CN115701814A - Mold device - Google Patents
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- CN115701814A CN115701814A CN202211082882.1A CN202211082882A CN115701814A CN 115701814 A CN115701814 A CN 115701814A CN 202211082882 A CN202211082882 A CN 202211082882A CN 115701814 A CN115701814 A CN 115701814A
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Abstract
Description
技术领域technical field
本申请涉及半导体材料制备技术领域,特别是涉及模具装置。The present application relates to the technical field of semiconductor material preparation, in particular to a mold device.
背景技术Background technique
为提升半导体封装材料的导热性能,金刚石由于其高导热率,在复合材料中具有广阔应用前景。然而,由于金刚石硬度极高,复合材料的制备难度大且成本高。In order to improve the thermal conductivity of semiconductor packaging materials, diamond has broad application prospects in composite materials due to its high thermal conductivity. However, due to the extremely high hardness of diamond, the preparation of composite materials is difficult and expensive.
发明内容Contents of the invention
基于此,提供一种能够提升复合材料制备容易程度的模具装置,以解决复合材料制备困难且成本高的问题。Based on this, a mold device capable of improving the ease of preparation of composite materials is provided, so as to solve the problems of difficulty and high cost in preparation of composite materials.
一种模具装置,用于将第一基材制备形成复合材料,包括:A mold device for preparing a first substrate to form a composite material, comprising:
容具,具有容纳腔和沿第一方向开设的第一开口,第一开口与容纳腔相连通;The container has an accommodating cavity and a first opening opened along a first direction, and the first opening communicates with the accommodating cavity;
定位组件,设于容纳腔内;定位组件内限定形成有沿第一方向延伸的定位腔,定位腔与第一开口相连通,以使第一基材能够经由第一开口而进入定位腔内;以及The positioning component is arranged in the receiving cavity; the positioning component defines a positioning cavity extending along the first direction, and the positioning cavity communicates with the first opening, so that the first base material can enter the positioning cavity through the first opening; as well as
至少两个金属网,沿第一方向彼此间隔设置,且借助于定位组件定位于定位腔内;At least two metal meshes are spaced apart from each other along the first direction and positioned in the positioning cavity by means of the positioning component;
其中,相邻的金属网之间形成用于夹持第一基材以制备复合材料的夹持空间。Wherein, a clamping space for clamping the first base material to prepare a composite material is formed between adjacent metal meshes.
在其中一个实施例中,定位组件包括沿第一方向交替且间隔布置的第一定位件和第二定位件;In one of the embodiments, the positioning assembly includes first positioning elements and second positioning elements arranged alternately and at intervals along the first direction;
第一定位件和第二定位件上沿第一方向开设有定位孔,全部定位孔共同限定形成定位腔;Positioning holes are formed on the first positioning member and the second positioning member along the first direction, and all the positioning holes are jointly defined to form a positioning cavity;
相邻的第一定位件和第二定位件之间形成用于限位一金属网的限位空间。A limiting space for limiting a metal mesh is formed between adjacent first positioning pieces and second positioning pieces.
在其中一个实施例中,定位组件还包括定位结构;In one of the embodiments, the positioning component also includes a positioning structure;
定位结构配合于相邻的第一定位件和第二定位件之间,以形成限位空间。The positioning structure fits between adjacent first positioning pieces and second positioning pieces to form a limiting space.
在其中一个实施例中,定位结构包括凸出结构;In one of the embodiments, the positioning structure includes a protruding structure;
凸出结构设于第一定位件朝向第二定位件的一侧;和/或凸出结构设于第二定位件朝向第一定位件的一侧;The protruding structure is provided on the side of the first positioning member facing the second positioning member; and/or the protruding structure is provided on the side of the second positioning member facing the first positioning member;
相邻的第一定位件和第二定位件借助于凸出结构彼此相间隔,以形成限位空间。Adjacent first positioning pieces and second positioning pieces are spaced apart from each other by means of the protruding structures to form a limiting space.
在其中一个实施例中,定位结构包括凸出结构和凹陷结构;In one of the embodiments, the positioning structure includes a protruding structure and a concave structure;
凸出结构与凹陷结构的至少其中之一设于第一定位件朝向相邻的第二定位件的一侧,凸出结构与凹陷结构的至少其中另一设于第二定位件朝向相邻的第一定位件的一侧;At least one of the protruding structure and the recessed structure is provided on the side of the first positioning member facing the adjacent second positioning member, and at least the other of the protruding structure and the recessing structure is provided on the second positioning member facing the adjacent side. one side of the first positioning member;
相邻的第一定位件和第二定位件能够借助于至少部分凸出结构形成间隔,和/或能够借助至少部分相配合的凸出结构与凹陷结构形成间隔,以形成限位空间。Adjacent first positioning pieces and second positioning pieces can be separated by at least part of the protruding structure, and/or can be spaced by at least part of the matching protruding structure and concave structure, so as to form a limiting space.
在其中一个实施例中,凸出结构与凹陷结构的其中之一设于第一定位件朝向相邻的第二定位件的一侧,凸出结构与凹陷结构的其中另一设于第二定位件朝向相邻的第一定位件的一侧;In one of the embodiments, one of the protruding structure and the recessed structure is provided on the side of the first positioning member facing the adjacent second positioning member, and the other of the protruding structure and the recessed structure is provided on the second positioning member. One side of the piece facing the adjacent first positioning piece;
相邻的第一定位件和第二定位件能够借助于至少部分凸出结构形成间隔,和/或能够借助至少部分相配合的凸出结构与凹陷结构形成间隔,以形成限位空间。Adjacent first positioning pieces and second positioning pieces can be separated by at least part of the protruding structure, and/or can be spaced by at least part of the matching protruding structure and concave structure, so as to form a limiting space.
在其中一个实施例中,第一定位件朝向相邻的第二定位件的一侧设有凸出结构和凹陷结构;In one of the embodiments, the side of the first positioning member facing the adjacent second positioning member is provided with a protruding structure and a concave structure;
第二定位件朝向相邻的第一定位件的一侧设有凸出结构和凹陷结构;The second positioning part is provided with a protruding structure and a concave structure on one side facing the adjacent first positioning part;
相邻的第一定位件和第二定位件能够借助于至少部分凸出结构形成间隔,和/或能够借助至少部分相配合的凸出结构与凹陷结构形成间隔,以形成限位空间。Adjacent first positioning pieces and second positioning pieces can be separated by at least part of the protruding structure, and/or can be spaced by at least part of the matching protruding structure and concave structure, so as to form a limiting space.
在其中一个实施例中,金属网上设有配合部;In one of the embodiments, a matching portion is provided on the metal mesh;
配合部能够与定位结构相互配合,以使金属网限位于第一定位件和第二定位件之间。The matching part can cooperate with the positioning structure, so that the metal mesh is confined between the first positioning part and the second positioning part.
在其中一个实施例中,容具远离第一开口的一端具有台阶部;In one of the embodiments, the end of the container away from the first opening has a stepped portion;
台阶部构造为能够用于支撑定位组件。The stepped portion is configured to support the positioning assembly.
在其中一个实施例中,台阶部上设有第一通道;In one of the embodiments, a first channel is provided on the stepped portion;
第一通道的径向尺寸小于第一开口的径向尺寸。The radial dimension of the first channel is smaller than the radial dimension of the first opening.
上述模具装置,在容具的容纳腔内,通过由定位组件所限定的定位腔对金属网和第一基材进行定位,使得相邻两个金属网能够在制备过程中可靠夹持第一基材,从而避免了直接对第一基材中硬度较大的金刚石进行加工,进而降低了制备困难程度和制备成本。In the above-mentioned mold device, in the accommodating cavity of the container, the metal mesh and the first substrate are positioned through the positioning cavity defined by the positioning component, so that two adjacent metal meshes can reliably clamp the first substrate during the preparation process. material, thereby avoiding the direct processing of diamond with higher hardness in the first base material, thereby reducing the degree of difficulty and cost of preparation.
附图说明Description of drawings
图1为本申请一实施例的模具装置的结构示意图;Fig. 1 is the structural representation of the mold device of an embodiment of the present application;
图2为本申请一实施例的容具的结构示意图;FIG. 2 is a schematic structural view of a container according to an embodiment of the present application;
图3为本申请一实施例的金属网的结构示意图;FIG. 3 is a schematic structural diagram of a metal mesh according to an embodiment of the present application;
图4为本申请一实施例的第一定位件的结构示意图;Fig. 4 is a schematic structural diagram of a first positioning member according to an embodiment of the present application;
图5为本申请一实施例的第二定位件的结构示意图;Fig. 5 is a schematic structural diagram of a second positioning member according to an embodiment of the present application;
图6为本申请一实施例的承托件的结构示意图;Fig. 6 is a schematic structural diagram of a supporting member according to an embodiment of the present application;
图7为本申请一实施例的压头的结构示意图。FIG. 7 is a schematic structural diagram of an indenter according to an embodiment of the present application.
附图标记说明:Explanation of reference signs:
100、模具装置;110、容具;111、容纳腔;112、第一开口;113、台阶部;1131、第一通道;1132、第二通道;120、定位组件;121、第一定位件;1211、凸出结构;122、第二定位件;1221、凹陷结构;A、定位腔;a、定位孔;130、金属网;131、配合部;B、限位空间;140、承托件;150、压头。100. Mold device; 110. Container; 111. Accommodating cavity; 112. First opening; 113. Step; 1131. First channel; 1132. Second channel; 120. Positioning component; 121. First positioning member; 1211, protruding structure; 122, second positioning part; 1221, recessed structure; A, positioning cavity; a, positioning hole; 130, metal mesh; 131, matching part; B, limiting space; 140, supporting part; 150, pressure head.
具体实施方式Detailed ways
为使本申请的上述目的、特征和优点能够更加明显易懂,下面结合附图对本申请的具体实施方式做详细的说明。在下面的描述中阐述了很多具体细节以便于充分理解本申请。但是本申请能够以很多不同于在此描述的其它方式来实施,本领域技术人员可以在不违背本申请内涵的情况下做类似改进,因此本申请不受下面公开的具体实施例的限制。In order to make the above-mentioned purpose, features and advantages of the present application more obvious and understandable, the specific implementation manners of the present application will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the application. However, the present application can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.
在本申请的描述中,需要理解的是,术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本申请和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请的限制。In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial" , "radial", "circumferential" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the application and simplifying the description, rather than indicating or implying the referred device or Elements must have certain orientations, be constructed and operate in certain orientations, and thus should not be construed as limiting the application.
此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。在本申请的描述中,“多个”的含义是至少两个,例如两个,三个等,除非另有明确具体的限定。In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In the description of the present application, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.
在本申请中,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或成一体;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系,除非另有明确的限定。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本申请中的具体含义。In this application, terms such as "installation", "connection", "connection" and "fixation" should be interpreted in a broad sense, for example, it can be a fixed connection or a detachable connection, unless otherwise clearly specified and limited. , or integrated; it may be mechanically connected or electrically connected; it may be directly connected or indirectly connected through an intermediary, and it may be the internal communication of two components or the interaction relationship between two components, unless otherwise specified limit. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application according to specific situations.
在本申请中,除非另有明确的规定和限定,第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触,或第一和第二特征通过中间媒介间接接触。而且,第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方,或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方,或仅仅表示第一特征水平高度小于第二特征。In the present application, unless otherwise clearly specified and limited, a first feature being "on" or "under" a second feature may mean that the first and second features are in direct contact, or that the first and second features are indirect through an intermediary. touch. Moreover, "above", "above" and "above" the first feature on the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. "Below", "beneath" and "beneath" the first feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is less horizontally than the second feature.
需要说明的是,当元件被称为“固定于”或“设置于”另一个元件,它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件,它可以是直接连接到另一个元件或者可能同时存在居中元件。本文所使用的术语“垂直的”、“水平的”、“上”、“下”、“左”、“右”以及类似的表述只是为了说明的目的,并不表示是唯一的实施方式。It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. As used herein, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions are for the purpose of illustration only and are not intended to represent the only embodiment.
此外,附图并不是1:1的比例绘制,并且各元件的相对尺寸在附图中仅以示例地绘制,而不一定按照真实比例绘制。In addition, the drawings are not drawn in a 1:1 scale, and the relative sizes of the elements are drawn in the drawings by way of example only and not necessarily in true scale.
为了便于理解本申请的技术方案,在详细展开说明之前,首先对现有半导体器件用于封装的复合材料进行阐述。In order to facilitate the understanding of the technical solution of the present application, prior to the detailed description, the composite materials used for packaging of existing semiconductor devices are firstly described.
半导体封装常用的热沉材料是一种具有高热导率、低热膨胀系数等特性的散热封装材料,其为芯片起着固定支撑、散发热量的作用,为芯片提供了稳定工作的环境。常用的热沉材料包括钨铜合金、钼铜合金、铝碳化硅、覆铜陶瓷板等,但这些材料热导率普遍相对较低,已不能满足电子元器件日益增长的散热需求。The heat sink material commonly used in semiconductor packaging is a heat-dissipating packaging material with high thermal conductivity and low thermal expansion coefficient. It acts as a fixed support for the chip and dissipates heat, providing a stable working environment for the chip. Commonly used heat sink materials include tungsten-copper alloy, molybdenum-copper alloy, aluminum silicon carbide, copper-clad ceramic plate, etc., but these materials generally have relatively low thermal conductivity, which cannot meet the growing heat dissipation requirements of electronic components.
金刚石导热率可达2000w/mk,是良好的散热封装材料,而金刚石同时还具有高硬度的特性,导致其极难加工,整块的金刚石制备困难,成本高昂。因此,通常将金刚石颗粒与金属材料制备得到复合材料,并通过设计金刚石颗粒所占的体积分数,调控复合材料的热膨胀系数需求,从而与碳化硅、氮化镓等半导体材料相匹配,且具有较高热导率,能够更好地满足芯片的散热需求。The thermal conductivity of diamond can reach 2000w/mk, which is a good heat dissipation packaging material, and diamond also has the characteristics of high hardness, which makes it extremely difficult to process, and the preparation of the whole diamond is difficult and expensive. Therefore, composite materials are usually prepared from diamond particles and metal materials, and the thermal expansion coefficient requirements of the composite materials are adjusted by designing the volume fraction of diamond particles, so as to match with semiconductor materials such as silicon carbide and gallium nitride, and have a relatively high High thermal conductivity can better meet the heat dissipation requirements of the chip.
为便于描述,附图仅示出了与本申请实施例相关的结构。For ease of description, the drawings only show structures related to the embodiments of the present application.
图1示出了本申请一实施例中的模具装置100的结构示意图,图2示出了本申请一实施例中的容具110的结构示意图;图3示出了本申请一实施例中的金属网130的结构示意图。Figure 1 shows a schematic structural view of a
参阅图1,并结合图2、图3,本申请一实施例提供了的模具装置100,用于将第一基材制备形成复合材料,包括容具110、定位组件120和至少两个金属网130。容具110具有容纳腔111和沿第一方向开设的第一开口112,第一开口112与容纳腔111相连通。定位组件120设于容纳腔111内,定位组件120内限定形成有沿第一方向延伸的定位腔A,定位腔A与第一开口112相连通,以使第一基材能够经由第一开口112进入定位腔A内。至少两个金属网130沿第一方向彼此间隔设置,且借助于定位组件120定位于定位腔A内。其中,相邻的金属网130之间形成用于夹持第一基材以制备复合材料的夹持空间。Referring to Fig. 1, and in conjunction with Fig. 2 and Fig. 3, a
上述模具装置100,在容具110的容纳腔111内,通过由定位组件120所限定的定位腔A对金属网130和第一基材进行定位,使得相邻两个金属网130能够在制备过程中可靠夹持第一基材,从而避免了直接对第一基材中硬度较大的金刚石进行加工,进而降低了在将第一基材加工制备得到复合材料的过程中的制备困难程度和制备成本。The above-mentioned
需要说明的是,本申请中的模具装置100可应用于熔渗工艺、粉末冶金工艺、搅拌铸造工艺、烧结工艺等制备工艺中,其中,烧结工艺包括但不限于是放电等离子烧结、热压烧结工艺、高压烧结工艺等。本申请以熔渗工艺作为示例。熔渗工艺是将金属加热至液体状态,在无压或者压力辅助下渗入金刚石颗粒中,最后凝固成复合材料。It should be noted that the
结合本申请中的模具装置100,第一基材包括金刚石,金属网130具有多个网孔,网孔的孔径大于金刚石的粒径。如此,能够确保金刚石被限制于两个金属网130之间,避免金属网130的孔径过大,导致金刚石无法夹持在两层金属网130之间。尤其是在制备多层复合材料时,通过金属网130对金刚石进行拦截,能够避免模具装置100中更上层的金刚石会穿过金属网130掉落至更下层,以免制备得到的多层复合材料难以保持每层复合材料的均匀一致性。而金属网130限位于第一定位件121和第二定位件122之间,能够在复合材料的制备过程中,限制金刚石颗粒及金属网130在金属溶液中的浮动。除此之外,金属网130还能够保证金刚石颗粒铺展的均一性,从而提升所制备得到的复合材料的厚度均匀一致性。In combination with the
进一步地,模具装置100用于将第一基材和第二基材制备形成复合材料。第二基材以第一基材为中心,对称设于两个金属网130的相背的一侧。具体到一些实施方式中,第二基材为金属块。如此,在制备过程中,金属块变形,由金属网130的网孔进入并包覆于金刚石外部,再经由冷却凝固后得到复合材料。Further, the
“变形”是指金属在加热过程中会发生形变。此处需要说明的是,物体因温度改变而发生的膨胀现象被称为“热膨胀”。通常是指外压强不变的情况下,物质在温度升高时,其体积随之增大。在升温过程中,金属发生熔融,熔融是熔化过程中的固液共存状态,此时无论固相金属或是液相金属,均发生“变形”,也即其体积增大,而在模具装置100的容具110内,受限于容具110的内壁、金属自身重力以及其他压力,金属变形会经由金属网130的网孔进入,也即是填充于金刚石与金属网130的缝隙之间,实现对金刚石的包覆。也即是,制备得到的金刚石“镶嵌”于复合材料内部。"Deformation" means that the metal deforms during heating. What needs to be explained here is that the expansion phenomenon of an object due to temperature change is called "thermal expansion". Generally speaking, when the external pressure is constant, the volume of the substance increases when the temperature rises. During the heating process, the metal melts, and melting is a solid-liquid coexistence state in the melting process. At this time, no matter the solid phase metal or the liquid phase metal, "deformation" occurs, that is, its volume increases, and in the
在一些实施例中,第一基材还包括金属粉。如此,借助于金属粉能够进一步地确保对金刚石的包覆效果。具体地,金属粉与第二基材的金属块的材料相同。如此,能够进一步提升复合材料的结合强度,而且能够易于控制金属的熔点,确保金属在熔渗过程中能够可靠熔化至包覆金刚石。示例性地,金属粉及金属块的材料包括铜、银、铝、镍中的至少一种。上述金属材料导热性较好,最终制备形成的复合材料导热率更高,更能适用于半导体散热领域。In some embodiments, the first substrate further includes metal powder. In this way, the coating effect on the diamond can be further ensured by means of the metal powder. Specifically, the metal powder is the same material as the metal block of the second substrate. In this way, the bonding strength of the composite material can be further improved, and the melting point of the metal can be easily controlled to ensure that the metal can be reliably melted to the coated diamond during the infiltration process. Exemplarily, the material of the metal powder and the metal block includes at least one of copper, silver, aluminum and nickel. The above-mentioned metal materials have better thermal conductivity, and the final prepared composite material has higher thermal conductivity, which is more suitable for the field of semiconductor heat dissipation.
需要说明的是,本申请提供的模具装置100,既可以仅制备一层复合材料,也可以通过在模具装置100中借助于多个金属块及多个金属网130,同时制备多层的复合材料。借助于第二基材金属块,制备得到的复合材料沿第一方向的两侧为金属层。在将冷却的多层复合材料及模具装置100从加热炉中取出后,通过对多层的复合材料在金属层处进行切割,即可形成单层的复合材料。切割方法示例性地,可以为线切割、激光切割、金刚石刀具切割、水刀切割等,在此不作限制。It should be noted that the
其中,经过本申请提供的模具装置100制备得到的多层复合材料,每层之间借助于金属层结合在一起,故而在对其进行切割时,不会存在金刚石和金属网130的阻碍,因此降低了加工难度,提高了成品率。而且,预留的金属层也易于后续的表面镀覆和封装等的加工步骤。而且,正是由于复合材料在第一方向上的两侧为金属层,降低了研磨抛光的难度,复合材料的表面平整度和粗糙度也得到了极大改善。Among them, the multi-layer composite material prepared by the
图4示出了本申请一实施例中的第一定位件121的结构示意图;图5示出了本申请一实施例中的第二定位件122的结构示意图。FIG. 4 shows a schematic structural view of the
参阅图4、图5,并结合图1,在一些实施例中,定位组件120包括沿第一方向交替且间隔布置的第一定位件121和第二定位件122。第一定位件121和第二定位件122上沿第一方向开设有定位孔a,全部定位孔a共同限定形成定位腔A,相邻的第一定位件121和第二定位件122之间形成用于限位一金属网130的限位空间B。由于相邻的两个金属网130限定了所能够容纳的第一基材的量,也即借助于相邻的两个金属网130限定了所能制备得到的复合材料的尺寸,如此,借助于交替间隔布置的第一定位件121和第二定位件122,能够对金属网130进行支撑及限位,从而避免在制备过程中金属网130在容具110中发生移位,进而确保了在同时制备多层复合材料时,每层复合材料的结构尺寸保持一致。需要说明的是,为满足不同复合材料的厚度需求,第一定位件121与第二定位件122在第一方向上的尺寸可进行根据需求进行调节,在此不作限制。Referring to FIG. 4 and FIG. 5 in conjunction with FIG. 1 , in some embodiments, the
请继续结合图4和图5所示,在一些实施例中,定位组件120还包括定位结构,定位结构配合于相邻的第一定位件121和第二定位件122之间,以形成限位空间B。如此,能够借助于第一定位件121和第二定位件122之间的定位结构,形成用于限位金属网130的限位空间B。具体到一些实施方式中,定位结构包括凸出结构1211,凸出结构1211设于第一定位件121朝向第二定位件122的一侧。相邻的第一定位件121和第二定位件122借助于凸出结构1211彼此相间隔,以形成限位空间B。如此,通过第一定位件121上的凸出结构1211与第二定位件122朝向第一定位件121的表面配合作用,从而可靠地将金属网130夹持在第一定位件121和第二定位件122之间。Please continue to refer to FIG. 4 and FIG. 5, in some embodiments, the
具体到又一些实施方式中,凸出结构1211设于第二定位件122朝向第一定位件121的一侧。如此,通过第二定位件122上的凸出结构1211与第一定位件121朝向第二定位件122的表面配合作用,从而可靠地将金属网130夹持在第一定位件121和第二定位件122之间。具体到再一些实施方式中,凸出结构1211还可以同时设于第一定位件121朝向第二定位件122的一侧,以及第二定位件122朝向第一定位件121的一侧。Specifically, in still some embodiments, the protruding
在一些实施例中,定位结构包括凸出结构1211和凹陷结构1221,凸出结构1211与凹陷结构1221的至少其中之一设于第一定位件121朝向相邻的第二定位件122的一侧,凸出结构1211与凹陷结构1221的至少其中另一设于第二定位件122朝向相邻的第一定位件121的一侧。需要说明的是,凸出结构1211与凹陷结构1221的“至少”其中之一,也即为第一定位件121及第二定位件122上既可以设有凸出结构1211,也可以设有凹陷结构1221,还可以同时设有凸出结构1211和凹陷结构1221。在装配时,第一定位件121与第二定位件122借助于彼此的凸出结构1211和凹陷结构1221相互配合,从而限制第一定位件121与第二定位件122之间的移动,进而确保对金属网130的限位效果。In some embodiments, the positioning structure includes a protruding
在一些实施方式中,相邻的第一定位件121和第二定位件122能够借助于至少部分凸出结构1211形成间隔。如此,结合后述一些实施例,借助于凸出结构1211朝向第二定位件122的表面,与第二定位件122朝向第一定位件121的表面相抵,能够实现对金属网130的可靠限位。In some embodiments, the adjacent
在又一些实施方式中,相邻的第一定位件121和第二定位件122能够借助至少部分相配合的凸出结构1211与凹陷结构1221形成间隔,以形成限位空间B。如此,通过凸出结构1211和凹陷结构1221之间的配合,能够进一步地减小第一定位件121和第二定位件122之间的间距,从而使得金属网130能够被限制在更小的空间内,进一步地减小金属网130的可移动范围。而且,借助于凹陷结构1221的凹陷更为稳靠地限制第一定位件121相对第二定位件122的移动,进而使得对金属网130的限位更为可靠。在本申请的实施方式中,金属网130在第一方向上的两个表面分别与第一定位件121和第二定位件122相贴合,也即夹持于第一定位件121和第二定位件122之间。In yet other embodiments, the adjacent
具体到一些实施例中,凸出结构1211与凹陷结构1221的其中之一设于第一定位件121朝向相邻的第二定位件122的一侧,凸出结构1211与凹陷结构1221的其中另一设于第二定位件122朝向相邻的第一定位件121的一侧。可以理解地,在本实施例中,第一定位件121或第二定位件122上,有且仅有凸出结构1211或是凹陷结构1221的其中之一。Specifically, in some embodiments, one of the protruding
具体至一些实施方式中,相邻的第一定位件121和第二定位件122能够借助于至少部分凸出结构1211形成间隔。如此,能够借助于凸起结构1211形成的间隔对金属网130进行限位。具体至另一些实施方式中,相邻的第一定位件121和第二定位件122能够借助至少部分相配合的凸出结构1211与凹陷结构1221形成间隔,以形成限位空间B。如此,借助于凸起结构1211和凹陷结构1221的配合,能够进一步地减小间隔的距离,从而缩小金属网130的可移动空间。Specifically, in some implementations, adjacent
具体到又一些实施例中,第一定位件121朝向相邻的第二定位件122的一侧设有凸出结构1211和凹陷结构1221。第二定位件122朝向相邻的第一定位件121的一侧设有凸出结构1211和凹陷结构1221。相邻的第一定位件121和第二定位件122能够借助于至少部分凸出结构1211形成间隔,和/或能够借助至少部分相配合的凸出结构1211与凹陷结构1221形成间隔,以形成限位空间B。可以理解地,在本实施例中,第一定位件121或第二定位件122上,既设有凸出结构1211,又设有凹陷结构1221。Specifically, in some other embodiments, the side of the
进一步地,第一定位件121朝向第二定位件122的一侧设有多个凸出结构1211,多个凸出结构1211沿第一定位件121的周向彼此间隔设置。第二定位件122朝向第一定位件121的一侧设有多个凹陷结构1221,多个凹陷结构1221沿第二定位件122的周向彼此间隔设置。其中,多个凸出结构1211与多个凹陷结构1221一一对应且相互配合。如此,借助于多个凸出结构1211和多个凹陷结构1221之间的配合,能够从多个位置限制第一定位件121和第二定位件122之间的相互移动,以进一步地确保金属网130的可靠限位。Further, a side of the
更进一步地,第一定位件121朝向第二定位件122的一侧设有四个凸出结构1211,第二定位件122朝向第一定位件121的一侧设有四个凹陷结构1221。在如图4示出的实施例中,第一定位件121在第一方向上的两侧均设有凸出结构1211。如此,在第一定位件121与第二定位件122交错设置时,能够保证当第一定位件121位于两个第二定位件122之间时,能够依靠两侧的凸出结构1211同时与两个第二定位件122上的凹陷结构1221相配合,从而实现更为稳靠的定位。Further, the
在一些实施例中,凸出结构1211的外廓形状与凹陷结构1221的內廓形状相适配。如此,能够确保凸出结构1211与凹陷结构1221可靠配合。具体至如图4和图5示出的实施例中,凸出结构1211在与第一方向相垂直的平面上的正投影呈圆形,凹陷结构1221在与第一方向相垂直的平面上的正投影呈圆形。可以理解地,凸出结构1211呈圆柱体结构。如此,能够提升凸出结构1211与凹陷结构1221的加工的容易程度。当然,凸出结构1211与凹陷结构1221也可以为其他形状,在此不作限制。In some embodiments, the outer contour shape of the protruding
在其他实施例中,定位结构也可以为其他结构形式。例如,第一定位件121朝向第二定位件122的一侧具有在第一方向上凸起的弧形段,第二定位件122朝向第一定位件121的一侧具有在第一方向上凹陷的弧形段。如此,第一定位件121和第二定位件122借助于弧形段彼此相配合,也可限制第一定位件121与第二定位件122之间的相互运动。弧形段既可以是连续的弧形段,以形成类似于“波浪”状结构,也可以是彼此间隔的弧形段,只要能够实现第一定位件121与第二定位件122之间的相互配合即可。In other embodiments, the positioning structure may also be in other structural forms. For example, the side of the
请再次参阅图3,在一些实施例中,金属网130上设有配合部131,配合部131能够与定位结构相互配合,以使金属网130限位于第一定位件121和第二定位件122之间。如此,通过金属网130上的配合部131与定位结构配合,能够确保金属网130与定位结构相贴合。具体到一些实施方式中,配合部131为配合孔。结合前述一些实施例,第一定位件121上设有凸出结构1211,第二定位件122上设有凹陷结构1221,金属网130夹持在第一定位件121和第二定位件122之间,也即是凸出结构1211穿过配合孔伸入凹陷结构1221,从而确保金属网130能够被第一定位件121和第二定位件122可靠定位。进一步地,金属网130上设有多个配合部131,多个配合部131沿周向彼此间隔设置。如此,能够易于金属网130从多个位置限位于第一定位件121和第二定位件122之间。具体至如图3示出的实施方式中,金属网130上开设有四个配合孔。Please refer to FIG. 3 again. In some embodiments, the
图6示出了本申请一实施例中的承托件140的结构示意图。FIG. 6 shows a schematic structural diagram of a supporting
参阅图6,并结合图1和图2所示,在一些实施例中,容具110远离第一开口112的一端具有台阶部113,台阶部113被构造为能够用于支撑定位组件120。如此,借助于台阶部113能够为定位组件120提供支撑平台,从而沿第一方向支撑定位组件120。可以理解地,第一定位件121与第二定位件122彼此交替地沿第一方向设置在台阶部113上。具体到一些实施方式中,模具装置100还包括承托件140,承托件140与定位组件120依次沿第一方向设于台阶部113上。在制备复合材料的过程中,承托件140能够承托第一基材,以确保制备工艺的可靠进行。尤其是在压力熔渗的工艺中,承托件140能够提供更为稳靠的支撑作用。示例性地,承托件140可以为垫片。Referring to FIG. 6 , as shown in FIG. 1 and FIG. 2 , in some embodiments, the end of the
在一些实施例中,台阶部113上设有第一通道1131,第一通道1131的径向尺寸小于第一开口112的径向尺寸。如此,结合前述一些实施例,通过第一通道1131能够使得制备过程中的废液更为容易地排出,而避免堆积在容具110的容纳腔111的底部,致使制备得到的底层的复合材料结构与上层的复合材料结构相异。结合前述一些实施例,需要说明的是,金属溶液可通过承托件140与容具110的容纳腔111的腔壁之间的缝隙流出,也即是承托件140并不会影响废液的排出。In some embodiments, the
在一些实施例中,台阶部113上还设有与第一通道1131相连通的第二通道1132,第二通道1132的径向尺寸沿背离第一开口112的方向逐渐增大。如此,借助于第二通道1132能够与外部容器进行配合,外部容器示例性地,可以为废液容器。当然,在其他一些实施方式中,也可以不采用台阶部113与承托件140的配合方式,而在容具110的底部设置一个或多个出液口以使废液排出,在此不作限制。In some embodiments, the
图7示出了本申请一实施例中的压头150的结构示意图。FIG. 7 shows a schematic structural view of the
参阅图7,并结合图1,在一些实施例中,模具装置100还包括压头150,压头150沿第一方向位于容纳腔111内靠近第一开口112的一端。其中,压头150用于辅助压力熔渗。如此,借助于压头150能够更为容易地向容具110内的第一基材和第二基材施加压力。具体地,压头150可以但不限于是圆柱体、长方体、圆台等形状,在此不作限制。Referring to FIG. 7 in conjunction with FIG. 1 , in some embodiments, the
本申请实施例提供的模具装置100,在容具110的容纳腔111内,通过由定位组件120所限定的定位腔A对金属网130和第一基材进行定位,使得相邻两个金属网130能够在制备过程中可靠夹持第一基材,从而避免了直接对第一基材中硬度较大的金刚石进行加工,进而降低了在将第一基材加工制备得到复合材料的过程中的制备困难程度和制备成本。借助于定位组件120中交替间隔布置的第一定位件121和第二定位件122,能够对金属网130进行支撑及限位,从而避免在制备过程中金属网130在容具110中发生移位,进而确保了在同时制备多层复合材料时,每层复合材料的结构尺寸保持一致。而且,经过本申请提供的模具装置100制备得到的多层复合材料,每层之间借助于金属层结合在一起,故而在对其进行切割时,不会存在金刚石和金属网130的阻碍,因此降低了研磨抛光的难度,复合材料的表面平整度和粗糙度也得到了极大改善。In the
以上所述实施例的各技术特征可以进行任意的组合,为使描述简洁,未对上述实施例中的各个技术特征所有可能的组合都进行描述,然而,只要这些技术特征的组合不存在矛盾,都应当认为是本说明书记载的范围。The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, should be considered as within the scope of this specification.
以上所述实施例仅表达了本申请的几种实施方式,其描述较为具体和详细,但并不能因此而理解为对申请专利范围的限制。应当指出的是,对于本领域的普通技术人员来说,在不脱离本申请构思的前提下,还可以做出若干变形和改进,这些都属于本申请的保护范围。因此,本申请专利的保护范围应以所附权利要求为准。The above-mentioned embodiments only express several implementation modes of the present application, and the description thereof is relatively specific and detailed, but should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the scope of protection of the patent application should be based on the appended claims.
Claims (10)
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Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0271222A2 (en) * | 1986-11-12 | 1988-06-15 | Alcan International Limited | Production of metal matrix composites |
| US4925457A (en) * | 1989-01-30 | 1990-05-15 | Dekok Peter T | Abrasive tool and method for making |
| CN204411851U (en) * | 2015-01-14 | 2015-06-24 | 瑞安市天越泵业有限公司 | A kind of oil guide pipe |
| JP2016206010A (en) * | 2015-04-23 | 2016-12-08 | 株式会社粧研 | Resin column body |
| CN108430765A (en) * | 2015-11-21 | 2018-08-21 | Ats材料与电化学研究有限责任公司 | Systems and methods for forming layers on surfaces of solid substrates and products formed therefrom |
| CN210751564U (en) * | 2019-10-23 | 2020-06-16 | 梁华 | Three-stage static pressure filtering device for ink production |
| CN111304481A (en) * | 2020-02-11 | 2020-06-19 | 中南大学 | A kind of infiltration preparation process of diamond-metal composite material and diamond-metal composite material |
| CN112387956A (en) * | 2019-08-12 | 2021-02-23 | 江苏华昌工具制造有限公司 | Preparation method of hard alloy saw blade |
| CN113547101A (en) * | 2021-07-21 | 2021-10-26 | 长飞光纤光缆股份有限公司 | Preparation method and product of high-thermal-conductivity diamond-aluminum-based composite material |
| CN114592140A (en) * | 2022-02-28 | 2022-06-07 | 江南大学 | A kind of preparation method of silver matrix composite material |
| CN115673319A (en) * | 2022-09-06 | 2023-02-03 | 佛山华智新材料有限公司 | Composite material and preparation method of composite material |
-
2022
- 2022-09-06 CN CN202211082882.1A patent/CN115701814A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0271222A2 (en) * | 1986-11-12 | 1988-06-15 | Alcan International Limited | Production of metal matrix composites |
| US4925457A (en) * | 1989-01-30 | 1990-05-15 | Dekok Peter T | Abrasive tool and method for making |
| US4925457B1 (en) * | 1989-01-30 | 1995-09-26 | Ultimate Abrasive Syst Inc | Method for making an abrasive tool |
| CN204411851U (en) * | 2015-01-14 | 2015-06-24 | 瑞安市天越泵业有限公司 | A kind of oil guide pipe |
| JP2016206010A (en) * | 2015-04-23 | 2016-12-08 | 株式会社粧研 | Resin column body |
| CN108430765A (en) * | 2015-11-21 | 2018-08-21 | Ats材料与电化学研究有限责任公司 | Systems and methods for forming layers on surfaces of solid substrates and products formed therefrom |
| CN112387956A (en) * | 2019-08-12 | 2021-02-23 | 江苏华昌工具制造有限公司 | Preparation method of hard alloy saw blade |
| CN210751564U (en) * | 2019-10-23 | 2020-06-16 | 梁华 | Three-stage static pressure filtering device for ink production |
| CN111304481A (en) * | 2020-02-11 | 2020-06-19 | 中南大学 | A kind of infiltration preparation process of diamond-metal composite material and diamond-metal composite material |
| CN113547101A (en) * | 2021-07-21 | 2021-10-26 | 长飞光纤光缆股份有限公司 | Preparation method and product of high-thermal-conductivity diamond-aluminum-based composite material |
| CN114592140A (en) * | 2022-02-28 | 2022-06-07 | 江南大学 | A kind of preparation method of silver matrix composite material |
| CN115673319A (en) * | 2022-09-06 | 2023-02-03 | 佛山华智新材料有限公司 | Composite material and preparation method of composite material |
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