CN116394460A - Electronic detonator module sealing method and sealing system - Google Patents

Abstract

The invention discloses a glue sealing method and a glue sealing system for an electronic detonator module, belonging to the technical field of electronic detonators. The electronic detonator module sealing method includes: putting the substrate of a plurality of electronic detonator modules to be sealed into the storage cavity of the sealing mold in the electronic detonator module sealing system, wherein the substrate is provided with A plurality of substrate strips, the plurality of substrate strips are respectively arranged with connecting wires and electronic components to form an electronic detonator module; the sealing mold is molded, and the plurality of electronic detonator modules to be sealed are limited in the sealing mold. In the cavity to be injected after the mold is formed, the parts to be sealed of multiple electronic detonator modules are respectively located in the cavity to be injected; hot colloid is injected into the cavities to be injected, and the hot colloid is filled in the multiple cavities to be injected. In the cavity and wrap the part of the electronic detonator module to be sealed; demoulding. The electronic detonator module sealing method of the present invention is beneficial to sealing a plurality of electronic detonator modules and improving the sealing quality.

Description

Electronic detonator module sealing method and sealing system

technical field

The invention relates to the technical field of electronic detonators, in particular to a sealing method and a sealing system for an electronic detonator module.

Background technique

At present, electronic detonators are widely used in tunnel excavation, hazard blasting, demolition blasting, ore-rock separation, open-pit mine blasting, etc., and the electronic detonator module in the electronic detonator is the initiation control part of the electronic detonator. The stability of the electronic detonator module The stability of the electronic detonator will directly affect the stability of the electronic detonator. The electronic detonator module mainly includes electronic components such as integrated control chips, ignition parts, and energy storage capacitors installed on the circuit board; The module is sealed with glue to protect the electronic components mounted on the circuit board, making it moisture-proof and dust-proof.

However, when sealing electronic detonator modules using the sealing method in the prior art, before sealing multiple electronic detonator modules, in order to improve the sealing efficiency of electronic detonator modules, it is usually necessary to pass The connecting piece connects multiple electronic detonator modules as a whole, so as to realize the positioning of multiple electronic detonator modules, and then places the multiple electronic detonator modules connected as a whole by the connecting piece in the cavity of the injection mold. However, when multiple electronic detonator modules are connected as a whole through connectors, there is often the problem that the binding force of the connectors on multiple electronic detonator modules is insufficient. shift, which in turn leads to a decrease in the quality of the sealant of the electronic detonator module.

Further, by connecting multiple electronic detonator modules one by one to the connector, the workload of sealing the electronic detonator modules is also increased. Therefore, there is an urgent need for a sealing method that is beneficial to sealing a plurality of electronic detonator modules and improving the quality of the sealing.

Contents of the invention

The object of the present invention is to overcome at least one deficiency of the above-mentioned prior art, and provide a method for sealing electronic detonator modules that is beneficial to sealing multiple electronic detonator modules and improving the quality of the sealing. In addition, it also provides a Electronic detonator module sealing system.

The technical scheme that the present invention solves the problems of the technologies described above is as follows:

According to one aspect of the present application, a method for sealing an electronic detonator module is provided, including:

Put the substrates of a plurality of electronic detonator modules to be sealed into the storage cavity of the sealing mold in the electronic detonator module sealing system, wherein the substrate is provided with a plurality of substrate strips, and a plurality of Connecting wires and electronic components are respectively arranged on the substrate strip to form the electronic detonator module;

Closing the sealing mold, limiting the plurality of electronic detonator modules to be sealed in the cavity to be injected after the sealing mold is closed, and the plurality of electronic detonator modules The parts to be sealed are respectively located in the cavities to be injected;

Injecting thermal colloid into the plurality of cavities to be injected, the thermal colloid filling in the plurality of cavities to be injected and covering the parts to be sealed of the electronic detonator module;

Demoulding the plurality of electronic detonator modules that have been sealed with glue.

The beneficial effects of the present invention are: in the electronic detonator module sealing method of this embodiment, by putting the substrates of a plurality of electronic detonator modules to be sealed into the sealing mold in the electronic detonator module sealing system In the storage cavity of the storage chamber, multiple electronic detonator modules to be sealed are connected to the substrate strip, and the substrate strip is a part of the substrate. By fixing the substrate, multiple electronic detonator modules can be fixed, thereby improving the stability of the substrate. The fixed reliability of multiple electronic detonator modules prevents the electronic detonator modules from shifting during the sealing process, thereby improving the sealing quality of the electronic detonator modules; furthermore, multiple electronic detonator modules to be sealed The group is connected to the substrate strip. In the process of demoulding the sealed electronic detonator module, it is beneficial to push the substrate to make the multiple electronic detonator modules connected to the substrate fall off together, and it is beneficial to reduce the The deformation of the electronic detonator module completed by the small sealing glue during the demoulding process further improves the sealing quality of the electronic detonator module.

In addition, on the basis of the above technical solutions, the present invention can also be improved as follows, and can also have the following additional technical features.

According to an embodiment of the present invention, before the substrates with multiple electronic detonator modules to be sealed are put into the cavity of the sealing mold in the electronic detonator module sealing system, the The electronic detonator module sealing method further includes: a plurality of openings are arranged at intervals on the substrate, and the plurality of openings are arranged in an array along the length direction of the substrate, and between two adjacent openings The substrate strips are respectively formed, and connecting wires and electronic components are respectively arranged on the substrate strips to form the electronic detonator module.

In this embodiment, a plurality of openings are arranged at intervals on the substrate, and then a substrate strip for laying connection wires and electronic components to form an electronic detonator module is formed on the substrate, so that the connection wires and the electronic detonator module can be arranged on the substrate strip respectively. The electronic components form an electronic detonator module, so that it is convenient to manufacture and obtain multiple electronic detonator modules on the substrate, and the multiple electronic detonator modules can be supported and fixed by the substrate strip integrally connected with the substrate, which is conducive to improving the efficiency of multiple electronic detonators. The reliability of the connection and fixation of the detonator module prevents the electronic detonator module from shifting during the sealing process, thereby improving the sealing quality of the electronic detonator module.

According to an embodiment of the present invention, the electronic detonator module sealing method further includes: setting pre-breaking lines at both ends of the substrate strip in the length direction, and the pre-breaking lines are used for The substrate strips are disconnected by wires to obtain a plurality of sealed electronic detonator modules. In this embodiment, pre-breaking lines are respectively provided at both ends of the substrate strip in the length direction, so that after the electronic detonator module is packaged, the substrate can be taken out, and the substrate strip can be broken along the pre-breaking line to obtain a single sealant. The completed electronic detonator module.

According to another aspect of the present application, an electronic detonator module sealing system is provided, which is used to implement the above electronic detonator module sealing method, and the electronic detonator module sealing system includes:

base;

The sealing mold, the sealing mold includes a first module and a second module, one of the first module and the second module is installed on the base, and the first module is provided with Space constraint structure 1, the side of the second module used to mold with the first module is provided with space constraint structure 2, the first module or/and the first module A runner structure is provided on the side of the two modules for mold closing; when the first module and the second module are mold-closed, the space constraint structure 1 and the space constraint structure 2 are defined to form a The receiving cavity for storing the substrate, the space constraining structure 1 and the space constraining structure 2 also define a plurality of cavities to be injected with the hot glue, and a plurality of the The cavities to be injected are respectively communicated with the storage cavities, the runner structure forms a runner connected to the cavities to be injected, and the substrate is placed behind the storage cavities, the electronic detonator The parts to be sealed of the module are respectively located in the cavity to be injected; the thermal colloid is injected into the cavity to be injected through the runner, and the thermal colloid is filled in the cavity to be injected and Wrapping the part to be sealed with the electronic detonator module;

a drive device installed on the base, the other of the first module and the second module is mounted on the drive device and can move under the drive of the drive device and move the first The module is mold-closed and mold-opened with the second module;

a guide mechanism installed on the base, the first module or/and the second module are slidably connected to the guide mechanism and can move under the guidance of the guide mechanism;

A pushing mechanism, installed on the base or the driving device, the pushing mechanism is used to seal the glue in the cavity to be injected after the first module and the second module are opened. A plurality of completed electronic detonator modules are ejected to realize demoulding;

An injection molding machine is used for producing the hot glue and inputting the hot glue into the sprue.

The sealing mold in this embodiment includes a first module and a second module. When the first module and the second module are molded together, the gap between the space constraint structure 1 on the first module and the space constraint structure 2 on the second module A storage cavity that can accommodate the substrate is defined and formed, and a plurality of cavities to be injected with thermal colloid are also defined between the first space constraint structure and the second space constraint structure, so that it is convenient to put the substrate into the storage cavity and then place multiple electrons into the cavity. The parts to be sealed of the detonator modules are respectively located in the cavity to be injected, which is conducive to injecting hot colloid into the cavity to be injected, so as to realize the sealing of the parts to be sealed of multiple electronic detonators; further, by The fixing of the substrate can realize the fixing of multiple electronic detonator modules, thereby improving the reliability of fixing multiple electronic detonator modules, avoiding the deviation of the electronic detonator modules in the process of sealing glue, and thus improving the reliability of the electronic detonator modules. sealing quality.

According to an embodiment of the present invention, the space constraint structure- includes:

a storage groove, the profile of the storage groove matches the profile of the substrate, and the substrate can be stored in the storage groove;

A plastic sealing groove one communicates with the receiving groove, and the plastic sealing groove one is used to shape the part to be sealed of the electronic detonator module;

When the first module and the second module are molded together, the receiving groove forms the receiving cavity, and the sealing molding groove forms a part of the cavity to be injected;

The space constraint structure two includes:

Sealing molding groove 2 is set opposite to the sealing molding groove 1, and is used to shape the part to be sealed of the electronic detonator module;

After the first module and the second module are molded together, the plastic sealing groove 2 forms another part of the cavity to be injected, and the sealing plastic groove 1 and the sealing groove 1 The plastic groove two defines the cavity to be injected.

The space constraint structure in this embodiment includes a storage groove and a sealing plastic groove. In the storage groove, the substrate is positioned in the peripheral direction through the storage groove; further, when the first module and the second module are molded together, the plastic sealing groove forms a part of the cavity to be injected; In addition, the space constraint structure 2 in this embodiment includes the plastic sealing groove 2, the sealing plastic groove 2 is set opposite to the sealing plastic groove 1, and the sealing plastic groove 1 forms a cavity to be injected The other part of the body, when the first module and the second module are molded together, the plastic sealing groove 1 and the sealing plastic groove 2 define a cavity to be injected, which is beneficial to the electronic detonator module to be sealed. The plastic part is molded, so that the sealing body obtained by sealing the glue has the same profile as the cavity to be injected; further, the cavity to be injected in this embodiment is formed by the sealing molding concave located on the first module. Groove 1 and the sealing plastic groove 2 on the second module are defined, which facilitates the opening of the mold by driving the first module and the second module, thereby facilitating the demoulding of the sealed electronic detonator module.

According to an embodiment of the present invention, the receiving groove includes:

a peripheral storage part for storing the peripheral part of the substrate;

There are multiple substrate strip storage parts in an array, and the plurality of substrate strip storage parts communicate with the sealing plastic groove one and the peripheral storage part respectively, and the substrate strip storage parts are used to store the substrate strips, and the substrate strip storage part forms limit blocks on both sides along the array direction of the substrate strip storage part. After the substrate is placed in the storage groove, the peripheral part of the substrate is stored in the In the peripheral storage part, the substrate strips are respectively stored in the substrate strip storage part, and the limiting blocks respectively protrude into the through openings.

The storage groove in this embodiment includes a peripheral storage part and a substrate strip storage part, which is convenient to store the peripheral part of the substrate through the peripheral storage part, and accommodates the substrate strip through the substrate strip storage part, which is convenient for placing the substrate in the storage groove and Limiting the substrate in the circumferential direction is convenient for fixing the substrate in the circumferential direction; further, the substrate strip storage part forms limiting blocks on both sides along the array direction of the substrate strip storage part, and the substrate strips are respectively stored in In the storage part of the substrate strip, the limit blocks extend into the openings respectively, which further improves the limit of the substrate in the circumferential direction, which is beneficial to fix the substrate in the circumferential direction, and the limit block also avoids the electronic detonator module. During the sealing process, hot glue flows into the port.

According to an embodiment of the present invention, the width dimension of the plastic sealing groove 1 is larger than the width dimension of the substrate strip storage part, the substrate is placed behind the storage groove, and the outer side wall of the substrate strip Respectively contact with the inner side wall of the substrate strip storage part, the substrate strip fills the substrate strip storage part and enters the sealing plastic groove along the length direction of the substrate strip The thermal gel inside is blocked.

In this embodiment, the width of the plastic-molded groove 1 is larger than the width of the substrate strip storage part. After the substrate is placed in the storage groove, the outer sidewalls of the substrate strip are respectively in contact with the inner sidewalls of the substrate strip storage part. It is conducive to thickening the thickness of the plastic groove that flows into the sealing plastic - the inner thermal colloid is wrapped in the thickness of the part to be sealed in the electronic detonator module, which is conducive to obtaining a sealing body with a suitable thickness; further, the substrate strip fills the substrate strip storage part And block the thermal colloid that enters the sealing plastic molding groove 1 along the length direction of the substrate strip, which is beneficial to prevent the thermal colloid from flowing out of the sealing plastic molding groove 1 along the length direction of the substrate strip.

According to an embodiment of the present invention, the electronic component includes an energy storage capacitor, the substrate strip is provided with a capacitor installation groove for installing the energy storage capacitor, and the energy storage capacitor is installed in the capacitor installation groove;

The sealing mold also includes:

The capacitor positioning protrusion is connected to the inner wall of the plastic sealing groove 1 or/and the sealing plastic groove 2 and is vertical along the mold opening direction of the first module and the second module After the first module and the second module are clamped, the capacitor positioning protrusion can stop against the energy storage capacitor and position the energy storage capacitor.

The electronic detonator module sealing plastic mold structure in this embodiment includes capacitor positioning protrusions. Before the electronic detonator module is sealed, it is convenient to stop the energy storage capacitor through the capacitor positioning protrusions, and the energy storage capacitor is limited. Positioning in the capacitor installation slot is beneficial to ensure that the position of the energy storage capacitor is fixed during the process of sealing the electronic detonator module, and avoids the offset of the energy storage capacitor during the process of sealing the electronic detonator module , which is beneficial to ensure the stability of the energy storage capacitor function.

According to an embodiment of the present invention, the electronic component includes an ignition element and a connection pin, the ignition element is connected to one end of the length direction of the substrate strip, and the connection pin is connected to the length of the substrate strip. on the other side of the direction;

The first module or the second module is provided with a storage tank for accommodating the ignition element, and the first module or the second module is also provided with a storage tank for accommodating the connecting pins. tank two;

After the first module and the second module are molded together, the ignition element is inserted into and accommodated in the first storage tank, and the connecting pin is inserted into and stored in the second storage tank.

In this embodiment, the storage tank 1 and the storage tank 2 are arranged on the first module or the second module, so that after the first module and the second module are molded, the ignition element is inserted into and stored in the storage tank. Inside one, the connecting pins extend into and are stored in the storage tank two, which is beneficial to protect the ignition parts and connecting pins, and avoids the sealing of the parts to be sealed by the ignition parts and connecting pins on the electronic detonator module The impact of the process can also avoid the interference of the ignition part and the connecting pins on the clamping of the first module and the second module, which is conducive to the close contact and stop of the first module and the second module.

According to an embodiment of the present invention, the first module includes:

The first body, the receiving groove is arranged on the first body, and the first body is provided with a plurality of groove structures 1 which respectively constitute a part of the plastic-molded groove 1;

Limiting sliding block one, the first body is provided with a sliding guide channel one, the sliding guiding channel one communicates with the groove structure one, and the limit sliding block one is close to the groove structure one One end corresponding to the groove structure one is provided with a groove structure two for constituting the other part of the sealing plastic groove one, and the limit sliding block one is slidably installed in the sliding guide channel one Inside;

The limit sliding block one slides relative to the groove structure and has a first alignment matching position and a first protruding position, when the limit sliding block one is located at the first alignment matching position, the groove structure The contour of the two is aligned and matched with the contour of the groove structure one and defines the plastic molding groove one; when the limit sliding block one is located at the first protruding position, the groove structure two protruding from the groove structure one.

In this embodiment, the first body is provided with a plurality of groove structures 1, and the first body is also provided with a sliding guide channel 1, and the limiting sliding block 1 is slidably installed in the sliding guiding channel 1, and the limiting sliding One end of block 1 is provided with groove structure 2. When the limit sliding block 1 is located at the first alignment and matching position, the contour of groove structure 2 is aligned and matched with the contour of groove structure 1 to define and form a plastic-sealed groove 1. , it is convenient to shape the part to be sealed of the electronic detonator module, and the plastic sealing groove is divided into two parts: groove structure 1 and groove structure 2. The position, groove structure 2 protrudes from groove structure 1, and the limit sliding block pushes a plurality of sealed electronic detonator modules, which is convenient for separating the sealed electronic detonator modules first from groove structure 1. It is beneficial to reduce the bonding force between the sealed electronic detonator module and the sealed plastic groove 1, which is beneficial to the demoulding of the sealed electronic detonator module, and reduces the sealing of the electronic detonator mold. The deformation of the group during the demolding process.

According to an embodiment of the present invention, the second module includes:

The second body, the second body is provided with a plurality of groove structures 3 which respectively constitute a part of the plastic-molded groove 2;

Limiting sliding block 2, the second body is provided with a sliding guide channel 2, the sliding guiding channel 2 communicates with the groove structure 3, and the limiting sliding block 2 is close to the groove structure 3 One end corresponding to the groove structure 3 is provided with the groove structure 4 for constituting the other part of the sealing plastic groove 2, and the limiting sliding block 2 is slidably installed in the sliding guide channel 2 Inside, the limit sliding block 2 slides relative to the groove structure 2 to have a second alignment matching position and a second protruding position, when the limit sliding block 2 is located at the second alignment matching position, the concave The profile of the groove structure 4 is aligned and matched with the profile of the groove structure 3 and defines the plastic-molded groove 2; when the limit sliding block 2 is in the second protruding position, the groove Structure four protrudes from the groove structure three.

The second body in this embodiment is provided with a plurality of groove structures 3, and the second body is also provided with a sliding guide channel 2, and the limiting sliding block 2 is slidably installed in the sliding guiding channel 2, and the limiting sliding One end of the block 2 is provided with a groove structure 4. When the limit sliding block 2 is located at the second alignment and matching position, the contour of the groove structure 4 is aligned and matched with the contour of the groove structure 3 and forms a plastic-sealed plastic groove 2 , which is convenient for molding the part to be sealed of the electronic detonator module, and the plastic sealing groove is divided into two parts: groove structure three and groove structure four. When the limit sliding block two is located at the second protruding position , Groove structure four protrudes groove structure three, limit sliding block two pairs of multiple electronic detonator modules sealed with glue to push, it is convenient to separate the sealed electronic detonator modules first with groove structure three, which is beneficial Reduce the bonding force between the sealed electronic detonator module and the sealed plastic groove 2, which is conducive to the demoulding of the sealed electronic detonator module, and reduces the size of the sealed electronic detonator module The deformation produced during the demoulding process.

According to an embodiment of the present invention, the first module and/or the second module are further provided with a plurality of pusher guide through holes, and the plurality of pusher guide through holes can communicate with the storage cavity The plurality of guide through holes of the ejector are respectively used to install movable ejectors that can push the plurality of electronic detonator modules that have been sealed to achieve demoulding.

In this embodiment, a plurality of pusher guide through holes are also provided on the first module or/and the second module, so as to facilitate the reliable demoulding of the sealed electronic detonator module through a plurality of movable pushers , to further reduce the deformation of the sealed electronic detonator module during the demoulding process.

Description of drawings

In order to illustrate the technical solutions in the present invention more clearly, the following will briefly introduce the accompanying drawings used in the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the application. Those of ordinary skill in the art can also obtain other drawings based on these drawings without any creative effort.

Fig. 1 is the flowchart of the electronic detonator module sealing method of the embodiment of the present invention;

Fig. 2 is the structural schematic diagram of the electronic detonator module sealing plastic mold structure of the embodiment of the present invention;

Fig. 3 is a schematic structural diagram of a first module of an embodiment of the present invention;

Figure 4 is an enlarged view of the I region in Figure 3;

Fig. 5 is a structural schematic diagram of the disassembly and assembly of the limit sliding block one and the first module in Fig. 3;

Fig. 6 is a schematic structural diagram of the erected second module of the embodiment of the present invention;

Figure 7 is an enlarged view of the II region in Figure 6;

Fig. 8 is a structural schematic diagram of disassembly and assembly of the limit sliding block 2 and the second module in Fig. 6;

Fig. 9 is a schematic structural diagram of connecting wires and electronic components installed on a substrate strip to form a plurality of electronic detonator modules according to an embodiment of the present invention;

FIG. 10 is a schematic diagram of the structure of a plurality of electronic detonator modules in FIG. 9 after sealing.

Detailed ways

In order to make the purpose, technical solution and advantages of the present application clearer, the implementation manners of the present application will be further described in detail below in conjunction with the accompanying drawings.

In order to understand the above-mentioned purpose, features and advantages of the present invention more clearly, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

In the following description, many specific details are set forth in order to fully understand the present invention. However, the present invention can also be implemented in other ways different from those described here. Therefore, the protection scope of the present invention is not limited by the specific details disclosed below. EXAMPLE LIMITATIONS.

In one aspect of the present application, a method for sealing an electronic detonator module is provided, as shown in FIG. 1 , including:

Step S102, putting the substrate 3 with multiple electronic detonator modules to be sealed into the cavity of the sealing mold in the electronic detonator module sealing system, wherein the substrate 3 is provided with a plurality of substrate strips 33, a plurality of substrate strips 33 are respectively arranged with connecting wires and electronic components to form an electronic detonator module;

Step S104, closing the sealing mold, limiting the plurality of electronic detonator modules to be sealed in the cavity to be injected formed after the sealing mold is closed, and the parts to be sealed of the plurality of electronic detonator modules They are respectively located in the cavity to be injected;

Step S106, injecting thermal colloid into a plurality of cavities to be injected, the thermal colloid filling the multiple cavities to be injected and covering the part of the electronic detonator module to be sealed;

Step S108, demoulding the plurality of electronic detonator modules that have been sealed with glue.

In this embodiment, as shown in Fig. 1 and Fig. 9, in the electronic detonator module sealing method of the present embodiment, by putting the substrate 3 of a plurality of electronic detonator modules to be sealed into the electronic detonator module In the storage cavity of the sealing mold in the assembly sealing system, multiple electronic detonator modules to be sealed are connected to the substrate strip 33, and the substrate strip 33 is a part of the substrate 3, which can be realized by fixing the substrate 3. Fix multiple electronic detonator modules, thereby improving the reliability of fixing multiple electronic detonator modules, avoiding the deviation of the electronic detonator modules during the sealing process, and improving the sealing quality of the electronic detonator modules; Further, the parts to be sealed of a plurality of electronic detonator modules are respectively located in the cavity to be injected, which is convenient for putting the substrate 3 into the storage cavity, and then the parts to be sealed of the plurality of electronic detonator modules are respectively located in the cavity to be injected. In the cavity, it is beneficial to inject hot colloid into the cavity to be injected, so as to realize the sealing of the parts to be sealed of multiple electronic detonator modules; further, multiple electronic detonator modules to be sealed are connected to the substrate strip 33, in the process of demoulding the sealed electronic detonator module, it is beneficial to push the substrate 3 so that the multiple electronic detonator modules connected to the substrate 3 fall off together, and it is beneficial to reduce the sealing capacity. The deformation of the electronic detonator module completed by glue in the demoulding process further improves the sealing quality of the electronic detonator module.

In one embodiment of the present invention, as shown in FIG. 9 , before the substrate 3 with a plurality of electronic detonator modules to be sealed is put into the storage cavity of the sealing mold in the electronic detonator module sealing system , the electronic detonator module sealing method also includes: a plurality of openings 32 are arranged at intervals on the substrate 3, the plurality of openings 32 are arranged in an array along the length direction of the substrate 3, and two adjacent openings 32 are respectively formed The substrate strip 33 is respectively provided with connecting wires and electronic components on the substrate strip 33 to form an electronic detonator module.

In this embodiment, as shown in FIG. 9, a plurality of openings 32 are spaced apart on the substrate 3, and then a substrate strip 33 is formed on the substrate 3 for laying connection wires and electronic components to form an electronic detonator module. , it is convenient to arrange connecting wires and electronic components on the substrate strip 33 to form an electronic detonator module, so as to facilitate the manufacture of multiple electronic detonator modules on the substrate 3, and the substrate strip 33 that is integrally connected with the substrate 3 can be connected to many The support and fixation of each electronic detonator module is conducive to improving the reliability of the connection and fixing of multiple electronic detonator modules, avoiding the deviation of the electronic detonator module during the sealing process, and improving the sealing of the electronic detonator module. quality. In addition, the opening 32 in this embodiment is formed by laser cutting, and the opening 32 can also be formed by other methods.

In one embodiment of the present invention, the electronic detonator module sealing method further includes:

Pre-breaking lines are respectively provided at both ends of the substrate strip 33 in the length direction, and the pre-breaking lines are used to disconnect the substrate strip 33 along the pre-breaking line to obtain a plurality of sealed electronic detonator modules.

In this embodiment, the two ends of the lengthwise direction of the substrate strip 33 are respectively provided with pre-breaking lines, so that after the electronic detonator module is packaged, the substrate 3 is taken out, and the substrate strip 33 is broken off along the pre-breaking line. Then obtain the electronic detonator module with a single glue seal.

It should be noted that, in this embodiment, the specific operation of demoulding the sealed multiple electronic detonator modules can refer to the injection molding method in the field, and the electronic detonator module sealing method is performing other operations in the sealing process The steps can also refer to the prior art in this field.

In another aspect of the present application, an electronic detonator module sealing system is provided, which is used to implement the above electronic detonator module sealing method, as shown in Figures 2 to 10, the electronic detonator module sealing system includes:

base;

The sealing mold, the sealing mold includes a first module 1 and a second module 2, one of the first module 1 and the second module 2 is installed on the base, the first module 1 is provided with a space constraint structure 1, the second The side of the module 2 used for mold closing with the first module 1 is directly facing the space constraint structure 1, and the space constraint structure 2 is provided, and the side of the first module 1 and the second module 2 used for mold closing is provided with a sprue structure ; When the first module 1 and the second module 2 are closed, a storage cavity capable of accommodating the substrate 3 is defined between the space constraint structure 1 and the space constraint structure 2, and the space constraint structure 1 and the space constraint structure 2 are also defined A plurality of cavities to be injected with hot glue are formed, and the multiple cavities to be injected are respectively connected to the storage cavity, and the runner structure forms a sprue connected to the cavities to be injected, and the substrate 3 is placed in the storage cavity After the body, the parts to be sealed of the electronic detonator module are respectively located in the cavity to be injected; the thermal colloid is injected into the cavity to be injected through the runner, and the thermal colloid is filled in the cavity to be injected and the electronic detonator module is sealed. The sealing part is covered;

The driving device is installed on the base, the other of the first module 1 and the second module 2 is installed on the driving device and can move under the drive of the driving device and clamp the first module 1 and the second module 2 and mold opening;

The guide mechanism is installed on the base, the first module 1 and the second module 2 are slidably connected with the guide mechanism and can move under the guidance of the guide mechanism;

The ejector mechanism is installed on the drive device, and the ejector mechanism is used to eject the multiple electronic detonator modules that have been sealed in the cavity to be injected to realize demoulding after the first module 1 and the second module 2 are opened. ;

Injection molding machine for producing hot glue and feeding hot glue to the sprue.

In this embodiment, as shown in FIGS. 2 to 10, the sealing mold includes a first module 1 and a second module 2. When the first module 1 and the second module 2 are closed, the space on the first module 1 A storage cavity capable of accommodating the substrate 3 is defined between the first constraint structure and the second space constraint structure on the second module 2, and a plurality of injection chambers to be injected with thermal colloid are also defined between the first space constraint structure and the second space constraint structure. The glue cavity is convenient to put the substrate 3 into the storage cavity, and then the parts to be sealed of multiple electronic detonator modules are respectively located in the cavity to be injected, which is conducive to injecting hot colloid into the cavity to be injected, so as to achieve multiple The part to be sealed of the electronic detonator module is sealed; further, by fixing the substrate 3, multiple electronic detonator modules can be fixed, thereby improving the reliability of fixing multiple electronic detonator modules, and avoiding electronic The detonator module deviates during the sealing process, thereby improving the sealing quality of the electronic detonator module.

In this embodiment, the first module 1 and the second module 2 are provided with a runner structure on the side for mold closing; further, it is also possible to only set the runner structure on the first module 1 or the second module 2, it is convenient to inject hot colloid into the cavity to be injected.

In this embodiment, as shown in FIG. 9 , the substrate 3 in this embodiment has a rectangular plate structure, and the storage cavity in this embodiment has a rectangular structure. Further, the electronic detonator module sealing plastic mold structure in this embodiment can seal two groups of electronic detonator modules at the same time, and the two substrates 3 are connected to form two groups of electronic detonator modules to be sealed. Group.

Further, as shown in FIG. 9 , the substrate 3 in this embodiment includes a support plate 1 30, a support plate 2 31 and a substrate strip 33, the support plate 1 30 has a U-shaped structure, and the support plate 2 31 has a straight plate structure. The substrate strip 33 is connected between the first support plate 30 and the second support plate 31 . Further, a pre-broken line segment 311 is provided between the support plate one 30 and the support plate two 31, and the two ends connected to the support plate one 30 and the support plate two 31 of the substrate bar 33 are respectively provided with a pre-break line. After the package of the electronic detonator module is completed, take out the substrate 3, and break off the support plate 1 30 and the support plate 2 31 along the pre-broken line section 311, and then connect the support plate 30 and the support plate 30 and the support plate along the pre-broken line at both ends of the substrate strip 33. Two 31 are broken off to obtain a single electronic detonator module. Further, in this embodiment, in order to facilitate the fixing of the substrate 3 during the process of installing the electronic components on the substrate strip 33, two fixing through holes 301 are respectively provided on the left and right ends of the supporting plate 30, and the During the process of installing electronic components on the substrate strip 33 , the substrate 3 is fixed through the fixing through hole 301 by the fixing member.

Further, as shown in Figure 10, after the thermal colloid is filled in the cavity to be injected and the part to be sealed of the electronic detonator module is covered, the part to be sealed of the electronic detonator module forms a sealing body 7, and the sealing body 7 Wrapped on the outside of the substrate strip 33 and the electronic components.

In this embodiment, as shown in Figures 3 to 5, the first module 1 in this embodiment is approximately in the shape of a cuboid, and the first module 1 is provided with four vertical guide holes-10, four vertical The guide holes 10 are arranged near the four corners of the first module 1 respectively; the vertical guide holes 10 are respectively used for installing vertical guide rods; further, the second module 2 in this embodiment is also approximately in the shape of a cuboid, The second module 2 is respectively facing four vertical guide holes 10 and is provided with four vertical guide holes 3 20, and the vertical guide rod vertically passes through the vertical guide holes 10 and the vertical guide holes 3 20, vertically The straight guide bar restricts the vertical movement of the first module 1 and the second module 2, avoiding limiting the circumferential offset of the first module 1 and the second module 2; in addition, the vertical guide bar is not shown in this embodiment.

Further, as shown in Figures 3 to 5, in order to better improve the stability of the vertical movement of the first module 1 in this embodiment, a plurality of vertical guides are respectively provided at the left and right ends of the first module 1 The second hole 17 and the second vertical guide hole 17 are used to slide and fit with the vertically provided guide rod to guide the vertical movement of the first module 1, so as to facilitate the reliable mold clamping and mold opening of the first module 1.

In this embodiment, as shown in Figure 2, in order to facilitate the horizontal fixing of the first module 1 and the second module 2, a horizontal installation hole 16 is provided on the first module 1, and the horizontal installation hole 16 is arranged along the first The length direction of the module 1 is opened horizontally, and the horizontal mounting hole 16 passes through the left and right ends of the first module 1; there are two horizontal mounting holes 16 in this embodiment, and two support rods pass through the horizontal mounting hole 1 respectively. The first mounting hole 16 is convenient for connecting the first module 1 horizontally through two support rods. In addition, by setting the second module 2 with the second horizontal installation hole 26, the second horizontal installation hole 26 is opened horizontally along the length direction of the second module 2, and the second horizontal installation hole 26 passes through the left and right ends of the second module 2; Two horizontal mounting holes 26 are provided in this embodiment, and two supporting rods are used to pass through the horizontal mounting holes 26 respectively, so that the second module 2 can be connected horizontally through the two supporting rods.

It should be noted that the first module 1 and the second module 2 in this embodiment can also be arranged in other structures, and the storage cavity in this embodiment can be adaptively adjusted and designed according to the structure and size of the substrate 3 to be placed , the structure and size of the cavity to be injected in this embodiment can also be adaptively designed according to the structure and size of the sealing body 7 formed by sealing and wrapping the part to be sealed of the electronic detonator module.

In this embodiment, as shown in Fig. 3 to Fig. 5, the middle part of the front side of the first module 1 in this embodiment is provided with an avoidance groove 100 for installing and avoiding the pouring head. A gate groove 101 is provided on the front side of the position of the avoidance groove 100, and a gate groove 101 communicating with the gate groove 101 is provided on the upper side of the first module 1 facing the position of the avoidance groove 100. Runner groove one 102, the first module 1 is also provided with two transverse flow distribution grooves one 103 along the length extension direction of the receiving groove 11, and the transverse flow distribution groove one 103 communicates with the runner groove one 102, the first The module 1 is also provided with a plurality of longitudinal distribution grooves 104 at intervals along the length extension direction of the receiving groove 11. The longitudinal distribution grooves 104 are respectively connected with the horizontal distribution grooves 103, and the longitudinal distribution grooves 104 are connected with the sealing glue. There is no flow opening 105 between the molding grooves one 12, and the sealing plastic molding groove one 12 communicates with the vertical distribution groove one 104 through the circulation opening 105.

In this embodiment, as shown in Figures 6 to 8, the middle part of the front side of the second module 2 in this embodiment is provided with an avoidance groove 2 200 for installing and avoiding the pouring head. Gate groove 1 101 is provided with gate groove 2 201, and the lower side of the second module 2 facing the position of avoiding groove 2 200 is provided with runner groove 2 connected with gate groove 2 201. 202, the runner groove 2 202 is set opposite to the runner groove 1 102, and the second module 2 is also provided with two lateral diversion groove 1 103 facing the two lateral diversion grooves 203, the lateral diversion groove The second 203 is in communication with the runner groove 2 202, and the second module 2 is also respectively provided with a plurality of vertical diversion grooves 104 opposite to the first 104. Groove two 203 are connected.

Further, when the second module 2 and the first module 1 are closed, a gate is defined between the first gate groove 101 and the second gate groove 201, and the first runner groove 102 and the second runner groove 202 The main runner is defined between them, the horizontal shunt runner is defined between the first horizontal shunt groove 103 and the second horizontal shunt groove 203, and the vertical shunt runner is defined between the first vertical shunt groove 104 and the second longitudinal shunt groove 204. Therefore, the gate, the main runner, the horizontal split runner, the vertical split runner and the circulation port 105 in this embodiment constitute a runner structure. In addition, the runner structure in this embodiment can also be set in other ways, which is convenient for injecting hot glue into the cavity to be injected to realize the sealing of the part to be sealed of the electronic detonator module.

Further, as shown in FIG. 2 , in order to facilitate the installation of the pouring head in this embodiment, two pouring head clamping grooves 19 are provided on the front side of the first module 1 , and the two pouring head clamping grooves 19 are respectively Located on the left and right sides of the avoidance groove 100, the pouring head clamping groove 19 in this embodiment has a rectangular parallelepiped structure. In the connection groove 19, in order to fix the pouring head, it is convenient to fix the pouring head reliably during the process of injecting hot glue into the cavity to be injected through the pouring head.

It should be noted that the "shaping" in this embodiment refers to restricting the flow and molding shape of the hot glue, so that the hot glue cools down to form a shape that matches the contour of the cavity to be injected.

Further, the guide mechanism in this embodiment is installed on the base, and the first module 1 and the second module 2 are slidably connected with the guide mechanism and can move under the guidance of the guide mechanism; One of the first module 1 and the second module 2 is slidably connected with the guide mechanism, while the other of the first module 1 and the second module 2 is fixed. Further, the pushing mechanism in this embodiment is installed on the driving device, and the pushing mechanism can also be installed on the base, so that the multiple electronic detonator modules that have been sealed in the cavity to be injected can be conveniently sealed by the pushing mechanism. Ejection is enough to realize demoulding.

Further, the injection molding machine in this embodiment adopts low-pressure injection molding when injecting thermal colloid into the runner, so that the pressure of the cavity to be injected is suitable, and avoids the impact of the thermal colloid on the electronic detonator module during the process of sealing the electronic detonator module. The electronic components on the detonator module cause a relatively large impact, which causes loosening or displacement of the electronic components on the electronic detonator module.

In this embodiment, the guide mechanism includes a plurality of vertical guide rods, the vertical guide rods vertically pass through the first vertical guide hole 10 and the third vertical guide hole 20, and the vertical guide rods define the first module 1 and the second module 1. Movement of module 2 in the vertical direction.

It should be noted that the driving device, guiding mechanism, pushing mechanism and injection molding machine are not illustrated in this embodiment, and the specific connection and driving method of the first module 1 and the second module 2 in this embodiment can refer to the existing There is an injection mold in the art, and the operation of sealing the electronic detonator module in this embodiment can also refer to the injection molding technology in the field, and will not be repeated here. Furthermore, the above-mentioned sealing method for the electronic detonator module can also be implemented by other sealing systems.

In one embodiment of the present invention, as shown in Figure 3 and Figure 6, the space constraint structure 1 includes:

The receiving groove 11, the outline of the receiving groove 11 matches the outline of the substrate 3, and the substrate 3 can be accommodated in the receiving groove 11;

The plastic sealing groove 12 is connected with the receiving groove 11, and the plastic sealing groove 12 is used to shape the part to be sealed of the electronic detonator module;

When the first module 1 and the second module 2 are molded together, the receiving groove 11 forms a receiving cavity, and the sealing plastic groove 12 forms a part of the cavity to be injected;

Space Constraint Structure II includes:

Sealing molding groove 2 21 is set opposite to sealing plastic molding groove 1 12, and is used to shape the part to be sealed of the electronic detonator module;

After the first module 1 and the second module 2 are closed, the plastic sealing groove 2 21 forms another part of the cavity to be injected, and the sealing plastic groove 12 and the sealing plastic groove 2 21 define A cavity to be injected is formed.

In this embodiment, as shown in FIG. 3 and FIG. 6 , the space constraint structure 1 includes a storage groove 11 and a plastic molding groove 12, and the contour of the storage groove 11 is adapted to the contour of the substrate 3. After the substrate 3 is put into the storage groove 11, the substrate 3 is stored in the storage groove 11, and the substrate 3 is positioned in the peripheral direction through the storage groove 11; further, when the first module 1 and the second When the module 2 is molded, the plastic sealing groove 1 12 forms a part of the cavity to be injected; in addition, the space constraint structure 2 in this embodiment includes the sealing plastic groove 2 21, and the sealing plastic groove 21 The second 21 is set opposite to the plastic sealing groove 12, and the sealing plastic groove 12 forms another part of the cavity to be injected. When the first module 1 and the second module 2 are molded together, the sealing plastic molding Groove one 12 and sealing plastic molding groove two 21 define the cavity to be injected, which is conducive to molding the part to be sealed of the electronic detonator module, and then makes the sealing body 7 obtained by sealing the glue to be injected. The cavity has the same profile; further, the cavity to be injected in the present embodiment consists of a plastic sealing groove 12 on the first module 1 and a sealing plastic groove on the second module 2 The formation of the two 21 limits facilitates the opening of the mold by driving the first module 1 and the second module 2, thereby facilitating the demoulding of the sealed electronic detonator module.

In this embodiment, as shown in Figure 3, the substrate 3 in this embodiment has a rectangular plate structure, and the receiving groove 11 has a rectangular structure, and the receiving groove 11 can be adjusted according to the structure and size of the substrate 3 to be placed. Adaptive adjustment design; further, the plastic sealing groove-12 in the present embodiment is approximately in the shape of a semi-cylindrical cavity, and the structure of the sealing plastic groove-12 can also be placed in the electronic detonator module as required. Adaptive design is carried out for the structure and size of the sealing body 7 formed by sealing the part to be sealed.

Further, as shown in Fig. 6 to Fig. 8, the plastic sealing groove 2 21 in this embodiment is approximately in the shape of a semi-cylindrical cavity, and the structure of the sealing plastic groove 2 21 can also be changed in the electronic The structure and size of the sealing body 7 formed by sealing the part to be sealed of the detonator module is adaptively designed.

In one embodiment of the present invention, as shown in FIG. 3 , the receiving groove 11 includes:

The peripheral storage part is used to store the peripheral part of the substrate 3;

There are a plurality of substrate strip storage parts in the array, and the plurality of substrate strip storage parts are respectively connected with the sealing plastic groove 12 and the peripheral storage part. The substrate strip storage part is used to accommodate the substrate strip 33, and the substrate strip storage part is in the Limiting blocks 13 are respectively formed on both sides along the array direction of the substrate strip storage part. After the substrate 3 is placed in the storage groove 11, the peripheral part of the substrate 3 is stored in the peripheral storage part, and the substrate strips 33 are respectively stored in the substrate strip storage part. The limiting blocks 13 extend into the openings 32 respectively.

In this embodiment, as shown in FIG. 3 , the storage groove 11 includes a peripheral storage part and a substrate strip storage part, which is convenient to store the peripheral part of the substrate 3 through the peripheral storage part, and accommodates the substrate strip 33 through the substrate strip storage part, which is convenient Place the substrate 3 in the storage groove 11 and limit the position of the substrate 3 in the circumferential direction, so as to fix the substrate 3 in the circumferential direction; Limiting blocks 13 are respectively formed on both sides of the substrate strips, and the substrate strips 33 are respectively accommodated in the substrate strip accommodating parts, and the limiting blocks 13 respectively extend into the openings 32, further improving the limitation of the substrate 3 in the circumferential direction, which is beneficial to The base plate 3 is fixed in the circumferential direction, and the limit block 13 also prevents hot glue from flowing into the port 32 during the process of sealing the electronic detonator module.

In this embodiment, as shown in Figure 4 and Figure 9, the opening 32 provided on the substrate 3 in this embodiment has a rectangular structure, and correspondingly, the limiting block 13 in this embodiment is in the shape of a strip structure, the limit block 13 matches the port 32, and the limit block 13 can be snapped into the port 32.

In one embodiment of the present invention, as shown in FIG. 4, the width dimension of the sealing plastic groove 12 is larger than the width dimension of the substrate strip storage part, and the substrate 3 is placed behind the storage groove 11, and the outer side walls of the substrate strip 33 are respectively The substrate strip 33 is in contact with the inner wall of the substrate strip storage part, and the substrate strip 33 fills the substrate strip storage part and blocks the thermal glue entering the sealing plastic groove 12 along the length direction of the substrate strip 33 .

In this embodiment, as shown in FIG. 4 , the width dimension of the sealing plastic groove 12 is greater than the width dimension of the substrate strip storage part. After the substrate 3 is placed in the storage groove 11, the outer wall of the substrate strip 33 is respectively connected The inner side wall of the receiving part of the substrate strip is not in contact, which is conducive to thickening the thickness of the thermal colloid flowing into the sealing plastic groove-12, which is wrapped on the part to be sealed of the electronic detonator module, and is conducive to obtaining a suitable thickness of the sealing material 7 Further, the substrate strip 33 fills the substrate strip receiving part and blocks the thermal colloid that enters the sealing plastic groove 12 along the length direction of the substrate strip 33, which is beneficial to avoid the thermal colloid from being blocked along the substrate strip 33. The length direction of the strip 33 flows out from the sealing plastic groove 12.

One embodiment of the present invention, as shown in Fig. 6, Fig. 7 and Fig. 9, electronic component comprises energy storage capacitor 4, is provided with on the substrate bar 33 and is used for installing the capacitance installation groove of energy storage capacitor 4, and energy storage capacitor 4 is installed on Capacitor installation slot;

The sealing mold also includes:

The capacitance positioning protrusion is connected to the inner wall of the sealing plastic groove 21 and protrudes vertically along the mold opening direction of the first module 1 and the second module 2. After the first module 1 and the second module 2 are closed , the capacitor positioning protrusion can stop against the energy storage capacitor 4 and position the energy storage capacitor 4 .

In this embodiment, as shown in Fig. 6, Fig. 7 and Fig. 9, the electronic detonator module sealing plastic mold structure includes capacitor positioning protrusions, before the electronic detonator module is sealed, it is convenient to pass through the capacitor positioning protrusions. The energy storage capacitor 4 is stopped, and the energy storage capacitor 4 is limited in the capacitor installation groove to achieve positioning, which is conducive to ensuring that the position of the energy storage capacitor 4 is fixed during the process of sealing the electronic detonator module, and avoiding The energy storage capacitor 4 is offset during the process of sealing the electronic detonator module, which is beneficial to ensure the stability of the function of the energy storage capacitor 4 .

In this embodiment, as shown in FIG. 6 and FIG. 7 , in order to facilitate fixing the energy storage capacitor 4 in this embodiment, the capacitor positioning protrusion is set to include a capacitor positioning protrusion 1 213 and a capacitor positioning protrusion 2 242 , there are two capacitor positioning protrusions 1 213, and the two capacitor positioning protrusions 1 213 are respectively located on the inner side walls of the groove segment 4 211 and the groove segment 5 212 in the plastic-molded groove 21; Two protrusions 242 are provided, and the two capacitive positioning protrusions 242 are connected to the inner sidewall of the groove section six 241 of the limiting sliding block two 24 . In this embodiment, there are two capacitor positioning protrusions 1 213 and two capacitor positioning protrusions 2 242, which are convenient for fixing the energy storage capacitors 4 installed in different positions of the substrate strip 33, and improve the effect of the capacitor positioning protrusions on energy storage. Capacitor 4 defines flexibility.

Further, as shown in FIG. 6 and FIG. 7 , the structure of the capacitor positioning protrusion 1 213 and the capacitor positioning protrusion 2 242 in this embodiment are the same, and the sealing body 7 of the completed electronic detonator module is correspondingly formed with four A concave groove 70. In addition, the capacitor positioning protrusion 1 213 and the capacitor positioning protrusion 2 242 in this embodiment are both in the form of circular protrusion structures, and the capacitor positioning protrusion 1 213 and the capacitor positioning protrusion 2 242 can also be arranged in other structures, which is convenient It is sufficient to define the energy storage capacitor 4 .

Further, as shown in Fig. 6 and Fig. 7, the capacitance positioning protrusion is connected to the inner wall of the sealing plastic groove two 21, and the capacitance positioning protrusion can also be connected to the inner wall of the sealing plastic molding groove one 12 , Capacitance positioning protrusions can also be respectively connected on the inner walls of the plastic-sealed groove one 12 and the plastic-sealed groove two 21. In addition, the number of capacitor positioning protrusions can also be properly adjusted as required.

One embodiment of the present invention, as shown in Figure 6 and Figure 7, electronic component comprises ignition element 6 and connecting pin 5, and ignition element 6 is connected on one end of the length direction of substrate strip 33, and connection pin 5 is connected on the substrate On the other end of the length direction of the strip 33;

The second module 2 is provided with a storage tank 1 22 for storing the ignition element 6, and the second module 2 is also provided with a storage tank 2 23 for receiving the connecting pin 5;

After the first module 1 and the second module 2 are molded together, the ignition element 6 is inserted into and accommodated in the first storage tank 22 , and the connecting pin 5 is inserted into and stored in the second storage tank 23 .

In this embodiment, as shown in FIG. 6 and FIG. 7 , the second module 2 is provided with a receiving tank body 1 22 and a receiving tank body 2 23 , so that after the first module 1 and the second module 2 are clamped, , the ignition part 6 extends into and is accommodated in the first storage tank 22, and the connection pin 5 extends into and is accommodated in the second storage tank 23, which is beneficial to protect the ignition part 6 and the connection pin 5, and avoids ignition parts 6 and the connecting pin 5 affect the sealing process of the part to be sealed of the electronic detonator module, and can also avoid the interference between the first module 1 and the second module 2 caused by the ignition part 6 and the connecting pin 5, It is beneficial for the first module 1 and the second module 2 to close together and stop.

Further, as shown in Fig. 6 and Fig. 7, the storage tank body 1 22 and the storage tank body 2 23 in this embodiment are all arranged on the second module 2, in addition, the storage tank body 1 22 and the storage tank body can also be One or two of the body two 23 are arranged on the first module 1, which is beneficial for the ignition element 6 to extend into and be stored in the storage tank one 22, and the connecting pin 5 to extend into and be stored in the storage tank two 23. Can.

Further, as shown in Fig. 6 and Fig. 7, the ignition element 6 in this embodiment includes two connecting legs, a sealing block one and an ignition resistance wire, one end of the two connecting legs is connected to the substrate strip 33, and the ignition resistance The wire is connected between the two connecting legs and located at the other end of the connecting legs, and the sealing glue block is wrapped on the end of the connecting legs connected to the substrate strip 33 .

Further, as shown in Fig. 6 and Fig. 7, the receiving tank body 22 in this embodiment has a strip-shaped structure, and the receiving tank body 22 extends along the length direction of the second module 2, connecting the legs and the sealing block 1 and the ignition resistance wire can be accommodated in the storage tank 22; in addition, the storage tank 22 can also be arranged in other structures, so as to facilitate the storage of the ignition element 6.

Further, as shown in Figure 6 and Figure 7, there are two connection pins 5 in this embodiment, one end of the connection pin 5 is connected to the substrate strip 33, and the other end of the connection pin 5 forms a connection end, The end where the connection pin 5 is connected to the substrate strip 33 is wrapped by the second sealing compound. Further, in this embodiment, there are multiple storage tanks 23 corresponding to multiple connection pins 5 one by one, the storage tank 2 23 has a rectangular parallelepiped cavity structure, and the sealing block 2 and the connection pins 5 can be stored in the Receive in the tank body two 23. In addition, the receiving tank 2 23 can also be arranged in other structures, which is convenient for storing the connecting pins 5 .

One embodiment of the present invention, as shown in Figure 5, the first module 1 includes:

The first body, the receiving groove 11 is arranged on the first body, and the first body is provided with a plurality of groove structures 1 which respectively constitute a part of the sealing plastic groove 12;

The limit sliding block one 14, the first body is provided with a slide guide through groove one 15, the slide guide through groove one 15 communicates with the groove structure one, and the end of the limit slide block one 14 near the groove structure one corresponds to the concave Groove structure 1 is provided with groove structure 2 for constituting the other part of plastic sealing groove 12, and the limit sliding block 14 is slidably installed in the sliding guide groove 15;

The limit sliding block one 14 slides relative to the groove structure one and has a first alignment matching position and a first protruding position. When the limit sliding block one 14 is located at the first alignment matching position, the contour of the groove structure two is the same as that of the groove structure one The contours of the grooves are matched and defined to form a sealing plastic groove one 12; when the limit sliding block one 14 is located at the first protruding position, the groove structure two protrudes from the groove structure one.

In this embodiment, as shown in Figure 5, the first body is provided with a plurality of groove structures 1, and the first body is also provided with a sliding guide channel 15, and the limiting sliding block 14 is slidably installed on the sliding guide In the through groove one 15, and one end of the limiting sliding block one 14 is provided with a groove structure two, when the limiting sliding block one 14 is in the first alignment matching position, the contour of the groove structure two is the same as the contour of the groove structure one Align and match and define the sealing plastic molding groove 12, which is convenient for molding the part to be sealed of the electronic detonator module, and the sealing plastic molding groove 12 is divided into groove structure 1 and groove structure 2. For the first part, when the limit sliding block 14 is located at the first protruding position, the groove structure 2 protrudes from the groove structure 1, and the limit sliding block 14 pushes the plurality of electronic detonator modules completed by sealing, so as to facilitate the The sealed electronic detonator module is first separated from the groove structure, which is beneficial to reduce the bonding force between the sealed electronic detonator module and the sealed plastic groove 12, which is beneficial to the sealing of the electronic detonator module. The detonator module is demoulded, and the deformation of the sealed electronic detonator module during the demoulding process is reduced.

In this embodiment, as shown in Figure 2, in order to facilitate the connection of the first body in this embodiment, a plurality of connection holes for connection are provided at the lower end of the first body, the connection holes are specifically threaded holes, It is convenient to securely connect the first module 1 through screw connection.

In this embodiment, as shown in Fig. 4 and Fig. 5 , the sliding guide channel one 15 is provided in the middle part of the first body, the limiting sliding block one 14 is installed behind the sliding guiding channel one 15, and the limiting sliding block one 14 is located in the middle of the first body; groove structure one includes groove section one 121 and groove section two 122, groove structure two includes groove section three 141, and limit sliding block one 14 is installed in sliding guide channel one 15 And after the first alignment and matching position, the third groove segment 141 is located between the first groove segment 121 and the second groove segment 122, and the first groove segment 121, the second groove segment 122 and the third groove segment 141 jointly define and form Seal plastic molding groove-12.

In this embodiment, as shown in FIG. 4 and FIG. 5 , the sliding guide slot 15 is set in the middle of the first body, and the two sides of the groove segment 121 on the first body are respectively provided with a convex segment 131 , the two sides of the groove section 122 on the first body are respectively provided with the projection section 2 132, and the both sides of the groove section 141 on the limit sliding block 14 are respectively provided with the projection section 3 142, and the limit After the sliding block one 14 is installed in the sliding guide channel one 15 and is positioned at the first alignment and matching position, the third bump segment 142 is located between the first bump segment 131 and the second bump segment 132, and the first bump segment 131, the bump segment The second segment 132 and the third bump segment 142 are arranged in sequence to form the limiting block 13 .

In this embodiment, in order to facilitate the connection between the limit sliding block 14 and the driving structure, a plurality of connection hole structures for connection are provided at the lower end of the limit sliding block 14; further, as shown in Figure 5 Shown, the sliding guide slot 15 in the present embodiment has a rectangular parallelepiped cavity structure, and the limiting sliding block 14 has a rectangular parallelepiped structure. In addition, the sliding guiding slot 15 and the limiting sliding block 14 can also set to other configurations.

One embodiment of the present invention, as shown in Figure 8, the second module 2 includes:

The second body, the second body is provided with a plurality of groove structures three respectively constituting a part of the sealing plastic groove two 21 at intervals;

Limiting sliding block two 24, the second body is provided with sliding guide through groove two 25, sliding guiding through groove two 25 communicates with groove structure three, and one end of limit sliding block two 24 near groove structure three corresponds to the concave Groove structure 3 is provided with groove structure 4 for constituting the other part of plastic-sealed groove 2 21 , the limiting sliding block 2 24 is slidably installed in the sliding guide channel 2 25 , and the limiting sliding block 2 24 is opposite to the groove Structure 2 slides with a second alignment and matching position and a second protruding position. When the limit sliding block 2 24 is located at the second alignment and matching position, the contour of the groove structure 4 is aligned and matched with the contour of the groove structure 3 to form a sealant Plastic groove 2 21; when the limit sliding block 2 24 is located at the second protruding position, groove structure 4 protrudes from groove structure 3.

In this embodiment, as shown in Figure 8, the second body is provided with a plurality of groove structures 3, and the second body is also provided with a sliding guide channel 2 25, and the limiting sliding block 2 24 is slidably installed on the sliding guide In the through groove two 25, and one end on the limit sliding block two 24 is provided with a groove structure four, when the limit slide block two 24 is in the second alignment matching position, the outline of the groove structure four is the same as the outline of the groove structure three Align and match and define the plastic sealing groove 2 21, which is convenient for molding the part to be sealed in the electronic detonator module, and the sealing plastic groove 2 2 is divided into groove structure 3 and groove structure 4 For the first part, when the limit sliding block 2 24 is located at the second protruding position, the groove structure 4 protrudes from the groove structure 3, and the limit sliding block 2 24 pushes the plurality of electronic detonator modules completed by sealing, so as to facilitate the The sealed electronic detonator module is firstly separated from the groove structure three, which is beneficial to reduce the bonding force between the sealed electronic detonator module and the sealed plastic groove 21, which is beneficial to the sealing of the electronic detonator module. The detonator module is demoulded, and the deformation of the sealed electronic detonator module during the demoulding process is reduced.

In this embodiment, as shown in Fig. 2 and Fig. 6, in order to facilitate the connection between the second body and the driving structure in this embodiment, a plurality of connecting holes 29 for connection are provided on the upper end of the second body The connection hole 1 29 is specifically a threaded hole and is used for threaded connection with the driving structure, so as to facilitate the fixed connection of the second module 2 .

In this embodiment, as shown in FIG. 7 and FIG. 8 , the sliding guide slot 2 25 in this embodiment is set in the middle of the second body, and the limit sliding block 2 24 is installed behind the sliding guide slot 2 25 . Limiting sliding block two 24 is located in the middle of the second body; groove structure three in this embodiment includes groove segment four 211 and groove segment five 212, groove structure four includes groove segment six 241, and the limit sliding block The second 24 is installed on the sliding guide channel two 25 and is positioned at the second alignment matching position, the groove segment six 241 is located between the groove segment four 211 and the groove segment five 212, and the groove segment four 211 and the groove segment five 212 and the groove section six 241 jointly define and form the plastic sealing groove two 21 .

In this embodiment, as shown in Fig. 7 and Fig. 8, in order to facilitate the connection of the limit sliding block 24 with the driving structure in this embodiment, a plurality of The second connection hole 243 is connected, and the second connection hole 243 is specifically a threaded hole and is used for threaded connection with the driving structure, so as to facilitate the fixed connection of the limit sliding block two 24; further, as shown in Figure 8, the sliding block in this embodiment The second guiding channel 25 is a cuboid cavity structure, and the second limiting sliding block 24 is a rectangular parallelepiped structure. In addition, the second sliding guiding channel 25 and the second limiting sliding block 24 can also be set to other structures as required.

In one embodiment of the present invention, as shown in Figure 2 and Figure 3, the first module 1 and the second module 2 are also provided with a plurality of pusher guide through holes, and the plurality of pusher guide through holes can be connected with the storage cavity The body is connected, and the guide through holes of a plurality of ejectors are respectively used to install movable ejectors that can push the multiple electronic detonator modules that have been sealed to achieve demoulding.

In this embodiment, as shown in Fig. 2 and Fig. 3, a plurality of pusher guide through holes are provided on the first module 1 and the second module 2, so as to facilitate sealing by a plurality of movable pusher pieces. The electronic detonator module completed with glue is reliably demoulded, further reducing the deformation of the electronic detonator module completed with glue sealing during the demoulding process.

In this embodiment, as shown in FIG. 3 , in this embodiment, the first module 1 is provided with a push piece guide through hole including a push piece guide through hole 18, and the push piece guide through hole 18 is along the receiving recess. The coverage of the groove 11 is arranged at intervals; specifically, in this embodiment, two rows of pusher guide through holes 18 are provided on the front side and the rear side of the receiving groove 11, and the left and right sides of the receiving groove 11 are also arranged. There are two rows of push piece guide through holes 18 on the side, which are conducive to applying a uniform upward thrust to the sealed electronic detonator module through the push pieces respectively passing through the push piece guide through holes, so as to realize the completion of the seal. The electronic detonator module is demolded from the first module 1, and the pusher in this embodiment is specifically a thimble.

Further, as shown in Fig. 2 and Fig. 6, in this embodiment, the second module 2 is provided with pusher guide through holes including pusher guide through hole two 27 and pusher guide through hole three 28, the pusher Pieces guiding through holes three 28 are arranged at intervals along the coverage of the receiving cavity; specifically, the push piece guiding through holes two 27 and the pushing pushing piece guiding through holes three 28 in this embodiment are respectively provided with two rows; Through the pushing piece passing through the push piece guiding through hole 2 and the pushing piece guiding through hole 3 respectively, a uniform downward thrust is applied to the sealed electronic detonator module to realize the sealing of the sealed electronic detonator module from the second Demoulding on module 2. In addition, in this embodiment, the guide through holes of the pusher can be arranged in various ways, so as to facilitate the demoulding of the sealed electronic detonator module from the first module 1 and the second module 2 .

Further, in order to simplify the mold structure in this embodiment, a plurality of pusher guide through holes may only be provided on the first module 1 or the second module 2, so as to facilitate the removal of the sealed electronic detonator module. Just make a mold.

In addition, in addition to the technical solutions disclosed in this embodiment, reference can be made to conventional technical solutions in the technical field for the structure of the drive device, energy storage capacitor 4, injection molding machine and its working principle in the present invention, and these conventional technical solutions are also It is not the focus of the present invention, and the present invention is not stated in detail here.

In the present invention, the term "plurality" refers to two or more, unless otherwise clearly defined. The terms "installation", "connection", "connection", "fixed" and other terms should be interpreted in a broad sense, for example, "connection" can be fixed connection, detachable connection, or integral connection; "connection" can be directly or indirectly through an intermediary. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear" etc. is based on the orientation or positional relationship shown in the drawings, and is only for convenience The present application and simplified description are described without indicating or implying that the referred device or unit must have a specific orientation, be constructed and operate in a specific orientation, and therefore, should not be construed as limiting the present application.

In the description of this specification, descriptions of the terms "one embodiment", "some embodiments", "specific embodiments" and the like mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in this application In at least one embodiment or example of . In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above are only preferred embodiments of the present application, and are not intended to limit the present application. For those skilled in the art, there may be various modifications and changes in the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of this application shall be included within the protection scope of this application.

Claims (12)

1. An electronic detonator module sealing method, is characterized in that, comprises: Put the substrates of a plurality of electronic detonator modules to be sealed into the storage cavity of the sealing mold in the electronic detonator module sealing system, wherein the substrate is provided with a plurality of substrate strips, and a plurality of Connecting wires and electronic components are respectively arranged on the substrate strip to form the electronic detonator module; Closing the sealing mold, limiting the plurality of electronic detonator modules to be sealed in the cavity to be injected after the sealing mold is closed, and the plurality of electronic detonator modules The parts to be sealed are respectively located in the cavities to be injected; Injecting thermal colloid into the plurality of cavities to be injected, the thermal colloid filling in the plurality of cavities to be injected and covering the parts to be sealed of the electronic detonator module; Demoulding the plurality of electronic detonator modules that have been sealed with glue. 2. The electronic detonator module sealing method according to claim 1, characterized in that, putting the substrates of a plurality of electronic detonator modules to be sealed into the electronic detonator module sealing system Before the storage cavity of the sealing mold, the electronic detonator module sealing method also includes: A plurality of through ports are arranged at intervals on the substrate, and the plurality of through ports are arranged in an array along the length direction of the substrate, and the substrate strips are respectively formed between two adjacent through ports, and respectively in the Connecting wires and electronic components are arranged on the substrate strip to form the electronic detonator module. 3. The electronic detonator module sealing method according to claim 2, characterized in that, the electronic detonator module sealing method further comprises: Pre-broken lines are respectively provided at both ends of the substrate strip in the length direction, and the pre-broken lines are used to disconnect the substrate strip along the pre-broken line to obtain a plurality of sealed electronic detonator molds. Group. 4. An electronic detonator module sealing system, used to implement the electronic detonator module sealing method described in any one of the above 1 to 3, characterized in that, the electronic detonator module sealing system includes: base; The sealing mold, the sealing mold includes a first module and a second module, one of the first module and the second module is installed on the base, and the first module is provided with Space constraint structure 1, the side of the second module used to mold with the first module is provided with space constraint structure 2, the first module or/and the first module A runner structure is provided on the side of the two modules for mold closing; when the first module and the second module are mold-closed, the space constraint structure 1 and the space constraint structure 2 are defined to form a The receiving cavity for storing the substrate, the space constraining structure 1 and the space constraining structure 2 also define a plurality of cavities to be injected with the hot glue, and a plurality of the The cavities to be injected are respectively communicated with the storage cavities, the runner structure forms a runner connected to the cavities to be injected, and the substrate is placed behind the storage cavities, the electronic detonator The parts to be sealed of the module are respectively located in the cavity to be injected; the thermal colloid is injected into the cavity to be injected through the runner, and the thermal colloid is filled in the cavity to be injected and Wrapping the part to be sealed with the electronic detonator module; a drive device installed on the base, the other of the first module and the second module is mounted on the drive device and can move under the drive of the drive device and move the first The module is mold-closed and mold-opened with the second module; a guide mechanism installed on the base, the first module or/and the second module are slidably connected to the guide mechanism and can move under the guidance of the guide mechanism; A pushing mechanism, installed on the base or the driving device, the pushing mechanism is used to seal the glue in the cavity to be injected after the first module and the second module are opened. A plurality of completed electronic detonator modules are ejected to realize demoulding; An injection molding machine is used for producing the hot glue and inputting the hot glue into the sprue. 5. The electronic detonator module sealing system according to claim 4, characterized in that the space constraint structure one comprises: a storage groove, the profile of the storage groove matches the profile of the substrate, and the substrate can be stored in the storage groove; A plastic sealing groove one communicates with the receiving groove, and the plastic sealing groove one is used to shape the part to be sealed of the electronic detonator module; When the first module and the second module are molded together, the receiving groove forms the receiving cavity, and the sealing molding groove forms a part of the cavity to be injected; The space constraint structure two includes: Sealing molding groove 2 is set opposite to the sealing molding groove 1, and is used to shape the part to be sealed of the electronic detonator module; After the first module and the second module are molded together, the plastic sealing groove 2 forms another part of the cavity to be injected, and the sealing plastic groove 1 and the sealing groove 1 The plastic groove two defines the cavity to be injected. 6. The electronic detonator module sealing system according to claim 5, wherein the receiving groove comprises: a peripheral storage part for storing the peripheral part of the substrate; There are multiple substrate strip storage parts in an array, and the plurality of substrate strip storage parts communicate with the sealing plastic groove one and the peripheral storage part respectively, and the substrate strip storage parts are used to store the substrate strips, and the substrate strip storage part forms limit blocks on both sides along the array direction of the substrate strip storage part. After the substrate is placed in the storage groove, the peripheral part of the substrate is stored in the In the peripheral storage part, the substrate strips are respectively stored in the substrate strip storage part, and the limiting blocks respectively protrude into the through openings. 7. The electronic detonator module sealing system according to claim 6, characterized in that, the width dimension of the plastic sealing groove 1 is larger than the width dimension of the substrate bar storage part, and the substrate is placed on the After the accommodating groove, the outer sidewalls of the substrate strips are in contact with the inner sidewalls of the substrate strip storage parts, and the substrate strips fill the substrate strip storage parts and move along the length of the substrate strips. direction to block the thermal colloid that enters the sealing plastic groove one. 8. The electronic detonator module sealing system according to claim 4, wherein the electronic component includes an energy storage capacitor, and the substrate strip is provided with a capacitor installation groove for installing the energy storage capacitor, so The energy storage capacitor is installed in the capacitor installation groove; The sealing mold also includes: The capacitor positioning protrusion is connected to the inner wall of the plastic sealing groove 1 or/and the sealing plastic groove 2 and is vertical along the mold opening direction of the first module and the second module After the first module and the second module are clamped, the capacitor positioning protrusion can stop against the energy storage capacitor and position the energy storage capacitor. 9. The electronic detonator module sealing system according to claim 4, wherein the electronic component includes an ignition element and a connecting pin, and the ignition element is connected to one end of the length direction of the substrate strip, The connection pins are connected to the other end of the substrate strip in the length direction; The first module or the second module is provided with a storage tank for accommodating the ignition element, and the first module or the second module is also provided with a storage tank for accommodating the connecting pins. tank two; After the first module and the second module are molded together, the ignition element is inserted into and accommodated in the first storage tank, and the connecting pin is inserted into and stored in the second storage tank. 10. The electronic detonator module sealing system according to claim 4, wherein the first module comprises: The first body, the receiving groove is arranged on the first body, and the first body is provided with a plurality of groove structures 1 which respectively constitute a part of the plastic-molded groove 1; Limiting sliding block one, the first body is provided with a sliding guide channel one, the sliding guiding channel one communicates with the groove structure one, and the limit sliding block one is close to the groove structure one One end corresponding to the groove structure one is provided with a groove structure two for constituting the other part of the sealing plastic groove one, and the limit sliding block one is slidably installed in the sliding guide channel one Inside; The limit sliding block one slides relative to the groove structure and has a first alignment matching position and a first protruding position, when the limit sliding block one is located at the first alignment matching position, the groove structure The contour of the two is aligned and matched with the contour of the groove structure one and defines the plastic molding groove one; when the limit sliding block one is located at the first protruding position, the groove structure two protruding from the groove structure one. 11. The electronic detonator module sealing system according to claim 4, wherein the second module comprises: The second body, the second body is provided with a plurality of groove structures 3 which respectively constitute a part of the plastic-molded groove 2; Limiting sliding block 2, the second body is provided with a sliding guide channel 2, the sliding guiding channel 2 communicates with the groove structure 3, and the limiting sliding block 2 is close to the groove structure 3 One end corresponding to the groove structure 3 is provided with the groove structure 4 for constituting the other part of the sealing plastic groove 2, and the limiting sliding block 2 is slidably installed in the sliding guide channel 2 Inside, the limit sliding block 2 slides relative to the groove structure 2 to have a second alignment matching position and a second protruding position, when the limit sliding block 2 is located at the second alignment matching position, the concave The profile of the groove structure 4 is aligned and matched with the profile of the groove structure 3 and defines the plastic-molded groove 2; when the limit sliding block 2 is in the second protruding position, the groove Structure four protrudes from the groove structure three. 12. The electronic detonator module sealing system according to any one of claims 4 to 11, characterized in that, the first module or/and the second module are also provided with a plurality of pusher guide passages A plurality of pusher guide through holes can communicate with the storage cavity, and a plurality of pusher guide through holes are respectively used to install and push a plurality of electronic detonator modules that have been sealed. A movable ejector for demoulding.

Images