[go: up one dir, main page]

CN116200035A - PAI composite material for valve body sealing and preparation method thereof - Google Patents

PAI composite material for valve body sealing and preparation method thereof Download PDF

Info

Publication number
CN116200035A
CN116200035A CN202211681173.5A CN202211681173A CN116200035A CN 116200035 A CN116200035 A CN 116200035A CN 202211681173 A CN202211681173 A CN 202211681173A CN 116200035 A CN116200035 A CN 116200035A
Authority
CN
China
Prior art keywords
parts
pai
sio
valve body
composite material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202211681173.5A
Other languages
Chinese (zh)
Inventor
朱娟
陶峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhenjiang Dongyi Machinery Co ltd
Original Assignee
Zhenjiang Dongyi Machinery Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhenjiang Dongyi Machinery Co ltd filed Critical Zhenjiang Dongyi Machinery Co ltd
Priority to CN202211681173.5A priority Critical patent/CN116200035A/en
Publication of CN116200035A publication Critical patent/CN116200035A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/011Nanostructured additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/08Stabilised against heat, light or radiation or oxydation
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Sealing Material Composition (AREA)

Abstract

本发明公开了一种用于阀体密封的PAI复合材料及其制备方法,包括以下重量份数的各组分:50~65份SiO2/PAI复合材料;20~26份环氧树脂;4~8份碳纤维;3~12份丙酮;10~16份邻苯二甲酸二丁酯;2~8份石墨烯;1~4份硫化剂;3~12份促进剂;10~22份防老化剂;所述的SiO2/PAI复合材料中SiO2的掺杂量为10~15%。在组分中添加SiO2/PAI复合材料,纳米SiO2具有颗粒尺寸小、键能高和耐热性好等优点,通过将SiO2与PAI进行复合进行提高阀体密封件的热稳定性,经过对PAI进行纳米掺杂后,阀体密封件的耐电晕寿命得到显著提升。The invention discloses a PAI composite material used for valve body sealing and a preparation method thereof, which comprises the following components in parts by weight: 50-65 parts of SiO 2 /PAI composite material; 20-26 parts of epoxy resin; 4 ~8 parts of carbon fiber; 3~12 parts of acetone; 10~16 parts of dibutyl phthalate; 2~8 parts of graphene; 1~4 parts of vulcanizing agent; 3~12 parts of accelerator; 10~22 parts of anti-aging agent; the doping amount of SiO 2 in the SiO 2 /PAI composite material is 10-15%. Add SiO 2 /PAI composite material to the components. Nano-SiO 2 has the advantages of small particle size, high bond energy and good heat resistance. By compounding SiO 2 and PAI, the thermal stability of the valve body seal is improved. After nano-doping PAI, the corona resistance life of the valve body seal is significantly improved.

Description

一种用于阀体密封的PAI复合材料及其制备方法A kind of PAI composite material used for valve body sealing and preparation method thereof

技术领域technical field

本发明涉及一种用于阀体密封的PAI复合材料及其制备方法。The invention relates to a PAI composite material used for valve body sealing and a preparation method thereof.

背景技术Background technique

聚酰胺酰亚胺PAI是一类主链由酰亚胺环和酰胺基团键接而成的高性能聚合物,由于分子中同时具有耐热的芳杂环亚胺基团和柔性的酰胺基团,因此不但有聚酰亚胺优良的耐热性、介电性、机械性能、耐蠕变性、耐腐蚀性和化学稳定性,同时具有聚酰胺优异的力学性能及可加工性能,是一种性能卓越的工程材料,被广泛应用在航空航天、电子器件等领域。Polyamide-imide PAI is a kind of high-performance polymer whose main chain is bonded by imide ring and amide group. Due to the heat-resistant aromatic heterocyclic imide group and flexible amide group in the molecule Therefore, it not only has excellent heat resistance, dielectric properties, mechanical properties, creep resistance, corrosion resistance and chemical stability of polyimide, but also has excellent mechanical properties and processability of polyamide. It is an engineering material with excellent performance, which is widely used in aerospace, electronic devices and other fields.

因聚酰胺酰亚胺具有耐高温、耐摩擦和耐辐射性能,以及良好的机械强度、粘合性等,因此是一种较理想的耐高温热塑性工程塑料。在商业上销售的无定形热塑性工程塑料中,PAI具有最高的玻璃化转变温度,热稳定性类似于聚酰亚胺,但PAI具有更加优越的加工性能和机械性能,与大多数工程高分子相比,PAI表现出更高的强度。目前PAI被广泛应用于阀体密封件中,但阀体密封件的各方面性能尚需要提升。Because polyamide-imide has high temperature resistance, friction resistance and radiation resistance, as well as good mechanical strength and adhesion, it is an ideal high temperature resistant thermoplastic engineering plastic. Among the amorphous thermoplastic engineering plastics sold commercially, PAI has the highest glass transition temperature, and its thermal stability is similar to that of polyimide, but PAI has more superior processing performance and mechanical properties, and is compatible with most engineering polymers. Than, PAI showed a higher intensity. At present, PAI is widely used in valve body seals, but the performance of various aspects of valve body seals still needs to be improved.

发明内容Contents of the invention

为提高阀体密封件的性能,本发明提供了一种用于阀体密封的PAI复合材料及其制备方法,具体方案如下:In order to improve the performance of valve body seals, the invention provides a PAI composite material for valve body seals and a preparation method thereof, the specific scheme is as follows:

一种用于阀体密封的PAI复合材料,包括以下重量份数的各组分:A PAI composite material used for valve body sealing, comprising the following components in parts by weight:

50~65份SiO2/PAI复合材料;50-65 parts of SiO 2 /PAI composite material;

20~26份环氧树脂;20-26 parts of epoxy resin;

4~8份碳纤维;4 to 8 parts of carbon fiber;

3~12份丙酮;3-12 parts of acetone;

10~16份邻苯二甲酸二丁酯;10-16 parts of dibutyl phthalate;

2~8份石墨烯;2 to 8 parts of graphene;

1~4份硫化剂;1 to 4 parts of vulcanizing agent;

3~12份促进剂;3-12 accelerators;

10~22份防老化剂;10-22 parts of anti-aging agent;

所述的SiO2/PAI复合材料中SiO2的掺杂量为10~15%。The doping amount of SiO 2 in the SiO 2 /PAI composite material is 10-15%.

进一步的,所述SiO2/PAI复合材料的制备方法包括以下步骤:Further, the preparation method of the SiO 2 /PAI composite material includes the following steps:

S1:将正硅酸乙酯、甲基三乙氧基硅烷、甲苯加入容器中进行搅拌;S1: Add ethyl orthosilicate, methyltriethoxysilane, and toluene into the container and stir;

S2:在超声作用下向S1溶液中滴加去离子水,进行超声搅拌,搅拌完成后进行反应;S2: Add deionized water dropwise to the S1 solution under the action of ultrasound, perform ultrasonic stirring, and react after the stirring is completed;

S3:反应一段时间后滴加N,N’-二甲基乙酰胺至一定浓度,得到纳米SiO2分散液;S3: After reacting for a period of time, add N,N'-dimethylacetamide dropwise to a certain concentration to obtain a nano-SiO 2 dispersion;

S4:将S3制备得到的纳米SiO2分散液与聚酰胺酰亚胺进行机械共混,进行机械搅拌得到均一稳定的纳米改性聚酰胺酰亚胺树脂液。S4: Mechanically blending the nano- SiO2 dispersion prepared in S3 with polyamide-imide, and mechanically stirring to obtain a uniform and stable nano-modified polyamide-imide resin solution.

进一步的,S3中滴加N,N’-二甲基乙酰胺至一定浓度为10~20%。Further, N,N'-dimethylacetamide is added dropwise to S3 to a certain concentration of 10-20%.

一种用于阀体密封的PAI复合材料的制备方法,包括以下步骤:A preparation method for a PAI composite material for valve body sealing, comprising the following steps:

S1:按照原料的重量份数进行备料,并对原料进行干燥;S1: Prepare materials according to the weight parts of the raw materials, and dry the raw materials;

S2:将干燥后的原料进行充分搅拌混合;S2: Thoroughly stir and mix the dried raw materials;

S3:将原料装入模具内压实成型;S3: Put the raw materials into the mold for compaction;

S4:放入烧结炉中以一定的升温曲线进行烧制。S4: Put it into a sintering furnace to sinter with a certain heating curve.

进一步的,S3中成型压力为20~30MPa。Further, the molding pressure in S3 is 20-30 MPa.

进一步的,S4中升温曲线为以室温为起始温度,以1.5~2℃/min的速率进行升温至200℃,保温30min再以1.5~2℃/min的速率升温至400~450℃,保温30min,保温结束后冷却至室温。Further, the temperature rise curve in S4 is starting at room temperature, raising the temperature to 200°C at a rate of 1.5-2°C/min, keeping the temperature for 30 minutes, and then raising the temperature to 400-450°C at a rate of 1.5-2°C/min, and holding After 30min, cool to room temperature after the heat preservation.

有益效果:Beneficial effect:

(1)本发明提供了一种用于阀体密封的PAI复合材料及其制备方法,在组分中添加SiO2/PAI复合材料,纳米SiO2具有颗粒尺寸小、键能高和耐热性好等优点,通过将SiO2与PAI进行复合进行提高阀体密封件的热稳定性,经过对PAI进行纳米掺杂后,阀体密封件的耐电晕寿命得到显著提升。(1) The present invention provides a PAI composite material for valve body sealing and its preparation method, adding SiO 2 /PAI composite material to the components, nano-SiO 2 has small particle size, high bond energy and heat resistance Good and other advantages, by compounding SiO 2 and PAI to improve the thermal stability of the valve body seal, after nano doping of PAI, the corona resistance life of the valve body seal is significantly improved.

(2)本发明对纳米SiO2的掺杂量优化至10~15%,当纳米SiO2的掺杂量低于10%或高于15%时阀体密封件的性能下降。(2) The present invention optimizes the doping amount of nano-SiO 2 to 10-15%. When the doping amount of nano-SiO 2 is lower than 10% or higher than 15%, the performance of the valve body seal will decrease.

(3)本发明提供了一种用于阀体密封的PAI复合材料的制备方法,对烧制时的升温曲线进行优化,进一步增强阀体密封件的机械性能。(3) The present invention provides a method for preparing a PAI composite material used for valve body sealing, which optimizes the heating curve during firing and further enhances the mechanical properties of the valve body seal.

具体实施方式Detailed ways

为了加深对本发明的理解,下面将结合实施例对本发明作进一步详述,该实施例仅用于解释本发明,并不构成对本发明保护范围的限定。In order to deepen the understanding of the present invention, the present invention will be further described below in conjunction with examples, which are only used to explain the present invention and do not constitute a limitation to the protection scope of the present invention.

实施例1:Example 1:

一种用于阀体密封的PAI复合材料的制备方法,包括以下步骤:A preparation method for a PAI composite material for valve body sealing, comprising the following steps:

步骤1、制备SiO2/PAI复合材料:Step 1. Preparation of SiO 2 /PAI composite material:

S1:将正硅酸乙酯、甲基三乙氧基硅烷、甲苯加入容器中进行搅拌;S1: Add ethyl orthosilicate, methyltriethoxysilane, and toluene into the container and stir;

S2:在超声作用下向S1溶液中滴加去离子水,进行超声搅拌,搅拌完成后进行反应;S2: Add deionized water dropwise to the S1 solution under the action of ultrasound, perform ultrasonic stirring, and react after the stirring is completed;

S3:反应一段时间后滴加N,N’-二甲基乙酰胺至浓度为12%,得到纳米SiO2分散液;S3: After reacting for a period of time, add N,N'-dimethylacetamide dropwise to a concentration of 12%, to obtain a nano- SiO2 dispersion;

S4:将S3制备得到的纳米SiO2分散液与聚酰胺酰亚胺进行机械共混,进行机械搅拌得到均一稳定的纳米改性聚酰胺酰亚胺树脂液。S4: Mechanically blending the nano- SiO2 dispersion prepared in S3 with polyamide-imide, and mechanically stirring to obtain a uniform and stable nano-modified polyamide-imide resin solution.

步骤2、准备原料:Step 2. Prepare raw materials:

55份SiO2/PAI复合材料;24份环氧树脂;6份碳纤维;55 parts SiO 2 /PAI composite material; 24 parts epoxy resin; 6 parts carbon fiber;

6份丙酮;10份邻苯二甲酸二丁酯;2份石墨烯;1份硫化剂;3份促进剂;10份防老化剂;所述的SiO2/PAI复合材料中SiO2的掺杂量为10%;将上述原料进行干燥;6 parts of acetone; 10 parts of dibutyl phthalate; 2 parts of graphene; 1 part of vulcanizing agent; 3 parts of accelerator ; The amount is 10%; the above raw materials are dried;

步骤3、将干燥后的原料进行充分搅拌混合;Step 3, fully stirring and mixing the dried raw materials;

步骤4、将原料装入模具内压实成型,成型压力为20MPa;Step 4, put the raw materials into the mold for compaction molding, and the molding pressure is 20MPa;

步骤5、放入烧结炉中进行烧制,烧制温度为以室温为起始温度,以1.5℃/min的速率进行升温至200℃,保温30min再以1.5℃/min的速率升温至400℃,保温30min,保温结束后冷却至室温。Step 5. Put it into a sintering furnace for firing. The firing temperature is starting at room temperature, and the temperature is raised to 200°C at a rate of 1.5°C/min, kept for 30 minutes, and then raised to 400°C at a rate of 1.5°C/min. , keep warm for 30min, and cool to room temperature after the keep warm.

实施例2:Example 2:

一种用于阀体密封的PAI复合材料的制备方法,包括以下步骤:A preparation method for a PAI composite material for valve body sealing, comprising the following steps:

步骤1、制备SiO2/PAI复合材料:Step 1. Preparation of SiO 2 /PAI composite material:

S1:将正硅酸乙酯、甲基三乙氧基硅烷、甲苯加入容器中进行搅拌;S1: Add ethyl orthosilicate, methyltriethoxysilane, and toluene into the container and stir;

S2:在超声作用下向S1溶液中滴加去离子水,进行超声搅拌,搅拌完成后进行反应;S2: Add deionized water dropwise to the S1 solution under the action of ultrasound, perform ultrasonic stirring, and react after the stirring is completed;

S3:反应一段时间后滴加N,N’-二甲基乙酰胺至浓度为15%,得到纳米SiO2分散液;S3: After reacting for a period of time, add N,N'-dimethylacetamide dropwise to a concentration of 15% to obtain a nano- SiO2 dispersion;

S4:将S3制备得到的纳米SiO2分散液与聚酰胺酰亚胺进行机械共混,进行机械搅拌得到均一稳定的纳米改性聚酰胺酰亚胺树脂液。S4: Mechanically blending the nano- SiO2 dispersion prepared in S3 with polyamide-imide, and mechanically stirring to obtain a uniform and stable nano-modified polyamide-imide resin solution.

步骤2、准备原料:Step 2. Prepare raw materials:

60份SiO2/PAI复合材料;23份环氧树脂;6份碳纤维;60 parts of SiO 2 /PAI composite material; 23 parts of epoxy resin; 6 parts of carbon fiber;

6份丙酮;12份邻苯二甲酸二丁酯;5份石墨烯;2份硫化剂;7份促进剂;16份防老化剂;所述的SiO2/PAI复合材料中SiO2的掺杂量为13%;将上述原料进行干燥;6 parts of acetone; 12 parts of dibutyl phthalate ; 5 parts of graphene; 2 parts of vulcanizing agent; 7 parts of accelerator; The amount is 13%; the above raw materials are dried;

步骤3、将干燥后的原料进行充分搅拌混合;Step 3, fully stirring and mixing the dried raw materials;

步骤4、将原料装入模具内压实成型,成型压力为25MPa;Step 4, put the raw materials into the mold for compaction molding, and the molding pressure is 25MPa;

步骤5、放入烧结炉中进行烧制,烧制温度为以室温为起始温度,以1.8℃/min的速率进行升温至200℃,保温30min再以1.7℃/min的速率升温至420℃,保温30min,保温结束后冷却至室温。Step 5. Put it into a sintering furnace for firing. The firing temperature is starting at room temperature, and the temperature is raised to 200°C at a rate of 1.8°C/min, kept for 30 minutes, and then raised to 420°C at a rate of 1.7°C/min. , keep warm for 30min, and cool to room temperature after the keep warm.

实施例3:Example 3:

一种用于阀体密封的PAI复合材料的制备方法,包括以下步骤:A preparation method for a PAI composite material for valve body sealing, comprising the following steps:

步骤1、制备SiO2/PAI复合材料:Step 1. Preparation of SiO 2 /PAI composite material:

S1:将正硅酸乙酯、甲基三乙氧基硅烷、甲苯加入容器中进行搅拌;S1: Add ethyl orthosilicate, methyltriethoxysilane, and toluene into the container and stir;

S2:在超声作用下向S1溶液中滴加去离子水,进行超声搅拌,搅拌完成后进行反应;S2: Add deionized water dropwise to the S1 solution under the action of ultrasound, perform ultrasonic stirring, and react after the stirring is completed;

S3:反应一段时间后滴加N,N’-二甲基乙酰胺至浓度为20%,得到纳米SiO2分散液;S3: After reacting for a period of time, add N, N'-dimethylacetamide dropwise to a concentration of 20%, to obtain a nano-SiO2 dispersion;

S4:将S3制备得到的纳米SiO2分散液与聚酰胺酰亚胺进行机械共混,进行机械搅拌得到均一稳定的纳米改性聚酰胺酰亚胺树脂液。S4: Mechanically blending the nano- SiO2 dispersion prepared in S3 with polyamide-imide, and mechanically stirring to obtain a uniform and stable nano-modified polyamide-imide resin solution.

步骤2、准备原料:Step 2. Prepare raw materials:

65份SiO2/PAI复合材料;26份环氧树脂;8份碳纤维;65 parts of SiO2/PAI composite material; 26 parts of epoxy resin; 8 parts of carbon fiber;

12份丙酮;16份邻苯二甲酸二丁酯;8份石墨烯;4份硫化剂;12份促进剂;22份防老化剂;所述的SiO2/PAI复合材料中SiO2的掺杂量为15%;将上述原料进行干燥;12 parts of acetone; 16 parts of dibutyl phthalate ; 8 parts of graphene; 4 parts of vulcanizing agent; 12 parts of accelerator; The amount is 15%; the above raw materials are dried;

步骤3、将干燥后的原料进行充分搅拌混合;Step 3, fully stirring and mixing the dried raw materials;

步骤4、将原料装入模具内压实成型,成型压力为30MPa;Step 4, put the raw materials into the mold for compaction molding, the molding pressure is 30MPa;

步骤5、放入烧结炉中进行烧制,烧制温度为以室温为起始温度,以2℃/min的速率进行升温至200℃,保温30min再以2℃/min的速率升温至450℃,保温30min,保温结束后冷却至室温。Step 5. Put it into a sintering furnace for firing. The firing temperature is starting at room temperature, and the temperature is raised to 200°C at a rate of 2°C/min, kept for 30 minutes, and then raised to 450°C at a rate of 2°C/min. , keep warm for 30min, and cool to room temperature after the keep warm.

对实施例1~3制备得到的阀体密封件进行性能检测,结果表明通过掺杂纳米SiO2,阀体密封件的性能得到增强。The performance testing of the valve body seals prepared in Examples 1-3 shows that the performance of the valve body seals is enhanced by doping nano-SiO 2 .

作为进一步改进,以上所述仅为本发明的较佳实施例而已,并不用以限制本发明,凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。As a further improvement, the above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall include Within the protection scope of the present invention.

Claims (6)

1. The PAI composite material for sealing the valve body is characterized by comprising the following components in parts by weight:
50-65 parts of SiO 2 PAI composite material;
20-26 parts of epoxy resin;
4-8 parts of carbon fiber;
3-12 parts of acetone;
10-16 parts of dibutyl phthalate;
2-8 parts of graphene;
1-4 parts of vulcanizing agent;
3-12 parts of accelerator;
10-22 parts of an anti-aging agent;
the SiO is 2 SiO in PAI composite material 2 The doping amount of (2) is 10-15%.
2. A PAI composite for valve body sealing as in claim 1 wherein the SiO 2 The preparation method of the PAI composite material comprises the following steps:
s1: adding ethyl orthosilicate, methyltriethoxysilane and toluene into a container and stirring;
s2: dropwise adding deionized water into the solution S1 under the action of ultrasound, performing ultrasonic stirring, and performing reaction after stirring is completed;
s3: after reacting for a period of time, dropwise adding N, N' -dimethylacetamide to a certain concentration to obtain nano SiO 2 A dispersion;
s4: nano SiO prepared by S3 2 And mechanically blending the dispersion liquid and the polyamide-imide, and mechanically stirring to obtain uniform and stable nano modified polyamide-imide resin liquid.
3. The PAI composite for valve body sealing according to claim 2, wherein N, N' -dimethylacetamide is added dropwise to a concentration of 10 to 20% in S3.
4. A method of preparing a PAI composite for sealing a valve body as claimed in claims 1 to 3, comprising the steps of:
s1: preparing materials according to the weight parts of the raw materials, and drying the raw materials;
s2: fully stirring and mixing the dried raw materials;
s3: filling the raw materials into a die, and compacting and molding;
s4: and (5) placing the mixture into a sintering furnace to be sintered according to a certain heating curve.
5. The method for producing a PAI composite for valve body sealing according to claim 4, wherein the molding pressure in S3 is 20 to 30MPa.
6. The method for preparing a PAI composite material for sealing a valve body according to claim 4, wherein the temperature rising curve in S4 is to raise the temperature to 200 ℃ at a rate of 1.5-2 ℃/min, heat-preserving for 30min, then raise the temperature to 400-450 ℃ at a rate of 1.5-2 ℃/min, heat-preserving for 30min, and cooling to the room temperature after heat preservation is finished.
CN202211681173.5A 2022-12-27 2022-12-27 PAI composite material for valve body sealing and preparation method thereof Pending CN116200035A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211681173.5A CN116200035A (en) 2022-12-27 2022-12-27 PAI composite material for valve body sealing and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211681173.5A CN116200035A (en) 2022-12-27 2022-12-27 PAI composite material for valve body sealing and preparation method thereof

Publications (1)

Publication Number Publication Date
CN116200035A true CN116200035A (en) 2023-06-02

Family

ID=86512038

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211681173.5A Pending CN116200035A (en) 2022-12-27 2022-12-27 PAI composite material for valve body sealing and preparation method thereof

Country Status (1)

Country Link
CN (1) CN116200035A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000095997A (en) * 1998-09-22 2000-04-04 Hitachi Chem Co Ltd Polyamide-imide resin paste and film forming material
JP2004091734A (en) * 2002-09-03 2004-03-25 Gun Ei Chem Ind Co Ltd Polyamide-imide resin, resin composition containing the same, coating material for electronic component, and adhesive for electronic component
CN1546586A (en) * 2003-12-12 2004-11-17 四川东方绝缘材料股份有限公司 Preparation method of nanometer modified corona-tolerant enamel of enameled wire
CN106811112A (en) * 2016-12-29 2017-06-09 天恒达电工科技股份有限公司 A kind of preparation method of Inverter fed motor polyamide-imide enamelled wire varnishes
CN114269857A (en) * 2019-09-06 2022-04-01 太阳油墨制造株式会社 Curable resin composition, dry film and cured product thereof, and electronic component containing the cured product
CN114685989A (en) * 2020-12-30 2022-07-01 广东生益科技股份有限公司 Resin composition and adhesive film and covering film containing same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000095997A (en) * 1998-09-22 2000-04-04 Hitachi Chem Co Ltd Polyamide-imide resin paste and film forming material
JP2004091734A (en) * 2002-09-03 2004-03-25 Gun Ei Chem Ind Co Ltd Polyamide-imide resin, resin composition containing the same, coating material for electronic component, and adhesive for electronic component
CN1546586A (en) * 2003-12-12 2004-11-17 四川东方绝缘材料股份有限公司 Preparation method of nanometer modified corona-tolerant enamel of enameled wire
CN106811112A (en) * 2016-12-29 2017-06-09 天恒达电工科技股份有限公司 A kind of preparation method of Inverter fed motor polyamide-imide enamelled wire varnishes
CN114269857A (en) * 2019-09-06 2022-04-01 太阳油墨制造株式会社 Curable resin composition, dry film and cured product thereof, and electronic component containing the cured product
CN114685989A (en) * 2020-12-30 2022-07-01 广东生益科技股份有限公司 Resin composition and adhesive film and covering film containing same

Similar Documents

Publication Publication Date Title
CN101735566B (en) Processable full sea-depth buoyancy material and manufacture method
CN103601928B (en) High-strength nitrile rubber material
CN102153955B (en) Preparation method of heat conduction plaster adopting fiber glass mesh as supporting structure
CN111117540B (en) High-strength high-heat-resistance epoxy plastic packaging material for organic bentonite modified semiconductor packaging and preparation method thereof
CN101724272A (en) Silicon rubber for large-scale injection moulding vulcanization and preparation method thereof
CN107868474A (en) A kind of thermally conductive silicone rubber composite material and preparation method of the wide damping temperature domain of high-damping
CN103396653A (en) Preparation method of graphene nanoplatelet/epoxy resin nanocomposite material
CN111333817A (en) Bio-based furan epoxy resin polymer and preparation method and application thereof
CN107652629A (en) A kind of preparation method of monodisperse mesoporous molecular sieve reinforced epoxy composite
CN110218390A (en) A kind of PP composite material with the filling of core-shell structure heat filling
CN112961468B (en) Modified epoxy resin composite material and preparation method thereof
CN106009693A (en) Silicone rubber with excellent tracking resistance and high heat conductivity
CN101817981B (en) Silicon rubber-ethylene propylene diene monomer (EPDM) rubber blend thermal conductive composite material and preparation method thereof
CN103819895B (en) A kind of epoxide group modified graphite and heat conduction nylon composite materials and preparation thereof
CN106221086B (en) A kind of new PTFE based composites and preparation method thereof
CN116200035A (en) PAI composite material for valve body sealing and preparation method thereof
CN105602196B (en) A kind of fire resistant resin base composite ceramic insulating sheath material and fire resistant resin base composite ceramic insulating sheath
CN104650595A (en) A preparation method of 300-degree high-temperature silica gel
CN101457021A (en) Nano silicon nitride/bimaleimide resin/cyanate ester resin composite material and preparation method thereof
CN107266864A (en) It is a kind of for insulating materials of LED package and preparation method thereof
CN103408893B (en) Maleimide phenolic resin/nano-TiO2 composite material and its preparation method
CN103881379B (en) Hydroxy silicate/phosphorous benzoxazine/bismaleimide resin composite material and preparation method thereof
CN118824650A (en) A high temperature resistant composite insulating column and preparation method thereof
CN104723572B (en) The preparation method of the high silica refractory fibre-Pps Pes composite of microwave high temperature resistant, saturating
CN101597430A (en) Preparation method of filling type heat-conducting silicone rubber composite material

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20230602