CN115900977A - Chip overheating warning method and device for relay protection equipment - Google Patents

Abstract

The invention discloses a chip overheat early warning method and device for relay protection equipment. Wherein, the method includes: collecting the ambient temperature of the monitored chip through a temperature sensor at intervals of preset unit monitoring time periods; calculating the junction temperature of the monitored chip according to the ambient temperature based on the chip junction temperature model; Compared with a junction temperature threshold, it is determined whether the relay protection device gives an early warning prompt to the monitored chip, wherein the multiple junction temperature thresholds include the first junction temperature threshold, the second junction temperature threshold, the third junction temperature threshold and the fourth junction temperature threshold. Threshold, between the first junction temperature threshold and the second junction temperature threshold is the normal operating temperature range; between the second junction temperature threshold and the third junction temperature threshold is the lifetime accelerated decay temperature range; the third junction temperature threshold and the fourth junction temperature threshold Between the temperature thresholds is the allowable short-term operating temperature range: the fourth junction temperature threshold is the highest allowable temperature.

Description

Chip overheating warning method and device for relay protection equipment

technical field

The present invention relates to the field of chip overheating warning technology, and more specifically, to a chip overheating warning method and device for relay protection equipment.

Background technique

Relay protection equipment is one of the key equipment in the field of power grid dispatching and communication. It is the first line of defense to ensure the safe and stable operation of the power grid. Overheating of components may cause equipment performance degradation or instability. In severe cases, it will affect the correctness of relay protection equipment. action, resulting in power grid outages or casualties and other accidents.

The equipment manufacturer mainly relies on the design experience and the high and low temperature test of the whole machine to ensure the thermal reliability of the equipment. After the test is passed, the thermal reliability is considered to meet the requirements. However, after it was put into operation, there were occasional incidents of components overheating that caused equipment failures, which affected the reliable operation of the power grid. With the comprehensive application of domestic chips in protection equipment, the problem of equipment heating has gradually emerged.

At present, State Grid Corporation installs temperature sensors on the CPU board and power board to sense the ambient temperature of the relay protection equipment in operation, and lacks effective means of judging the temperature and life status of high heat loss components such as the main control chip and FPGA chip, and There is no effective early warning and prompt strategy for overheated chips, and operators cannot know the abnormal state of chips in the first place. Long-term high-temperature operation of high-heat-loss components leads to abnormal chip performance, which will cause abnormal or even refusal or malfunction of protection equipment, seriously affecting the safe and reliable operation of the power grid.

Contents of the invention

Aiming at the deficiencies of the prior art, the present invention provides a chip overheating early warning method and device for relay protection equipment.

According to one aspect of the present invention, a chip overheating warning method for relay protection equipment is provided, including:

Collect the ambient temperature of the monitored chip through the temperature sensor every preset unit monitoring time period;

Based on the chip junction temperature model, calculate the junction temperature of the monitored chip according to the ambient temperature;

Compare the junction temperature with multiple preset junction temperature thresholds to determine whether the relay protection device will give an early warning prompt to the monitored chip, where the multiple junction temperature thresholds include the first junction temperature threshold, the second junction temperature threshold, the second The third junction temperature threshold and the fourth junction temperature threshold,

Between the first junction temperature threshold and the second junction temperature threshold is a normal operating temperature range;

Between the second junction temperature threshold and the third junction temperature threshold is a lifetime accelerated decay temperature range;

Between the third junction temperature threshold and the fourth junction temperature threshold is the allowable short-term operating temperature range:

The fourth junction temperature threshold is the maximum temperature allowed.

Optionally, compare the junction temperature with multiple preset junction temperature thresholds to determine whether the relay protection device gives an early warning prompt to the monitored chip, including:

When the junction temperature is higher than the fourth junction temperature threshold, the relay protection device sends an alarm signal to the monitored chip.

Optionally, compare the junction temperature with multiple preset junction temperature thresholds to determine whether the relay protection device gives an early warning prompt to the monitored chip, including:

When the junction temperature is between the third junction temperature threshold and the fourth junction temperature threshold interval, calculate the running time of the monitored chip, and if the running time exceeds the preset maximum allowed running time in this temperature range, continue The electrical protection device sends an alarm signal to the monitored chip.

Optionally, compare the junction temperature with multiple preset junction temperature thresholds to determine whether the relay protection device gives an early warning prompt to the monitored chip, including:

When the junction temperature is between the second junction temperature threshold and the third junction temperature threshold interval, set the monitoring time period of the monitored chip, and calculate the average junction temperature of the monitored chip within the monitoring time period;

Calculate the first characteristic lifetime of the monitored chip at the second junction temperature threshold and the second characteristic lifetime at the average junction temperature according to the Arrhenius model;

According to the first characteristic lifetime and the second characteristic lifetime, determine the lifetime attenuation acceleration ratio of the monitored chip within the monitoring period;

Set the protection warning time of the monitored chip in the life accelerated decay temperature range, and within the protection warning time, calculate the junction temperature and life decay acceleration ratio of the monitored chip at intervals of the preset unit monitoring time period, and determine that the monitored chip is in The average life decay acceleration ratio within the protection warning time;

According to the average life attenuation acceleration ratio, it is determined whether the relay protection device gives an early warning prompt to the monitored chip.

Optionally, according to the average life decay acceleration ratio, it is determined whether the relay protection device gives an early warning prompt to the monitored chip, including:

When the average life attenuation acceleration ratio is greater than the preset threshold, the relay protection device will not give an early warning prompt to the monitored chip;

In the case that the average life decay acceleration ratio is less than or equal to the preset threshold, the relay protection device sends an alarm signal to the monitored chip.

According to another aspect of the present invention, a chip overheating warning device for relay protection equipment is provided, including:

The acquisition module is used to collect the ambient temperature of the monitored chip through the temperature sensor at each preset unit monitoring time period;

The calculation module is used to calculate the junction temperature of the monitored chip according to the ambient temperature based on the chip junction temperature model;

The determination module is used to compare the junction temperature with a plurality of preset junction temperature thresholds, and determine whether the relay protection device gives an early warning prompt to the monitored chip, wherein the plurality of junction temperature thresholds include the first junction temperature threshold, the second the junction temperature threshold, the third junction temperature threshold, and the fourth junction temperature threshold,

Between the first junction temperature threshold and the second junction temperature threshold is a normal operating temperature range;

Between the second junction temperature threshold and the third junction temperature threshold is a lifetime accelerated decay temperature range;

Between the third junction temperature threshold and the fourth junction temperature threshold is the allowable short-term operating temperature range:

The fourth junction temperature threshold is the maximum temperature allowed.

According to still another aspect of the present invention, a computer-readable storage medium is provided, the storage medium stores a computer program, and the computer program is used to execute the method described in any one of the above aspects of the present invention.

According to another aspect of the present invention, an electronic device is provided, and the electronic device includes: a processor; a memory for storing instructions executable by the processor; the processor is used for reading from the memory fetching the executable instructions, and executing the instructions to implement the method described in any one of the above aspects of the present invention.

Therefore, the chip overheat warning method for relay protection equipment provided by the present application can reliably identify the actual operating state of the chip by setting different temperature thresholds and cooperating with corresponding alarm strategies. When the chip is abnormally high temperature, by lighting the abnormal light of the device and sending an alarm message to the monitoring background of the station, the operator is prompted to check the protection abnormal state at the first time and take timely solutions to avoid device failure due to chip overheating and affect the safety and reliability of the power grid. The running event occurs. The present invention can change the current situation that there is no effective monitoring means for the chip overheating of the relay protection equipment, and effectively improve the reliability of the relay protection equipment.

Description of drawings

A more complete understanding of the exemplary embodiments of the present invention can be had by referring to the following drawings:

Fig. 1 is a schematic flowchart of a chip overheat warning method for a relay protection device provided by an exemplary embodiment of the present invention;

Fig. 2 is another schematic flowchart of a chip overheat warning method for a relay protection device provided by an exemplary embodiment of the present invention;

Fig. 3 is a schematic structural diagram of a chip overheat warning device for relay protection equipment provided by an exemplary embodiment of the present invention;

Fig. 4 is a structure of an electronic device provided by an exemplary embodiment of the present invention.

Detailed ways

Hereinafter, exemplary embodiments according to the present invention will be described in detail with reference to the accompanying drawings. Apparently, the described embodiments are only some embodiments of the present invention, rather than all embodiments of the present invention, and it should be understood that the present invention is not limited by the exemplary embodiments described here.

It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

Those skilled in the art can understand that terms such as "first" and "second" in the embodiments of the present invention are only used to distinguish different steps, devices or modules, etc. necessary logical sequence.

It should also be understood that in the embodiments of the present invention, "plurality" may refer to two or more than two, and "at least one" may refer to one, two or more than two.

It should also be understood that for any component, data or structure mentioned in the embodiments of the present invention, it can generally be understood as one or more unless there is a clear limitation or a contrary suggestion is given in the context.

In addition, the term "and/or" in the present invention is only an association relationship describing associated objects, indicating that there may be three relationships, for example, A and/or B may indicate: A exists alone, and A and B exist at the same time , there are three cases of B alone. In addition, the character "/" in the present invention generally indicates that the contextual objects are an "or" relationship.

It should also be understood that the description of the various embodiments of the present invention emphasizes the differences between the various embodiments, and the same or similar points can be referred to each other, and for the sake of brevity, details are not repeated one by one.

At the same time, it should be understood that, for the convenience of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship.

The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, techniques, methods and devices should be considered part of the description.

It should be noted that like numerals and letters denote like items in the following figures, therefore, once an item is defined in one figure, it does not require further discussion in subsequent figures.

Embodiments of the present invention can be applied to electronic equipment such as terminal equipment, computer systems, servers, etc., which can operate with many other general-purpose or special-purpose computing system environments or configurations. Examples of well known terminal devices, computing systems, environments and/or configurations suitable for use with electronic devices such as terminal devices, computer systems, servers include, but are not limited to: personal computer systems, server computer systems, thin clients, thick client Computers, handheld or laptop devices, microprocessor-based systems, set-top boxes, programmable consumer electronics, networked personal computers, minicomputer systems, mainframe computer systems, and distributed cloud computing technology environments including any of the foregoing, etc.

Electronic devices such as terminal devices, computer systems, servers, etc. may be described in the general context of computer system-executable instructions, such as program modules, being executed by the computer system. Generally, program modules may include routines, programs, objects, components, logic, data structures, etc., that perform particular tasks or implement particular abstract data types. The computer system/server can be practiced in distributed cloud computing environments where tasks are performed by remote processing devices that are linked through a communications network. In a distributed cloud computing environment, program modules may be located in both local and remote computing system storage media including storage devices.

exemplary method

Fig. 1 is a schematic flowchart of a chip overheat warning method for a relay protection device provided by an exemplary embodiment of the present invention. This embodiment can be applied to electronic equipment. As shown in FIG. 1, the chip overheating warning method 100 for relay protection equipment includes the following steps:

Step 101, collect the ambient temperature of the monitored chip through the temperature sensor every preset unit monitoring time period;

Step 102, based on the chip junction temperature model, calculate the junction temperature of the monitored chip according to the ambient temperature;

Step 103, compare the junction temperature with a plurality of preset junction temperature thresholds, and determine whether the relay protection device gives an early warning prompt to the monitored chip, wherein the plurality of junction temperature thresholds include the first junction temperature threshold, the second junction temperature threshold, and the second junction temperature threshold. threshold, the third junction temperature threshold, and the fourth junction temperature threshold,

Between the first junction temperature threshold and the second junction temperature threshold is a normal operating temperature range;

Between the second junction temperature threshold and the third junction temperature threshold is a lifetime accelerated decay temperature range;

Between the third junction temperature threshold and the fourth junction temperature threshold is the allowable short-term operating temperature range:

The fourth junction temperature threshold is the maximum temperature allowed.

Optionally, compare the junction temperature with multiple preset junction temperature thresholds to determine whether the relay protection device gives an early warning prompt to the monitored chip, including:

When the junction temperature is higher than the fourth junction temperature threshold, the relay protection device sends an alarm signal to the monitored chip.

Optionally, compare the junction temperature with multiple preset junction temperature thresholds to determine whether the relay protection device gives an early warning prompt to the monitored chip, including:

When the junction temperature is between the third junction temperature threshold and the fourth junction temperature threshold interval, calculate the running time of the monitored chip, and if the running time exceeds the preset maximum allowed running time in this temperature range, continue The electrical protection device sends an alarm signal to the monitored chip.

Optionally, compare the junction temperature with multiple preset junction temperature thresholds to determine whether the relay protection device gives an early warning prompt to the monitored chip, including:

When the junction temperature is between the second junction temperature threshold and the third junction temperature threshold interval, set the monitoring time period of the monitored chip, and calculate the average junction temperature of the monitored chip within the monitoring time period;

Calculate the first characteristic lifetime of the monitored chip at the second junction temperature threshold and the second characteristic lifetime at the average junction temperature according to the Arrhenius model;

According to the first characteristic lifetime and the second characteristic lifetime, determine the lifetime attenuation acceleration ratio of the monitored chip within the monitoring period;

Set the protection warning time of the monitored chip in the life accelerated decay temperature range, and within the protection warning time, calculate the junction temperature and life decay acceleration ratio of the monitored chip at intervals of the preset unit monitoring time period, and determine that the monitored chip is in The average life decay acceleration ratio within the protection warning time;

According to the average life attenuation acceleration ratio, it is determined whether the relay protection device gives an early warning prompt to the monitored chip.

Optionally, according to the average life decay acceleration ratio, it is determined whether the relay protection device gives an early warning prompt to the monitored chip, including:

When the average life attenuation acceleration ratio is greater than the preset threshold, the relay protection device will not give an early warning prompt to the monitored chip;

In the case that the average life decay acceleration ratio is less than or equal to the preset threshold, the relay protection device sends an alarm signal to the monitored chip.

Specifically, according to the working requirements of the chip to be monitored, different junction temperature thresholds are set, which are T _1m , T _2m , T _3m , and T _4m in ascending order.

Among them, T _1m ~ T _2m : the normal working temperature range of the monitored chip, and the expected life is not affected;

T _2m -T _3m : The accelerated decay temperature range of the monitored chip life;

T _3m -T _4m : The monitored chip allows short-term operation temperature range;

T _4m : The highest allowable junction temperature of the chip, beyond which the chip may suffer irreversible damage;

The main steps are as follows:

Step 1: According to the Arrhenius model, calculate the characteristic life of the monitored chip at the maximum allowable temperature T _2m under normal operation:

Step 2: Use the temperature sensor to collect the ambient temperature of the chip in real time every unit time Δt, and calculate the junction temperature T _j of the monitored chip based on the chip junction temperature model;

Step 3: Determine the temperature range of the junction temperature.

When the junction temperature T _j is greater than T _4m , the abnormal light of the protection device is directly lit, and an alarm signal is sent to the monitoring background;

When the junction temperature T _j is greater than T _3m and less than T _4m , calculate the cumulative running time h of the monitored chip, and when the cumulative running time exceeds the allowable time h _max , light the abnormal light of the protection device and send an alarm signal to the monitoring background;

When the junction temperature T _j is less than T _3m , calculate the average junction temperature _Tjav of the monitored chip within a certain temperature monitoring time interval ΔT(n·Δt) and the characteristic lifetime of the chip at this temperature

Calculate the life decay acceleration ratio of the monitored chip:

Step 4: Set the protection early warning time of the chip in the life accelerated decay period to be N times △T, then repeat steps 2-3 during the chip protection early warning time, and calculate λ _i (i=1,2,3... ).

Step 5: Calculate the average value of the life decay acceleration ratio during the protection warning time N·△T:

If μ>1 during the protection warning time N·△T, it indicates that the monitored chip is working within the allowable temperature range of normal operation most of the time, which does not affect the expected life of the chip;

If μ≤1 during the protection warning time N·△T, it indicates that the monitored chip is working outside the allowable temperature range of normal operation most of the time, and the chip is in the period of accelerated life decay, that is, the life decay rate of the monitored chip is relatively large. The abnormal light of the protective device should be turned on, and an alarm signal should be sent to the monitoring background.

Thus, 1. The present invention proposes an overheating warning method for relay protection equipment components, and proposes corresponding overheating warning strategies based on different temperature thresholds, which can reliably identify the actual operating state of the chip; 2. The present invention proposes a method based on A The life accelerated attenuation model of the Lennius equation and the early warning strategy between partitions can avoid false alarms in the relay protection system under thermal oscillation and EMC environments, and are stable and reliable; 3. The present invention belongs to the category of soft protection. With the help of the current relay protection The device has a temperature monitoring function, and the judging strategy proposed by the present invention is added to complete the overheating warning of the monitored chip.

Therefore, the chip overheat warning method for relay protection equipment provided by the present application can reliably identify the actual operating state of the chip by setting different temperature thresholds and cooperating with corresponding alarm strategies. When the chip is abnormally high temperature, by lighting the abnormal light of the device and sending an alarm message to the monitoring background of the station, the operator is prompted to check the protection abnormal state at the first time and take timely solutions to avoid device failure due to chip overheating and affect the safety and reliability of the power grid. The running event occurs. The present invention can change the current situation that there is no effective monitoring means for the chip overheating of the relay protection equipment, and effectively improve the reliability of the relay protection equipment.

Exemplary device

Fig. 3 is a schematic structural diagram of a chip overheat warning device for relay protection equipment provided by an exemplary embodiment of the present invention. As shown in Figure 3, the device 300 includes:

The collection module 310 is used to collect the ambient temperature of the monitored chip through the temperature sensor every preset unit monitoring time period;

Calculation module 320, for calculating the junction temperature of the monitored chip according to the ambient temperature based on the chip junction temperature model;

The determination module 330 is used to compare the junction temperature with a plurality of preset junction temperature thresholds, and determine whether the relay protection device gives an early warning prompt to the monitored chip, wherein the plurality of junction temperature thresholds include the first junction temperature threshold, the second The second junction temperature threshold, the third junction temperature threshold and the fourth junction temperature threshold,

Between the first junction temperature threshold and the second junction temperature threshold is a normal operating temperature range;

Between the second junction temperature threshold and the third junction temperature threshold is a lifetime accelerated decay temperature range;

Between the third junction temperature threshold and the fourth junction temperature threshold is the allowable short-term operating temperature range:

The fourth junction temperature threshold is the maximum temperature allowed.

Optionally, the determining module 330 includes:

The first warning sub-module is used to send a warning signal to the monitored chip by the relay protection device when the junction temperature is higher than the fourth junction temperature threshold.

Optionally, the determining module 330 includes:

The second warning sub-module is used to calculate the running time of the monitored chip when the junction temperature is between the third junction temperature threshold and the fourth junction temperature threshold, and run when the running time exceeds the preset allowable temperature range In the case of the maximum value of time, the relay protection device sends an alarm signal to the monitored chip.

Optionally, the determining module 330 includes:

The first calculation sub-module is used to set the monitoring time period of the monitored chip when the junction temperature is between the second junction temperature threshold and the third junction temperature threshold, and calculate the average junction temperature of the monitored chip within the monitoring time period;

The second calculation sub-module is used to calculate the first characteristic life of the monitored chip at the second junction temperature threshold and the second characteristic life at the average junction temperature according to the Arrhenius model;

The first determining submodule is used to determine the life decay acceleration ratio of the monitored chip within the monitoring period according to the first characteristic life and the second characteristic life;

The second determination sub-module is used to set the protection early warning time of the monitored chip in the life accelerated decay temperature range, and perform junction temperature calculation and life decay acceleration of the monitored chip at intervals of preset unit monitoring time periods within the protection early warning time Ratio calculation to determine the average life decay acceleration ratio of the monitored chip within the protection warning time;

The third determination sub-module is used to determine whether the relay protection device gives an early warning prompt to the monitored chip according to the average life decay acceleration ratio.

Optionally, the third determination submodule includes:

The first judging unit is configured to prevent the relay protection device from giving an early warning prompt to the monitored chip when the average life attenuation acceleration ratio is greater than a preset threshold;

The second judging unit is configured to send an alarm signal to the monitored chip by the relay protection device when the average life decay acceleration ratio is less than or equal to a preset threshold.

Exemplary electronic device

Fig. 4 is a structure of an electronic device provided by an exemplary embodiment of the present invention. As shown in FIG. 4 , electronic device 40 includes one or more processors 41 and memory 42 .

Processor 41 may be a central processing unit (CPU) or other form of processing unit having data processing capabilities and/or instruction execution capabilities, and may control other components in the electronic device to perform desired functions.

Memory 42 may include one or more computer program products, which may include various forms of computer-readable storage media, such as volatile memory and/or non-volatile memory. The volatile memory may include, for example, random access memory (RAM) and/or cache memory (cache). The non-volatile memory may include, for example, a read-only memory (ROM), a hard disk, a flash memory, and the like. One or more computer program instructions can be stored on the computer-readable storage medium, and the processor 41 can execute the program instructions to implement the methods of the software programs of the various embodiments of the present invention described above and/or other desired features. In an example, the electronic device may further include: an input device 43 and an output device 44, and these components are interconnected through a bus system and/or other forms of connection mechanisms (not shown).

In addition, the input device 43 may also include, for example, a keyboard, a mouse, and the like.

The output device 44 can output various information to the outside. The output device 44 may include, for example, a display, a speaker, a printer, a communication network and its connected remote output devices, and the like.

Of course, for simplicity, only some components related to the present invention in the electronic device are shown in FIG. 4 , and components such as bus, input/output interface, etc. are omitted. In addition, the electronic device may also include any other suitable components according to specific applications.

Exemplary computer program product and computer readable storage medium

In addition to the above-mentioned methods and devices, embodiments of the present invention may also be computer program products, which include computer program instructions that, when executed by a processor, cause the processor to perform the above-mentioned "exemplary method" of this specification. Steps in methods according to various embodiments of the invention described in section.

The computer program product can be written in any combination of one or more programming languages for executing the program codes for the operations of the embodiments of the present invention, and the programming languages include object-oriented programming languages, such as Java, C++, etc. , also includes conventional procedural programming languages, such as the "C" language or similar programming languages. The program code may execute entirely on the user's computing device, partly on the user's device, as a stand-alone software package, partly on the user's computing device and partly on a remote computing device, or entirely on the remote computing device or server to execute.

In addition, the embodiments of the present invention may also be a computer-readable storage medium, on which computer program instructions are stored, and the computer program instructions, when executed by a processor, cause the processor to execute the above-mentioned "Exemplary Method" section of this specification. Steps in the method for information mining of historical change records according to various embodiments of the present invention described in .

The computer readable storage medium may employ any combination of one or more readable media. The readable medium may be a readable signal medium or a readable storage medium. A readable storage medium may include, but is not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, system, or device, or any combination thereof, for example. More specific examples (non-exhaustive list) of readable storage media include: electrical connection with one or more conductors, portable disk, hard disk, random access memory (RAM), read only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.

The basic principles of the present invention have been described above in conjunction with specific embodiments, but it should be pointed out that the advantages, advantages, effects, etc. mentioned in the present invention are only examples rather than limitations, and these advantages, advantages, effects, etc. Every embodiment of the invention must have. In addition, the specific details disclosed above are only for the purpose of illustration and understanding, rather than limitation, and the above details do not limit the present invention to be implemented by using the above specific details.

Each embodiment in this specification is described in a progressive manner, each embodiment focuses on the difference from other embodiments, and the same or similar parts of each embodiment can be referred to each other. As for the system embodiment, since it basically corresponds to the method embodiment, the description is relatively simple, and for the related parts, please refer to the part of the description of the method embodiment.

The block diagrams of devices, systems, devices, and systems involved in the present invention are only illustrative examples and are not intended to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagrams. These devices, systems, devices, systems may be connected, arranged, configured in any manner, as will be appreciated by those skilled in the art. Words such as "including", "comprising", "having" and the like are open-ended words meaning "including but not limited to" and may be used interchangeably therewith. As used herein, the words "or" and "and" refer to the word "and/or" and are used interchangeably therewith, unless the context clearly dictates otherwise. As used herein, the word "such as" refers to the phrase "such as but not limited to" and can be used interchangeably therewith.

It is possible to implement the methods and systems of the present invention in many ways. For example, the method and system of the present invention may be implemented by software, hardware, firmware or any combination of software, hardware, and firmware. The above sequence of steps used in the method is for illustration only, and the steps of the method of the present invention are not limited to the sequence specifically described above unless specifically stated otherwise. Furthermore, in some embodiments, the present invention can also be implemented as programs recorded in recording media including machine-readable instructions for realizing the method according to the present invention. Thus, the present invention also covers a recording medium storing a program for executing the method according to the present invention.

It should also be pointed out that in the system, device and method of the present invention, each component or each step can be decomposed and/or reassembled. These decompositions and/or recombinations should be considered equivalents of the present invention. The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the invention. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other aspects without departing from the scope of the invention. Thus, the present invention is not intended to be limited to the aspects shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

The foregoing description has been presented for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of the invention to the forms disclosed herein. Although a number of example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims (10)

1. A chip overheating early warning method for relay protection equipment, characterized in that, comprising: Collect the ambient temperature of the monitored chip through the temperature sensor every preset unit monitoring time period; calculating the junction temperature of the monitored chip according to the ambient temperature based on the chip junction temperature model; Comparing the junction temperature with a plurality of preset junction temperature thresholds to determine whether the relay protection device gives an early warning prompt to the monitored chip, wherein the plurality of junction temperature thresholds include the first junction temperature threshold, the second The second junction temperature threshold, the third junction temperature threshold and the fourth junction temperature threshold, Between the first junction temperature threshold and the second junction temperature threshold is a normal operating temperature range; Between the second junction temperature threshold and the third junction temperature threshold is a lifetime accelerated decay temperature interval; The range between the third junction temperature threshold and the fourth junction temperature threshold is the allowable short-term operating temperature range: The fourth junction temperature threshold is a maximum allowable temperature. 2. The method according to claim 1, characterized in that comparing the junction temperature with a plurality of preset junction temperature thresholds to determine whether the relay protection device gives an early warning prompt to the monitored chip, including : When the junction temperature is higher than the fourth junction temperature threshold, the relay protection device sends an alarm signal to the monitored chip. 3. The method according to claim 1, wherein the junction temperature is compared with a plurality of preset junction temperature thresholds to determine whether the relay protection device gives an early warning prompt to the monitored chip, including : When the junction temperature is between the third junction temperature threshold and the fourth junction temperature threshold interval, calculate the operating time of the monitored chip, and when the operating time exceeds the preset allowable temperature interval In the case of the maximum running time, the relay protection device sends an alarm signal to the monitored chip. 4. The method according to claim 1, characterized in that comparing the junction temperature with a plurality of preset junction temperature thresholds to determine whether the relay protection device gives an early warning prompt to the monitored chip, including : When the junction temperature is in the interval between the second junction temperature threshold and the third junction temperature threshold, set the monitoring time period of the monitored chip, and calculate the temperature of the monitored chip within the monitoring time period average junction temperature; calculating the first characteristic lifetime of the monitored chip at the second junction temperature threshold and the second characteristic lifetime at the average junction temperature according to the Arrhenius model; determining a life decay acceleration ratio of the monitored chip within the monitoring period according to the first characteristic life and the second characteristic life; Set the protection early warning time of the monitored chip in the life accelerated decay temperature interval, and perform junction temperature calculation and life expectancy of the monitored chip at intervals of the preset unit monitoring time period within the protection early warning time. Calculating the attenuation acceleration ratio, determining the average life attenuation acceleration ratio of the monitored chip within the protection warning time; According to the average life decay acceleration ratio, it is determined whether the relay protection device gives an early warning prompt to the monitored chip. 5. The method according to claim 4, wherein, according to the average life decay acceleration ratio, determining whether the relay protection device gives an early warning prompt to the monitored chip includes: In the case where the average life decay acceleration ratio is greater than a preset threshold, the relay protection device does not give an early warning prompt to the monitored chip; In a case where the average life decay acceleration ratio is less than or equal to the preset threshold, the relay protection device sends an alarm signal to the monitored chip. 6. A chip overheating early warning device for relay protection equipment, characterized in that it comprises: The acquisition module is used to collect the ambient temperature of the monitored chip through the temperature sensor at each preset unit monitoring time period; A calculation module, configured to calculate the junction temperature of the monitored chip according to the ambient temperature based on the chip junction temperature model; A determining module, configured to compare the junction temperature with a plurality of preset junction temperature thresholds, and determine whether the relay protection device gives an early warning prompt to the monitored chip, wherein the plurality of junction temperature thresholds include the first a junction temperature threshold, a second junction temperature threshold, a third junction temperature threshold, and a fourth junction temperature threshold, Between the first junction temperature threshold and the second junction temperature threshold is a normal operating temperature range; Between the second junction temperature threshold and the third junction temperature threshold is a lifetime accelerated decay temperature interval; The range between the third junction temperature threshold and the fourth junction temperature threshold is the allowable short-term operating temperature range: The fourth junction temperature threshold is a maximum allowable temperature. 7. The device according to claim 6, wherein the determining module comprises: The first warning submodule is configured to send an alarm signal to the monitored chip by the relay protection device when the junction temperature is higher than the fourth junction temperature threshold. 8. The device according to claim 6, wherein the determining module comprises: The second warning submodule is used to calculate the running time of the monitored chip when the junction temperature is in the interval between the third junction temperature threshold and the fourth junction temperature threshold, and during the running time In the case of exceeding the preset maximum allowable operating time in the temperature range, the relay protection device sends an alarm signal to the monitored chip. 9. A computer-readable storage medium, wherein the storage medium stores a computer program, and the computer program is used to execute the method according to any one of claims 1-5. 10. An electronic device, characterized in that the electronic device comprises: processor; memory for storing said processor-executable instructions; The processor is configured to read the executable instruction from the memory, and execute the instruction to implement the method described in any one of claims 1-5.

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