CN116169131A - Multicolor LED lamp bead - Google Patents

Abstract

The invention relates to a multi-color LED lamp bead. Specifically, the lamp bead is made by encapsulating a plurality of LED chips with a cup-shaped bracket. There is at least one separating resin in the bracket cup to separate the bracket cup into multiple Shallow cups, multiple chips are set in each shallow cup, there are many kinds of packaging glue, the chips in each shallow cup have been sealed by packaging glue, the packaging glue in each shallow cup is different, and the upper layer of the whole big cup is still Sealed with encapsulation glue, the encapsulation glue has covered the separation resin and multiple shallow cups, and each chip of the produced lamp bead emits light of different colors. The advantage of the lamp bead is that the light emitted by each chip independently passes through the encapsulation glue on the upper layer of the entire large cup, and then emits light outward, and its light-emitting surface is the light-emitting surface of the encapsulation glue at the mouth of the large cup, and the light-emitting area is large; After multiple chips are lit at the same time, the emitted light will be mixed in the upper encapsulant of the large cup, and then emitted outward, and the emitted light is more evenly mixed.

Description

A multi-color LED lamp bead

technical field

The invention relates to the field of LEDs, in particular to a multicolor LED lamp bead.

Background technique

The LED industry uses chips to make lamp beads, which can produce lamp beads that emit light of various colors. The following two solutions are adopted:

① Directly use chips that emit different colors of light to make;

② Made with packaging glue that produces different colors of light;

When using packaging glue that produces different colors of light to make multi-color lamp beads, the products in the existing industry are to completely separate the packaging glue of several colors on the lamp beads, as shown in the figure (Figure 1, Figure 8, Figure 14) .

The lamp bead products made by the prior art have two defects:

①, when each color emits light independently, the light emitting surface of the lamp bead is small;

② When multiple colors emit light at the same time, the emitted light needs to have a more uniform and better light mixing effect. However, the light emitted by multiple chips of this kind of lamp bead needs to be spread into the air or space and then mixed. So the mixed light effect is not good;

We have invented the following technology to make multi-color lamp beads (two-color or more than two-color lamp beads), which solves the problem of small light-emitting surface when the independent single-color is lit alone; and solves the problem of mixed light difference when lighting at the same time, as follows :

A method for manufacturing multi-color LED lamp beads. An LED bracket with a cup is manufactured, and at least one partition resin (1.2a, 4.2a, 7.2a) is arranged in the middle, and the height of the partition resin is lower than that of the outer cup resin (1.2, 7.2a). 4.2, 7.2), separate the resin so that the LED bracket forms n small shallow cups in the cup, n ≥ 2, fix at least two LED chips on the electrodes in at least two shallow cups, and form with the electrodes Conductive connection, apply different encapsulation glue in each shallow cup, and then apply another encapsulation glue after heating and solidification to form an outer layer of encapsulation glue, covering the surface of the encapsulation glue in each shallow cup, the separation resin has been encapsulated by the encapsulation glue Cover and reheat to cure all the packaging glue, or apply n-1 kinds of packaging glue in n-1 shallow cups respectively, after heating and solidifying, apply another kind of packaging glue into the nth shallow cup to cover the nth shallow cup The chip in the shallow cup is also covered with the encapsulant surface in the n-1 shallow cups that already have encapsulant, and the outer layer of encapsulant is exposed at the mouth of the large cup, and all the encapsulant is cured by heating to complete a For multi-color LED lamp beads, the light emitted by all the chips of the lamp beads must pass through the outer packaging glue and then be emitted outward, with a large light-emitting surface. The lamp beads can respectively light up one chip to emit light of different colors, or can light up at least two chips at the same time to mix light in the outer packaging glue and then emit light, which has a uniform and good light mixing effect.

Contents of the invention

The invention relates to a multi-color LED lamp bead. Specifically, the lamp bead is made by encapsulating a plurality of LED chips with a cup-shaped bracket. There is at least one separating resin in the bracket cup to separate the bracket cup into multiple Shallow cups, multiple chips are placed in each shallow cup, there are many kinds of packaging glue, the chips in each shallow cup have been sealed by the packaging glue, the packaging glue in each shallow cup is different, and there are still some glues on the upper layer of the whole big cup. Sealed with encapsulation glue, the encapsulation glue has covered the separation resin and multiple shallow cups, and each chip of the produced lamp bead emits light of different colors. The advantage of the lamp bead is that the light emitted by each chip independently passes through the encapsulation glue on the upper layer of the entire large cup, and then emits light outward, and its light-emitting surface is the light-emitting surface of the encapsulation glue at the mouth of the large cup, and the light-emitting area is large; After multiple chips are lit at the same time, the emitted light will be mixed in the upper encapsulation glue of the large cup, and then emitted outward, and the emitted light is more evenly mixed.

According to the present invention, a multi-color LED lamp bead is provided, specifically, the LED bracket with a cup is made, and at least one separating resin (1.2a, 4.2a, 7.2a) is arranged in the middle, and the height of the separating resin is lower than The height of the outer cup resin ((1.2, 4.2, 7.2), separate the resin so that the LED bracket forms n small shallow cups in the cup, n≥2, and fix at least two LED chips in at least two shallow cups On the electrode, and form a conductive connection with the electrode, apply different encapsulation glue in each shallow cup, and then apply another encapsulation glue after heating and solidification to form an outer layer of encapsulation glue, covering the surface of the encapsulation glue in each shallow cup , the separation resin has been covered with encapsulant, and then heat to cure all the encapsulant, or apply n-1 kinds of encapsulant in n-1 shallow cups respectively, after heating and solidifying, apply another encapsulant into the nth shallow cup The inside of the cup covers the chip in the nth shallow cup, and also covers the surface of the encapsulant in the n-1 shallow cups that already have encapsulant. The glue is cured, and a multi-color LED lamp bead is produced. The light emitted by all the chips of the lamp bead must pass through the outer packaging glue and then be sent out. The lamp beads can light up one chip and emit light respectively. The lights of different colors can light up at least two chips at the same time, mix the light in the outer encapsulation glue, and then emit light. The lamp beads can emit light of various colors.

According to a preferred embodiment of the present invention, the multi-color LED lamp bead includes: an LED bracket; a plurality of LED chips; a variety of encapsulation glue; it is characterized in that the LED bracket is an LED bracket with a cup, There is at least one separation resin in the cup, and the height of the separation resin is lower than that of the outer cup resin. The separation resin partition forms at least two small shallow cups, and at least two LED chips have been respectively fixed on the metal electrodes of each shallow cup , and has formed a conductive connection with the electrodes. There is one chip in a shallow cup or there are multiple chips in a shallow cup. Various packaging glues have been sealed in each shallow cup, and only one kind is exposed at the mouth of the large cup. The packaging glue forms the outer packaging glue, the packaging glue has covered the separation resin, the packaging glue has covered all the small shallow cups, the multi-color LED lamp beads, all the light emitted by the chips must first pass through the outer packaging glue Then emit outward, the above-mentioned multi-color LED lamp bead can respectively light up one chip to emit light of different colors, or can light up at least two chips at the same time, and the light emitted is mixed in the outer packaging glue After emitting outward, the lamp beads can emit light of various colors.

According to a preferred embodiment of the present invention, the multi-color LED bead is characterized in that the outer layer of encapsulant is a different encapsulant from the encapsulant in each shallow cup.

According to a preferred embodiment of the present invention, the multi-color LED lamp bead is characterized in that the outer layer of encapsulant is the same as the encapsulant in one of the shallow cups.

According to a preferred embodiment of the present invention, the above-mentioned multi-color LED lamp bead is characterized in that there are a plurality of welding feet outside the lamp bead, and the plurality of welding feet are respectively connected to a plurality of electrodes in the bracket cup .

According to a preferred embodiment of the present invention, the above-mentioned multi-color LED lamp bead is characterized in that the encapsulation glue in the lamp bead is a variety of encapsulation glues, all of which contain phosphor powder respectively, or both There are encapsulants containing phosphors and encapsulants without phosphors.

According to a preferred embodiment of the present invention, the multi-color LED lamp bead is characterized in that the LED chip is a formally mounted LED chip, and the conduction connection between the chip and the electrode is connected by a welding wire. conduction, or both the soldering wire connection and the conductive adhesive connection are conductive.

According to a preferred embodiment of the present invention, the multi-color LED lamp bead is characterized in that the LED chip is a flip-chip LED chip, and the connection and conduction between the chip and the electrode is conducted by soldering , or connected by conductive glue.

The details of one or more embodiments of the invention are set forth in the following description of the accompanying drawings and the detailed description.

Description of drawings

The features, objects and advantages of the present invention will become more apparent by reading this specification in conjunction with the following drawings, a brief description of which follows.

Fig. 1 is a schematic cross-sectional view of a two-color lamp bead in the existing industry.

Figure 2 is a schematic cross-sectional view of a two-color stent.

Figure 3 is a schematic front view of the two-color stent.

Fig. 4 is a schematic perspective view of a two-color stent.

FIG. 5 is a schematic cross-sectional view of the two-color stent after die bonding and wire bonding.

Fig. 6 is a schematic cross-sectional view of a two-color lamp bead manufactured by method (1).

Fig. 7 is a schematic cross-sectional view of a two-color lamp bead manufactured by method (2).

FIG. 8 is a schematic cross-sectional view of an RGB+single white light lamp bead in the existing industry.

Fig. 9 is a schematic cross-sectional view of a double-cup holder of RGB+single white light.

FIG. 10 is a schematic plan view of a dual-cup holder with RGB+single white light.

Fig. 11 is a perspective schematic diagram of a double-cup holder with RGB+single white light.

Fig. 12 is a schematic cross-sectional view of a RGB+single white light double-cup bracket after die-bonding and wire bonding.

Figure 13 is a schematic cross-sectional view of a lamp bead made of a RGB+single white light double-cup bracket.

Fig. 14 is a cross-sectional schematic diagram of an RGB+double white light bead in the existing industry.

Fig. 15 is a schematic cross-sectional view of an RGB+double white light three-cup holder.

Figure 16 is a schematic plan view of the RGB+double white light three-cup holder.

Fig. 17 is a three-dimensional schematic diagram of an RGB+double white light three-cup holder.

Fig. 18 is a schematic cross-sectional view of the RGB + double white light three-cup bracket after die bonding and wire bonding.

Figure 19 is a schematic cross-sectional view of a lamp bead made of an RGB+ double white light three-cup bracket.

Detailed ways

The present invention will be described in detail below by taking preferred embodiments as examples.

However, those skilled in the art should understand that the following descriptions are only examples and descriptions of some preferred implementations, and do not have any limitations on the claims of the present invention.

Embodiment one

Production of a two-color lamp bead

1. Fabrication of Two-color Scaffolds

Punch 0.2mm copper plate 1.1 with a punch and a mold to make the prototype of the bracket circuit. After electroplating, use an injection mold to inject resin 1.2 to make a cup-shaped bracket with four solder feet. The inner height of the cup wall is 0.4mm. There is a separation resin in the middle, and the height of the separation resin 1.2a is 0.2mm. The separation resin divides the large cup into two shallow small cups, and there are two metal electrodes in each small cup (Fig. 2, Fig. 3, Fig. 4).

2. Die bonding wire

Fix the two blue-ray chips 2.1 on one of the electrodes in the two small cups with crystal-bonding glue and a crystal-bonding machine, and then use a KS wire bonding machine to weld the wires to make the positive and negative electrodes of the chip and the positive and negative electrodes of the bracket respectively. The negative pole is connected (Figure 5).

3. Preparation of encapsulant

method one)

Two kinds of silica gel 3.1a and 3.1b containing fluorescent powder were respectively applied to two small cups with a glue dispenser, and heated in an oven at 100 degrees Celsius for 60 minutes to pre-cure until it does not flow.

Then use a dispenser to apply transparent silicone 3.1c to fill the entire large cup, heat it in an oven to 150 degrees Celsius, and heat it for 240 minutes to completely cure all the glue (Figure 6).

Method Two)

First apply a phosphor glue 3.1a in a small cup with a dispenser, heat it in an oven at 100 degrees Celsius, bake for 60 minutes, pre-cure, and then apply another phosphor glue 3.1b in another small cup and continue to apply to fill or nearly fill the entire large cup. At this time, the phosphor glue added later has covered the surface of the front phosphor glue. Heat it in an oven at 150 degrees Celsius for 240 minutes to make the two Seed glue is completely cured (Figure 7).

Embodiment two

Production of a RGB + single white light lamp bead

1. Fabrication of double-cup brackets with RGB+single white light

Punch 0.2mm copper plate 4.1 with a punch and a mold to make the prototype of the bracket circuit. After electroplating, use an injection mold to inject resin 4.2 to make a cup-shaped bracket with 8 solder feet. The inner height of the cup wall is 0.5mm. There is a separation resin 4.2a in the middle, and the height of the separation resin is 0.2mm. The separation resin divides the large cup into two shallow small cups. There are 2 metal electrodes in the small cup, and 6 metal electrodes in the other small cup ( Figure 9, Figure 10, Figure 11).

2. Die bonding wire

Fix a blue-ray chip 5.1a on one electrode in a small cup with two electrodes with crystal-bonding glue and a crystal-bonding machine, and fix the blue-light chip 5.1a and green-light chip 5.1c on the other with epoxy crystal-bonding glue On the two electrodes of a small cup, fix the red light chip 5.1b on the other electrode of the small cup with silver glue, heat the crystal glue to fix the bottom, and then use the KS wire bonding machine to weld the wires, respectively Connect the positive and negative electrodes of the blue-green light chip with the positive and negative electrodes of the support, conduct the surface electrode of the red light chip with the other electrode of the support, and conduct the bottom electrode of the red light through the silver glue and the bottom electrode ( Figure 12).

3. Preparation of encapsulant

First use a dispenser to apply a phosphor glue 6.1a in a small cup with only a blue-ray chip, heat it in an oven at 100 degrees Celsius, bake for 60 minutes, pre-cure, and then apply another silica gel 6.1b in another small cup In, and continue to apply to fill or nearly fill the entire large cup, at this time, the silica gel added later has covered the surface of the phosphor glue in front. In the oven at 150 degrees Celsius, heat for 240 minutes, so that the two glues are completely cured (Figure 13).

Embodiment three

Production of an RGB ten-pair white light bead

1. Fabrication of RGB ten-pair white-light three-cup stand

Punch 0.2mm copper plate 7.1 with a punch and a mold to make the prototype of the bracket circuit. After electroplating, use an injection mold to inject resin 7.2 to make a cup-shaped bracket with 10 solder feet. The inner height of the cup wall is 0.5mm. There are two partition resins 7.2a, the height of the partition resin is 0.2mm, the partition resin divides the large cup into three shallow cups, two small cups have 2 metal electrodes, and the other small cup has 6 a metal electrode (Figure 15, Figure 16, Figure 17).

2. Die bonding wire

2. Die bonding wire

Fix the two blue-ray chips 8.1a on one electrode in two small cups with two electrodes respectively with crystal-bonding glue and a crystal-bonding machine, and glue the blue-light chip 8.1a and the green-light chip 8.1 with epoxy crystal-bonding glue c is fixed on the two electrodes of another small cup, and the red light chip 8.1b is also fixed on the other electrode of this small cup with silver glue, heated to solidify the crystal-bonding glue, and then welded with KS wire bonding machine Connect the positive and negative electrodes of the blue and green light chip with the positive and negative electrodes of the bracket respectively, and connect the surface electrode of the red light chip with the other electrode of the bracket. The bottom electrode of the red light has been formed by silver glue and the bottom electrode conduction (Figure 18).

3. Preparation of encapsulant

First use a dispenser to apply two kinds of phosphor glue 9.1a and 9.1b respectively in two small cups with only blue-ray chips, heat in an oven at 100 degrees Celsius, bake for 60 minutes, pre-cure, and then apply another silica gel 9.1 c in another small cup, and continue to apply to fill or nearly fill the entire large cup. At this time, the silica gel added later has covered the surface of the two phosphor glues in front. In the oven at 150 degrees Celsius, heat for 240 minutes, so that the two glues are completely cured (Figure 19).

A specific embodiment of a multi-color LED lamp bead has been described in detail above in conjunction with the accompanying drawings. However, those skilled in the art should understand that the above descriptions are only examples and descriptions of some specific implementations, and do not limit the scope of the present invention, especially the scope of the claims.

Claims (8)

1. A method for manufacturing multi-color LED lamp beads includes the steps of manufacturing an LED support with a cup, arranging at least one separation resin (1.2 a, 4.2a and 7.2 a) in the middle, enabling the separation resin to enable the LED support to form n small light cups in the cup, enabling n to be more than or equal to 2, fixing at least two LED chips on electrodes in the at least two light cups respectively, enabling the LED chips to be in conduction connection with the electrodes, respectively applying different packaging adhesives in each light cup, heating and solidifying, then applying one packaging adhesive to form outer packaging adhesives, covering the surfaces of the packaging adhesives in the light cups, enabling the separation resin to be covered by the packaging adhesives, reheating to enable all the packaging adhesives to be solidified, or respectively applying n-1 packaging adhesives in the n-1 light cups, enabling one packaging adhesive to enter the n-1 light cup to cover chips of the n-th light cup, enabling the at least two LED chips to be covered in the n-1 light cup to be provided with the packaging adhesive, enabling the LED chips to be different from the outer layers to be formed into the outer layers of the LED lamp beads, and enabling the LED lamp beads to be different from being capable of being exposed to the outer layers to be formed, and enabling the LED lamp beads to be different from the outer layers to be different from the LED lamp beads to be different from the outer layers.

2. A multi-colored LED lamp bead comprising:

an LED bracket;

a plurality of LED chips;

a plurality of packaging adhesives;

the LED support is characterized in that the LED support is provided with a cup, at least one separation resin is arranged in the cup, the height of the separation resin is lower than that of the outer cup, at least two small light cups are formed by the separation resin, at least two LED chips are respectively fixed on metal electrodes of the light cups and are in conductive connection with the electrodes, one chip or a plurality of chips are arranged in one light cup, a plurality of packaging adhesives are respectively sealed in the light cups, only one packaging adhesive is exposed at a large cup opening to form an outer packaging adhesive, the separation resin is covered by the packaging adhesive, all small light cups are covered by the packaging adhesive, the multicolor LED lamp beads are respectively lighted by one chip after penetrating through the outer packaging adhesive, or the at least two chips are simultaneously lighted by the multicolor LED lamp beads, the emitted light can be respectively lighted by one chip after being mixed with the outer packaging adhesive, and the light can be emitted by the lamp beads with a plurality of colors.

3. The LED lamp bead of claim 1 or 2, wherein the outer layer of encapsulant is a different encapsulant than the encapsulant in each of the cups.

4. The LED lamp bead of claim 1 or 2, wherein the outer encapsulant is the same encapsulant as the encapsulant in one of the cups.

5. The multi-color LED lamp bead according to claim 1 or 2, wherein a plurality of fillets are provided outside the lamp bead, the plurality of fillets being respectively connected to a plurality of electrodes in the support cup.

6. The multi-color LED lamp bead according to claim 1 or 2, wherein the encapsulant in the lamp bead is a plurality of types of encapsulant, each of which is a phosphor-containing encapsulant, or both of which is a phosphor-containing encapsulant and a phosphor-free encapsulant.

7. A multi-color LED lamp bead according to claim 1 or 2, wherein the LED chip is a front-mounted LED chip, and the conductive connection between the chip and the electrode is by wire bonding or by both wire bonding and conductive adhesive bonding.

8. A multi-color LED lamp bead according to claim 1 or 2, wherein the LED chip is a flip-chip LED chip, and the connection between the chip and the electrode is via solder connection or via conductive paste connection.

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