CN116409919A - A method for improving the product yield rate of sensor substrate cutting process and its application - Google Patents

Abstract

The invention discloses a method for improving the yield rate of products in a sensor substrate cutting process and an application thereof. The raw material for preparing the sensor substrate includes a substrate substrate, and the substrate substrate includes a middle part and an edge part. The method includes the following steps: S1, making a peelable adhesive layer on the surface of the substrate substrate to obtain a process product I, wherein the peelable adhesive layer Including several protective adhesive layers on the middle surface and several supporting adhesive layers on the edge surface, the thickness of the supporting adhesive layer is equal to that of the adjacent protective adhesive layer and there is a gap a between them; S2, after processing step S1 The obtained process product I is subjected to cutting treatment to obtain the cutting process product, wherein the cutting method includes cutting along the gap a, and the number of said several is at least one. In the present invention, the peelable adhesive layer includes a supporting adhesive layer and a protective adhesive layer with equal thickness, so that there is no step difference at the outer edge of the peelable adhesive layer, and it is beneficial to the long-term use of the cutting equipment, and the yield rate of products in the cutting process is high.

Description

A method for improving the product yield rate of sensor substrate cutting process and its application

technical field

The invention belongs to the technical field of display screens, and in particular relates to a method for improving the yield rate of products in a sensor substrate cutting process and an application thereof.

Background technique

Sensor (touch sensor chip) is widely used in electronic products with display and touch effects. In order to improve product quality, in the production process of Sensor products, each process needs to carefully inspect and check the products of the Sensor process to ensure To the greatest extent, it is possible to prevent defective items from directly affecting the progress of the next process, or even directly affecting the product yield. In the related art, peelable glue is often used to protect the Sensor process products to prevent the process products from being polluted or scratched in the subsequent production process (such as cutting process). Among them, in the cutting process of Sensor process products containing peelable glue, especially in the cutting of batch Sensor process products, there is often a certain step difference on the outer edge of the peelable glue used for Sensor protection, and this step difference will lead to unevenness of the cutting surface. , as the use time of the cutting equipment increases, the edge of the cutter wheel will wear out in the middle and later stages of cutting, and the cutting state will gradually deteriorate, which will easily lead to the problem of edge chipping during cutting, and the yield rate of products in the cutting process is low.

Contents of the invention

The present invention aims to solve at least one of the technical problems in the above-mentioned prior art. For this reason, the present invention proposes a method for improving the yield rate of products in the cutting process of the sensor substrate, and the yield rate of the products in the cutting process is high.

The invention also proposes a method for preparing the sensor substrate.

The invention also provides a sensor substrate.

The present invention also proposes the above-mentioned method for improving the product yield rate in the cutting process of the sensor substrate and the application of the sensor substrate.

In the first aspect of the present invention, a method for improving the product yield rate of the sensor substrate cutting process is proposed. The raw materials for the preparation of the sensor substrate include a substrate base material, and the substrate base material includes a middle part and an edge part. The method includes the following steps: step:

S1, making a peelable adhesive layer on the surface of the substrate base material to obtain process product I, wherein the peelable adhesive layer includes several protective adhesive layers on the middle surface and several support adhesives on the edge surface layer, the thickness of the supporting adhesive layer is equal to that of the adjacent protective adhesive layer and there is a gap a between them;

S2. Carry out cutting processing on the process product I obtained after step S1 to obtain the cutting process product, wherein the cutting method includes cutting along the gap a, and the number is at least one.

The method for improving the product yield rate of the sensor substrate cutting process according to the embodiment of the present invention has at least the following beneficial effects:

In the present invention, the peelable adhesive layer includes a supporting adhesive layer and a protective adhesive layer with the same thickness. By setting the supporting adhesive layer, it is equivalent to adding a peelable gasket with a considerable thickness at the step position of the outer edge of the peelable adhesive on the traditional substrate to compensate The edge of the peelable rubber on the traditional substrate has a step difference, so that there is no step difference on the outer edge of the peelable rubber layer, creating a flat cutting surface is not easy to cause cutting edge chipping, and it is conducive to the long-term use of the cutting equipment, that is, the cutting wheel in the middle and later stages The knife edge is not easy to wear, the cutting state is good and the problem of cutting edge chipping is not easy to occur, and the yield rate of products in the cutting process is high.

In some embodiments of the present invention, the substrate base includes a front side and a back side.

In some embodiments of the present invention, in step S1, the peelable adhesive layer is prepared on at least one of the front and back sides of the substrate base material.

In some embodiments of the present invention, in step S1, the peelable adhesive layer is prepared on one surface of the substrate substrate, and a protective adhesive layer is prepared on the other surface of the substrate substrate, and the protective adhesive layer is on the middle surface.

In some embodiments of the present invention, in step S1, the peelable adhesive layer is prepared on the surface of the substrate by screen printing and screen printing.

In some preferred embodiments of the present invention, the mesh of the screen printing screen is 100-200 mesh.

In some embodiments of the present invention, the peelable adhesive layer has a thickness of more than 25 μm, preferably 30-40 μm, more preferably 30-35 μm.

Through the above embodiment, compared with the thickness of the peelable adhesive layer less than 25 μm, when the thickness of the peelable adhesive layer is 30-40 μm, the toughness of the peelable adhesive layer is better, the strength is higher, and the peelable adhesive layer is easier to peel off. It is beneficial to the subsequent preparation process after cutting; compared with the thickness of the peelable adhesive layer exceeding 40 μm, when the thickness of the peelable adhesive layer is 30-40 μm, less materials are used, and the peelable adhesive layer can be formed after baking. The consumption is small, and it is beneficial to the back-end process of Sensor products (such as cutting, CNC, bonding, etc.).

In some embodiments of the present invention, the width of the gap a is more than 1 mm, preferably 1-3 mm, more preferably 1-2 mm.

Through the above implementation, compared with the width of the gap a being less than 1 mm, when the width of the gap a is more than 1 mm, the post-process cutting is not easy to deviate, and the protective adhesive layer of the peelable adhesive layer is more difficult to be cut; compared with the gap a When the width of the gap a exceeds 3mm and the width of the gap a is 1-3mm, the efficiency of space utilization is higher, the material used for the base material of the substrate is smaller, and the production cost is lower.

In some embodiments of the present invention, there is a gap a' between two adjacent protective adhesive layers.

In some preferred embodiments of the present invention, the width of the gap a' is more than 1mm, preferably 1-3mm, more preferably 1-2mm.

In some preferred embodiments of the present invention, the gap a' is equal to the gap a.

In some preferred embodiments of the present invention, the cutting method also includes cutting along the gap a'.

The way of cutting along the gap a and the way of cutting along the gap a' can be adjusted in order according to actual production needs, such as the way of cutting along the gap a, before or after the way of cutting along the gap a', or both Two kinds of cutting methods are carried out at the same time, or alternately mixed and other methods.

In some embodiments of the present invention, the support glue layer contains several holes. Preferably, the hole is a square hole; more preferably, the hole is a square hole penetrating through the supporting adhesive layer.

In some preferred embodiments of the present invention, the square holes are equidistantly arranged in the supporting adhesive layer. Preferably, the square holes are arranged in a matrix.

Through the above embodiment, the setting of several holes in the supporting adhesive layer can form a hollowed-out loop pattern in the supporting adhesive layer according to the arrangement of the holes.

In some preferred embodiments of the present invention, the distance b between two adjacent square holes is more than 1 mm, preferably 1-5 mm, more preferably 1-3 mm.

Through the above-mentioned embodiment, compared with the distance b being less than 1 mm, when the distance b is more than 1 mm, in the cutting process, the contact surface is wider and the supporting force is more stable, and the cutting stability is better; compared with the distance b exceeding 5 mm, the distance b When the thickness is 1-5mm, the amount of peelable glue is less and the production cost is lower.

In some preferred embodiments of the present invention, the supporting rubber layer is in the shape of a strip, and the middle part of the supporting rubber layer contains a row or a row of square holes arranged equidistantly.

In some preferred embodiments of the present invention, the distance c between the square hole and the edge of the supporting adhesive layer is more than 1mm, preferably 1-5mm, more preferably 1-3mm.

Through the above-mentioned embodiment, compared with the distance c being less than 1 mm, when the distance c is more than 1 mm, in the cutting process, the contact surface is wider and the supporting force is more stable, and the cutting stability is better; compared with the distance c exceeding 5 mm, the distance c When the thickness is 1-5mm, the amount of peelable glue is less and the production cost is lower.

In some preferred embodiments of the present invention, the length d of the square hole is 5-10 mm.

Through the above embodiment, compared with the length d exceeding 10 mm, when the length d is 5-10 mm, in the cutting process, the hollow surface is not easy to be too large to cause insufficient support force, and the cutting stability is better; compared to the length d being less than 5 mm, When the length d is 5-10 mm, the utilization rate of the peelable glue is high, the waste of the peelable glue is less likely to be caused, and the production cost is lower.

In some preferred embodiments of the present invention, the width of the square hole is 2-5mm.

In some embodiments of the present invention, the substrate base material includes several pattern effective areas located in the middle and several margin blank areas located at the sides, each of the pattern effective areas has at least one protective adhesive layer on the surface, each There is at least one supporting glue layer on the surface of each of the margin blank areas.

In some preferred embodiments of the present invention, the screen printing screen includes several areas I and II, wherein the area I is located in the middle of the screen printing screen, and is used for printing peelable glue on the graphics. The surface of the effective area, thereby forming a protective adhesive layer; the area II is located at the edge of the screen printing screen, and is used for printing peelable adhesive on the surface of the marginal blank area, thereby forming a supporting adhesive layer.

In some preferred embodiments of the present invention, step S1 specifically includes the following operations: use a screen printing screen containing several regions I and II to print a peelable adhesive on the surface of the substrate, and print on several regions of the substrate A protective adhesive layer and a supporting adhesive layer are respectively formed on the surface of the effective area of the graphics and the surface of the edge blank area to obtain the process product I, wherein the area I is used to print peelable adhesive to form the protective adhesive layer, and the area II is used to form the protective adhesive layer. The supporting adhesive layer is formed by printing peelable adhesive.

In some embodiments of the present invention, the substrate base material includes several substrate bodies, and at least one protective adhesive layer is provided on the surface of each substrate body.

Through the above-mentioned embodiment, after the substrate base material containing the peelable adhesive layer is cut, several substrate bodies containing the protective adhesive layer are obtained, that is, the products of the cutting process.

In some preferred embodiments of the present invention, the substrate body includes a sensing sheet with a touch function.

In some preferred embodiments of the present invention, the substrate body is a glass substrate fabricated with functional circuits.

In some embodiments of the present invention, the substrate base material has a thickness of 0.2-3 mm.

In some embodiments of the present invention, in step S2, the process product I is baked and then cut.

In some preferred embodiments of the present invention, the baking temperature is 130-180° C.; preferably, the baking time is 20-60 minutes.

In the second aspect of the present invention, a method for preparing a sensor substrate is proposed. The preparation method includes: using the method for improving the product yield of the sensor substrate in the cutting process to obtain a product in the cutting process, and then obtaining a sensor substrate.

The method for preparing a sensor substrate according to an embodiment of the present invention has at least the following beneficial effects:

In the present invention, the peelable adhesive layer includes a supporting adhesive layer and a protective adhesive layer with the same thickness. By setting the supporting adhesive layer, it is equivalent to adding a peelable gasket with a considerable thickness at the step position of the outer edge of the peelable adhesive on the traditional substrate to compensate The edge of the peelable rubber on the traditional substrate has a step difference, so that there is no step difference on the outer edge of the peelable rubber layer, creating a flat cutting surface is not easy to cause cutting edge chipping, and it is conducive to the long-term use of the cutting equipment, that is, the cutting wheel in the middle and later stages The knife edge is not easy to wear, the cutting state is good and the problem of cutting edge chipping is not easy to occur, the yield rate of products in the cutting process is high, and the yield rate and processing effect of the sensor substrate are improved.

In some embodiments of the present invention, the preparation method includes the following steps:

S1, take the base material of the substrate, the base material of the base plate includes a plurality of graphic effective areas located in the middle and a number of edge blank areas located in the edge;

Use a screen printing screen containing several areas I and II to print peelable adhesive on the surface of the substrate substrate, and form a protective adhesive layer and a supporting adhesive on the surface of several graphic effective areas and the surface of the edge blank area of the substrate substrate. layer to obtain process product I, wherein the area I is used to print peelable adhesive to form the protective adhesive layer, and the area II is used to print peelable adhesive to form the support adhesive layer; the support adhesive layer and the adjacent The thickness of the protective adhesive layer is equal and there is a gap a between them; there is a gap a' between two adjacent protective adhesive layers;

S2, cutting the process product I obtained after step S1 to obtain the cutting process product, wherein the cutting method includes cutting along the gap a and the gap a'.

Through the above implementation, the area I is printed with a protective adhesive layer that can be peeled on the surface of the effective graphic area, and the area II is printed with a support adhesive layer that can be peeled and formed on the surface of the edge blank area.

In the third aspect of the present invention, a sensor substrate is proposed, which is prepared by using the above preparation method.

In some embodiments of the present invention, the sensor substrate includes a substrate body and a protective adhesive layer provided on the surface of the substrate body.

In some embodiments of the present invention, the substrate body includes a front side and a back side.

In some embodiments of the present invention, at least one of the front and back of the substrate body is provided with the protective adhesive layer.

In the fourth aspect of the present invention, a method for improving the product yield rate in the cutting process of the sensor substrate or an application of the sensor substrate in manufacturing a touch display device is proposed.

In some embodiments of the present invention, the touch display device includes but not limited to a touch display screen.

Description of drawings

The present invention will be further described below in conjunction with accompanying drawing and embodiment, wherein:

FIG. 1 is a schematic structural view of a Sensor substrate base material in Example 1 of the present invention;

2 is a schematic structural view of a Sensor substrate substrate covered with a peelable adhesive layer in Example 1 of the present invention;

3 is a schematic diagram of the distribution of the peelable adhesive layer in Example 1 of the present invention;

Figure 4 is an enlarged view of the part inside the upper right dashed box in Figure 3;

Figure 5 is a schematic diagram of the cutting method in Example 1 of the present invention;

FIG. 6 is a schematic diagram of the sensor substrate obtained after cutting in Embodiment 1 of the present invention.

Detailed ways

The conception and technical effects of the present invention will be clearly and completely described below in conjunction with the embodiments, so as to fully understand the purpose, features and effects of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, rather than all of them. Based on the embodiments of the present invention, other embodiments obtained by those skilled in the art without creative efforts belong to The protection scope of the present invention.

The experimental methods that do not indicate specific conditions in the following examples are usually according to the conventional conditions in this field or according to the conditions suggested by the manufacturer; the raw materials and reagents used, if no special instructions, all can be obtained from commercial channels such as conventional markets raw materials and reagents.

Vinyl chloride-vinyl acetate copolymer: CAS: 9003-22-9; viscosity at 260-350dpa.s (25°C);

Epoxidized soybean oil: CAS: 8013-07-8, viscosity is about 325mpa.s (25℃);

Calcium zinc stabilizer: calcium stearate, CAS: 1592-23-0, purchased from Shanghai Yien Chemical Technology Co., Ltd.;

Polyester plasticizer: dioctyl terephthalate, CAS: 6422-86-2, purchased from Shanghai Yien Chemical Technology Co., Ltd.;

Toner: Phthalocyanine blue, CAS: 147-14-8, purchased from Shuangle Pigment Co., Ltd.

Example 1

This embodiment discloses a sensor substrate, the preparation process of which includes:

(I) Take the screen printing screen I and the screen printing screen II, the screen meshes are both 150, and the screen printing screen I includes several areas I located in the middle of the screen printing screen I (for the effective area of printing graphics) and the area located in the screen printing area. Several areas II on the edge of the screen I (used to print the blank area on the outer edge of the graphic); the screen printing screen II includes several areas I' located in the middle of the screen printing II (used to print the effective area of the graphic); the thickness is 1.1mm Sensor substrate base material, wherein the substrate base material includes several graphic effective areas located in the middle and several edge blank areas located at the edge of the substrate base material. The structure schematic diagram of the Sensor substrate base material is shown in Figure 1, where , inside the dotted line frame is the graphic effective area, and outside the dotted line frame is the margin blank area;

Place the Sensor substrate base material on the screen printing screen I, carry out peelable adhesive printing through the squeegee, and coat the peelable adhesive on the reverse side of the Sensor substrate base material with a film thickness of 30 μm, using a hot drum Bake and cure in an air-type oven (baking temperature is 155°C, baking time is 30min) to form a peelable adhesive layer I, and use a screen printing screen II screen printing to coat the peelable adhesive on the graphics on the front of the Sensor substrate substrate The surface of the effective area is baked (the baking temperature is 155°C, and the baking time is 30 minutes) to form a peelable adhesive layer II, so that the Sensor raw material covered with peelable adhesive is obtained, which is a product of the silk screen printing process; among them, the product of the silk screen printing process It includes the Sensor substrate substrate and the peelable adhesive layer I and the peelable adhesive layer II respectively located on the reverse and front surfaces of the Sensor substrate substrate. The peelable adhesive layer I includes multiple protective adhesive layers I and multiple protective adhesive layers of equal thickness (30 μm). Supporting adhesive layer (the structural diagram of the product in the silk screen printing process is shown in Figure 2. The sheet inside the dotted line frame is the effective area of the graphics covering the protective adhesive layer, and the hollow segment outside the frame is the edge blank area covering the supporting adhesive layer), which can be peeled off Layer II includes multiple protective adhesive layers II with a thickness of 30 μm. Area I in the screen printing screen I is used to print peelable adhesive on the back surface of the effective area of the graphic to form protective adhesive layer I. Area II is used to print peelable adhesive on the edge The supporting adhesive layer is formed on the back surface of the blank area; the area I' in the screen printing screen II is used for printing peelable adhesive to form a protective adhesive layer II on the front surface of the effective graphic area. Specifically, a protective adhesive layer I is located on the surface opposite to a pattern effective area of the substrate base material, and a supporting adhesive layer is located on the surface opposite to an edge blank area of the substrate base material; a protective adhesive layer II is located on the surface of the substrate base material The front surface of a graphic effective area of the substrate base material; the supporting adhesive layer is in the shape of a strip, the gap between the supporting adhesive layer and the adjacent protective adhesive layer I is a, and the gap between two adjacent protective adhesive layers I , The gap between two adjacent protective adhesive layers II is a', the supporting adhesive layer contains several square holes arranged in a matrix, the distance between two adjacent square holes is b, and the square hole and its position The distance from the edge of the supporting adhesive layer is c, the length of the square hole is d, and the width of the square hole is 2mm, where a=a'=2mm, b=1.5mm, c=1mm, d=5mm; peelable adhesive layer I The schematic diagram of the distribution is shown in Figure 3-4, wherein Figure 4 is an enlarged view of the upper right corner of Figure 3, x indicates the protective adhesive layer I, y indicates the supporting adhesive layer, and z indicates the hollowed out small square formed by the square hole;

(II) Cut the product of the silk screen printing process, take the front of the product of the silk screen printing process as the cutting front (cutting from the front), and the cutting method is to cut along the cutting line (the schematic diagram is shown in Figure 5, and the double The arrow indicates the cutting line), and the cutting line is the line segment where the gap a is located and the line segment where the gap a' is located; the effective area of the graphic of the product in the silk printing process forms multiple sensor substrates (glass Sensor components, the schematic diagram is shown in Figure 6). Among them, the sensor substrate obtained by cutting includes the substrate body (made of a glass substrate with functional circuits, that is, a sensor sheet with touch function) and the protective adhesive layer I and protective adhesive layer II provided on the surface of the substrate body.

Example 2

This embodiment discloses a sensor substrate, which differs from Embodiment 1 in that: in step (I) of this embodiment, the thickness of the peelable adhesive layer is 32 μm, and a=a'=1 mm.

Example 3

This embodiment discloses a sensor substrate, which differs from Embodiment 1 in that: in step (I) of this embodiment, the peelable adhesive layers I-II have a thickness of 35 μm, and b=5 mm.

Example 4

This embodiment discloses a sensor substrate, which is different from Embodiment 1 in that: in the step (I) of this embodiment, the thickness of peelable adhesive layers I-II is 32 μm, and c=5 mm.

Example 5

This embodiment discloses a sensor substrate, which differs from Embodiment 1 in that: in step (I) of this embodiment, the peelable adhesive layers I-II have a thickness of 32 μm, and d=10 mm.

Example 6

This embodiment discloses a sensor substrate, which is different from Embodiment 1 in that: in step (I) in this embodiment, the thickness of the peelable adhesive layers I~II is 32 μm, and a=a'=3mm , b=5mm, c=5mm, d=10mm.

Example 7

This embodiment discloses a sensor substrate, which is different from Embodiment 1 in that: in step (I) in this embodiment, the thickness of the peelable adhesive layers I~II is 32 μm, and a=a'=1mm , b=1 mm.

Example 8

This embodiment discloses a sensor substrate, which differs from Embodiment 1 only in that in step (I) of this embodiment, the method used to coat the front and back of the Sensor substrate substrate with peelable adhesive The screen printing screens are all the screen printing screen I in Example 1, therefore, the peelable adhesive layer II in the screen printing process product obtained in this example not only includes the protective adhesive layer located on the front of the graphic effective area of the substrate base material II, further comprising a supporting adhesive layer on the front surface of the marginal blank area of the substrate base material. Others are the same as embodiment 1.

Comparative example 1

This comparative example discloses a sensor substrate, which is different from Example 1 in that: in step (I) in this comparative example, the peelable adhesive layer I in the obtained silk screen process product only includes the protective adhesive layer I, Does not contain the support adhesive layer (the screen printing screen used in this comparative example does not contain the lower ink area for printing the peelable adhesive on the blank area at the edge of the Sensor substrate substrate, such as the area II of the screen printing screen I in Example 1) , and a'=2mm, the thickness of peelable adhesive layer I~II is 32μm. Others are the same as embodiment 1.

Comparative example 2

This comparative example discloses a sensor substrate, which is different from Comparative Example 1 in that: in the step (I) of this comparative example, a'=1mm, and the thickness of peelable adhesive layers I-II is 30 μm.

Comparative example 3

This comparative example discloses a sensor substrate, which differs from Comparative Example 1 in that: in the step (I) of this comparative example, a'=3mm, and the thickness of the peelable adhesive layers I-II is 35 μm.

The peelable glue in the above-mentioned embodiment and comparative example is made by following method:

Put the specific components of the peelable glue into the container according to the mass percentage in Table 1, start the stirring switch, stir at a speed of 100-150rpm for 3 minutes, then start the dispersing switch, and disperse at a speed of 500-800rpm for 8 minutes , transfer the material to a three-roller mill and grind it three times, the measured fineness is 10-20μm, transfer the material to the container again, start stirring, stir at a speed of 300-350rpm for 10 minutes, and keep the temperature during the stirring process Below 100°C, a peelable adhesive is produced.

Table 1 Information table of peelable adhesive components

The peelable adhesive layer information in the above-mentioned embodiments and comparative examples is as shown in Table 2:

Table 2 Peelable adhesive layer information table

Test case

In this test example, the sensor substrate cutting yield test results obtained in the embodiment and the comparative example are shown in Table 3. According to the above method, at least 1000 silk screen printing process products are continuously cut and processed, and the cutting yield is counted; The service life is defined by the number of meters. Generally, the cutter wheel is defined according to the service life of 15,000 meters (cutting and processing 1,000 pieces of silk screen printing process products). Cutting and processing 300-600 pieces of silk screen printing process products) is the mid-term, and 1-15,000 meters (cutting and processing 600-1000 pieces of silk screen printing process products) is the later stage. In Table 3, the "yield rate at the initial stage of knife wheel cutting" indicates the yield rate of products in the silk screen printing process that cut the 1st-300th piece, and "the yield rate at the initial stage of knife wheel cutting" indicates the yield rate of products in the silk screen process that cuts the 301st-1000th piece .

Table 3 Comparison Table of Product Yield Rate of Cutting Process

It can be seen from the above that the screen printing process products produced in Examples 1-7 make up for the traditional substrate by adding a considerable thickness of support adhesive layer (peelable gasket) at the step position of the outer edge of the peelable rubber of the traditional substrate. The step difference of the peeling edge creates a flat cutting surface and greatly reduces the edge chipping. By comparing the yield rate of products in the early stage of cutter wheel cutting and the middle and later stages, it can be seen that the initial state of cutter wheel cutting is better and the cutting yield rate is higher. There is almost no difference in the cutting yield rate compared with those with and without peelable rubber gaskets. However, when cutting There is a significant difference in the cutting yield between those with and without the peelable rubber gasket in the middle and later stages. The cutting yield of the embodiment with a support rubber layer is about 5% higher than that of the comparison example without a support rubber layer, and the cutting yield has been significantly improved.

It is measured that the yield of products in the cutting process in Example 8 is equivalent to that in Example 1.

It can be seen that the present invention improves the cutting yield of the substrate by adding a supporting adhesive layer and rationally designing the peelable adhesive layout, prolongs the service life of the cutter wheel, and can still maintain a high cutting yield in the middle and late stages of cutting with the cutter wheel without replacing a new knife The process also reduces the adjustment of the cutting process, which greatly improves the stability of the cutting process yield and production efficiency, and also reduces the cost of cutting consumables.

To sum up, the present invention provides a method and its application for improving the yield rate of products in the sensor substrate cutting process. By setting a strip-shaped gasket pattern in a specific area of the silk-screen peelable adhesive screen, it is used to place a blank area on the edge of the substrate substrate. Printing peelable adhesive, without adding additional processes, can obtain a peelable adhesive layer on the surface of the effective area of the substrate substrate with a considerable thickness. The step difference on the outer edge of the graphic area can be peeled off to obtain a flat cutting surface and improve the cutting yield, which is conducive to the long-term use of the cutting equipment, that is, the cutting edge of the cutter wheel is not easy to wear in the middle and later stages of cutting, and the cutting state is better and is not easy to appear Cutting edge chipping problem, the yield rate of products in the cutting process is high. Specifically, by adding a peelable glue "ink area" (such as a hollowed-out loop pattern) to the blank area outside the graphic of the screen printing screen, the peelable glue is screen printed on the graphic effective area of the Sensor substrate , the blank area on the outer edge, after baking, the protective adhesive layer for the protection of the pattern of the Sensor substrate base material and the supporting adhesive layer on the outer edge of the Sensor substrate base material can be obtained at the same time. Since the supporting adhesive layer and the protective adhesive layer have the same thickness, it can solve the problem that there is a step difference in the outer edge of the glass sensor substrate substrate in the related art, which causes the cutting surface to be uneven and cause cutting edge chipping, thereby improving the product of the sensor substrate cutting process. cutting yield.

The embodiments of the present invention have been described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned embodiments, and within the scope of knowledge of those of ordinary skill in the art, various modifications can be made without departing from the spirit of the present invention. Variety. In addition, the embodiments of the present invention and the features in the embodiments can be combined with each other if there is no conflict.

Claims (10)

1. The method for improving the product yield of the sensor substrate cutting process is characterized in that the preparation raw materials of the sensor substrate comprise a substrate base material, the substrate base material comprises a middle part and a side part, and the method comprises the following steps:

s1, manufacturing a peelable adhesive layer on the surface of a base material of a base plate to obtain a working procedure product I, wherein the peelable adhesive layer comprises a plurality of protective adhesive layers positioned on the surface of the middle part and a plurality of support adhesive layers positioned on the surface of the edge part, and the thickness of the support adhesive layers is equal to that of the adjacent protective adhesive layers and a gap a is reserved between the support adhesive layers;

s2, cutting the working procedure product I obtained after the treatment in the step S1 to obtain a cutting working procedure product, wherein the cutting mode comprises cutting along the gap a, and the number of the cutting modes is at least 1.

2. The method for improving the yield of the sensor substrate cutting process product according to claim 1, wherein in the step S1, a peelable adhesive layer is prepared on the surface of a substrate by adopting a screen printing and peelable adhesive printing mode;

preferably, the screen mesh number is 100-200 mesh.

3. The method for improving the yield of a sensor substrate cutting process according to claim 1, wherein the width of the gap a is 1mm or more.

4. The method for improving the product yield of the sensor substrate cutting process according to claim 1, wherein a gap a' is formed between two adjacent protective adhesive layers;

preferably, the width of the gap a' is 1mm or more.

5. The method for improving the product yield of the cutting process of the sensor substrate according to claim 1, wherein the supporting adhesive layer comprises a plurality of holes; preferably, the holes are square holes; preferably, the distance b between two adjacent square holes is more than 1mm, the distance c between the square holes and the edge of the support adhesive layer is more than 1mm, and the length d of each square hole is 5-10mm.

6. The method for improving the yield of products in a sensor substrate cutting process according to claim 1, wherein the substrate comprises a plurality of pattern effective areas positioned in the middle and a plurality of edge blank areas positioned at the edges, at least one protective adhesive layer is arranged on the surface of each pattern effective area, and at least one support adhesive layer is arranged on the surface of each edge blank area.

7. The method for improving the product yield in the dicing process of a sensor substrate according to claim 6, wherein in step S1, the method specifically comprises the following operations: and (3) adopting a screen printing plate comprising a plurality of areas I and areas II, printing peelable glue on the surface of a substrate, respectively forming a protective glue layer and a supporting glue layer on the surfaces of a plurality of pattern effective areas and the surfaces of edge blank areas of the substrate, and obtaining a process product I, wherein the areas I are used for printing peelable glue to form the protective glue layer, and the areas II are used for printing peelable glue to form the supporting glue layer.

8. A method for manufacturing a sensor substrate, characterized in that the method for improving the yield of the sensor substrate cutting process product according to any one of claims 1 to 7 is adopted to manufacture the cutting process product, and further the sensor substrate is obtained;

preferably, the preparation method comprises the following steps:

s1, taking a substrate base material, wherein the substrate base material comprises a plurality of pattern effective areas positioned in the middle and a plurality of edge blank areas positioned at the edges;

printing strippable glue on the surface of a substrate by adopting a screen printing plate comprising a plurality of areas I and areas II, respectively forming a protective glue layer and a support glue layer on the surfaces of a plurality of pattern effective areas and the surfaces of edge blank areas of the substrate to obtain a process product I, wherein the areas I are used for printing strippable glue to form the protective glue layer, and the areas II are used for printing strippable glue to form the support glue layer; the thickness of the supporting adhesive layer is equal to that of the adjacent protective adhesive layer, and a gap a is formed between the supporting adhesive layer and the adjacent protective adhesive layer; a gap a' is formed between two adjacent protective adhesive layers;

s2, cutting the working procedure product I obtained after the step S1 to obtain a cutting working procedure product, wherein the cutting mode comprises cutting along the gap a and the gap a'.

9. A sensor substrate produced by using the production method according to claim 8.

10. The method for improving the yield of the sensor substrate cutting process product according to any one of claims 1 to 7 or the sensor substrate manufactured by the method according to claim 8 or the application of the sensor substrate according to claim 9 in manufacturing a touch display device.

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