CN115816228B - Hierarchical material removal manufacturing method for high-aspect-ratio thin-wall optical element - Google Patents
Hierarchical material removal manufacturing method for high-aspect-ratio thin-wall optical elementInfo
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- CN115816228B CN115816228B CN202211435959.9A CN202211435959A CN115816228B CN 115816228 B CN115816228 B CN 115816228B CN 202211435959 A CN202211435959 A CN 202211435959A CN 115816228 B CN115816228 B CN 115816228B
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Abstract
本发明公开了一种高径厚比薄壁光学元件的层级材料去除制造方法，属于精密光学元件制造领域。针对高径厚比薄壁光学元件壁薄易碎难加工的难题，构建了新型薄壁斜面体层级材料去除模型，可对切削后元件研磨去除过程的材料去除效率及深度做定量化计算，精确指导材料的加工工艺参数规划；通过对研磨盘、工装夹具和工件进行运动学建模，计算获得工件相对于研磨盘的运动轨迹；结合材料接触去除特性和工艺参数去除过程理论计算得到材料的去除率。本发明适用于切削加工后斜面体零件在研磨机上进行研磨加工时采用不同加工参数下材料去除率的计算，同时也适用于根据材料去除率反推加工参数的计算，完成对高径厚比薄壁光学元件制造过程的精确控制。
This invention discloses a layered material removal manufacturing method for high aspect ratio thin-walled optical components, belonging to the field of precision optical component manufacturing. Addressing the challenge of thin-walled, fragile, and difficult-to-machine high aspect ratio thin-walled optical components, a novel layered material removal model for thin-walled inclined surfaces is constructed. This model can quantitatively calculate the material removal efficiency and depth during the grinding process after cutting, precisely guiding the planning of material processing parameters. By performing kinematic modeling on the grinding disc, tooling fixture, and workpiece, the motion trajectory of the workpiece relative to the grinding disc is calculated. The material removal rate is calculated by combining material contact removal characteristics and theoretical calculations of the process parameters. This invention is applicable to calculating the material removal rate of inclined surface parts under different processing parameters during grinding on a grinding machine after cutting. It is also applicable to calculating processing parameters by inversely deducing the processing parameters from the material removal rate, achieving precise control of the manufacturing process of high aspect ratio thin-walled optical components.
Description
Technical Field
The invention belongs to the field of manufacturing of precision optical elements, and particularly relates to a hierarchical material removal manufacturing method of a high-diameter-thickness-ratio thin-wall optical element.
Background
Plane grinding and polishing are important ways to obtain high-precision optical elements, and have general application in the fields of electronic information, laser, aerospace and the like. The plane grinding and polishing processing of materials is a complex and precise multi-input multi-output system, the removal rate and the surface precision of the output materials are limited by various input factors, and the factors commonly influence the processing process and the result. Especially for the high aspect ratio thin-wall optical element, the optical element has the characteristics of easy damage, uncontrollable property and the like which are difficult to process. At present, accurate digital modeling methods are proposed by fresh people and are used for planning processing technological parameters.
Disclosure of Invention
In order to solve the processing difficulty of the thin-wall optical element in the existing industry, the invention provides a hierarchical material removing manufacturing method of a high-diameter-thickness ratio thin-wall optical element. The method takes the cut element section as an inclined plane, establishes a hierarchical processing removal model and a relative motion track kinematic model, deduces a material removal rate model, guides processing process planning and accurate manufacturing of the element, and solves the problem of calculating the grinding removal rate of the high-diameter-thickness ratio thin-wall optical element.
In order to achieve the above purpose, the invention is realized by adopting the following technical scheme:
a method of hierarchical material removal fabrication of an high aspect ratio thin-walled optical element, comprising the steps of:
1) Providing an inclined plane body level model for the grinding process of the workpiece;
2) Finishing kinematic modeling on the motion trail of the bevel body workpiece on the grinding machine relative to the grinding disc;
3) Constructing a relation between technological parameters and material removal efficiency in the grinding process of the novel optical element;
4) Guiding the forward process planning and the reverse process planning of the specific material specific removal process.
The invention is further improved in that step 1) a grinding removal model of the high-diameter-thickness-ratio thin-wall optical element is established, a kinematic model of the relative motion track of the workpiece-grinding machine is established for the planetary grinding machine, and the material removal rate under corresponding processing parameters is calculated by combining the material contact removal characteristics and the process parameter removal process theory.
The invention further improves that the specific implementation method of the step 1) is to consider the grinding surface of the thin-wall optical element with high aspect ratio as an inclined plane, and deduce that the surface of the element actually participating in grinding is a level plane changing with time according to the clamping mode during the grinding of the element.
The invention is further improved in that step 2) the motion trail of the bevel body workpiece on the grinder relative to the grinding disc is subjected to kinematic modeling, the relative motion speed of the workpiece and the grinder is obtained through coordinate transformation, and the calculation modeling of the bevel body level grinding relative motion trail is completed.
The invention is further improved in that the coordinate transformation is to transform the workpiece coordinate system into the grinder coordinate system, and points on the workpiece coordinate system have different value ranges according to grinding time in consideration of the inclined plane body level model of the workpiece in the grinding process.
The method is further improved in that the specific implementation method of the step 2) comprises the steps of establishing a coordinate system A for a grinding disc, establishing a coordinate system B for a workpiece, transforming the workpiece coordinate system B into the grinding disc coordinate system A through coordinate transformation, obtaining coordinates, namely motion tracks of any point on the workpiece relative to the grinding disc along with time, listing the value ranges of the motion tracks by combining a hierarchical material removal model, and deriving the time t to obtain the relative motion speed of the motion tracks.
The invention is further improved in that the step 3) considers the material contact removal characteristic and the process parameter removal process theory for the high-diameter-thickness ratio thin-wall optical element, and models and constructs a relation between the process parameter input and the material removal efficiency in the grinding process of the optical element.
The invention is further improved in that the specific implementation method of the step 3) is as follows:
(301) Modeling a material grinding and removing process in two aspects of macroscopic contact surface and microscopic grinding and removing, macroscopically, obtaining macroscopic actual contact area through a grinding inclined surface body model of a workpiece for solving the material removing thickness, microscopically, considering that the material removing rate is related to microscopic particles based on the acting force among particles, simultaneously considering that the contact of a grinding disc and an element is elastoplastic contact, and obtaining microscopic actual bonding area of the material by utilizing the contact characteristic of the grinding disc material of the workpiece for solving the number of abrasive particles with actual action;
(302) And taking the parameters of the relative motion speed v of the workpiece and the grinding disc, the particle diameter and concentration of the grinding liquid, the rotating speed of the grinding disc, the macroscopic and microscopic contact area and the like as input parameters, and solving by utilizing the volume relation of material removal and integrating the parameters to obtain an output parameter, namely the material removal rate.
The invention is further improved in that step 4) proposes to complete forward process planning and reverse process planning for a specific removal process for a specific material based on the established removal model, i.e. to accurately calculate the material removal efficiency and depth with process parameter inputs or to complete the reverse thrust of the process parameters with determined material removal efficiency and depth.
Compared with the prior art, the invention has at least the following beneficial technical effects:
the invention provides a method for removing and manufacturing a hierarchical material of an optical element with high aspect ratio and thin wall, which is used for modeling the grinding surface of the optical thin wall element with high aspect ratio after cutting processing, providing a grinding 'inclined plane body' model and modeling the hierarchical material removing distribution of the inclined plane body;
According to the method for removing and manufacturing the hierarchical material of the high-diameter-thickness-ratio thin-wall optical element, provided by the invention, the difficult problem of controlling the grinding processing technological parameters of the cut high-diameter-thickness-ratio thin-wall optical element is solved, and the accurate manufacturing of the high-diameter-thickness-ratio thin-wall optical element can be completed through technological parameter input based on the inclined plane body hierarchical material removing model and the relative motion track model.
Drawings
FIG. 1 is a schematic view of a polishing structure according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of an optical element polishing model according to an embodiment of the invention;
FIG. 3 is a calculation model of the removal of polishing material from an optical element according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of coordinate transformation of a workpiece and a grinding table according to an embodiment of the invention;
FIG. 5 is a graph showing experimental measurement of k9 glass in an embodiment of the invention;
fig. 6 is a graph c comparing theoretical and actual removal.
Detailed description of the preferred embodiments
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. It should be noted that, without conflict, the embodiments of the present invention and features of the embodiments may be combined with each other. The invention will be described in detail below with reference to the drawings in connection with embodiments.
The invention provides a method for removing and manufacturing a hierarchical material of a high-diameter-thickness-ratio thin-wall optical element, which comprises the following input parameters of grinding fluid concentrationAbrasive particle diameter D, abrasive disc rotation speed, inclination angle and diameter of the cutting face of the optical element, etc.
A method of hierarchical material removal fabrication of an high aspect ratio thin-walled optical element, comprising the steps of:
(1) And establishing a grinding model of the thin-wall optical element obtained after the cutting process, considering that the grinding processing part is an inclined plane body, the processing surface is an inclined plane, researching the rule of the change of the contact area of the element and the grinding disc along with the change of time, and simultaneously influencing the material removal rate by the changed contact area.
(2) A coordinate system a is established for the grinding disc, a coordinate system B is established for the workpiece, and the coordinates of points on both coordinate systems are functions of time. And (3) transforming the coordinates of a point P (x 2,y2) on the workpiece coordinate system B to a grinding disc coordinate system A, obtaining a coordinate P' (x 1,y1), namely a motion track of any point on the workpiece relative to the grinding disc along with time, and deriving a parameter time t in the coordinate to obtain a relative motion speed v of the two.
(3) The material mill removal process was modeled in terms of both macro-contact surface and micro-particle milling. The grinding 'inclined plane body' model of the workpiece is macroscopically proposed, the model considers that the cutting surface of the optical element obtained by cutting presents a certain inclined angle, the inclined height gradually decreases and the contact area of the workpiece and the grinding disc gradually increases along with the grinding process, and particularly referring to figure 1, the calculation is carried out microscopically based on the inter-particle acting force, the grinding particles are considered to be embedded into the surface of the workpiece and are ground for grinding process, the contact of the grinding disc and the element is considered to be elastoplastic contact, the actual microscopically rough contact surface is a, and the density correction coefficient of the workpiece and the grinding disc is added due to the influence of an oxide film。
(4) Calculating the material removal efficiency, wherein the input parameters include the contact area of the part grinding discAnd finally, calculating to obtain a material removal rate formula of the optical element on the grinder according to the volume removal principle of the grinding particles. Finally, a material removal rate solving formula of the specific optical element is provided:
Wherein D is the diameter of abrasive particles of the grinding fluid, Is the coefficient factor of the oxide film,Is the volume concentration of the grinding fluid,The depth of the abrasive particle embedded element is a microcosmic actual contact area when the number of abrasive particles of the contact surface is calculated,Is the theoretical contact area when calculating the material removal thickness.
Further, step (1) is to obtain a thin-wall optical element grinding surface removal model after the cutting process, and the overall modeling is shown in fig. 2. The model considers that the elements after cutting are mostly in the shape of inclined planes, and clamping is carried out on the elements by taking the axis as a reference in grinding, and the grinding process is from top to bottom, so that the grinding contact surface is gradually increased along with time;
Further, step (1) is performed on a contact area variation model of the component inclined surface in the grinding process, as shown in fig. 3. For any time t in the grinding process, the contact area of the element and the grinding disc can be regarded as a part of a whole circle, and the cross-sectional area can be obtained by the geometric relationship when the processed thickness h and the inclination angle alpha of the element surface are set Relation to the processed thickness h:
further, step (2) models the mill as shown in fig. 4. The modeling object is the space geometrical movement position of the workpiece and the millstone, a coordinate system A is established by the millstone, a coordinate system B is established by the workpiece, and the intermediate parameter, namely the relative movement speed v of the workpiece and the millstone, is obtained through calculation. Considering the bevel body level model of the workpiece in the grinding process, points on the workpiece coordinate system respectively have different value ranges along with the grinding time.
Establishing a coordinate system B for the workpiece, wherein the coordinates of points on the coordinate system are as follows
Wherein, the
Wherein, a coordinate system A is established for the grinding disc, and the (x 1,y1) in the coordinate system A is transformed into a coordinate system B, namely
Where s and b are the horizontal vertical distances of the workpiece center relative to the center of the abrasive disc, respectively, as shown in fig. 4. Therefore, the relative movement speed is
Further, regarding the material grinding and removing model, the step (2) takes the surface obtained by cutting the workpiece in the previous step as an initial grinding surface, and is used for researching the contact condition with the grinding disc, and the inclination angles of the inclined surfaces generated under different working conditions are different. The grinding model is used for calculating and obtaining accurate equation coefficients. Macroscopically, the surface obtained by the previous cutting processing of the workpiece is regarded as an inclined surface to be used as an initial grinding surface, and the actual contact area of the workpiece and the grinding disc can be obtained through modeling calculationThe actual contact area varies with time, and is also a function of the processed thickness h;
Further, the microscopic actual contact area a in the step (3) is calculated by adopting a rough surface contact theoretical model, combining the mechanical characteristics of materials to consider that the contact of the grinding disc and the element is elastoplastic, thereby correlating the actual contact area of the grinding disc and the element with the surface characteristics, wherein the material removal rate of single abrasive particles adopts a material embedding model, and the direct contact of the abrasive particles and the element is considered to be plastic, thereby obtaining the embedding area of the abrasive particles Wherein the calculation of the relative movement velocity v uses a coordinate transformation analysis, as described above, and wherein the equation coefficients affected by the density perform quantitative calculation of the characteristic material.
Integrating the previous formula to obtain a material removal rate expression:
Wherein D is the diameter of abrasive particles of the grinding fluid, Is the coefficient factor of the oxide film,Is the volume concentration of the grinding fluid,The depth of the abrasive particle embedded element is a microcosmic actual contact area when the number of abrasive particles of the contact surface is calculated,Is the theoretical contact area when calculating the material removal thickness.
Examples
In this embodiment, a method for removing and manufacturing a hierarchical material of a thin-walled optical element with a high aspect ratio uses the following equipment and materials:
corundum powder w20 grinding fluid concentration 10%, k9 glass optical element (diameter d=50 mm, thickness h=5 mm, cutting face inclination angle) =4.6 °), UNIPOL-1203 chemical mechanical polisher, three coordinate measuring machine.
Wherein the machining parameters are as follows, the grinding disc rotating speed is 100r/min, the workpiece rotating speed is 0, the pressure is 14N, and the position (s, b) of the workpiece coordinate system relative to the grinding disc coordinate system is approximately regarded as (75, 75).
The method for removing and manufacturing the hierarchical material of the high-diameter-thickness-ratio thin-wall optical element comprises the following steps of:
(1) Establishing a coordinate system B for the workpiece, wherein the coordinates of points on the coordinate system are as follows
Establishing a coordinate system A for a millstone of the UNIPOL-1203 chemical mechanical polishing machine, and transforming (x 1,y1) in the coordinate system A into a coordinate system B to obtain
Relative movement speed。
(2) When the grinding surface of the workpiece is regarded as an inclined surface, the actually processed cross-sectional area is
Analyzing the microscopic grinding of the abrasive particles, and taking out the proper oxide film coefficientThe former method is carried into the material removal rate:
(3) And carrying out experiments to measure material removal data, and calculating theoretical material removal data.
Two data are plotted as shown in figure 6. According to the graph, the method has certain accuracy in calculating the grinding removal quantity of the material with the specific height-diameter-thickness ratio, the error range is +/-0.005 mm, and certain reference effect and certain practical benefit are realized on parameter selection during practical grinding processing.
The foregoing description is only exemplary embodiments of the present invention, and is not intended to limit the scope of the present invention, and all equivalent structures or equivalent processes using the descriptions and the drawings of the present invention, or direct or indirect application in other related system fields are included in the scope of the present invention.
Claims (5)
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| CN102509712A (en) * | 2011-11-29 | 2012-06-20 | 中国科学院微电子研究所 | Determination Method of Dynamic Pressure Distribution and Grinding Removal Rate of Chemical Mechanical Polishing Slurry |
| CN102637238A (en) * | 2012-05-09 | 2012-08-15 | 中国科学院微电子研究所 | Calculation method for grinding removal rate of wafer surface |
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| US6736992B2 (en) * | 2000-04-11 | 2004-05-18 | Honeywell International Inc. | Chemical mechanical planarization of low dielectric constant materials |
| US7333875B2 (en) * | 2004-11-29 | 2008-02-19 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of predicting CMP removal rate for CMP process in a CMP process tool in order to determine a required polishing time |
| CN102794688B (en) * | 2012-08-10 | 2014-10-22 | 上海交通大学 | Reconstructing few-shaft ultra-precise large-size optical mirror grinding system |
| CN103831673B (en) * | 2014-02-20 | 2016-05-18 | 太原理工大学 | A kind of liquid-magnetic abrasive tool aperture polishing rapidoprint clearance computational methods |
| CN105150078B (en) * | 2015-08-09 | 2017-04-12 | 大连理工大学 | A non-damaging numerical control water-dissolving polishing method for removing micro-nano textures on the surface of KDP crystals |
| CN109909815B (en) * | 2019-03-28 | 2020-06-02 | 中国人民解放军国防科技大学 | Magnetorheological polishing compensation processing method, system and medium for optical complex curved surface element |
| CN110587484A (en) * | 2019-07-29 | 2019-12-20 | 苏州超徕精工科技有限公司 | Device and method for predicting removal effect in polishing process in real time |
| CN111660147B (en) * | 2020-06-28 | 2021-10-15 | 上海理工大学 | Optimization method of process parameters for tapered roller ball base surface grinding |
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| CN102509712A (en) * | 2011-11-29 | 2012-06-20 | 中国科学院微电子研究所 | Determination Method of Dynamic Pressure Distribution and Grinding Removal Rate of Chemical Mechanical Polishing Slurry |
| CN102637238A (en) * | 2012-05-09 | 2012-08-15 | 中国科学院微电子研究所 | Calculation method for grinding removal rate of wafer surface |
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