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CN116576907A - MCU chip for agricultural soil moisture content monitoring and data analysis method - Google Patents

MCU chip for agricultural soil moisture content monitoring and data analysis method Download PDF

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CN116576907A
CN116576907A CN202310338409.3A CN202310338409A CN116576907A CN 116576907 A CN116576907 A CN 116576907A CN 202310338409 A CN202310338409 A CN 202310338409A CN 116576907 A CN116576907 A CN 116576907A
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CN116576907B (en
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袁名勇
张升荣
符坚
朱宇鹏
冯浩
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China Electronics Technology Guohai Xintong Technology Hainan Co ltd
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China Electronics Technology Guohai Xintong Technology Hainan Co ltd
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    • G06QINFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
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    • G01MEASURING; TESTING
    • G01DMEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
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    • G01D21/02Measuring two or more variables by means not covered by a single other subclass

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Abstract

The invention discloses an MCU chip for monitoring agricultural soil moisture content and a data analysis method, which relate to the technical field of sensor chip data processing and comprise a chip basic module and a functional module, wherein the chip basic module comprises a chip CORE, a PMU unit, a FLASH storage module, a reset generation module, a clock generation module and a chip configuration module; the PMU unit, the FLASH memory module, the reset generation module, the clock generation module and the chip configuration module are respectively in communication connection with the chip CORE; the invention integrates the functional units of various sensors in the chip, thereby greatly reducing the complexity of configuring an external circuit; after the functions of the sensors are unified, various soil indexes can be detected simultaneously; by utilizing the accurate data screening method, the acquired large amount of data is accurately refined, so that each acquired index data is separated, and the high integration of various sensors is further realized.

Description

MCU chip for agricultural soil moisture content monitoring and data analysis method
Technical Field
The invention relates to the technical field of sensor chip data processing, in particular to an MCU chip for agricultural soil moisture content monitoring and a data analysis method.
Background
The soil moisture content monitoring system can realize long-time continuous monitoring of the soil moisture content. The user can flexibly arrange the soil moisture sensor according to the monitoring requirement; the sensors can also be arranged at different depths to measure profile soil moisture conditions. The system also provides additional expansion capability, and corresponding sensors can be added according to monitoring requirements to monitor the information such as soil temperature, soil conductivity, soil PH value, groundwater level, groundwater quality, air temperature, air humidity, illumination intensity, wind speed, wind direction, rainfall and the like, so that the requirement of system function upgrading is met.
The traditional soil moisture content monitoring system architecture needs to use various sensors at a terminal, such as a soil moisture sensor, a soil PH value sensor and the like, and also needs to be provided with a wired or wireless communication device, a data collector is required to be arranged for collecting a plurality of groups of monitored data, then an MCU chip is required to analyze the collected multipath data, finally data are recorded and data analysis results are displayed through a display.
Therefore, the hardware architecture required by the traditional soil moisture content monitoring system needs to use more electric devices, and various electric devices are connected with each other in a complicated way and have large power consumption, so that the technical problem of how to integrate the functions of part of the electric devices in the soil moisture content monitoring system into the MCU chip, reduce the system erection workload and reduce the system hardware cost is needed to be solved.
Disclosure of Invention
In order to solve the problem of the integration level of the MCU chip for monitoring the soil moisture content of the agriculture, the invention provides the MCU chip for monitoring the soil moisture content of the agriculture and a data analysis method. The following technical scheme is adopted:
MCU chip for agricultural soil moisture content monitoring, its characterized in that: the chip basic module comprises a chip CORE, a PMU unit, a FLASH storage module, a reset generation module, a clock generation module and a chip configuration module;
the PMU unit, the FLASH memory module, the reset generation module, the clock generation module and the chip configuration module are respectively in communication connection with the chip CORE;
the functional module comprises a general purpose GPIO unit, a signal processing unit and a sensor data preprocessing unit;
the GPIO unit is in communication connection with the sensor data preprocessing unit through the signal processing unit, and the sensor data preprocessing unit is in communication connection with the chip CORE;
the GPIO unit is used for accessing different soil monitoring sensors, and the signal processing unit is used for amplifying weak analog current signals of the sensors, filtering and converting the signals into voltage signals;
the sensor data preprocessing unit is used for preprocessing soil monitoring data.
By adopting the technical scheme, the chip CORE is used for calculating and processing the data acquired by the sensor according to a pre-stored program;
the PMU unit is responsible for supplying power to each component in the chip, namely the power management unit, is a highly integrated power management scheme for specific application, integrates a plurality of traditional separated power management devices such as a direct current/direct current converter (DC/DC) and a low dropout linear voltage regulator (LDO) into one package, reduces the number of components and the space of a board level, realizes higher power conversion efficiency, and has lower power consumption;
the FLASH storage module is used for storing data generated in each link;
the reset generation module is used for resetting the built-in system and hardware of the chip, and generally supports three reset modes:
1. a power reset, which occurs when one of the following events occurs: power-on/power-off reset vddd_por (POR/PDR reset); returning from PD power down mode; a power reset will reset all registers. The RESET source will eventually act on the RESET pin and remain low during the RESET process. The reset entry vector is fixed at address 0x0000_0004;
2. system reset, except some specific registers in RCC and vddd_aon power domains (PWR/RTC/RCC/AFIO/AFEC), will reset, all registers to their reset state, all drivers and communication protocols will restore to factory state;
3. resetting power consumption; all power consumption controls configured by the PMU unit are reset;
the clock generation module consists of an HSE module, an LSE module, an HSI module and an LSI module;
HSE:32MHz external high-speed crystal
LSE:32.768KHz external low speed crystal
HSI: internal high speed RC64MHz
LSI: internal low speed RC32KHz
Supporting 1-path clock output, being configurable as different clocks, and outputting after frequency division;
the chip configuration module is used for realizing modification, deletion and other operations of the built-in system program and the application program;
the function module, the general purpose GPIO unit is provided with a plurality of pins for directly butting various sensors to realize acquisition of sensor data;
the sensor data preprocessing unit is used for performing unified data signal processing on acquired sensor data, then performing screening processing, and performing advanced work on the data processing on the chip CORE, so that the operation load of the chip CORE is greatly reduced, acquisition and processing of multiple paths of different sensor data can be realized, the functional units of multiple sensors are highly integrated in the chip, and the complexity of configuring an external circuit is greatly reduced.
Optionally, the functional module further includes an ADC unit, an input end of the ADC unit is in communication with the GPIO unit, and an output end of the ADC unit is in communication connection with the sensor data preprocessing unit, and the ADC unit is configured to convert an analog quantity into a digital quantity.
Optionally, the ADC unit is a 14-bit single chip ADC.
By adopting the technical scheme, the 14-bit ADC unit is a high-speed successive approximation type analog-to-digital converter. There are up to 8 lanes, 5 external single ended, 1 differential MIC and 2 internal lanes. The A/D conversion of each channel can be performed in a single, continuous mode, and multiple paths of A/D conversion can be realized efficiently.
Optionally, the functional module further includes a wireless communication unit 64, where the wireless communication unit 64 is configured to interface with a wireless sensor, and an output end is communicatively connected to the ADC unit.
Optionally, the wireless communication unit 64 is a bluetooth unit.
By adopting the technical scheme, the Bluetooth unit can realize wireless connection with the sensor with the wireless transmitting function.
Optionally, the sensor data preprocessing unit includes soil temperature detecting element, soil humidity detecting element, soil PH value detecting element, soil salinity detecting element and soil nitrogen phosphorus potassium detecting element, the input of soil temperature detecting element, soil humidity detecting element, soil PH value detecting element, soil salinity detecting element and soil nitrogen phosphorus potassium detecting element respectively with the digital output communication connection of ADC unit, the data after soil temperature detecting element, soil humidity detecting element, soil PH value detecting element, soil salinity detecting element and soil nitrogen phosphorus potassium detecting element handle is with chip kernel CORE communication connection.
By adopting the technical scheme, the sensors used for soil monitoring basically comprise temperature, humidity, PH value, research and reading, nitrogen, phosphorus, potassium and the like, the detection units are respectively preprocessed for integrated acquisition data, the data processing can be finished for the CORE of the chip, the advance work can be finished, the operation load of the CORE of the chip is greatly reduced, the acquisition and the processing of the data of multiple different sensors can be realized, the functional units of the multiple sensors are highly integrated in the chip, and the complexity of configuring an external circuit is greatly reduced.
Optionally, the MCU chip further comprises a switching value IO module, wherein an input end of the switching value IO module is in communication connection with the GPIO unit, and an output end of the switching value IO module is in communication connection with the CORE of the chip.
By adopting the technical scheme, the switching value IO module can be also connected with switching value sensors such as photoelectric switches used in some soil monitoring fields, and the direct access of switching value signals is realized.
Optionally, the MCU chip further includes a display driving unit, and the display driving unit is connected to the CORE of the chip in a communication manner.
By adopting the technical scheme, the display driving unit is integrated into the MCU chip, and only the display screen is required to be connected in subsequent display screen equipment.
The data analysis method of the MCU chip comprises the following specific steps:
step 1, the analog quantity of a sensor is accessed to a signal processing unit through a GPIO unit, and is transmitted to an ADC unit after signal amplification and filtering, and the ADC unit converts the analog quantity into an AD value;
step 2, the sensor data preprocessing unit converts the AD value into a voltage value;
step 3, the sensor data preprocessing unit continuously collects and converts 1000 groups of voltage data;
step 4, respectively and sequentially carrying out an IIR filtering algorithm, a Kalman filtering algorithm and a sliding average value filtering algorithm on 1000 groups of voltage data;
step 5, obtaining a voltage average value by the data set operation average value filtering algorithm obtained in the step 4 and transmitting the voltage average value to a chip CORE;
step 6, the chip CORE converts the voltage average value into sensor data according to a corresponding sensor voltage value conversion formula;
and 7, driving and displaying the monitoring value of the peripheral display sensor by the chip CORE through the display driving unit according to the sensor data.
Alternatively, in step 2, the conversion of the AD value into a voltage value is achieved using the formula v=ad×2.5 ≡16777216.
Through the technical scheme, after the functions of the sensors are unified, various soil indexes can be detected simultaneously, an accurate data screening method is utilized, a great amount of collected data is accurately refined, the collected index data are separated, and further high integration of various sensors is realized.
In summary, the present invention includes at least one of the following beneficial technical effects:
the invention can provide the MCU chip for monitoring the soil moisture content of agriculture and the data analysis method, and the functional units of various sensors are highly integrated in the chip, so that the complexity of configuring an external circuit is greatly reduced; after the functions of the sensors are unified, various soil indexes can be detected simultaneously; by utilizing the accurate data screening method, the acquired large amount of data is accurately refined, so that each acquired index data is separated, and the high integration of various sensors is further realized.
Drawings
FIG. 1 is a schematic diagram of hardware connection of an MCU chip for agricultural soil moisture monitoring;
FIG. 2 is a schematic connection diagram of an MCU chip functional module for agricultural soil moisture content monitoring and a chip CORE;
fig. 3 is a flow chart of a data analysis method of the MCU chip of the present invention.
Reference numerals illustrate: 1. a chip CORE; 2. a PMU unit; 3. a FLASH storage module; 4. a clock generation module; 5. a chip configuration module; 6. a functional module; 61. a general purpose GPIO unit; 62. a sensor data preprocessing unit; 621. a soil temperature detecting unit; 622. a soil humidity detection unit; 623. a soil pH value detection unit; 624. a soil salinity detection unit; 625. a soil nitrogen, phosphorus and potassium detection unit; 63. an ADC unit; 64. a wireless communication unit; 65. a signal processing unit; 7. a switching value IO module; 8. a display driving unit; 9. and resetting the generating module.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
The embodiment of the invention discloses an MCU chip for monitoring agricultural soil moisture content and a data analysis method.
Referring to fig. 1 to 3, an MCU chip for monitoring soil moisture content of agricultural soil is characterized in that: the chip comprises a chip basic module and a functional module 6, wherein the chip basic module comprises a chip CORE1, a PMU unit 2, a FLASH storage module 3, a reset generation module 9, a clock generation module 4 and a chip configuration module 5;
the PMU unit 2, the FLASH memory module 3, the reset generation module 9, the clock generation module 4 and the chip configuration module 5 are respectively in communication connection with the chip CORE1;
the functional module 6 includes a general purpose GPIO unit 61, a signal processing unit 65, and a sensor data preprocessing unit 62;
the GPIO unit 61 is in communication connection with the sensor data preprocessing unit 62 through the signal processing unit 65, and the sensor data preprocessing unit 62 is in communication connection with the chip CORE1;
the GPIO unit 61 is used for accessing different soil monitoring sensors, and the signal processing unit 65 is used for amplifying weak analog current signals of the sensors, filtering and converting the signals into voltage signals;
the sensor data preprocessing unit 62 is used for preprocessing soil monitoring data.
The chip CORE1 is used for calculating and processing the data acquired by the sensor according to a pre-stored program; powermanager unit, i.e. a power management unit, is a highly integrated power management scheme for specific applications, and integrates a plurality of types of traditional separated power management devices, such as a direct current/direct current converter (DC/DC) and a low dropout linear regulator (LDO), into one package, so that the number of components and the space at the board level are reduced, and meanwhile, higher power conversion efficiency is realized, and the power consumption is lower;
the FLASH memory module 3 is used for storing data generated in each link;
the reset generation module 9 is used for resetting the system and hardware in the chip, and the reset generation module 3 generally supports three reset modes:
1. a power reset, which occurs when one of the following events occurs: power-on/power-off reset vddd_por (POR/PDR reset); returning from PD power down mode; a power reset will reset all registers. The RESET source will eventually act on the RESET pin and remain low during the RESET process. The reset entry vector is fixed at address 0x0000_0004;
2. system reset, except some specific registers in RCC and vddd_aon power domains (PWR/RTC/RCC/AFIO/AFEC), will reset, all registers to their reset state, all drivers and communication protocols will restore to factory state;
3. resetting power consumption; all power consumption controls configured by the PMU unit 2 are reset;
the clock generation module 4 is composed of an HSE module, an LSE module, an HSI module, and an LSI module;
HSE:32MHz external high-speed crystal
LSE:32.768KHz external low speed crystal
HSI: internal high speed RC64MHz
LSI: internal low speed RC32KHz
Supporting 1-path clock output, being configurable as different clocks, and outputting after frequency division;
the chip configuration module 5 is used for realizing modification, deletion and other operations of the built-in system program and the application program;
the function module 6 and the general purpose GPIO unit 61 are provided with multiple paths of pins for directly docking various sensors to realize acquisition of sensor data;
the sensor data preprocessing unit 62 performs unified data signal processing on the acquired sensor data, then performs screening processing, performs advanced work on the final data processing of the chip CORE1, greatly reduces the operation load of the chip CORE1, can acquire and process multiple paths of different sensor data, integrates the functional units of multiple sensors in the chip, and greatly reduces the complexity of configuring an external circuit.
The functional module 6 further comprises an ADC unit 63, an input of the ADC unit 63 is in communication with the GPIO unit 61, an output is in communication with the sensor data preprocessing unit 62, and the ADC unit 63 is configured to convert an analog quantity into a digital quantity.
The ADC unit 63 is a 14-bit single chip ADC.
The 14bit ADC unit 63 is a high-speed successive approximation analog-to-digital converter. There are up to 8 lanes, 5 external single ended, 1 differential MIC and 2 internal lanes. The A/D conversion of each channel can be performed in a single, continuous mode, and multiple paths of A/D conversion can be realized efficiently.
The functional module 6 further comprises a wireless communication unit 64, wherein the wireless communication unit 64 is used for interfacing with a wireless sensor, and an output end of the wireless communication unit 64 is in communication connection with the ADC unit 63.
The wireless communication unit 64 is a bluetooth unit.
The Bluetooth unit can realize wireless connection with a sensor with a wireless transmitting function.
The sensor data preprocessing unit 62 includes a soil temperature detecting unit 621, a soil humidity detecting unit 622, a soil PH detecting unit 623, a soil salinity detecting unit 624, and a soil nitrogen phosphorus potassium detecting unit 625, and input ends of the soil temperature detecting unit 621, the soil humidity detecting unit 622, the soil PH detecting unit 623, the soil salinity detecting unit 624, and the soil nitrogen phosphorus potassium detecting unit 625 are respectively in communication connection with digital output ends of the ADC unit 63, and data processed by the soil temperature detecting unit 621, the soil humidity detecting unit 622, the soil PH detecting unit 623, the soil salinity detecting unit 624, and the soil nitrogen phosphorus potassium detecting unit 625 are in communication connection with the chip CORE 1.
The sensors used for soil monitoring basically comprise temperature, humidity, PH value, grinding, nitrogen, phosphorus, potassium and the like, the detection units are respectively preprocessed for integrated acquisition data, the data processing of the chip CORE1 can be finished, the operation load of the chip CORE1 is greatly reduced, the acquisition and the processing of multiple paths of different sensor data can be realized, the functional units of the multiple sensors are highly integrated in the chip, and the complexity of configuring an external circuit is greatly reduced.
The MCU chip further comprises a switching value IO module 7, wherein the input end of the switching value IO module 7 is in communication connection with the GPIO unit 61, and the output end of the switching value IO module 7 is in communication connection with the chip CORE 1.
The switching value IO module 7 can be also connected with switching value sensors such as photoelectric switches used in the soil monitoring field, and the direct access of switching value signals is realized.
The MCU chip also comprises a display driving unit 8, and the display driving unit 8 is in communication connection with the chip CORE 1.
The display driving unit 8 is integrated into the MCU chip, and only the display screen needs to be connected in the subsequent display screen configuration.
The data analysis method of the MCU chip comprises the following specific steps:
step 1, the analog quantity of the sensor is accessed to a signal processing unit 65 through a GPIO unit 61, and is transmitted to an ADC unit 63 after signal amplification and filtering, and the ADC unit 63 converts the analog quantity into an AD value;
step 2, the sensor data preprocessing unit 62 converts the AD value into a voltage value;
step 3, the sensor data preprocessing unit 62 continuously collects and converts 1000 sets of voltage data;
step 4, respectively and sequentially carrying out an IIR filtering algorithm, a Kalman filtering algorithm and a sliding average value filtering algorithm on 1000 groups of voltage data;
step 5, obtaining a voltage average value by the data set operation average value filtering algorithm obtained in the step 4 and transmitting the voltage average value to a chip CORE1;
step 6, the chip CORE1 converts the voltage average value into sensor data according to a corresponding sensor voltage value conversion formula;
and 7, driving the display peripheral display sensor to monitor the numerical value by the chip CORE1 through the display driving unit 8 according to the sensor data.
In step 2, the conversion of the AD value into a voltage value is achieved using the formula v=ad×2.5++16777216.
After unifying the sensor functions, the sensor can detect various soil indexes simultaneously and utilize an accurate data screening method to accurately refine a large amount of collected data, so that all collected index data are separated, and further, the high integration of various sensors is realized.
The MCU chip for monitoring the soil moisture content of the agricultural soil and the data analysis method are implemented according to the following principles:
under a specific soil monitoring application scene, the monitoring target is the soil condition of the strawberry planting greenhouse, and the specifically used sensors comprise a temperature sensor, a soil humidity sensor, a PH value sensor, a nitrogen, phosphorus and potassium sensor and a photoelectric sensor, so that the soil temperature value, the humidity value, the PH value, the nitrogen, phosphorus and potassium value and whether the soil is intruded or not are respectively monitored.
The temperature sensor, the soil humidity sensor, the PH value sensor, the nitrogen-phosphorus-potassium sensor and the photoelectric sensor are respectively connected to the chip through the Bluetooth unit, wherein analog quantities measured by the temperature sensor, the soil humidity sensor, the PH value sensor and the nitrogen-phosphorus-potassium sensor are connected to the ADC unit 63 through the Bluetooth unit, and the ADC unit 63 converts the analog quantities into AD values; the sensor data preprocessing unit 62 converts the AD value into a voltage value; the sensor data preprocessing unit 62 continuously collects and converts 1000 sets of voltage data; respectively and sequentially carrying out an IIR filtering algorithm, a Kalman filtering algorithm and a sliding average value filtering algorithm on 1000 groups of voltage data; obtaining a voltage average value by the data set operation average value filtering algorithm obtained in the step 4 and transmitting the voltage average value to a chip CORE1; the chip CORE1 converts the voltage average value into sensor data according to a corresponding sensor voltage value conversion formula; the chip CORE1 drives the display peripheral display sensor to monitor the numerical value through the display driving unit 8 according to the sensor data.
When the photoelectric sensor is blocked, a switching value signal is sent out, the switching value signal is converted by the switching value IO module 7 and then is transmitted to the chip CORE1, and the chip CORE1 controls an external alarm to carry out alarm operation according to a set program, so that the sensor integration with multiple functions is realized.
The above embodiments are not intended to limit the scope of the present invention, and therefore: all equivalent changes in structure, shape and principle of the invention should be covered in the scope of protection of the invention.

Claims (10)

1. MCU chip for agricultural soil moisture content monitoring, its characterized in that: the chip comprises a chip basic module and a functional module (6), wherein the chip basic module comprises a chip CORE (1), a PMU unit (2), a FLASH storage module (3), a reset generation module (9), a clock generation module (4) and a chip configuration module (5);
the PMU unit (2), the FLASH memory module (3), the reset generation module (9), the clock generation module (4) and the chip configuration module (5) are respectively in communication connection with the chip CORE (1);
the functional module (6) comprises a general purpose GPIO unit (61), a signal processing unit (65) and a sensor data preprocessing unit (62);
the GPIO unit (61) is in communication connection with the sensor data preprocessing unit (62) through the signal processing unit 65, and the sensor data preprocessing unit (62) is in communication connection with the chip CORE (1);
the GPIO unit (61) is used for accessing different soil monitoring sensors, and the signal processing unit (65) is used for amplifying weak analog current signals of the sensors, filtering and converting the weak analog current signals into voltage signals;
the sensor data preprocessing unit (62) is used for preprocessing soil monitoring data.
2. The MCU chip for agricultural soil moisture monitoring according to claim 1, wherein: the functional module (6) further comprises an ADC unit (63), wherein the input end of the ADC unit (63) is in communication connection with the signal output end of the signal processing unit (65), the output end of the ADC unit is in communication connection with the sensor data preprocessing unit (62), and the ADC unit (63) is used for converting analog quantity into digital quantity.
3. The MCU chip for agricultural soil moisture monitoring according to claim 2, wherein: the ADC unit (63) is a 14-bit single chip ADC.
4. The MCU chip for agricultural soil moisture monitoring according to claim 2, wherein: the functional module (6) further comprises a wireless communication unit (64), wherein the wireless communication unit (64) is used for docking the wireless sensor, and the output end of the wireless communication unit is in communication connection with the ADC unit (63).
5. The MCU chip for monitoring the soil moisture content of agriculture according to claim 4, wherein: the wireless communication unit (64) is a bluetooth unit.
6. The MCU chip for monitoring the soil moisture content of agriculture according to claim 4, wherein: the sensor data preprocessing unit (62) comprises a soil temperature detection unit (621), a soil humidity detection unit (622), a soil PH value detection unit (623), a soil salinity detection unit (624) and a soil nitrogen, phosphorus and potassium detection unit (625), wherein the input ends of the soil temperature detection unit (621), the soil humidity detection unit (622), the soil PH value detection unit (623), the soil salinity detection unit (624) and the soil nitrogen, phosphorus and potassium detection unit (625) are respectively in communication connection with the digital output end of the ADC unit (63), and the data processed by the soil temperature detection unit (621), the soil humidity detection unit (622), the soil PH value detection unit (623), the soil salinity detection unit (624) and the soil nitrogen, phosphorus and potassium detection unit (625) are in communication connection with the chip CORE (1).
7. The MCU chip for monitoring soil moisture content of agriculture according to claim 6, wherein: the MCU chip further comprises a switching value IO module (7), wherein the input end of the switching value IO module (7) is in communication connection with the GPIO unit (61), and the output end of the switching value IO module is in communication connection with the chip CORE (1).
8. The MCU chip for monitoring soil moisture content of agriculture according to claim 7, wherein: the MCU chip also comprises a display driving unit (8), and the display driving unit (8) is in communication connection with the chip CORE (1).
The data analysis method of the MCU chip is characterized by comprising the following steps of: the MCU chip for monitoring the soil moisture content of the agriculture is used for collecting and analyzing sensor data, and the specific method is as follows:
step 1, the analog quantity of a sensor is accessed to a signal processing unit (65) through a GPIO unit (61), and is transmitted to an ADC unit (63) after signal amplification and filtering, and the ADC unit (63) converts the analog quantity into an AD value;
step 2, a sensor data preprocessing unit (62) converts the AD value into a voltage value;
step 3, a sensor data preprocessing unit (62) continuously collects and converts 1000 groups of voltage data;
step 4, respectively and sequentially carrying out an IIR filtering algorithm, a Kalman filtering algorithm and a sliding average value filtering algorithm on 1000 groups of voltage data;
step 5, the data set operation average filtering algorithm obtained in the step 4 is used for obtaining a voltage average value and transmitting the voltage average value to a chip CORE (1);
step 6, the chip CORE (1) converts the voltage average value into sensor data according to a corresponding sensor voltage value conversion formula;
and 7, driving the display peripheral display sensor to monitor the numerical value by the chip CORE (1) through the display driving unit (8) according to the sensor data.
10. The data analysis method of the MCU chip according to claim 9, wherein: in step 2, the conversion of the AD value into a voltage value is achieved using the formula v=ad×2.5++16777216.
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