CN116105390A - Electronic device, heat dissipation method and readable storage medium - Google Patents

Abstract

The application discloses electronic equipment, a heat dissipation method and a readable storage medium, and belongs to the technical field of electronic equipment. Wherein, electronic equipment includes: a speaker, an acoustic wave collecting device and an acoustic wave refrigerating device; the sound wave collecting device comprises a sound wave collecting port and a sound wave transmission port, the sound wave collecting port faces the loudspeaker, and the sound wave transmission port faces the sound wave refrigerating device; when the loudspeaker is in a working state, the sound wave refrigerating device cools the medium based on the sound waves collected by the sound wave collecting device, and the cooled medium is transmitted to the area where the device to be cooled in the electronic equipment is located.

Description

Electronic device, heat dissipation method and readable storage medium

technical field

The application belongs to the technical field of electronic equipment, and in particular relates to an electronic equipment, a heat dissipation method and a readable storage medium.

Background technique

Electronic devices such as smartphones have the problem that the louder the volume, the more serious the heat of the electronic device. In related technologies, the power consumption of electronic devices is reduced by limiting the maximum volume of electronic devices, reducing frames, and limiting frequency to control the power consumption of electronic devices. The calorific value will not be too large, but these measures also reduce the performance of the electronic device while reducing the calorific value of the control electronic device.

Contents of the invention

The purpose of the embodiments of the present application is to provide an electronic device, a heat dissipation method and a readable storage medium, which use the sound wave cooling device to cool the redundant sound waves emitted by the speaker, so as to realize the heat dissipation function of the speaker.

In the first aspect, an embodiment of the present application provides an electronic device, including: a speaker, a sound wave collecting device, and a sound wave cooling device;

The sound wave collection device includes a sound wave collection port and a sound wave transmission port, the sound wave collection port faces the speaker, and the sound wave transmission port faces the sound wave cooling device;

When the speaker is in a working state, the sound wave cooling device cools the medium based on the sound waves collected by the sound wave collecting device, and transmits the cooled medium to the area of the electronic device where the components to be dissipated are located.

In the second aspect, the embodiment of the present application provides a heat dissipation method, which is applied to the electronic equipment as described in the first aspect. The components to be dissipated in the electronic equipment include a speaker and a CPU, and the electronic equipment also includes a heat dissipation channel and a setting a valve on the cooling channel;

The methods include:

Acquiring first information, where the first information includes at least one of the volume of the electronic device and the current of the whole machine;

The on or off of the valve is controlled according to the first information, so that the sound wave cooling device cools down the speaker and/or the CPU.

In the third aspect, the embodiment of the present application provides an electronic device, the electronic device includes a processor and a memory, the memory stores programs or instructions that can run on the processor, and the programs or instructions are processed by the implement the steps of the method as described in the second aspect when the controller is executed.

In a fourth aspect, an embodiment of the present application provides a readable storage medium, on which a program or an instruction is stored, and when the program or instruction is executed by a processor, the steps of the method described in the second aspect are implemented .

In the fifth aspect, the embodiment of the present application provides a chip, the chip includes a processor and a communication interface, the communication interface is coupled to the processor, and the processor is used to run programs or instructions, so as to implement the second aspect the method described.

In a sixth aspect, an embodiment of the present application provides a computer program product, the program product is stored in a storage medium, and the program product is executed by at least one processor to implement the method described in the second aspect.

In the embodiment of the present application, a sound wave collecting device and a sound wave cooling device are arranged in the electronic equipment, so as to collect redundant sound waves from the speaker based on the sound wave collecting device, so that the sound wave cooling device can perform sound wave cooling, and transmit the cooled medium to the electronic device The device to be dissipated is neutralized, and the heat dissipation speed of the device to be dissipated is accelerated. The heat dissipation measures of the electronic equipment do not limit the maximum volume, frame rate, and frequency of the electronic equipment. Compared with the heat dissipation method in the related art that reduces the power consumption of the electronic equipment by limiting the maximum volume of the electronic equipment, reducing the frame, and limiting the frequency, etc. In other words, the embodiments of the present application can improve the performance of electronic equipment while improving heat dissipation efficiency.

Description of drawings

FIG. 1 is a schematic structural diagram of a first electronic device provided by an embodiment of the present application;

Figure 2 is an enlarged view of area A in Figure 1;

FIG. 3 is a schematic structural diagram of a second electronic device provided by an embodiment of the present application;

FIG. 4 is a schematic diagram of the control logic of the second electronic device provided by the embodiment of the present application;

FIG. 5 is a schematic structural diagram of a third electronic device provided by an embodiment of the present application;

FIG. 6 is a flow chart of a heat dissipation method provided by an embodiment of the present application;

FIG. 7 is a schematic structural diagram of a fourth electronic device provided by an embodiment of the present application.

Detailed ways

The following will clearly describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, but not all of them. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in this application belong to the protection scope of this application.

The terms "first", "second" and the like in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific sequence or sequence. It should be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the application can be practiced in sequences other than those illustrated or described herein, and that references to "first," "second," etc. distinguish Objects are generally of one type, and the number of objects is not limited. For example, there may be one or more first objects. In addition, "and/or" in the specification and claims means at least one of the connected objects, and the character "/" generally means that the related objects are an "or" relationship.

Electronic equipment (taking smart phones as an example) has become an indispensable entertainment device in contemporary people's life because of its advantages of portability and easy operation, but the smart phones in related technologies still have the following defects:

1. The audio effect cannot meet the needs of users, such as: low volume and poor sound effect.

Users have higher and higher requirements for sound effects, such as immersive game experience, theater-level auditory enjoyment, etc. In order to achieve loud and balanced sound field, full and abundant sound quality, it is necessary to increase the power consumption of speakers. At this time, the temperature of speakers is extremely high, and even can When the temperature reaches above 90°C, a high-temperature hotspot will be formed at the corresponding position of the speaker on the back of the mobile phone, making the surface temperature of the mobile phone reach above 45°C. The current solution of various manufacturers is to add a piece of graphite heat dissipation film on the top of the speaker to even out the heat, but the improvement of this solution is limited. In order to effectively limit the temperature rise of the mobile phone, it is also necessary to simultaneously reduce the power consumption of the speaker to ensure the thermal experience of the user.

2. After the mobile phone is used, it will become hot and hot, which will affect the user experience.

With the continuous improvement of mobile phone performance and platform power consumption, the contradiction between heat generation and performance has become more and more prominent. Take games as an example: At present, large-scale mobile games such as Peace Elite and Glory of Kings have been adapted to high configurations such as 90 or 120 frames. At this time, power consumption will rise sharply, and mobile phones are prone to heat problems. In order to avoid overheating, various manufacturers usually adopt strategies such as frame reduction and frequency limitation to reduce power consumption, but at the same time, it will cause problems such as game freezing and unclear picture quality, which will affect the gaming experience.

In related technologies, in order to solve the technical problem of excessive temperature of the hot spot of the speaker, the following solutions are usually adopted:

1) Add a piece of graphite heat dissipation film or other heat dissipation materials above the speaker to even out the heat, but the improvement of this solution is limited, and as the audio power consumption increases, this solution cannot completely solve the problem;

2) Reduce the power consumption of the speaker, thereby reducing the heat generation and improving the thermal experience, but this solution will sacrifice the audio effect;

3) The combination of hardware heat dissipation measures and speaker power consumption optimization is essentially a balance between the first two solutions, and does not fundamentally meet the needs of users for better thermal experience and performance experience.

However, in the embodiment of the present application, the sound energy of the speaker can be used as power to obtain the energy for cooling the medium based on the thermoacoustic effect, wherein the thermoacoustic effect refers to the principle of mutual conversion between heat energy and sound energy. In this way, components such as speakers and CPUs in the electronic equipment can be dissipated based on the cooling medium. In this way, effective heat dissipation can be realized without sacrificing the sound effect and other performances of the electronic equipment.

The electronic device, heat dissipation method, and readable storage medium provided by the embodiments of the present application will be described in detail below through specific embodiments and application scenarios with reference to the accompanying drawings.

Please refer to Figure 1. The electronic device provided by the embodiment of the present application may be a mobile phone, a tablet computer, a smart watch, and other electronic devices with speakers. . As shown in Figure 1, the electronic equipment includes: a speaker 1, a sound wave collecting device 2 and a sound wave cooling device 3;

The sound wave collection device 2 includes a sound wave collection port 21 and a sound wave transmission port 22, the sound wave collection port 21 faces the speaker 1, and the sound wave transmission port 22 faces the sound wave cooling device 3;

When the speaker 1 is in the working state, the sound wave cooling device 3 cools the medium based on the sound waves collected by the sound wave collecting device 2, and transmits the cooled medium to the area of the electronic device where the components to be dissipated are located.

In an implementation manner, the device to be dissipated may be the speaker 1 .

In one embodiment, the device to be dissipated may be a central processing unit (Central Processing Unit, CPU) 4 of an electronic device.

In one embodiment, the devices to be dissipated can be the speaker 1 and the CPU 4.

In an implementation manner, the device to be dissipated may also include other devices in the electronic device, such as a battery, which is not specifically limited here.

In one embodiment, the sonic cooling device 3 can be any device capable of cooling by means of sound waves (for example: 50Hz-20KHz sound waves emitted by the speaker 1). For example, the sonic cooling device 3 mainly includes a resonant cavity, a heat exchanger, For equipment such as plate stacks, the specific structure and principle of the sonic refrigeration device 3 can refer to the sonic refrigerator in the related art, and will not be repeated here.

Optionally, the sound wave transmission port 22 faces the sound wave refrigeration device 3, and the sound wave transmission port 22 may be connected to the sound wave input port of the sound wave refrigeration device 3, so that the sound wave refrigeration device 3 performs sound energy and thermal energy based on the sound waves obtained from the sound wave input port. Conversion, and finally realize the cooling of the cooling medium, and output the cooled medium to the area where the device to be dissipated is located. Wherein, the cooling medium may be air or any other type of heat conduction medium, which is not specifically limited here. Wherein, in the case that the cooling medium is air, the acoustic wave refrigeration device 3 outputs the cooled medium to the area where the heat dissipation device is located, and it can be that the acoustic wave refrigeration device 3 blows the cooled air to the area where the heat dissipation device is located, or It is to blow the cooled air to the area where the components to be dissipated are located through the duct. In the case that the cooling medium is another medium, the acoustic wave refrigeration device 3 outputs the cooled medium to the area where the heat dissipation device is located. It may be that the acoustic wave refrigeration device 3 flows the cooled medium to the area where the heat dissipation device is located through the outflow channel And flow back into the sonic refrigeration device 3 through the return channel, and conduct heat conduction cyclically.

For ease of description, in the embodiments of the present application, the cooling medium is air as an example for illustration.

Optionally, as shown in Figure 2, the aperture of the above-mentioned sound wave collection port 21 is greater than the aperture of the sound wave transmission port 22, so that the sound wave collection device 2 can be in the shape of a horn, so that the sound wave density at the sound wave transmission port 22 is increased, It is beneficial to improve the efficiency of collecting sound waves, thereby improving the efficiency of sound energy acquisition by the sonic cooling device 3, and improving the heat dissipation efficiency of electronic equipment based on sonic cooling.

Optionally, the sound wave collecting port 21 of the sound wave collecting device 2 may be located on the first side of the speaker 1, wherein the sound outlet of the electronic device is located on the second side of the speaker 1, and the first side and the second side are located on the second side of the speaker 1. different sides. In this way, the sound wave collecting device 2 can collect excess sound waves from the speaker 1, reducing the impact on the sound effect of the electronic equipment.

As an optional implementation, the electronic device as shown in the figure also includes: a controller (not shown), a heat dissipation channel 5 and a valve 6 arranged on the heat dissipation channel 5;

The inlet end 51 of the heat dissipation channel 5 is connected to the acoustic wave refrigeration device 3, and the outlet end 52 of the heat dissipation channel 5 faces the device to be dissipated;

The controller is used to control the opening or closing of the valve 6, so as to control the communication or closing of the cooling channel 5.

In an implementation manner, the above-mentioned controller may be any control unit in the electronic device, such as a CPU, etc., which is not specifically limited herein.

In one embodiment, the controller controls the valve 6 to open. At this time, the heat dissipation channel 5 is connected, and the cooling medium pair output by the sonic refrigeration device 3 can reach the area where the heat dissipation device is located, so as to dissipate heat from the heat dissipation device.

In one embodiment, the controller controls the valve 6 to close. At this time, the heat dissipation channel 5 is closed, and the cooling medium output by the acoustic wave refrigeration device 3 cannot reach the area where the heat dissipation device is located. At this time, the heat dissipation device is not radiated.

In this embodiment, the heat dissipation of the device to be dissipated can be turned on or off through the controller and the valve 6 provided on the heat dissipation channel 5 .

Optionally, when the number of components to be dissipated is at least two, heat dissipation channels 5 corresponding to each of the components to be dissipated can be respectively provided, and a valve 6 is provided on each heat dissipation channel 5, wherein, The components to be dissipated are communicated with the cooling medium output port of the acoustic wave refrigeration device 3 through respective corresponding heat dissipating channels 5 . In this way, the controller can control some valves 6 to open and some valves to close, so as to adjust the flow direction of the cooling medium output by the sonic refrigeration device 3, realize heat dissipation for some devices to be dissipated, and improve the pertinence of heat dissipation. For example: when the speaker 1 generates high heat, the controller controls the opening of the valve 6 on the heat dissipation channel 5 connected to the area where the speaker 1 is located, and closes the valves 6 on the other heat dissipation channels 5, so as to control the speaker 1 in a targeted manner. Heat dissipation.

As an optional embodiment, the heat dissipation passage 5 includes a first passage 53 and a second passage 54, and the valve includes a first valve 61 arranged on the first passage 53 and a valve 61 arranged on the second passage 54. second valve 62;

The inlet end of the first passage 53 and the second passage 54 is connected with the sound wave refrigeration device 3, the outlet end of the first passage 53 is toward the loudspeaker 1, and the outlet end of the second passage 54 is toward the CPU 4;

The controller is connected to the first valve 61 and the second valve 62 respectively;

The controller is used to control the opening or closing of the first valve 61 to control the connection or closure of the first passage 53 , and/or the controller is used to control the opening or closing of the second valve 62 to control the connection or closure of the second passage 54 .

In one embodiment, the controller controls the first valve 61 to open, and controls the second valve 62 to close, so that the first channel 53 is communicated, and the second channel 54 is closed, so as to cool the speaker 1 .

In one embodiment, the controller controls the first valve 61 to close, and controls the second valve 62 to open, so that the first channel 53 is closed, and the second channel 54 is connected to cool the CPU 4.

In one embodiment, the controller controls the opening of the first valve 61 and the second valve 62, so that the first passage 53 and the second passage 54 communicate, so as to cool the speaker 1 and the CPU 4.

Optionally, the controller may obtain information such as volume setting and current of the electronic device, so as to determine a control strategy for the first valve 61 and the second valve 62 accordingly.

For example: as shown in Figure 4, the controller identifies the volume setting of the electronic device and the power consumption of the mobile phone, wherein the volume can be the volume of speaker 1, and the power consumption of the mobile phone can be reflected by the current of the whole machine, wherein the current of the whole machine can be the volume of the electronic device output current of the battery. Then, control the first valve 61 and the second valve 62 to be in any one of the following three working states according to the volume and the current of the whole machine:

Working state one: volume>50%, and current<800mA, control the first valve 61 to open, control the second valve 62 to close, to cool the speaker 1;

Working state two: volume <50%, and current >800mA, control the first valve 61 to close, control the second valve 62 to open, to cool the CPU 4;

Working state three: volume > 50%, and current > 800mA, or volume ≤ 50%, and current ≤ 800mA, control the first valve 61 to open, control the second valve 62 to open, to cool the speaker 1 and CPU 4.

It should be noted that the above-mentioned volume threshold (50%) and current threshold (800mA) can be set according to the actual heat generation of the electronic device, hardware parameters, etc., or can be adjusted according to user settings, which are not specifically limited here.

Optionally, as shown in FIG. 3 , at least one of the first channel 53 and the second channel 54 passes through the area where the battery 7 of the electronic device is located.

In this embodiment, at least one of the first channel 53 and the second channel 54 passes through the area where the battery 7 of the electronic device is located, which can dissipate heat from the battery while cooling the speaker 1 and/or the CPU and waiting for the cooling device.

Optionally, as shown in FIG. 3 , the heat dissipation channel 5 further includes a third channel 55 , and the third channel 55 is a common part of the first channel 53 and the second channel 54 .

In this embodiment, the first channel 53 and the second channel 54 have a common part, which can reduce the total length of the first channel 53 and the second channel 54, thereby simplifying the structure of the electronic device.

Of course, in another embodiment, the first channel 53 and the second channel 54 may also be set as independent channels, which are not specifically limited here.

As an optional implementation, as shown in Figure 5, the speaker 1 includes a first speaker 11 and a second speaker 12, the sound wave collecting device 2 includes a first sound wave collecting device 23 and a second sound wave collecting device 24, the sound wave cooling The device 3 includes a first sonic refrigeration device 31 and a second sonic refrigeration device 32;

The first loudspeaker 11, the first sound wave collecting device 23 and the first sound wave cooling device 31 are arranged on the first area 10 of the electronic equipment; the second speaker 12, the second sound wave collecting device 24 and the second sound wave cooling device 32 Set in the second area 20 of the electronic device, the first area and the second area are respectively located in different positions of the electronic device;

The first sound wave collecting device 23 is used to collect the sound waves generated by the first speaker 11 and transmit them to the first sound wave cooling device 31, so as to control the sound waves of the first sound wave cooling device 31 based on the cooling medium output by the first sound wave cooling device 31. A device to be dissipated for heat dissipation, the first device to be dissipated includes at least one of the first speaker 11, the second speaker 12 and the CPU 4;

The second sound wave collection device 24 is used to collect the sound waves generated by the second speaker 12 and transmit them to the second sound wave refrigeration device 32, so as to control the second sound wave based on the cooling medium output by the second sound wave refrigeration device 32. The device to be dissipated dissipates heat, and the second device to be dissipated includes at least one of the first speaker 11, the second speaker 12 and the CPU 4.

In one embodiment, the first speaker 11 may be an upper speaker, and the first area 10 may be a motherboard area of an electronic device, and the motherboard area mainly includes: a first speaker 11, a first sound wave collecting device 23, a first sound wave refrigerating device 31, motherboard printed circuit boards (Printed Circuit Boards, PCB), camera and other components.

In one embodiment, the second speaker 12 can be the lower speaker, and the second area 20 can be the sub-board area of the electronic device, and the sub-board area mainly includes: the second speaker 12, the second sound wave collecting device 24, the second sound wave Refrigerating device 32 and sub-board PCB etc.

In this implementation manner, the electronic device has two speakers, for example, an upper speaker disposed on the top of the electronic device and a lower speaker disposed on the bottom of the mobile phone. At this time, two sets of sound wave cooling components (namely, sound wave collecting device and sound wave cooling device) can be provided to use the sound waves of the two speakers for cooling, so as to realize the heat dissipation of the device to be dissipated.

Optionally, the cooling passage 5 includes: a main pipe 501, a first branch 502, a second branch 503, a third branch 504, a fourth branch 505, and a fifth branch 506, and the valve 6 includes: a third valve 601, a fourth valve 602, the fifth valve 603 and the sixth valve 604;

The third valve 601 is set on the second branch 503, the fourth valve 602 is set on the main pipe 501, the fifth valve 603 is set on the fourth branch 505, the sixth valve 604 is set on the fifth branch 506, and the controller is connected to the first Three valves 601, a fourth valve 602, a fifth valve 603 and a sixth valve 604;

The first end of the main pipeline 501 is connected with the second acoustic wave refrigeration device 32 through the first branch 502, and communicates with the area where the second speaker 12 is located through the second branch 503, and the second end of the main pipeline 501 is connected with the second acoustic wave cooling device 32 through the third branch 504. The acoustic wave refrigeration device 31 is connected, and communicates with the area where the CPU 4 is located through the fourth branch 505, and communicates with the area where the first loudspeaker 11 is located through the fifth branch 506;

The controller is used to control at least one of the third valve 601, the fourth valve 602, the fifth valve 603 and the sixth valve 604 to open, and/or control the third valve 601, the fourth valve 602, the fifth valve 603 and the sixth valve At least one of the six valves 604 is closed.

In this embodiment, the controller can control the switching states of the third valve 601, the fourth valve 602, the fifth valve 603 and the sixth valve 604, so as to adjust the sound source provider and the device to be dissipated during the sonic cooling process. At this point, the electronic device can have at least one of the following nine working states:

Working state one: the third valve 601 and the sixth valve 604 are open, the fourth valve 602 and the fifth valve 603 are closed, and at this time, at least one of the first sonic refrigeration device 31 and the second sonic refrigeration device 32 flows out The cooling medium is transported to the area where the first loudspeaker 11 is located and the area where the second loudspeaker 12 is located, so as to realize the cooling of the first loudspeaker 11 and the second loudspeaker 12;

Working state two: the third valve 601 and the sixth valve 604 are closed, and the fourth valve 602 and the fifth valve 603 are opened. At this time, at least one of the first sonic refrigeration device 31 and the second sonic refrigeration device 32 flows out The cooling medium is transmitted to the area where the CPU 4 is located to cool the CPU 4;

Working state three: the third valve 601, the sixth valve 604, the fourth valve 602 and the fifth valve 603 are opened, at this time, the The cooling medium is transported to the area where the first loudspeaker 11 is located, the area where the second loudspeaker 12 is located, and the area where the CPU 4 is located, so as to cool the first loudspeaker 11, the second loudspeaker 12, and the CPU 4;

Working state four: the third valve 601 and the fourth valve 602 are opened, the fifth valve 603 and the sixth valve 604 are closed, at this time, at least one of the first sonic refrigeration device 31 and the second sonic refrigeration device 32 flows out The cooling medium is transported to the area where the second loudspeaker 12 is located, so as to cool the second loudspeaker 12;

Working state five: the fourth valve 602 and the sixth valve 604 are opened, the third valve 601 and the fifth valve 603 are closed, at this time, at least one of the first sonic refrigeration device 31 and the second sonic refrigeration device 32 flows out The cooling medium is transported to the area where the first loudspeaker 11 is located, so as to cool the first loudspeaker 11;

Working state six: the fourth valve 602 is closed, and the third valve 601 is opened. At this time, the cooling medium flowing out from the second sound wave refrigeration device 32 is transmitted to the area where the second speaker 12 is located to cool the second speaker 12;

Working state seven: the fourth valve 602 is closed, the fifth valve 603 and the sixth valve 604 are opened, at this time, the cooling medium flowing out from the first sonic refrigeration device 31 is transmitted to the area where the first speaker 11 is located and the area where the CPU 4 is located, To cool the area where the first loudspeaker 11 is located and the CPU 4;

Working state eight: the fourth valve 602 is closed, the fifth valve 603 is opened, and the sixth valve 604 is closed. At this time, the cooling medium flowing out from the first sonic refrigeration device 31 is transmitted to the area where the CPU 4 is located to cool the CPU 4 ;

Ninth working state: the fourth valve 602 is closed, the fifth valve 603 is closed, and the sixth valve 604 is opened. At this time, the cooling medium flowing out from the first sound wave refrigeration device 31 is transmitted to the area where the first speaker 11 is located, so as to control the first The speaker 11 is cooled.

It is worth pointing out that, in implementation, the controller can acquire the activation states of the first speaker 11 and the second speaker 12, and accordingly determine that the sound energy provider is the speaker in the on state. For example: when the first loudspeaker 11 is turned on and the second loudspeaker 12 is turned off, the controller can control the first loudspeaker 11 as the provider of sound energy accordingly, and start the first sound wave collecting device 23 and the first sound wave refrigeration unit. The device 31 produces a cooling medium.

In addition, the controller can also be based on information such as the starting state and volume of the first speaker 11 and the second speaker 12, the current of the electronic device, and at least one of the temperature of the first speaker 11, the second speaker 12, and the CPU 4. To determine the device to be cooled. For example: when the first loudspeaker 11 is turned on and the volume is greater than 50%, the second loudspeaker 12 is turned on but the volume is less than or equal to 50%, and the overall current is greater than 800mA, it can be determined that the first loudspeaker 11 and the CPU 4 are devices to be cooled According to this, the controller can control the fourth valve 602, the fifth valve 603 and the sixth valve 604 to open, and control the third valve 601 to close.

In the embodiment of the present application, a sound wave collecting device and a sound wave cooling device are arranged in the electronic equipment, so as to collect redundant sound waves from the speaker based on the sound wave collecting device, so that the sound wave cooling device can perform sound wave cooling, and transmit the cooled medium to the electronic device The device to be dissipated is neutralized, and the heat dissipation speed of the device to be dissipated is accelerated. The heat dissipation measures of the electronic equipment do not limit the maximum volume, frame rate, and frequency of the electronic equipment. Compared with the heat dissipation method in the related art that reduces the power consumption of the electronic equipment by limiting the maximum volume of the electronic equipment, reducing the frame, and limiting the frequency, etc. In other words, the embodiments of the present application can improve the performance of electronic equipment while improving heat dissipation efficiency.

Please refer to FIG. 6 , which is a flow chart of the heat dissipation method provided by the embodiment of the present application. The execution subject of the heat dissipation method may be the electronic device in the embodiment shown in any one of FIGS. 1 to 5 . The device to be dissipated includes a loudspeaker and a CPU, and the electronic equipment also includes a heat dissipation channel and a valve arranged on the heat dissipation channel.

As shown in Figure 6, the cooling method may include the following steps:

S601. Acquire first information, where the first information includes at least one of a volume and a current of the electronic device.

S602. Control the on or off of the valve (6) according to the first information, so that the sound wave refrigeration device cools down the speaker (1) and/or the CPU (4).

In an implementation manner, the above-mentioned first information may include parameters used for judging whether the device to be dissipated has a heat dissipation requirement, or the first information may include parameters used for judging which device or devices are to be dissipated. For example: the first information includes at least one of the volume and the current of the whole machine.

In an implementation manner, it is also possible to obtain the on state of the speaker, and only when a speaker is on, the above step S601 and step S602 are executed.

As an optional implementation manner, the controlling the on or off of the valve according to the first information, so that the sound wave cooling device cools down the speaker and/or the CPU includes:

When the first information satisfies a first preset condition, control the on or off of the valve so that the sound wave cooling device cools down the speaker and/or the CPU, and the first preset Conditions include at least one of the following:

The volume is greater than or equal to the preset volume, and the current of the whole machine is greater than or equal to the preset current of the whole machine;

The volume is less than the preset volume, and the current of the whole machine is greater than or equal to the preset current of the whole machine;

The volume is greater than or equal to the preset volume, and the overall machine current is less than the preset overall machine current.

Optionally, the above-mentioned preset volume may be a volume threshold determined based on the hardware structure of the electronic device, or a volume threshold set by the user. When the volume of the speaker is greater than the preset volume, it indicates that the speaker may generate too much heat. situation, so there is a need to cool the loudspeaker.

Optionally, the aforementioned preset overall current may be a current threshold determined based on the hardware structure of the electronic device, or a current threshold set by the user. When the volume of the electronic device's overall current is greater than the preset overall current, it means The power consumption of electronic equipment is large, and there is a demand for cooling components such as CPUs.

As an optional implementation manner, when the first information satisfies the first condition, the valve is controlled to be turned on or off, so that the sound wave cooling device can control the speaker and/or the Cool down the CPU, including:

determining a target device to be dissipated corresponding to the target first condition according to the target first condition satisfied by the first information, where the target first condition is any one of the first conditions;

Controlling the on or off of the valve, so that the passage between the sonic cooling device and the target device to be dissipated heat is in a communication state, and turning on the sonic cooling device.

In this embodiment, the target device to be dissipated can be determined according to the actual situation of the first information, and the channel between the sonic cooling device and the target device to be dissipated can be connected, and the sonic cooling device can be activated to perform sonic cooling, so as to treat the target device to be dissipated. The heat dissipation device is cooled, so that the pertinence of the cooled target heat dissipation device can be improved.

Optionally, the determining the target device to be dissipated corresponding to the target first condition according to the target first condition satisfied by the first information includes:

When the volume is greater than or equal to the preset volume and the current of the whole machine is greater than or equal to the preset current of the whole machine, it is determined that the target components to be dissipated corresponding to the target first condition are the speaker and the CPU;

When the volume is less than the preset volume and the current of the whole machine is greater than or equal to the current of the whole machine, it is determined that the target device to be dissipated corresponding to the target first condition is the CPU;

When the volume is greater than or equal to the preset volume and the overall current is less than the preset overall current, it is determined that the target device to be dissipated corresponding to the target first condition is the speaker.

In this embodiment, the device to be dissipated can be determined according to the control logic shown in FIG. 4 according to the volume and the current of the whole machine.

In an implementation manner, when there are at least two speakers, the method further includes:

determining that the target speaker is a provider of sound energy, wherein the target speaker is a speaker that is turned on among the at least two speakers;

In the case that the first information satisfies the first condition, controlling the on or off of the valve so that the sound wave cooling device cools down the speaker and/or the CPU includes:

When the first information satisfies the first condition, the valve is controlled to be turned on or off, so that the sound wave cooling device cools down the speaker and/or the CPU based on the sound wave of the target speaker.

For example: in the embodiment shown in Figure 5, the controller can control the switching states of the third valve 601, the fourth valve 602, the fifth valve 603 and the sixth valve 604, so as to adjust the sound source provider and the For the specific description of the device to be dissipated, refer to the description in the embodiment of the electronic device shown in FIG. Let me repeat.

Optionally, as shown in FIG. 7 , the embodiment of the present application also provides an electronic device 700, including a processor 701 and a memory 702, and the memory 702 stores programs or instructions that can run on the processor 701, the When the program or instruction is executed by the processor 701, each step of the method embodiment shown in FIG. 6 is implemented, and the same technical effect can be achieved. To avoid repetition, details are not repeated here.

The embodiment of the present application also provides a readable storage medium, the readable storage medium stores a program or an instruction, and when the program or instruction is executed by the processor, each process of the above heat dissipation method embodiment is realized, and the same Technical effects, in order to avoid repetition, will not be repeated here.

Wherein, the processor is the processor in the electronic device described in the above embodiments. The readable storage medium includes a computer-readable storage medium, such as a computer read-only memory ROM, a random access memory RAM, a magnetic disk or an optical disk, and the like.

The embodiment of the present application further provides a chip, the chip includes a processor and a communication interface, the communication interface is coupled to the processor, and the processor is used to run programs or instructions to implement the above heat dissipation method embodiments. process, and can achieve the same technical effect, in order to avoid repetition, it will not be repeated here.

It should be understood that the chips mentioned in the embodiments of the present application may also be called system-on-chip, system-on-chip, system-on-a-chip, or system-on-a-chip.

The embodiment of the present application provides a computer program product, the program product is stored in a storage medium, and the program product is executed by at least one processor to implement the various processes in the above heat dissipation method embodiment, and can achieve the same technical effect, To avoid repetition, details are not repeated here.

It should be noted that, in this document, the term "comprising", "comprising" or any other variation thereof is intended to cover a non-exclusive inclusion such that a process, method, article or apparatus comprising a set of elements includes not only those elements, It also includes other elements not expressly listed, or elements inherent in the process, method, article, or device. Without further limitations, an element defined by the phrase "comprising a ..." does not preclude the presence of additional identical elements in the process, method, article, or apparatus comprising that element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved. Functions are performed, for example, the described methods may be performed in an order different from that described, and various steps may also be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

Through the description of the above embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus a necessary general-purpose hardware platform, and of course also by hardware, but in many cases the former is better implementation. Based on such an understanding, the technical solution of the present application can be embodied in the form of computer software products, which are stored in a storage medium (such as ROM/RAM, magnetic disk, etc.) , optical disc), including several instructions to enable a terminal (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods described in various embodiments of the present application.

The embodiments of the present application have been described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementations. The above-mentioned specific implementations are only illustrative and not restrictive. Those of ordinary skill in the art will Under the inspiration of this application, without departing from the purpose of this application and the scope of protection of the claims, many forms can also be made, all of which belong to the protection of this application.

Claims (13)

1. An electronic device, comprising: a speaker, an acoustic wave collecting device and an acoustic wave refrigerating device;

the sound wave collecting device comprises a sound wave collecting port and a sound wave transmission port, the sound wave collecting port faces the loudspeaker, and the sound wave transmission port faces the sound wave refrigerating device;

when the loudspeaker is in a working state, the sound wave refrigerating device cools the medium based on the sound waves collected by the sound wave collecting device, and the cooled medium is transmitted to the area where the device to be cooled in the electronic equipment is located.

2. The electronic device of claim 1, wherein the device to be thermally dissipated comprises at least one of: the speaker and a central processing unit CPU of the electronic device.

3. The electronic device of claim 2, wherein the electronic device further comprises: the device comprises a controller, a heat dissipation channel and a valve arranged on the heat dissipation channel;

the inlet end of the heat dissipation channel is connected with the sound wave refrigerating device, and the outlet end of the heat dissipation channel faces the device to be cooled;

the controller is used for controlling the opening or closing of the valve so as to control the communication or closing of the heat dissipation channel.

4. The electronic device of claim 3, wherein the heat dissipation channel comprises a first channel and a second channel, the valve comprising a first valve disposed on the first channel and a second valve disposed on the second channel;

the inlet ends of the first channel and the second channel are connected with the sound wave refrigerating device, the outlet end of the first channel faces the loudspeaker, and the outlet end of the second channel faces the CPU;

the controller is respectively connected with the first valve and the second valve;

the controller is used for controlling the first valve to be opened or closed so as to control the first channel to be communicated or closed, and/or is used for controlling the second valve to be opened or closed so as to control the second channel to be communicated or closed.

5. The electronic device of claim 4, wherein at least one of the first channel and the second channel passes through an area of the electronic device where a battery is located.

6. The electronic device of claim 4, wherein the heat dissipation channel further comprises a third channel that is a common portion of the first channel and the second channel.

7. The electronic device of claim 3, wherein the speaker comprises a first speaker and a second speaker, the sound wave collecting means comprises a first sound wave collecting means and a second sound wave collecting means, and the sound wave cooling means comprises a first sound wave cooling means and a second sound wave cooling means;

the first loudspeaker, the first sound wave collecting device and the first sound wave refrigerating device are arranged in a first area of the electronic equipment; the second loudspeaker, the second sound wave collecting device and the second sound wave refrigerating device are arranged in a second area of the electronic equipment, and the first area and the second area are respectively positioned at different positions of the electronic equipment;

the first sound wave collecting device is used for collecting sound waves generated by the first loudspeaker and transmitting the sound waves to the first sound wave refrigerating device so as to radiate heat of a first device to be radiated based on a cooling medium output by the first sound wave refrigerating device, and the first device to be radiated comprises at least one of the first loudspeaker, the second loudspeaker and the CPU;

the second sound wave collecting device is used for collecting sound waves generated by the second loudspeaker and transmitting the sound waves to the second sound wave refrigerating device so as to radiate heat of a second device to be radiated based on a cooling medium output by the second sound wave refrigerating device, and the second device to be radiated comprises at least one of the first loudspeaker, the second loudspeaker and the CPU.

8. A heat dissipation method, characterized in that it is applied to the electronic device according to any one of claims 1 to 7, the device to be heat-dissipated of the electronic device includes a speaker and a CPU, the electronic device further includes a heat dissipation channel and a valve provided on the heat dissipation channel;

the method comprises the following steps:

acquiring first information, wherein the first information comprises at least one of volume and complete machine current of the electronic equipment;

and controlling the on or off of the valve according to the first information so as to enable the sound wave refrigerating device to cool the loudspeaker and/or the CPU.

9. The method of claim 8, wherein controlling the valve to be turned on or off according to the first information to cool the speaker and/or the CPU by the acoustic wave refrigeration device comprises:

and under the condition that the first information meets a first preset condition, controlling the on or off of the valve so as to enable the sound wave refrigerating device to cool the loudspeaker and/or the CPU, wherein the first preset condition comprises at least one of the following:

the volume is larger than or equal to a preset volume, and the whole machine current is larger than or equal to a preset whole machine current;

the volume is smaller than the preset volume, and the whole machine current is larger than or equal to the preset whole machine current;

the volume is larger than or equal to the preset volume, and the whole machine current is smaller than the preset whole machine current.

10. The method according to claim 9, wherein controlling the valve to be turned on or off to cool the speaker and/or the CPU by the acoustic wave refrigeration device when the first information satisfies a first preset condition includes:

determining a target device to be cooled corresponding to a target first condition according to the target first condition met by the first information, wherein the target first condition is any one of the first conditions;

and controlling the on or off of the valve so as to enable a channel between the sound wave refrigerating device and the target device to be cooled to be in a communication state, and starting the sound wave refrigerating device.

11. The method of claim 10, wherein the determining, according to the target first condition satisfied by the first information, a target device to be heat-dissipated corresponding to the target first condition includes:

when the volume is larger than or equal to a preset volume and the whole machine current is larger than or equal to the preset whole machine current, determining that a target device to be cooled corresponding to the target first condition is the loudspeaker and the CPU;

when the volume is smaller than a preset volume and the whole machine current is larger than or equal to the preset whole machine current, determining that a target device to be cooled corresponding to the target first condition is the CPU;

and determining that the target device to be cooled corresponding to the target first condition is the loudspeaker under the condition that the volume is larger than or equal to the preset volume and the whole machine current is smaller than the preset whole machine current.

12. An electronic device comprising a processor and a memory storing a program or instructions executable on the processor, which when executed by the processor, implement the steps of the heat dissipation method of any one of claims 8 to 11.

13. A readable storage medium, characterized in that the readable storage medium has stored thereon a program or instructions which, when executed by a processor, implement the steps of the heat dissipation method according to any one of claims 8 to 11.

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