CN116113812A

CN116113812A - Infrared temperature measurement module, terminal equipment and temperature measurement method

Info

Publication number: CN116113812A
Application number: CN202180055581.7A
Authority: CN
Inventors: 魏罕钢; 蒋泽娇; 李刚; 王洋荣
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2020-08-28
Filing date: 2021-08-20
Publication date: 2023-05-12
Also published as: WO2022042442A1; CN116113812A8; CN114112045A

Abstract

An infrared temperature measurement module (100), a terminal device (1000) having the infrared temperature measurement module (100), and a temperature measurement method applied to the terminal device (1000). The infrared temperature measurement module (100) includes a casing (110), an infrared lens (120), an infrared sensing chip (130), a circuit board (140) and a processor (150). The infrared sensor chip (130) and the processor (150) are electrically connected with the circuit board (140). The infrared lens (120) focuses the infrared radiation light on the infrared sensor chip (130), and the infrared lens (120) and the infrared sensor chip (130) are accommodated in the casing (110). The infrared temperature measurement module (100) also includes a packaging body (160) for packaging the infrared sensor chip (130) that can transmit infrared light. The infrared temperature measurement module (100) can realize relatively long-distance temperature measurement, and solve the problem that the existing terminal equipment needs to be close to the object to be measured to measure the temperature, thereby greatly improving the user experience.

Description

PCT国内申请，说明书已公开。PCT domestic application, specification has been published.

Claims

The infrared temperature measurement module is characterized by comprising a shell, an infrared lens, an infrared sensing chip, a circuit board and a processor, wherein the infrared sensing chip and the processor are electrically connected with the circuit board;

the infrared lens focuses infrared radiation rays on the infrared sensing chip, and the infrared lens and the infrared sensing chip are accommodated in the shell;

the infrared temperature measurement module further comprises an encapsulation body which can transmit infrared light and is used for encapsulating the infrared sensing chip.
The infrared temperature measurement module of claim 1, wherein the infrared sensor chip is disposed directly below the infrared lens such that an optical axis of the infrared sensor chip substantially coincides with an optical axis of the infrared lens.
The infrared thermometry module of claim 1 or 2, wherein the infrared lens is located at the top end of the housing such that the infrared lens top surface is exposed to the outside and is flush with the top of the housing.
An infrared thermometry module according to any of claims 1 to 3, characterized in that the package is made of silicon.
The infrared thermometry module of any one of claims 1 to 4, wherein the infrared sensing chip comprises a photosensitive region and a non-photosensitive region surrounding the photosensitive region around the photosensitive region;

the package body only packages the photosensitive area of the infrared sensing chip, or the package body integrally packages the infrared sensing chip.
The infrared temperature measurement module according to any one of claims 1 to 5, wherein the infrared sensor chip is encapsulated in an inert gas through the encapsulation body.
The infrared temperature measurement module of claim 6, wherein the inert gas is nitrogen.
The infrared temperature measurement module according to claim 6 or 7, wherein the package body is provided with a groove at a side facing the photosensitive area, inert gas is filled in the groove of the package body, and the package body is provided for packaging at least the photosensitive area of the infrared sensor chip in an inert gas environment by using the groove.
The infrared temperature measurement module according to claim 5, wherein the surface of the non-photosensitive area is coated with an opaque material.
The infrared temperature measurement module according to claim 5, wherein a cavity is arranged on a side of the infrared sensor chip, which is opposite to the photosensitive area, and an opening of the cavity faces the circuit board.
The infrared temperature measurement module according to claim 10, wherein an area of the cavity is larger than an area of the photosensitive region and smaller than an area of the infrared sensing chip as viewed in an optical axis direction.
The infrared temperature measurement module according to claim 10 or 11, wherein a ratio of an area of the cavity to an area of the infrared sensor chip is in a range of 0.1 to 1; and/or the ratio of the area of the cavity to the area of the photosensitive region is in the range of 4 to 6.
The infrared temperature measurement module according to any one of claims 10 to 12, wherein a ratio of a thickness of the cavity to a thickness of the infrared sensor chip is in a range of 0.7 to 0.9 in an optical axis direction.
The infrared thermometry module of any one of claims 1 to 13, wherein the infrared lens is a silicon infrared lens.
The infrared thermometry module of any one of claims 1 to 14, wherein the field angle of the infrared lens is between 6 ° and 8 °.
The infrared temperature measurement module as set forth in any one of claims 1 to 15, wherein the infrared sensor chip is packaged on the circuit board by a ball grid array packaging process.
The infrared thermometry module of any one of claims 1 to 16, further comprising a thermistor housed within the housing, the thermistor being disposed on and electrically connected to the circuit board.
The infrared thermometry module of any one of claims 1 to 17, wherein the processor is disposed on the circuit board and housed within the housing; alternatively, the processor is disposed outside the housing and electrically connected to the circuit board through a connector.
The infrared temperature measurement module as set forth in any one of claims 1 to 18, wherein the circuit board is provided with a slot, and the infrared sensor chip is disposed in the slot and electrically connected to the circuit board by a wire.
The infrared temperature measurement module as set forth in any one of claims 1 to 19, wherein the circuit board is provided with a through opening, and the infrared sensor chip is disposed in the opening and electrically connected to the circuit board by a wire.
The infrared temperature measurement module as set forth in any one of claims 1 to 20, further comprising a stiffening plate attached to the bottom of the circuit board so as to conduct away heat generated by the circuit board during operation.
A terminal device, characterized in that it comprises an infrared temperature measurement module according to any one of claims 1 to 21, an input module and a display module, said input module and said display module being connected with said infrared temperature measurement module;

the input module is configured to input a temperature measurement instruction and transmit the temperature measurement instruction to the infrared temperature measurement module;

the infrared temperature measurement module is configured to receive the temperature measurement instruction, respond to the temperature measurement instruction to perform temperature measurement, and transmit the measured temperature value to the display module;

the display module is configured to receive and display the temperature value.
A temperature measurement method applied to the terminal device according to claim 22, characterized in that the temperature measurement method comprises:

receiving a temperature measurement instruction on an input module;

the infrared temperature measurement module is used for performing temperature measurement in response to the temperature measurement instruction and transmitting the measured temperature value to the display module;

and displaying the temperature value on a display module.