CN116815277B - Electroplating device, control method, equipment and medium - Google Patents
Electroplating device, control method, equipment and mediumInfo
- Publication number
- CN116815277B CN116815277B CN202310861654.2A CN202310861654A CN116815277B CN 116815277 B CN116815277 B CN 116815277B CN 202310861654 A CN202310861654 A CN 202310861654A CN 116815277 B CN116815277 B CN 116815277B
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- flow guiding
- liquid receiving
- electroplating
- receiving tank
- unit
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to the technical field of electroplating, in particular to an electroplating device, a control method, equipment and a medium, wherein the electroplating device comprises a power supply, a liquid receiving tank, a flow guiding unit, a flow guiding moving unit and a circulating unit; the flow guiding unit comprises a flow guiding component, a sealing flange and a flow guiding component polar plate, wherein the sealing flange comprises a flange overflow port and is connected with the flow guiding component, the flow guiding component polar plate is arranged in the flow guiding component and is electrically connected with a power supply, the circulating unit is communicated with the flow guiding component, and the flow guiding moving unit is connected with the flow guiding unit. The height of the electroplating device in the scheme cannot be influenced by the length of a plated piece, namely, the height of the electroplating device can be lower, the height of the factory building cannot be limited, the purpose of automatically electroplating the inner cavity of the plated piece in the factory building can be achieved, the electroplating cost is reduced, and the electroplating efficiency is improved.
Description
Technical Field
The disclosure relates to the technical field of electroplating, in particular to an electroplating device, a control method, equipment and a medium.
Background
In the related art, when electroplating an inner cavity of a plated part (such as a long conductive rod), a scheme of local insulation vertical electroplating or brush plating is generally adopted, wherein the brush plating needs to be manually completed by an operator, and the local insulation vertical electroplating is to immerse the plated part into a solution from above a liquid surface of the solution used for electroplating so as to realize automatic continuous production.
In the scheme, although the inner cavity of the plating piece can be automatically and continuously plated, when the length of the plating piece is longer, the plating piece cannot be immersed into the solution from the upper part in a vertical state due to the restriction of the height of the factory building, so that the scheme of local insulation vertical plating cannot be adopted, and the inner cavity of the plating piece can be plated only in the factory building in a manual brushing plating operation mode, thereby improving the plating cost, reducing the plating efficiency and having larger plating quality fluctuation.
Disclosure of Invention
In order to solve the problems in the related art, embodiments of the present disclosure provide an electroplating apparatus, a control method, a device, and a medium.
In a first aspect, an embodiment of the present disclosure provides an electroplating apparatus, including a power supply, a liquid receiving tank, a flow guiding unit, a flow guiding moving unit, and a circulation unit;
The flow guiding unit comprises a flow guiding component, a sealing flange and a flow guiding component polar plate, wherein the sealing flange comprises a flange overflow port and is connected with the flow guiding component;
The circulating unit is communicated with the flow guide assembly and is used for moving the solution from the liquid receiving tank to the flow guide assembly and enabling the solution to flow out of the flow guide assembly;
The flow guiding moving unit is connected with the flow guiding unit and used for moving the flow guiding unit, so that the flow guiding assembly is inserted into the inner cavity of the plating piece from the inner cavity opening of the plating piece above the liquid receiving groove, the sealing flange is attached to the inner cavity opening, and the solution in the inner cavity can flow out from the flange overflow opening and flow into the liquid receiving groove.
In one embodiment of the present disclosure, the circulation unit includes a circulation pump, a liquid storage tank, and a diverter valve;
the liquid storage tank is arranged below the liquid receiving tank, the liquid receiving tank comprises a liquid receiving tank diversion port arranged on the bottom surface of the liquid receiving tank, and the liquid storage tank is communicated with the liquid receiving tank diversion port through a diversion valve;
The circulating pump is communicated with the liquid storage tank and used for moving the solution from the liquid storage tank to the flow guiding assembly and enabling the solution to flow out of the flow guiding assembly.
In one embodiment of the present disclosure, the instantaneous flow of solution from the flow directing assembly is greater than the instantaneous flow of solution from the flange overflow.
In one embodiment of the disclosure, the flow guiding unit further includes a sealing ring made of an elastic material, one surface of the sealing ring is abutted against the sealing flange, and the other surface of the sealing ring is abutted against the opening end surface of the inner cavity of the plating member when the flow guiding assembly is inserted into the inner cavity of the plating member.
In one embodiment of the present disclosure, a wire holder is disposed on a side of the sealing flange away from the flow guiding component, the wire holder is electrically connected with the power supply, and the flow guiding component polar plate is electrically connected with the wire holder.
In one embodiment of the disclosure, the flow guiding assembly comprises a flow guiding assembly inner cavity, the flow guiding assembly inner cavity is communicated with the circulating unit, and a plurality of through holes are formed in the inner wall of the flow guiding assembly inner cavity and used for guiding out the solution in the flow guiding assembly inner cavity.
In one embodiment of the present disclosure, the electroplating apparatus further comprises a plating inner cavity blocking assembly, wherein the plating inner cavity blocking assembly is used for being arranged at the edge of the to-be-plated area of the inner cavity and used for sealing the inner cavity.
In one embodiment of the present disclosure, the electroplating apparatus further includes a support and a moving device disposed under the support;
the power supply, the liquid receiving groove, the flow guiding moving unit and the circulating unit are fixed on the supporting piece and can move back and forth in the horizontal direction under the drive of the moving device.
In one embodiment of the disclosure, the electroplating device further comprises a plating piece height adjusting device for adjusting the distance between the plating piece and the liquid receiving groove.
In one embodiment of the present disclosure, the plating height adjustment device includes a rotation assembly for driving the plating member to rotate in a radial direction during the electroplating process.
In one embodiment of the present disclosure, an anti-splash device is provided on the liquid receiving tank for preventing the solution from splashing out of the liquid receiving tank.
In one embodiment of the disclosure, the anti-splashing device comprises a first anti-splashing component and a second anti-splashing component, wherein the first anti-splashing component is arranged on the inner wall of the liquid receiving groove, and the second anti-splashing component is arranged on the outer wall of the liquid receiving groove.
In one embodiment of the present disclosure, the first splash guard assembly includes a plurality of gas nozzles;
and/or the second splash-proof assembly comprises a liquid receiving box and a hairbrush, wherein the liquid receiving box is arranged on the outer wall of the liquid receiving groove, and the hairbrush is arranged on the side wall of one side, close to the liquid receiving groove, in the liquid receiving box.
In a second aspect, embodiments of the present disclosure provide a method for controlling an electroplating apparatus according to any one of the first aspect, including:
Acquiring position information of a plating piece;
When the plating piece is determined to be positioned above the liquid receiving groove in the electroplating device according to the position information, controlling the flow guiding moving unit in the electroplating device to move the flow guiding unit in the electroplating device, enabling the flow guiding component in the flow guiding unit to be inserted into the inner cavity of the plating piece from the inner cavity opening of the plating piece, and enabling the sealing flange in the flow guiding unit to seal the inner cavity opening;
the circulating unit in the electroplating device is controlled to move the solution from the liquid receiving tank to the flow guiding assembly, and the solution flows out of the flow guiding assembly.
In one embodiment of the present disclosure, before acquiring the positional information of the plated item, the method further includes:
and controlling the moving device in the electroplating device to move so that the liquid receiving groove moves to the lower part of the plating piece.
In a third aspect, an embodiment of the present disclosure provides an electronic device, including a memory and a processor, wherein the memory is configured to store one or more computer instructions, wherein the one or more computer instructions are executed by the processor to implement the method of any of the second aspects.
In a fourth aspect, embodiments of the present disclosure provide a computer-readable storage medium having stored thereon computer instructions which, when executed by a processor, implement a method as in any of the second aspects.
According to the technical scheme, the electroplating device comprises a power supply, a liquid receiving groove, a flow guiding unit, a flow guiding moving unit and a circulating unit, wherein the flow guiding unit comprises a flow guiding assembly, a sealing flange and a flow guiding assembly polar plate, the sealing flange comprises a flange overflow port, the sealing flange is connected with the flow guiding assembly, the flow guiding assembly polar plate is arranged in the flow guiding assembly, the flow guiding assembly polar plate is electrically connected with the power supply, the circulating unit is communicated with the flow guiding assembly and is used for moving a solution from the liquid receiving groove to the flow guiding assembly and enabling the solution to flow out of the flow guiding assembly, the flow guiding moving unit is connected with the flow guiding unit and is used for moving the flow guiding unit, the flow guiding assembly is inserted into an inner cavity of a plating piece above the liquid receiving groove from an inner cavity opening of the plating piece, the sealing flange is attached to the inner cavity opening, and the solution in the inner cavity can flow out of the flange overflow port and flow into the liquid receiving groove. In this scheme, can be more convenient make plate the piece along the horizontal direction setting to make the water conservancy diversion subassembly follow the inner chamber opening of plating the piece and insert in the inner chamber of plating the piece, use the solution in will electroplating through the water conservancy diversion subassembly in leading-in the inner chamber of plating the piece, thereby can electroplate the inner chamber of plating the piece after the switch-on, the height of electroplating device in the above-mentioned scheme can not receive the influence of plating piece length, and the height of this electroplating device can be lower promptly, can not cause the restriction on the height to the factory building, thereby can realize the purpose of electroplating the inner chamber of plating the piece in the factory building voluntarily, electroplating cost is reduced, and electroplating efficiency has been improved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
Other features, objects and advantages of the present disclosure will become more apparent from the following detailed description of non-limiting embodiments, taken in conjunction with the accompanying drawings. In the drawings:
Fig. 1 shows a schematic structural view of an electroplating apparatus according to an embodiment of the present disclosure.
Fig. 2 shows a schematic longitudinal cross-section of a sealing flange according to an embodiment of the present disclosure.
Fig. 3 shows a schematic longitudinal cross-sectional view of a flow directing assembly according to an embodiment of the present disclosure.
Fig. 4 shows a schematic structural view of a plating member according to an embodiment of the present disclosure.
Fig. 5 shows a flowchart of a plating apparatus control method according to an embodiment of the present disclosure.
Fig. 6 shows a block diagram of an electronic device according to an embodiment of the disclosure.
Fig. 7 shows a schematic diagram of a computer system suitable for use in implementing methods according to embodiments of the present disclosure.
Detailed Description
Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily implement them. In addition, for the sake of clarity, portions irrelevant to description of the exemplary embodiments are omitted in the drawings.
In this disclosure, it should be understood that terms such as "comprises" or "comprising," etc., are intended to indicate the presence of features, numbers, steps, acts, components, portions, or combinations thereof disclosed in this specification, and are not intended to exclude the possibility that one or more other features, numbers, steps, acts, components, portions, or combinations thereof are present or added.
In addition, it should be noted that, without conflict, the embodiments of the present disclosure and features of the embodiments may be combined with each other. The present disclosure will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
In the present disclosure, if an operation of acquiring user information or user data or an operation of presenting user information or user data to another person is referred to, the operations are all operations authorized, confirmed, or actively selected by the user.
In the related art, when electroplating is performed on the inner cavity of the plating member, a scheme of local insulation vertical electroplating is generally adopted, namely, when electroplating, the plating member is immersed into a solution from above the liquid level of the solution used in electroplating, so as to perform electroplating, thereby realizing the purpose of automatic continuous production.
In the scheme, although the inner cavity of the plating piece can be automatically and continuously plated, when the length of the plating piece is longer, the plating piece cannot be immersed into the solution from the upper part in a vertical state due to the restriction of the height of the factory building, so that the scheme of local insulation vertical plating cannot be adopted, and the inner cavity of the plating piece can be plated only in the factory building in a manual brushing plating operation mode, thereby improving the plating cost and reducing the plating efficiency.
In order to solve the problems, the present disclosure provides an electroplating apparatus, a control method, a device, and a medium.
According to the technical scheme, the electroplating device comprises a power supply, a liquid receiving groove, a flow guiding unit, a flow guiding moving unit and a circulating unit, wherein the flow guiding unit comprises a flow guiding assembly, a sealing flange and a flow guiding assembly polar plate, the sealing flange comprises a flange overflow port, the sealing flange is connected with the flow guiding assembly, the flow guiding assembly polar plate is arranged in the flow guiding assembly, the flow guiding assembly polar plate is electrically connected with the power supply, the circulating unit is communicated with the flow guiding assembly and is used for moving a solution from the liquid receiving groove to the flow guiding assembly and enabling the solution to flow out of the flow guiding assembly, the flow guiding moving unit is connected with the flow guiding unit and is used for moving the flow guiding unit, the flow guiding assembly is inserted into an inner cavity of a plating piece above the liquid receiving groove from the inner cavity opening of the plating piece, the sealing flange is attached to the inner cavity opening, and the solution in the inner cavity can flow out of the flange overflow port and flow into the liquid receiving groove. In this scheme, can be more convenient make plate the piece along the horizontal direction setting to make the water conservancy diversion subassembly follow the inner chamber opening of plating the piece and insert in the inner chamber of plating the piece, use the solution in will electroplating through the water conservancy diversion subassembly in leading-in the inner chamber of plating the piece, thereby can electroplate the inner chamber of plating the piece after the switch-on, the height of electroplating device in the above-mentioned scheme can not receive the influence of plating piece length, and the height of this electroplating device can be lower promptly, can not cause the restriction on the height to the factory building, thereby can realize the purpose of electroplating the inner chamber of plating the piece in the factory building voluntarily, electroplating cost is reduced, and electroplating efficiency has been improved.
Fig. 1 shows a schematic structural view of an electroplating apparatus according to an embodiment of the present disclosure. As shown in fig. 1, the electroplating device comprises a power supply, a liquid receiving tank 102, a flow guiding unit, a flow guiding moving unit 104 and a circulating unit 105;
The flow guiding unit comprises a flow guiding component 106, a sealing flange 107 and a flow guiding component polar plate 108, wherein the sealing flange 107 comprises a flange overflow port, and the sealing flange 107 is connected with the flow guiding component 106;
The circulation unit 105 is communicated with the diversion assembly 106 and is used for moving the solution from the liquid receiving tank 102 to the diversion assembly 106 and enabling the solution to flow out of the diversion assembly 106;
the diversion moving unit 104 is connected with the diversion unit and is used for moving the diversion unit, so that the diversion assembly 106 is inserted into the inner cavity 202 of the plating piece 200 from the inner cavity opening 201 of the plating piece 200 above the liquid receiving groove 102, and the sealing flange 107 is attached to the inner cavity opening 201, so that the solution in the inner cavity 202 can flow out from the flange overflow port and flow into the liquid receiving groove 102.
In one implementation of the present disclosure, the flow directing assembly plate is electrically connected with the positive pole of the power source and the plating member is electrically connected with the negative pole of the power source, thereby electroplating the interior cavity of the plating member.
In one implementation of the present disclosure, the flow guiding mobile unit is connected to the flow guiding unit, which may be understood as the flow guiding mobile unit is connected to the sealing flange, which may be understood as the flow guiding mobile unit is directly or indirectly connected to any other component in the flow guiding unit.
In one implementation of the disclosure, the circulation unit may be a circulation pump, or may be another device with a solution movement function. The circulation unit is communicated with the flow guide assembly, and can be directly communicated with the flow guide assembly through a pipeline or can be communicated with the flow guide assembly through at least one device with a liquid storage function or a flow guide function.
In one implementation of the disclosure, the electroplating device may further include an upper liquid storage tank disposed above the liquid receiving tank, and configured to communicate the upper liquid storage tank with the flow guiding assembly, wherein during electroplating, the solution is moved from the liquid receiving tank to the upper liquid storage tank by the solution pump, so that the solution in the upper liquid storage tank can move to the flow guiding assembly under the action of gravity and flow out from the flow guiding assembly.
According to the technical scheme, the electroplating device comprises a power supply, a liquid receiving groove, a flow guiding unit, a flow guiding moving unit and a circulating unit, wherein the flow guiding unit comprises a flow guiding assembly, a sealing flange and a flow guiding assembly polar plate, the sealing flange comprises a flange overflow port, the sealing flange is connected with the flow guiding assembly, the flow guiding assembly polar plate is arranged in the flow guiding assembly, the flow guiding assembly polar plate is electrically connected with the power supply, the circulating unit is communicated with the flow guiding assembly and is used for moving a solution from the liquid receiving groove to the flow guiding assembly and enabling the solution to flow out of the flow guiding assembly, the flow guiding moving unit is connected with the flow guiding unit and is used for moving the flow guiding unit, the flow guiding assembly is inserted into an inner cavity of a plating piece above the liquid receiving groove from an inner cavity opening of the plating piece, the sealing flange is attached to the inner cavity opening, and the solution in the inner cavity can flow out of the flange overflow port and flow into the liquid receiving groove. In this scheme, can be more convenient make plate the piece along the horizontal direction setting to make the water conservancy diversion subassembly follow the inner chamber opening of plating the piece and insert in the inner chamber of plating the piece, use the solution in will electroplating through the water conservancy diversion subassembly in leading-in the inner chamber of plating the piece, thereby can electroplate the inner chamber of plating the piece after the switch-on, the height of electroplating device in the above-mentioned scheme can not receive the influence of plating piece length, and the height of this electroplating device can be lower promptly, can not cause the restriction on the height to the factory building, thereby can realize the purpose of electroplating the inner chamber of plating the piece in the factory building voluntarily, electroplating cost is reduced, and electroplating efficiency has been improved.
In one embodiment of the present disclosure, as shown in fig. 1, the circulation unit 105 includes a circulation pump 115, a reservoir 125, and a diverter valve;
the liquid storage tank 125 is arranged below the liquid receiving tank 102, the liquid receiving tank 102 comprises a liquid receiving tank guide port 112 arranged on the bottom surface of the liquid receiving tank 102, and the liquid storage tank 102 is communicated with the liquid receiving tank guide port 112 through a guide valve;
The circulation pump 115 is in communication with the reservoir 125 for moving the solution from the reservoir 125 to the diversion assembly 106 and for flowing the solution out of the diversion assembly 106.
According to the technical scheme provided by the embodiment of the disclosure, the circulating unit comprises a circulating pump, a liquid storage tank and a flow guide valve, wherein the liquid storage tank is arranged below the liquid receiving tank, the liquid receiving tank comprises a liquid receiving tank flow guide port arranged on the bottom surface of the liquid receiving tank, the liquid storage tank is communicated with the liquid receiving tank flow guide port through the flow guide valve, and the circulating pump is communicated with the liquid storage tank and is used for moving solution from the liquid storage tank to the flow guide assembly and enabling the solution to flow out from the flow guide assembly. Wherein, through opening the diversion valve, the solution in the liquid receiving tank can flow into the liquid storage tank so as to store the solution in the liquid storage tank. When electroplating is needed, the solution in the liquid storage tank can be moved from the liquid storage tank to the flow guide assembly through the circulating pump, and the solution flows out of the flow guide assembly, so that the inner cavity of the plating piece is electroplated. According to the scheme, on the premise that normal electroplating functions are not affected, the solution is stored through the liquid storage tank, so that the most sufficient solution can be provided during electroplating.
In one embodiment of the present disclosure, the instantaneous flow of solution from the flow directing assembly is greater than the instantaneous flow of solution from the flange overflow.
In one implementation of the present disclosure, the sectional area of the outlet for guiding out the solution and the sectional area of the flange overflow port in the flow guiding assembly may be set, so that it may be ensured that the solution inside the inner cavity of the plating member maintains a continuous flow and full state during electroplating, and the solution may be in a laminar flow state, so that the electroplating effect on the inner cavity is better.
In one embodiment of the present disclosure, fig. 2 shows a schematic longitudinal cross-sectional view of a sealing flange according to an embodiment of the present disclosure. As shown in fig. 2, the flow guiding unit further includes a sealing ring 110 made of an elastic material, one surface of the sealing ring 110 is abutted against the sealing flange 107, and the other surface of the sealing ring 110 is used for being abutted against the opening end surface of the inner cavity of the plating member when the flow guiding assembly 106 is inserted into the inner cavity of the plating member.
According to the technical scheme provided by the embodiment of the disclosure, by arranging the sealing ring, the sealing effect of the sealing flange on the inner cavity opening is good, and the leakage of the solution from the sealing flange to the inner cavity opening end face of the plating piece is avoided.
In one embodiment of the present disclosure, a wire holder is disposed on a side of the sealing flange away from the flow guiding component, the wire holder is electrically connected with the power supply, and the flow guiding component polar plate is electrically connected with the wire holder.
According to the technical scheme provided by the embodiment of the disclosure, the wiring seat is arranged, the pole plate of the flow guide assembly is electrically connected with the power supply through the wiring seat, so that the maintenance can be facilitated, and the user experience is improved.
In one implementation of the present disclosure, fig. 3 shows a schematic longitudinal cross-sectional view of a flow directing assembly according to an embodiment of the present disclosure. As shown in fig. 3, the diversion assembly 106 includes a diversion assembly cavity 116, the diversion assembly cavity 116 is communicated with the circulation unit, a plurality of through holes 126 are arranged on the inner wall of the diversion assembly cavity 116, and the through holes are used for guiding out the solution in the diversion assembly cavity 116
According to the technical scheme provided by the embodiment of the disclosure, the solution in the inner cavity of the flow guide assembly flows out from the plurality of through holes on the inner wall of the inner cavity of the flow guide assembly, so that the concentration of the solution in different areas in the inner cavity of the flow guide assembly is uniform, and the electroplating effect is improved.
In one embodiment of the present disclosure, fig. 4 shows a schematic block diagram of a plating according to an embodiment of the present disclosure. As shown in fig. 4, the electroplating apparatus further includes a plating inner cavity plugging assembly 203, where the plating inner cavity plugging assembly 203 is configured to be disposed at an edge of the to-be-plated area of the inner cavity 202, and is configured to close the inner cavity 202.
According to the technical scheme provided by the embodiment of the disclosure, considering that partial electroplating is needed inside the inner cavity of the plating part in a partial scene, namely, only the part from the edge of the to-be-plated area of the inner cavity of the plating part to the opening of the inner cavity is electroplated, in order to meet the requirement, the edge of the to-be-plated area of the inner cavity of the plating part is provided with the plating part inner cavity plugging component, so that the edge of the to-be-plated area of the inner cavity of the plating part can be sealed by the plating part inner cavity plugging component, and when the inner cavity opening is sealed by the sealing flange, a relatively sealed space is formed in the inner cavity, so that solution is prevented from entering the inner cavity without electroplating, and pollution and waste to the inner cavity are avoided.
In one embodiment of the present disclosure, as shown in fig. 1, the electroplating apparatus further includes a support and a moving device 111 disposed under the support;
The power supply, the liquid receiving tank 102, the diversion moving unit 104 and the circulating unit 105 are fixed on the supporting piece and can move back and forth in the horizontal direction under the drive of the moving device.
According to the technical scheme provided by the embodiment of the disclosure, through the arrangement and the support piece and the moving device arranged below the support piece, the mobile power supply, the liquid receiving tank, the flow guiding moving unit and the circulating unit can be more convenient.
In one embodiment of the present disclosure, as shown in FIG. 1, the plating apparatus further includes a plating height adjusting device 120 for adjusting the distance between the plating member 200 and the liquid receiving tank 102.
In one implementation of the present disclosure, the plating height adjustment device may include a telescoping rod, a lift screw, a threaded rod, etc., which the present disclosure does not limit. The plating piece height adjusting device can be provided with a plurality of plating pieces according to the length of the plating pieces and is used for stably supporting the plating pieces along the horizontal direction.
In one embodiment of the present disclosure, the plating height adjustment device includes a rotation assembly for driving the plating member to rotate in a radial direction during the electroplating process.
In one implementation of the present disclosure, a rotating assembly may be provided to a support surface of the plating height adjustment device and configured to contact a surface of the plating member to drive rotation of the plating member in a radial direction during the electroplating process. The structure of the rotating assembly may be, for example, a rotating bearing structure, a rolling bearing or a sliding bearing driving the plating member to rotate, or may be a gear structure, a driving motor driving a gear to rotate and then driving the plating member to rotate, etc., and the specific structure of the rotating assembly is not limited in this disclosure.
According to the technical scheme provided by the embodiment of the disclosure, the rotating assembly drives the plating piece to rotate along the radial direction in the electroplating process, so that the plating layer is more uniform, and the situation that the local plating layer is too thick or too thin is avoided. In addition, the plating piece rotates along the radial direction, so that the to-be-plated area in the inner cavity of the plating piece can be contacted with the solution, the coverage of the solution on the plating piece is improved, and the electroplating quality is further improved.
In one embodiment of the present disclosure, an anti-splash device is provided on the liquid receiving tank for preventing the solution from splashing out of the liquid receiving tank.
According to the technical scheme provided by the embodiment of the disclosure, through setting up the anti-splashing device that is used for preventing the solution from splashing out of the liquid receiving tank, can ensure that the solution flows out from the flange overflow port and then smoothly flows into the liquid receiving tank, reduces the solution loss, thereby reducing the electroplating cost, and simultaneously can also avoid the outer surface of the workpiece to be polluted.
In one embodiment of the disclosure, the anti-splashing device comprises a first anti-splashing component and a second anti-splashing component, wherein the first anti-splashing component is arranged on the inner wall of the liquid receiving groove, and the second anti-splashing component is arranged on the outer wall of the liquid receiving groove.
Preferably, the first splash guard assembly includes a plurality of air jets;
and/or the second splash-proof assembly comprises a liquid receiving box and a hairbrush, wherein the liquid receiving box is arranged on the outer wall of the liquid receiving groove, and the hairbrush is arranged on the side wall of one side, close to the liquid receiving groove, in the liquid receiving box.
In one implementation of the present disclosure, a plurality of air nozzles may be connected to a compressed air source through a compressed air flow channel, compressed air provided by the compressed air source is ejected from the air nozzles through the air flow channel, and is ejected to the periphery of the area to be plated, to form an air curtain, which may prevent the solution from splashing to other areas outside the liquid receiving tank, thereby helping to reduce the solution loss, and keep the cleaning of other areas outside the liquid receiving tank, reducing the cleaning work of the rear operators, and improving the electroplating efficiency.
In one implementation of the present disclosure, the brush may retain the splashed solution in the liquid receiving box, prevent the solution from splashing to other areas outside the liquid receiving tank,
According to the technical scheme provided by the embodiment of the disclosure, the first splash-preventing component and the second splash-preventing component are arranged, so that protection can be provided for the non-electroplating area of the plating piece and other areas except the liquid receiving groove, the solution is effectively intercepted and collected, pollution caused by splashing of the solution is reduced, and the electroplating efficiency and quality are improved.
Fig. 5 shows a flowchart of a plating apparatus control method according to an embodiment of the present disclosure. The plating apparatus control method is used for controlling any one of the plating apparatuses according to the embodiments of the present disclosure, as shown in fig. 5, and includes the following steps S101 to S103:
In step S101, positional information of a plated item is acquired;
In step S102, when it is determined that the plating member is located above the liquid receiving tank in the electroplating device according to the position information, controlling the flow guiding moving unit in the electroplating device to move the flow guiding unit in the electroplating device, so that the flow guiding component in the flow guiding unit is inserted into the inner cavity of the plating member from the inner cavity opening of the plating member, and making the sealing flange in the flow guiding unit close the inner cavity opening;
in step S103, a circulation unit in the electroplating apparatus is controlled to move the solution from the liquid receiving tank to the diversion assembly, and to flow the solution out of the diversion assembly.
According to the technical scheme provided by the embodiment of the disclosure, the position information of the plating piece is obtained, when the plating piece is determined to be positioned above the liquid receiving groove in the electroplating device according to the position information, the flow guiding moving unit in the electroplating device is controlled to move the flow guiding unit in the electroplating device, the flow guiding assembly in the flow guiding unit is inserted into the inner cavity of the plating piece from the inner cavity opening of the plating piece, the sealing flange in the flow guiding unit is used for sealing the inner cavity opening, and the flow guiding unit in the electroplating device is controlled to move the solution from the liquid receiving groove to the flow guiding assembly and flow the solution out from the flow guiding assembly. In the above-mentioned scheme, can be more convenient make plate the piece along the horizontal direction setting to make the water conservancy diversion subassembly follow the inner chamber opening of plating the piece and insert in the inner chamber of plating the piece, use the solution in will electroplating through the water conservancy diversion subassembly in leading into the inner chamber of plating the piece, thereby can electroplate the inner chamber of plating the piece after the switch-on, the height of electroplating device in the above-mentioned scheme can not receive the influence of plating piece length, and the height of this electroplating device can be lower promptly, can not cause the restriction on the height to the factory building, thereby can realize the purpose of electroplating the inner chamber of plating the piece in the factory building voluntarily, reduce electroplating cost, and improved electroplating efficiency.
In one embodiment of the present disclosure, before acquiring the positional information of the plated item, the method further includes:
and controlling the moving device in the electroplating device to move so that the liquid receiving groove moves to the lower part of the plating piece.
According to the technical scheme provided by the embodiment of the disclosure, the liquid receiving groove is moved to the lower part of the plating piece by controlling the movement device in the electroplating device, so that the relative position of the plating piece and the liquid receiving groove can be conveniently adjusted, the subsequent electroplating process is convenient to carry out, and the user experience is improved.
The present disclosure also discloses an electronic device, and fig. 6 shows a block diagram of the electronic device according to an embodiment of the present disclosure.
As shown in fig. 6, the electronic device includes a memory and a processor, wherein the memory is configured to store one or more computer instructions, wherein the one or more computer instructions are executed by the processor to implement a method in accordance with an embodiment of the present disclosure.
Fig. 7 shows a schematic diagram of a computer system suitable for use in implementing methods according to embodiments of the present disclosure.
As shown in fig. 7, the computer system includes a processing unit that can execute the various methods in the above embodiments according to a program stored in a Read Only Memory (ROM) or a program loaded from a storage section into a Random Access Memory (RAM). In the RAM, various programs and data required for the operation of the computer system are also stored. The processing unit, ROM and RAM are connected to each other by a bus. An input/output (I/O) interface is also connected to the bus.
Connected to the I/O interface are an input section including a keyboard, a mouse, etc., an output section including an output section such as a Cathode Ray Tube (CRT), a Liquid Crystal Display (LCD), etc., and a speaker, etc., a storage section including a hard disk, etc., and a communication section including a network interface card such as a LAN card, a modem, etc. The communication section performs a communication process via a network such as the internet. The drives are also connected to the I/O interfaces as needed. Removable media such as magnetic disks, optical disks, magneto-optical disks, semiconductor memories, and the like are mounted on the drive as needed so that a computer program read therefrom is mounted into the storage section as needed. Wherein, the processing unit may be implemented as a processing unit such as CPU, GPU, TPU, FPGA, NPU.
In particular, according to embodiments of the present disclosure, the methods described above may be implemented as computer software programs. For example, embodiments of the present disclosure include a computer program product comprising a computer program tangibly embodied on a machine-readable medium, the computer program comprising program code for performing the method described above. In such embodiments, the computer program may be downloaded and installed from a network via a communication portion, and/or installed from a removable medium.
The flowcharts and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various embodiments of the present disclosure. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
The units or modules referred to in the embodiments of the present disclosure may be implemented in software or in programmable hardware. The units or modules described may also be provided in a processor, the names of which in some cases do not constitute a limitation of the unit or module itself.
As another aspect, the present disclosure also provides a computer-readable storage medium, which may be a computer-readable storage medium included in the electronic device or the computer system in the above-described embodiment, or may be a computer-readable storage medium that exists alone and is not assembled into the device. The computer-readable storage medium stores one or more programs for use by one or more processors in performing the methods described in the present disclosure.
The foregoing description is only of the preferred embodiments of the present disclosure and description of the principles of the technology being employed. It will be appreciated by those skilled in the art that the scope of the invention referred to in this disclosure is not limited to the specific combination of features described above, but encompasses other embodiments in which any combination of features described above or their equivalents is contemplated without departing from the inventive concepts described. Such as those described above, are mutually substituted with the technical features having similar functions disclosed in the present disclosure (but not limited thereto).
Claims (15)
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1064901A (en) * | 1992-01-28 | 1992-09-30 | 胜利石油管理局总机械厂 | Deep-hole sizing chromate plating device and processing method |
| CN220265902U (en) * | 2023-07-13 | 2023-12-29 | 北京种树科技有限公司 | Electroplating device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4931150A (en) * | 1988-03-28 | 1990-06-05 | Sifco Industries, Inc. | Selective electroplating apparatus and method of using same |
| JP6193005B2 (en) * | 2013-06-14 | 2017-09-06 | Ｋｙｂ株式会社 | Holding device and high-speed plating apparatus provided with the same |
| CN105200478B (en) * | 2015-10-10 | 2018-05-01 | 中联西北工程设计研究院有限公司 | Electroplate continuous producing apparatus in a kind of inner cavity |
| US20170241035A1 (en) * | 2016-02-23 | 2017-08-24 | Sanoh America, Inc. | Method and apparatus for electroplating |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1064901A (en) * | 1992-01-28 | 1992-09-30 | 胜利石油管理局总机械厂 | Deep-hole sizing chromate plating device and processing method |
| CN220265902U (en) * | 2023-07-13 | 2023-12-29 | 北京种树科技有限公司 | Electroplating device |
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