CN115703269A - Manufacturing method of composite board applied to electronic product shell and product - Google Patents

Abstract

The invention relates to the technical field of thermocompression forming of electronic product shells, in particular to a manufacturing method and product of a composite plate applied to electronic product shells. The method includes a manufacturing step of an electronic product casing, and the product is an electronic product casing produced according to the manufacturing method. The beneficial effect of the present invention is that, the purpose of directly molding the product structure can be achieved by performing hot-press molding on the composite board, without the need for submerged injection molding, and the middle core layer of the composite board uses a thickened thermoplastic resin sheet Or the thermoplastic resin sheet reinforced by chopped fibers can maintain the high strength and high modulus properties of the composite sheet.

Description

A manufacturing method and product of a composite plate applied to an electronic product casing

【Technical field】

The invention relates to the technical field of thermocompression forming of electronic product shells, in particular to a manufacturing method and product of a composite plate applied to electronic product shells.

【Background technique】

With the development of electronic and information equipment such as notebook computers, tablet notebooks, portable phones, portable information terminals or cameras, products on the market are increasingly thinner and lighter. Thin and light products require thin-walled and light-weight shells or internal parts that make up the product, as well as high strength and high rigidity. Composite materials have the advantages of light weight, high strength and high modulus, chemical corrosion resistance, fatigue resistance, and easy integral molding. They are widely used in the production of military, aircraft, automobile, wind power and other products. Due to the excellent mechanical properties of composite materials, they can also be used in the casings of portable information terminals such as notebook computers, tablet notebooks, and portable phones, and play a role in reducing the thickness of the casing and reducing the weight of the equipment.

At present, thermoplastic composite products used in electronic appliances, automobiles, sports equipment and other products mostly use continuous carbon fiber, continuous glass fiber, etc. When the board is processed into products, most of them use the process of hot pressing the board first and then burying it. The desired structure must be obtained through burying molding.

In view of this, it is necessary to develop a manufacturing method that utilizes composite plates to eliminate the need for submerged injection molding mechanisms, so as to save processes and improve production efficiency.

【Content of invention】

The technical problem to be solved by the present invention is: most of the products processed by the composite plate currently need to adopt the process of hot pressing the plate and then burying the plate, and the required structure must be obtained through burying molding.

Therefore, the technical solution for solving the problem of the present invention is: a manufacturing method and product of a composite plate applied to an electronic product casing, comprising the following steps:

S1: Cut the composite sheet within the design specifications into the required size;

S2: The local structure needs to remove the corresponding fiber layer;

S3: Put the cut board into the mold for heating, the heating temperature depends on the resin used for the composite board, keep a certain gap between the upper and lower molds of the mold, and do not clamp the mold with high pressure;

S4: When the mold temperature reaches the design temperature, high pressure is applied to the mold clamping;

S5: Keep the mold at high pressure and constant temperature for a period of time;

S6: After the mold is cooled to the required temperature, the mold is opened and the product is taken out.

Preferably, the removal method of the fiber layer is CNC numerical control machining.

Optionally, the hot pressing mold is heated to 280-320°C.

Optionally, a certain gap of 0.2-1 mm is reserved between the upper and lower molds of the mold.

Optionally, the high-pressure constant-temperature holding time is 60-90 seconds.

Optionally, the cooling to the required temperature is 30-60°C.

The composite board contains two layers of fiber layers and an intermediate core layer, and is characterized in that:

Optionally, the fiber layer is continuous fiber impregnated with thermoplastic (such as PC, PA, PPS) or thermosetting (such as epoxy resin, etc.) resin.

Optionally, the continuous fiber may be carbon fiber, glass fiber, aramid fiber, graphite fiber, etc.; the carbon fiber uses unidirectional or woven carbon fiber to maximize the strength of the plate while retaining the carbon fiber pattern;

Preferably, the fiber layer adopts carbon fiber.

The middle core layer is a thickened thermoplastic resin sheet (such as PC, PPS, etc.), and a thermoplastic resin sheet reinforced by chopped fibers (such as PC+GF, PC+CF, PBT+GF, PPS+GF, etc. ); the length of the chopped fibers is between 0.2 mm and 5 mm; the intermediate core layer is arranged between two fiber layers.

In addition, the present invention also provides a product, which is a product produced by the method of applying the composite board to the casing of an electronic product.

Compared with the prior art, a manufacturing method and product of a composite plate applied to electronic product casings according to the present invention have the following technical effects:

1. Squeeze out the middle core layer resin by hot pressing, which can achieve the purpose of directly forming the product structure, without the need to bury the structure.

2. Using a thickened thermoplastic resin sheet or a thermoplastic resin sheet reinforced by chopped fibers in the middle core layer of the composite sheet can maintain the high strength and high modulus properties of the composite sheet.

3. The hot-pressing process is simple, and the whole process can use conventional hot-pressing equipment.

【Description of drawings】

FIG. 1 is a flow chart of the steps of a method for manufacturing a composite plate applied to an electronic product casing according to the present invention.

Fig. 2 is a schematic cross-sectional view of a composite sheet used in the manufacturing method of the housing of an electronic product and the product according to the present invention.

Fig. 3 is a schematic diagram of a composite sheet used in the manufacturing method of an electronic product casing and the composite sheet thermocompression forming in the product according to the present invention.

【Detailed ways】

In order to further illustrate the technical means and effects adopted by the present invention, the following will be described in detail in conjunction with the embodiments of the present invention and the accompanying drawings:

Please refer to Figures 1 to 3. Figure 1 shows a flow chart of the steps of a method for manufacturing a composite sheet material used in an electronic product casing according to the present invention. The method and the schematic cross-sectional view of the composite plate in the product. FIG. 3 shows a schematic diagram of a composite plate of the present invention applied to the manufacturing method of the electronic product casing and the product for thermocompression forming.

Let's take the case of making a 14-inch laptop computer as an example, and the details are as follows:

Please refer to Fig. 2, the composite board (100) includes two fiber layers (101) and an intermediate core layer (102), wherein the intermediate core layer (102) is arranged between the two fiber layers (101).

In this embodiment, the two fiber layers (101) are continuous carbon fibers impregnated with thermoplastic resin.

In this embodiment, the middle core layer (102) is a thermoplastic resin sheet (PC+20% CF) reinforced by chopped fibers.

Next, please refer to Fig. 1, utilize a kind of surface layer provided by the present invention to use the application of the composite sheet impregnated with resin, described application comprises the following steps:

S1: Cut the composite plate (100) within the design specifications into the required size, length: 350mm, width: 255mm;

S2: The local structure requires the corresponding fiber layer (101) to be removed by CNC machining;

S3: Put the cut composite plate (100) into the mold (2), heat press the mold (2) to close the mold, keep a gap of 0.2-1 mm between the upper and lower molds, and heat the mold (2) to 280-320 degrees Celsius;

S4: When the temperature of the mold (2) reaches the design temperature, high pressure is applied to the mold clamping;

S5: The mold (2) is kept at high pressure and constant temperature for 60-90 seconds;

S6: Open the mold when the temperature of the mold (2) is cooled to 30°C-60°C, and take out the molded product (3);

A cycle ends.

In addition, the present invention also provides a product, which is a product produced by the method of applying the composite board to the casing of an electronic product. The product described is a case for a notebook computer. The product can maintain excellent properties such as high strength and high modulus because the thermoplastic resin sheet reinforced by chopped fibers is used.

Compared with the prior art, the present invention uses a resin-impregnated composite sheet and its application, which has the following technical effects:

1. The resin of the intermediate core layer (102) is extruded out by hot pressing, which can achieve the purpose of directly molding the product structure, without the need for injection molding.

2. Using a thickened thermoplastic resin sheet or a thermoplastic resin sheet reinforced by chopped fibers in the middle core layer (102) of the composite board can maintain the high strength and high modulus properties of the composite board (100).

3. The hot-pressing process is simple, and the whole process can use conventional hot-pressing equipment.

It should be pointed out that the present invention is not limited to the above-mentioned specific implementation methods, any simple modifications, equivalent changes and modifications made to the above-mentioned embodiments by any skilled person based on the technical solution of the present invention shall fall within the scope of protection of the present invention Inside.

Claims (14)

1. A manufacturing method in which a composite sheet is applied to an electronic product casing, is characterized in that, the manufacturing method may further comprise the steps: S1: Cut the composite sheet within the design specifications into the required size; S2: The local structure needs to remove the corresponding fiber layer; S3: Put the cut board into the mold for heating, the heating temperature depends on the resin used for the composite board, keep a certain gap between the upper and lower molds of the mold, and do not clamp the mold with high pressure; S4: When the mold temperature reaches the design temperature, high pressure is applied to the mold clamping; S5: Keep the mold at high pressure and constant temperature for a period of time; S6: After the mold is cooled to the required temperature, the mold is opened and the product is taken out. 2 . The method for manufacturing a composite plate applied to an electronic product housing according to claim 1 , wherein the cutting size is length: 350 mm, width: 255 mm. 3 . 3 . The manufacturing method of a composite board applied to an electronic product housing according to claim 1 , wherein the method of removing the fiber layer is CNC numerical control machining. 4 . 4. A method for manufacturing a composite plate applied to an electronic product housing according to claim 1, wherein the hot pressing mold is heated to 280-320°C. 5 . The method for manufacturing a composite plate applied to an electronic product housing according to claim 1 , wherein the holding time of the high-pressure constant temperature is 60-90 seconds. 6 . 6 . The method for manufacturing a composite plate applied to an electronic product casing according to claim 1 , wherein the gap between the upper and lower molds of the mold is 0.2-1 mm. 7 . 7 . The method for manufacturing a composite plate applied to an electronic product casing according to claim 1 , wherein the required cooling temperature is 30° C. to 60° C. 7 . 8. A method for manufacturing a composite board applied to an electronic product casing according to claim 1, wherein the main body of the composite board is composed of two layers of fiber layers and an intermediate core layer, and the intermediate core layer is located at Between the two fiber layers, the fiber layer is a continuous fiber impregnated with resin, and the middle core layer is a thickened resin sheet. 9 . The method for manufacturing a composite board applied to an electronic product housing according to claim 8 , wherein the resin impregnated into the fiber layer is a thermosetting resin. 10 . 10 . The method for manufacturing a composite board applied to an electronic product housing according to claim 8 , wherein the resin impregnated with the fiber layer is a thermoplastic resin. 11 . 11. A method for manufacturing a composite plate applied to an electronic product casing according to claim 8, wherein the fiber layer is unidirectional or woven carbon fiber. 12 . The method for manufacturing a composite board applied to an electronic product casing according to claim 8 , wherein the middle core layer is a thickened resin sheet, which is a thermoplastic resin sheet. 13 . 13 . The manufacturing method of a composite sheet applied to an electronic product housing according to claim 8 , wherein the middle core layer is a thickened resin sheet, which is a thermoplastic resin sheet reinforced by chopped fibers. 14 . 14. A product, characterized in that the product is a product produced by applying the composite sheet material according to any one of claims 1 to 13 to the manufacturing method of an electronic product casing.

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