CN115815038B

CN115815038B - Coating jig with connecting parts

Info

Publication number: CN115815038B
Application number: CN202211385974.7A
Authority: CN
Inventors: 王蕾; 卢陆旺
Original assignee: Shenzhen Silicon Bionics Technology Co ltd
Current assignee: Shenzhen Silicon Bionics Technology Co ltd
Priority date: 2019-09-30
Filing date: 2019-09-30
Publication date: 2025-12-23
Anticipated expiration: 2039-09-30
Also published as: CN115815038A; CN115815037A; CN112571702A; CN112571702B; CN115815037B

Abstract

This disclosure provides a coating fixture, characterized by comprising: a loading section having a first loading surface and a bottom surface intersecting the first loading surface, wherein a plurality of positioning grooves for placing microelectrodes are arranged side-by-side on the first loading surface, the positioning grooves penetrating the bottom surface in a direction parallel to the first loading surface; and a cover plate that cooperates with the first loading surface of the loading section to fix the microelectrodes located in the positioning grooves, wherein the microelectrodes have exposed portions that do not contact the loading section and the cover plate. According to this disclosure, a coating fixture that can perform both batch coating and improve coating consistency can be provided.

Description

Jig for coating film with connecting part

The application relates to a patent application of a jig for coating film, which is divided into a patent application with the application number 2019109448957 and the application name of 2019, 9 and 30 days.

Technical Field

The present disclosure relates to a jig for coating a film.

Background

Common coating liquid-phase coating techniques are brush coating, dip-coating, spray coating, and the like. The dipping and pulling method is to dip the cleaned substrate into the prepared solution, then to pull the substrate out of the solution smoothly at a precisely controlled uniform speed, and to form a uniform liquid film on the surface of the substrate under the action of viscosity and gravity, wherein the solution adhered to the surface of the substrate is rapidly gelled to form a gel film along with rapid volatilization of the solvent. The dip-coating method is a common film preparation method, and can be used for coating uniform films on a base cloth substrate and a base film, and can be widely applied to sol-gel, solution and suspension film.

The dip-coating method has been widely used because of its higher coating quality than the brush coating method and its simple and inexpensive equipment as compared with the spray coating method. However, there are some problems in the mass production of coating films, such as large coating film differences among various articles to be coated, and uniformity of the coating film is difficult to be ensured.

Disclosure of Invention

The present disclosure has been made in view of the above-described conventional circumstances, and an object thereof is to provide a jig for coating a film, which can improve uniformity of the coating film while coating the film in a batch.

The jig for coating film is characterized by comprising a loading part and a cover plate, wherein the loading part is provided with a first loading surface and a bottom surface intersected with the first loading surface, a plurality of positioning grooves for placing microelectrodes are arranged on the first loading surface side by side, the positioning grooves penetrate through the bottom surface along the direction parallel to the first loading surface, and the cover plate is matched with the first loading surface of the loading part to fix the microelectrodes positioned in the positioning grooves, wherein the microelectrodes are provided with exposed parts which are not contacted with the loading part and the cover plate.

In the present disclosure, the first loading surface of the loading part of the jig for coating film has a plurality of positioning grooves for placing microelectrodes arranged side by side. In this case, the jig can simultaneously place a plurality of microelectrodes, and the positions of the microelectrodes fixed on the jig are consistent, so that the states of the microelectrodes before coating can be relatively consistent, and further, the consistency of coating is improved. In addition, the jig is provided with the cover plate matched with the first loading surface of the loading part, so that the microelectrode can be better fixed, and the quality of a coating film can be improved. Thus, a jig for coating film which can improve uniformity of coating film while coating film in a batch can be provided.

In addition, in the jig according to the present disclosure, optionally, the jig further includes a connection portion at which the loading portion is mounted. In this case, the fixture is advantageously mounted to the film coating machine by the connection portion later.

In the jig according to the present disclosure, the loading portion may be attached to the connecting portion by a fixing mechanism. In this case, the loading portion can be preferably attached to the connecting portion.

In addition, in the jig according to the present disclosure, the fixing mechanism may be a fastening structure or a screwing structure. In this case, the loading portion can be better fixed to the connecting portion.

In addition, in the jig according to the present disclosure, the cover plate may be engaged with the loading part by a screw fixing method or a magnetic attraction method. In this case, the cover plate can be well fitted to the loading portion, and thus the microelectrode positioned in the positioning groove can be well fixed.

In addition, in the jig according to the present disclosure, the jig may have a plurality of the loading portions having a plate shape. In this case, the plate-like loading portion facilitates fixation with the cover plate, and thus more microelectrodes can be better fixed in the jig.

In addition, in the jig according to the present disclosure, optionally, the loading portion further includes a second loading surface parallel to the first loading surface, the bottom surface connects the first loading surface and the second loading surface, and an edge of the cover plate does not exceed the bottom surface. Therefore, more microelectrodes can be fixed, interference to the microelectrodes in the coating process can be reduced, and the consistency of the coating of the microelectrodes is improved.

In addition, in the jig according to the present disclosure, optionally, the jig further includes a back plate that mates with the second loading surface of the loading portion, and an edge of the back plate does not exceed the bottom surface. In this case, the microelectrode placed in the second loading surface can be well fixed.

In addition, in the jig according to the present disclosure, the cover plate may have a protrusion portion that mates with the positioning groove. This makes it possible to fix the microelectrode more favorably.

In addition, in the jig according to the present disclosure, optionally, the cover plate and the back plate have the same structure. This makes it possible to fix more microelectrodes better.

According to the present disclosure, a jig for coating film that can improve uniformity of coating film while coating film in batch can be provided.

Drawings

Fig. 1 shows a flow diagram of a method of coating a microelectrode surface according to an example of the present disclosure.

Fig. 2 illustrates a perspective view of an immersion lift coater according to an example of the present disclosure.

Fig. 3 shows a schematic diagram of an impregnation pull process involved in an example of the present disclosure.

Fig. 4 shows a perspective view of a jig according to an example of the present disclosure.

Fig. 5 illustrates a partial schematic view of a jig related to another example of the present disclosure.

Detailed Description

Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In the following description, the same members are denoted by the same reference numerals, and overlapping description thereof is omitted. In addition, the drawings are schematic, and the ratio of the sizes of the components to each other, the shapes of the components, and the like may be different from actual ones.

Fig. 1 shows a flow diagram of a method of coating a microelectrode surface according to an example of the present disclosure. Fig. 3 shows a schematic diagram of an impregnation pull process involved in an example of the present disclosure.

As shown in fig. 1, a method for coating a surface of a microelectrode according to the present embodiment may include preparing the microelectrode to be coated (step S10), fixing the microelectrode (step S20), preparing a film solution and a crosslinking agent, mixing to obtain a pulling liquid, the viscosity of which may be 0.1 to 20cP (step S30), immersing and pulling the microelectrode from the pulling liquid under an atmosphere having the same gas composition as the solvent of the film solution in a predetermined procedure (step S40), and curing the microelectrode in a vacuum atmosphere (step S50).

In the method for coating a surface of a microelectrode according to the present embodiment, the microelectrode is fixed, a film solution having a proper concentration is prepared and uniformly mixed with a proper amount of a crosslinking agent to obtain a drawing liquid having a viscosity of 0.1 to 20cP, and then the microelectrode is immersed and drawn, and in the immersion and drawing process, the drawing liquid is protected by an atmosphere, and the components of the atmosphere are the same as the solvent of the film solution, in which case, the increase in the concentration of the film solution due to the volatilization of the solvent can be suppressed by the atmosphere protection, so that the change in the viscosity of the drawing liquid can be reduced, and the sagging effect can be reduced, and therefore, the uniformity and uniformity of the coating thickness of the film on the surface of the microelectrode can be improved, and therefore, the film on the microelectrode surface can be made good in uniformity, uniform in thickness, and flat in appearance.

In this embodiment, the microelectrode may be coated on its surface by dip-coating. As shown in fig. 3, the dipping and pulling process may be to dip the piece to be coated into a solution, and then pull out the piece to be coated from the solution, wherein the solution attached to the surface of the piece to be coated is formed into a film under the action of viscosity and gravity and accompanied by volatilization of the solvent.

In the present embodiment, a microelectrode to be coated may be prepared in step S10. In addition, in some examples, in step S10, the prepared microelectrode to be coated may be cleaned. In other examples, in step (a), the microelectrode may be rinsed with ethanol for 1 to 10 minutes followed by deionized water for 1 to 10 minutes. Thus, the foreign matter on the surface of the microelectrode can be removed, which is beneficial to forming a flat film. For example, the microelectrode may be rinsed with ethanol for 1min and then with deionized water for 5min.

In some examples, the microelectrodes may be rinsed with ethanol for 5 minutes and then deionized water for 1 minute. In other examples, the microelectrodes may be washed with ethanol for 10 minutes, with deionized water for 10 minutes, and so forth.

In addition, in the present embodiment, the roughness of the surface of the microelectrode in step S10 may be 0.01 μm to 10. Mu.m. This can facilitate the formation of a thin film on the surface of the microelectrode by the pulling liquid.

In some examples, the roughness of the microelectrode surface may be 0.01 μm. In other examples, the roughness of the microelectrode surface may be 10 μm. In addition, in some examples, the roughness of the microelectrode surface may be 0.05 μm, 0.1 μm, 0.5 μm, 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, or 8 μm.

In the present embodiment, the material of the microelectrode is not particularly limited, and may be selected according to actual requirements. In some examples, the microelectrodes may be made of biosafety materials. Thereby, it is possible to implant or act on the human body.

In some examples, the microelectrodes may be made of metallic materials. Additionally, in some examples, the microelectrodes may be made of at least one of platinum, nickel, cobalt, titanium, tantalum, niobium, zirconium. For example, the microelectrode may be made of metallic platinum, metallic niobium or nickel cobalt alloy, etc.

In the present embodiment, the shape of the microelectrode is not particularly limited, and may be selected according to actual requirements. For example, the microelectrodes may be needle-like, lamellar, or the like.

In some examples, the microelectrodes may be connected to pads. Additionally, in some examples, the pads may be circular or polygonal. In other examples, the microelectrodes and the bond pads may not be uniform in size. For example, the bonding pads may be wider than the microelectrodes. In addition, the microelectrode and the bonding pad can be integrally formed. In some examples, the microelectrodes may be electrode sheets with bond pads attached. In other examples, the microelectrodes may include pads.

In some examples, the microelectrode has an exposed portion that is not in contact with the loading portion 10 and the cover plate 20. In other examples, the exposed portion of the microelectrode may be the portion of the microelectrode where the coating is applied.

In the present embodiment, the microelectrode is fixed in step S20. Specifically, the microelectrode obtained in step S10 may be assembled and fixed to the jig 1 for coating film, and then the coating film to be applied may be obtained.

Hereinafter, the jig 1 used in step 20 according to the present embodiment will be described in detail with reference to the drawings.

Fig. 2 shows a perspective view of the dip-pull coating machine 2 according to an example of the present disclosure. Fig. 4 shows a perspective view of the jig 1 according to the example of the present disclosure, in which fig. 4 (a) shows a perspective view of the jig 1 according to the example of the present disclosure, fig. 4 (b) shows a structural view of the connection part 30 according to the example of the present disclosure, fig. 4 (c) shows a structural view of the loading part 10 according to the example of the present disclosure, and fig. 4 (d) shows a structural view of the cover plate 20 according to the example of the present disclosure.

In the present embodiment, as shown in fig. 4, a jig 1 for coating film (hereinafter, sometimes referred to as "jig 1") may include a loading portion 10 and a cover plate 20. In some examples, the loading portion 10 has a first loading surface 11 and a bottom surface (not shown) intersecting the first loading surface 11. A plurality of positioning grooves 111 for fixing microelectrodes are provided in parallel on the first loading surface 11, and the positioning grooves 111 penetrate the bottom surface in a direction parallel to the first loading surface 11. In addition, in some examples, the cover plate 20 cooperates with the first loading surface 11 of the loading portion 10 to secure the microelectrode positioned in the positioning slot 111.

In the jig 1 for coating film according to the present embodiment, the first loading surface 11 of the loading unit 10 has a plurality of positioning grooves 111 for placing microelectrodes in parallel. In this case, the jig 1 can simultaneously place a plurality of microelectrodes, and the positions of the microelectrodes fixed on the jig 1 are consistent, so that the state before coating the microelectrodes can be relatively consistent, and the consistency of coating is improved. In addition, in some examples, the jig 1 has a cover plate 20 that mates with the first loading surface 11 of the loading portion 10. In this case, the microelectrode can be fixed more favorably, and the quality of the coating film can be improved, whereby the jig 1 for coating film can be provided which can improve both the uniformity of the coating film and the mass coating film.

In addition, in some examples, the jig 1 may further include a connection part 30. In addition, an end of the loading part 10 remote from the positioning groove 111 may be engaged with the connection part 30. In this case, the jig 1 can be attached to the coating machine via the connection portion 30, and thus the coating machine can control the jig 1 to perform coating. In addition, the bottom surface of the loading portion 10 is away from the connecting portion 30.

In addition, in some examples, as shown in fig. 4 (b), the connection portion 30 may be a combined structure. In this case, the connection portion 30 can connect both the coating machine and the mounting portion 10 (described later in detail). In addition, in some examples, the connection 30 may be composed of flat plates. This can facilitate connection between the connection portion 30 and the coating machine. For example, in some examples, the connection 30 may be formed by combining a first plate 31 and a second plate 32.

In addition, in some examples, as shown in fig. 4 (b), the first plate 31 may have a first type fixing hole 311, and the second plate 32 may be fitted with the first type fixing hole 311. In some examples, the first plate 31 and the second plate 32 may be fixed with screws. In other examples, the connection 30 may be formed by combining a flat plate with a cylinder. Additionally, in some examples, the connection 30 may be integrally formed.

In some examples, the first plate 31 may have a plurality of first-type fixing holes 311. In addition, in some examples, the first plate 31 may have 2 to 10 first-type fixing holes 311. For example, the first plate 31 may have 2, 3, 4, 5, 6, 7, 8, 9, or 10 first-type fixing holes 311. In other examples, the plurality of first-type fixing holes 311 may be located on the same horizontal line.

In addition, in some examples, as shown in fig. 4 (b), the connection part 30 may have a groove 321 that mates with the loading part 10. In some examples, the connecting portion 30 may have a plurality of grooves 321 that mate with the loading portion 10. For example, the connection part 30 may have 2 to 8 grooves 321 to be engaged with the loading part 10. In addition, in some examples, the connection 30 may have 1, 2, 3, 4, 5, 6, 7, or 8 grooves 321.

In addition, in some examples, the groove 321 may have a second type fixing hole 322 therein for fixing the loading part 10, and the loading part 10 may be engaged with the second type fixing hole 322.

In some examples, the groove 321 may have a plurality of second-type fixation holes 322. In addition, in some examples, the groove 321 may have 2 to 10 second-type fixing holes 322. For example, the groove 321 may have 2, 3, 4, 5, 6,7,8, 9, or 10 second-type fixing holes 322. In other examples, the plurality of second-type fixing holes 322 may be located on the same horizontal line.

In addition, in some examples, the loading portion 10 may be mounted to the connection portion 30 by a fixing mechanism. In this case, the loading unit 10 can be mounted to the connecting unit 30 with good performance. Additionally, in some examples, the securing mechanism may be a snap-fit or a screw-fit structure. In this case, the loading portion 10 can be better fixed to the connecting portion 30. For example, in some examples, the loading portion 10 may be mounted to the connection portion 30 using screws. In other examples, the loading portion 10 may be mounted to the connecting portion 30 by a snap-fit structure.

In addition, in some examples, the connection portion 30 may be fixed to the coating machine using a screw fixing manner, a snap-fit manner, or a magnetic attraction manner. In this case, the jig 1 for coating can be fixed to a coating machine, so that the microelectrode can be coated well by the coating machine. Additionally, in some examples, the coating machine may be an dip-pull coater 2 (see fig. 2). In some examples, the connection 30 may be secured to the dip-coating machine 2 using a screw-fastening. In other examples, the connection 30 may be magnetically secured to the dip-coating machine 2.

In addition, in some examples, as shown in fig. 4, the jig 1 may have a plurality of loading portions 10 in a plate shape. In this case, the plate-like loading portion 10 facilitates fixation with the cover plate 20, and thus, more microelectrodes can be well fixed in the jig 1. In some examples, jig 1 may have 2 to 12 loading portions 10. For example, the jig 1 may have 2, 4, 5, 6, 8, 10, or 12 loading parts 10. In other examples, the jig 1 may also have only 1 loading portion 10.

In some examples, the loading portion 10 may have a first loading surface 11. In addition, in some examples, the loading portion 10 may also have a bottom surface intersecting the first loading surface 11.

In some examples, as shown in fig. 4 (c), the loading part 10 may have a positioning groove 111. In addition, in some examples, the loading part 10 may be provided with a plurality of positioning grooves 111. As shown in fig. 4 (c), the first loading surface 11 may be provided with a plurality of positioning grooves 111. In other examples, a plurality of detents 111 may be provided side-by-side on the first loading surface 11.

In some examples, the positioning slots 111 may be used to secure microelectrodes. Additionally, in some examples, microelectrodes may be placed within positioning slots 111. In other examples, pads that may be connected to microelectrodes are placed within the positioning slots 111. Thus, the microelectrode can be fixed by the fixing pad.

In some examples, one loading portion 10 may have 2,4, 6, 8, 10, 12, 14, 16, 18, 20, 22, or 24 detents 111. In other examples, one loading part 10 may have 1 positioning groove 111.

In some examples, as shown in fig. 4 (c), the positioning groove 111 may penetrate the bottom surface in a direction parallel to the first loading surface 11. Additionally, in some examples, the shape of the positioning groove 111 may match the shape of the microelectrode. In other examples, the portion of the detent 111 proximate to the bottom surface may be larger than the portion distal from the bottom surface.

In addition, in some examples, the shape and depth of the positioning groove 111 may be substantially the same as the contact portions of the microelectrode with the cover plate 20 and the loading portion 10. This can facilitate fixation of the microelectrode. In other examples, the shape and depth of the positioning groove 111 may be slightly larger than the contact portions of the microelectrode with the cover plate 20 and the loading portion 10. In some examples, the orientation of the detent 111 may be a direction perpendicular to the bottom surface.

In addition, in some examples, the loading portion 10 further includes a second loading surface (not shown) parallel to the first loading surface 11, and the bottom surface connects the first loading surface 11 and the second loading surface, and an edge of the cover plate 20 (described in detail later) does not exceed the bottom surface. Therefore, more microelectrodes can be fixed, interference to the microelectrodes in the coating process can be reduced, and the consistency of the coating of the microelectrodes is improved. In some examples, an edge of the cover plate 20 may be aligned with the bottom surface.

In addition, in some examples, the second loading surface is provided with a plurality of positioning grooves 111 for placing microelectrodes side by side, like the first loading surface 11. For example, in some examples, the first loading surface 11 of the loading portion 10 may have 1,2, 4, 6, 8,10, 12, 14, or 16 detents 111, and the second loading surface of the loading portion 10 may have the same 1,2, 4, 6, 8,10, 12, 14, or 16 detents 111.

In addition, in some examples, the first loading surface 11 of the loading part 10 may have a positioning groove 111, and the second loading surface of the loading part 10 may not have a positioning groove 111. For example, the first loading surface 11 of the loading portion 10 may have 1,3,5, 7, 9, 11, 13, 15, or 16 positioning grooves 111, and the second loading surface of the loading portion 10 may have no positioning groove 111.

In addition, in some examples, the second loading surface of the loading part 10 may have a positioning groove 111, and the first loading surface 11 of the loading part 10 may not have a positioning groove 111. For example, the second loading surface of the loading part 10 may have 1,3, 5, 7, 9, 11, 13, 15 or 16 positioning grooves 111, and the first loading surface 11 of the loading part 10 may have no positioning groove 111.

In addition, in some examples, the jig 1 may further include a back plate 40 that mates with the second loading surface of the loading part 10, and an edge of the back plate 40 does not exceed the bottom surface. In this case, the microelectrode placed in the second loading surface can be well fixed. In some examples, the edges of the back plate 40 may be aligned with the bottom surface. In addition, in some examples, the cover plate 20 may have the same structure as the back plate 40. This makes it possible to fix more microelectrodes better.

In addition, in some examples, as shown in fig. 4 (c) and 4 (d), the loading part 10 may have a third type of fixing hole 12, and the cover plate 20 (described later in detail) may have a fourth type of fixing hole 21 to be matched with the third type of fixing hole 12. Thereby, the cover plate 20 can be fixed to the loading unit 10.

In some examples, the loading portion 10 may have a plurality of third-type securing holes 12. In addition, in some examples, the loading part 10 may have 2 to 10 third-type fixing holes 12. For example, the loading part 10 may have 2, 3, 4, 5,6,7, 8, 9 or 10 third type fixing holes 12. In other examples, the plurality of third-type fixation holes 12 may be located on the same or different horizontal lines.

In some examples, the cover plate 20 may have a plurality of fourth-type fixing holes 21. In addition, in some examples, the cover plate 20 may have 2 to 10 fourth-type fixing holes 21. For example, the cover plate 20 may have 2,3, 4, 5, 6, 7, 8, 9, or 10 fourth type fixing holes 21. In other examples, the plurality of fourth-type fixing holes 21 may be located on the same or different horizontal lines.

In some examples, the cover plate 20 may cooperate with the loading portion 10. In other words, the third type of fixing holes 12 may be matched with the fourth type of fixing holes 21. Thereby, the cover plate 20 can be fixed to the loading portion 10. Additionally, in some examples, the cover plate 20 may be mated with the loading portion 10 using a screw fixation or a magnetic attraction. In this case, the cover plate 20 can be favorably engaged with the loading portion 10, and thus the microelectrode positioned in the positioning groove 111 can be favorably fixed. In other examples, the cover plate 20 may be mated with the loading portion 10 using a snap-fit structure.

In some examples, the cover plate 20 may be mated with the loading portion 10 using a screw fixation. For example, the loading part 10 and the cover plate 20 may be fastened by screws through the third and fourth kinds of fixing holes 12 and 21. In other examples, the cover plate 20 may magnetically engage the loading portion 10. For example, the loading unit 10 and the cover plate 20 may be fixed by a magnet through the third type fixing hole 12 and the fourth type fixing hole 21.

In addition, in some examples, the cover plate 20 may cooperate with the first loading surface 11 of the loading portion 10 to secure the microelectrode located in the positioning slot 111. In some examples, the cover plate 20 may have a mating surface 22 that mates with the first loading surface 11.

In addition, in some examples, the cover plate 20 may have a protrusion 221 that mates with the positioning groove 111. This makes it possible to fix the microelectrode more favorably. In some examples, the protrusion 221 may be provided on the abutment surface 22 of the cover plate 20.

Additionally, in some examples, the protrusion 221 may be a flexible substance. In this case, when the cover 20 is engaged with the positioning groove 111, the protrusion 221 can be adaptively deformed, thereby enabling the microelectrode to be fixed more securely. For example, in some examples, the protrusion 221 may be an adhesive tape.

In addition, in some examples, the flexible substance may be composed of at least one selected from the group consisting of silica gel, rubber, parylene, polyimide, polytetrafluoroethylene, and polyvinyl alcohol. This can further fix the microelectrode. For example, in some examples, the flexible substance may be a silicone gel. In other examples, the flexible substance may be polyimide. Additionally, in still other examples, the flexible substance may be polyvinyl alcohol.

In addition, in some examples, as shown in fig. 4 (d), the protrusion 221 of the cover 20 that mates with the positioning groove 111 may be continuous, for example, the cover 20 may have a piece of adhesive tape that mates with the positioning groove 111. In other examples, the protrusions 221 on the cover plate 20 that mate with the positioning grooves 111 may be discontinuous, e.g., the cover plate 20 may have a pad of silicone rubber only in the locations corresponding to the positioning grooves 111.

In addition, in some examples, the fixture 1 may not include the connection portion 30, and the loading portion 10 may be directly fixed to the dip-coating machine 2 by magnetic attraction.

Fig. 5 shows a partial schematic view of a jig 1 according to another example of the present disclosure. Fig. 5 (a) shows a schematic structural view of a loading portion 10A according to another example of the present disclosure, and fig. 5 (b) shows a schematic structural view of a cover plate 20A according to another example of the present disclosure.

In other examples, as shown in fig. 5, the jig 1 may include a loading portion 10A and a cover plate 20A. In some examples, the jig 1 may include a loading portion 10A without the positioning groove 111 and a cover plate 20A without the protrusion 221. In addition, in some examples, the cover plate 20A and the loading part 10A may be fixed using a magnetic attraction manner or a screw fixing manner.

In some examples, as shown in fig. 5 (a), the loading portion 10A may include a first type of limiting hole 13. Additionally, in some examples, as shown in fig. 5 (b), the cover plate 20A may include a second type of limiting aperture 23.

In some examples, the loading portion 10A may include a plurality of first-type limiting holes 13, and the cover plate 20A may include a plurality of second-type limiting holes 23. Additionally, in some examples, the first type of limiting aperture 13 may mate with the second type of limiting aperture 23. This can be used for assisting in fixing the microelectrode.

In some examples, the microelectrodes may have through holes that mate with the first type of limiting holes 13 and the second type of limiting holes 23. In other examples, the microelectrode may have a plurality of through holes. I.e. each microelectrode may have a plurality of through holes.

In some examples, the microelectrode may have 2 to 5 through holes. For example, the microelectrode may have 2, 3, 4 or 5 through holes. In addition, in some examples, the microelectrode may have 1 through hole.

In other examples, the pads may have through holes that mate with the first type of limiting holes 13 and the second type of limiting holes 23. In this case, if the bonding pad is placed in the positioning groove 111, the bonding pad can be engaged with the first type limiting hole 13 and the second type limiting hole 23 to fix the bonding pad, thereby fixing the microelectrode. Additionally, in some examples, the pad may have a plurality of vias. I.e. each pad may have a plurality of vias.

In other examples, the pad may have 2 to 5 vias. For example, the pad may have 2, 3, 4, or 5 vias. Additionally, in some examples, the pad may have 1 via.

In some examples, the jig 1 may include a plurality of limit posts (not shown). In other examples, the spacing posts may be cylindrical or prismatic. In addition, the diameter of the limiting post may be slightly smaller than the diameters of the first type limiting hole 13 and the second type limiting hole 23.

In some examples, the spacing posts may extend through the first type of spacing holes 13, the second type of spacing holes 23, and the through holes. In addition, in some examples, the microelectrode may be mounted on the jig 1 through the first-type limiting holes 13, the second-type limiting holes 23, the through holes and the limiting posts.

In some examples, each of the stopper posts may extend through both the first type stopper hole 13 and the second type stopper hole 23 to secure the microelectrode. In other examples, each of the stopper posts may pass through only a portion of the first-type stopper hole 13 and a portion of the second-type stopper hole 23 to fix the microelectrode.

In addition, in some examples, the jig 1 may further have a pressing plate (not shown). In addition, the pressing plate may have the same structure as the cover plate 20A. For example, the platen may have a third type of limiting aperture (not shown) that mates with the first type of limiting aperture 13. In addition, the pressing plate may be engaged with the second surface of the loading part 10A.

In some examples, each of the spacing posts may simultaneously extend through the first, second, and third types of spacing holes 13, 23, to secure two microelectrodes. In other examples, each of the stopper posts may extend through the first type of stopper hole 13 and into the second type of stopper hole 23 and the third type of stopper hole to secure two microelectrodes.

In addition, in some examples, in the first type of limiting hole 13, the second type of limiting hole 23 and the third type of limiting hole which are matched, one limiting column penetrates through the first type of limiting hole 13 and extends into the second type of limiting hole 23 to fix the microelectrode, and the other limiting column penetrates through the first type of limiting hole 13 and extends into the third type of limiting hole to fix the other microelectrode.

In addition, in some examples, the jig 1 can fix 1 to 200 microelectrodes. In this case, it is possible to facilitate subsequent simultaneous batch coating of a plurality of microelectrodes, and to make the pre-coating state of the microelectrodes relatively uniform within a batch and between batches, thereby making it possible to make the uniformity of films formed by the microelectrodes within a batch and between batches good.

In the present embodiment, in step S20, each microelectrode may be fixed at a substantially uniform position in the jig 1. In this case, the uniformity of the clamping before coating of each microelectrode can be improved, and the state of each coating of each microelectrode can be made uniform.

In some examples, a film solution may be prepared in step S30. Specifically, in step S30, a membrane solution may be prepared by dissolving a solute in a solvent. In addition, the concentration of the membrane solution may be 1mg/ml to 150mg/ml. Thus, a film solution having a proper viscosity can be selected as needed.

In some examples, the concentration of the membrane solution may be 64mg/ml. In other examples, the concentration of the membrane solution may be 150mg/ml. Additionally, in some examples, the concentration of the membrane solution may be 1mg/ml, 5mg/ml, 10mg/ml, 20mg/ml, 40mg/ml, 60mg/ml, 70mg/ml, 80mg/ml, 100mg/ml, 120mg/ml, or 140mg/ml.

In the present embodiment, in step S30, the solute of the membrane solution may be at least one selected from the group consisting of poly 4-vinylpyridine (P4 VP), poly 4-vinylpyridine-SO ₃(P4VP-SO₃), polyvinylpyrrolidone (PVP), polyurethane (PU), polypropylene (PP), polyethylene oxide (PEO), polyvinyl alcohol (PVA), polyacrylate (PEA), and polyacrylic acid (PAA). In this case, the membrane solution can have one or more different solutes, whereby the different solutes can be selected as desired.

In some examples, the solute of the membrane solution may be poly 4-vinylpyridine-SO ₃. In other examples, the solute of the membrane solution may be polyethylene oxide. Additionally, in still other examples, the solute of the membrane solution may be polyvinylpyrrolidone.

In the present embodiment, in step S30, the solvent may be selected from ethanol and water, and thus, the solute can be well dissolved to form a membrane solution. In addition, since the solvent is volatile, the generation of atmosphere protection can be facilitated, and the drying of the film can be facilitated. For example, in some examples, the solvent may be ethanol. In other examples, the solvent may be tetrahydrofuran. Additionally, in some examples, the solvent may be a mixture of ethanol and water.

In the present embodiment, the crosslinking agent may be mixed with the film solution to obtain the pulling liquid in step S30. Specifically, in step S30, the pulling liquid may be formed by mixing by adding a crosslinking agent to the prepared film solution. In addition, the viscosity of the pulling liquid may be 0.1 to 20cP. Thus, a thin film can be formed on the surface of the microelectrode.

In some examples, the viscosity of the draw solution may be 0.1cP. In other examples, the viscosity of the draw solution may be 20cP. Additionally, in some examples, the viscosity of the draw solution may be 0.2cP, 0.5cP, 1cP, 2cP, 5cP, 8cP, 10cP, 12cP, 15cP, or 18cP.

In addition, in some examples, in step S30, the component of the crosslinking agent may be selected from at least one of polyethylene glycol dimethyl ether, polyethylene glycol, boric acid, adipic acid dihydrazide, polyacrylamide, polyisocyanate. Thus, the tensile strength, water resistance and viscosity of the film can be improved. For example, in some examples, the component of the crosslinker may be polyethylene glycol dimethyl ether. In other examples, the crosslinker component may be adipic acid dihydrazide. Additionally, in still other examples, the component of the crosslinker may be polyethylene glycol.

In the present embodiment, the amount of the crosslinking agent added to the pulling liquid in step S30 may be 1mg/ml to 25mg/ml. Therefore, the tensile strength and the water resistance of the film can be improved, and the pulling liquid with proper viscosity can be formed. For example, in some examples, the crosslinker may be added in an amount of 6mg/ml. In other examples, the crosslinker may be added in an amount of 25mg/ml. In addition, in still other examples, the crosslinker may be added in an amount of 1mg/ml, 2mg/ml, 5mg/ml, 7mg/ml, 10mg/ml, 12mg/ml, 15mg/ml, 20mg/ml, or 22mg/ml.

Additionally, in some examples, the crosslinker may be solid. In other examples, the crosslinker may be a crosslinker solution. In some examples, the solvent of the crosslinker solution may be the same as the solvent of the film solution.

In some examples, in step S40, the microelectrode may be dip-pulled under atmosphere protection. In addition, in some examples, in step S40, the microelectrode may be immersed in and pulled out of the pulling liquid in a predetermined procedure under the protection of atmosphere.

In addition, in some examples, in step S40, the predetermined procedure may include a step of immersing the microelectrode in the pulling liquid at an immersion rate of 2 to 8mm/S for 1 to 60S, followed by pulling the microelectrode out of the pulling liquid at a pulling rate of 2 to 8 mm/S. Thus, a thin film having a certain thickness can be formed on the surface of the microelectrode.

In some examples, the immersion rate, the pull rate, and the immersion time may affect the film thickness. In addition, in some examples, the appropriate immersion rate, pull rate, and immersion time may be selected according to actual requirements.

In some examples, the predetermined procedure may include immersing the microelectrode in the draw solution at an immersion rate of 6mm/s for 5 seconds, followed by extraction from the draw solution at a draw rate of 6 mm/s.

In some examples, the parameters of the pulling step may be a descent rate of 4mm/s, a pulling rate of 4mm/s, a dipping time of 8s. In addition, in some examples, the parameters of the pulling step may be a descent rate of 5mm/s, a pulling rate of 5mm/s, a dipping time of 12s. In other examples, the parameters of the pulling step may be a descent rate of 7mm/s, a pulling rate of 7mm/s, a dipping time of 15s.

In some examples, in step S40, the predetermined procedure may further include repeating the pulling step at least 1 time. Therefore, a multi-layer film can be formed, so that the surface of the microelectrode is smoother, and the performance is more stable. In addition, in some examples, when the number of repetitions is greater than 5, the pull rate in the pull step may be reduced from the 6 th time. In this case, since the uniformity of the coating film decreases as the pull rate increases, the film formed on the surface of the microelectrode can be made more uniform by decreasing the pull rate on the basis of the multilayer film, i.e., the uniformity of the film on the microelectrode can be improved.

In some examples, in the predetermined procedure, repeating the pulling step 1 to 30 times may be included. For example, the pulling step may be repeated 1, 5, 6, 8, 10, 12, 15, 20, 25, 30, etc. In some examples, the number of repetitions may be selected based on the desired thickness of the microelectrode surface.

In some examples, the microelectrode may be immersed in the pulling liquid at an immersion rate of 6mm/s for 5 seconds and then pulled out of the pulling liquid at a pulling rate of 6mm/s when the 1 st to 5 th pulling steps are repeated, and the microelectrode may be immersed in the pulling liquid at an immersion rate of 6mm/s for 5 seconds and then pulled out of the pulling liquid at a pulling rate of 3mm/s when the 6 th to 10 th pulling steps are repeated.

In some examples, the microelectrode may be immersed in the pulling liquid at an immersion rate of 8mm/s for 4s and then pulled out of the pulling liquid at a pulling rate of 6mm/s when the 1 st to 5 th pulling steps are repeated, and the microelectrode may be immersed in the pulling liquid at an immersion rate of 6mm/s for 4s and then pulled out of the pulling liquid at a pulling rate of 2mm/s when the 6 th to 15 th pulling steps are repeated.

In some examples, the parameters of the pulling step may also be adjusted according to actual requirements since the 6 th time when the number of repetitions is greater than 5 times. For example, the immersion rate may be increased, the immersion time may be prolonged, and the like.

In addition, in some examples, in step S40, the predetermined procedure may be performed by the dip-pull coater 2. This enables the dip-coating to be performed well. In addition, in some examples, the dip-pull coater 2 may have equipment that creates an atmosphere protection. This allows step S40 to be performed under atmosphere protection. For example, in some examples, the dip-pull coater 2 may have a cavity that may be hermetically closed for dip-pulling.

In addition, in some examples, in step S40, fixing the to-be-coated film package in the dip-coating machine 2 may be included. In this case, the batch of microelectrodes can be better dip-pulled.

In addition, in some examples, in step S40, the dip-coating solution prepared in step S30 may be placed in a sealable dip-coating chamber of the dip-coating machine 2. In addition, in some examples, the pulling liquid may be contained in only one container in the dip-coating machine 2, in which case all the microelectrodes fixed in the jig 1 may be dip-pulled in the pulling liquid in one container. In other examples, the drawing liquid may be contained only in a plurality of containers in the dip-draw coater 2, in which case each row (column) of microelectrodes fixed in the jig 1 may be dip-drawn in the drawing liquid in one container, or each microelectrode fixed in the jig 1 may be dip-drawn in the drawing liquid in a corresponding one of the containers.

In addition, in some examples, in step S40, the composition of the gas in the atmosphere protection may be the same as the solvent of the film solution. In this case, the increase in concentration of the film solution due to the volatilization of the solvent can be suppressed, that is, the change in concentration of the pulling liquid can be reduced in the dip-pulling process. For example, in some examples, the solvent may be ethanol and the composition of the atmosphere may be ethanol.

In addition, in the present embodiment, in step S40, the saturation of the gas may be 90% to 100%. In this case, the gas can effectively suppress volatilization of the solution, and thus the concentration of the pulling liquid can be maintained during the dip-pulling.

In addition, in some examples, preferably the atmosphere may have a saturation of 90%, more preferably the atmosphere may have a saturation of 95%, more preferably the atmosphere may have a saturation of 96%, more preferably the atmosphere may have a saturation of 97%, more preferably the atmosphere may have a saturation of 98%, more preferably the atmosphere may have a saturation of 99%, more preferably the atmosphere may have a saturation of 99.5%, more preferably the atmosphere may have a saturation of 99.8%, more preferably the atmosphere may have a saturation of 99.9%, and most preferably the atmosphere may have a saturation of 100%.

In this embodiment, the microelectrode may be cured in a vacuum environment in step S50. This makes it possible to make the film less susceptible to contamination. In addition, in some examples, in step S50, the microelectrode may be cured in a vacuum environment for 20 to 30 hours. This can better coagulate the thin film on the microelectrode surface.

In some examples, the microelectrodes may be cured in a vacuum environment for 24 hours. In other examples, the microelectrodes may be cured in a vacuum environment for 22 hours. Additionally, in still other examples, the microelectrodes may be placed in a vacuum environment for curing for 26 hours. Additionally, in some examples, the vacuum environment may be a vacuum box, a vacuum chamber, or the like.

In addition, in the present embodiment, the thickness of the thin film after the completion of the coating of the surface of the microelectrode may be 50nm to 50. Mu.m. For example, in some examples, the film thickness after the microelectrode surface coating is complete may be 50 μm. In other examples, the thickness of the film after coating the surface of the microelectrode may be 50nm. In addition, in still other examples, the thickness of the film after the microelectrode surface coating may be 100nm, 500nm, 800nm, 1 μm, 2 μm, 5 μm, 10 μm, 20 μm, 30 μm, 40 μm, or 45 μm.

While the disclosure has been described in detail in connection with the drawings and embodiments, it should be understood that the foregoing description is not intended to limit the disclosure in any way. Modifications and variations of the present disclosure may be made as desired by those skilled in the art without departing from the true spirit and scope of the disclosure, and such modifications and variations fall within the scope of the disclosure.

Claims

1. A coating fixture having a connecting portion, characterized in that:

include:

The loading section has a first loading surface and a bottom surface intersecting the first loading surface, and a plurality of positioning grooves arranged side by side on the first loading surface for placing microelectrodes, the positioning grooves penetrating the bottom surface in a direction parallel to the first loading surface;

A cover plate that mates with the first loading surface of the loading section to fix the microelectrode located in the positioning groove, the cover plate having a protrusion that mates with the positioning groove; and

A connecting part, which mates with the end of the loading part away from the positioning groove and is used to fix the loading part and connect the coating machine.

The microelectrode has an exposed portion that does not contact the loading part and the cover plate.

2. The fixture as described in claim 1, characterized in that:

The connecting part includes a first plate and a second plate. The first plate has a first type of fixing hole, and the second plate cooperates with the first type of fixing hole.

3. The fixture as described in claim 1, characterized in that:

The connecting part has a groove that mates with the loading part, and the groove has a second type of fixing hole for fixing the loading part, and the loading part mates with the second type of fixing hole.

4. The fixture as described in claim 3, characterized in that:

The loading part is installed on the connecting part by a fixing mechanism, which is a snap-fit structure or a screw-fit structure.

5. The fixture as described in claim 1, characterized in that:

The connecting part is fixed to the coating machine by means of screws, snap-fit, or magnetic attraction.

6. The fixture as described in claim 1, characterized in that:

The cover plate and the loading part are fixed to each other by magnetic attraction or screw fixing.

7. The fixture as described in claim 1, characterized in that:

The loading part includes a first type of limiting hole, the cover plate includes a second type of limiting hole that cooperates with the first type of limiting hole, the microelectrode has a through hole that cooperates with the first type of limiting hole and the second type of limiting hole, and the fixture also includes a limiting post that can penetrate the first type of limiting hole, the second type of limiting hole and the through hole.

8. The fixture as described in claim 1, characterized in that:

The loading section also includes a bottom surface that intersects with the first loading surface, and the edge of the cover plate does not extend beyond the bottom surface.

9. The fixture as described in claim 8, characterized in that:

The loading section further includes a second loading surface parallel to the first loading surface, the bottom surface connects the first loading surface and the second loading surface, and the fixture further includes a back plate that mates with the second loading surface, the edge of the back plate not exceeding the bottom surface.

10. The fixture as described in claim 1, characterized in that:

The coating machine is an immersion dip coating machine.