CN116520810A - Thermal test method, device, system, equipment and medium of gateway controller - Google Patents

Abstract

The invention discloses a thermal testing method, device, system, equipment and medium of a gateway controller. The method includes: acquiring at least one target heat source included in the gateway controller to be thermally tested and a thermally sensitive area respectively matched with each target heat source; According to the location of the port and at least one preset thermocouple wiring rule, a thermocouple wiring method is generated for the user to configure thermocouples on each target heat source in the gateway controller according to the thermocouple wiring method to obtain the target gateway controller; Obtain the real-time position information of the baffle after the target gateway controller is placed in the baffle of the incubator, set the direction of the high-temperature fan according to the real-time position information of the baffle, and start the incubator to conduct a thermal test on the target gateway controller . By adopting the above technical solution, measurement errors caused by external factors can be reduced, and thermal test accuracy can be effectively improved.

Description

A thermal testing method, device, system, equipment and medium for a gateway controller

technical field

The invention relates to the technical field of thermal testing, in particular to a thermal testing method, device, system, equipment and medium of a gateway controller.

Background technique

The vehicle gateway controller is generally equipped with multiple electronic components that generate large amounts of heat, such as power supply chips, main control SoC (System on Chip) chips, and Ethernet PHY (Port Physical Layer, port physical layer) chips. In the early product development stage, although the vehicle gateway controller has been simulated and thermally simulated by software, after the PCB (Printed Circuit Board, printed circuit board) board is made, the actual thermal test of the vehicle gateway controller is still required , to obtain its real heat generation state, and to verify the previous design and simulation.

In the process of thermal testing the gateway controller, it is necessary to place the gateway controller in a pre-built test environment, and use thermocouples to detect the heat of each electronic component that generates heat. Both configurations may introduce measurement errors to the thermal test of the gateway controller, resulting in test results that do not reflect the actual heating conditions.

Contents of the invention

The invention provides a thermal testing method, device, system, equipment and medium of a gateway controller, which can reduce measurement errors caused by external factors and effectively improve thermal testing accuracy.

According to an aspect of the present invention, a thermal testing method of a gateway controller is provided, comprising:

Acquiring at least one target heat source included in the gateway controller to be thermally tested and a heat sensitive area respectively matched with each target heat source;

According to each target heat source, each heat-sensitive area, the location of the outlet of the gateway controller, and at least one preset thermocouple wiring rule, a thermocouple wiring method is generated for the user to use in each gateway controller according to the thermocouple wiring method. Configure thermocouples on the target heat source respectively to obtain the target gateway controller;

Obtain the real-time position information of the baffle after the target gateway controller is placed in the baffle of the incubator, set the direction of the high-temperature fan according to the real-time position information of the baffle, and start the thermostat after the orientation of the high-temperature fan is set. box to thermally test the target gateway controller.

According to another aspect of the present invention, a thermal testing device for a gateway controller is provided, including:

A heat generation information acquisition module, configured to obtain at least one target heat source included in the gateway controller to be thermally tested and a heat sensitive area that matches each target heat source;

The target gateway controller acquisition module is used to generate a thermocouple wiring method according to each target heat source, each heat-sensitive area, the location of the outlet of the gateway controller, and at least one preset thermocouple wiring rule, so that the user can follow the thermoelectric In the dual wiring mode, thermocouples are respectively arranged on each target heat source in the gateway controller to obtain the target gateway controller;

The thermal test module is used to obtain the real-time position information of the air shield after the target gateway controller is placed in the air shield of the incubator, and set the orientation of the high-temperature fan according to the real-time position information of the air shield. After setup is complete, start the thermostat to thermal test the target gateway controller.

According to another aspect of the present invention, a thermal testing system for a gateway controller is provided, including a central controller, a printed circuit board, and a thermostat; wherein,

The central controller is used to execute the thermal testing method of the gateway controller described in any embodiment of the present invention;

The printed circuit board is used to provide a configuration environment for the gateway controller and the thermocouple;

The incubator is used to take images of the cowling and to provide a thermal test environment to the gateway controller.

According to another aspect of the present invention, an electronic device is provided, and the electronic device includes:

at least one processor; and

a memory communicatively coupled to the at least one processor; wherein,

The memory stores a computer program that can be executed by the at least one processor, and the computer program is executed by the at least one processor, so that the at least one processor can execute the method described in any embodiment of the present invention. Thermal testing method for gateway controllers.

According to another aspect of the present invention, a computer-readable storage medium is provided, the computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement any of the embodiments of the present invention when executed. Thermal testing method for gateway controllers.

By obtaining the target heat source and heat-sensitive area, the thermocouple wiring method is automatically generated, and the direction of the high-temperature fan is set according to the direction of the outlet of the shroud, which can largely avoid thermal test measurement caused by external factors. Error, improve the accuracy of thermal testing, and can effectively save labor costs.

It should be understood that the content described in this section is not intended to identify key or important features of the embodiments of the present invention, nor is it intended to limit the scope of the present invention. Other features of the present invention will be easily understood from the following description.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those skilled in the art, other drawings can also be obtained based on these drawings without creative effort.

FIG. 1 is a flow chart of a thermal testing method for a gateway controller according to Embodiment 1 of the present invention;

Fig. 2 is a schematic diagram of a thermocouple wiring method provided according to an embodiment of the present invention;

Fig. 3 is a thermocouple pressing effect diagram provided according to an embodiment of the present invention;

FIG. 4 is a flow chart of another thermal testing method for a gateway controller according to Embodiment 2 of the present invention;

Fig. 5 is a schematic diagram of setting the direction of a fan outlet according to an embodiment of the present invention;

FIG. 6 is a schematic structural diagram of a thermal testing device for a gateway controller according to Embodiment 3 of the present invention;

FIG. 7 is a schematic structural diagram of a thermal testing system for a gateway controller according to Embodiment 4 of the present invention;

Fig. 8 is a schematic structural diagram of an electronic device implementing a thermal testing method for a gateway controller according to an embodiment of the present invention.

Detailed ways

In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only It is an embodiment of a part of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

It should be noted that the terms "first" and "second" in the description and claims of the present invention and the above drawings are used to distinguish similar objects, but not necessarily used to describe a specific sequence or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances such that the embodiments of the invention described herein can be practiced in sequences other than those illustrated or described herein. Furthermore, the terms "comprising" and "having", as well as any variations thereof, are intended to cover a non-exclusive inclusion, for example, a process, method, system, product or device comprising a sequence of steps or elements is not necessarily limited to the expressly listed instead, may include other steps or elements not explicitly listed or inherent to the process, method, product or apparatus.

Embodiment one

Figure 1 is a flow chart of a thermal testing method for a gateway controller provided by Embodiment 1 of the present invention. This embodiment can be applied to automatically generate a better thermocouple wiring method and adaptively adjust the high-temperature fan in the incubator To reduce the measurement error of the thermal test, the method can be executed by the thermal test device of the gateway controller, the thermal test device of the gateway controller can be implemented in the form of hardware and/or software, the gateway controller The thermal testing device can have data processing function, and generally can be configured in the thermal testing system of the gateway controller. As shown in Figure 1, the method includes:

S110. Obtain at least one target heat source included in the gateway controller to be thermally tested and a heat sensitive area respectively matched with each target heat source.

Optionally, the gateway controller can be composed of multiple electronic components, and the electronic components can include various chips, for example, a power supply chip, a main control SoC chip, an Ethernet PHY chip, an Ethernet Switch chip, a PMIC (PowerManagement IC , power management integrated circuit) chips and DDR (Double Data Rate, double data rate) chips, etc.

Optionally, the gateway controller can be configured on the printed circuit board. If the thermal test of the gateway controller is to be performed, the thermocouple used to detect heat can also be configured on the printed circuit board, so that each heating electronic Components are tested for heat.

Optionally, the target heat source may refer to electronic components whose heating temperature exceeds a certain threshold under the set working condition, and the set working condition may include the temperature, for example, when the working environment is 85°C, the Electronic components can be used as target heat sources. The temperature rise range of each electronic component under the set working condition can be calculated according to the specification parameters of each electronic component.

Optionally, the thermally sensitive area can be determined according to the temperature rise range of each target heat source, for example, for a target heat source with a temperature of 95°C under the set working condition, the temperature rise range can be 1 mm around the target heat source , then the heat-sensitive area of the target heat source can be set within a range of 1mm around it, and for example, for a target heat source with a temperature of 100°C under the set working condition, its temperature rise range can be the target If the heat source is within a range of 2 mm around it, then the heat-sensitive area of the target heat source can be set within a range of 2 mm around it. The above example is only for better understanding of the present invention, and does not limit the range of temperature rise of the target heat source at each temperature, nor does it limit the specific method of obtaining the heat-sensitive area.

Optionally, if you want to obtain the target heat sources and the heat-sensitive areas that match each target heat source, you can first obtain a gateway controller built on a virtual platform. The gateway controller built on the virtual platform can be compared with the The gateway controller configured on the printed circuit board has the same configuration structure. It can also be understood that the gateway controller built on the virtual platform and the actual gateway controller to be tested are structurally one-to-one, and in the virtual platform Specification parameters matching each component of the gateway controller can be stored. Then, according to the specifications and parameters of each electronic component of the gateway controller in the virtual platform and the set working conditions of the thermal test, the heating temperature of each electronic component under the set working condition can be calculated. For the heating temperature greater than the set temperature Threshold electronic components can be used as target heat sources. Further, according to the temperature of each target heat source, each heat-sensitive area can be delineated in the gateway controller of the virtual platform.

S120. According to each target heat source, each heat-sensitive area, the location of the outlet of the gateway controller, and at least one preset thermocouple wiring rule, generate a thermocouple wiring method for the user to use in the gateway controller according to the thermocouple wiring method The thermocouples are respectively arranged on each target heat source in , and the target gateway controller is obtained.

It is understandable that the temperature of electronic components in the thermally sensitive area will rise to a certain extent. Therefore, when arranging thermocouples, it is necessary to avoid large areas of thermocouple probes and connecting wires passing through the thermally sensitive area. Areas across thermally sensitive areas can cause heat loss through the thermocouple wires, reducing the measurement accuracy of thermal tests.

The present invention considers that due to the large number of electronic components on the printed circuit board, technicians often arrange thermocouples based on experience, which may lead to heat loss from the target heat source due to poor placement of thermocouple connecting wires. Therefore, the present invention creatively proposes to automatically generate a thermocouple wiring method for users to arrange thermocouple connecting wires according to the thermocouple wiring method, so as to minimize the influence of thermocouple connecting wires on thermal testing.

Optionally, the outlet of the gateway controller can be the outlet where each thermocouple connecting wire passes through the printed circuit board, and the outlet of the gateway controller can generally be configured on the edge of the gateway controller on the printed circuit board.

Optionally, the target gateway controller can be understood as a gateway controller that the user can directly conduct a thermal test after configuring a thermocouple for each target heat source.

In the embodiment of the present invention, the thermocouple can be arranged in the center of the upper surface of the target heat source in a press fit manner. Specifically, the thermocouple can be press-fitted to the center of the surface of the target heat source by using a heat dissipation gasket that is closely fitted to the lowering boss of the target gateway controller housing.

The advantage of this setting is that it avoids the use of fixed media to fix thermocouples, and can effectively avoid the measurement introduced by the entire thermal test system due to factors such as overlapping of thermally sensitive areas, thermal conductivity of fixed media that cannot be calculated, and space occupied by fixed media that cannot be calculated. error.

Wherein, the thermocouple wiring method may include: the position of the fixed medium setting point of the thermocouple connecting wire, and the wiring position of the thermocouple connecting wire.

Among them, the thermocouple wiring rules may include: the fixed medium setting point of the thermocouple connection line is located outside each heat-sensitive area, the direction of the thermocouple connection line at the outlet of the gateway controller and the direction of the thermocouple connection line at the fixed medium set point The thermocouple connection wires in parallel and in the thermally sensitive area are straight lines.

The advantage of this setting is that it can restore the thermal resistance coefficient of the target heat source itself to the greatest extent and the effective contact area between the target heat source and the heat dissipation pad, and it can also avoid the thermoelectric force introduced by the uneven force when the thermocouple connection wire goes out. The error caused by the position deviation of the dual probe.

Figure 2 is a schematic diagram of an optional thermocouple wiring method. Optionally, the thermocouple wiring method can be displayed to the user in the form of a schematic diagram shown in Figure 2, or it can be displayed to the user in the form of data. For the thermocouple wiring method The format is not limited.

Figure 3 is an optional thermocouple compression effect diagram. As shown in Figure 3, the thermocouple is not fixed on the target heat source through a medium, but fixed by pressing.

It should be noted that FIG. 2 and FIG. 3 are only used for exemplary illustration, and do not limit the specific content shown therein.

S130. Obtain the real-time position information of the air shield after the target gateway controller is placed in the air shield of the incubator, and set the orientation of the high-temperature fan according to the real-time position information of the air shield. After the orientation setting of the high-temperature fan is completed, Start the thermostat to thermally test the target gateway controller.

Optionally, when performing a thermal test on the target gateway controller, the target gateway controller needs to be placed in a baffle, and the baffle is arranged in an incubator. The incubator is also equipped with a high-temperature fan to blow air through the high-temperature fan. Realize the temperature rise in the incubator. The baffle is used to block the high-temperature gas blown by the high-temperature fan. In order to avoid the measurement error caused by the influence of natural convection, the invention proposes to change the direction of the fan so that the direction of the high-temperature fan is in line with the direction of the baffle. The directions where the outlets of the flow hood are located are perpendicular to each other in the horizontal direction.

In the technical solution of the embodiment of the present invention, by acquiring the target heat source and heat-sensitive area, the thermocouple wiring mode is automatically generated, and the direction of the high-temperature fan is set according to the direction of the outlet of the windshield. The thermal test measurement error caused by external factors improves the accuracy of the thermal test and can effectively save labor costs.

Embodiment two

FIG. 4 is a flow chart of a thermal testing method for a gateway controller provided by Embodiment 2 of the present invention. This embodiment specifically illustrates the thermal testing method for a gateway controller on the basis of the foregoing embodiments.

As shown in Figure 4, the method includes:

S210. According to the specifications and parameters of each electronic component in the gateway controller and the set working condition, calculate and obtain the heating temperature of each electronic component under the set working condition.

S220. Determine an electronic component whose heating temperature is greater than a preset temperature threshold as a target heating source.

S230. According to the heating temperature of each target heating source under the set working condition, calculate and obtain the temperature rise range of each main heating source.

S240. According to the temperature rise range of each target heat source, determine a thermally sensitive area that matches each target heat source.

S250. Obtain the current heat source sequentially from each target heat source, and obtain the target configuration position of the thermocouple matching the current heat source.

S260. Determine at least one alternative fixed medium set point position matching the target configuration position and each alternative fixed medium according to the heat-sensitive area matching the current processing heat source, the location of the outlet of the gateway controller, and the thermocouple wiring rules. The location of the thermocouple connection wires corresponding to the location of the medium set point.

S270. According to the wiring positions of the thermocouple connecting wires corresponding to the setting point positions of each candidate fixed medium, calculate the routing complexity respectively corresponding to the set point positions of each candidate fixed medium.

Taking Figure 2 as an example, fixed medium setting point 1 and fixed medium setting point 2 are two alternative fixed medium setting points. It can be seen that the matching wiring methods of the two fixed medium setting points in Figure 2 are in line with thermocouple The wiring is regular, but the wiring complexity of fixed medium set point 2 is obviously greater than that of fixed medium set point 1. Therefore, fixed medium set point 1 and its matching wiring method can be selected as the thermocouple wiring method that matches the current heat source.

However, it should be noted that the wiring method of thermocouples in Fig. 2 is simpler than the actual one, and the purpose is to make the present invention better understood. The structure of the actual printed circuit board is complicated, and the wiring method is also relatively complicated.

S280. According to the complexity of each wiring, determine a thermocouple wiring mode that matches the current heat source, so that the user can respectively configure thermocouples on each target heat source in the gateway controller according to the thermocouple wiring mode to obtain a target gateway controller.

S290. Collect a baffle image of the baffle in the incubator, and identify the direction of the outlet of the baffle in the image of the baffle.

S2100, setting the orientation of the high-temperature fan and the direction where the wire outlet of the windshield is located to orthogonally intersect in the horizontal direction.

Fig. 5 is a schematic diagram of an optional fan outlet orientation setting. As shown in Figure 5, the ellipse represents the air outlet of the high-temperature fan, and the rectangle represents the baffle. The blowing direction of the fan can be positively intersected with the direction of the outlet of the baffle in the horizontal direction, so as to avoid the influence of natural convection. measurement error.

By obtaining the target heat source and thermally sensitive area, the way of automatically generating thermocouple wiring can effectively reduce the impact of thermocouple connection lines on thermal testing, and by setting the direction of the high-temperature fan according to the direction of the outlet of the windshield, It can avoid the measurement error caused by the influence of natural convection, avoid the thermal test measurement error caused by external factors to a large extent, improve the accuracy of the thermal test, and can effectively save labor costs.

Embodiment three

FIG. 6 is a schematic structural diagram of a thermal testing device for a gateway controller provided by Embodiment 3 of the present invention. As shown in FIG. 6 , the device includes: a heating information acquiring module 310 , a target gateway controller acquiring module 320 and a heat testing module 330 .

The heating information acquiring module 310 is configured to acquire at least one target heating source included in the gateway controller to be thermally tested and a heat sensitive area respectively matched with each target heating source.

The target gateway controller acquisition module 320 is used to generate a thermocouple wiring method according to each target heat source, each heat-sensitive area, the location of the outlet of the gateway controller, and at least one preset thermocouple wiring rule, for the user to follow In the thermocouple wiring mode, thermocouples are respectively arranged on each target heat source in the gateway controller to obtain the target gateway controller.

The thermal test module 330 is used to obtain the real-time position information of the air shield after the target gateway controller is placed in the air shield of the incubator, and set the direction of the high-temperature fan according to the real-time position information of the air shield. Once the orientation is set, start the thermostat to thermally test the target gateway controller.

By obtaining the target heat source and heat-sensitive area, the thermocouple wiring method is automatically generated, and the direction of the high-temperature fan is set according to the direction of the outlet of the shroud, which can largely avoid thermal test measurement caused by external factors. Error, improve the accuracy of thermal testing, and can effectively save labor costs.

On the basis of the above-mentioned embodiments, the fever information acquisition module 310 can be specifically used for:

Calculate and obtain the heating temperature of each electronic component under the set working condition according to the specifications and parameters of each electronic component in the gateway controller and the set working condition;

Determine the electronic components whose heating temperature is greater than the preset temperature threshold as the target heating source;

According to the heating temperature of each target heat source under the set working condition, the temperature rise range of each main heat source is calculated;

According to the temperature rise range of each target heat source, determine the heat sensitive area that matches each target heat source.

On the basis of the above-mentioned embodiments, the thermocouple wiring method may include: the position of the fixed medium setting point of the thermocouple connecting wire, and the wiring position of the thermocouple connecting wire;

The thermocouple wiring rules may include: the fixed medium setting point of the thermocouple connection line is located outside each heat-sensitive area, the direction of the thermocouple connection line at the outlet of the gateway controller is parallel to the direction of the thermocouple connection line at the fixed medium set point, and The thermocouple connection wires in the thermally sensitive area are straight lines.

On the basis of the foregoing embodiments, the target gateway controller acquiring module 320 may be specifically used for:

Obtain the current heat source in turn from each target heat source, and obtain the target configuration position of the thermocouple that matches the current heat source;

Determine at least one alternative fixed medium set point location that matches the target configuration location and each alternative fixed medium setting based on the thermally sensitive area that matches the current processing heat source, the location of the gateway controller outlet, and the thermocouple wiring rules The wiring position of the thermocouple connection line corresponding to the point position;

According to the wiring position of the thermocouple connection line corresponding to the set point position of each alternative fixed medium, calculate the routing complexity corresponding to the set point position of each alternative fixed medium;

According to the complexity of each trace, determine the thermocouple wiring method that matches the current heat source.

On the basis of the above-mentioned embodiments, the thermal test module 330 can be specifically used for:

Collect the baffle image of the baffle in the incubator, and recognize the direction of the outlet of the baffle in the image of the baffle;

The orientation of the high-temperature fan is set to be orthogonal to the direction of the outlet of the spoiler in the horizontal direction.

On the basis of the above embodiments, in the target gateway controller, each thermocouple can be arranged in the center of the upper surface of the target heat source in a press fit manner.

The gateway controller thermal testing device provided in the embodiments of the present invention can execute the gateway controller thermal testing method provided in any embodiment of the present invention, and has corresponding functional modules and beneficial effects for executing the method.

Embodiment four

Fig. 7 shows a schematic structural diagram of a thermal testing system for a gateway controller. As shown in FIG. 7 , the thermal testing system of the gateway controller may include a central controller 41 , a printed circuit board 42 and a thermostat 43 .

Wherein, the central controller 41 is configured to execute the thermal testing method of the gateway controller described in any embodiment of the present invention.

The printed circuit board 42 is used to provide a configuration environment for the gateway controller and thermocouples.

The incubator 43 is used to take images of the cowling and to provide a thermal test environment to the gateway controller 41 .

Optionally, the printed circuit board 42 may include a gateway controller 421 configured with a plurality of electronic components, and a thermocouple 422 may also be arranged on the printed circuit board 42, and the thermocouple may be connected to the lower part of the gateway controller housing. The heat dissipating pad closely fitted by the probing platform is pressed on the gateway controller 421 .

Optionally, the incubator 43 may include an image capturing device 431 and a high temperature fan 432 .

Optionally, the image capturing device 431 may be used to capture an image of the windshield 433 and send the image of the windshield to the central controller 41 .

Optionally, the high temperature fan 432 can be used to raise the temperature of the thermostat 43 .

Optionally, a flow baffle can also be arranged in the incubator 43 , and the flow baffle can be used to block the high-temperature gas blown out by the high-temperature fan 432 from directly contacting the printed circuit board 42 .

In the technical solution of the embodiment of the present invention, by configuring the central controller, printed circuit board, and thermostat in the thermal test system of the gateway controller, the measurement error caused by external factors can be reduced, and the thermal test accuracy can be effectively improved.

Embodiment five

FIG. 8 shows a schematic structural diagram of an electronic device 10 that can be used to implement an embodiment of the present invention. Electronic device is intended to represent various forms of digital computers, such as laptops, desktops, workstations, personal digital assistants, servers, blade servers, mainframes, and other suitable computers. Electronic devices may also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices (eg, helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions, are by way of example only, and are not intended to limit implementations of the inventions described and/or claimed herein.

As shown in FIG. 8 , the electronic device 10 includes at least one processor 11, and a memory communicatively connected with the at least one processor 11, such as a read-only memory (ROM) 12, a random access memory (RAM) 13, etc., wherein the memory stores There is a computer program executable by at least one processor, and the processor 11 can operate according to a computer program stored in a read-only memory (ROM) 12 or loaded from a storage unit 18 into a random access memory (RAM) 13. Various appropriate actions and processes are performed. In the RAM 13, various programs and data necessary for the operation of the electronic device 10 are also stored. The processor 11 , ROM 12 , and RAM 13 are connected to each other through a bus 14 . An input/output (I/O) interface 15 is also connected to the bus 14 .

Multiple components in the electronic device 10 are connected to the I/O interface 15, including: an input unit 16, such as a keyboard, a mouse, etc.; an output unit 17, such as various types of displays, speakers, etc.; a storage unit 18, such as a magnetic disk, an optical disk etc.; and a communication unit 19, such as a network card, a modem, a wireless communication transceiver, and the like. The communication unit 19 allows the electronic device 10 to exchange information/data with other devices through a computer network such as the Internet and/or various telecommunication networks.

Processor 11 may be various general and/or special purpose processing components having processing and computing capabilities. Some examples of processor 11 include, but are not limited to, central processing units (CPUs), graphics processing units (GPUs), various dedicated artificial intelligence (AI) computing chips, various processors that run machine learning model algorithms, digital signal processing processor (DSP), and any suitable processor, controller, microcontroller, etc. The processor 11 executes the various methods and processes described above, for example, the thermal testing method of the gateway controller according to the embodiment of the present invention. That is:

Acquiring at least one target heat source included in the gateway controller to be thermally tested and a heat sensitive area respectively matched with each target heat source;

According to each target heat source, each heat-sensitive area, the location of the outlet of the gateway controller, and at least one preset thermocouple wiring rule, a thermocouple wiring method is generated for the user to use in each gateway controller according to the thermocouple wiring method. Configure thermocouples on the target heat source respectively to obtain the target gateway controller;

Obtain the real-time position information of the baffle after the target gateway controller is placed in the baffle of the incubator, set the direction of the high-temperature fan according to the real-time position information of the baffle, and start the thermostat after the orientation of the high-temperature fan is set. box to thermally test the target gateway controller.

In some embodiments, the thermal testing method of the gateway controller can be implemented as a computer program tangibly embodied in a computer-readable storage medium, such as the storage unit 18 . In some embodiments, part or all of the computer program may be loaded and/or installed on the electronic device 10 via the ROM 12 and/or the communication unit 19 . When the computer program is loaded into the RAM 13 and executed by the processor 11, one or more steps of the thermal testing method of the gateway controller described above can be performed. Alternatively, in other embodiments, the processor 11 may be configured in any other suitable manner (for example, by means of firmware) to execute the thermal testing method of the gateway controller.

Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips Implemented in a system of systems (SOC), load programmable logic device (CPLD), computer hardware, firmware, software, and/or combinations thereof. These various embodiments may include being implemented in one or more computer programs executable and/or interpreted on a programmable system including at least one programmable processor, the programmable processor Can be special-purpose or general-purpose programmable processor, can receive data and instruction from storage system, at least one input device, and at least one output device, and transmit data and instruction to this storage system, this at least one input device, and this at least one output device an output device.

Computer programs for implementing the methods of the present invention may be written in any combination of one or more programming languages. These computer programs can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing apparatus, so that the computer program causes the functions/operations specified in the flowcharts and/or block diagrams to be implemented when executed by the processor. A computer program may execute entirely on the machine, partly on the machine, as a stand-alone software package partly on the machine and partly on a remote machine or entirely on the remote machine or server.

In the context of the present invention, a computer readable storage medium may be a tangible medium that may contain or store a computer program for use by or in conjunction with an instruction execution system, apparatus or device. A computer readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination of the foregoing. Alternatively, a computer readable storage medium may be a machine readable signal medium. More specific examples of machine-readable storage media would include one or more wire-based electrical connections, portable computer discs, hard drives, random access memory (RAM), read only memory (ROM), erasable programmable read only memory (EPROM or flash memory), optical fiber, compact disk read only memory (CD-ROM), optical storage, magnetic storage, or any suitable combination of the foregoing.

In order to provide interaction with the user, the systems and techniques described herein can be implemented on an electronic device having a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display)) for displaying information to the user. monitor); and a keyboard and pointing device (eg, a mouse or a trackball) through which the user can provide input to the electronic device. Other kinds of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and can be in any form (including Acoustic input, speech input or, tactile input) to receive input from the user.

The systems and techniques described herein can be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., as a a user computer having a graphical user interface or web browser through which a user can interact with embodiments of the systems and techniques described herein), or including such backend components, middleware components, Or any combination of front-end components in a computing system. The components of the system can be interconnected by any form or medium of digital data communication, eg, a communication network. Examples of communication networks include: local area networks (LANs), wide area networks (WANs), blockchain networks, and the Internet.

A computing system can include clients and servers. Clients and servers are generally remote from each other and typically interact through a communication network. The relationship of client and server arises by computer programs running on the respective computers and having a client-server relationship to each other. The server can be a cloud server, also known as a cloud computing server or a cloud host. It is a host product in the cloud computing service system to solve the problems of difficult management and weak business expansion in traditional physical hosts and VPS services. defect.

It should be understood that steps may be reordered, added or deleted using the various forms of flow shown above. For example, each step described in the present invention may be executed in parallel, sequentially, or in a different order, as long as the desired result of the technical solution of the present invention can be achieved, there is no limitation herein.

The above specific implementation methods do not constitute a limitation to the protection scope of the present invention. It should be apparent to those skilled in the art that various modifications, combinations, sub-combinations and substitutions may be made depending on design requirements and other factors. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims (10)

1. A method for thermally testing a gateway controller, comprising:

acquiring at least one target heat source and a heat sensitive area matched with each target heat source respectively, wherein the target heat source is included in a gateway controller to be subjected to heat test;

generating a thermocouple wiring mode according to the positions of each target heating source, each heat sensitive area and a gateway controller outlet and at least one preset thermocouple wiring rule, so that a user can respectively configure thermocouples on each target heating source in the gateway controller according to the thermocouple wiring mode to obtain a target gateway controller;

and acquiring real-time position information of a flow blocking cover after the target gateway controller is placed in the flow blocking cover of the incubator, setting the orientation of the high-temperature fan according to the real-time position information of the flow blocking cover, and starting the incubator to perform thermal test on the target gateway controller after the orientation of the high-temperature fan is set.

2. The method of claim 1, wherein acquiring at least one target heat source included in a gateway controller to be thermally tested and a heat sensitive area respectively matched to each target heat source, comprises:

according to the specification parameters and the set working conditions of the electronic components in the gateway controller, calculating to obtain the heating temperature of the electronic components under the set working conditions;

determining an electronic component with the heating temperature being greater than a preset temperature threshold as a target heating source;

according to the heating temperature of each target heating source under the set working condition, calculating to obtain the heating range of each main heating source;

and determining a heat sensitive area matched with each target heat source respectively according to the heating range of each target heat source.

3. The method according to claim 1, wherein the thermocouple wiring method comprises: a fixed medium set point position of the thermocouple connection wire and a wiring position of the thermocouple connection wire;

the thermocouple wiring rule includes: the fixed medium set point of the thermocouple connecting wire is positioned outside each heat sensitive area, the direction of the thermocouple connecting wire at the outlet of the gateway controller is parallel to the direction of the thermocouple connecting wire at the fixed medium set point, and the thermocouple connecting wire in the heat sensitive area is a straight line.

4. The method of claim 3, wherein generating thermocouple routing patterns based on the locations of each target heat generating source, each heat sensitive area, the gateway controller outlet, and a preset thermocouple routing rule comprises:

sequentially acquiring a current heating source from each target heating source, and acquiring a target configuration position of a thermocouple matched with the current heating source;

determining at least one alternative fixed medium set point position matched with the target configuration position and the wiring position of a thermocouple connecting wire corresponding to each alternative fixed medium set point position according to the heat sensitive area matched with the current processing heating source, the position of a gateway controller outlet and the thermocouple wiring rule;

calculating wiring complexity corresponding to each alternative fixed medium set point position according to the wiring position of the thermocouple connecting wire corresponding to each alternative fixed medium set point position;

and determining a thermocouple wiring mode matched with the current heating source according to the wiring complexity.

5. The method of claim 1, wherein obtaining real-time position information of a flow blocking cover after the target gateway controller is placed in the flow blocking cover of the incubator, and setting an orientation of the high temperature fan based on the real-time position information of the flow blocking cover, comprises:

collecting a flow blocking cover image of the flow blocking cover in the incubator, and identifying the direction of a flow blocking cover outlet in the flow blocking cover image;

the direction of the high-temperature fan is arranged to be positively intersected with the direction of the outlet of the flow blocking cover in the horizontal direction.

6. The method of any one of claims 1-5, wherein in the target gateway controller, each thermocouple is disposed in a press fit manner in the center of the upper surface of the target heat generating source.

7. A thermal test device for a gateway controller, comprising:

the heating information acquisition module is used for acquiring at least one target heating source and a heat sensitive area matched with each target heating source respectively, wherein the target heating source is included in the gateway controller to be subjected to the thermal test;

the target gateway controller acquisition module is used for generating a thermocouple wiring mode according to the positions of each target heating source, each heat sensitive area and a gateway controller outlet and at least one preset thermocouple wiring rule so that a user can respectively configure thermocouples on each target heating source in the gateway controller according to the thermocouple wiring mode to obtain a target gateway controller;

and the thermal test module is used for acquiring real-time position information of the flow blocking cover after the target gateway controller is placed in the flow blocking cover of the incubator, setting the orientation of the high-temperature fan according to the real-time position information of the flow blocking cover, and starting the incubator to perform thermal test on the target gateway controller after the orientation setting of the high-temperature fan is completed.

8. The heat test system of the gateway controller is characterized by comprising a central controller, a printed circuit board and an incubator; wherein,,

the central controller being configured to perform the method of thermal testing of a gateway controller as claimed in any one of claims 1 to 6;

the printed circuit board is used for providing a configuration environment for the gateway controller and the thermocouple;

the incubator is used for acquiring the flow blocking cover image and providing a thermal test environment for the gateway controller.

9. An electronic device, the electronic device comprising:

at least one processor; and

a memory communicatively coupled to the at least one processor; wherein,,

the memory stores a computer program executable by the at least one processor to enable the at least one processor to perform the method of thermal testing of a gateway controller as claimed in any one of claims 1 to 6.

10. A computer readable storage medium storing computer instructions for causing a processor to perform the method of thermal testing of a gateway controller according to any one of claims 1-6.