CN116900200A - Chip lead processing equipment - Google Patents

Abstract

The invention discloses a chip pin processing device, which belongs to the technical field of chip pins. The chip pin processing device includes: a rack; A clamping mechanism is used to clamp the chip for transportation on the conveyor belt; a bending roller, the bending roller is arranged on the frame, the rotating axis of the bending roller is parallel to the forward direction of the conveyor belt, and the bending roller There are multiple bending parts evenly distributed on the circumferential side of the cylinder, and the rotation of the bending roller drives the bending parts to bend the pins of the chip on the clamping mechanism; the driving mechanism is arranged on the frame, and the driving mechanism is connected with The clutch is connected to the bending roller and the conveyor belt respectively. Through the operation of the clutch, the driving mechanism makes the conveyor belt and the bending roller operate alternately.

Description

Chip lead processing equipment

Technical field

The present invention relates to the technical field of chip pins, and in particular, to a chip pin processing device.

Background technique

The pins of a chip refer to the metal contacts on an integrated circuit used to connect to external circuits or other chips. These pins are typically located on the edge of the chip and connect to external circuitry through soldering, insertion, or other connections. Each pin is connected to a specific function or circuit node within the chip. They can be used for input, output, power supply, ground connection, communication with other chips, etc.

The existing chip pin processing has a low degree of automation and requires manual assistance during the processing. However, on the one hand, manual assistance increases the labor cost of chip pin processing. On the other hand, manual assistance can easily affect the accuracy of chip pin processing, and It is possible to damage the chip and chip pins during processing.

Contents of the invention

The purpose of the present invention is to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a chip pin processing device that can fully automatically complete the processing of chip pins and perform quality inspection after the processing is completed. .

A chip lead processing device according to an embodiment of the present invention includes: a frame; and a conveyor belt. The conveyor belt is arranged on the frame in the front-to-back direction. A plurality of clamping mechanisms are arranged at equal intervals on the conveyor belt. The clamping mechanism is used to clamp the chip. Transported on the conveyor belt; chip placement mechanism, the chip placement mechanism is set on the frame, the chip placement mechanism is located at the front end of the conveyor belt, the chips with pins to be processed are stored in the chip placement mechanism, and the chip placement mechanism is used to put the pins to be processed The chip is placed on the clamping mechanism; the chip collection mechanism is set on the frame, and the chip collection mechanism is located at the rear end of the conveyor belt. The chip collection mechanism is used to remove the chip with processed pins from the clamping mechanism and Collection; bending roller, the bending roller is set on the frame, the rotation axis of the bending roller is parallel to the forward direction of the conveyor belt, there are multiple bending parts evenly distributed on the circumference of the bending roller, the bending roller The rotation of the drum drives the bending part to bend the pins of the chip on the clamping mechanism; the clamping mechanism is set on the frame. The clamping mechanism is located on the side of the bending roller close to the conveyor belt. When the clamping mechanism When the chip is transported to the side of the bending roller, the clamping mechanism clamps the pins on the side of the chip facing the bending roller, allowing the bending part to bend the pins between the clamping mechanism and the bending roller. ; Driving mechanism, the driving mechanism is arranged on the frame, and the driving mechanism is connected with a clutch. The clutches are respectively connected with the bending roller and the conveyor belt. Through the operation of the clutch, the driving mechanism makes the conveyor belt and the bending roller operate alternately.

The chip lead processing device according to the embodiment of the present invention at least has the following beneficial effects: a clutch is used to alternately drive the driving mechanism to the conveyor belt and the bending roller, thereby ensuring that the conveyor belt and the bending roller do not work at the same time, avoiding the occurrence of The error occurs when the chip is moving while bending the leads, ensuring the accuracy of lead processing. In addition, the pin is clamped by the clamping mechanism, and then the bending roller is used to drive the bending part to rotate to bend the end of the pin, which can effectively avoid the impact of the bending process on the chip body, and the bending force can Conveniently provide precise control and adjustments.

According to some embodiments of the present invention, a visual detection mechanism is also included. The visual detection mechanism is arranged on the conveyor belt. The visual detection mechanism is located behind the bending roller. The visual detection mechanism is used to detect the processing status of the chip pins.

According to some embodiments of the present invention, the chip delivery mechanism is located above the conveyor belt. The chip delivery mechanism includes: a storage rack. The storage rack is arranged on the rack in the vertical direction. The storage rack is located above the front end of the conveyor belt. The storage rack is used to move along the vertical direction. A plurality of chips with pins to be processed are stacked; a delivery piece is movably arranged at the lower end of the storage rack, and the delivery piece is used to deliver chips with leads to be processed sequentially from bottom to top onto the clamping mechanism.

According to some embodiments of the present invention, the delivery piece includes a movable stop, which is movably disposed at the lower end of the storage rack. The movable block is against the bottom surface of the chip. When the clamping mechanism moves below the storage rack, the movable block The block moves outward to make the bottom chip slide down onto the clamping mechanism, and the movable block resets to support the bottom of the second chip.

According to some embodiments of the present invention, the chip collection mechanism is located above the conveyor belt. The chip collection mechanism includes: a collection rack. The collection rack is arranged on the frame in a vertical direction. The collection rack is located above the rear end of the conveyor belt. The collection rack is used to move along the vertical direction. The method is to stack the chips with processed pins; the lifting piece can move up and down and is installed on the frame. The lifting piece is used to lift the chips on the clamping mechanism upward into the collection rack.

According to some embodiments of the present invention, the bottom end of the collection rack is provided with a one-way baffle that can rotate upward. When the lifting member lifts the chip upward, the one-way baffle will rotate upward so that the chip can smoothly pass through the one-way baffle. Baffle, when the lifting member descends, the one-way baffle resists the bottom of the chip to prevent the chip from falling, allowing the chips to be stacked on the collection rack.

According to some embodiments of the present invention, the clamping mechanism is provided with a micro-moving component, which is used to drive the chip to move in a direction perpendicular to the conveyor belt, thereby adjusting the distance between the chip and the bending part in the left and right directions, and adjusting the pins. bending angle.

According to some embodiments of the present invention, a rotating seat is provided on the clamping mechanism, and the rotating seat is used to drive the chip to rotate in the horizontal direction, so that the pins on each side of the chip are sequentially processed toward the bending roller.

According to some embodiments of the present invention, the clamping mechanism includes an upper clamping jaw and a lower clamping jaw. Both the upper clamping jaw and the lower clamping jaw are disposed on the frame to move up and down. The upper clamping jaw is located above the chip pin, and the lower clamping jaw The claw is located below the chip pin, and the upper clamping claw and the lower clamping claw can move toward the chip pin synchronously to clamp the chip pin.

According to some embodiments of the present invention, both the upper clamping jaw and the lower clamping jaw include a plurality of arc clamping jaw heads with different diameters. Using different arc clamping jaw heads to clamp the chip pins can bend different bending radii. of pins.

Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Description of the drawings

The present invention will be further described below in conjunction with the accompanying drawings and examples:

Figure 1 is a schematic structural diagram of a chip pin processing device according to an embodiment of the present invention;

Figure 2 is a top view of Figure 1;

Figure 3 is a front view of Figure 1;

Figure 4 is a partial enlarged view of position A in Figure 1;

Figure 5 is a partial enlarged view of B in Figure 1;

Figure 6 is a partial enlarged view of C in Figure 1;

Reference signs:

Rack 100;

Conveyor belt 200; clamping mechanism 210; micro-moving parts 220; rotating base 230;

Chip placement mechanism 300; storage rack 310; placement piece 320; movable stopper 330;

Chip collection mechanism 400; collection rack 410; lifting member 420; one-way baffle 430;

Bending roller 500; bending portion 510;

Clamping mechanism 600; upper clamping jaw 610; lower clamping jaw 620;

Visual inspection mechanism 700.

Detailed ways

This section will describe the specific embodiments of the present invention in detail. The preferred embodiments of the present invention are shown in the accompanying drawings. The function of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand the present invention. Each technical feature and overall technical solution of the invention shall not be construed as limiting the scope of protection of the invention.

In the description of the present invention, it should be understood that orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or position relationships shown in the drawings and are only In order to facilitate the description of the present invention and simplify the description, it is not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be construed as a limitation of the present invention.

In the description of the present invention, several means one or more, plural means two or more, greater than, less than, more than, etc. are understood to exclude the original number, and above, below, within, etc. are understood to include the original number. If there is a description of first and second, it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the order of indicated technical features. relation.

In the description of the present invention, unless otherwise explicitly limited, words such as setting, installation, and connection should be understood in a broad sense. Those skilled in the art can reasonably determine the specific meaning of the above words in the present invention in combination with the specific content of the technical solution.

A chip lead processing device according to an embodiment of the present invention is described with reference to FIGS. 1 to 6 .

As shown in Figures 1 to 6, the chip pin processing device according to the embodiment of the present invention includes: a frame 100; a conveyor belt 200. The conveyor belt 200 is arranged on the frame 100 in the front and rear direction. There are multiple devices arranged at equal intervals on the conveyor belt 200. A clamping mechanism 210 is used to clamp the chip for transportation on the conveyor belt 200; a chip placement mechanism 300 is provided on the frame 100, and the chip placement mechanism 300 is located at the front end of the conveyor belt 200. The chip placement mechanism Chips with pins to be processed are stored in 300, and the chip placement mechanism 300 is used to place the chips with pins to be processed onto the clamping mechanism 210; the chip collection mechanism 400 is set on the rack 100 to collect chips. The mechanism 400 is located at the rear end of the conveyor belt 200. The chip collection mechanism 400 is used to remove and collect the chips with processed pins from the clamping mechanism 210; the bending roller 500 is arranged on the frame 100 , the rotation axis of the bending roller 500 is parallel to the forward direction of the conveyor belt 200 , a plurality of bending parts 510 are evenly distributed on the circumference of the bending roller 500 , the rotation of the bending roller 500 drives the bending parts 510 to clamp the clamping mechanism The pins of the chip on 210 are bent; the clamping mechanism 600 is arranged on the frame 100. The clamping mechanism 600 is located on the side of the bending roller 500 close to the conveyor belt 200. When the clamping mechanism 210 presses the chip When transported to the side of the bending roller 500, the clamping mechanism 600 clamps the pins on the side of the chip facing the bending roller 500, so that the bending portion 510 is opposite to the lead between the clamping mechanism 600 and the bending roller 500. The feet are bent; the driving mechanism is arranged on the frame 100. The driving mechanism is connected with clutches. The clutches are respectively connected with the bending roller 500 and the conveyor belt 200. Through the operation of the clutch, the driving mechanism makes the conveyor belt 200 and the bending roller The barrels 500 operate alternately.

As shown in Figures 1 to 6, the frame 100 is provided with a conveyor belt 200 along the front and rear directions. The conveyor belt 200 is used to transport chips from front to back. A chip delivery mechanism 300 is provided at the front end of the conveyor belt 200. The chip delivery mechanism 300 is located on the conveyor belt 200. Above, the chip delivery mechanism 300 includes: a storage rack 310. The storage rack 310 is arranged on the rack 100 in the vertical direction. The storage rack 310 is located above the front end of the conveyor belt 200. The storage rack 310 is used to stack multiple pins in the vertical direction. The chip to be processed; the placement piece 320. The placement piece 320 is movably arranged at the lower end of the storage rack 310. The placement piece 320 is used to sequentially put the chip to be processed onto the clamping mechanism 210 from bottom to top.

The delivery piece 320 includes a movable stopper 330, which is movably disposed at the lower end of the storage rack 310. The movable stopper 330 abuts against the bottom surface of the chip. When the clamping mechanism 210 moves below the storage rack 310, the movable stopper 330 moves to the bottom of the storage rack 310. 330 moves outward to cause the bottom chip to slide downward onto the clamping mechanism 210, and the movable stopper 330 resets to support the bottom of the second chip.

Since the conveyor belt 200 and the driving mechanism are connected through a clutch, the driving mechanism drives the conveyor belt 200 to move intermittently. The movable block 330 cooperates with the intermittent movement of the conveyor belt 200 to place the chips onto the clamping mechanism 210 of the conveyor belt 200 in sequence. Specifically, whenever the empty clamping mechanism 210 moves directly below the storage rack 310 , the movable block 330 rotates outward, causing the chips in the storage rack 310 to lose support and slide downward into the clamping mechanism 210 . The movable stopper 330 will automatically reset after completing the placement of one chip to provide support for the remaining chips in the storage rack 310 again.

The storage rack 310 is arranged vertically in the up and down direction, so the movement of the chip sliding down is also performed in the vertical direction. It is conceivable that only photoelectric detection components and other detection elements need to be installed on the storage rack 310 to detect whether the clamping mechanism 210 moves. Once in place, the chip can be accurately placed on the clamping mechanism 210, ensuring the accuracy of chip positioning, thereby ensuring the accuracy of subsequent bending of the chip leads.

The chip collection mechanism 400 is arranged at the rear end of the conveyor belt 200. The chip collection mechanism 400 is located above the conveyor belt 200. The chip collection mechanism 400 includes: a collection rack 410. The collection rack 410 is arranged on the frame 100 in the vertical direction. The collection rack 410 is located on the conveyor belt. Above the rear end of 200, a collection rack 410 is used to vertically stack the chips with processed pins; a lifting piece 420 can move up and down and is disposed on the rack 100, and the lifting piece 420 is used to clamp the chips. The chips on the holding mechanism 210 are lifted upward into the collection rack 410 .

The bottom end of the collection rack 410 is provided with a one-way baffle 430 that can rotate upward. When the lifting member 420 lifts the chip upward, the one-way baffle 430 will rotate upward so that the chip can smoothly pass through the one-way baffle 430. When the lifting member 420 descends, the one-way baffle 430 resists the bottom of the chip to prevent the chip from descending, so that the chips are stacked on the collection rack 410 .

When the clamping mechanism 210 clamps the chip with processed pins and moves it below the collection rack 410, the lifting member 420 operates to lift the chip upward, and the chip pushes the one-way baffle 430 to move upward until the chip completely passes through the one-way baffle. Board 430. At this time, the one-way baffle 430 is reset to its original state. Since the one-way baffle 430 cannot move further downward, the lifting member 420 descends at this time. The one-way baffle 430 offsets the bottom of the chip and blocks the chip. Support is provided to store the chips stacked in the collection rack 410.

As shown in Figure 5, the clamping mechanism 210 is provided with a micro-moving component 220. The micro-moving component 220 is used to drive the chip to move in a direction perpendicular to the conveyor belt 200, thereby adjusting the distance between the chip and the bending portion 510 in the left and right directions. Adjust the bending angle of the pin.

The micro-moving part 220 can push the clamping mechanism 210 to slide in the left and right direction, so that the chip on the clamping mechanism 210 moves closer to or away from the bending part 510 and the clamping mechanism 600 . Therefore, when the clamping mechanism 210 stops on the right side of the bending roller 500, the micro-moving part 220 can drive the clamping mechanism 210 to slide left and right, thereby adjusting the position of the clamping mechanism 600 to clamp the pin, and the position between the pin and the folding roller 500. The relative position of the bent portion 510 changes the position of the pin bending and the angle of the pin bending.

As shown in FIG. 5 , the clamping mechanism 210 is provided with a rotating base 230 . The rotating base 230 is used to drive the chip to rotate in the horizontal direction, so that the pins on each side of the chip are sequentially processed toward the bending roller 500 . The rotating base 230 can drive the chip to rotate. When the chip has multiple pins that need to be processed, the rotating base 230 can rotate so that the pins on each side can be aligned with the bending roller 500 for processing.

As shown in Figure 5, the clamping mechanism 600 includes an upper clamping jaw 610 and a lower clamping jaw 620. Both the upper clamping jaw 610 and the lower clamping jaw 620 are disposed on the frame 100 to move up and down. The upper clamping jaw 610 is located on the chip pin. above, the lower clamping jaw 620 is located below the chip pin, and the upper clamping jaw 610 and the lower clamping jaw 620 can move toward the chip pin synchronously to clamp the chip pin. The upper clamping jaw 610 and the lower clamping jaw 620 each include a plurality of arc clamping jaw heads with different diameters. Using different arc clamping jaw heads to clamp the chip pins can bend the pins with different bending radii.

As shown in Figures 1 to 3, the device also includes a visual detection mechanism 700. The visual detection mechanism 700 is arranged on the conveyor belt 200. The visual detection mechanism 700 is located behind the bending roller 500. The visual detection mechanism 700 is used to detect chip pins. processing conditions. The visual inspection mechanism 700 observes the pin condition of the processed chip through imaging elements such as cameras, and carefully checks the angle, position, shape, etc. of the pin after completing the bending of the pin. This ensures that the pins can connect and work properly.

The process of using this device to automatically process chip pins is as follows:

The driving mechanism alternately drives the conveyor belt 200 and the bending roller 500 to operate through the clutch. The conveyor belt 200 stops, and the chip placing mechanism 300 places the chips to be processed on the clamping mechanism 210; after the clamping mechanism 210 carries the chip, the conveyor belt 200 operates, and the The chip is transported to the right side of the bending roller 500; the conveyor belt 200 stops, the clamping mechanism 600 clamps the pins on the side facing the bending roller 500, and at the same time the bending roller 500 rotates to cause the bending part 510 to fold the pins. Bending; after completing the bending, the bending roller 500 stops, and the conveyor belt 200 operates to transport the chip to the visual inspection mechanism 700 for visual inspection to ensure that the pin processing is completed and the quality is qualified, the conveyor belt 200 transports the chip to the chip collection mechanism 400 Stacked collection everywhere.

A clutch is used to alternately connect the driving mechanism to the conveyor belt 200 and the bending roller 500, thereby ensuring that the conveyor belt 200 and the bending roller 500 do not work at the same time, and avoiding the occurrence of an erroneous working condition in which the chip is moving while bending the pins. , ensuring the accuracy of pin processing.

In addition, the clamping mechanism 600 clamps the pin, and then uses the bending roller 500 to drive the bending part 510 to rotate to bend the end of the pin, which can effectively avoid the impact of the bending on the chip body, and the bending Bending force can be easily and precisely controlled and adjusted.

The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the scope of knowledge of those of ordinary skill in the technical field without departing from the spirit of the present invention. .

Claims (10)

1. A chip pin processing apparatus, comprising:

a frame (100);

a conveyor belt (200), wherein the conveyor belt (200) is arranged on the frame (100) along the front-back direction, a plurality of clamping mechanisms (210) are arranged on the conveyor belt (200) at equal intervals, and the clamping mechanisms (210) are used for clamping chips to transport on the conveyor belt (200);

the chip throwing mechanism (300) is arranged on the frame (100), the chip throwing mechanism (300) is positioned at the front end of the conveyor belt (200), chips with pins to be processed are stored in the chip throwing mechanism (300), and the chip throwing mechanism (300) is used for throwing the chips with the pins to be processed onto the clamping mechanism (210);

the chip collecting mechanism (400) is arranged on the rack (100), the chip collecting mechanism (400) is positioned at the rear end of the conveyor belt (200), and the chip collecting mechanism (400) is used for taking off and collecting chips with processed pins from the clamping mechanism (210);

the bending roller (500), the bending roller (500) is arranged on the frame (100), the rotation axis of the bending roller (500) is parallel to the advancing direction of the conveyor belt (200), a plurality of bending parts (510) are uniformly distributed on the periphery of the bending roller (500), and the bending roller (500) rotates to drive the bending parts (510) to bend pins of a chip on the clamping mechanism (210);

the clamping mechanism (600), the clamping mechanism (600) is arranged on the frame (100), the clamping mechanism (600) is positioned on one side, close to the conveyor belt (200), of the bending roller (500), when the clamping mechanism (210) conveys a chip to the side surface of the bending roller (500), the clamping mechanism (600) clamps the chip towards a pin on one side of the bending roller (500), and the bending part (510) bends the pin between the clamping mechanism (600) and the bending roller (500);

the driving mechanism is arranged on the frame (100), the driving mechanism is connected with a clutch, the clutch is respectively connected with the bending roller (500) and the conveying belt (200), and the conveying belt (200) and the bending roller (500) are alternately operated by the driving mechanism through the operation of the clutch.

2. The chip pin processing apparatus of claim 1, further comprising a visual detection mechanism (700), wherein the visual detection mechanism (700) is disposed on the conveyor belt (200), the visual detection mechanism (700) is located behind the bending roller (500), and the visual detection mechanism (700) is configured to detect a processing condition of a chip pin.

3. The chip pin processing apparatus of claim 1, wherein the chip dispensing mechanism (300) is located above the conveyor belt (200), the chip dispensing mechanism (300) comprising:

the storage rack (310) is arranged on the rack (100) along the vertical direction, the storage rack (310) is positioned above the front end of the conveyor belt (200), and the storage rack (310) is used for stacking chips with a plurality of pins to be processed along the vertical direction;

the throwing piece (320), the movably lower extreme that sets up of depositing rack (310) is put in piece (320), put in piece (320) are used for from the bottom up to put in the chip that the pin is to be processed downwards in proper order on fixture (210).

4. A chip pin processing apparatus according to claim 3, wherein the delivering member (320) comprises a movable stopper (330), the movable stopper (330) is movably disposed at the lower end of the storage rack (310), the movable stopper (330) is abutted against the bottom surface of the chip, when the clamping mechanism (210) moves below the storage rack (310), the movable stopper (330) moves outwards to enable the chip at the bottommost layer to slide down onto the clamping mechanism (210), and the movable stopper (330) resets to support the bottom of the second chip.

5. The die pin processing apparatus of claim 1, wherein the die collection mechanism (400) is located above the conveyor belt (200), the die collection mechanism (400) comprising:

the collecting frame (410), the collecting frame (410) is arranged on the rack (100) along the vertical direction, the collecting frame (410) is positioned above the rear end of the conveyor belt (200), and the collecting frame (410) is used for stacking chips with processed pins along the vertical mode;

the jacking piece (420), the jacking piece (420) can reciprocate the end setting and be in on the frame (100), jacking piece (420) are used for upwards jacking the chip on the fixture (210) to in the collection frame (410).

6. The chip pin processing apparatus according to claim 5, wherein the bottom end of the collecting rack (410) is provided with a unidirectional baffle (430) capable of rotating upwards, when the chip is lifted upwards by the lifting member (420), the unidirectional baffle (430) rotates upwards, so that the chip can smoothly pass through the unidirectional baffle (430), and when the lifting member (420) descends, the unidirectional baffle (430) abuts against the bottom of the chip, so that the chip is prevented from descending, and the chip is stacked on the collecting rack (410).

7. The chip pin processing device according to claim 1, wherein the clamping mechanism (210) is provided with a micro-motion member (220), and the micro-motion member (220) is used for driving the chip to move along a direction perpendicular to the conveyor belt (200), so as to adjust a distance between the chip and the bending portion (510) in a left-right direction and adjust a bending angle of the pin.

8. The chip pin processing device according to claim 1, wherein a rotating seat (230) is provided on the clamping mechanism (210), and the rotating seat (230) is used for driving the chip to rotate along a horizontal direction, so that pins on each side of the chip are sequentially processed towards the bending roller (500).

9. The chip pin processing apparatus according to claim 1, wherein the clamping mechanism (600) includes an upper clamping jaw (610) and a lower clamping jaw (620), the upper clamping jaw (610) and the lower clamping jaw (620) are both movably disposed on the frame (100) up and down, the upper clamping jaw (610) is located above a chip pin, the lower clamping jaw (620) is located below a chip pin, and the upper clamping jaw (610) and the lower clamping jaw (620) are capable of synchronously moving toward the chip pin to clamp the chip pin.

10. The chip pin processing apparatus of claim 9, wherein the upper clamping jaw (610) and the lower clamping jaw (620) each include a plurality of circular arc clamping jaw heads with different diameters, and pins with different bending radii can be bent by clamping the chip pins with different circular arc clamping jaw heads.