CN115831837A - Wafer loading device and loading method - Google Patents

Abstract

The invention relates to the technical field of semiconductor wafer processing, and discloses a wafer loading device and a loading method. Wherein the loading and fixing system of the wafer loading device includes a loading execution part and a fixed execution part, the loading execution part can load the wafer on the carrier assembly, and the fixed execution part can fix the loaded carrier assembly; The loading station corresponding to the part and the fixed station corresponding to the fixed executive part, the conversion workbench is rotated to change the position of the carrier assembly placed in the loading station and the fixed station; the transmission system is set on one part of the conversion workbench side, including the carrier frame and the transfer execution part, the transfer execution part can place the unloaded carrier assembly on the carrier frame on the fixed station, and place the carrier assembly loaded and fixed on the fixed station on the carrier frame; wafer The positioning can position the wafer to provide the positioned wafer for the load implement. The invention has higher working efficiency, better loading and fixing precision and more compact structure.

Description

Wafer loading device and loading method

technical field

The invention relates to the technical field of semiconductor wafer processing, in particular to a wafer loading device and a loading method.

Background technique

The wafer is carried by the fixture (tray, sealing ring, cover plate), and then enters the ICP process chamber for etching; the fixture carries 7-9 wafers at the same time; there is a channel at the bottom of the fixture for passing helium gas to cool the wafer and improve the process.

In the prior art, the process of loading the wafer into the fixture is a purely manual operation, which specifically includes the following steps: put the wafer positioner on the tray, suck the wafer into the positioner slot with a vacuum suction pen, carefully remove the positioner, slowly and accurately set it Fix the upper cover and turn it over 180 degrees, put screws (>30 pieces) on the bottom of the tray, turn it over 180 degrees and take off the clamp system for use. This process is cumbersome, inefficient, prone to wafer shift and contamination, and requires high quality operators.

Therefore, there is an urgent need for a wafer loading device and a loading method to solve the above problems.

Contents of the invention

Based on the above, the object of the present invention is to provide a wafer loading device and loading method, which have better loading accuracy, higher efficiency and more compact structure.

For reaching above-mentioned purpose, the present invention adopts following technical scheme:

Wafer loader, including:

The loading and fixing system includes a loading implement and a fixed implement, the loading implement can load the wafer on the carrier assembly, and the fixed implement can fix the loaded carrier assembly;

The conversion workbench is provided with a loading station corresponding to the loading execution member and a fixed station corresponding to the fixed execution member, and the conversion workbench is rotated so as to be placed in the loading station and the fixed execution member. the transfer position of the carrier assembly of the fixed station;

The transfer system is arranged on one side of the conversion workbench, and includes a carrier frame and a transfer implement, and the transfer execute member can place the empty carrier assembly on the carrier frame to the fixed station, and placing the fixed carrier assembly on the carrier after the fixed station is loaded and fixed;

A wafer positioning system configured to position the wafer so as to provide the positioned wafer for the loading implement.

As a preferred solution of a wafer loading device, the carrier assembly includes a carrier body and a cover plate, and the wafer loading device also includes a cover plate pick-and-place system, and the cover plate pick-and-place system can The cover is removed and snapped on after loading.

As a preferred solution of the wafer loading device, the wafer loading device further includes a fixing part supply system, which is arranged on one side of the fixing execution part, and the fixing part supply system can supply the fixing part to the fixing execution part.

As a preferred solution of a wafer loading device, the wafer loading device also includes a wafer supply system, the wafer supply system includes a wafer placement table and a wafer pick-and-place member, the wafer is placed on the wafer placement table, and the wafer The pick-and-place component can remove the wafer on the wafer placement table and place it in the wafer positioning system.

As a preferred solution of a wafer loading device, the conversion table is provided with through holes corresponding to the loading station and the fixed station, the conversion table is set up and down, and the conversion table is raised to support the carrier assembly, or descend to place the carrier assembly at the loading station and the fixing station.

As a preferred solution of the wafer loading device, there are two carriers, and the two carriers are respectively arranged on both sides of the transfer execution member, and one of the carriers is used to place the unloaded the carrier assembly, and the other carrier is used to place the loaded carrier assembly.

As a preferred solution of the wafer loading device, the loading station and the fixed station are configured to be able to rotate at a preset angle.

As a preferred solution of a wafer loading device, the wafer positioning system includes a positioning station, a backlight and a positioning camera, the wafer is placed on the positioning station, and the backlight is arranged on one of the positioning stations. The positioning camera is arranged on the side of the positioning station far away from the backlight, and the positioning camera is configured to acquire the light of the backlight passing through the positioning edge of the wafer.

As a preferred solution of the wafer loading device, the wafer positioning system further includes an adjustment module configured to rotate the wafer so as to direct the positioning side of the wafer toward a preset direction.

A wafer loading method, using the wafer loading device described in any of the above schemes, the wafer loading method comprising:

The transfer implement places the unloaded carrier assembly on the carrier to the fixed station of the conversion table;

The conversion table rotates to transfer the unloaded carrier assembly placed in the fixed station to the loading station;

The loading actuator loads the wafer positioned by the wafer positioning system on the empty carrier assembly;

The conversion table rotates, and the carrier assembly loaded at the loading station is transferred to the fixed station;

The fixed executive part fixes the loaded carrier assembly;

The conveying implement places the fixed carrier assembly on the carrier.

The beneficial effects of the present invention are:

In the present invention, the carrier frame is used to accommodate the unloaded and loaded carrier components; the transfer actuator is set to place the carrier component unloaded on the carrier frame at a fixed position on the conversion workbench; The conversion table is rotated and set, which can switch the position of the loading station and the carrier assembly of the fixed station; after the position is changed, the empty carrier assembly is placed in the loading station, and the loading execution part provides the wafer positioning system with the positioned wafer in turn. Placed on the carrier assembly; after the placement is completed, the conversion table rotates, and the loaded carrier assembly is transferred to the fixed station at this time, and the fixed execution part fixes the loaded carrier assembly; finally, the transfer execution part will The loaded and secured carrier components are transferred back to the carrier rack. The working efficiency of the wafer loading device is higher, and the accuracy of loading and fixing is better. At the same time, the structure of the wafer loading device is more compact, which effectively reduces the volume of the components, thereby reducing the occupied space of the entire device, which is more convenient for the transportation of the device and the workshop. Inner space utilization.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the accompanying drawings that need to be used in the description of the embodiments of the present invention. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention , for those skilled in the art, other drawings can also be obtained according to the content of the embodiment of the present invention and these drawings without any creative effort.

Fig. 1 is a schematic diagram of a wafer loading device provided by a specific embodiment of the present invention.

In the picture:

1. Loading and fixing system; 11. Loading execution parts; 12. Fixed execution parts;

2. Conversion table; 21. Loading station; 22. Fixed station;

3. Transmission system; 31. Bearing frame; 32. Transmission execution parts;

4. Wafer positioning system;

5. Cover pick-and-place system;

6. Fixture supply system;

7. Wafer supply system; 71. Placement table; 72. Wafer picking and placing parts.

Detailed ways

Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, or in a specific orientation. construction and operation, therefore, should not be construed as limiting the invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and should not be understood as indicating or implying relative importance. Wherein, the terms "first position" and "second position" are two different positions.

Unless otherwise clearly specified and limited, the terms "mounted", "connected", "connected" and "fixed" should be interpreted in a broad sense, for example, it may be a fixed connection or a detachable connection; it may be a mechanical connection, or It can be an electrical connection; it can be a direct connection, or an indirect connection through an intermediary, and it can be an internal communication between two elements or an interaction relationship between two elements. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

As shown in FIG. 1 , the present embodiment provides a wafer loading device, which includes a loading and fixing system 1, a transfer table 2, a transfer system 3 and a wafer positioning system 4, and the loading and fixing system 1 includes a loading execution member 11 and Fixed executive member 12, loading executive member 11 can be loaded on the carrier assembly with wafer, and fixed executive member 12 can fix the carrier assembly after loading; Conversion table 2 is provided with the loading station 21 corresponding to loading executive member 11 and The fixed station 22 corresponding to the fixed actuator 12, the conversion table 2 is rotated and set to switch the position of the carrier assembly placed in the loading station 21 and the fixed station 22; the transmission system 3 is arranged on one side of the conversion table 2 side, including a carrier frame 31 and a transfer actuator 32, the transfer actuator 32 can place the unloaded carrier assembly on the carrier frame 31 in the fixed station 22, and load the fixed station 22 with the fixed carrier assembly Placed on the carrier 31 ; the wafer positioning system 4 is configured to position the wafer so as to provide the positioned wafer for the loading implement 11 .

By setting the carrier 31 for containing the empty and loaded carrier components; by setting the transfer execution member 32, it is used to place the unloaded carrier components on the carrier 31 on the fixed position on the conversion workbench 2; By rotating the conversion table 2, the positions of the carrier components of the loading station 21 and the fixed station 22 can be switched; after the switching position, the unloaded carrier component is placed in the loading station 21, and the loading execution member 11 positions the wafer The system 4 provides that the positioned wafers are sequentially placed on the carrier assembly; after the placement is completed, the conversion table 2 rotates, and the loaded carrier assembly is transferred to the fixed station 22 at this time, and the fixed actuator 12 is paired with the loaded carrier assembly Fixing; finally, the loaded and fixed carrier assembly is transferred back to the carrier 31 by the transfer execution member 32 . The working efficiency of the wafer loading device is higher, and the accuracy of loading and fixing is better. At the same time, the structure of the wafer loading device is more compact, which effectively reduces the volume of the components, thereby reducing the occupied space of the entire device, which is more convenient for the transportation of the device and the workshop. Use of space inside.

As an alternative to a wafer loading device, two carriers 31 are provided, and the two carriers 31 are respectively arranged on both sides of the transfer execution member 32. Preferably, the two carriers 31 are symmetrical with respect to the transfer execution member 32 set up. One of the carrier frames 31 is used to place the unloaded carrier assembly, and the other carrier frame 31 is used to place the loaded carrier assembly. Each carrier frame 31 is sequentially provided with a plurality of bearing positions. corresponding setting of the bearer bit. Further, each bearing position can place a carrier component, and each bearing position is also equipped with a bearing sensor and an anti-collision sensor, etc., and only when multiple sensors are in the correct state, can the load be carried out. The transfer action of the component.

In this embodiment, the transfer actuator 32 is set as a manipulator, and the manipulator includes an X-axis module, a Z-axis module, and a θ-axis module. When transferring the carrier component, the corresponding modules of the three axes are linked to realize the transfer of the carrier component. Exemplarily, each shaft is driven by a servo motor, and can be driven by a structure such as a belt or a lead screw. Specifically, the X-axis module includes an X1 axis and an X2 axis, wherein the X1 axis can implement an adjustable stroke, and the X2 axis can implement a fixed stroke. The Z-axis is divided into Z1-axis and Z2-axis. The Z2-axis runs according to the travel ratio of the Z1-axis. The θ-axis can rotate 360 degrees. Such a design realizes a smaller size of the delivery implement 32 and makes debugging of the delivery implement 32 more flexible. Preferably, the execution end of the delivery implement 32 is also provided with a carrier fixing module and a fall-off detection module, which are respectively used for clamping, fixing and detecting the carrier component, so as to ensure the reliability of the delivery of the carrier component, and effectively Prevents the falling off of the carrier components.

As an optional solution of the wafer loading device, the wafer loading device further includes a wafer supply system 7 configured to supply wafers to the wafer positioning system 4 . Specifically, the wafer supply system 7 includes a wafer placement table 71 and a wafer pick-and-place member 72. The wafer placement table 71 is used to hold wafers. System 4.

Further, the wafer placement platform 71 is arranged in an arc shape, and the wafer pick-and-place member 72 is arranged inside the arc-shaped wafer placement platform 71 . Such setting is beneficial to reduce the pick-and-place distance and pick-and-place time of the wafer pick-and-place member 72, and effectively improves the wafer pick-and-place efficiency. Optionally, the wafer placement platform 71 is provided with multiple layers, and each layer is provided with a plurality of placement positions. Exemplarily, the wafer placement table 71 is provided with upper and lower layers, each layer has 10 placement positions, and there are 20 placement positions in total. Preferably, the placement position is compatible with wafers of various sizes, so as to improve the applicability and versatility of the wafer loading device. In addition, each placement position has jamming and displacement sensors to avoid collision of the wafer pick-and-place member 72, thereby ensuring that the wafer pick-and-place member 72 can pick and place wafers normally.

In this embodiment, the wafer pick-and-place part 72 is set as a manipulator, and the manipulator includes an X-axis module, a Z-axis module, a θ-axis module, and a rotation module. The rotation module is used for the reverse film of the wafer. Exemplarily, each shaft is driven by a servo motor, and can be driven by a structure such as a belt or a lead screw.

Preferably, the wafer pick-and-place unit 72 is also provided with a scanning sensor, which can be used to scan the position and number of wafers in the placement position, so as to facilitate the overall control of the wafer loading device. Exemplarily, the wafer pick-and-place member 72 is provided with a negative pressure pipeline, and the pick-and-place of the wafer is realized through negative pressure, which is beneficial to reduce damage to the wafer.

As an alternative to the wafer loading device, the wafer positioning system 4 includes a positioning station, a backlight and a positioning camera. The wafer is placed on the positioning station by the wafer pick-and-place part 72, and the backlight is arranged on one side of the positioning station. The positioning camera is arranged on the side of the positioning station far away from the backlight, and the positioning camera is configured to acquire the light of the backlight passing through the positioning edge of the wafer. Since light can pass through the positioning edge of the wafer, the positioning of the wafer can be realized through the backlight and the positioning camera. Compared with the mechanical positioning of the wafer in the prior art, on the one hand, the damage to the wafer is reduced, and on the other hand, the positioning accuracy Higher, and then a fine sealing ring (diameter 1200 μm) can be used to improve the area utilization rate of the wafer placing table 71 .

Further, the wafer positioning system 4 further includes an adjustment module configured to rotate the wafer so as to direct the positioning side of the wafer toward a preset direction. It is worth noting that the wafer positioning system 4 may not be provided with an adjustment module, and the wafer direction can be adjusted through the wafer pick-and-place component 72 or the loading execution component 11 .

As an alternative to the wafer loading device, the loading station 21 and the fixed station 22 on the conversion table 2 are symmetrically arranged, and the conversion table 2 is also provided with a communication channel corresponding to the loading station 21 and the fixed station 22. hole, the conversion table 2 is set up and down, the conversion table 2 rises to support the carrier assembly, and then the conversion table 2 rotates to exchange the position of the carrier assembly on the loading station 21 and the fixed station 22, and then converts The workbench 2 descends to place the carrier assembly on the loading station 21 and the fixing station 22 , so as to complete the transfer position of the carrier assembly to be placed on the loading station 21 and the fixing station 22 .

Specifically, the lifting and rotation of the transfer table 2 are respectively realized through the X-axis module and the θ-axis module. The X-axis module can be driven by a belt and a lead screw, and the θ-axis module can be operated by a direct drive motor with a deceleration device. The 360-degree rotation of the conversion workbench 2 can quickly switch the carrier components in a cycle, and realizes the flow automatic wafer loading process.

As an optional solution of the wafer loading device, the carrier assembly includes a carrier body and a cover plate, the carrier body is used to place the wafer, and the cover plate is buckled on the carrier body. Correspondingly, the wafer loading device also includes a cover pick-and-place system 5. When the empty carrier assembly is switched to the loading station 21, the cover pick-and-place system 5 removes the cover to facilitate the loading of the actuator 11 to the carrier. Chips are placed in the body; after the multiple chips on the carrier body are placed, the cover pick-and-place system 5 fastens the cover. After the cover plate pick-and-place system 5 fastens the rear cover plate, the conversion table 2 is rotated again, so that the carrier assembly after the wafer and the cover plate are fastened is transferred to the fixed station 22, so that the cover plate and the carrier The main body is fixed.

Specifically, the cover pick-and-place system 5 includes a lifting axis module and a translation axis module, which are respectively used to drive the negative pressure suction cup to lift and translate, so as to realize the removal and fastening of the cover. Exemplarily, each shaft is driven by a servo motor, and can be driven by a structure such as a belt or a lead screw. The cover pick-and-place system 5 also includes a negative pressure suction cup for absorbing the cover. Preferably, the cover pick-and-place system 5 also includes a pick-and-place cover identification module, specifically including a CCD camera, which collects, locates and calibrates position information before removing the cover, collects position information again after the cover needs to be fastened, and passes two The comparison of the secondary position information to ensure the accuracy of the buckled cover.

As an optional solution of the wafer loading device, the loading station 21 and the fixed station 22 are configured to be able to rotate at a preset angle. The rotation may be through a direct drive motor to realize a 360-degree rotation of the carrier assembly placed on the loading station 21 or the fixed station 22 . Furthermore, the preset angle of each rotation is related to the position on the carrier assembly and the position to be fixed, and those skilled in the art can set it according to actual needs.

Further, the loading station 21 is provided with a negative pressure fixing module, which is used to fix the carrier body by setting the negative pressure fixing module, so as to facilitate the picking and placing of the cover plate by the cover plate pick-and-place system 5, and at the same time perform reprinting on the reprinting execution part. The wafer and the fixed actuator 12 ensure the stability of the carrier body when the cover is fixed.

Preferably, the loading station 21 is also provided with a positioning module, the positioning module includes a CCD camera and a backlight assembly, and the light intensity of the backlight assembly can be set. Before the cover plate pick-and-place system 5 takes off the cover plate, the CCD camera collects the image of the carrier assembly and performs analysis and positioning, and then the cover plate pick-and-place system 5 takes off the cover plate; The image of each film placement position is analyzed and positioned to achieve more accurate wafer loading; in addition, after the cover is transferred and fastened, the CCD camera can also collect the influence of the cover and analyze the positioning for subsequent fixing of the actuator 12 to fix the cover board accuracy.

In this embodiment, the wafer loading device further includes a fixture supply system 6 disposed on one side of the fixture 12 , and the fixture supply system 6 can supply fixtures for the fixture 12 . Exemplarily, the fixing element is a screw, and a large number of screws are stored in the fixing element supply system 6 , and the fixing element supply system 6 can also arrange and position the screws when supplying the screws. Preferably, the fastener supply system 6 further includes a counter and a shortage sensor, respectively monitoring the number of installed screws and the remaining screws, so as to ensure the reliability of supplying screws.

Specifically, the fixed station 22 is provided with a centering module for positioning the carrier assembly at the fixed station 22 . Optionally, the centering module is positioned by a three-jaw positioning cylinder. On the one hand, the three-jaw positioning cylinder can center the carrier assembly, and on the other hand, it is used to fix the carrier assembly, which is convenient for the stability of the carrier assembly during fixing, and effectively Avoiding the failure of loading or fixing due to the location of the vehicle components.

This embodiment also discloses a wafer loading method, using the wafer loading device described in any of the above schemes, the wafer loading method includes: the transfer execution member 32 transfers the empty carrier assembly from the carrier frame 31 to the transfer table 2 The fixed station 22; the conversion table 2 rotates, and the unloaded carrier assembly is converted to the loading station 21; the cover plate pick-and-place system 5 takes the cover plate of the carrier assembly; the wafer supply system 7 sends the wafer positioning system 4 The wafer is supplied, and the wafer positioning system 4 positions the wafer; the loading actuator 11 places the positioned wafer on the carrier body; the cover plate pick-and-place system 5 buckles the cover plate of the carrier assembly; the conversion table 2 rotates, and the The loaded carrier assembly is transferred to the fixed station 22; the fixture supply system 6 supplies the fixture for the fixed actuator 12, and the fixed actuator 12 fixes the cover plate of the carrier assembly; finally, the loaded and fixed actuator 32 is delivered The carrier assembly is transferred to the carrier frame 31 by the fixed station 22 of the transfer table 2 .

The above content is only a preferred embodiment of the present invention. For those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation and application scope. limits.

Claims (10)

1. A wafer loading apparatus, comprising:

the loading and fixing system (1) comprises a loading executive part (11) and a fixing executive part (12), wherein the loading executive part (11) can load the wafer on the carrier component, and the fixing executive part (12) can fix the loaded carrier component;

the conversion workbench (2) is provided with a loading station (21) corresponding to the loading executive part (11) and a fixing station (22) corresponding to the fixing executive part (12), and the conversion workbench (2) is rotatably arranged to convert the carrier components arranged at the loading station (21) and the fixing station (22) into positions;

the conveying system (3) is arranged on one side of the conversion workbench (2) and comprises a bearing frame (31) and a conveying executing piece (32), the conveying executing piece (32) can place the carrier components unloaded on the bearing frame (31) on the fixing station (22), and place the carrier components loaded and fixed on the fixing station (22) on the bearing frame (31);

a wafer positioning system (4) configured to position the wafer to provide the positioned wafer to the load effector (11).

2. The wafer loading device according to claim 1, wherein the carrier assembly comprises a carrier body and a cover plate, the wafer loading device further comprising a cover plate pick-and-place system (5), the cover plate pick-and-place system (5) being capable of removing the cover plate before loading the wafer and snapping the cover plate after loading.

3. The wafer loading apparatus according to claim 1, further comprising a fixing member supply system (6) provided at one side of the fixing actuator (12), wherein the fixing member supply system (6) can supply a fixing member to the fixing actuator (12).

4. The wafer loading device according to claim 1, characterized in that the wafer loading device further comprises a wafer supply system (7), the wafer supply system (7) comprises a wafer placing table (71) and a wafer taking and placing member (72), the wafer is placed on the wafer placing table (71), and the wafer taking and placing member (72) can take the wafer off the wafer placing table (71) and place the wafer on the wafer positioning system (4).

5. The wafer loading apparatus according to claim 1, wherein the transfer table (2) is provided with through holes corresponding to the loading station (21) and the fixing station (22), the transfer table (2) is disposed to be lifted, and the transfer table (2) is raised to support the carrier assembly or lowered to place the carrier assembly at the loading station (21) and the fixing station (22).

6. The wafer loading apparatus according to claim 1, wherein the carrier (31) is provided with two, two carriers (31) are respectively provided at both sides of the transfer actuator (32), one of the carriers (31) is used for placing the empty carrier components, and the other carrier (31) is used for placing the loaded carrier components.

7. Wafer loading device according to claim 1, characterized in that the loading station (21) and the fixing station (22) are configured so as to be each rotatable by a preset angle.

8. The wafer loading apparatus according to claim 1, wherein the wafer positioning system (4) comprises a positioning station where the wafer is placed, a backlight disposed at a side of the positioning station, and a positioning camera disposed at a side of the positioning station away from the backlight, the positioning camera being configured to acquire light of the backlight through a positioning edge of the wafer.

9. Wafer loading device according to claim 8, characterized in that the wafer positioning system (4) further comprises an adjustment module configured to be able to rotate the wafer to orient the positioning edge of the wafer in a preset direction.

10. A wafer loading method using the wafer loading apparatus according to any one of claims 1 to 9, the wafer loading method comprising:

the conveying executing part (32) places the carrier assembly unloaded on the bearing frame (31) on a fixing station (22) of the conversion workbench (2);

the conversion workbench (2) rotates to convert the carrier assembly which is positioned at the fixed station (22) and is unloaded to the loading station (21);

the loading executive component (11) loads the wafer positioned by the wafer positioning system (4) to the idle carrier component;

the conversion workbench (2) rotates to convert the carrier assembly loaded at the loading station (21) to the fixed station (22);

the fixed executive component (12) fixes the loaded carrier assembly;

the transmission executing part (32) places the fixed carrier assembly on the bearing frame (31).

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