CN116230601A - Plasma deglue device for semiconductor wafer manufacturing - Google Patents

Abstract

The application discloses plasma photoresist removing device for semiconductor wafer manufacturing, include plasma photoresist removing unit and get pay-off unit, plasma photoresist removing unit includes box and hatch door, have the working chamber in the box, have workstation and movable carrier in the working chamber, the workstation is connected with upper base plate and lower base plate, form the business turn over material recess between upper base plate and the lower base plate, movable carrier includes arc, lower arc and a plurality of connection upper arc and lower arc can be embedded go up spacing recess and lower spacing recess's connection montant, upper arc department has a plurality of upper bearing lugs, lower arc department has a plurality of lower bearing lugs, the lower base plate is connected with the arc mounting panel through the connecting plate, a plurality of first elevator motor are installed to arc mounting panel department, and every first elevator motor drive has a first lead screw, the junction have with first lead screw complex screw thread passageway. The photoresist removing unit has high photoresist removing efficiency.

Description

Plasma deglue device for semiconductor wafer manufacturing

technical field

The present application relates to the field of wafer manufacturing, in particular to a plasma deglue device for semiconductor wafer manufacturing.

Background technique

Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its raw material is silicon. Through the production of polysilicon, monocrystalline silicon, silicon ingots are ground, polished, and sliced to form silicon wafers, that is, wafers. Wafers are the basis for manufacturing chips. From wafers to chips, complex production processes are required, such as cleaning, uniform glue, photolithography, development, glue removal, doping and other steps, and these steps need to be repeated dozens of times. Therefore, the production cycle of a wafer is long, so the length of each step will be repeated dozens of times, which will greatly affect the overall production efficiency of the chip. Wafer degumming is one of the important steps. The existing degumming methods generally include wet degumming and dry degumming. Among them, plasma degumming will cost a certain amount of time because it involves wafer handling and degumming operations. The duration is tens of seconds or even hundreds of seconds. The existing handling method is generally to transport the wafer that has been deglued to the storage rack, and then transport a new wafer from the storage rack into the plasma deglue device. , one out and one in, due to the two-step operation, the overall length of the deglue operation is lengthened, and it takes longer to complete the deglue operation on the wafers in the entire storage rack.

Contents of the invention

Purpose of the invention: In order to improve the overall degumming efficiency of the wafer, the present application provides a plasma degumming device for manufacturing semiconductor wafers.

Technical solution: A plasma degumming device for semiconductor wafer manufacturing, including a plasma degumming unit and a feeding unit, the plasma degumming unit includes a box body and a hatch, the box body has a working chamber, and the working chamber There is a workbench and a movable carrier inside. The workbench is connected with an upper base plate and a lower base plate. An inlet and outlet groove is formed between the upper base plate and the lower base plate. The upper base plate has an upper circular groove and a The upper connecting groove connected by the circular groove, there are a plurality of upper limit grooves on the circumferential surface of the upper circular groove, and the lower base plate has a lower circular groove and a lower connecting groove connected with the lower circular groove , the circumferential surface of the lower circular groove has a plurality of lower limit grooves, and the movable carrier includes an upper arc-shaped plate, a lower arc-shaped plate, and a plurality of connecting plates that can connect the upper arc-shaped plate and the lower arc-shaped plate The connecting vertical bar embedded in the upper limit groove and the lower limit groove, the upper arc-shaped plate has a plurality of upper bearing protrusions, the lower arc-shaped plate has a plurality of lower bearing protrusions, and the lower arc-shaped plate has a plurality of lower bearing protrusions. The substrate is connected to an arc-shaped mounting plate through a connecting plate, and a plurality of first lifting motors are installed on the arc-shaped mounting plate, and each first lifting motor drives a first screw rod, and the connecting vertical rod has a Describe the threaded channel that the first lead screw fits.

Further, each connecting vertical bar is embedded in one of the upper limiting grooves and one of the lower limiting grooves.

Further, the number of the first lifting motor and the connecting vertical rod is three, and the connecting vertical rod in the middle is 60 degrees different from the other two connecting vertical rods.

Therefore, the connecting vertical bar can ensure the stable movement of the movable carrier up and down, and the layout of the three connecting vertical plates does not hinder the entry and exit of the wafer.

Further, the fetching and feeding unit includes an installation base, an installation seat fixed on the installation base, a first rotating arm installed on the installation seat, a second rotating arm installed on the first rotating arm, a second rotating arm installed on the second rotating arm The third rotating arm and the mounting cylinder fixed to the third rotating arm, two conveying plates are installed in the mounting cylinder, the mounting base has a first rotating motor capable of driving the first rotating arm to rotate, the first A second rotating motor capable of driving the second rotating arm to rotate is installed on the first rotating arm, and a third rotating motor capable of driving the third rotating arm to rotate is installed on the second rotating arm.

Therefore, through the arrangement of the first, second, and third rotating arms, greater flexibility can be obtained in wafer handling.

Further, the installation cylinder includes a top plate, a bottom plate, and a circumferential plate connecting the top plate and the bottom plate. There is a vertical through groove at the circumferential plate, and a plurality of vertical guide rods are connected between the top plate and the bottom plate. The installation A second lifting motor is installed on the top of the barrel, a bearing is installed on the bottom end, a second screw is installed between the second lifting motor and the bearing, and there are two external threads with opposite helical directions at the second screw. One said carrying plate is installed at each external thread, and said carrying plate has threaded holes and a plurality of limit guide holes matched with vertical guide rods.

Further, two deflection drive units are installed on the installation cylinder, and the deflection drive unit includes a drive abutment block and a connecting frame connecting the circumferential plate of the installation cylinder and the drive abutment block, and the drive abutment block It includes a lower abutment block, an upper abutment block fixedly connected with the connecting frame and a connecting abutment block connecting the lower abutment block and the upper abutment block, the lower abutment block has a lower abutment arc surface, and the upper abutment block The abutting block has an upper abutting arc surface; the carrying plate includes a lifting plate with the threaded hole and the limiting guide hole and a rotating plate hinged with the lifting plate through an elastic reset hinge part, and the lifting plate It has a first abutting surface and an insertion groove communicating with the first abutting surface, the insertion groove can allow the lower abutting block to be inserted, and the rotating plate has a second abutting surface capable of abutting against the first abutting surface. Two abutment surfaces; when the lower abutment block is inserted into the insertion groove and the lower abutment arc abuts against the second abutment surface, the first abutment surface abuts the second abutment surface; when the upper abutment arc abuts against the second abutment surface; When the connecting block is inserted into the insertion groove and the upper abutting arc surface abuts against the second abutting surface, the first abutting surface and the second abutting surface are perpendicular.

Further, when there is no external force, the first abutting surface abuts the second abutting surface, and the first abutting surface is at 45 degrees to the length direction of the rotating plate; the fetching and feeding unit can be in the first feeding state and In the second feeding state, in the first feeding state, the second abutting surface of the rotating plate of the upper conveying plate abuts against the upper abutting arc surface of the driving abutting block above, and the second abutting surface of the lower conveying plate Abut against the first abutment surface; in the second feeding state, the second abutment surface of the lower conveying plate abuts against the upper abutment arc surface of the lower driving abutment block, and the second abutment of the upper conveying plate The surface abuts against the first abutment surface.

Further, there are 3 vertical guide rods inside the installation cylinder, and 3 position-limiting guide holes are provided at each carrying plate.

Further, the three vertical guide rods are equally spaced in a ring, so as to obtain a more stable lifting operation of the two transport plates.

Further, the hatch door is an electric door, and the hatch door and the box are hinged; the box body has a control panel and a display unit, the hatch door has an observation window, and electrodes are installed in the box, so The box body is connected with a ventilation system.

Thus the motor is used to generate plasma, and the gas exchange system is used to evacuate and inject argon.

Further, the connecting abutment block has a transitional abutment surface.

Therefore, the second abutment surface can abut against the upper abutment arc surface through the transition abutment surface from the abutment lower abutment arc surface.

Further, the rotating plate includes a ring plate and a strip plate connected with the ring plate.

Further, the second abutting surface is located at the strip plate.

Beneficial effects: the deglue device of the present application, as shown in the figure, can realize the two-step operation of feeding in the unremoved wafer and taking out the degummed wafer, so that the operation efficiency is higher.

Moreover, although two transport plates are provided, when the wafers that have been deglued are sent into the storage rack, one of the transport plates can be rotated, so as not to hinder the feeding of the wafers that have been deglued.

Description of drawings

Fig. 1A is a schematic diagram of a first angle of a glue removing device;

Fig. 1B is a schematic diagram of a second angle of the glue removal device;

Figure 2 is a schematic diagram of the position of the movable carrier during the degumming operation;

FIG. 3A is a schematic diagram of the transport plate not entering the box when the lower carrying bump is used to carry the glue-removed wafer;

FIG. 3B is a schematic diagram of the transport plate entering the box when the lower carrying bump is used to carry the deglue wafer;

3C is a schematic diagram of placing a new wafer on the upper carrying bump and removing the wafer at the lower carrying bump when the lower carrying bump is used to carry the glue-removed wafer;

FIG. 3D is a schematic diagram of the removal of the transport plate when the lower carrying bump is used to carry the deglue wafer;

FIG. 3E is a schematic diagram of the transfer board sending the deglued wafer into the storage rack when the lower carrying bump is used to carry the deglue wafer;

FIG. 4A is a schematic diagram of the transport plate not entering the box when the upper carrying bump is used to carry the deglue wafer;

FIG. 4B is a schematic diagram of the transport plate entering the box when the upper carrying bump is used to carry the deglue wafer;

FIG. 4C is a schematic diagram of placing a new wafer on the upper carrying bump and removing the wafer at the lower carrying bump when the upper carrying bump is used to carry the glue-removed wafer;

FIG. 4D is a schematic diagram of the removal of the transport plate when the upper carrying bump is used to carry the glue-removed wafer;

FIG. 4E is a schematic diagram of the transfer board sending the deglued wafer into the storage rack when the upper carrying bump is used to carry the deglue wafer;

Wherein, in FIGS. 3A-4E , for clarity of illustration, only the workbench and the movable carrier are shown in the glue removal unit.

Detailed ways

Reference signs: 1 installation base; 1.1 mounting seat; 1.2 first rotating arm; 1.3 second rotating arm; 1.4 third rotating arm; 1.5 installation cylinder; 1.5.1 second lifting motor; ; 1.5.3 Limit guide rod; 1.6 Connecting frame; 1.7 Drive abutment block; 1.7.1 Upper abutment block; 1.7.2 Lower abutment block; The first abutment surface; 1.8.2 insertion groove; 1.9 rotating plate; 1.9.1 second abutment surface; 1.9.2 ring plate;

2 Chassis; 2.1 Cabin door; 2.2 Observation window; 2.3 Display unit; 2.4 Control panel;

3 workbench; 3.1 upper base plate; 3.1.1 upper circular groove; 3.1.2 upper connecting groove; 3.2 lower base plate; 3.2.1 lower circular groove; 3.2.2 lower connecting groove; 3.3 upper arc 3.3.1 Upper bearing bump; 3.4 Lower arc plate; 3.4.1 Lower arc bump; 3.5 Connecting vertical bar; 3.6 Arc mounting plate; 3.6.1 Connecting plate; 3.6.3 The first screw rod;

5 wafers.

Below in conjunction with the accompanying drawings for specific description: a semiconductor wafer manufacturing plasma degumming device, including a plasma degumming unit and a feeding unit, the plasma degumming unit includes a box 2 and a door 2.1, the box 2 There is a working chamber inside, and the working chamber has a workbench 3 and a movable carrier. The workbench 3 is connected with an upper substrate 3.1 and a lower substrate 3.2, and an inlet and outlet groove is formed between the upper substrate 3.1 and the lower substrate 3.2. , the upper substrate 3.1 has an upper circular groove 3.1.1 and an upper connecting groove 3.1.2 communicating with the upper circular groove 3.1.1, and the circumferential surface of the upper circular groove 3.1.1 has a plurality of The upper limit groove, the lower base plate 3.2 has a lower circular groove 3.2.1 and a lower connection groove 3.2.2 communicating with the lower circular groove 3.2.1, the lower circular groove 3.2.1 There are a plurality of lower limit grooves on the circumferential surface, and the movable carrier includes an upper arc-shaped plate 3.3, a lower arc-shaped plate 3.4, and a plurality of connecting vertical bars 3.5 connecting the upper arc-shaped plate 3.3 and the lower arc-shaped plate 3.4, so The upper arc-shaped plate 3.3 has a plurality of upper bearing protrusions 3.3.1, the lower arc-shaped plate 3.4 has a plurality of lower bearing protrusions 3.4.1, and the lower base plate 3.2 is connected with a connecting plate 3.6.1 Arc mounting plate 3.6, a plurality of first lifting motors 3.6.2 are installed at the arc mounting plate 3.6, each first lifting motor 3.6.2 drives a first screw rod 3.6.3, and the connecting vertical The rod 3.5 has a threaded channel that cooperates with the first screw rod 3.6.3. The number of the first lifting motor 3.6.2 and the connecting vertical rod 3.5 is three, and the connecting vertical rod 3.5 located in the middle and the other two connecting vertical rods 3.5 all have a difference of 60 degrees.

The feeding unit includes an installation base 1, an installation base 1.1 fixed on the installation base 1, a first rotating arm 1.2 installed on the installation base 1.1, a second rotating arm 1.3 installed on the first rotating arm 1.2, and a second rotating arm 1.3 installed on the The third rotating arm 1.4 of the second rotating arm 1.3 and the installation tube 1.5 fixed to the third rotating arm 1.4, two transport plates are installed in the installation tube 1.5, and the installation seat 1.1 has a 1.2 The first rotating motor that rotates, the first rotating arm 1.2 is equipped with a second rotating motor that can drive the second rotating arm 1.3 to rotate, and the second rotating arm 1.3 is equipped with a motor that can drive the third rotating arm 1.3 to rotate the third rotating motor. The installation cylinder 1.5 includes a top plate, a bottom plate, and a circumferential plate connecting the top plate and the bottom plate. The circumferential plate has a vertical through groove, and a plurality of vertical guide rods 1.5.3 are connected between the top plate and the bottom plate. The top of the installation cylinder is equipped with a second lifting motor 1.5.1, and the bottom end is equipped with a bearing. A second screw rod 1.5.2 is installed between the second lifting motor 1.5.1 and the bearing. The second screw rod 1.5 .2 has two external threads with opposite helical directions, and each external thread is equipped with one of the carrying plates, and the carrying plate has threaded holes and a plurality of limit guide holes that cooperate with the vertical guide rod 1.5.3 . Two deflection drive units are installed at the installation cylinder 1.5, and the deflection drive unit includes a drive abutment block 1.7 and a connecting frame 1.6 connecting the circumferential plate of the installation cylinder 1.5 and the drive abutment block 1.7. The connection block 1.7 includes a lower abutment block 1.7.2, an upper abutment block 1.7.1 fixedly connected with the connecting frame 1.6, and a connecting abutment block 1.7 connecting the lower abutment block 1.7.2 and the upper abutment block 1.7.1. 3. The lower abutment block 1.7.2 has a lower abutment arc surface, and the upper abutment block 1.7.1 has an upper abutment arc surface; The lifting plate 1.8 of the guide hole and the rotating plate 1.9 hinged with the lifting plate 1.8 through an elastic reset hinge part, the lifting plate 1.8 has a first abutting surface 1.8.1 and a connection with the first abutting surface 1.8.1 The insertion groove 1.8.2 can allow the lower abutment 1.7.2 to be inserted, and the rotating plate 1.9 has a second abutment capable of abutting against the first abutment surface 1.8.1 Joint surface 1.9.1; when the lower abutment block 1.7.2 is inserted into the insertion groove 1.8.2 and the lower abutment arc surface abuts the second abutment surface 1.9.1, the first abutment surface 1.8 .1 abut against the second abutment surface 1.9.1; when the upper abutment block 1.7.1 is inserted into the insertion groove 1.8.2 and the upper abutment arc surface abuts against the second abutment surface 1.9.1, The first abutting surface 1.8.1 and the second abutting surface 1.9.1 are perpendicular. When there is no external force, the first abutting surface 1.8.1 abuts the second abutting surface 1.9.1, and the length direction of the first abutting surface 1.8.1 and the rotating plate 1.9 is 45 degrees; the feeding unit Can be in the first feeding state and the second feeding state, in the first feeding state, the second abutment surface 1.9.1 of the rotating plate 1.9 of the upper conveying plate abuts against the upper abutment arc of the upper driving abutment block 1.7 surface, the second abutting surface 1.9.1 of the lower conveying plate abuts against the first abutting surface 1.8.1; in the second feeding state, the second abutting surface 1.9.1 of the lower conveying plate abuts against the lower The upper abutment arc surface of the driving abutment block 1.7, the second abutment surface 1.9.1 of the upper conveying plate abuts the first abutment surface 1.8.1.

There are three vertical guide rods 1.5.3 inside the installation cylinder 1.5, and three position-limiting guide holes are provided at each carrying plate. The hatch door 2.1 is an electric door, and the hatch door 2.1 is hinged to the box body 2; the box body 2 has a control panel 2.4 and a display unit 2.3, and the hatch door 2.1 has an observation window 2.2, and the box body Electrodes are installed inside the box 2, and the box body 2 is connected with a ventilation system.

As shown in the figure, the degumming device of the present application includes a degumming unit and a feeding unit. Through efficient taking and feeding, the wafer that has been degummed is taken out at one time, and a new wafer to be degummed is put in at the same time. In this way, the high-efficiency pick-and-place of the pick-and-place material is realized, which saves time compared with the separate operation of the pick-and-place material, thereby improving the glue removal efficiency. And as shown in Figures 3E and 4E, after the wafers that have been deglued are put into the storage rack (the storage rack can store multiple wafers vertically, and the storage rack itself can be lifted and lowered, so as to cooperate with the feeding unit to move the target wafer When performing the corresponding operation), one of the transport plates can be rotated 90 degrees, so that when the other transport plate is used to perform the operation, the transport plate rotated 90 degrees will not interfere with the transport plate performing the operation.

During the specific operation, there are upper bearing bosses and lower bearing bosses at the movable carrier, which may be shown in Figure 3A-3E, and the lower bearing boss is used to carry the wafer for deglue, or it may be shown in Figure 4A-4E As shown, use the upper carrying boss to carry the wafer for deglue. Since the movable carrier can be lifted up and down, as shown in Figure 2, no matter whether the upper carrying boss or the lower carrying boss is used for deglue, the movable carrier can lift the wafer to be removed to a specific height, thereby ensuring the deglue. The glued wafer is in the set position, thus ensuring the consistency of the glue removal.

And as shown in Figures 3A-3E: first, as shown in Figure 3A, after the wafer at the lower bearing bump has been deglued, take the handling plate above the feeding unit to transport the unglued wafer; then as shown in Figure 3B As shown, the semi-circular plate extends into the chassis; then, as shown in Figure 3C, the handling plate places the unremoved wafer on the upper bearing bump, and holds the lower wafer that has been deglued; then, as shown in Figure 3D As shown in 3E, the transfer board exits the chassis; then, as shown in 3E, the transfer board feeds the deglue-finished wafers into the storage rack, and at this time the other transfer board is in a rotating state, which will not adversely affect the feeding operation.

Or as shown in Figure 4A, after the wafers at the upper carrying bumps have been deglued, there are unglued wafers at the lower carrier plate; then, as shown in Figure 4B, the carrier plate is extended into the chassis; and then as shown in Figure 4B As shown in 4C, the upper carrier plate lifts the wafer at the upper bearing bump, and the lower carrier plate places the unglued wafer on the lower carrier bump; then, as shown in Figure 4D, the carrier plate exits the chassis ; Next, as shown in FIG. 4E , the upper transfer plate puts the deglue-finished wafers into the storage rack, and the lower transfer plate rotates 90 degrees without affecting the operation of the upper transfer plate.

Although the present invention has been illustrated and described in terms of preferred embodiments, those skilled in the art should understand that various changes and modifications can be made to the present invention without departing from the scope defined by the claims of the present invention.

Claims (8)

1. A kind of semiconductor wafer manufacturing plasma degumming device, it is characterized in that, comprise plasma degumming unit and get feeding unit, described plasma degumming unit comprises casing and hatch, has working cavity in the described casing, so There is a workbench and a movable carrier in the working chamber, the workbench is connected with an upper base plate and a lower base plate, an inlet and outlet groove is formed between the upper base plate and the lower base plate, and an upper circular groove is formed at the upper base plate And the upper connection groove communicated with the upper circular groove, there are a plurality of upper limit grooves at the circumference of the upper circular groove, the lower base plate has the lower circular groove and the upper circular groove communicated with the lower circular groove. The lower connecting groove, the circumferential surface of the lower circular groove has a plurality of lower limit grooves, and the movable carrier includes an upper arc plate, a lower arc plate and a plurality of connecting upper arc plates and lower arc plates The connecting vertical bar of the plate that can be embedded in the upper limit groove and the lower limit groove, the upper arc-shaped plate has a plurality of upper bearing protrusions, and the lower arc-shaped plate has a plurality of lower bearing protrusions, The lower base plate is connected with an arc-shaped mounting plate through a connecting plate, and a plurality of first lifting motors are installed on the arc-shaped mounting plate, and each first lifting motor drives a first screw rod, and the connecting vertical rod is There is a threaded channel matched with the first threaded rod. 2. semiconductor wafer manufacture according to claim 1 is characterized in that, the quantity of described first lifting motor and connecting vertical bar is 3, and the connecting vertical bar in the middle and other two The connecting vertical bars are all 60 degrees apart. 3. The plasma deglue device for semiconductor wafer manufacturing according to claim 1, wherein the feeding unit includes a mounting base, a mounting base fixed to the mounting base, and a first rotating base mounted on the mounting base. arm, a second rotating arm mounted on the first rotating arm, a third rotating arm mounted on the second rotating arm, and a mounting cylinder fixed on the third rotating arm, two conveying plates are installed in the mounting cylinder, and the There is a first rotating motor that can drive the first rotating arm to rotate at the mounting seat, a second rotating motor that can drive the second rotating arm is installed at the first rotating arm, and a second rotating motor that can drive the second rotating arm is installed at the second rotating arm. A third rotating motor for rotating the third rotating arm. 4. semiconductor wafer manufacture according to claim 3 is characterized in that, described mounting cylinder comprises top plate, bottom plate and the peripheral plate that connects top plate and bottom plate, and described peripheral plate place has vertical through groove , a plurality of vertical guide rods are connected between the top plate and the bottom plate, a second lifting motor is installed on the top end of the installation cylinder, a bearing is installed on the bottom end, and a second lifting motor is installed between the second lifting motor and the bearing. Screw rod, the second screw rod has two external threads with opposite helical directions, each external thread is equipped with one of the carrying plates, and the carrying plate has threaded holes and a plurality of vertical guide rods. Limit guide hole. 5. The plasma deglue device for semiconductor wafer manufacturing according to claim 4, wherein two deflection drive units are installed at the installation cylinder, and the deflection drive unit includes a drive abutment block and a connection installation cylinder The circumferential plate and the connecting frame of the driving abutting block, the driving abutting block includes a lower abutting block, an upper abutting block fixedly connected with the connecting frame, and a connecting abutment connecting the lower abutting block and the upper abutting block Connecting block, the lower abutting block has a lower abutting arc surface, the upper abutting block has an upper abutting arc surface; the handling plate includes a lifting plate with the threaded hole and the limiting guide hole and a rotating plate hinged with the lifting plate through an elastic reset hinge part, the lifting plate has a first abutment surface and an insertion groove communicating with the first abutment surface, and the insertion groove can allow the lower abutment to The connecting block is inserted, the rotating plate has a second abutting surface capable of abutting against the first abutting surface; the lower abutting block is inserted into the insertion groove and the lower abutting arc surface abuts against the second abutting surface , the first abutting surface abuts the second abutting surface; when the upper abutting block is inserted into the insertion groove and the upper abutting arc abuts the second abutting surface, the first abutting surface The junction surface is perpendicular to the second abutment surface. 6. The semiconductor wafer manufacturing plasma deglue device according to claim 5, wherein when there is no external force, the first abutting surface abuts against the second abutting surface, and the first abutting surface and the rotating The length direction of the plate is 45 degrees; the fetching and feeding unit can be in the first feeding state and the second feeding state, and in the first feeding state, the second abutting surface of the rotating plate of the upper conveying plate abuts against the upper driving The upper abutting arc surface of the abutting block, the second abutting surface of the lower conveying plate abuts against the first abutting surface; in the second feeding state, the second abutting surface of the lower conveying plate abuts against the lower The upper abutting arc surface of the abutting block is driven, and the second abutting surface of the upper conveying plate abuts against the first abutting surface. 7. The plasma deglue device for manufacturing semiconductor wafers according to claim 4, wherein there are three vertical guide rods in the installation cylinder, and three position-limiting guide holes are provided at each transfer plate. 8. semiconductor wafer manufacture according to claim 1 is characterized in that, described cabin door is electric door, and described cabin door and box body are hinged; Described box body place has control panel and display unit, the hatch has an observation window, electrodes are installed in the box, and the box is connected with a ventilation system.

Images