CN117202474A - Circuit board, display device using same and manufacturing method of display device - Google Patents

Abstract

A display device includes a circuit board and a display panel. The circuit board comprises a substrate and a T-shaped conductive piece, wherein the T-shaped conductive piece is arranged on the substrate and protrudes outwards from the substrate. The display panel is arranged on the base material and embedded in the T-shaped conductive piece to be connected with the T-shaped conductive piece. The application also provides a manufacturing method of the display device and a structure of the circuit board.

Description

Circuit board, display device using same and manufacturing method of display device

Technical Field

The application relates to a circuit board, a display device using the circuit board and a method for manufacturing the display device.

Background

The simplification of the packaging process, the reduction of the cost and the reduction of the packaging volume are important developments in the display device at present. In addition, in response to current consumer market trends, related products of display devices also tend to have high screen ratios.

In this regard, display devices of narrow bezel design have also been developed and are also subject to the intense reverberant effects of the consumer market. In the narrow frame design, how to reduce the space of the peripheral area and electrically connect the display panel and the electronic device on both sides of the substrate has become one of the important issues in the related art for the peripheral area of the display device outside the display area.

Disclosure of Invention

According to some embodiments of the present application, a display device includes a circuit board and a display panel. The circuit board comprises a substrate and a T-shaped conductive piece, wherein the T-shaped conductive piece is arranged on the substrate and protrudes outwards from the substrate. The display panel is arranged on the base material and embedded in the T-shaped conductive piece to be connected with the T-shaped conductive piece.

In some embodiments, the display device further includes an electronic component disposed under the substrate, wherein the display panel is electrically connected to the electronic component through the T-shaped conductive member.

In some embodiments, the display panel includes conductive lines protruding laterally from the display area. The T-shaped conductive member includes a laterally protruding cantilever electrically coupled to the wire.

In some embodiments, the conductive line has a first protruding length protruding from the display area, and the cantilever has a second protruding length smaller than the first protruding length.

In some embodiments, the display device further includes solder disposed between the wire and the cantilever to electrically couple the wire and the cantilever.

According to some embodiments of the present application, a method of manufacturing a display device includes providing a first substrate, disposing a first circuit layer on the first substrate, disposing a second substrate on the first circuit layer, forming conductive blind vias in the second substrate, and forming a second circuit layer on the second substrate and connecting the conductive blind vias, wherein the conductive blind vias and the second circuit layer together form a T-shaped conductive member. The method of manufacturing the display device further includes removing a portion of the second substrate to form a recess beside the T-shaped conductive member, and inserting the display panel into the recess such that the display panel is embedded in the T-shaped conductive member.

In some embodiments, the method of manufacturing a display device further includes disposing a bonding layer between the first substrate and the second substrate and completely covering the first circuit layer.

In some embodiments, inserting the display panel into the recess includes disposing the display panel on the conforming layer.

According to some embodiments of the present application, a circuit board includes a first substrate, a second substrate disposed on the first substrate, wherein the second substrate has a groove. The circuit board further comprises a T-shaped conductive piece arranged in the second base material, wherein the groove is a space surrounded by the T-shaped conductive piece and the first base material.

In some embodiments, the T-shaped conductive member has a lateral extension, wherein a portion of the lateral extension is suspended above the first substrate and another portion of the lateral extension contacts the second substrate.

The embodiment of the application provides a circuit board, a display device using the circuit board and a manufacturing method of the display device. The circuit board is provided with a convex T-shaped conductive piece on the base material, and the display panel can be embedded in the T-shaped conductive piece to form an embedded display device, so that the screen occupation ratio of the display device is improved.

Drawings

The following embodiments are to be read in conjunction with the accompanying drawings to provide a clear understanding of the aspects of the application. It should be noted that the various features are not drawn to scale according to industry standard practices. In fact, the dimensions of the various features may be arbitrarily expanded or reduced for clarity of discussion. Moreover, like reference numerals designate like elements.

Fig. 1-4A are cross-sectional views illustrating a display device at various stages of fabrication according to some embodiments of the application.

Fig. 4B is a partial top view of the display device of fig. 4A according to some embodiments of the application.

Fig. 5-6A are cross-sectional views illustrating a display device at various stages of fabrication according to some embodiments of the application.

FIG. 6B is a partial top view of the display device of FIG. 6A according to some embodiments of the application.

FIG. 7A is a cross-sectional view of a display device at various stages of manufacture in accordance with some embodiments of the present application.

Fig. 7B is a partial top view of the display device of fig. 7A according to some embodiments of the application.

Fig. 8-13A are cross-sectional views illustrating a display device at various stages of fabrication according to some embodiments of the application.

Fig. 13B is a partial top view of the display device of fig. 13A according to some embodiments of the application.

Fig. 14 is a partial cross-sectional view of the display device of fig. 13A according to some embodiments of the application.

Detailed Description

When an element such as a layer, film, region or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physical and/or electrical connection. Furthermore, "electrically connected" or "coupled" may mean that there are other elements between the elements.

Moreover, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe one element's relationship to another element as illustrated. It will be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation depicted in the figures. For example, if the device in one of the figures is turned over, elements described as being on the "lower" side of other elements would then be oriented on the "upper" side of the other elements. Thus, the exemplary term "lower" may include both "lower" and "upper" orientations, depending on the particular orientation of the figure. Similarly, if the device in one of the figures is turned over, elements described as "below" or "beneath" other elements would then be oriented "above" the other elements. Thus, the exemplary terms "below" or "beneath" can encompass both an orientation of above and below.

As used herein, "about," "approximately," or "approximately" includes both the values and average values within an acceptable deviation of the particular values determined by one of ordinary skill in the art, taking into account the particular number of measurements and errors associated with the measurements in question (i.e., limitations of the measurement system). For example, "about" may mean within one or more standard deviations of the values.

Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present application and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

It should be noted that when the following embodiments are illustrated or described as a series of acts or events, the order of the description of the acts or events should not be limited, unless otherwise noted. For example, some operations or events may take on a different order, some may occur concurrently, some may not be required to be taken, and/or some may be repeated, than the present application. Moreover, the actual process may require additional operations before, during, or after each step to complete the display device. Thus, the present application may briefly explain some of the additional operations.

Referring to fig. 1, fig. 1 is a cross-sectional view illustrating one stage of manufacturing a display device according to some embodiments of the application. First, a first substrate 100 and conductive materials 102 disposed on both sides of the first substrate 100 are provided. Next, conductive blind vias 104 are formed in the first substrate 100, and the conductive blind vias 104 are electrically connected to the conductive material 102.

In some embodiments, the material of the first substrate 100 may include a liquid crystal polymer (liquid crystal polymer, LCP), a bismaleimide-triazine (BT), a prepreg (prepreg), a resin containing inorganic filler (e.g., ajinomoto Build-up Film, ABF), epoxy, polyimide (PI), or other resin materials, but the present application is not limited to the above examples. In some further embodiments, the material of the first substrate 100 may include a flexible polymer material, such as Polyimide (PI), thermoplastic polyimide (thermoplastic polyimide, TPI), polyethylene terephthalate (polyethylene terephthalate, PET), polyethylene naphthalate (polythylene naphthalate, PEN), polyurethane (PU), thermoplastic polyurethane (thermoplastic polyurethane, TPU), other suitable materials, derivatives thereof, or any combination thereof, for application to flexible products. For example, the material of the first substrate 100 may include polyimide, and the plurality of ceramic powders are uniformly distributed in the first substrate 100.

Methods of forming the conductive material 102 on the first substrate 100 may include sputtering, evaporation, electroplating, or other suitable techniques, or combinations thereof. In some embodiments, the material of the conductive material 102 may be copper foil. Therefore, in this embodiment, the first substrate 100 and the corresponding conductive material 102 may be flexible copper foil substrates (flexible copper clad laminate, FCCL), but the application is not limited thereto.

Methods of forming the conductive via 104 in the first substrate 100 may include laser drilling, mechanical drilling, etching, sputtering, evaporation, electroplating processes, or other suitable techniques, or combinations thereof.

Referring to fig. 2, fig. 2 is a cross-sectional view illustrating one of the stages in the manufacture of a display device in accordance with some embodiments of the present application. Next, a patterning process is performed on the conductive material 102 (please refer to fig. 1) to form a first circuit layer 202 on the first substrate 100. The patterning of the conductive material 102 (see fig. 1) may include a photolithography process, an etching process, other suitable operations, or a combination thereof. Conductive patterns and circuits may be etched on the conductive material 102 to form the first circuit layer 202 according to process conditions or circuit layout required for product design.

Referring to fig. 3, fig. 3 is a cross-sectional view illustrating one of the stages in the manufacture of a display device according to some embodiments of the application. Next, a build-up structure (e.g., build-up structure 300 or build-up structure 310) is laminated onto the first substrate 100. The configuration of the build-up structure can be adjusted according to process conditions or product design. In the embodiment shown in fig. 3, the build-up structure 300 is disposed above the first substrate 100, and the build-up structure 310 is disposed below the first substrate 100. In other embodiments, the build-up structure 300 is disposed above the first substrate 100, and no build-up structure is disposed below the first substrate 100.

The build-up structure 300 may include a second substrate 302, a bonding layer 304, and a conductive material 306, wherein the bonding layer 304 is disposed between the second substrate 302 and the first substrate 100 and is pressed onto the first circuit layer 202. The material of the second substrate 302 may be similar to the material of the first substrate 100. In some further embodiments, the material of the second substrate 302 may be polyimide or other soft material, and the plurality of ceramic powders are uniformly distributed in each second substrate 302 for being applied to flexible products. The conforming layer 304 may be an adhesive gel. When the build-up structure 300 is pressed onto the first substrate 100, the bonding layer 304 may be disposed in the space between the first circuit layers 202 and cover the first circuit layers 202. It should be noted that the bonding layer 304 is sandwiched between the second substrate 302 and the first circuit layer 202, such that the second substrate 302 is not directly contacted with the first circuit layer 202.

The build-up structure 310 may include a third substrate 312, a bonding layer 314, and a conductive material 316, wherein the bonding layer 304 is disposed between the third substrate 312 and the first substrate 100 and is pressed onto the first circuit layer 202. The build-up structure 310 may be of the same material as the build-up structure 300 and will not be described in detail herein.

Referring to fig. 4A, fig. 4A is a cross-sectional view illustrating one of manufacturing stages of a display device according to some embodiments of the application. Next, blind holes 400 are formed in the build-up structure 300. Specifically, blind via 400 extends from conductive material 306 to adhesion layer 304 and exposes a portion of first circuit layer 202. It should be noted that the sidewalls of the blind via 400 may be vertical (i.e., perpendicular to the first substrate 100) or inclined. In this embodiment, the blind via 400 is vertical (i.e., perpendicular to the first substrate 100). The operation of forming the blind via 400 may include laser drilling, mechanical drilling, etching processes, or other suitable techniques, or a combination thereof. In this embodiment, the blind via 400 with vertical sidewalls may be formed by a mechanical drilling or etching process.

Furthermore, blind holes 402 may be further formed in the build-up structure 310. Specifically, the blind via 402 extends from the conductive material 316 to the bonding layer 314 and exposes a portion of the first circuit layer 202. The sidewalls of the blind via 402 may be vertical (i.e., perpendicular to the first substrate 100) or sloped. The operation of forming the blind via 402 may include laser drilling, mechanical drilling, etching processes, or other suitable techniques, or a combination thereof.

Referring to fig. 4B, fig. 4B is a partial top view of the display device of fig. 4A according to some embodiments of the application. It should be noted that fig. 4B is simplified to depict only some elements for clarity of illustration, so the elements between fig. 4B (partial top view) and fig. 4A (cross-sectional view) may not necessarily correspond exactly.

In fig. 4B, the number of blind holes 400 may be plural. Also, the blind holes 400 may be arranged in a regular manner, such as in an array (e.g., a column), as shown in fig. 4B. Furthermore, the opening of the blind via 400 may have a circular shape, an elliptical shape, a polygonal shape (e.g., a quadrilateral shape), or other suitable shape. For example, in the embodiment shown in fig. 4B, the blind hole 400 is rectangular, but the application is not limited thereto. The number, arrangement, or opening morphology of the blind holes 400 can be adjusted according to process conditions or product design.

In some embodiments, the blind holes 400 may be between about 100 micrometers (μm) to about 500 μm in size. When the size of the blind via 400 is below the aforementioned lower limit, process difficulty may increase and the subsequently formed conductive blind via (e.g., conductive blind via 500 of fig. 5) may decrease the reliability of the conductive blind via due to the undersize. When the size of the blind hole 400 is higher than the aforementioned lower limit value, the use area may be too large to be advantageous for the design of the narrow bezel.

Referring to fig. 5, fig. 5 is a cross-sectional view illustrating one of the stages in the manufacture of a display device in accordance with some embodiments of the present application. Next, conductive material is disposed in the blind holes 400 and 402 (see fig. 4A) to form conductive blind holes 500 and 502. The conductive blind via 500 may electrically connect the first circuit layer 202 and the conductive material 306. The conductive blind via 502 may electrically connect the first circuit layer 202 and the conductive material 316. In embodiments where the conductive via 104 is electrically connected to the first circuit layer 202 on opposite sides of the first substrate 100, the conductive via 500 and the conductive via 502 may be electrically connected to each other through the conductive via 104 and the first circuit layer 202. Furthermore, the blind holes 400 and 402 are the previous stage of the conductive blind holes 500 and 502, so the morphology of the blind holes 400 and 402 can determine the morphology of the conductive blind holes 500 and 502. For example, the foregoing description of the blind via 400 is applicable to the conductive blind via 500, and thus is not described in detail herein.

Referring to fig. 6A, fig. 6A is a cross-sectional view illustrating one of manufacturing stages of a display device according to some embodiments of the application. Next, a patterning process is performed on the conductive material 306 (please refer to fig. 5) to form a second circuit layer 606. The conductive material 306 may be patterned according to a desired circuit layout to form a corresponding conductive pattern and circuit on the conductive material 306 to form the second circuit layer 606. The second circuit layer 606 is connected to the first circuit layer 202 through the conductive blind via 500. In this way, the first substrate 100, the corresponding first circuit layer 202, the build-up structure 300 and the second circuit layer 606 may form a multi-layer circuit board. The operation of patterning the conductive material 306 of the build-up structure 300 to form the second circuit layer 606 may include a photolithography process, an etching process, other suitable operations, or a combination thereof.

Furthermore, a patterning process may be further performed on the conductive material 316 (see fig. 5) to form a third circuit layer 616. The conductive material 316 may be patterned according to a desired circuit layout to form corresponding conductive patterns and circuits on the conductive material 316 to form a third circuit layer 616. The third circuit layer 616 is connected to the first circuit layer 202 through the conductive via 502. In this way, the first substrate 100, the first circuit layer 202, the build-up structure 300, the second circuit layer 606, the build-up structure 310, and the third circuit layer 616 may form a multi-layer circuit board. The operation of patterning the conductive material 316 of the build-up structure 310 to form the third circuit layer 616 may include a photolithography process, an etching process, other suitable operations, or a combination thereof.

Referring to fig. 6B, fig. 6B is a partial top view of the display device of fig. 6A according to some embodiments of the application. It should be noted that fig. 6B is simplified to depict only some elements for clarity of illustration, so the elements between fig. 6B (partial top view) and fig. 6A (cross-sectional view) may not necessarily correspond exactly.

In fig. 6B, the second circuit layer 606 is a plurality of elongated structures, but the application is not limited thereto. The individual elongated structures of the second circuit layer 606 are spaced apart from one another. The second circuit layer 606 is disposed around the conductive blind holes 500, and each conductive blind hole 500 is electrically connected to a corresponding elongated structure of the second circuit layer 606 in a manner of directly contacting the second circuit layer 606. Thus, referring to fig. 6A and 6B, the single conductive via 500 and the corresponding elongated structure of the second circuit layer 606 may together form a T-shaped conductive element 620, where the T-shaped conductive element 620 protrudes outward from the first substrate 100. Thus, one or more conductive elements 620 may be formed on the first substrate 100. The T-shaped conductive member 620 may be symmetrical or asymmetrical. In some embodiments, the T-shaped conductive element 620 formed by the conductive via 500 and the elongated structure of the second circuit layer 606 is asymmetric, i.e. the lengths of the elongated structures of the second circuit layer 606 on opposite sides of the conductive via 500 are different.

Referring to fig. 7A and 7B, fig. 7A is a cross-sectional view illustrating one of the stages in fabrication of a display device according to some embodiments of the application, and fig. 7B is a partial top view illustrating the display device of fig. 7A according to some embodiments of the application, wherein elements under the protective layer 700 are shown in phantom with exemplary locations and features. It should be noted that fig. 7B is simplified to depict only some elements for clarity of illustration, so the elements between fig. 7B (partial top view) and fig. 7A (cross-sectional view) may not necessarily correspond exactly.

Next, a protective layer 700 is disposed over the exposed circuit layer (e.g., over the second circuit layer 606). The configuration of the protective layer 700 on the circuit layer (e.g., on the second circuit layer 606) may be adjusted depending on process conditions or product design. For example, the protective layer 700 may encapsulate the second circuit layer 606 and exposed surfaces of the conductive blind via 500 (e.g., upper surfaces of the conductive blind via 500). In some further embodiments, the protective layer 700 completely encapsulates the exposed surfaces of the second circuit layer 606 and the conductive blind via 500.

In some embodiments, the protection layer 700 may further cover the exposed surface of the conductive blind via 502 and a portion of the third circuit layer 616, wherein the portion of the third circuit layer 616 covered by the protection layer 700 is the first portion 616A, and the other portion of the third circuit layer 616 not covered by the protection layer 700 is the second portion 616B.

Subsequently, a mask layer 800 is disposed over the protective layer 700 and the circuit layer (e.g., the third circuit layer 616). In fig. 7A, a mask layer 800 may overlie the conductive blind via 500 and the second circuit layer 606, wherein a protective layer 700 is interposed between the mask layer 800 and the conductive blind via 500, and between the mask layer 800 and the second circuit layer 606. The mask layer 800 may also overlie the conductive blind via 502 and the first portion 616A, wherein the protective layer 700 is interposed between the mask layer 800 and the conductive blind via 502, and the protective layer 700 is interposed between the mask layer 800 and the first portion 616A. Still alternatively, the mask layer 800 may directly overlie the second portion 616B. In a subsequent process, the mask layer 800 may provide protection against damage to the device. Accordingly, the configuration of the mask layer 800 on the protective layer (e.g., the protective layer 700) or the circuit layer (e.g., the third circuit layer 616) may be adjusted according to process conditions or product design.

The material of the protective layer 700 may include epoxy, polyimide, or other suitable solder resist ink material. Furthermore, additives such as hardeners or photoinitiators may be added to the materials described above depending on the process requirements or product design. In some embodiments, the protective layer 700 may include a thermosetting solder resist ink. In other embodiments, the protective layer 700 may include a photo-curable solder resist ink. The operation of disposing the protective layer 700 may include a deposition process, an exposure and development process, an etching process, a curing process, other suitable processes, or any combination thereof. In some embodiments, the protective layer 700 may be formed by screen printing (screen print) techniques.

Referring to fig. 8, fig. 8 is a cross-sectional view illustrating one stage of manufacturing a display device according to some embodiments of the application. Next, a mask layer 800 is disposed over the protective layer 700 and the circuit layer (e.g., the third circuit layer 616). In fig. 8, a mask layer 800 may overlie the conductive blind via 500 and the second circuit layer 606, wherein a protective layer 700 is interposed between the mask layer 800 and the conductive blind via 500, and between the mask layer 800 and the second circuit layer 606. The mask layer 800 may also overlie the conductive blind via 502 and the first portion 616A, wherein the protective layer 700 is interposed between the mask layer 800 and the conductive blind via 502, and the protective layer 700 is interposed between the mask layer 800 and the first portion 616A. Still alternatively, the mask layer 800 may directly overlie the second portion 616B. In a subsequent process, the mask layer 800 may provide protection against damage to the device. Accordingly, the configuration of the mask layer 800 on the protective layer (e.g., the protective layer 700) or the circuit layer (e.g., the third circuit layer 616) may be adjusted according to process conditions or product design.

Next, a portion of the second substrate 302 is removed (see fig. 7A) to expose the bonding layer 304, wherein the bonding layer 304 remains completely covering the first circuit layer 202, and thus the first circuit layer 202 is not exposed. In other words, the first circuit layer 202 remains embedded in the bonding layer 304.

After the second substrate 302 is partially removed, a recess 810 is formed in the build-up structure 300. The groove 810 is formed beside the T-shaped conductive member 620, and the groove 810 is a space surrounded by the T-shaped conductive member 620 and the lamination layer 304. Specifically, after the second substrate 302 is partially removed, the second circuit layer 606 may be partially suspended above the adhesion layer 304. Thus, the recess 810 is a space substantially surrounded by the conductive blind via 500, the bonding layer 304, the second circuit layer 606, and the protection layer 700. Since the second circuit layer 606 may be considered a lateral extension of the T-shaped conductive element 620, a portion of the lateral extension of the T-shaped conductive element 620 may overhang the second substrate 302, another portion of the lateral extension may overlie and contact the first portion 302A of the second substrate 302, wherein the first portion 302A may provide support.

The projected area of the recess 810 on the bonding layer 304 is within the projected area of the mask layer 800 on the bonding layer 304. The area of the masking layer 800 outside the projected area of the conforming layer 304 may be referred to as a planar area 812, and the conforming layer 304 is exposed in the planar area 812. In some embodiments, the conforming layer 304 in the planar region 812 has a planar upper surface. In some further implementations, the conforming layer 304 has a planar upper surface.

After the second substrate 302 is partially removed, the remaining second substrate 302 is located on the sidewall of the conductive blind via 500. In the cross-sectional view shown in fig. 8, the second substrate 302 on one side of the conductive blind via 500 and exposed to the recess 810 may be the second portion 302B and on the opposite side of the first portion 302A is the first portion 302A. In some other embodiments, the second portion 302B may not be present such that the conductive blind hole 500 is exposed in the recess 810.

The operation of removing portions of the second substrate 302 may include a lift-off (routing), a mechanical or laser process, an etching process, a lift-off (peeling) process, other suitable techniques, or a combination thereof. In some embodiments, portions of the second substrate 302 are removed by an etching process. In some embodiments, the etchant used in the etching process is selective to the material of the second substrate 302. In other words, the etching rate of the etchant to the material of the second substrate 302 is faster than the etching rate of the other material (e.g., the material of the mask layer 800). Thus, the second substrate 302 not covered by the mask layer 800 may be removed. In some embodiments, the etching process is an isotropic etch.

Referring to fig. 9, fig. 9 is a cross-sectional view illustrating one stage of manufacturing a display device according to some embodiments of the application. Next, the mask layer 800 is removed (see fig. 8). After removing the mask layer 800, a second portion 616B of the third circuit layer 616 is exposed. The operation of removing the mask layer 800 may include a mechanical or laser process, an etching process, a lift-off (peeling) process, other suitable techniques, or a combination thereof.

Subsequently, a metal layer 900 is formed over the exposed conductive elements (e.g., the second circuit layer 606 or the third circuit layer 616). The exposed surface of the second circuit layer 606 or the third circuit layer 616 is surface treated so that the surface of the second circuit layer 606 or the third circuit layer 616 has a metal layer 900 having a higher hardness.

In the embodiment shown in fig. 9, a portion of the first substrate 100, a portion of the first circuit layer 202, a portion of the build-up structure 300, and a portion of the build-up structure 310 are located within a scribe line 910 (saw area). It should be noted that the conductive blind via 500 is not disposed in the scribe line 910 to ensure the integrity of the conductive blind via 500 and further ensure the reliability of the circuit board and the display device to be formed later.

Referring to fig. 10, fig. 10 is a cross-sectional view illustrating one stage of manufacturing a display device according to some embodiments of the application. Next, a portion of the first substrate 100, a portion of the first circuit layer 202, a portion of the build-up structure 300, and a portion of the build-up structure 310 are cut along the scribe line 910 such that the cut surfaces of the first substrate 100, and the build-up structure 300, and the build-up structure 310 are aligned (i.e., coplanar) with each other. Since the conductive blind via 500 is not disposed within the scribe line 910, the conductive blind via 500 may maintain integrity.

In a subsequent process, the bonding layer 304 located in the planar region 812 can be used to carry a display panel (not shown), and the recess 810 can be used to provide an embedded space of the display panel. The T-shaped conductive element 620 formed by the conductive blind via 500 and the second circuit layer 606 may protrude above the first substrate 100, and the bonding layer 304 may remain completely covering the first circuit layer 202, so that the first circuit layer 202 is buried in the bonding layer 304 and is not exposed. The T-shaped conductive member 620 and the metal layer 900 can be used as a connection terminal (e.g. a gold finger) for interfacing with a connection terminal of a display panel in a subsequent process. Since the elements located above the first substrate 100 may be combined or connected with the display panel, the area located above the first substrate 100 may be referred to as a display panel combination area 1002.

On the other hand, the second portion 616B of the third circuit layer 616 and the metal layer 900 may function as a connection terminal (e.g., a gold finger) and interface with a connection terminal of an electronic component (not shown) in a subsequent process. In this way, the electronic device can be electrically connected to the T-shaped conductive element 620 located in the display panel assembly region 1002 through the third circuit layer 616, the conductive via 502, the first circuit layer 202 located at both sides of the conductive via 104, and further electrically connected to the display panel (not shown). Accordingly, the area below the T-shaped conductive element 620 or below the bonding layer 304 may be referred to as the display electronics assembly area 1004, which may include the first substrate 100, the first circuit layer 202, and the build-up structure 310, as shown in FIG. 10.

To this end, a multi-layered circuit board 1000 including a display panel assembly area 1002 and an electronic component assembly area 1004 has been substantially manufactured. It should be noted that although the multi-layer circuit board 1000 of fig. 10 is depicted as a 4-layer structure, the present application is not limited thereto. The number of layers may be adjusted depending on process conditions or product design.

Referring to fig. 11, fig. 11 is a cross-sectional view illustrating one of the stages in the manufacture of a display device in accordance with some embodiments of the present application. Next, one or more electronic components 1100 are mounted (mounted) onto the circuit board 1000. Specifically, the second portion 616B of the third circuit layer 616 and the metal layer 900 may function as a connection terminal (e.g., a gold finger) and be connected to the connection terminal of the electronic component 1100. The electronic component 1100 may be a passive component such as a capacitor, inductor, resistor, or the like. Alternatively, the electronic device 1100 may be an active device, such as a transistor. Alternatively, the electronic device 1100 may include active devices and passive devices, such as an integrated circuit (integrated circuit, IC) having active devices and passive devices, but the application is not limited thereto.

Referring to fig. 12, fig. 12 is a cross-sectional view illustrating one stage of manufacturing a display device according to some embodiments of the application. Next, a display panel 1200 is provided. The display panel 1200 may include a substrate 1202, a conductive line 1204 disposed on the substrate 1202, and a display region 1206 disposed on the conductive line 1204. The substrate 1202 may be a transparent substrate, such as a glass substrate or a transparent resin substrate. The display region 1206 may include light emitting elements.

The conductive line 1204 protrudes laterally from the display region 1206, and the conductive line 1204 has a protruding length P1 (i.e., a distance between an edge of the display region 1206 and an edge of the conductive line 1204). The display panel 1200 further includes solder 1208 and an adhesive material 1210, wherein the solder 1208 is disposed on the protruding portion of the wire 1204 and the adhesive material 1210 is disposed under the substrate 1202. The adhesive material 1210, the substrate 1202, and the conductive line 1204 may have a total thickness T1. The protruding wires 1204 and the solder 1208 may serve as connection terminals of the display panel 1200. In some embodiments, the solder 1208 may be a conductive paste, such as solder paste, but the application is not limited thereto. In some other embodiments, conductive paste may be used instead of the effect of solder 1208, such as anisotropic conductive paste (anisotropic conductive film, ACF).

As described above, since the grooves 810 may be used to provide an embedding space of the display panel 1200, the T-shaped conductive member 620 and the metal layer 900 may function as connection terminals, interfacing with the connection terminals (i.e., the wires 1204 and the solders 1208) of the display panel 1200. The cantilever of the T-shaped conductive element 620 (i.e., the suspended portion of the second circuit layer 606 or the suspended portion of the lateral extension of the T-shaped conductive element 620) laterally protrudes in the recess 810 has a protruding length P2, and the T-shaped conductive element 620 has a height H1 in the recess 810. In some implementations, the protruding length P2 of the T-shaped conductive member 620 is smaller than the protruding length P1 of the conductive wire 1204, and the height H1 of the T-shaped conductive member 620 at the groove 810 is greater than the total thickness T1 of the adhesive material 1210, the substrate 1202 and the conductive wire 1204, thereby ensuring that the display panel 1200 is embedded in the groove 810.

Referring to fig. 13A, fig. 13A is a cross-sectional view illustrating one of the stages of manufacturing a display device according to some embodiments of the application. Next, the display panel 1200 is inserted into the display panel assembly area 1002 of the circuit board 1000 such that the display panel 1200 and the T-shaped conductive member 620 are fitted to each other. Solder 1208 is disposed between the wire 1204 and the second circuit layer 606 to bond the metal layer 900. The solder 1208 may directly contact the metal layer 900 such that the display panel 1200 is electrically connected to the T-shaped conductive member 620. Therefore, the display panel 1200 may be further electrically connected to the electronic component 1100 below through the T-shaped conductive member 620. In addition, the first circuit layer 202 is embedded in the bonding layer 304, wherein the bonding layer 304 has a flat upper surface, thereby simplifying the operation of embedding the display panel 1200 into the display panel assembly area 1002 of the circuit board 1000. Furthermore, after the display panel 1200 is embedded, the adhesive material 1210 may directly contact the bonding layer 304, thereby improving the bonding force between the display panel 1200 and the circuit board 1000.

Referring to fig. 13B, fig. 13B is a partial top view of the display panel of fig. 13A, wherein the elements under the passivation layer 700 are shown in phantom with exemplary positions and features according to some embodiments of the application. It should be noted that fig. 13B is simplified to depict only some elements for clarity of illustration, so the elements between fig. 13B (partial top view) and fig. 13A (cross-sectional view) may not necessarily correspond exactly.

The conductive line 1204 may have an elongated shape that extends under the protection layer 700 and is electrically coupled to the cantilever of the T-shaped conductive member 620. Specifically, the conductive wire 1204 overlaps the cantilever (i.e., the suspended portion of the second circuit layer 606) of the T-shaped conductive member 620. Solder 1208 is disposed between the wire 1204 and the cantilever of the T-shaped conductive member 620 to electrically couple the wire 1204 and the cantilever of the T-shaped conductive member 620. Specifically, the solder 1208 is located in the region where the wires 1204 and the cantilevers of the T-shaped conductive members 620 overlap each other. The conductive line 1204 may continue to extend until it contacts the conductive blind via 500. As described above, the shape of the conductive via 500 is determined by the via 400 (see fig. 4B), so that the shape of the conductive via 500 in a top view can be circular, elliptical, polygonal (e.g., quadrilateral), or other suitable shape. In some embodiments, the conductive blind via 500 may be polygonal in shape in plan view, wherein the side closest to the display region 1206 may be substantially parallel to the edge of the display region 1206. For example, as shown in fig. 13B, the conductive blind hole 500 may be rectangular in shape in top view.

In some embodiments, the conductive blind via 500 has a rectangular design in top view and a vertical sidewall design in cross-section to facilitate insertion of the conductive line 1204 under the second circuit layer 606, as shown in fig. 13A and 13B. The rectangular design in top view and the vertical sidewall design in cross-section simplify alignment of the conductive line 1204 and the second circuit layer 606 with respect to each other to promote uniformity.

To this end, a display device 1300 in which the display panel 1200 is embedded in the circuit board 1000 is substantially manufactured. Specifically, the display panel 1200 is embedded in the display panel assembly area 1002 of the circuit board 1000 such that the wires 1204 of the display panel 1200 are embedded with the T-shaped conductive members 620 of the circuit board 1000.

Referring to fig. 14, fig. 14 is a partial cross-sectional view of the display device 1300 of fig. 13A, such as the area 1400 of fig. 13A, according to some embodiments of the application. Fig. 14 shows peripheral regions other than the display region 1206: the sidewalls of the display region 1206 adjacent to the conductive via 500 are a first length L1, the width of the conductive via 500 is a second length L2, and the edges of the other sidewall of the conductive via 500 to the display device 1300 (e.g., the edges of the passivation layer 700) are a third length L3. The first length L1, the second length L2, and the third length L3 may be shortened by improving the accuracy of the process. For example, the third length L3 is affected by the cutting accuracy. Current cutting accuracy may be less than about 50 microns, such as about 20 microns, with lasers.

In contrast, in the conventional process, the peripheral area of the display device is difficult to be reduced by providing a bending space due to the encapsulation by bending the conductive lines or the circuit board of the display panel. The process disclosed by the application does not bend the circuit board, so that the space of the peripheral area can be reduced, and the screen occupation ratio of the display device can be improved.

In view of the foregoing, embodiments of the present application provide a circuit board, a display device using the circuit board, and a method for manufacturing the display device. The circuit board is provided with a convex T-shaped conductive piece on the base material, and the display panel can be embedded in the T-shaped conductive piece to form an embedded display device, so that the screen occupation ratio of the display device is improved.

The foregoing generally illustrates the features of several embodiments of the application so that those skilled in the art may more readily understand the application. Those skilled in the art should appreciate that the conception and specific embodiment disclosed may be readily utilized as a basis for modifying or designing other structures or processes for carrying out the same purposes and/or obtaining the same advantages of the embodiments of the present application. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the application, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the application.

[ symbolic description ]

100 first substrate

102 conductive material

104 conductive blind hole

202 first circuit layer

300-layer structure

302 second substrate

302A first portion

302B second portion

304 laminating layer

306 conductive material

310 build-up structure

312 third substrate

314 laminating layer

316 conductive material

400 blind holes

402 blind hole

500 conductive blind hole

502 conductive blind hole

606 second circuit layer

616 third circuit layer

616A first portion

616B second portion

620T-shaped conductive member

700 protective layer

800 mask layer

810 groove

812 plane area

900 metal layer

910 cutting lane

1000 circuit board

1002 display panel assembly area

1004 electronic component assembly area

1100 electronic component

1200 display panel

1202 substrate

1204 wire

1206 display area

1208 solder

1210 adhesive material

1300 display device

1400 area

H1 height of

L1 first length

L2 second length

L3 third length

P1 projected length

P2 projected length

T1 is thickness.

Claims (10)

1. A display device, comprising:

a circuit board, comprising:

a substrate; and

the T-shaped conductive piece is arranged on the base material and protrudes outwards from the base material; and

the display panel is arranged on the base material, embedded in the T-shaped conductive piece and connected with the T-shaped conductive piece.

2. The display device according to claim 1, further comprising:

the electronic element is arranged under the base material, and the display panel is electrically connected with the electronic element through the T-shaped conductive piece.

3. The display device according to claim 1, wherein

The display panel comprises a wire transversely protruding out of the display area; and

the T-shaped conductive member includes a laterally protruding cantilever electrically coupled to the wire.

4. A display device according to claim 3, wherein

The wire has a first protruding length protruding from the display area; and

the cantilever has a second protruding length that is less than the first protruding length.

5. A display device according to claim 3, further comprising:

and solder arranged between the wire and the cantilever to electrically couple the wire and the cantilever.

6. A method of manufacturing a display device, comprising:

providing a first substrate;

disposing a first circuit layer on the first substrate;

disposing a second substrate on the first circuit layer;

forming a conductive blind hole in the second substrate;

forming a second circuit layer on the second substrate and connecting the conductive blind holes, wherein the conductive blind holes and the second circuit layer together form a T-shaped conductive piece;

removing a portion of the second substrate to form a recess alongside the T-shaped conductive member; and

a display panel is inserted into the recess such that the display panel is embedded in the T-shaped conductive member.

7. The method of manufacturing a display device according to claim 6, further comprising:

a bonding layer is disposed between the first substrate and the second substrate and completely covers the first circuit layer.

8. The method of manufacturing a display device according to claim 7, wherein inserting the display panel into the recess comprises disposing the display panel on the conforming layer.

9. A circuit board, comprising:

a first substrate having a first surface and a second surface,

the second substrate is arranged on the first substrate and is provided with a groove; and

the T-shaped conductive piece is arranged in the second base material, and the groove is a space surrounded by the T-shaped conductive piece and the first base material.

10. The circuit board of claim 9, wherein the T-shaped conductive member has a lateral extension, wherein a portion of the lateral extension is suspended above the first substrate and another portion of the lateral extension contacts the second substrate.