opposite to the light source;
or the first double faced adhesive tape is arranged in the area between the two boundary lines of the light source along the first direction and the same side boundary line of the flexible circuit board.
8. A backlight module according to any of claims 2-6, wherein the thermal functional layer covers at least the first copper-leakage area.
9. A backlight module according to any of claims 2-6, wherein a protective layer is provided on a side of the thermal functional layer facing away from the light guide plate, the protective layer being bonded to the thermal functional layer.
10. A backlight module according to any one of claims 2-6, wherein the heat dissipation layer is formed by laminating a third double sided adhesive and a heat dissipation material, or the heat dissipation layer is a heat dissipation adhesive layer; the heat insulation layer is formed by laminating the third double-sided adhesive tape and a heat insulation material;
the heat insulation layer in the composite layer is close to the second covering film, the composite layer is formed by laminating the third double-sided adhesive, the heat insulation material and the heat radiation material, or the heat radiation layer in the composite layer is close to the second covering film, and the composite layer is formed by laminating the heat radiation double-sided adhesive layer and the heat insulation material.
11. A display module comprising a display panel and the backlight module of any one of claims 1-10, wherein the backlight module is disposed on a side of the display panel away from the display side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202311324743.XA CN117234005A (en) | 2023-10-13 | 2023-10-13 | Backlight modules and display modules |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311324743.XA CN117234005A (en) | 2023-10-13 | 2023-10-13 | Backlight modules and display modules |
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