CN117174703A

CN117174703A - LED module, manufacturing method of LED module and display device

Info

Publication number: CN117174703A
Application number: CN202311128970.5A
Authority: CN
Inventors: 刘坤; 吴立; 谢俊烽
Original assignee: HKC Co Ltd
Current assignee: HKC Co Ltd
Priority date: 2023-08-31
Filing date: 2023-08-31
Publication date: 2023-12-05

Abstract

The application belongs to the field of display, and particularly relates to an LED module, a manufacturing method of the LED module and a display device. When the LED module is used for a display device, the second light source is started, and the light of the second light source is reduced through the first lens, so that peep prevention is realized; the first light source is started, the light emergent angle of the first light source is not adjusted by the first lens, the wide-view angle display is realized, and the peep-proof mode and the wide-view angle mode can be rapidly switched by controlling the on-off of the first light source and the second light source.

Description

LED module, manufacturing method of LED module and display device

Technical Field

The application belongs to the field of display, and particularly relates to an LED module, a manufacturing method of the LED module and a display device.

Background

The display device has a wider viewing angle, which can bring better visual experience to users, but sometimes users also want the viewing angle of the display device to be adjustable, so that business confidentiality and personal privacy are effectively protected.

The existing display device can only be torn away from the peep-proof film when the peep-proof film is not needed, and the peep-proof function is inconvenient to switch. In addition, the privacy film also causes loss of light efficiency, resulting in an increase in power consumption of the display device.

Disclosure of Invention

The application aims to provide an LED module, a manufacturing method of the LED module and a display device, so as to facilitate a switch with an anti-peeping function.

In order to achieve the above object, the present application provides an LED module, including a driving substrate and a first light source, wherein a plurality of the first light sources are disposed at intervals on a first side of the driving substrate, the LED module further includes:

the second light sources are arranged on the first side of the driving substrate at intervals, and the second light sources and the first light sources are arranged at intervals;

the first lenses are at least partially arranged on one side of each second light source, which is far away from the driving substrate, and are used for reducing the light emitting angle of the second light source;

the packaging layer is arranged on one side of the driving substrate, the thickness of the packaging layer is larger than the height of the first light source, and the thickness of the packaging layer is larger than the height of the second light source.

Optionally, the LED module further includes a second lens, the second lens is disposed between the second light source and the first lens, a first accommodating cavity is disposed on a side of the second lens, which is close to the second light source, and the second light source is located in the first accommodating cavity.

Optionally, a groove is formed on a side, far away from the driving substrate, of the second lens, the first lens is a convex lens, and the first lens is located in the groove of the second lens;

the second lens and the first light source are buried in the packaging layer, and the interface of the second lens and the packaging layer can reflect part of light rays of the second light source to the first lens.

Optionally, the refractive index of the material forming the second lens is greater than the refractive index of the material forming the encapsulation layer; or (b)

The LED module further comprises a reflecting layer, and the reflecting layer is formed at the interface of the second lens and the packaging layer.

Optionally, the first light sources are all buried in the packaging layer, the first lens part is buried in the packaging layer, one side, close to the second light source, of the second lens is provided with a first accommodating cavity, the second light source is positioned in the first accommodating cavity, one side, close to the driving substrate, of the first lens is provided with a second accommodating cavity, the second lens is positioned in the second accommodating cavity, one side, far away from the driving substrate, of the second lens is provided with a groove, one side, far away from the driving substrate, of the central part of the first lens is positioned in the groove of the second lens, the other side, far away from the driving substrate, of the central part of the first lens is protruded, and the edge part, far away from the driving substrate, of the first lens is protruded;

the interface of the first lens and the packaging layer can reflect part of light rays of the second light source to the edge part of the first lens.

Optionally, the refractive index of the material forming the first lens is greater than the refractive index of the material forming the encapsulation layer; or (b)

The LED module further comprises a reflecting layer, and the reflecting layer is formed at the interface of the first lens and the packaging layer.

Optionally, the first light source and the second light source are arranged on the driving substrate in an array in a row direction and a column direction, the first light source is located in an odd-numbered row, and the second light source is located in an even-numbered row; or (b)

The first light sources are located in odd columns and the second light sources are located in even columns.

The application also provides a manufacturing method of the LED module, which is used for manufacturing the LED module, and comprises the following steps:

binding the first light source and the second light source on a first side of the driving substrate;

the forming die is arranged on the first side of the driving substrate and comprises a template and a cavity type die arranged on one side of the template, and the cavity type die is positioned on one side of the second light source away from the driving substrate;

injecting packaging resin between the driving substrate and the template to form the packaging layer, and removing the forming die to form a cavity at the second light source of the packaging layer;

the first lens is disposed within the cavity.

Optionally, the LED module further includes a second lens, the second lens is disposed between the second light source and the first lens, a first accommodating cavity is disposed on a side of the second lens, which is close to the second light source, the second light source is located in the first accommodating cavity, and the manufacturing method of the LED module further includes:

before the first lens is arranged, the second lens is arranged in the cavity, and the second lens is bonded with the packaging layer or the driving substrate;

and when the first lens is arranged, bonding the first lens with the second lens or the packaging layer.

The present application also provides a display device including:

the LED module;

and the main board is connected with the LED module.

The LED module, the manufacturing method of the LED module and the display device disclosed by the application have the following beneficial effects:

in the application, a plurality of first light sources and a plurality of second light sources are arranged on the first side of a driving substrate, the first lenses are in one-to-one correspondence with the second light sources, at least part of each first lens is arranged on one side of each second light source far away from the driving substrate, the first lens is used for reducing the light emitting angle of the second light source, a packaging layer is arranged on one side of the driving substrate, the thickness of the packaging layer is larger than the height of the first light source, and the thickness of the packaging layer is also larger than the height of the second light source. When the LED module is used for a display device, the first light source is turned off, the second light source is turned on, and the light of the second light source is reduced through the first lens, so that peep prevention is realized; the first light source is turned on, the second light source is turned off, and the light emergent angle of the first light source is not adjusted by the first lens, so that wide-view angle display is realized. The application can realize the quick switching of the peep-proof mode and the wide view angle mode by controlling the switch of the first light source and the second light source.

Other features and advantages of the application will be apparent from the following detailed description, or may be learned by the practice of the application.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application. It is evident that the drawings in the following description are only some embodiments of the present application and that other drawings may be obtained from these drawings without inventive effort for a person of ordinary skill in the art.

Fig. 1 is a schematic top view of an LED module according to a first embodiment of the application.

Fig. 2 is a schematic cross-sectional view of an LED module according to a first embodiment of the present application.

Fig. 3 is a schematic view illustrating an anti-peeping principle of an LED module according to a first embodiment of the present application.

Fig. 4 is a schematic cross-sectional view of an LED module according to a second embodiment of the present application.

Fig. 5 is a schematic view illustrating an anti-peeping principle of an LED module according to a second embodiment of the present application.

Fig. 6 is a flowchart of a method for manufacturing an LED module according to a third embodiment of the present application.

Fig. 7 is a schematic view illustrating a cavity formed on the encapsulation layer according to a third embodiment of the present application.

Fig. 8 is a schematic view of a second lens in a third embodiment of the application.

Fig. 9 is a schematic view of a first lens in a third embodiment of the present application.

Fig. 10 is a schematic structural diagram of a display device according to a fourth embodiment of the present application.

Reference numerals illustrate:

100. an LED module; 110. a driving substrate; 120. an encapsulation layer; 130. a first light source; 140. a second light source; 150. a first lens; 151. a second accommodation chamber; 160. a second lens; 161. a first accommodation chamber; 170. a reflective layer;

200. a forming die; 210. a template; 220. cavity section mould;

300. and a main board.

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments may be embodied in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art.

Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the application. One skilled in the relevant art will recognize, however, that the application may be practiced without one or more of the specific details, or with other methods, components, devices, steps, etc. In other instances, well-known methods, devices, implementations, or operations are not shown or described in detail to avoid obscuring aspects of the application.

The application will be described in further detail with reference to the drawings and the specific examples. It should be noted that the technical features of the embodiments of the present application described below may be combined with each other as long as they do not collide with each other. The embodiments described below by referring to the drawings are illustrative and intended to explain the present application and should not be construed as limiting the application.

Example 1

Referring to fig. 1 and 2, the LED module in this embodiment includes a driving substrate 110, an encapsulation layer 120, a first light source 130, a second light source 140, and a first lens 150. The driving substrate 110 has opposite first and second sides, and the plurality of first light sources 130 and the plurality of second light sources 140 are disposed on the first side of the driving substrate 110. The adjacent first light sources 130 are spaced apart, the adjacent second light sources 140 are spaced apart, and the adjacent first and second light sources 130, 140 are also spaced apart. The light emitting angles of the first light source 130 and the second light source 140 are the same.

The first lenses 150 are in one-to-one correspondence with the second light sources 140. At least a portion of each first lens 150 is disposed on a side of each second light source 140 away from the driving substrate 110, and the first lens 150 is used for reducing the light emitting angle of the second light source 140. For example, the light emitting angle of the second light source 140 is 120 °, and the light emitted by the second light source 140 is adjusted by the first lens 150, and the light emitting angle is reduced to 90 °. The first lens 150 may be specifically configured to adjust the light-emitting angle of the second light source 140. The encapsulation layer 120 is disposed on the driving substrate 110 side, the thickness of the encapsulation layer 120 is greater than the height of the first light source 130, and the thickness of the encapsulation layer 120 is also greater than the height of the second light source 140. The first light source 130 and the second light source 140 may each be embedded in the encapsulation layer 120, and each of the first lenses 150 is at least partially embedded in the encapsulation layer 120.

The LED module may be used as a backlight module for a display device, but not limited thereto, and the LED module may also be used for an LED direct display device, where each first light source 130 and each second light source 140 are used as a pixel to display a picture, as the case may be.

The LED module is used for a display device, and the display device is provided with a peep-proof mode and a wide view angle mode. In the peep-proof mode, the first light source 130 is turned off, the second light source 140 is turned on, the light of the second light source 140 is reduced through the first lens 150, and the viewing angle of the display screen visible on the viewing side of the display device is relatively small; in the wide viewing angle mode, the first light source 130 is turned on, the second light source 140 is turned off, and the light emitting angle of the first light source 130 is not adjusted by the first lens 150, so that the viewing angle of the display screen visible on the viewing side of the display device is relatively large.

In this embodiment, the LED module includes a driving substrate 110, an encapsulation layer 120, a first light source 130, a second light source 140 and a first lens 150, where the first light source 130 and the second light source 140 are disposed on a first side of the driving substrate 110, the first lens 150 corresponds to the second light source 140 one by one, at least a portion of each first lens 150 is disposed on a side of each second light source 140 away from the driving substrate 110, the first lens 150 is used for reducing an emitting angle of the second light source 140, the encapsulation layer 120 is disposed on a side of the driving substrate 110, a thickness of the encapsulation layer 120 is greater than a height of the first light source 130, and a thickness of the encapsulation layer 120 is also greater than a height of the second light source 140. When the LED module is used in a display device, the first light source 130 is turned off, the second light source 140 is turned on, the light of the second light source 140 is reduced by the first lens 150, and the viewing angle of the display screen visible on the viewing side of the display device is relatively small, so that peep-proof is realized; the first light source 130 is turned on, the second light source 140 is turned off, the light emitting angle of the first light source 130 is not adjusted by the first lens 150, and the viewing angle of the display screen seen by the viewing side of the display device is relatively large, that is, the wide viewing angle display is realized. The present application can realize the fast switching between the peep-proof mode and the wide viewing angle mode by controlling the switching of the first light source 130 and the second light source 140.

In addition, the light rays of the first light source 130 and the second light source 140 are not blocked, so that the loss of light efficiency is avoided and the power consumption of the display device is reduced compared with the display device adopting the peep-proof film for peep prevention.

By way of example, the first light source 130 and the second light source 140 may each be a Mini/Micro LED light source. Wherein, the size of the Mini LED light source is 50 micrometers-200 micrometers, and when the Mini LED light source is bound on the driving substrate 110, the gap between two adjacent Mini LED light sources is 0.3 millimeter-1.2 millimeter. The Micro LED light sources are less than 50 microns in size, and when bound to the drive substrate 110, the gap between two adjacent Micro LED light sources is less than 0.3 mm.

The Mini LED/Micro LED light source has small size, small gap between the light sources, and large quantity of the Mini LED/Micro LED light sources integrated on the driving substrate 110, and when the LED module is used as a backlight module, the LED module can be divided into more fine backlight partitions, so that the contrast ratio of a screen is greatly improved. In addition, when the Mini/Micro LED light source size is reduced to the pixel level, the LED module can be used for LED direct display, a traditional liquid crystal display panel is omitted, the manufacturing cost of the display device is reduced, and the image quality of the display device is improved.

It should be noted that, the first light source 130 and the second light source 140 may be Mini/Micro LED light sources, but not limited thereto, and the first light source 130 and the second light source 140 may also be LED light sources, as the case may be.

Referring to fig. 1 and 2, the first light source 130 and the second light source 140 are disposed on the driving substrate 110 in a row direction and a column direction array. The first light sources 130 are located in the odd numbered rows and the second light sources 140 are located in the even numbered rows.

The first light source 130 and the second light source 140 are alternately arranged, when the LED module is used as a backlight module, the light of the backlight source is more uniform, and when the LED module is used for LED direct display, the image quality of the display device is better.

It should be noted that, the first light sources 130 are located in odd rows and the second light sources 140 are located in even rows, but not limited thereto, the first light sources 130 may be located in odd columns, and the second light sources 140 may be located in even columns, as the case may be.

Referring to fig. 2, the LED module further includes a second lens 160, the second lens 160 is disposed between the second light source 140 and the first lens 150, a first accommodating cavity 161 is disposed on a side of the second lens 160 adjacent to the second light source 140, and the second light source 140 is disposed in the first accommodating cavity 161.

The second light source 140 is disposed in the first accommodating cavity 161 of the second lens 160, and the second light source 140 can be protected by the second lens 160. At the same time, the second lens 160 also functions to support the first lens 150.

Referring to fig. 2, the second lens 160 has a groove on a side far from the driving substrate 110, the first lens 150 is a convex lens, one surface of the first lens 150 is located in the groove of the second lens 160, and the other surface of the first lens 150 is located outside the groove of the second lens 160. The second lens 160 and the first light source 130 are both buried in the encapsulation layer 120, and the interface between the second lens 160 and the encapsulation layer 120 can reflect part of the light of the second light source 140 toward the first lens 150.

Referring to fig. 3 specifically, the light with a small angle from the second light source 140 directly irradiates the first lens 150, the light with a large angle from the second light source 140 irradiates the interface between the second lens 160 and the encapsulation layer 120, the interface between the second lens 160 and the encapsulation layer 120 reflects the light with a large angle from the second light source 140 to the first lens 150, and finally, the total light from the second light source 140 is reduced in light emergent angle through the first lens 150, so as to realize peep prevention.

The first lens 150 is a convex lens, the first lens 150 has a simple structure and is manufactured at the edge; the interface between the second lens 160 and the encapsulation layer 120 can reflect part of the light of the second light source 140 to the first lens 150, so that the light utilization rate is improved, and the power consumption of the LED module is reduced.

Referring to fig. 2 and 3, the refractive index of the material forming the second lens 160 is greater than the refractive index of the material forming the encapsulation layer 120. When light is incident from an optically dense medium into an optically sparse medium, total reflection occurs if the incident angle is greater than or equal to the critical angle. Therefore, by adjusting the refractive index of the material forming the second lens 160 and the refractive index of the material forming the encapsulation layer 120, the light with a large angle of the second light source 140 can be totally reflected at the interface between the second lens 160 and the encapsulation layer 120.

By adjusting the refractive index of the material forming the second lens 160 and the refractive index of the material forming the encapsulation layer 120, the large-angle light of the second light source 140 is totally reflected at the interface between the second lens 160 and the encapsulation layer 120, the structure of the LED module is simpler, and the manufacturing cost of the LED module can be reduced.

It should be noted that, the refractive index of the material forming the second lens 160 and the refractive index of the material forming the encapsulation layer 120 may be adjusted, and the large-angle light of the second light source 140 is totally reflected at the interface between the second lens 160 and the encapsulation layer 120, but not limited thereto, the LED module may also include a reflective layer 170, and the reflective layer 170 is formed at the interface between the second lens 160 and the encapsulation layer 120.

The reflective layer 170 is formed at the interface between the second lens 160 and the encapsulation layer 120, and the reflective layer 170 reflects the light of the second light source 140 with a large angle, so that the material requirements on the second lens 160 and the encapsulation layer 120 can be reduced.

Example two

The main difference between the second embodiment and the first embodiment is that the first lens 150 and the second lens 160 are different in shape.

Referring to fig. 4, the first light sources 130 are all embedded in the encapsulation layer 120, and the first lens 150 is partially embedded in the encapsulation layer 120, i.e. the light incident surface of the first lens 150 is embedded in the encapsulation layer 120, and the light emergent surface of the first lens 150 is located outside the encapsulation layer 120.

The second lens 160 has a first accommodating cavity 161 near the second light source 140, and the second light source 140 is located in the first accommodating cavity 161. The first lens 150 has a second accommodating cavity 151 near the driving substrate 110, and the second lens 160 is located in the second accommodating cavity 151. The second lens 160 has a groove on a side away from the driving substrate 110, a center portion of the first lens 150 is located in the groove of the second lens 160, another side of the center portion of the first lens 150 protrudes away from the driving substrate 110, and an edge portion of the first lens 150 protrudes away from the driving substrate 110.

The interface between the first lens 150 and the encapsulation layer 120 can reflect part of the light of the second light source 140 toward the edge portion of the first lens 150.

Referring to fig. 5 specifically, the light with a small angle of the second light source 140 directly irradiates the center portion of the first lens 150, the light with a large angle of the second light source 140 irradiates the interface between the edge portion of the first lens 150 and the encapsulation layer 120, the interface between the edge portion of the second lens 160 and the encapsulation layer 120 reflects the light with a large angle of the second light source 140 to the side, far away from the driving substrate 110, of the edge portion of the first lens 150, and finally, the whole light of the second light source 140 is reduced in light outgoing angle by the first lens 150, so as to realize peep prevention.

The interface between the first lens 150 and the encapsulation layer 120 can reflect part of the light of the second light source 140 to the edge of the first lens 150, so that the light utilization rate is improved, and the power consumption of the LED module is reduced. In addition, since the aperture of the first lens 150 is increased, a wider light range can be obtained, thereby enhancing the overall brightness uniformity of the display device.

As shown in fig. 4 and 5, the refractive index of the material forming the first lens 150 is greater than the refractive index of the material forming the encapsulation layer 120. When light is incident from an optically dense medium into an optically sparse medium, total reflection occurs if the incident angle is greater than or equal to the critical angle. Therefore, by adjusting the refractive index of the material forming the first lens 150 and the refractive index of the material forming the encapsulation layer 120, the light beams with large angles of the second light source 140 can be totally reflected at the interface between the edge portion of the first lens 150 and the encapsulation layer 120.

By adjusting the refractive index of the material forming the first lens 150 and the refractive index of the material forming the encapsulation layer 120, the large-angle light of the second light source 140 is totally reflected at the interface between the edge portion of the first lens 150 and the encapsulation layer 120, the structure of the LED module is simpler, and the manufacturing cost of the LED module can be reduced.

It should be noted that, the refractive index of the material forming the first lens 150 and the refractive index of the material forming the encapsulation layer 120 may be adjusted, and the large-angle light of the second light source 140 is totally reflected at the interface between the edge portion of the first lens 150 and the encapsulation layer 120, but not limited thereto, the LED module may also include a reflective layer 170, and the reflective layer 170 is formed at the interface between the edge portion of the first lens 150 and the encapsulation layer 120.

The reflective layer 170 is formed at the interface between the edge of the first lens 150 and the encapsulation layer 120, and the reflective layer 170 reflects the light of the second light source 140 with a large angle, so that the material requirements on the first lens 150 and the encapsulation layer 120 can be reduced.

Example III

The manufacturing method of the LED module is used for manufacturing the LED module disclosed in the first embodiment or the second embodiment. Referring to fig. 2 to 6, the method for manufacturing the LED module includes:

s100: binding the first and second light sources 130 and 140 to the first side of the driving substrate 110;

s200: disposing a molding die 200 on a first side of the driving substrate 110, the molding die 200 including a mold plate 210 and a cavity-type die 220 disposed on one side of the mold plate 210, the cavity-type die 220 being located on a side of the second light source 140 remote from the driving substrate 110;

s300: injecting an encapsulation resin between the driving substrate 110 and the mold plate 210 to form the encapsulation layer 120, and removing the molding die 200 to form a cavity at the second light source 140 of the encapsulation layer 120;

s400: the first lens 150 is disposed within the cavity.

Specifically, the cavity-type mold 220 may have the same shape as a portion of the first lens 150 buried in the encapsulation layer 120. After the molding die 200 is disposed on the first side of the driving substrate 110, the encapsulation resin is injected between the driving substrate 110 and the mold plate 210, the molding die 200 is removed after the encapsulation resin is hardened to form the encapsulation layer 120, a layer of adhesive is formed on the inner surface of the cavity, and finally the first lens 150 is mounted in the cavity and adhered to the encapsulation layer 120.

The binder employs a heat curable resin or a UV curable resin having high transparency and high light transmittance, such as an acrylate-based resin, a urethane-based resin, an epoxy-based resin, a vinyl-based resin, a polyester-based resin, a polyamide-based resin, and a mixture of one or more thereof.

The forming mold 200 is adopted to form a cavity on the encapsulation layer 120, and then the first lens 150 is arranged in the cavity, so that the process for manufacturing the LED module is simpler, and the manufacturing cost of the LED module can be reduced.

For example, referring to fig. 7 to 9, in manufacturing the LED module according to the first embodiment, before the first lens 150 is disposed, the second lens 160 is disposed in the cavity, and the second lens 160 is bonded to the encapsulation layer 120; when the first lens 150 is disposed, the first lens 150 and the second lens 160 are bonded.

For the LED module further including the reflective layer 170, a reflective layer 170 of an inorganic material layer or an organic material layer, such as polytetrafluoroethylene, silicon nitride, white paint, etc., may be formed on the inner surface of the cavity. The reflective layer 170 can be formed using a physical vapor deposition or chemical vapor deposition process.

The second lens 160 and the first lens 150 are sequentially arranged in the cavity, the second lens 160 is adhered to the encapsulation layer 120, the first lens 150 is adhered to the second lens 160, the process for manufacturing the LED module is simpler, and the manufacturing cost of the LED module can be reduced.

In the manufacturing of the LED module disclosed in the second embodiment, before the first lens 150 is disposed, the second lens 160 is disposed in the cavity, and the second lens 160 is bonded to the driving substrate 110; when the first lens 150 is disposed, the first lens 150 is bonded to the encapsulation layer 120.

For the LED module further including the reflective layer 170, a reflective layer 170 of an inorganic material layer or an organic material layer may be formed on the inner surface of the cavity, and then the first lens 150 is bonded to the encapsulation layer 120.

Example IV

Referring to fig. 10, the display device in this embodiment includes an LED module 100 and a motherboard 300, and the motherboard 300 is connected to the LED module 100. The LED module 100 includes the LED module 100 disclosed in the first and second embodiments.

In this embodiment, the display device includes an LED module 100, the LED module 100 includes a driving substrate 110, an encapsulation layer 120, a first light source 130, a second light source 140 and a first lens 150, where the first light source 130 and the second light source 140 are disposed on a first side of the driving substrate 110, the first lens 150 corresponds to the second light source 140 one by one, at least a portion of each first lens 150 is disposed on a side of each second light source 140 away from the driving substrate 110, the first lens 150 is used for reducing a light emitting angle of the second light source 140, the encapsulation layer 120 is disposed on a side of the driving substrate 110, a thickness of the encapsulation layer 120 is greater than a height of the first light source 130, and a thickness of the encapsulation layer 120 is also greater than a height of the second light source 140. When the LED module 100 is used in a display device, the peep-proof mode and the wide viewing angle mode can be rapidly switched by controlling the switching of the first light source 130 and the second light source 140.

The terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and the like are to be construed broadly, and may be fixedly attached, detachably attached, or integrally formed, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

In the description of the present specification, reference to the terms "some embodiments," "exemplary," and the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

While embodiments of the present application have been shown and described, it will be understood that the above embodiments are illustrative and not to be construed as limiting the application, and that variations, modifications, alternatives and variations may be made in the above embodiments by those skilled in the art within the scope of the application, which is therefore intended to be covered by the appended claims and their equivalents.

Claims

1. The utility model provides a LED module, includes drive base plate and first light source, a plurality of first light source interval sets up drive base plate's first side, its characterized in that, LED module still includes:

2. The LED module of claim 1, further comprising a second lens disposed between the second light source and the first lens, wherein a side of the second lens adjacent to the second light source has a first receiving cavity, and wherein the second light source is disposed in the first receiving cavity.

3. The LED module of claim 2, wherein the second lens has a groove on a side away from the driving substrate, the first lens is a convex lens, and the first lens is positioned in the groove of the second lens;

4. The LED module of claim 3, wherein the refractive index of the material forming the second lens is greater than the refractive index of the material forming the encapsulation layer; or (b)

5. The LED module of claim 2, wherein the first light sources are all embedded in the package layer, the first lens is partially embedded in the package layer, the second lens has a first accommodating cavity near the second light source, the second light source is positioned in the first accommodating cavity, the first lens has a second accommodating cavity near the driving substrate, the second lens is positioned in the second accommodating cavity, the second lens has a groove far away from the driving substrate, the first lens has a center portion in the groove of the second lens, the other side of the center portion of the first lens is protruded far away from the driving substrate, and the edge portion of the first lens is protruded far away from the driving substrate;

6. The LED module of claim 5, wherein the refractive index of the material forming the first lens is greater than the refractive index of the material forming the encapsulant layer; or (b)

7. The LED module of claim 1, wherein the first light source and the second light source are arranged in an array in a row direction and a column direction on the driving substrate, the first light source being located in an odd-numbered row, the second light source being located in an even-numbered row; or (b)

8. A method for manufacturing an LED module according to any one of claims 1 to 7, the method comprising:

the first lens is disposed within the cavity.

9. The method according to claim 8, wherein the LED module further comprises a second lens, the second lens is disposed between the second light source and the first lens, a first accommodating cavity is disposed on a side of the second lens, which is close to the second light source, the second light source is disposed in the first accommodating cavity, and the method further comprises:

10. A display device, comprising:

the LED module according to any one of claims 1 to 7;

and the main board is connected with the LED module.