CN116007224A - A kind of portable cooling and heating all-in-one machine and method based on thermoelectric refrigeration - Google Patents

Abstract

The invention provides a thermoelectric refrigeration-based portable cooling and heating integrated machine and method, which relate to the technical field of thermoelectric refrigeration; it includes a box body and a semiconductor refrigeration element, the semiconductor refrigeration element is located in the installation cavity of the box body, and the installation cavity connects the cold room in the box body Separated from the hot chamber; the cold end of the semiconductor refrigeration element is separated from the hot end of the semiconductor refrigeration element and connected by wires. The cold end is a variable cross-section structure to reduce Joule heat, the cold end exchanges heat with the cold chamber, and the hot end is a constant cross-section structure And exchange heat with the hot chamber; in view of the waste of heat at the hot end and the unevenness of cold and heat when the current semiconductor refrigerator is working, it is difficult to make reasonable and accurate control and adjustment, the cold end and the hot end are separated and insulated, and the cold end Adopt variable cross-section structure and use equal cross-section structure at the hot end to effectively reduce the heat difference between the cold end and the hot end and improve the utilization rate of heat at the hot end; increase the temperature sensor combined with the controller to realize feedback control, and realize accurate control and adjustment of the semiconductor refrigeration element .

Description

A kind of portable cooling and heating all-in-one machine and method based on thermoelectric refrigeration

technical field

The invention relates to the technical field of thermoelectric refrigeration, in particular to a portable integrated cooling and heating machine and method based on thermoelectric refrigeration.

Background technique

The all-in-one cooling and heating machine can realize two functions of cooling and heating at the same time, with a high degree of integration, which is convenient for equipment installation and layout, and meets the needs of heat preservation/heating and cold preservation/cooling at the same time. The portable cooling and heating all-in-one machine based on thermoelectric refrigeration is easy to control, does not involve chemical reactions, has no moving parts, does not use working fluids, does not produce pollutants that cause global warming, and has efficient and reliable cooling. machine field has great potential for development.

However, when the semiconductor refrigerator is working, it usually releases the heat of the hot end to the surrounding environment, resulting in a waste of energy. The high integration of the device is not conducive to the layout and design of the heat dissipation device at the hot end, so it is easy to cause damage to the device and potential safety hazards. Chinese patent (notification number: CN1352467A) discloses a split-type thermocouple refrigeration and power generation technology, including P-type semiconductor thermoelectric materials, N-type semiconductor thermoelectric materials, wires, DC power supplies and metal connecting pieces. Types of semiconductor thermoelectric materials are connected by wires to realize the separation of their cold and hot ends. But there are certain problems: 1. The heat of the hot end is not fully and effectively used, resulting in energy waste; 2. The thermoelectric material structure of the cold end and the hot end are the same, resulting in a large difference in cold heat and heat under the same input current. Can not meet the appropriate heating and cooling needs. 3. The lack of a feedback system for controlling cooling and heating is not conducive to determining the magnitude of the input current.

Contents of the invention

The object of the present invention is to address the defects of the prior art, and provide a portable thermoelectric refrigeration-based integrated cooling and heating machine and its method, which separates the cold end from the hot end and insulates them to reduce the heat between the hot end and the cold end. The exchange capacity adopts a variable cross-section structure for the cold end and an equal cross-section structure for the hot end, effectively reducing the heat difference between the cold end and the hot end, and improving the heat utilization rate of the hot end; adding a temperature sensor combined with a controller to achieve feedback control, and the semiconductor Refrigeration elements for precise control and regulation.

The first purpose of the present invention is to provide a portable cooling and heating integrated machine based on thermoelectric refrigeration, which adopts the following scheme:

Including the box body and the semiconductor refrigeration element, the semiconductor refrigeration element is located in the installation cavity of the box body, and the installation cavity separates the cold room and the hot room in the box; the cold end of the semiconductor refrigeration element is separated from the hot end of the semiconductor refrigeration element, and is connected through a wire Connection, the cold end is a variable cross-section structure to reduce Joule heat, the cold end exchanges heat with the cold chamber, and the hot end has a constant cross-section structure and exchanges heat with the hot chamber.

Further, a plurality of semiconductor cooling elements are arranged in the installation cavity, the hot end establishes heat exchange with the hot chamber through the heat conduction module, and the cold end establishes heat exchange with the cold chamber through the cold conduction module.

Further, the semiconductor cooling element includes P-type semiconductors and N-type semiconductors, which are alternately arranged in sequence in the installation cavity.

Further, the hot end of the P-type semiconductor and the hot end of an adjacent N-type semiconductor are bonded to a metal connecting sheet, and the metal connecting sheet is bonded to the heat conduction module; the cold end of the P-type semiconductor is bonded to the adjacent N-type semiconductor. The cold end of the type semiconductor is bonded to another metal connecting piece, and the metal connecting piece is bonded to the cold conduction module.

Further, two insulating plates are arranged between the cold end and the hot end, and the insulating plates are provided with through holes for wires to pass through. One insulating plate is attached to the side of the cold end away from the cold room, and the other insulating plate is attached to the On the side of the hot end away from the heat chamber, two insulating plates are arranged at intervals.

Further, the installation cavity is provided with a controller and a power supply, and temperature sensors are respectively arranged in the cold chamber and the hot chamber, and the temperature sensor, power supply and semiconductor refrigeration elements are respectively connected to the controller.

Further, the box body includes an insulating shell and a heat insulating layer, and a cavity is formed inside the heat insulating layer, and the cavity is divided into a cold room, an installation cavity and a hot room arranged in sequence.

Further, the cold end is a stepped structure with a cross-sectional area gradually decreasing along the direction away from the cold room, the end face of the cold end facing the cold room is square; the hot end is a prism with a square end face facing the hot room shape structure.

The second object of the present invention is to provide a working method using a portable integrated cooling and heating machine based on thermoelectric refrigeration as shown in the first object, including:

The semiconductor refrigeration element is energized, the cold end transfers cold energy to the cold room to cool down the cold room, and the hot end transfers heat to the cold room to heat up the cold room;

Measure the temperature in the cold room and the hot room, and adjust the working state of the semiconductor refrigeration element until the temperature in the cold room and the hot room meets the requirements.

Further, an insulating plate is provided between the cold end and the hot end to block heat transfer between the hot end and the cold end.

Compared with prior art, the advantages and positive effects that the present invention has are:

(1) In view of the heat waste at the hot end and the unevenness of cold and heat when the current semiconductor refrigerator is working, it is difficult to perform reasonable and accurate control and adjustment. The cold end and the hot end are separated and insulated to reduce the distance between the hot end and the cold end. The heat exchange between the cold end adopts the variable cross-section structure and the hot end adopts the equal cross-section structure, which can effectively reduce the heat difference between the cold end and the hot end, and improve the heat utilization rate of the hot end; increase the temperature sensor combined with the controller to realize feedback control , to achieve accurate control and regulation of semiconductor refrigeration components.

(2) Cooling is carried out through semiconductor refrigeration elements to ensure the heating effect and cooling effect. The installation cavity isolates the cold room and the hot room to reduce their mutual influence, make full use of the cooling capacity and heat, improve energy utilization and energy efficiency coefficient, and reduce energy consumption. waste of energy.

(3) The semiconductor refrigeration element adopts a variable cross-section structure at the cold end, and an equal cross-section structure at the hot end. Through this setting, the volume of the cold end can be reduced to reduce the Joule heat generated by it, and reduce the loss of the cold end, thereby reducing the cooling of the semiconductor refrigeration element. The heat difference between the cold end and the hot end reduces the difficulty of temperature control in the cold room and the hot room.

(4) The heat insulation layer inside the box can avoid the influence of the external environment on the temperature inside the box, reduce cooling capacity and heat loss, and maintain the temperature of the box. The insulating shell can realize thermal insulation and electrical insulation, which can ensure safety while Reduce energy dissipation and improve energy efficiency.

Description of drawings

The accompanying drawings constituting a part of the present invention are used to provide a further understanding of the present invention, and the schematic embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations to the present invention.

FIG. 1 is a schematic structural diagram of a portable integrated cooling and heating machine based on thermoelectric refrigeration in Embodiments 1 and 2 of the present invention.

Fig. 2 is a schematic diagram of the layout of semiconductor refrigeration elements in Embodiments 1 and 2 of the present invention.

Among them, 1. Insulated shell, 2. Insulation layer, 3. Cold room, 4. Hot room, 5. Temperature sensor, 6. Cooling module, 7. Cold end, 8. Insulation sheet, 9. Hot end, 10. Heat conduction module, 11. wire, 12. controller, 13. power supply, 14. metal connecting sheet.

Detailed ways

Example 1

In a typical embodiment of the present invention, as shown in FIGS. 1-2 , a portable integrated cooling and heating machine based on thermoelectric refrigeration is provided.

At present, when semiconductor refrigerators are used to work, there are problems of heat waste at the hot end 9 and uneven cooling and heating. Moreover, the lack of a feedback system for controlling cooling and heating in portable all-in-one machines is not conducive to determining the size of the input current, which makes it difficult to carry out Reasonable and accurate control adjustment.

Based on this, this embodiment provides a portable cooling and heating integrated machine based on thermoelectric refrigeration, which separates and insulates the cold end 7 and the hot end 9, reduces the amount of heat exchange between the hot end 9 and the cold end 7, and improves the temperature of the cold end. The end 7 adopts a variable cross-section structure, and the hot end 9 uses an equal cross-section structure, which effectively reduces the heat difference between the cold end 7 and the hot end 9, and improves the heat utilization rate of the hot end 9; adding a temperature sensor 5 and a controller 12 to realize feedback control , to achieve accurate control and regulation of semiconductor refrigeration components.

Hereinafter, the above-mentioned portable cooling and heating integrated machine based on thermoelectric refrigeration will be described in detail with reference to the accompanying drawings.

Referring to Figure 1, the main body of the portable cooling and heating all-in-one machine based on thermoelectric refrigeration is a box body, and the box body is provided with an installation cavity. Modules, cold room 3 and hot room 4 can be used to store items. The cooling and heating modules use semiconductor refrigeration elements, the side of the semiconductor refrigeration element corresponding to the hot chamber 4 is the hot end 9, and the side corresponding to the cold chamber 3 is the cold end 7.

The hot end 9 is bonded with a heat conduction module 10, and the hot end 9 exchanges heat with the hot chamber 4 through the heat conduction module 10; exchange. The semi-conductor refrigeration element performs refrigeration, and is transported to the cold room 3 of the box through the cold conduction module 6 to cool down the inside, and at the same time, the heat is dissipated to the hot room 4 of the box through the heat conduction module 10 to heat it.

Among them, the cold conduction module 6 is made of materials with excellent heat conduction effect, and its volume, material and other specification parameters can be configured according to the requirements, which can meet the requirements of cold conduction efficiency. Similarly, the heat conduction module 10 is made of materials with excellent heat conduction effects. Configure its volume, material and other specification parameters to meet the needs of thermal conductivity.

It can be understood that the heating effect and cooling effect are ensured by semiconductor refrigeration elements, and the installation cavity isolates the cold chamber 3 and the hot chamber 4 to reduce their mutual influence, make full use of cold and heat, and improve energy utilization and energy efficiency coefficient, reducing energy waste.

As shown in Figure 2, the semiconductor refrigeration element adopts a variable cross-section structure at the cold end 7, and a constant cross-section structure at the hot end 9. direction, the cross-sectional area of the cold end 7 gradually decreases, so that the cold end 7 has a terrace-like structure; The cross-sectional area of the hot end 9 increases gradually, so that the cold end 7 has a similar square structure. It should be pointed out that, through this setting, the volume of the cold end 7 can be reduced to reduce the Joule heat generated by it, reduce the cooling loss of the cold end 7, thereby reducing the heat and cold between the cold end 7 and the hot end 9 of the semiconductor refrigeration element. Quantity difference.

The cold end 7 of the thermoelectric cooler uses a variable-section semiconductor element structure, and the hot end 9 of the thermoelectric cooler uses a semiconductor element structure with an equal cross-section, which reduces the difference in cold and heat between the hot and cold ends 9 of the thermoelectric cooler, and reduces the The difficulty of temperature control in cold room 3 and hot room 4.

In addition, in this embodiment, the cold end 7 is configured as a stepped structure rather than a pyramid-shaped structure, considering the convenience of wiring between the cold end 7 and the hot end 9, and the cold end 7 is far away from the side of the cold conduction module 6 It is a plane rather than a point, which is convenient for the connection and fixation of the wire 11.

Multiple semiconductor refrigeration elements work at the same time to increase the cooling and heating power. In order to increase the number of cold ends 7 that can be attached to the cold conduction module 6, it is configured as a square contact surface, which is convenient for arranging multiple cold ends 7. Compared with circular or other shaped contact surfaces, it can be arranged more conveniently and make full use of the bonding area of the cooling module 6 . Similarly, a square contact surface is also used between the hot end 9 and the heat conduction module 10 to facilitate the reasonable arrangement of the hot end 9 on the heat conduction module 10 .

1 and 2, multiple semiconductor cooling elements are used in this embodiment. The semiconductor cooling elements are divided into P-type semiconductors and N-type semiconductors, which are arranged alternately in the installation cavity. The hot end 9 and the cold end 7 of the P-type semiconductor separated and connected by wire 11; the hot end 9 and cold end 7 of the N-type semiconductor are separated and connected by wire 11. The hot end 9 of the P-type semiconductor and the hot end 9 of an adjacent N-type semiconductor are bonded together on a metal connecting sheet 14, and the cold end 7 of the P-type semiconductor is bonded together with the cold end 7 of another adjacent N-type semiconductor. On the other metal connecting piece 14, they are arranged in sequence to form the structure shown in FIG. 2 .

The cold end 7 of the semiconductor refrigeration element is bonded with an insulating sheet 8 on the side away from the cold conduction module 6, and the hot end 9 of the semiconductor refrigeration element is bonded with an insulating sheet 8 on the side away from the heat conduction module 10, and the two insulating sheets 8 are arranged at intervals The insulating sheet 8 is provided with openings for the wires 11 to pass through, and thermal insulation and electrical insulation are realized through the insulating sheet 8, which can reduce energy waste while ensuring safety.

The electrical connection between the cold end 7 and the hot end 9 is established through the wire 11. At the same time, the cold end 7 and the hot end 9 can be separated, which reduces the heat loss of the semiconductor caused by heat conduction, and the installation of the cold and hot ends 9 is more convenient. High reliability, good cooling and heating effects, and improved cooling and heating efficiency.

As shown in Figure 1, the semiconductor refrigeration element is also connected to the power supply 13, the power supply 13 is connected to the controller 12, the controller 12 is connected to the temperature sensor 5, and the temperature sensor 5 is respectively arranged in the box body, which can be used to measure the temperature of the box body cold room. 3 and the temperature inside the hot chamber 4.

The temperature sensor 5 is arranged inside the box, and the temperature sensor 5 is arranged in the cold room 3 and the hot room 4 respectively, and is used to obtain temperature parameters and send them to the controller 12, so that the controller 12 can automatically adjust the cooling and heating power and the temperature in the box. temperature. The temperature in the box is detected by the temperature sensor 5 and fed back to the controller 12, and then the cooling and heating power of the semiconductor refrigeration element is adjusted through the controller 12, so that the temperature in the box can be precisely controlled.

Among them, the power supply 13 and the controller 12 can also be installed in the installation cavity of the box body. The power supply 13 can be a DC storage battery installed in the front of the box body, which can be detached and charged and used repeatedly. Of course, an external power supply 13 can also be used to take power. . It can provide sufficient power supply 13 when the core components of cooling and heating are working, the structure design is reasonable and practical, and the continuous working time is long.

As shown in FIG. 1 , the box body includes an insulating shell 1 and a heat insulating layer 2 , a cavity is formed inside the heat insulating layer 2 , and the cavity is divided into a cold chamber 3 , an installation chamber and a hot chamber 4 arranged in sequence. The heat insulation layer 2 inside the box can avoid the influence of the external environment on the temperature inside the box, reduce the cooling capacity and heat loss, and maintain the temperature of the box. The insulating shell 1 can realize thermal insulation and electrical insulation, which can reduce the temperature while ensuring safety. Dissipation of energy and improved energy efficiency.

The semiconductor refrigeration method is used to generate cooling capacity, the cooling effect is good, and at the same time, the heat of the thermoelectric effect is used to utilize the heat and cold of the thermoelectric cooler, which improves the utilization rate of energy; the control is fast, accurate and convenient, and can be used in Adjust the cooling and heating temperature in a wide range to meet the needs.

Example 2

In another typical implementation of the present invention, as shown in Fig. 1-Fig. 2, a working method is given.

Utilize the portable cooling and heating all-in-one machine based on thermoelectric refrigeration as described in Embodiment 1, including:

The semiconductor refrigeration element is energized, the cold end 7 transfers cold energy to the cold room 3 to cool the cold room 3, and the hot end 9 transfers heat to the cold room 3 to heat the cold room 3;

Measure the temperature in the cold chamber 3 and the hot chamber 4, and adjust the working state of the semiconductor refrigeration element until the temperature in the cold chamber 3 and the hot chamber 4 meets the requirement.

Temperature sensors 5 are respectively arranged in the cold room 3 and the hot room 4, and the temperature information obtained by the temperature sensor 5 is sent to the controller 12, and the controller 12 obtains an external command, and compares the temperature information in the external command with the temperature sensor 5. The temperature information obtained;

If the two temperature information are consistent, the controller 12 controls the semiconductor refrigeration element to maintain the temperature state of the cold chamber 3 and the hot chamber 4; if the two temperature information do not match, the controller 12 adjusts the working state of the semiconductor refrigeration element until the cold end 7 The cold chamber 3 is adjusted to the desired temperature and the hot end 9 is adjusted to the desired temperature in the hot chamber 4 .

During the working process of the controller 12, the temperature sensor 5 and the semiconductor refrigeration element, the power supply 13 provides energy for them.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims (10)

1. The portable cooling and heating integrated machine based on thermoelectric refrigeration is characterized by comprising a box body and a semiconductor refrigeration element, wherein the semiconductor refrigeration element is positioned in a mounting cavity of the box body, and the mounting cavity separates a cooling chamber and a heating chamber in the box body; the cold end of the semiconductor refrigerating element is separated from the hot end of the semiconductor refrigerating element and is connected with the hot end of the semiconductor refrigerating element through a lead, the cold end is of a variable cross-section structure so as to reduce the joule heat, the cold end exchanges heat with the cold chamber, and the hot end is of a constant cross-section structure and exchanges heat with the hot chamber.

2. The portable cooling and heating integrated machine based on thermoelectric refrigeration according to claim 1, wherein a plurality of semiconductor refrigeration elements are arranged in the installation cavity, the hot end establishes heat exchange with the hot chamber through the heat conduction module, and the cold end establishes heat exchange with the cold chamber through the heat conduction module.

3. The portable cooling and heating all-in-one machine based on thermoelectric cooling as set forth in claim 2, wherein said semiconductor cooling element comprises P-type semiconductor and N-type semiconductor and is alternately arranged in sequence in the installation cavity.

4. The portable cooling and heating integrated machine based on thermoelectric cooling as set forth in claim 3, wherein the hot end of the P-type semiconductor and the hot end of an adjacent N-type semiconductor are jointly attached to a metal connecting sheet, and the metal connecting sheet is attached to the heat conducting module; the cold end of the P-type semiconductor and the cold end of the adjacent other N-type semiconductor are jointly attached to the other metal connecting sheet, and the metal connecting sheet is attached to the cold guide module.

5. The portable cooling and heating integrated machine based on thermoelectric cooling as set forth in claim 1, wherein two insulating plates are disposed between the cold end and the hot end, through holes for wires to pass through are disposed on the insulating plates, one side of the insulating plates, which is far away from the cold chamber, is attached to the cold end, the other side, which is far away from the hot chamber, is attached to the hot end, and the two insulating plates are arranged at intervals.

6. The portable cooling and heating integrated machine based on thermoelectric refrigeration as set forth in claim 1, wherein the controller and the power supply are arranged in the installation cavity, the temperature sensor is respectively arranged in the cooling chamber and the hot chamber, and the temperature sensor, the power supply and the semiconductor refrigeration element are respectively connected to the controller.

7. The portable cooling and heating integrated machine based on thermoelectric refrigeration according to claim 1, wherein the box body comprises an insulating shell and an insulating layer, and a cavity is formed in the insulating layer and divided into a cooling chamber, a mounting chamber and a heating chamber which are sequentially arranged.

8. The portable cooling and heating integrated machine based on thermoelectric refrigeration as set forth in claim 1, wherein the cold end is of a stepped structure with gradually reduced sectional area along the direction away from the cold chamber, and the end face of the cold end facing the cold chamber is square; the hot end is a prismatic structure with a square end face towards one side of the hot chamber.

9. A method of operating a thermoelectric refrigeration-based portable all-in-one machine as set forth in any one of claims 1-8, comprising:

the semiconductor refrigerating element is electrified, the cold end transmits cold energy to the cold chamber to cool the cold chamber, and the hot end transmits heat to the cold chamber to heat the cold chamber;

and measuring the temperatures in the cold chamber and the hot chamber, and adjusting the working state of the semiconductor refrigeration element until the temperatures in the cold chamber and the hot chamber reach the requirements.

10. A method of operation as claimed in claim 9 wherein an insulating plate is provided between the cold and hot ends to block heat transfer between the hot and cold ends.

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