CN115831815A - Chip mounting system and mounting method thereof - Google Patents
Chip mounting system and mounting method thereof Download PDFInfo
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- CN115831815A CN115831815A CN202211474992.2A CN202211474992A CN115831815A CN 115831815 A CN115831815 A CN 115831815A CN 202211474992 A CN202211474992 A CN 202211474992A CN 115831815 A CN115831815 A CN 115831815A
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Abstract
The invention provides a chip mounting system and a mounting method thereof, wherein the chip mounting system comprises: a wafer film carrying a chip; the wafer moving mechanism is used for adjusting the initial position and the angle of the wafer film; the thimble mechanism is positioned below the wafer film and used for jacking up the chip to separate the chip from the wafer film; the wafer identification camera is positioned above the thimble mechanism, is coaxial with the thimble mechanism and is used for identifying and positioning the position of the chip; the mounting substrate is positioned above the wafer identification camera; paste and paste dress device is including just installing mechanism, flip-chip mechanism and subsides installation mechanism, and just installing mechanism is used for realizing that the chip is just adorned, and flip-chip mechanism is used for realizing the chip flip-chip, pastes installation mechanism and installs on two-dimensional moving mechanism for pick up the chip and paste the dress position of waiting on pasting the dress base plate from just installing mechanism or flip-chip mechanism. The invention can be compatible with the flip-chip mounting process and the face-up mounting process, and can also improve the mounting efficiency and the positioning precision of the chip.
Description
Technical Field
The invention relates to the technical field of chip mounting, in particular to a chip mounting system and a mounting method thereof.
Background
The semiconductor industry is a fundamental and strategic industry of technological development, and chip packaging is one of the important links of the semiconductor industry. In recent years, the packaging industry in China is continuously developed, innovative packaging design and manufacturing technology is continuously promoted, and the chip packaging technology of high-density thin system integration represents the mainstream direction of the packaging technology development, so that advanced packaging technologies such as WLCSP, fan-Out, embedded IC, 3D WLCSP, 3D IC, 2.5D interposer and the like are formed. In the future, advanced packaging technology is developed towards short interconnection length, versatility, high integration and high heat dissipation, and the design, manufacture and application reliability of the advanced packaging technology is challenged unprecedentedly.
The die attach process is one of the important processes of the die package process, and the die attach process generally attaches the die to a plurality of predetermined attachment positions on the surface of a substrate such as a lead frame, a material strip, a substrate wafer, a substrate flat plate, etc., and the die attached to the predetermined positions are arranged in rows and columns on the surface of the substrate. In order to improve the yield, the mounting precision of the chip on the substrate needs to be improved; in order to reduce the packaging cost of the chips, the mounting time of each chip is required to be shortened as much as possible; meanwhile, according to different packaging requirements, the chip needs to be mounted through a flip-chip process and a normal mounting process.
The existing chip mounting system and mounting method are that a substrate is fixed on a horizontally placed substrate bearing mechanism in a vacuum adsorption or clamping mode, the substrate bearing mechanism drives the substrate to move in an X-Y plane, a pre-mounting position on the substrate is moved to a specified mounting position and fixed, meanwhile, a mounting mechanism picks up a chip from a chip supply mechanism and then moves to the position above the specified mounting position, and after the X-Y position error provided by a visual alignment system is corrected, the chip is mounted on the pre-mounting position on the substrate, so that the chip mounting process is completed.
The chip mounting system and the mounting method have the following defects:
1. in a mounting period, the mounting mechanism moves in the X-vertical direction, the substrate bearing mechanism moves in the X-vertical direction, and the two mechanisms have positioning deviation, so that greater positioning deviation can be generated due to accumulation, and the positioning precision of a chip is low;
2. only a single mounting mechanism can be adopted, and the mounting efficiency is low;
3. the method is only suitable for a single flip-chip mounting process or a positive mounting process, can not be compatible with two mounting processes, and has limitation.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a chip mounting system which has a flip mounting process and a forward mounting process and has high positioning precision and high mounting efficiency and a mounting method thereof.
In order to achieve the purpose, the invention adopts the following specific technical scheme:
the present invention provides a chip mounting system, comprising: a wafer film on which a chip is loaded, the front surface of the chip facing upward; the wafer moving mechanism is used for driving the wafer film to move and adjusting the initial position and the angle of the wafer film; the ejector pin mechanism is positioned below the wafer film and used for upwards ejecting the chip to separate the chip from the wafer film; the wafer identification camera is positioned above the thimble mechanism, the center of the wafer identification camera and the center of the thimble mechanism form a straight line in the Z direction, and the wafer identification camera is used for identifying and positioning the position of the chip; the mounting substrate is positioned above the wafer recognition camera and is used as a mounting target of a chip on the wafer film; the mounting device comprises at least one set of mounting device, and each set of mounting device comprises a forward mounting mechanism, a reverse mounting mechanism, a two-dimensional moving mechanism, a mounting mechanism identification camera, a mounted substrate identification camera and a data processor; the flip-chip mechanism is used for picking up a chip separated from the wafer film and driving the chip to turn over 180 degrees, so that the back of the chip faces upwards; the forward mounting mechanism is positioned above the flip-chip mechanism and used for picking up the chip on the flip-chip mechanism and driving the chip to turn over 180 degrees, so that the front side of the chip faces upwards; the mounting mechanism is arranged on the two-dimensional moving mechanism and is used for picking up a chip on the flip-chip mechanism or the forward mounting mechanism under the driving of the two-dimensional moving mechanism and moving the chip to the position above the recognition camera of the mounting mechanism; the mounting mechanism identification camera is used for identifying a chip position A on the mounting mechanism; the mounting substrate identification camera is used for identifying a position B to be mounted on the mounting substrate; the data processor is used for correcting the position B to be mounted according to the chip position A and sending the corrected position to the mounting mechanism, and the mounting mechanism mounts the picked chip to the corrected position on the mounting substrate.
Preferably, the two-dimensional moving mechanism comprises a first horizontal direction straight line module, a second horizontal direction straight line module and a vertical direction straight line module, the two ends of the vertical direction straight line module are fixedly connected with the first horizontal direction straight line module and the second horizontal direction straight line module, and the mounting mechanism is fixed on the sliding block of the vertical direction straight line module.
Preferably, the number of mounting devices is two.
The invention provides a flip chip mounting method, which comprises the following steps:
s1, adjusting the initial position of a wafer film through the matching of a wafer moving mechanism and a wafer identification camera, and moving a chip to be mounted on the wafer film to be coaxial with an ejector pin mechanism;
s2, the thimble mechanism jacks up the chip to be mounted at present, so that the chip to be mounted at present is separated from the wafer film;
s3, picking up the current chip to be mounted by the flip-chip mechanism, turning the current chip to be mounted by 180 degrees, and enabling the back surface of the current chip to be mounted to face upwards;
s4, driving the mounting mechanism to move to the position above the flip mechanism through the two-dimensional moving mechanism, picking up a chip on the flip mechanism, and moving to the position above a mounting mechanism recognition camera;
s5, identifying a chip position A on the mounting mechanism through a mounting mechanism identification camera, identifying a position B to be mounted on the mounted substrate through a mounted substrate identification camera, correcting the position B to be mounted according to the chip position A by the data processor, and sending the corrected position to be mounted to the mounting mechanism;
and S6, mounting the picked chip to the corrected position to be mounted on the mounting substrate by the mounting mechanism.
The invention provides a chip normal mounting method, which comprises the following steps:
s1, adjusting the initial position of a wafer film through the matching of a wafer moving mechanism and a wafer identification camera, and moving a chip to be mounted on the wafer film to be coaxial with an ejector pin mechanism;
s2, the thimble mechanism jacks up the chip to be mounted at present, so that the chip to be mounted at present is separated from the wafer film;
s3, picking up the current chip to be mounted by the flip-chip mechanism, turning the current chip to be mounted by 180 degrees, and enabling the back surface of the current chip to be mounted to face upwards;
s4, moving the forward mounting mechanism to the position above the flip mechanism, picking up the chip on the flip mechanism, turning the chip over 180 degrees, and enabling the front side of the chip to face upwards;
s5, driving the mounting mechanism to move to the position above the mounting mechanism through the two-dimensional moving mechanism, picking up a chip on the mounting mechanism, and moving to the position above a recognition camera of the mounting mechanism;
s6, identifying a chip position A on the mounting mechanism through a mounting mechanism identification camera, identifying a position B to be mounted on the mounted substrate through a mounted substrate identification camera, correcting the position B to be mounted according to the chip position A by the data processor, and sending the corrected position to be mounted to the mounting mechanism;
and S7, mounting the picked chip to the corrected position to be mounted on the mounting substrate by the mounting mechanism.
The invention can obtain the following technical effects:
1. the invention realizes the compatibility of the flip-chip mounting process and the face-up mounting process by arranging the face-up mounting mechanism and the face-down mounting mechanism.
And at least two pasting mechanisms are adopted, so that the pasting efficiency is improved, the pasting substrate is fixed, and the positioning precision of the chip can be improved.
2. The invention uses at least two mounting mechanisms for chip mounting, and can improve mounting efficiency.
3. The invention only needs to move the pasting mechanism and the pasting substrate is fixed, thereby reducing the positioning error and improving the positioning precision of the chip.
Drawings
Fig. 1 is a schematic structural diagram of a die attach system according to an embodiment of the present invention.
Wherein the reference numerals include: the wafer film 1, the chip 2, the thimble mechanism 3, the wafer recognition camera 4, the mounting substrate 5, the mounting device 6, the upright mounting mechanism 61, the flip-chip mechanism 62, the two-dimensional moving mechanism 63, the mounting mechanism 64, the mounting mechanism recognition camera 65, the mounting substrate recognition camera 66, the first horizontal direction straight line module 631, the second horizontal direction straight line module 632 and the vertical direction straight line module 633.
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the following description, the same reference numerals are used for the same blocks. In the case of the same reference numerals, their names and functions are also the same. Therefore, detailed description thereof will not be repeated.
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not to be construed as limiting the invention.
Fig. 1 illustrates a structure of a die attach system provided according to an embodiment of the present invention.
As shown in fig. 1, a chip mounting system according to an embodiment of the present invention includes: wafer membrane 1, chip 2, thimble mechanism 3, wafer identification camera 4, dress base plate 5 and dress device 6, chip 2 connects on wafer membrane 1 through specific glue, the front of chip 2 is up, thimble mechanism 3 is located the below of wafer membrane 1, be used for upwards jack-up with chip 2, make chip 2 and the separation of wafer membrane 1, wafer identification camera 4 is located the top of wafer membrane 1, be used for discerning the position of chip 2, dress base plate 5 is located wafer identification camera 4 directly over, dress device 6 is used for picking up the chip with the separation of wafer membrane 1, and dress to dress the dress position of waiting of dress base plate 5.
The position and the angle of the wafer film 1 are adjusted through the wafer moving mechanism, the angle of the wafer film 1 is adjusted to enable the wafer film 1 to be in a horizontal state, the position of the wafer film 1 is adjusted to ensure that a chip to be mounted currently moves to a position right above the thimble mechanism 3, and the center of the chip to be mounted currently is coaxial with the center of the thimble mechanism 3.
The specific structure of the ejector pin mechanism 3 refers to the invention patent with the application number of 201280018547.3, the wafer film 1 is fixed in a vacuum adsorption mode, and the chip 2 is lifted upwards through an inner ejector pin, so that the chip 2 is separated from the wafer film 1.
The center of the wafer identification camera 4 is coaxial with the center of the thimble mechanism 3, the center of the wafer identification camera 4 is the center of the thimble mechanism 3, the position of the chip to be mounted on the wafer film 1 is identified through the wafer identification camera 4, if the center of the chip to be mounted is not superposed with the center of the wafer identification camera 4, the position deviation of the chip to be mounted is sent to the wafer moving mechanism, the wafer mechanism moves to drive the wafer film 1 to move, and the center of the chip to be mounted is coaxial with the center of the thimble mechanism 3.
In order to improve the mounting efficiency, the number of the mounting devices 6 is at least two, and under the condition that the movement does not interfere, a plurality of sets of mounting devices 6 can be adopted, and the structures of all the sets of mounting devices 6 are the same.
The mounting device 6 comprises a mounting mechanism 61, a flip-chip mechanism 62, a two-dimensional moving mechanism 63, a mounting mechanism 64, a mounting mechanism identification camera 65 and a mounting substrate identification camera 66, wherein the mounting mechanism 61 is used for realizing the mounting of the chip 2, the flip-chip mechanism 62 is used for realizing the flip-chip of the chip 2, the mounting mechanism 64 is fixedly mounted on the two-dimensional moving mechanism 63, the horizontal direction and the vertical direction of the mounting mechanism 64 are moved through the two-dimensional moving mechanism 63, the mounting mechanism 64 is used for picking up the chip on the mounting mechanism 61 or the flip-chip mechanism 62, the mounting mechanism identification camera 65 is used for identifying the position of the chip on the mounting mechanism 64, the mounting substrate identification camera 66 is used for identifying the position to be mounted of the mounting substrate 5, the data processor corrects the position to be mounted identified by the mounting substrate identification camera 66 based on the position of the chip identified by the mounting mechanism identification camera 65 and sends the corrected position to the mounting mechanism 64, and the mounting mechanism 64 mounts the picked-up chip on the mounting substrate 5 at the corrected position to be mounted.
The chip 2 is picked up by the forward mounting mechanism 61, the reverse mounting mechanism 62 and the mounting mechanism 64 in a vacuum adsorption manner or a clamping manner, and the specific structures of the forward mounting mechanism 61, the reverse mounting mechanism 62 and the mounting mechanism 64 are the prior art, so the detailed description is omitted here.
When the chip mounting system carries out the normal mounting and mounting process, pick up the chip 2 separated from the wafer film 1 through the flip-chip mechanism 62 and overturn the chip 2 by 180 degrees, make the back of the chip 2 up, then the normal mounting mechanism 61 moves to the flip-chip mechanism 62 directly over and is coaxial with the flip-chip mechanism 62, adsorb the back of the chip on the flip-chip mechanism 62 through the normal mounting mechanism 61 vacuum, then the normal mounting mechanism 61 overturns the chip 2 by 180 degrees, make the front of the chip 2 up, the front of the chip on the normal mounting mechanism 61 is adsorbed by the final mounting mechanism 64 and the position to be mounted of the mounting substrate 5 is mounted, the normal mounting of the chip is realized.
When the chip mounting system carries out the flip-chip mounting process, the mounting mechanism 61 is moved to other positions from the position right above the mounting mechanism 62, the collision between the mounting mechanism 64 and the mounting mechanism 61 is avoided, the mounting mechanism 64 directly adsorbs the back of the chip on the mounting mechanism 62 in vacuum, and the mounting position to be mounted of the mounting substrate 5 is mounted, so that the flip chip is realized.
Two-dimensional moving mechanism 63 includes first horizontal direction sharp module 631, second horizontal direction sharp module 632 and vertical direction sharp module 633, the one end of vertical direction sharp module 633 and the slider fixed connection of first horizontal direction sharp module 631, the other end of vertical direction sharp module 633 and the slider fixed connection of second horizontal direction sharp module 632, paste dress mechanism 64 and paste dress mechanism identification camera 65 fixed mounting respectively on the slider of vertical direction sharp module 633, first horizontal direction sharp module 631 and second horizontal direction sharp module 632 are used for driving and paste dress mechanism 64 and remove along the horizontal direction, vertical direction sharp module 633 is used for driving and pastes dress mechanism 64 and paste dress mechanism identification camera 65 and remove along the vertical direction.
The precision and the speed of chip mounting can be effectively improved by adopting two horizontal linear modules.
The mounting device 6 adopted by the invention can be compatible with a forward mounting and mounting process and an inverted mounting process, and the number of the mounting devices is at least two, so that the mounting efficiency of the chip is improved.
Because the mounting substrate 5 is always fixed, the positioning error can be reduced, and the positioning accuracy of the chip can be improved.
The above details describe the structure of the die attach system provided in the embodiment of the present invention, and correspondingly, the embodiment of the present invention further provides a die face-up attach method and a die face-down attach method implemented by using the die attach system.
The flip chip mounting method provided by the embodiment of the invention comprises the following steps:
s1, adjusting the initial position of a wafer film through the matching of a wafer moving mechanism and a wafer recognition camera, and enabling a chip to be mounted on the wafer film to move to be coaxial with an ejector pin mechanism.
S2, the ejector pin mechanism jacks up the chip to be mounted at present, and the chip to be mounted at present is separated from the wafer film.
S3, the flip mechanism picks up the chip to be mounted at present and turns over 180 degrees, so that the back of the chip to be mounted at present faces upwards.
And S4, driving the mounting mechanism to move to the position above the flip mechanism through the two-dimensional moving mechanism, picking up a chip on the flip mechanism, and moving to the position above the mounting mechanism recognition camera.
And S5, identifying a chip position A on the mounting mechanism through the mounting mechanism identification camera, identifying a position B to be mounted on the mounting substrate through the mounting substrate identification camera, correcting the position B to be mounted according to the chip position A by the data processor, and sending the corrected position to be mounted to the mounting mechanism.
And S6, mounting the picked chip to the corrected position to be mounted on the mounting substrate by the mounting mechanism.
The chip normal mounting and mounting method provided by the embodiment of the invention comprises the following steps:
s1, adjusting the initial position of a wafer film through the matching of a wafer moving mechanism and a wafer recognition camera, and enabling a chip to be mounted on the wafer film to move to be coaxial with an ejector pin mechanism.
S2, the ejector pin mechanism jacks up the chip to be currently mounted, so that the chip to be currently mounted is separated from the wafer film.
S3, the flip mechanism picks up the chip to be mounted at present and turns over 180 degrees, so that the back of the chip to be mounted at present faces upwards.
And S4, the forward mounting mechanism moves to the position above the flip mechanism, picks up the chip on the flip mechanism and turns over 180 degrees, so that the front side of the chip faces upwards.
And S5, driving the mounting mechanism to move to the position above the mounting mechanism through the two-dimensional moving mechanism, picking up the chip on the mounting mechanism, and moving to the position above the mounting mechanism recognition camera.
S6, identifying a chip position A on the mounting mechanism through the mounting mechanism identification camera, identifying a position B to be mounted on the mounting substrate through the mounting substrate identification camera, correcting the position B to be mounted according to the chip position A by the data processor, and sending the corrected position to be mounted to the mounting mechanism;
and S7, mounting the picked chip to the corrected position to be mounted on the mounting substrate by using a mounting mechanism.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Moreover, various embodiments or examples and features of various embodiments or examples described in this specification can be combined and combined by one skilled in the art without being mutually inconsistent.
Although embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are exemplary and not to be construed as limiting the present invention, and that changes, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.
The above embodiments of the present invention should not be construed as limiting the scope of the present invention. Any other corresponding changes and modifications made according to the technical idea of the present invention should be included in the protection scope of the claims of the present invention.
Claims (5)
1. A chip mounting system, comprising:
the chip packaging structure comprises a wafer film, a chip and a chip packaging structure, wherein a chip is loaded on the wafer film, and the front surface of the chip faces upwards;
the wafer moving mechanism is used for driving the wafer film to move and adjusting the initial position and the angle of the wafer film;
the ejector pin mechanism is positioned below the wafer film and used for upwards ejecting the chip to separate the chip from the wafer film;
the wafer identification camera is positioned above the thimble mechanism, the center of the wafer identification camera and the center of the thimble mechanism form a straight line in the Z direction, and the wafer identification camera is used for identifying and positioning the position of the chip;
the mounting substrate is positioned above the wafer identification camera and is used as a mounting target of the chip on the wafer film;
the mounting device comprises at least one set of mounting devices, and each set of mounting device comprises a forward mounting mechanism, a reverse mounting mechanism, a two-dimensional moving mechanism, a mounting mechanism identification camera, a mounted substrate identification camera and a data processor; wherein,
the flip-chip mechanism is used for picking up the chip separated from the wafer film and driving the chip to turn over 180 degrees, so that the back of the chip faces upwards;
the forward mounting mechanism is positioned above the flip-chip mechanism and used for picking up the chip on the flip-chip mechanism and driving the chip to turn over 180 degrees, so that the front side of the chip faces upwards;
the mounting mechanism is arranged on the two-dimensional moving mechanism and is used for picking up a chip on the flip-chip mechanism or the forward mounting mechanism under the driving of the two-dimensional moving mechanism and moving the chip to the position above the mounting mechanism identification camera;
the mounting mechanism identification camera is used for identifying a chip position A on the mounting mechanism;
the mounting substrate identification camera is used for identifying a position B to be mounted on the mounting substrate;
the data processor is used for correcting the position B to be mounted according to the chip position A and sending the corrected position to the mounting mechanism, and the mounting mechanism mounts the picked chip to the corrected position on the mounting substrate.
2. The die bonding system according to claim 1, wherein the two-dimensional moving mechanism comprises a first horizontal linear module, a second horizontal linear module and a vertical linear module, two ends of the vertical linear module are fixedly connected with modules of the first horizontal linear module and the second horizontal linear module, and the bonding mechanism is fixed on a slide block of the vertical linear module.
3. The die attach system according to claim 1 or 2, wherein the number of the attaching devices is two.
4. A flip chip mounting method implemented by the system of claim 1, comprising the steps of:
s1, adjusting the initial position of a wafer film through the matching of a wafer moving mechanism and a wafer recognition camera, and enabling a chip to be mounted on the wafer film to move to be coaxial with a thimble mechanism;
s2, the thimble mechanism jacks up the chip to be currently mounted upwards to separate the chip to be currently mounted from the wafer film;
s3, picking up the current chip to be mounted by the flip-chip mechanism, turning the current chip to be mounted by 180 degrees, and enabling the back surface of the current chip to be mounted to face upwards;
s4, driving the mounting mechanism to move to the position above the flip mechanism through the two-dimensional moving mechanism, picking up a chip on the flip mechanism, and moving to the position above a mounting mechanism recognition camera;
s5, recognizing a chip position A on the mounting mechanism through the mounting mechanism recognition camera, recognizing a position B to be mounted on a mounting substrate through the mounting substrate recognition camera, correcting the position B to be mounted according to the chip position A by the data processor, and sending the corrected position to be mounted to the mounting mechanism;
and S6, the mounting mechanism mounts the picked chip to the corrected position to be mounted on the mounting substrate.
5. A method for attaching a chip to a chip mounting system according to claim 1, comprising the steps of:
s1, adjusting the initial position of a wafer film through the matching of a wafer moving mechanism and a wafer recognition camera, and enabling a chip to be mounted on the wafer film to move to be coaxial with a thimble mechanism;
s2, the thimble mechanism jacks up the chip to be currently mounted upwards to separate the chip to be currently mounted from the wafer film;
s3, picking up the current chip to be mounted by the flip-chip mechanism, turning the current chip to be mounted by 180 degrees, and enabling the back surface of the current chip to be mounted to face upwards;
s4, moving the forward mounting mechanism to the position above the flip mechanism, picking up the chip on the flip mechanism, turning the chip over 180 degrees, and enabling the front side of the chip to face upwards;
s5, driving a mounting mechanism to move to the position above the mounting mechanism through a two-dimensional moving mechanism, picking up a chip on the mounting mechanism, and moving to the position above a mounting mechanism recognition camera;
s6, identifying a chip position A on the mounting mechanism through the mounting mechanism identification camera, identifying a position B to be mounted on a mounting substrate through the mounting substrate identification camera, correcting the position B to be mounted according to the chip position A by the data processor, and sending the corrected position to be mounted to the mounting mechanism;
and S7, the mounting mechanism mounts the picked chip to the corrected position to be mounted on the mounting substrate.
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| CN202211474992.2A CN115831815B (en) | 2022-11-23 | 2022-11-23 | Chip mounting system and mounting method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117393655A (en) * | 2023-12-08 | 2024-01-12 | 苏州易缆微光电技术有限公司 | High-precision mounting methods and systems for silicon photonic chips and active devices |
| CN117594519A (en) * | 2024-01-18 | 2024-02-23 | 东莞触点智能装备有限公司 | A high-precision chip bonding machine and its ultra-thin chip non-destructive jacking method |
| CN118081315A (en) * | 2024-01-18 | 2024-05-28 | 南京航空航天大学 | A SIP radio frequency module intelligent assembly device and process with integrated coordinate picking |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006135013A (en) * | 2004-11-04 | 2006-05-25 | Renesas Technology Corp | Mounting device and mounting method |
| JP2006310480A (en) * | 2005-04-27 | 2006-11-09 | Toshiba Corp | Semiconductor device manufacturing apparatus and manufacturing method |
| CN101794009A (en) * | 2010-03-23 | 2010-08-04 | 哈尔滨工业大学 | Chip image collecting and locating device based on rotary reflector |
| JP2015076411A (en) * | 2013-10-04 | 2015-04-20 | 株式会社日立ハイテクインスツルメンツ | Die bonder |
| CN108155124A (en) * | 2017-12-25 | 2018-06-12 | 北京中电科电子装备有限公司 | A kind of chip attachment device and method |
| CN113035745A (en) * | 2021-02-25 | 2021-06-25 | 东莞普莱信智能技术有限公司 | Chip mounting device |
| CN113035719A (en) * | 2021-02-25 | 2021-06-25 | 东莞普莱信智能技术有限公司 | Chip mounting method and device |
| CN115036250A (en) * | 2022-05-20 | 2022-09-09 | 纳研科技(上海)有限公司 | Multifunctional chip mounting device and chip mounting method thereof |
-
2022
- 2022-11-23 CN CN202211474992.2A patent/CN115831815B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006135013A (en) * | 2004-11-04 | 2006-05-25 | Renesas Technology Corp | Mounting device and mounting method |
| JP2006310480A (en) * | 2005-04-27 | 2006-11-09 | Toshiba Corp | Semiconductor device manufacturing apparatus and manufacturing method |
| CN101794009A (en) * | 2010-03-23 | 2010-08-04 | 哈尔滨工业大学 | Chip image collecting and locating device based on rotary reflector |
| JP2015076411A (en) * | 2013-10-04 | 2015-04-20 | 株式会社日立ハイテクインスツルメンツ | Die bonder |
| CN108155124A (en) * | 2017-12-25 | 2018-06-12 | 北京中电科电子装备有限公司 | A kind of chip attachment device and method |
| CN113035745A (en) * | 2021-02-25 | 2021-06-25 | 东莞普莱信智能技术有限公司 | Chip mounting device |
| CN113035719A (en) * | 2021-02-25 | 2021-06-25 | 东莞普莱信智能技术有限公司 | Chip mounting method and device |
| CN115036250A (en) * | 2022-05-20 | 2022-09-09 | 纳研科技(上海)有限公司 | Multifunctional chip mounting device and chip mounting method thereof |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117393655A (en) * | 2023-12-08 | 2024-01-12 | 苏州易缆微光电技术有限公司 | High-precision mounting methods and systems for silicon photonic chips and active devices |
| CN117393655B (en) * | 2023-12-08 | 2024-02-20 | 苏州易缆微光电技术有限公司 | High-precision mounting methods and systems for silicon photonic chips and active devices |
| CN117594519A (en) * | 2024-01-18 | 2024-02-23 | 东莞触点智能装备有限公司 | A high-precision chip bonding machine and its ultra-thin chip non-destructive jacking method |
| CN117594519B (en) * | 2024-01-18 | 2024-04-02 | 东莞触点智能装备有限公司 | Chip high-precision die bonder and ultrathin chip nondestructive jacking method thereof |
| CN118081315A (en) * | 2024-01-18 | 2024-05-28 | 南京航空航天大学 | A SIP radio frequency module intelligent assembly device and process with integrated coordinate picking |
| CN118081315B (en) * | 2024-01-18 | 2024-08-13 | 南京航空航天大学 | A SIP radio frequency module intelligent assembly device and process with integrated coordinate picking |
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| CN115831815B (en) | 2024-07-05 |
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