CN115911076A

CN115911076A - Display device and manufacturing method

Info

Publication number: CN115911076A
Application number: CN202110980295.3A
Authority: CN
Inventors: 张廷斌; 林昌廷; 刘晓伟; 孙明晓; 刘永锋
Original assignee: Hisense Visual Technology Co Ltd
Current assignee: Hisense Visual Technology Co Ltd
Priority date: 2021-08-25
Filing date: 2021-08-25
Publication date: 2023-04-04

Abstract

The invention discloses a display device and a manufacturing method, wherein the display device comprises: a driving substrate for providing a driving signal; and the display unit is positioned on the driving substrate and electrically connected with the driving substrate. The display unit includes: the two blue light chips are positioned on the driving substrate and used for emitting blue light; the blue light chips are respectively a first blue light chip and a second blue light chip; the first blue light chip and the second blue light chip are arranged side by side; the green light chip is positioned on one side of the first blue light chip and is used for emitting green light; and the color conversion layer is positioned on one side of the second blue light chip and used for emitting red light under the excitation of the second blue light chip. The display element uses blue light chip emission blue light, and green glow chip emission green, blue light chip arouse the color conversion layer to emit red light, can guarantee that blue light, green light and red light all have higher luminous efficiency among the display element from this, have strengthened full-color display effect.

Description

Display device and manufacturing method

Technical Field

The invention relates to the technical field of display, in particular to a display device and a manufacturing method thereof.

Background

Micro Light-Emitting Diode (Micro LED for short) technology, namely LED miniaturization and matrixing technology. The LED array is integrated on a chip, can realize independent addressing and independent driving of each pixel to emit light, and reduces the distance between the pixels from millimeter level to micrometer level.

Compared with the common LED, the Micro LED has the characteristics of self luminescence, no need of a backlight source, energy conservation, high integration and the like; compared with an Organic Light-Emitting Diode (OLED for short) with the same self-luminous property, the Organic Light-Emitting Diode has the advantages of lower power consumption loss, longer service life and higher stability. Therefore, micro LED technology has become an important research point in the art.

However, when the Micro LED is used as a pixel unit for RGB full-color display at present, the blue Micro LED is generally used to excite a red quantum dot to emit red light, and the blue Micro LED is generally used to excite a green quantum dot to emit green light and the blue Micro LED to emit blue light. However, as the size of the Micro LED is decreased, the light emitting efficiency of the blue Micro LED to excite green quantum dots to emit green light is significantly decreased compared to that of the green Micro LED alone.

Disclosure of Invention

In some embodiments of the present invention, a display unit includes two blue chips, a green chip, and a color conversion layer. The two blue light chips are respectively a first blue light chip and a second blue light chip. The two blue light chips are positioned on the driving substrate and used for emitting blue light; the first blue light chip and the second blue light chip are arranged side by side. Wherein the first blue chip is used as a blue sub-pixel; the green chip is used as a green sub-pixel; the second blue chip may excite the color conversion layer to emit red light, which is used as a red sub-pixel. Therefore, the high light emitting efficiency of blue light, green light and red light in the display unit can be ensured, and the full-color display effect is enhanced.

In some embodiments of the present invention, the display unit further comprises a first substrate. The first substrate is used as a substrate of the display unit, the blue light chip, the green light chip and the color conversion layer are combined together, and when the light emitting chip is transferred in a large amount, the display unit can be transferred in a unit, so that the number of times of large-amount transfer can be reduced, and the transfer efficiency is improved.

In some embodiments of the present invention, the first blue light chip and the second blue light chip are arranged side by side on the first substrate. The orthographic projection pattern of the first blue light chip on the first substrate and the orthographic projection pattern of the second blue light chip on the first substrate are in a non-overlapping range. The problem of crosstalk among the blue light chips is avoided, and the display effect is enhanced.

In some embodiments of the present invention, the first blue chip and the second blue chip are in a transparent state when not emitting light.

In some embodiments of the invention, the green chip is positioned on the side of the first blue chip, which is far away from the first substrate; the orthographic projection of the green chip on the first substrate is within the range of the orthographic projection of the first blue chip on the first substrate. The green chip is in a transparent state when not emitting light. The blue light emitted by the first blue light chip can exit through the green light chip. Compared with the mode that the blue light chip is used for exciting the green conversion material to emit green light in the prior art, the light emitting efficiency of the green light chip is higher, and the full-color display effect is favorably enhanced.

In some embodiments of the present invention, the orthographic projection of the color conversion layer on the first substrate completely overlaps with the orthographic projection of the second blue light chip on the first substrate. The luminous efficiency and the light utilization ratio of red light are improved, the display effect is enhanced, and the problem that blue light is mixed in the red light of the outgoing light is avoided.

In some embodiments of the present invention, the color conversion layer includes a dam and a color conversion material. The box dam is used for forming an accommodating space and accommodating the color conversion material. The color conversion layer may be a quantum dot layer and the color conversion material may be a red quantum dot material. The red quantum dot material emits red light under the excitation of the blue light emitted by the second blue light chip, and the light emitting efficiency is higher than that of the red light chip.

In some embodiments of the present invention, a bonding layer is further disposed between the first blue chip and the green chip, and a side of the second blue chip facing away from the first substrate. For connecting the blue chip and the green chip.

In some embodiments of the present invention, the display unit further comprises: the first electrode pair is positioned on one side of the first blue light chip, which is far away from the first substrate; the second electrode pair is positioned on one side of the second blue light chip, which is far away from the first substrate; and the third electrode pair is positioned on one side of the green light chip, which is far away from the first blue light chip. The driving substrate includes: a plurality of bonding pad pairs located on the surface of the driving substrate; the positions of the bonding pad pairs respectively correspond to the positions of the first electrode pair, the second electrode pair and the third electrode pair; the pair of pads is electrically connected to the first electrode pair, the second electrode pair, and the third electrode pair, respectively. The driving substrate provides driving signals to the electrodes of the light emitting chips through the bonding pads so as to control the brightness of the light emitting chips.

In some embodiments of the present invention, the ions of the green chip that are doped N-type and P-type are different from the ions of the blue chip that are doped N-type and P-type, and can emit light of different colors.

In some embodiments of the present invention, the surface of the display unit is further covered with an insulating layer. The insulating layer is used for insulating the regions of the light emitting chips except the regions exposed with the first electrode pair, the second electrode pair and the third electrode pair, so that the crosstalk problem is prevented.

In some embodiments of the present invention, the display unit may adopt a normal mounting structure, and the pair of pads of the driving substrate is disposed adjacent to the first substrate of the display unit. The display unit further comprises a plurality of leads; the leads are respectively used for electrically connecting the first electrode pair and the corresponding bonding pad pair, the second electrode pair and the corresponding bonding pad pair, and the third electrode pair and the corresponding bonding pad pair. The color conversion layer is located on one side, away from the first substrate, of the second blue light chip.

In some embodiments of the present invention, when the display unit may adopt a front-mounted structure, the display device further includes an encapsulation layer, and the encapsulation layer covers a surface of the display unit away from the driving substrate, and is used for isolating water and oxygen, protecting the light emitting chip, and planarizing the display device.

In some embodiments of the present invention, the display unit may further adopt a flip-chip structure, and the pair of pads of the driving substrate is disposed adjacent to the first electrode pair, the second electrode pair, and the third electrode pair of the display unit. The first electrode pair and the corresponding pad pair are electrically connected through solder, the second electrode pair and the corresponding pad pair are electrically connected through solder, and the third electrode pair and the corresponding pad pair are electrically connected through solder. The color conversion layer is located on one side, away from the second blue light chip, of the first substrate.

In some embodiments of the present invention, when the display unit adopts the flip-chip structure, the display device further includes a packaging layer, and the packaging layer covers a surface of the display unit away from the driving substrate, and is used for isolating water and oxygen, protecting the light emitting chip, and planarizing the display device.

In some embodiments of the present invention, a method of manufacturing a display device includes providing a first substrate and a second substrate; forming a blue light epitaxial layer on a first substrate, and forming a green light epitaxial layer on a second substrate; the side, provided with the blue light epitaxial layer, of the first substrate is oppositely attached to the side, provided with the green light epitaxial layer, of the second substrate; stripping the second substrate, and removing part of the green light epitaxial layer to form a green light chip; etching the blue light epitaxial layer to form two blue light chips, namely a first blue light chip and a second blue light chip; the green chip is positioned on one side of the first blue chip, which is far away from the first substrate; and forming a color conversion layer on the second blue light chip. The display element uses blue light chip emission blue light, and green glow chip emission green, and the blue light chip arouses the color conversion layer to emit red light, can guarantee that blue light, green light and red light all have higher luminous efficacy among the display element from this, have strengthened full-color display effect.

In some embodiments of the present invention, forming a blue epitaxial layer on a first substrate specifically includes: sequentially forming a first doping layer, a first light-emitting layer and a second doping layer on a first substrate to form the blue light epitaxial layer; and forming a first electrode layer on one side of the blue light epitaxial layer, which is far away from the first substrate.

In some embodiments of the present invention, forming a green epitaxial layer on a second substrate specifically includes: sequentially forming a third doping layer, a second light-emitting layer and a fourth doping layer on a second substrate to form a green light epitaxial layer; and forming a second electrode layer on the side of the green light epitaxial layer, which is far away from the second substrate.

In some embodiments of the present invention, attaching the side of the first substrate provided with the blue light epitaxial layer to the side of the second substrate provided with the green light epitaxial layer, specifically includes: bonding the first electrode layer and the second electrode layer to each other.

In some embodiments of the present invention, the bonding layer may be silicon dioxide, transparent adhesive, and the like, which is not limited herein. The bonding layer has insulating property and viscosity, so that the electrical connection between the first electrode layer and the second electrode layer 304 is isolated, and the problem of crosstalk between the light emitting chips is prevented.

In some embodiments of the present invention, the manufacturing method further comprises: punching the first blue light chip to respectively expose a first doping layer and a first electrode layer of the first blue light chip, and forming a first electrode pair on the exposed first doping layer and the exposed first electrode layer; punching the second blue light chip to respectively expose the first doping layer and the first electrode layer of the second blue light chip, and forming a second electrode pair on the exposed first doping layer and the exposed first electrode layer; and perforating the green chip to expose the second electrode layer of the green chip, and forming a third electrode pair on the exposed second electrode layer and the third doped layer.

In some embodiments of the present invention, when the display unit adopts a front-loading structure, the forming a color conversion layer on the second blue light chip specifically includes: forming a dam on one side of the second blue light chip, which is far away from the first substrate; and injecting a color conversion material into the inner injection to form a color conversion layer. The box dam is used for forming an accommodating space and accommodating the color conversion material. The color conversion layer can be a quantum dot layer, the color conversion material can be a red quantum dot material, red light is emitted under excitation of blue light emitted by the second blue light chip, and the light emitting efficiency is higher than that of the red light chip.

In some embodiments of the present invention, when the display unit is upright mounted, the manufacturing method further includes: providing a driving substrate; the surface of the driving substrate is provided with a bonding pad pair; arranging the first substrate and one side of the driving substrate, which is provided with the bonding pad pair, adjacently; electrically connecting the first electrode pair, the second electrode pair and the third electrode pair with the corresponding pad pairs on the driving substrate respectively by using leads; and finally, carrying out packaging treatment.

In some embodiments of the present invention, when the display unit adopts a flip-chip structure, after the electrode pair is manufactured, a transient substrate is provided, and one side of the first substrate, on which the green chip is disposed, is attached to the transient substrate in an opposite manner. And forming a color conversion layer on the side of the first substrate, which is far away from the second blue light chip. Transferring the first substrate with the color conversion layer to a driving substrate, wherein a bonding pad pair of the driving substrate is adjacent to a first electrode pair, a second electrode pair and a third electrode pair of the display unit and is electrically connected with the driving substrate; and finally, carrying out packaging treatment.

In some embodiments of the present invention, when the display unit adopts a flip-chip structure, a driving substrate is provided; the surface of the driving substrate is provided with a bonding pad pair; one side of the first substrate, on which the first electrode pair, the second electrode pair and the third electrode pair are provided, is disposed adjacent to one side of the driving substrate, on which the pad pair is provided. Each electrode pair is electrically connected to a corresponding pad pair using solder. Forming a color conversion layer on one side of the first substrate, which is far away from the second blue light chip; and finally, carrying out packaging treatment.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments of the present invention will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic cross-sectional view of a display device according to an embodiment of the invention;

fig. 2 is a schematic cross-sectional view of a display unit according to an embodiment of the present invention;

fig. 3 is a schematic cross-sectional structure diagram of a first blue light chip according to an embodiment of the present invention;

fig. 4 is a schematic cross-sectional structure diagram of a second blue light chip according to an embodiment of the present invention;

FIG. 5 is a schematic cross-sectional view of a green chip according to an embodiment of the present invention;

fig. 6 is a second schematic cross-sectional view of a display device according to an embodiment of the invention;

fig. 7 is a third schematic cross-sectional view illustrating a display device according to an embodiment of the invention;

fig. 8 is a flowchart of a method for manufacturing a display device according to an embodiment of the invention;

FIGS. 9a-9m are schematic structural diagrams of a display device corresponding to steps of a manufacturing method.

The light emitting diode comprises a substrate 100, a driving substrate 300, a green light chip 300, a color conversion layer 400, a first electrode pair 500, a second electrode pair 600, a third electrode pair 700, a solder 900, a first substrate 1000, a second substrate 2000, a transient substrate 3000, a first blue light chip 210, a second blue light chip 220, a third doping layer 301, a second light emitting layer 302, a fourth doping layer 303, a second electrode layer 304, a dam 410, a color conversion material 420, a first electrode 510, a second electrode 520, a third electrode 610, a fourth electrode 620, a fifth electrode 710, a sixth electrode 720, a bonding pad 810, an 820 and a bonding pad pair 1001, a first doping layer 1002, a first light emitting layer 1003, a second doping layer 1004, a first electrode layer 1100, a bonding layer 3100 and a bonding layer.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, the present invention is further described in conjunction with the accompanying drawings and examples. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus, a repetitive description thereof will be omitted. The words expressing the position and direction described in the present invention are illustrated in the accompanying drawings, but may be changed as required and still be within the scope of the present invention. The drawings of the present invention are for illustrative purposes only and do not represent true scale.

In the field of display technology, micro LED technology refers to a high-density Micro-sized LED array integrated on a chip, which can realize individually addressing and individually driving each pixel to emit light. Because Micro LED has the characteristics of low power consumption, long service life, high stability and self-luminescence without a backlight source, the Micro LED has the advantages of energy conservation, high integration and the like, can be applied to almost all mainstream display fields, and is considered as an ideal form of a future display technology.

A typical structure of a Micro LED display device generally includes a driving substrate and a light emitting chip. The conventional Micro LED display device usually needs to manufacture the light emitting chips and the driving substrate by different processes, and after the light emitting chips and the driving substrate are manufactured, tens of millions of light emitting chips or even hundreds of millions of light emitting chips need to be transferred to the driving substrate by a massive transfer technology.

The Light Emitting chip is a micro LED, which is different from a Light-Emitting Diode (LED for short), and particularly refers to a miniaturized Light Emitting Diode chip. Typically, the size of the Micro LEDs is in the order of microns, e.g., the size of the Micro LEDs is less than 100 μm. When the size of the Micro LED chip is reduced to a pixel level, the Micro LED can be directly used as a light emitting unit for image display.

When the Micro LED display device is used for full-color display, one pixel unit includes three sub-pixels emitting red, green, and blue light, respectively.

At present, a blue chip, a red chip and a green chip are required to be arranged on a driving substrate for full-color display. Because the luminous efficiency of the red light chip is low, the blue light chip can be used for exciting the red light conversion material and the green light conversion material to replace the red light chip and the green light chip. Compared with the method that a single red light chip is used for emitting red light, the blue light chip excites the red light conversion material to emit red light, so that the light emitting efficiency is improved; however, the blue chip excites the green conversion material to emit green light with lower light extraction efficiency than when a separate green chip is used to emit green light.

In view of this, embodiments of the present invention provide a display device and a method for manufacturing the same, which can improve the light emitting efficiency of red light and green light in the display device and enhance the full-color display effect.

Fig. 1 is a schematic cross-sectional view of a display device according to some embodiments of the present invention.

Referring to fig. 1, the display device includes a driving substrate 100 for providing a driving signal and a display unit for implementing image display. The display unit is located on the driving substrate 100 and electrically connected to the driving substrate; the display unit includes two blue chips, a green chip 300, and a color conversion layer 400. The two blue light chips are a first blue light chip 210 and a second blue light chip 220, respectively.

In the embodiment of the present invention, the driving substrate 100 is located at the bottom of the display device, and the size of the driving substrate 100 is generally adapted to the overall size of the display device, and the size of the driving substrate 100 is slightly smaller than the size of the display device.

The shape of the driving substrate 100 is the same as the overall shape of the display device, and may be generally rectangular or square. When the display device is a special-shaped display device, the shape of the driving substrate can be adaptively set to other shapes, which is not limited herein.

The driving substrate 100 may be manufactured by a currently mature thin film process, and the driving substrate 100 may be manufactured as an active driving substrate. The driving substrate 100 is used to provide a driving signal.

In some embodiments, the display device may also include a plurality of driving substrates 100, and the driving substrates 100 are connected to each other in a splicing manner to provide driving signals for the display device. In order to avoid the optical problem caused by splicing the driving substrates 100, the splicing seams between the adjacent driving substrates 100 are as small as possible, and even seamless splicing is realized.

The display unit is located on the driving substrate 100 and electrically connected to the driving substrate 100. The display unit serves as a pixel unit for image display. In order to realize full-color display, one display unit needs to include red, green, and blue sub-pixels.

In the embodiment of the present invention, the display unit includes two blue chips, a green chip 300, and a color conversion layer 400. The two blue chips are a first blue chip 210 and a second blue chip 220, respectively. The two blue light chips are located on the driving substrate 100 and used for emitting blue light; the first blue light chip 210 and the second blue light chip 220 are arranged side by side. Wherein the first blue chip 210 is used as a blue sub-pixel; the green chip 300 is used as a green sub-pixel; the second blue chip 220 may excite the color conversion layer 400 to emit red light, which is used as a red sub-pixel.

The green chip 300 is positioned at one side of the first blue chip 210 to emit green light. The size of the green chip 300 is smaller than that of the first blue chip 210.

In the embodiment of the present invention, both the blue chip and the green chip 300 are Micro LED chips, which are miniaturized light emitting diode chips having a size of 100 μm or less. The light-emitting chip can be manufactured on the substrate by adopting the mature manufacturing process at present, the light-emitting chip is transferred onto the driving substrate 100 by a mass transfer technology, and then the blue light chip and the green light chip are electrically connected with the driving substrate 100, so that the driving substrate 100 controls the light emission of each blue light chip, and the brightness adjustment of each light-emitting chip is realized.

The color conversion layer 400 is located at one side of the second blue chip 220 and is used for emitting red light under excitation of the second blue chip 220. The shape and size of the color conversion layer 400 are adapted to the shape and size of the second blue chip 220. In the embodiment of the invention, the color conversion layer may be a quantum dot layer, and the color conversion layer 400 uses a color conversion material. Among them, the color conversion material may use a red quantum dot material, and may be formed on one side of the second blue chip 400 using an inkjet method or a coating method. Therefore, when the second blue chip 220 emits light under the control of the driving signal, the emitted light is incident into the color conversion layer 400, and the color conversion layer 400 can be excited to emit red light.

In the prior art, a blue light chip, a green light chip and a red light chip are respectively adopted for carrying out three-primary-color display, or the blue light chip is adopted to excite a red light conversion material and a green light conversion material to carry out three-primary-color display. Compared with the prior art, the display unit provided by the embodiment of the invention uses the blue light chip to emit blue light, the green light chip emits green light, and the blue light chip excites the color conversion layer to emit red light, so that the blue light, the green light and the red light in the display unit have higher light emitting efficiency, and the full-color display effect is enhanced.

Fig. 2 is a schematic cross-sectional view of a display unit according to some embodiments of the present invention.

Referring to fig. 2, the display unit further includes a first substrate 1000, a bonding layer 1100; the color conversion layer includes a dam 410 and a color conversion material 420.

The first substrate 1000 is a substrate for growing a blue chip, and may also be used as a base of a display unit. The first substrate 1000 may be any of various substrates that can be used for growing light emitting chips, such as a sapphire substrate, a silicon nitride substrate, and the like, and is not limited thereto. The first substrate 1000 serves as a base of the display unit, and combines the blue chip, the green chip 300, and the color conversion layer 400 together, whereby, when the light emitting chips are transferred in bulk, the transfer can be performed in units of display units, the number of times of the bulk transfer can be reduced, and the transfer efficiency can be improved.

The first blue chip 210 and the second blue chip 220 are arranged side by side on the first substrate 1000. The first blue chip 210 and the second blue chip 220 are in a transparent state when not emitting light. The orthographic projection pattern of the first blue-light chip 210 on the first substrate 1000 has no overlapping range with the orthographic projection pattern of the second blue-light chip 220 on the first substrate 1000. Therefore, the problem of crosstalk among the blue light chips is avoided, and the display effect is enhanced.

The green chip 300 is located on the side of the first blue chip 210 facing away from the first substrate 1000; the orthographic projection of the green chip 300 on the first substrate 1000 is within the range of the orthographic projection of the first blue chip 210 on the first substrate 1000. The green chip 300 is in a transparent state when not emitting light.

Thus, when it is required to emit green light alone, it is only necessary to supply a driving signal alone to the green chip 300, so that the green chip emits green light. When the blue light needs to be emitted separately, only the driving signal needs to be provided separately to the first blue chip 210, and the green chip 300 is in a transparent state, so that the blue light emitted by the first blue chip 210 can exit through the green chip 300. When it is required that the green light and the blue light are simultaneously emitted, the green light emitted from the green chip 300 and the blue light emitted from the first blue chip 210 are simultaneously emitted. Compared with the mode of exciting green conversion materials to emit green light by using a blue light chip in the prior art, the green light chip 300 has higher light emitting efficiency and is beneficial to enhancing the full-color display effect.

The orthographic projection of the color conversion layer on the first substrate 1000 completely overlaps the orthographic projection of the second blue chip 220 on the first substrate 1000. Therefore, emergent light of the second blue light chip 220 can be totally incident into the color conversion layer 400 and is used for exciting the color conversion layer to emit red light, the light emitting efficiency and the light utilization rate of the red light are improved, and the display effect is enhanced. In addition, the color conversion layer completely covers the second blue chip 220, so that the problem of mixing blue light in the emitted red light can be avoided.

The color conversion layer includes a dam 410 and a color conversion material 420.

The color conversion layer may be a quantum dot layer, and the color conversion material 420 may be a red quantum dot material, because the red quantum dot material is a mixed solution and has certain fluidity, the dam 410 needs to be set in the manufacturing process, and an accommodating space is formed on one side of the dam 410 and the second blue light chip 220 departing from the first substrate 1000, so as to accommodate the color conversion material 420. After the dam is fabricated, the color converting material 420 is formed within the dam. The color conversion material 420 emits red light under excitation of the blue light emitted from the second blue chip 220.

In some embodiments of the present invention, a bonding layer 1100 is further disposed between the first blue chip 210 and the green chip 300, and between the second blue chip 220 and the color conversion layer. This is because the blue chip and the green chip 300 are separately manufactured and the first blue chip and the second blue chip are obtained by etching in the embodiment of the present invention. Therefore, it is necessary to bond the green chip and the blue chip together to constitute a display unit structure, thereby employing the bonding layer 1100. In a specific implementation, the bonding layer 1100 may be made of silicon dioxide, transparent glue, or the like, and is not limited herein.

Since the driving substrate 100 needs to be electrically connected to each light emitting chip, the display unit further includes a first electrode pair 500, a second electrode pair 700, and a third electrode pair 600 as shown in fig. 2. The first electrode pair 500 is an electrode of the first blue chip 210, the second electrode pair 600 is an electrode of the second blue chip 220, and the third electrode pair 700 is an electrode of the green chip 300.

In the embodiment of the present invention, the first blue light chip 210 and the second blue light chip 220 are manufactured by growing a blue light epitaxial layer on the same substrate, and then obtaining two blue light chips arranged side by an etching process. Therefore, the internal structures of the first blue chip 210 and the second blue chip 220 are the same.

Fig. 3 is a schematic cross-sectional structure diagram of a first blue light chip according to an embodiment of the present invention.

Referring to fig. 3, the first blue chip 210 includes a first doping layer 1001, a first light emitting layer 1002, a second doping layer 1003, and a first electrode layer 1004.

In implementation, a first doped layer 1001, a first light emitting layer 1002, a second doped layer 1003, and a first electrode layer 1004 may be sequentially formed on the first substrate 1000 using a vapor deposition method. The first doping layer 1001 and the second doping layer 1003 may be obtained by N-type doping and P-type doping, respectively, using the same material, for example, gallium nitride, and the first light emitting layer 1002 may be a multiple quantum well layer.

The first electrode pair includes a first electrode 510 and a second electrode 520. The first electrode 510 and the second electrode 520 may be made of a metal or a transparent conductive material, which is not limited herein. Wherein the first electrode 510 is electrically connected to the electrode layer 1004; the second electrode 520 is electrically connected to the first doped layer 1001. Thus, the driving substrate controls the luminance of the first blue chip by applying the driving signal to the first electrode pair.

Fig. 4 is a schematic cross-sectional structure diagram of a second blue light chip according to an embodiment of the present invention.

Referring to fig. 4, the second blue chip 220 has the same internal structure as the first blue chip 210. The second blue chip 220 includes a first doped layer 1001, a first light emitting layer 1002, a second doped layer 1003, and a first electrode layer 1004.

In implementation, a first doped layer 1004, a first light emitting layer 1002, a second doped layer 1003, and a first electrode layer 1004 may be sequentially formed on the first substrate 1000 using a vapor deposition method. The first doping layer 1001 and the second doping layer 1003 may be obtained by N-type doping and P-type doping, respectively, using the same material, for example, gallium nitride, and the first light emitting layer 1002 may be a multiple quantum well layer.

The second electrode pair includes a third electrode 610 and a fourth electrode 620. The third electrode 610 and the fourth electrode 620 may be made of a metal or a transparent conductive material, and are not limited herein. Wherein the third electrode 610 is electrically connected to the first electrode layer 1004; the fourth electrode 620 is electrically connected to the first doping layer 1001. Thereby, the driving substrate controls the luminance of the second blue chip by applying the driving signal to the second electrode pair.

Fig. 5 is a schematic cross-sectional structure diagram of a green chip according to an embodiment of the present invention.

Referring to fig. 5, the green chip includes a third doped layer 301, a second light emitting layer 302, a fourth doped layer 303, and a second electrode layer 304.

In specific implementation, the third doped layer 301, the second light emitting layer 302, the fourth doped layer 303, and the second electrode layer 304 may be sequentially formed on the second substrate using a vapor deposition method. The third doping layer 301 and the fourth doping layer 303 may be obtained by N-type doping and P-type doping, respectively, using the same material, for example, gallium nitride. The ions of the green chip for N-type doping and P-type doping are different from the ions of the blue chip for N-type doping and P-type doping, so that the green chip can emit light with different colors.

The third electrode pair includes a fifth electrode 710 and a sixth electrode 720. The fifth electrode 710 and the sixth electrode 720 may be made of a metal or a transparent conductive material, and are not limited thereto. Wherein the sixth electrode 720 is electrically connected to the second electrode layer 304; the fifth electrode 710 is electrically connected to the third doped layer 301. Thus, the driving substrate controls the brightness of the green chip by supplying the driving signal to the third electrode pair.

In the embodiment of the invention, the first electrode in the first electrode pair is a P electrode, and the second electrode is an N electrode; the third electrode in the second electrode pair is a P electrode, and the fourth electrode is an N electrode; the fifth electrode of the third electrode pair is an N electrode and the sixth electrode is a P electrode.

If the second electrode of the first electrode pair, the fourth electrode of the second electrode pair, and the fifth electrode of the third electrode pair are connected to the same signal line so that the same signal is applied, a common cathode structure may be formed. At this time, different signals may be applied to the first electrode, the third electrode, and the sixth electrode, respectively, to control the light emission luminance of each sub-pixel, thereby implementing image display.

Likewise, if the first electrode of the first electrode pair, the third electrode of the second electrode pair, and the sixth electrode of the third electrode pair are connected to the same signal line, thereby applying the same signal, a common anode structure may be formed. At this time, different signals can be applied to the second electrode, the fourth electrode and the fifth electrode respectively to control the light emitting brightness of each sub-pixel, thereby realizing image display.

In the embodiment of the present invention, the surface of the display unit is further covered with an insulating layer (not shown), and the insulating layer has a pattern exposing the first electrode pair, the second electrode pair, and the third electrode pair. The insulating layer is used for insulating the regions of the light emitting chips except the regions exposed with the first electrode pair, the second electrode pair and the third electrode pair, so that the crosstalk problem is prevented.

In the embodiment of the invention, the driving substrate further comprises a plurality of bonding pad pairs. The pad pairs are positioned on the surface of the driving substrate, and the positions of the pad pairs respectively correspond to the positions of the first electrode pair, the second electrode pair and the third electrode pair; the pad pair is electrically connected with the first electrode pair, the second electrode pair and the third electrode pair respectively and used for transmitting a driving signal.

Fig. 6 is a second schematic cross-sectional view illustrating a display device according to some embodiments of the invention.

Referring to fig. 6, in some embodiments, the display unit may employ a front-mount structure, and the pair of pads of the driving substrate 100 is disposed adjacent to the first substrate 1000 of the display unit. The display unit further includes a plurality of lead lines (not shown in the drawings); the leads are used to electrically connect the first electrode pair 500 and the corresponding pad pair 810, the second electrode pair 600 and the corresponding pad pair 820, the third electrode pair 700 and the corresponding pad pair 830, respectively.

At this time, the color conversion layer 400 is located on a side of the second blue chip 220 facing away from the first substrate 1000. In the embodiment of the present invention, the display device further includes an encapsulation layer (not shown), which covers the surface of the display unit facing away from the driving substrate 100, and is used for isolating water and oxygen, protecting the light emitting chips, and planarizing the display device.

Fig. 7 is a third schematic cross-sectional view illustrating a display device according to some embodiments of the invention.

Referring to fig. 7, in some embodiments, the display unit may further employ a flip-chip structure in which the pair of pads of the driving substrate 100 are disposed adjacent to the first electrode pair 500, the second electrode pair 600, and the third electrode pair 700 of the display unit. The first electrode pair 500 and its corresponding pad pair 810 are electrically connected by solder 900, the second electrode pair 600 and its corresponding pad pair 820 are electrically connected by solder 900, and the third electrode pair 700 and its corresponding pad pair 830 are electrically connected by solder 900.

At this time, the color conversion layer 400 is located on a side of the first substrate 1000 facing away from the second blue chip 220. In the embodiment of the present invention, the display device further includes an encapsulation layer (not shown), which covers the surface of the display unit facing away from the driving substrate 100, and is used for isolating water and oxygen, protecting the light emitting chips, and planarizing the display device.

On the other hand, an embodiment of the present invention provides a method for manufacturing any one of the display devices described above, and fig. 8 is a flowchart of the method for manufacturing a display device according to the embodiment of the present invention.

Referring to fig. 8, a method for manufacturing a display device according to an embodiment of the present invention includes:

s801, providing a first substrate and a second substrate;

s802, forming a blue light epitaxial layer on the first substrate, and forming a green light epitaxial layer on the second substrate;

s803, oppositely attaching the side of the first substrate provided with the blue light epitaxial layer and the side of the second substrate provided with the green light epitaxial layer;

s804, stripping the second substrate, and removing part of the green light epitaxial layer to form a green light chip;

s805, etching the blue light epitaxial layer to form two blue light chips, namely a first blue light chip and a second blue light chip; the green chip is positioned on one side of the first blue chip, which is far away from the first substrate;

and S806, forming a color conversion layer on the second blue light chip.

By adopting the manufacturing method provided by the embodiment of the invention, a plurality of display units can be formed, each display unit comprises two blue light chips, and the first blue light chip is used for emitting blue light and can be used as a blue sub-pixel; the green chip is used for emitting green light and can be used as a green sub-pixel; the second blue chip excites the color conversion layer for emitting red light, which can be used as a red sub-pixel. In the prior art, a blue light chip, a green light chip and a red light chip are respectively adopted for carrying out three-primary-color display, or the blue light chip is adopted to excite a red light conversion material and a green light conversion material to carry out three-primary-color display. Compared with the prior art, the display unit provided by the embodiment of the invention uses the blue light chip to emit blue light, the green light chip emits green light, and the blue light chip excites the color conversion layer to emit red light, so that the blue light, the green light and the red light in the display unit have higher light emitting efficiency, and the full-color display effect is enhanced.

Fig. 9a to 9m are schematic structural diagrams of the display device corresponding to the above steps.

Specifically, the first substrate and the second substrate may both be made of a transparent substrate material, and are not limited herein.

As shown in fig. 9a, forming a blue epitaxial layer on a first substrate 1000 includes: forming a first doping layer 1001, a first light emitting layer 1002 and a second doping layer 1003 on a first substrate 1000 in sequence to form the blue light epitaxial layer; a first electrode layer 1004 is formed on the side of the blue epitaxial layer facing away from the first substrate 1000.

Specifically, an epitaxial layer and a first electrode layer 1004 may be formed on the first substrate 1000 using a vapor deposition method. The first doping layer 1001 and the second doping layer 1003 can be obtained by performing N-type doping and P-type doping, respectively, using the same material, for example, gallium nitride.

As shown in fig. 9b, forming the green epitaxial layer on the second substrate 2000 includes: forming a third doping layer 301, a first light emitting layer 302 and a fourth doping layer 303 on the second substrate 2000 in sequence to form the green epitaxial layer; a second electrode layer 304 is formed on the side of the green epitaxial layer facing away from the second substrate 2000.

Specifically, the green epitaxial layer and the second electrode layer 304 may be formed on the second substrate 2000 using a vapor deposition method. The third doping layer 301 and the fourth doping layer 303 may be obtained by N-type doping and P-type doping, respectively, using the same material, for example, gallium nitride. The ions of the third doping layer and the fourth doping layer in the green light epitaxial layer which are subjected to N-type doping and P-type doping are different from the ions of the blue light epitaxial layer which is subjected to N-type doping and P-type doping, so that light with different colors can be emitted.

And after the blue light epitaxial layer and the green light epitaxial layer are manufactured, the side of the first substrate provided with the blue light epitaxial layer is relatively attached to the side of the second substrate provided with the green light epitaxial layer, and bonding treatment is carried out.

As shown in fig. 9c, it is necessary to coat a bonding layer 1100 on the side of the first electrode layer 1004 of the blue epitaxial layer facing away from the second doped layer 1003. The bonding layer 1100 may be silicon dioxide, transparent glue, or the like, and is not limited herein. The bonding layer 1100 has an insulating property and adhesiveness, insulates the electrical connection of the first electrode layer 1004 and the second electrode layer 304, and prevents a cross talk problem between the light emitting chips.

After bonding is complete, the second substrate 2000 needs to be stripped and the green epitaxial layer portion etched.

As shown in fig. 9d, a portion of the green epitaxial layer is etched away, and the remaining portion is used to form the green chip 300.

After the green chip is formed, the blue epitaxial layer is etched to form two blue chips, namely a first blue chip 210 and a second blue chip 220. The green chip 300 is located on a side of the first blue chip 210 facing away from the first substrate 1000.

Fig. 9e is a schematic top view of the display unit after the green chip 300, the first blue chip 210 and the second blue chip 220 are etched. As shown in fig. 9d and 9e, the orthographic projection of the green chip 300 on the first substrate 1000 is within the orthographic projection of the first blue chip 210 on the first substrate; the first blue light chip 210 and the second blue light chip 220 are not in contact with each other, so that crosstalk is avoided.

After etching, punching processing needs to be performed on the blue light chip and the green light chip.

As shown in fig. 9f, a punching process is performed on the bonding layer 1100 on the side of the blue light epitaxial layer of the first blue light chip 210 away from the first substrate 1000, so as to expose the first electrode layer 1004, and the first electrode 510 is formed by externally connecting a conductive material electrically connected to the first electrode layer; punching the bonding layer and the blue light epitaxial layer to expose the first doping layer 1001, and then externally connecting a conductive material electrically connected with the first doping layer to form a second electrode 520; the first electrode 510 and the second electrode 520 constitute a first electrode pair. Similarly, the bonding layer 1100 on the side of the blue light epitaxial layer of the second blue light chip 220 away from the first substrate 1000 is punched to expose the first electrode layer 1004, and a conductive material electrically connected to the first electrode layer is externally connected to form a third electrode 510; opening the bonding layer and the blue light epitaxial layer to expose the first doping layer 1001, and then externally connecting a conductive material electrically connected with the first doping layer to form a fourth electrode 520; the third electrode 510 and the fourth electrode 520 constitute a second electrode pair. Forming a fifth electrode 710 on the third doped layer 301 of the green epitaxial layer of the green chip 300 on the side facing away from the first substrate 1000; opening the green epitaxial layer to expose the second electrode layer 304, and then externally connecting a conductive material electrically connected with the second electrode layer 304 to form a sixth electrode 720; the fifth electrode 710 and the sixth electrode 720 constitute a third electrode pair.

After the electrode pairs are formed, the surface of the display unit is covered with an insulating layer (not shown in the figure), the insulating layer can be formed by coating the whole surface, and then a pattern for exposing the first electrode pair, the second electrode pair and the third electrode pair is formed on the surface of the insulating layer by using a photoetching process. The insulating layer is used for insulating the regions of the light emitting chips except the regions exposed with the first electrode pair, the second electrode pair and the third electrode pair, thereby preventing the crosstalk problem.

Then, a color conversion layer needs to be formed on the second blue chip. The orthographic projection of the color conversion layer on the first substrate should completely overlap with the orthographic projection of the second blue chip. Thereby avoiding the problem of mixing blue light in the emitted red light. It should be noted that the color conversion layer needs to be disposed on the light-emitting side of the display device, and the display unit is disposed in the opposite direction when the forward-mounting structure and the flip-chip structure are adopted. The color conversion layer can be set as desired.

When the display unit adopts a front-mounted structure. As shown in fig. 9g, a dam 410 is formed on the second blue chip 220, and the dam 410 may be made of a photoresist material or a glue material, which is not limited herein. In one implementation, the color conversion layer 400 is a quantum dot layer and the color conversion material 420 is a red quantum dot material. The dam 410 and the second blue chip 220 form an accommodation space. Therefore, in the accommodating space, the red quantum dot material can be formed in the accommodating space by using an ink-jet printing method. Thus, when the second blue chip 220 emits light, the emitted light can excite the color conversion material 420 to emit red light.

After forming the color conversion layer on one side of the second blue chip, it is necessary to provide a driving substrate 100, and the surface of the driving substrate 100 has a plurality of pad pairs. A pair of pads corresponds to each electrode pair, for example, pad pair 810 corresponds to first electrode pair 500, pad pair 820 corresponds to second electrode pair 600, and pad pair 830 corresponds to third electrode pair 700.

Further, the first substrate 1000 and the side of the driving substrate 100 where the pad pair is provided are adjacently disposed. The first electrode pair 500 and the pad pair 810, the second electrode pair 600 and the pad pair 820, the third electrode pair 700, and the pad pair 830 are electrically connected using wires (not shown), respectively. Therefore, the driving substrate 100 facilitates the electrical connection of the display unit, and the driving substrate 100 can be used to provide driving signals for controlling the brightness and color display of the display unit.

After the display unit is electrically connected with the driving substrate, an encapsulation layer (not shown in the figure) may be further coated on a side of the display unit away from the driving substrate, and the material may be silicon oxide or the like. The packaging layer can be used for packaging and protecting the display unit, prolonging the service life of the display device, improving the stability of the display device and being used for flattening the display device.

Fig. 9h is a schematic top view of the display unit in the front-mounted configuration. As shown in fig. 9h, in the display unit, the orthographic projection of the green chip 300 on the first substrate 1000 is positioned within the orthographic projection of the first blue chip 210 on the first substrate 1000. The orthographic projection of the color conversion layer on the first substrate 1000 is completely overlapped with the orthographic projection of the second blue chip and the first substrate 1000. Wherein the color-converting material 420 is formed within the dam 410.

When the display unit adopts a flip-chip structure, there are two methods for manufacturing the color conversion layer.

In some embodiments, as shown in fig. 9i, after the completion of the electrode pair is fabricated, a temporary substrate 3000 is provided, and an adhesive layer 3100 is coated on the temporary substrate 3000. The adhesive layer 3100 may be a thermally or optically releasable adhesive.

After the adhesive layer 3100 is formed, the side of the first substrate 1000 on which the green chip 300 is provided is bonded to the side of the temporary substrate 3000 on which the adhesive layer 3100 is provided. Then, as shown in fig. 9j, a color conversion layer is formed on the side of the first substrate 1000 facing away from the second blue chip 220. The dam 410 is formed on the first substrate 1000 at a side away from the second blue chip 220, and the dam 410 may be made of a photoresist material or an adhesive material, which is not limited herein. The dam 410 and the side of the first substrate 1000 facing away from the second blue chip 220 form a receiving space. In particular implementations, the color conversion layer can be a quantum dot layer and the color conversion material 420 can be a red quantum dot material. Therefore, in the accommodating space, the red quantum dot material can be formed in the accommodating space by using an ink jet printing method.

After the color conversion layer is formed, the display cell is separated from the transient substrate 3000 using a photo dissociation method or a thermal dissociation method. After separation, the substrate was transferred to a driving substrate. As shown in fig. 9k, the pair of pads of the driving substrate 100 is disposed adjacent to the first electrode pair 500, the second electrode pair 600, and the third electrode pair 700 of the display unit, the first electrode pair 500 and the corresponding pair 810 of pads are electrically connected by solder 900, the second electrode pair 600 and the corresponding pair 820 of pads are electrically connected by solder 900, and the third electrode pair 700 and the corresponding pair 830 of pads are electrically connected by solder 900.

After the display unit is electrically connected to the driving substrate, an encapsulation layer (not shown) may be further coated on a side of the display unit away from the driving substrate, and the material may be silicon oxide or the like. The packaging layer can be used for packaging and protecting the display unit, prolonging the service life of the display device, improving the stability of the display device and flattening the display device.

In other embodiments, as shown in fig. 9l, after the completion of the electrode pairs, the pad pairs of the driving substrate 100 are disposed adjacent to the first electrode pair 500, the second electrode pair 600, and the third electrode pair 700 of the display unit, the first electrode pair 500 and the corresponding pad pair 810 thereof are electrically connected by solder 900, the second electrode pair 600 and the corresponding pad pair 820 thereof are electrically connected by solder 900, and the third electrode pair 700 and the corresponding pad pair 830 thereof are electrically connected by solder 900.

After the electrode pairs and the pad pairs are electrically connected, as shown in fig. 9m, a dam 410 is formed on a side of the first substrate 1000 away from the second blue chip 220, and the dam 410 may be made of a photoresist material or an adhesive material, which is not limited herein. The dam 410 and the side of the first substrate 1000 facing away from the second blue chip 220 form a receiving space. In this accommodation space, the color conversion material 420 may be formed in the accommodation space using an inkjet printing method.

After the color conversion layer is manufactured, an encapsulation layer (not shown in the figure) may be further coated on the side of the display unit away from the driving substrate, and silicon oxide or the like may be used as the material. The packaging layer can be used for packaging and protecting the display unit, prolonging the service life of the display device, improving the stability of the display device and being used for flattening the display device.

According to the first inventive concept, the display unit includes two blue chips, a green chip, and a color conversion layer. The two blue light chips are respectively a first blue light chip and a second blue light chip. The two blue light chips are positioned on the driving substrate and used for emitting blue light; the first blue light chip and the second blue light chip are arranged side by side. Wherein the first blue chip is used as a blue sub-pixel; the green chip is used as a green sub-pixel; the second blue chip may excite the color conversion layer to emit red light, which is used as a red sub-pixel. Therefore, the high light emitting efficiency of blue light, green light and red light in the display unit can be ensured, and the full-color display effect is enhanced.

According to the second inventive concept, the display unit further includes a first substrate. The first substrate is used as a substrate of the display unit, the blue light chip, the green light chip and the color conversion layer are combined together, and when the light emitting chip is transferred in a large amount, the display unit can be transferred in a unit, so that the number of times of large amount transfer can be reduced, and the transfer efficiency is improved.

According to the third inventive concept, the first blue chip and the second blue chip are arranged side by side on the first substrate. The orthographic projection pattern of the first blue light chip on the first substrate and the orthographic projection pattern of the second blue light chip on the first substrate have no overlapping range. The problem of crosstalk among the blue light chips is avoided, and the display effect is enhanced.

According to the fourth inventive concept, the green chip is located on the side of the first blue chip facing away from the first substrate; the orthographic projection of the green chip on the first substrate is within the range of the orthographic projection of the first blue chip on the first substrate. The green chip is in a transparent state when not emitting light. The blue light emitted by the first blue chip may exit through the green chip. Compared with the mode that the blue light chip is used for exciting the green conversion material to emit green light in the prior art, the light emitting efficiency of the green light chip is higher, and the full-color display effect is favorably enhanced.

According to the fifth inventive concept, the orthographic projection of the color conversion layer on the first substrate completely overlaps with the orthographic projection of the second blue chip on the first substrate. The luminous efficiency and the light utilization ratio of red light are improved, the display effect is enhanced, and the problem that blue light is mixed in the red light of the outgoing light is avoided.

According to a sixth inventive concept, the color conversion layer includes a dam and a color conversion material. The color conversion layer may be a quantum dot layer and the color conversion material may be a red quantum dot material. The box dam is used for forming an accommodating space and accommodating the color conversion material. The color conversion material emits red light under the excitation of the blue light emitted by the second blue light chip, and the light emitting efficiency is higher than that of the red light chip.

According to the seventh inventive concept, the display unit further includes: the first electrode pair is positioned on one side of the first blue light chip, which is far away from the first substrate; the second electrode pair is positioned on one side of the second blue light chip, which is far away from the first substrate; and the third electrode pair is positioned on one side of the green light chip, which is far away from the first blue light chip. The driving substrate includes: a plurality of bonding pad pairs located on the surface of the driving substrate; the positions of the bonding pad pairs respectively correspond to the positions of the first electrode pair, the second electrode pair and the third electrode pair; the pair of pads is electrically connected to the first electrode pair, the second electrode pair, and the third electrode pair, respectively. The driving substrate provides driving signals to the electrodes of the light emitting chips through the bonding pads so as to control the brightness of the light emitting chips.

According to the eighth inventive concept, the surface of the display unit is further covered with an insulating layer. The insulating layer is used for insulating the regions of the light emitting chips except the regions exposed with the first electrode pair, the second electrode pair and the third electrode pair, thereby preventing the crosstalk problem.

According to the ninth inventive concept, the display unit may employ a front-mount structure in which the pair of pads of the driving substrate is disposed adjacent to the first substrate of the display unit. The display unit also comprises a plurality of leads; the leads are respectively used for electrically connecting the first electrode pair and the corresponding pad pair, the second electrode pair and the corresponding pad pair, and the third electrode pair and the corresponding pad pair. The color conversion layer is located on one side, away from the first substrate, of the second blue light chip. The display device also comprises an encapsulation layer, wherein the encapsulation layer covers the surface of the display unit, which is far away from the driving substrate, and is used for isolating water and oxygen, protecting the light-emitting chip and flattening the display device.

According to the tenth inventive concept, the display unit may further adopt a flip structure in which the pair of pads of the driving substrate is disposed adjacent to the first electrode pair, the second electrode pair, and the third electrode pair of the display unit. The first electrode pair and the corresponding pad pair are electrically connected through solder, the second electrode pair and the corresponding pad pair are electrically connected through solder, and the third electrode pair and the corresponding pad pair are electrically connected through solder. The color conversion layer is located on one side, away from the second blue light chip, of the first substrate. The display device also comprises an encapsulation layer, wherein the encapsulation layer covers the surface of the display unit, which is far away from the driving substrate, and is used for isolating water and oxygen, protecting the light-emitting chip and flattening the display device. At this time, the first electrode pair and the corresponding pad pair are electrically connected by solder, the second electrode pair and the corresponding pad pair are electrically connected by solder, and the third electrode pair and the corresponding pad pair are electrically connected by solder.

According to an eleventh inventive concept, a method of manufacturing a display device includes providing a first substrate and a second substrate; forming a blue light epitaxial layer on a first substrate, and forming a green light epitaxial layer on a second substrate; the side of the first substrate provided with the blue light epitaxial layer is oppositely attached to the side of the second substrate provided with the green light epitaxial layer; stripping the second substrate, and removing part of the green light epitaxial layer to form a green light chip; etching the blue light epitaxial layer to form two blue light chips, namely a first blue light chip and a second blue light chip; the green light chip is positioned on one side of the first blue light chip, which is far away from the first substrate; and forming a color conversion layer on the second blue light chip. The display element uses blue light chip emission blue light, and green glow chip emission green, blue light chip arouse the color conversion layer to emit red light, can guarantee that blue light, green light and red light all have higher luminous efficiency among the display element from this, have strengthened full-color display effect.

According to the twelfth inventive concept, forming a blue epitaxial layer on a first substrate specifically includes: sequentially forming a first doping layer, a first light-emitting layer and a second doping layer on a first substrate to form the blue light epitaxial layer; and forming a first electrode layer on one side of the blue light epitaxial layer, which is far away from the first substrate. Forming a green epitaxial layer on a second substrate, specifically comprising: sequentially forming a third doping layer, a second light emitting layer and a fourth doping layer on a second substrate to form a green light epitaxial layer; and forming a second electrode layer on the side of the green light epitaxial layer, which is far away from the second substrate.

According to the thirteenth inventive concept, attaching the side of the first substrate provided with the blue light epitaxial layer and the side of the second substrate provided with the green light epitaxial layer oppositely comprises: bonding the first electrode layer and the second electrode layer to each other. The bonding layer may be silicon dioxide, transparent adhesive, or the like, and is not limited herein. The bonding layer has insulating property and viscosity, isolates the electrical connection of the first electrode layer and the second electrode layer 304, and prevents the crosstalk problem between the light emitting chips.

According to the fourteenth inventive concept, the manufacturing method further includes: punching the first blue light chip to respectively expose a first doping layer and a first electrode layer of the first blue light chip, and forming a first electrode pair on the exposed first doping layer and the exposed first electrode layer; punching the second blue light chip to expose a first doping layer and a first electrode layer of the second blue light chip respectively, and forming a second electrode pair on the exposed first doping layer and the exposed first electrode layer; and perforating the green chip to expose the second electrode layer of the green chip, and forming a third electrode pair on the exposed second electrode layer and the third doped layer.

According to a fifteenth inventive concept, when the display unit adopts the front-loading structure, forming the color conversion layer on the second blue chip specifically includes: forming a dam on one side of the second blue light chip, which is far away from the first substrate; and injecting a color conversion material into the inner injection to form a color conversion layer. The box dam is used for forming an accommodating space and accommodating the color conversion material. The color conversion layer can be a quantum dot layer, the color conversion material can be a red quantum dot material, red light is emitted under excitation of blue light emitted by the second blue light chip, and the light emitting efficiency is higher than that of the red light chip. The manufacturing method further comprises the following steps: providing a driving substrate; the surface of the driving substrate is provided with a bonding pad pair; arranging the first substrate and one side of the driving substrate, which is provided with the bonding pad pair, adjacently; electrically connecting the first electrode pair, the second electrode pair and the third electrode pair with the corresponding bonding pad pairs on the driving substrate respectively by using leads; and finally, carrying out packaging treatment.

According to the sixteenth inventive concept, when the display unit adopts the flip-chip structure, after the electrode pair is fabricated, a temporary substrate is provided, and the side of the first substrate on which the green chip is disposed is attached to the temporary substrate. And forming a color conversion layer on the side of the first substrate, which is far away from the second blue light chip. Transferring the first substrate with the color conversion layer to a driving substrate, wherein a bonding pad pair of the driving substrate is adjacent to a first electrode pair, a second electrode pair and a third electrode pair of the display unit and is electrically connected with the driving substrate; and finally, carrying out packaging treatment.

According to the seventeenth inventive concept, when the display unit adopts the flip-chip structure, the driving substrate is provided; the surface of the driving substrate is provided with a bonding pad pair; one side of the first substrate, on which the first electrode pair, the second electrode pair and the third electrode pair are provided, is disposed adjacent to one side of the driving substrate, on which the pad pair is provided. Each electrode pair is electrically connected to a corresponding pad pair using solder. Forming a color conversion layer on one side of the first substrate, which is far away from the second blue light chip; and finally, carrying out packaging treatment.

While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including the preferred embodiment and all changes and modifications that fall within the scope of the invention.

It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims

1. A display device, comprising:

a driving substrate for providing a driving signal;

the display unit is positioned on the driving substrate and is electrically connected with the driving substrate;

wherein the display unit includes:

the two blue light chips are positioned on the driving substrate and used for emitting blue light; the blue light chips are respectively a first blue light chip and a second blue light chip; the first blue light chip and the second blue light chip are arranged side by side;

the green light chip is positioned on one side of the first blue light chip and is used for emitting green light;

and the color conversion layer is positioned on one side of the second blue light chip and is used for emitting red light under the excitation of the second blue light chip.

2. The display device according to claim 1, wherein the display unit further comprises:

the two blue light chips are positioned on the first substrate; the first blue light chip and the second blue light chip are arranged on the first substrate side by side;

the green chip is positioned on one side of the first blue chip, which is far away from the first substrate;

the orthographic projection of the green light chip on the first substrate is positioned within the range of the orthographic projection of the first blue light chip on the first substrate;

the orthographic projection of the color conversion layer on the first substrate is completely overlapped with the orthographic projection of the second blue light chip on the first substrate.

3. The display device according to claim 1 or 2, wherein the color conversion layer comprises: the device comprises a dam and red quantum dot materials positioned in the dam.

4. The display device according to claim 2, wherein the display unit further comprises:

the first electrode pair is positioned on one side, away from the first substrate, of the first blue light chip;

the second electrode pair is positioned on one side, away from the first substrate, of the second blue light chip;

the third electrode pair is positioned on one side of the green light chip, which is far away from the first blue light chip;

the driving substrate includes: a plurality of bonding pad pairs positioned on the surface of the driving substrate; the positions of the bonding pad pairs respectively correspond to the positions of the first electrode pair, the second electrode pair and the third electrode pair; the pair of pads is electrically connected to the first electrode pair, the second electrode pair, and the third electrode pair, respectively.

5. The display device according to claim 4, wherein the pair of pads of the driving substrate is disposed adjacent to the first substrate of the display unit; the display unit further comprises a plurality of leads, wherein the leads are respectively used for electrically connecting the first electrode pair and the corresponding pad pair, electrically connecting the second electrode pair and the corresponding pad, and electrically connecting the third electrode pair and the corresponding pad pair;

the color conversion layer is positioned on one side, away from the first substrate, of the second blue light chip;

the display device further includes:

and the packaging layer covers the surface of each display unit.

6. The display device according to claim 4, wherein the pair of pads of the driving substrate is disposed adjacent to a first electrode pair, a second electrode pair, and a third electrode pair of the display unit; the first electrode pair is electrically connected with the corresponding bonding pad pair, the second electrode pair is electrically connected with the corresponding bonding pad, and the third electrode pair is electrically connected with the corresponding bonding pad pair;

the color conversion layer is positioned on one side, away from the second blue light chip, of the first substrate;

the display device further includes:

and the packaging layer covers the surface of each display unit.

7. A method for manufacturing a display device, comprising:

providing a first substrate and a second substrate;

forming a blue light epitaxial layer on a first substrate, and forming a green light epitaxial layer on a second substrate;

attaching the side of the first substrate provided with the blue light epitaxial layer to the side of the second substrate provided with the green light epitaxial layer oppositely;

stripping the second substrate, and removing part of the green light epitaxial layer to form a green light chip;

etching the blue light epitaxial layer to form two blue light chips, namely a first blue light chip and a second blue light chip; the green chip is positioned on one side of the first blue chip, which is far away from the first substrate;

and forming a color conversion layer on one side of the second blue light chip.

8. The method of claim 7, wherein the forming a blue epitaxial layer on a first substrate specifically comprises:

sequentially forming a first doping layer, a first light-emitting layer and a second doping layer on the first substrate to form the blue light epitaxial layer;

forming a first electrode layer on one side of the blue light epitaxial layer, which is far away from the first substrate;

the forming of the green light epitaxial layer on the second substrate specifically includes:

sequentially forming a third doping layer, a second light emitting layer and a fourth doping layer on the second substrate to form the green light epitaxial layer;

forming a second electrode layer on one side of the green light epitaxial layer, which is far away from the second substrate;

the first substrate will be provided with blue light epitaxial layer one side with the second substrate is provided with green light epitaxial layer one side and laminates relatively, specifically includes:

bonding the first electrode layer and the second electrode layer to each other;

the manufacturing method further comprises the following steps:

punching the first blue light chip to respectively expose a first doping layer and a first electrode layer of the first blue light chip, and forming a first electrode pair on the exposed first doping layer and the exposed first electrode layer;

punching the second blue light chip to expose a first doping layer and a first electrode layer of the second blue light chip respectively, and forming a second electrode pair on the exposed first doping layer and the exposed first electrode layer;

and perforating the green light chip, exposing the second electrode layer of the green light chip, and forming a third electrode pair on the exposed second electrode layer and the third doped layer.

9. The method of claim 8, wherein forming a color conversion layer on the second blue chip specifically comprises:

forming a dam on one side of the second blue light chip, which is far away from the first substrate;

injecting red quantum dot materials into the box dam to form a color conversion layer;

the manufacturing method further comprises the following steps:

providing a driving substrate; the surface of the driving substrate is provided with a bonding pad pair;

arranging the first substrate and one side of the driving substrate, which is provided with the bonding pad pair, adjacently;

and electrically connecting the first electrode pair, the second electrode pair and the third electrode pair with the corresponding pad pairs on the driving substrate by using leads.

10. The method of claim 8, wherein forming a color conversion layer on the second blue light chip comprises:

forming a dam on one side, away from the second blue light chip, of the first substrate;

the manufacturing method further comprises the following steps:

arranging one side of the first substrate, which is provided with the first electrode pair, the second electrode pair and the third electrode pair, adjacent to one side of the driving substrate, which is provided with the bonding pad pair;

and welding the first electrode pair, the second electrode pair and the third electrode pair with the corresponding welding pads on the driving substrate.