CN116111432A - A cooling device for a pump laser and an optical fiber amplifier - Google Patents

Abstract

The embodiment of the application discloses a heat abstractor of pump laser, optical fiber amplifier relates to the optical fiber equipment field, can satisfy simultaneously at high temperature heat dissipation, low temperature heat preservation in-process reduces the demand of semiconductor refrigerator refrigeration (heat) consumption. The heat dissipation device of the pump laser comprises a heat transfer component and a heat dissipation component, wherein the heat transfer component comprises a first heat pipe, a working medium is arranged in the first heat pipe, the first heat pipe comprises an evaporation section and a condensation section, the evaporation section of the first heat pipe is used for being connected with the pump laser, and when the temperature is higher than a first temperature value, the working medium in the evaporation section is gasified, and heat is transferred to the condensation section; and the heat dissipation assembly is connected with the condensation section of the first heat pipe and is used for transferring heat of the first heat pipe assembly to the outside of the heat dissipation device. The heat dissipation device of the pump laser is used for heat dissipation of the pump laser.

Description

A cooling device for a pump laser and an optical fiber amplifier

technical field

The present application relates to, but is not limited to, the field of optical fiber equipment, and in particular relates to a cooling device for a pump laser and an optical fiber amplifier disclosed in the embodiment of the present application.

Background technique

Optical fiber amplifier is an important device widely used in long-distance, large-capacity, high-speed optical fiber communication. It can amplify the power of the passing optical signal through the DC optical excitation provided by the pump laser to achieve multi-channel applications.

With the continuous complexity of applications, fiber amplifiers need to meet the temperature requirements of different environments, especially to ensure that the pump laser can work normally and stably within a wide temperature range. The core temperature of the pump laser in the fiber amplifier module is generally dynamically controlled and adjusted by a cooling (heating) semiconductor cooler (thermo electric cooler, TEC). However, during the control and adjustment process, the cooling (heating) TEC will generate corresponding power consumption according to the actual temperature difference that needs to be adjusted, thereby increasing the overall power consumption of the optical fiber amplifier module.

In order to reduce the extra power consumption generated by the cooling (heat) TEC during the process of controlling the temperature of the pump laser tube core and reduce the overall power consumption of the entire fiber amplifier module, the existing heat dissipation structure of the fiber amplifier can only reduce the heat dissipation at high temperature. The power consumption of cooling TEC or the power consumption of heating TEC during low-temperature heat preservation cannot simultaneously meet the needs of reducing TEC cooling (heat) power consumption during high-temperature heat dissipation and low-temperature heat preservation.

Contents of the invention

The embodiment of the present application provides a pump laser heat dissipation device and an optical fiber amplifier, which can simultaneously meet the requirements of reducing TEC cooling (heat) power consumption during high-temperature heat dissipation and low-temperature heat preservation.

In order to achieve the above object, the technical solution of the embodiment of the present application is achieved in this way:

In the first aspect, the heat dissipation device for a pump laser provided by the present application includes two parts: a heat transfer assembly and a heat dissipation assembly, wherein the heat transfer assembly includes a first heat pipe, a working fluid is arranged in the first heat pipe, and the first heat pipe includes The evaporating section and the condensing section, the evaporating section of the first heat pipe is used to connect with the pump laser, when the temperature is greater than the first temperature value, the working medium in the evaporating section is vaporized, and the heat is transferred to the condensing section; The condensation section of a heat pipe is connected to transfer the heat of the first heat pipe assembly to the outside of the heat sink.

The heat dissipation device of the pump laser provided in the embodiment of the present application includes a heat transfer component and a heat dissipation component. The heat transfer component includes a first heat pipe, and a working fluid is arranged in the first heat pipe. The first heat pipe includes an evaporation section and a condensation section. The evaporation section of a heat pipe is connected to the pump laser, and the condensation section is connected to the heat dissipation component. When the operating temperature of the pump laser exceeds its own specified value, and the operating temperature of the pump laser is greater than the minimum vaporization temperature of the working fluid , the working medium in the evaporation section is vaporized, and the temperature of the pump laser is transferred from the heat transfer component to the heat sink component, and then transferred to the outside of the heat sink, which lowers the temperature of the pump laser to a certain extent and reduces the temperature of the pump laser in a high temperature environment. Lower the cooling power of the TEC in the pump laser. When the working temperature of the pump laser is lower than its own specified value, and the working temperature of the pump laser is lower than the minimum vaporization temperature of the working fluid, the working fluid in the evaporation section cannot be vaporized, and the heat transfer component is equivalent to a shielding layer , which slows down the heat dissipation of the pump laser when working at a low temperature, and reduces the heating power of the TEC in the pump laser in a low temperature environment. Compared with the existing heat dissipation structure of pump lasers, which can only reduce the power consumption of cooling TEC during high-temperature heat dissipation or the power consumption of heating TEC during low-temperature heat preservation, the technical solution provided by this application can meet the requirements of high-temperature heat dissipation and low-temperature heat preservation at the same time. The need to reduce TEC cooling (heat) power consumption.

In a possible implementation manner of the present application, the heat transfer assembly further includes a heat conduction element, the heat conduction element is arranged between the pump laser and the heat dissipation assembly, the first heat pipe is penetrated inside the heat conduction element, and the first heat pipe is vaporized During the process, the evaporation section of the first heat pipe is in contact with the pump laser, and the contact area between the first heat pipe evaporation section and the pump laser determines the rate of heat transfer. Therefore, the heat transfer component also includes a heat conduction element. The component is arranged between the pump laser and the heat dissipation component, and the heat conduction component can directly contact the heat dissipation component. On the other hand, the first heat pipe is penetrated inside the heat conduction component, which increases the contact area of the evaporation section of the first heat pipe. Increased the rate at which pump lasers dissipate heat.

In a possible implementation of the present application, the first heat pipe is a micro heat pipe, and the first heat pipe can be a micro heat pipe. Since the first heat pipe is installed inside the heat conduction element, the size of the heat conduction element depends on the size of the first heat pipe. Size, if the first heat pipe is a conventional heat pipe, then the size of the heat conductor needs to be larger than the first heat pipe, and the first heat pipe is selected as a miniature heat pipe, which can reduce the size of the heat sink of the entire pump laser and reduce the space in the fiber amplifier .

In a possible implementation of the present application, there are multiple first heat pipes, multiple first heat pipes are arranged in the heat transfer assembly, and the evaporation sections of the multiple first heat pipes are connected to the pump laser. When the temperature of the laser is too high and heat dissipation is required, the evaporation sections of the multiple first heat pipes are vaporized at the same time, which increases the heat dissipation rate of the heat dissipation device.

In a possible implementation of the present application, a plurality of first heat pipes are evenly threaded inside the heat conduction element, and when the plurality of first heat pipes are threaded inside the heat conduction element, the heat inside the heat conduction element is uniform, If the first heat pipes are not evenly arranged, in some places the first heat pipes are arranged too much, and the heat to be transferred is too little, resulting in a waste of resources; in some places, the first heat pipes are arranged too few, and the heat to be transferred cannot be transferred out , causing heat to stay in the heat conducting part, reducing the heat dissipation rate of the heat sink. Therefore, a plurality of first heat pipes are uniformly arranged inside the heat-conducting element, realizing rational utilization of resources.

In a possible implementation of the present application, the heat dissipation assembly includes a heat dissipation plate, and the heat dissipation plate is connected to the condensation section of the first heat pipe, and the condensation section of the first heat pipe is connected to the heat dissipation plate. On the one hand, the condensation section of the first heat pipe The heat of liquefaction can be transferred out through the exchange with the outside air. On the one hand, it can also be transferred through the heat sink to quickly reduce the heat generated by the gasification of the condensation section of the first heat pipe, so that the working fluid in the condensation section of the first heat pipe can be rapidly liquefied. The evaporation section of the first heat pipe repeats the two-phase transformation of gasification and liquefaction of the working fluid, and transfers the heat in the pump laser.

In a possible implementation of the present application, the heat dissipation component includes a second heat pipe, a working fluid is arranged in the second heat pipe, the second heat pipe includes an evaporation section and a condensation section, and the evaporation section of the second heat pipe and the condensation section of the first heat pipe sections are connected and the first heat pipe and the second heat pipe are vertically arranged, and the heat dissipation assembly can also include the second heat pipe. Similarly, the second heat pipe is also provided with a working medium, and also includes an evaporation section and a condensation section, and the evaporation section of the second heat pipe The condensing section of the first heat pipe is connected to the condensation section of the first heat pipe, and the heat transferred by the gasification of the working fluid in the evaporating section of the first heat pipe reaches the condensing section of the first heat pipe, and the condensing section of the first heat pipe is connected to the evaporating section of the second heat pipe. The heat in the condensing section is transferred to the evaporating section of the second heat pipe, the heat in the condensing section of the first heat pipe drops rapidly, the working fluid in the first heat pipe liquefies rapidly, and the heat in the evaporating section of the second heat pipe causes the working fluid in the second heat pipe to vaporize , quickly transfer the heat from the evaporation section of the second heat pipe to the condensation section of the second heat pipe, and finally transfer the heat out. If the first heat pipe and the second heat pipe are arranged in parallel, the condensation section of the first heat pipe and the evaporation section of the second heat pipe are connected to each other. If multiple first heat pipes are provided, multiple second heat pipes also need to be provided, which increases the volume of the heat sink. Therefore, if the first heat pipe and the second heat pipe are vertically arranged, the condensation sections of the plurality of first heat pipes can all act on the evaporation section of the second heat pipe, thereby increasing the heat dissipation area of the heat dissipation device.

In a possible implementation of the present application, a groove is provided on the cooling plate, and the second heat pipe is embedded in the groove. If the second heat pipe is directly combined with the cooling plate, the position of the heat pipe is not fixed, which is not conducive to assembly, so A groove is provided on the heat dissipation plate, the second heat pipe can be embedded in the groove, and the position of the second heat pipe relative to the heat dissipation plate is fixed, which reduces the difficulty of assembly.

In a possible implementation manner of the present application, the first heat pipe and the second heat pipe are normal temperature heat pipes, and the temperature of the normal temperature heat pipes may be 0-200°C.

In a possible implementation of the present application, the gap between the condensing section of the first heat pipe and the evaporating section of the second heat pipe is provided with thermally conductive silver glue, which is used to connect the condensing section of the first heat pipe and the evaporating section of the second heat pipe. The final conductive silver glue is an adhesive with certain conductivity, and the process of conductive silver glue is simple and easy to operate. Can improve work efficiency.

In a possible implementation of the present application, graphene is also provided between the condensing section of the first heat pipe and the evaporating section of the second heat pipe, and the condensing section of the first heat pipe and the evaporating section of the second heat pipe are both The connection is used to transfer the heat from the condensing section of the first heat pipe to the evaporating section of the second heat pipe.

In the second aspect, the embodiment of the present application provides an optical fiber amplifier, which includes a pump laser, and includes a heat sink for the pump laser and a pump laser according to any one of the first aspect, wherein the pump laser includes a pump laser The pump laser includes a pump laser substrate and a pump laser tube shell, and the pump laser substrate is connected with a heat transfer component.

An embodiment of the present application provides an optical fiber amplifier. The optical fiber amplifier includes a pump laser, the base of the pump laser is connected to a heat transfer component, and the cooling device of the pump laser is used to transfer heat from the pump laser. At the same time, Owing to comprising the heat dissipation device of any one of the pump laser in the first aspect, it also has the same technical effect, that is, it can meet the requirements of reducing TEC refrigeration (heat) power consumption in the process of high temperature heat dissipation and low temperature heat preservation. need.

In a possible implementation manner of the present application, a thermally conductive glue is provided between the pump laser substrate and the heat transfer component.

Description of drawings

Fig. 1 is the schematic diagram of optical fiber amplifier in the embodiment of the present application;

Fig. 2 is the schematic diagram of the pump laser in the embodiment of the present application;

Fig. 3 is the schematic diagram of pump laser cooling device in the embodiment of the present application;

4 is a schematic diagram of the connection between the pump laser and the heat transfer assembly in the embodiment of the present application;

FIG. 5 is a schematic diagram of a heat dissipation assembly in an embodiment of the present application;

Fig. 6 is a schematic diagram of the heat transfer assembly in the embodiment of the present application;

FIG. 7 is a partial schematic diagram of a heat dissipation device for a pump laser in an embodiment of the present application.

reference sign

1-heat dissipation device; 11-heat transfer component; 111-first heat pipe; 1111-evaporation section; 1112-condensation section; 112-heat conduction element; Two heat pipes; 1221-evaporation section; 1222-condensation section; 2-pump laser; 21-substrate; 22-shell; 3-thermal silver glue; 4-graphene; 5-thermal glue.

Detailed ways

It should be noted that, in the case of no conflict, the embodiments in the application and the technical features in the embodiments can be combined with each other. Undue Limitation of This Application.

In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the specific technical solutions of the present application will be further described in detail below in conjunction with the drawings in the embodiments of the present application. The following examples are used to illustrate the present application, but not to limit the scope of the present application.

In the embodiments of the present application, the terms "first" and "second" are used for description purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the embodiments of the present application, unless otherwise specified, "plurality" means two or more.

In addition, in the embodiments of the present application, orientation terms such as "upper", "lower", "left" and "right" are defined relative to the schematic placement orientations of components in the drawings. It should be understood that these orientations The terminology is a relative concept, and they are used for description and clarification relative to each other, which may change correspondingly according to the change of orientation of parts placed in the drawings.

In this embodiment of the application, unless otherwise specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral body; it can be a direct connection , can also be indirectly connected through an intermediary.

In the embodiments of the present application, the term "comprising", "comprising" or any other variant thereof is intended to cover a non-exclusive inclusion, such that a process, method, article or device comprising a series of elements not only includes those elements, but also includes Including other elements not expressly listed, or also including elements inherent in such process, method, article or apparatus. Without further limitations, an element defined by the phrase "comprising a ..." does not preclude the presence of additional identical elements in the process, method, article, or apparatus comprising that element.

In the embodiments of the present application, words such as "exemplary" or "for example" are used as examples, illustrations or illustrations. Any embodiment or design solution described as "exemplary" or "for example" in the embodiments of the present application shall not be interpreted as being more preferred or more advantageous than other embodiments or design solutions. Rather, the use of words such as "exemplary" or "such as" is intended to present related concepts in a concrete manner.

Optical fiber amplifier is an important device widely used in long-distance, large-capacity, high-speed optical fiber communication. It can amplify the power of the passing optical signal through the DC optical excitation provided by the pump laser to achieve multi-channel applications.

The embodiment of the present application provides an optical fiber amplifier. Referring to FIG. 1 , it includes a pump laser 2 and a heat sink 1 for the pump laser, wherein the pump laser 2 includes a pump laser substrate 21 and a pump laser shell 22, and the pump laser The laser substrate 21 is connected to the heat transfer component 11 .

As shown in FIG. 1 and FIG. 2 , the fiber amplifier provided by the embodiment of the present application is connected to the heat transfer component 11 through the substrate 21 of the pump laser, and the heat of the pump laser 2 in the fiber amplifier is transferred out through the cooling device 1 .

Referring to Fig. 2 and Fig. 3, the embodiment of the present application provides a pump laser cooling device 1 in an optical fiber amplifier. A small heat exchange system or a cooling system can be added next to the heat generating part of the pump laser 2. The heat exchange system and the cooling system reduce the temperature of the pump laser 2 to achieve the purpose of heat dissipation.

In addition, referring to FIG. 2 and FIG. 4 , the pump laser 2 includes a pump laser substrate 21 and a pump laser shell 22 . The substrate 21 of the pump laser is connected to the heat transfer assembly 11. Since there may be a gap between the substrate 21 and the heat transfer assembly 11 during the connection process, the effect of heat conduction is reduced. Therefore, the pump laser substrate 21 and heat dissipation The heat transfer component 11 of the device is provided with a thermally conductive glue 5, which can be thermally conductive silicone grease, and the thermally conductive glue 5 is filled between the base and the gap between the heat transfer component 11. The thermal components 11 are connected together for convenience. On the other hand, the thermally conductive glue 5 also has a heat conduction function, and quickly transfers the heat on the pump laser 2 along the substrate 21 through the heat transfer component 11 .

Of course, as shown in Figure 1, the pump laser 2 and the heat sink 1 of the pump laser are used in combination in any place suitable for the application of the pump laser 2, and the pump laser 2 and the heat sink 1 of the pump laser can also be used separately , the heat sink 1 of the pump laser can also be applied to other materials that need heat dissipation, and the scope of its application is not limited.

The embodiment of the present application also provides a heat dissipation device for a pump laser. Referring to FIG. The first heat pipe 111 includes an evaporation section 1111 and a condensation section 1112. The evaporation section 1111 of the first heat pipe is used to connect with the pump laser 2. When the temperature is greater than the first temperature value, the working fluid in the evaporation section 1111 is vaporized. The heat is transferred to the condensation section 1112 ; the heat dissipation component 12 is connected to the condensation section 1112 of the first heat pipe, and is used to transfer the heat of the first heat pipe 111 to the outside of the heat dissipation device 1 .

Referring to Fig. 3 and Fig. 4, since the first heat pipe 111 is provided in the heat transfer component 11, and the first heat pipe 111 is provided with a working fluid, generally speaking, the working fluid has two phases, a liquid phase and a gas phase, and the liquid phase is located in the first heat pipe 111. The evaporation section 1111 of a heat pipe, the gas phase is located in the condensation section 1112 of the first heat pipe, the evaporation section 1111 of the first heat pipe is connected to the pump laser 2, when the operating temperature of the pump laser 2 exceeds its own specified value, and the pump laser When the working temperature of 2 is higher than the minimum temperature of gasification of the working fluid, the working fluid in the evaporation section 1111 of the first heat pipe is vaporized, and the condensation section 1112 of the first heat pipe is connected to the heat dissipation component 12. When the working fluid in the evaporation section 1111 is vaporized to the condensation In the section 1112, the temperature is transferred from the evaporating section 1111 to the condensing section 1112 and then to the heat dissipation assembly 12, and then to the outside of the cooling device 1, the temperature of the condensing section 1112 decreases, and the working medium becomes a liquid phase and flows back to the evaporating section 1111. After the continuous conversion of gasification and liquefaction of the working medium, the temperature of the pump laser 2 is transferred from the heat transfer component 11 to the heat dissipation component 12, and then transmitted to the outside of the heat dissipation device 1, which reduces the temperature of the pump laser 2 to a certain extent and reduces the temperature of the pump laser 2. The cooling power of the TEC in the pump laser 2 in a high temperature environment is determined. When the operating temperature of the pump laser 2 is lower than its own specified value, and the operating temperature of the pump laser 2 is lower than the minimum vaporization temperature of the working fluid, the working fluid in the evaporation section 1111 cannot be vaporized, and the heat transfer component 11 is equivalent to As a shielding layer, the heat dissipation of the pump laser 2 is slowed down when working at a low temperature, and the heating power of the TEC in the pump laser 2 is reduced in a low temperature environment. Compared with the existing heat dissipation structure of the pump laser 2, which can only reduce the power consumption of the cooling TEC during high-temperature heat dissipation or the power consumption of heating TEC during low-temperature heat preservation, the technical solution provided by this application satisfies both high-temperature heat dissipation and low-temperature heat preservation. The need to reduce TEC cooling (heat) power consumption during the process.

It should be added that, as shown in Figure 3 and Figure 4, the heat transfer assembly 11 not only includes the first heat pipe 111, in order to increase the contact area of the first heat pipe evaporation section 1111 and improve the heat dissipation rate of the pump laser 2, the heat transfer assembly 11 also includes a heat conduction member 112, which is arranged between the pump laser 2 and the heat dissipation assembly 12, and the first heat pipe 111 is passed through the inside of the heat conduction member 112, when the temperature of the pump laser tube shell 22 is higher, it needs When dissipating heat, on the one hand, the heat conduction member 112 is arranged between the pump laser 2 and the heat dissipation assembly 12, and the heat conduction member 112 is directly in contact with the substrate 21 of the pump laser, so that part of the heat of the pump laser 2 is directly transferred through the heat conduction member 112 On the heat dissipation assembly 12, on the other hand, the first heat pipe 111 is directly penetrated in the heat conduction member 112, and the evaporation section 1111 of the first heat pipe is close to the side of the pump laser 2, which not only can increase the heat dissipation of the first heat pipe evaporation section 1111 The contact area is increased, and the heat transfer speed from the pump laser 2 to the first heat pipe 111 is accelerated, and the heat dissipation rate of the pump laser 2 is accelerated.

Specifically, referring to FIG. 4 , the first heat pipe 111 can be vertically installed on the heat conduction member 112 and the first heat pipe evaporation section 1111 is perpendicular to the pump laser 2, because the first heat pipe 111 is vertically installed on the heat conduction member 112 , due to the gravity factor, the liquefied working fluid can quickly return to the evaporation section 1111 after the temperature of the condensation section 1112 drops, which improves the rate of heat dissipation, and the evaporation section 1111 is perpendicular to the pump laser 2, and the heat of the pump laser 2 can be Evenly acting on the evaporating section 1111 of the first heat pipe, the working medium can be completely vaporized. If the first heat pipe 111 and the pump laser 2 are set at a certain angle, the heat of the first heat pipe evaporating section 1111 cannot be uniformly applied to the first heat pipe. In the evaporating section 1111 of the first heat pipe, the working fluid in the evaporating section 1111 of the first heat pipe cannot be completely vaporized, resulting in a decrease in the heat dissipation rate of the heat sink 1 .

Further, as shown in FIG. 4 , there are multiple first heat pipes 111, and multiple first heat pipes 111 are arranged in the heat conducting member 112. The evaporation sections 1111 of the multiple first heat pipes are connected to the pump laser 2. When the pump When the temperature of the pump laser 2 is too high and heat dissipation is required, the evaporation sections 1111 of the plurality of first heat pipes are vaporized, which increases the heat dissipation rate of the heat dissipation device 1 .

Further, referring to FIG. 4, a plurality of first heat pipes 111 are penetrated in the heat conduction member 112. If the first heat pipes 111 are conventional heat pipes, a plurality of conventional heat pipes 111 are penetrated in the heat conduction member 112, and the heat conduction member 112 has a large size. , resulting in a larger area for the entire cooling device 1, therefore, the first heat pipe 1 is selected as a micro heat pipe, the thickness of the micro heat pipe section is only 0.8-2mm, and when the micro heat pipe is vertically installed on the guide, the micro heat pipe vertically The thermal conductivity of the plane is 3000-15000W/mk, which can reduce the size of the heat sink 1 of the entire pump laser and reduce the space of the pump laser 2 in the fiber amplifier.

In some embodiments provided by the present application, referring to FIG. 1 , a plurality of first heat pipes 111 are pierced inside the heat conduction member 112 . It will result in too many first heat pipes 111 , resulting in waste of resources, and will not cause retention of heat inside the heat conducting element 112 . Reduce the heat dissipation rate of the heat sink 1, so the present application provides a preferred solution, a plurality of first heat pipes 111 are evenly arranged inside the heat conduction member 112, and the penetration depth of the plurality of first heat pipes 111 inside the heat conduction member 112 Similarly, the heat at the same depth inside the heat conducting element 112 is uniform, and the heat received by the multiple first heat pipes 111 is also uniform. If the first heat pipes 111 are not evenly arranged, there are too many first heat pipes 111 in some places, which need to be transferred. The amount of heat is too little, resulting in a waste of resources. In some places, the arrangement of the first heat pipes 111 is too small, and the heat to be transferred cannot be transferred out, resulting in heat retention in the heat conducting member 111, which reduces the heat dissipation rate of the heat sink 1. Therefore, a plurality of first heat pipes 111 are uniformly arranged inside the heat-conducting element 112 , realizing rational utilization of resources.

In some other embodiments provided by the present application, as shown in FIG. 4 and FIG. 5 , the heat dissipation assembly 12 includes a heat dissipation plate 121, and the heat dissipation plate 121 is connected with the condensation section 1112 of the first heat pipe, and connects the condensation section 1112 of the first heat pipe Connected with the heat dissipation plate 121, on the one hand, the heat of vaporization of the condensation section 1112 of the first heat pipe can be transferred out through the exchange with the outside air, and on the other hand, it can also be transmitted through the heat dissipation plate 121, so that the heat of the condensation section 1112 of the first heat pipe can be rapidly reduced. The heat generated by the gasification of the work makes the working fluid in the condensation section 1112 of the first heat pipe rapidly liquefy and flow to the evaporation section 1111 of the first heat pipe, and then repeat the gasification and liquefaction two-phase transformation of the working fluid, and the pump laser 2 The heat is transferred out.

Specifically, referring to Fig. 4 and Fig. 5, the first heat pipe 111 is penetrated in the heat conduction element 112, and the first heat pipe 111 may be wholly or partially penetrated in the heat conduction element 112. When all the first heat pipes 111 are installed inside the heat conducting member 112, the evaporating section 1111 of the first heat pipe is close to the side of the pump laser 2, the condensation section 1112 of the first heat pipe is close to the side of the cooling plate 121, and the heat conducting member 112 and The cooling plates 121 are connected by welding or bonding. When the first heat pipe 111 partially passes through the inside of the heat conducting member 112 , the condensation section 1112 of the first heat pipe is connected to the heat dissipation plate 121 by welding or bonding.

In some other embodiments provided by the present application, referring to FIG. 2 , FIG. 5 and FIG. 6 , the heat dissipation assembly includes a second heat pipe 122 , and a working fluid is arranged in the second heat pipe 122 , and the second heat pipe includes an evaporation section 1221 and a condensation section. 1222, the evaporation section 1221 of the second heat pipe is connected to the condensation section 1112 of the first heat pipe, and the first heat pipe 111 and the second heat pipe 122 are vertically arranged. There is also a working fluid, which also includes an evaporation section 1221 and a condensation section 1222. The evaporation section 1221 of the second heat pipe is connected to the condensation section 1112 of the first heat pipe. The condensing section 1112 of the first heat pipe, the condensing section 1112 of the first heat pipe is connected to the evaporating section 1221 of the second heat pipe, and the heat of the condensing section 1112 of the first heat pipe is transferred to the evaporating section 1221 of the second heat pipe, and the condensing section 1112 of the first heat pipe The heat of the second heat pipe 122 rapidly drops, the working fluid in the first heat pipe 111 liquefies rapidly, and the heat of the second heat pipe evaporating section 1221 causes the working fluid in the second heat pipe 122 to vaporize, and the heat of the second heat pipe evaporating section 1221 is quickly transferred to the second heat pipe. The condensing section 1222 of the heat pipe finally transfers the heat out. If the first heat pipe 111 and the second heat pipe 122 are arranged in parallel, the first heat pipe condensing section 1112 and the second heat pipe evaporating section 1221 are connected to each other, and the thermal conductivity of the first heat pipe 111 is 3000-15000W/mk, and the thermal conductivity of the second heat pipe 122 The coefficient is 3000-10000W/mk. If multiple first heat pipes 111 are provided, multiple second heat pipes 122 also need to be provided, which increases the volume of the heat sink 1. Therefore, the first heat pipe 111 and the second heat pipe 122 are arranged vertically. The condensation sections 1112 of the multiple first heat pipes can all act on the evaporation section 1221 of the second heat pipe, which increases the heat dissipation area of the heat dissipation device 1 .

It should be added that referring to Fig. 4 and Fig. 5, the heat dissipation assembly 12 may only be provided with a heat dissipation plate 121, and the heat dissipation plate 121 is directly connected to the condensation section 1112 of the first heat pipe to directly transfer the heat of the first heat pipe 111, or Only the second heat pipe 122 is provided, and the evaporation section 1221 of the second heat pipe is directly connected with the condensation section 1112 of the first heat pipe, and the heat is transferred out through the gas-liquid two-phase conversion of the working fluid, or the cooling plate 121 and the second heat pipe 122 Used in combination, the heat dissipation efficiency of the heat dissipation device 1 is further improved.

As shown in Figure 5 and Figure 6, in order to facilitate the assembly and positioning of the cooling plate 121 and the second heat pipe 122, the present application provides a preferred solution, a groove 1211 is provided on the cooling plate, and the second heat pipe 122 is embedded in the groove In 1211, if the second heat pipe 122 is directly combined with the heat dissipation plate 121, the position of the heat pipe is not fixed, which is not conducive to assembly. Therefore, a groove 1211 is provided on the heat dissipation plate 121, and the second heat pipe 122 can be embedded in the groove 1211 , the position of the second heat pipe 122 relative to the heat sink 121 is fixed, which reduces the difficulty of assembly. It should be added that both the first heat pipe 111 and the second heat pipe 122 can be selected as normal temperature heat pipes, and the temperature of the normal temperature heat pipes can be 0-200°C.

In some embodiments provided in this application, as shown in FIG. 4 , FIG. 5 and FIG. 7 , the condensation section 1112 of the first heat pipe and the evaporation section 1221 of the second heat pipe can be connected by welding or adhesive bonding, equivalent to The gap between the condensation section 1112 of the first heat pipe and the evaporation section 1221 of the second heat pipe increases a part of the medium, if the medium does not conduct heat, the medium blocks the condensation section 1112 of the first heat pipe from the evaporation section 1221 of the second heat pipe The heat of transfer, therefore, the application provides a kind of preferred scheme, select two kinds of materials of thermally conductive silver glue 3 and graphene 4, because the conductive silver glue 3 after drying is the adhesive with certain conductivity, and graphene 4 is a A flexible heat-conducting material, the transverse thermal conductivity of graphene 4 is 600-1000W/mk, graphene 4 is fixedly connected to the condensation section 1112 of the first heat pipe and the evaporation section 1221 of the second heat pipe through the bonding of heat-conducting silver glue, graphite Both ene 3 and heat-conducting silver glue 4 are heat-conducting materials, which will not block the heat transfer from the condensation section 1112 of the first heat pipe to the evaporation section 1221 of the second heat pipe, and will also promote the transfer of heat. efficiency.

The above description is only a preferred embodiment of the present invention, and is not used to limit the protection scope of the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention shall be included in the within the protection scope of the present invention.

Claims (13)

1. A heat sink for a pump laser, comprising:

the heat transfer assembly comprises a first heat pipe, a working medium is arranged in the first heat pipe, the first heat pipe comprises an evaporation section and a condensation section, the evaporation section of the first heat pipe is used for being connected with the pump laser, and when the temperature is higher than a first temperature value, the working medium in the evaporation section is gasified to transfer heat to the condensation section;

and the heat dissipation assembly is connected with the condensation section of the first heat pipe and is used for transferring heat of the first heat pipe assembly to the outside of the heat dissipation device.

2. The heat sink of pump laser of claim 1, wherein the heat transfer assembly further comprises a thermally conductive member disposed between the pump laser and the heat sink assembly, the first heat pipe passing through an interior of the thermally conductive member.

3. The heat sink of a pump laser of claim 2, wherein the first heat pipe is a micro heat pipe.

4. A heat sink for a pump laser as claimed in claim 3, wherein the number of first heat pipes is plural.

5. The heat sink of claim 4, wherein the plurality of first heat pipes are uniformly disposed through the heat conductive member.

6. The heat sink of claim 1, wherein the heat sink assembly comprises a heat sink plate coupled to the condensing section of the first heat pipe.

7. The heat sink of any one of claims 1 to 6, wherein the heat sink comprises a second heat pipe, a working medium is disposed in the second heat pipe, the second heat pipe comprises an evaporation section and a condensation section, the evaporation section of the second heat pipe is connected with the condensation section of the first heat pipe, and the first heat pipe is perpendicular to the second heat pipe.

8. The heat sink of claim 7, wherein the heat sink has a recess, and the second heat pipe is embedded in the recess.

9. The heat sink of pump lasers of claim 7, wherein said first heat pipe and said second heat pipe are ambient temperature heat pipes.

10. The heat sink of claim 7, wherein a gap between the condensing section of the first heat pipe and the evaporating section of the second heat pipe is provided with a heat conductive silver paste for connecting the condensing section of the first heat pipe and the evaporating section of the second heat pipe.

11. The heat sink of pump laser of claim 10, wherein graphene is further disposed between the gap between the condensing section of the first heat pipe and the evaporating section of the second heat pipe, and the graphene connects the condensing section of the first heat pipe and the evaporating section of the second heat pipe, so as to transfer heat of the condensing section of the first heat pipe to the evaporating section of the second heat pipe.

12. An optical fiber amplifier comprising a pump laser, characterized by comprising a heat sink for the pump laser of any one of claims 1-11, the pump laser comprising a pump laser substrate and a pump laser package, the pump laser substrate being connected to the heat transfer assembly.

13. The fiber amplifier of claim 12, wherein a thermally conductive paste is disposed between the pump laser substrate and the heat transfer assembly.

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