CN115464673A - Photoelectric sensor for wafer detection of manipulator end effector and manipulator - Google Patents
Photoelectric sensor for wafer detection of manipulator end effector and manipulator Download PDFInfo
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- CN115464673A CN115464673A CN202210910800.1A CN202210910800A CN115464673A CN 115464673 A CN115464673 A CN 115464673A CN 202210910800 A CN202210910800 A CN 202210910800A CN 115464673 A CN115464673 A CN 115464673A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
- B25J19/02—Sensing devices
- B25J19/021—Optical sensing devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3202—Mechanical details, e.g. rollers or belts
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
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Abstract
本发明提供一种机械手末端执行器晶圆检测的光电传感器及机械手,涉及半导体制造技术领域,光电传感器包括感光元件和电路控制模块,电路控制模块与感光元件电连接,电路控制模块用于接收感应信号并将感应信号与阈值进行比对,以确定所述晶圆的状态;还用于调节所述感光元件的输入光的亮度,并根据所述感光元件感应的所述晶圆的规格对所述阈值进行调节。通过电路控制模块将感应信号与阈值进行比对,进而可以确定晶圆的状态;通过对感光元件的输入光的亮度进行调节,并根据感光元件感应的晶圆的规格对阈值进行调节,以使得感光元件可以检测不同规格晶圆的状态,确保感光元件对于不同规格的晶圆都具有较高的准确度,增大了感光元件的使用范围。
The invention provides a photoelectric sensor and a manipulator for wafer detection of a manipulator end effector, and relates to the technical field of semiconductor manufacturing. The photoelectric sensor includes a photosensitive element and a circuit control module. The circuit control module is electrically connected to the photosensitive element. signal and compare the sensing signal with a threshold value to determine the state of the wafer; it is also used to adjust the brightness of the input light of the photosensitive element, and to adjust the wafer according to the specifications of the wafer sensed by the photosensitive element Adjust the above threshold. Through the circuit control module, the sensing signal is compared with the threshold, and then the state of the wafer can be determined; by adjusting the brightness of the input light of the photosensitive element, and adjusting the threshold according to the specifications of the wafer sensed by the photosensitive element, so that The photosensitive element can detect the status of wafers of different specifications, ensuring that the photosensitive element has high accuracy for wafers of different specifications, and increasing the use range of the photosensitive element.
Description
技术领域technical field
本发明涉及半导体制造技术领域,尤其涉及一种机械手末端执行器晶圆检测的光电传感器及机械手。The invention relates to the technical field of semiconductor manufacturing, in particular to a photoelectric sensor and a manipulator for wafer detection of a manipulator end effector.
背景技术Background technique
晶圆传送几乎分散在晶圆制程的各个环节,最常用的设备例如晶圆传片倒片机(Wafer Sorter)、EFEM等,其中R-θ大气真空机械手已广泛应用在FAB厂内,如图1所示,R-θ大气真空机械手因为没有scada机械手灵活,经常被设计成双臂模式,可以提高工作效率,而双臂模式下对机械手末端执行器的结构设计提出更高要求。双手臂设计的机械手末端执行器的厚度较薄,大约为3mm,双末端执行器间距离一般在10mm左右,结构设计紧凑。Wafer transfer is scattered in almost every link of the wafer manufacturing process. The most commonly used equipment is such as wafer transfer and rewinder (Wafer Sorter), EFEM, etc. Among them, the R-θ atmospheric vacuum robot has been widely used in the FAB factory, as shown in the figure As shown in 1, the R-θ atmospheric vacuum manipulator is often designed in a dual-arm mode because it is not as flexible as a scada manipulator, which can improve work efficiency, and the dual-arm mode puts higher requirements on the structural design of the end effector of the manipulator. The thickness of the end effector of the manipulator designed with double arms is relatively thin, about 3mm, and the distance between the double end effectors is generally about 10mm, and the structure design is compact.
由于晶圆规格多种多样,反光率也不一样,现有的传感器在晶圆的规格发生变化或者在上手臂末端执行器背面材料反光的情况下,都会造成传感器误判,严重影响传感器检测的准确性,限制了传感器的使用范围。Due to the variety of wafer specifications and different reflectivity, the existing sensors will cause misjudgment by the sensor when the specification of the wafer changes or the material on the back of the end effector of the upper arm reflects light, which seriously affects the sensor detection. Accuracy, which limits the range of use of the sensor.
发明内容Contents of the invention
本发明提供一种机械手末端执行器晶圆检测的光电传感器,用以解决现有的手臂末端执行器的传感器无法匹配不同规格的晶圆,以及检测精度低的问题。The invention provides a photoelectric sensor for wafer detection of a manipulator end effector, which is used to solve the problems that the existing sensors of the arm end effector cannot match wafers of different specifications and the detection accuracy is low.
本发明提供一种机械手末端执行器晶圆检测的光电传感器,包括:The invention provides a photoelectric sensor for wafer detection of a manipulator end effector, comprising:
感光元件,用于感应晶圆的状态并输出感应信号;The photosensitive element is used to sense the state of the wafer and output the sensing signal;
电路控制模块,与所述感光元件电连接,所述电路控制模块用于接收所述感应信号并将所述感应信号与阈值进行比对,以确定所述晶圆的状态;还用于调节所述感光元件的输入光的亮度,并根据所述感光元件感应的所述晶圆的规格对所述阈值进行调节。The circuit control module is electrically connected to the photosensitive element, and the circuit control module is used to receive the sensing signal and compare the sensing signal with a threshold value to determine the state of the wafer; it is also used to adjust the the brightness of the input light of the photosensitive element, and adjust the threshold according to the specification of the wafer sensed by the photosensitive element.
根据本发明实施例提供的一种机械手末端执行器晶圆检测的光电传感器,还包括:A photoelectric sensor for wafer detection of a manipulator end effector provided according to an embodiment of the present invention further includes:
信号放大输出模块,分别与所述电路控制模块和控制终端电连接,所述信号放大输出模块用于对所述电路控制模块输出的信号进行放大处理后输出给所述控制终端;还用于在所述电路控制模块与所述控制终端之间起到电气隔离的作用。The signal amplification output module is electrically connected to the circuit control module and the control terminal respectively, and the signal amplification output module is used to amplify the signal output by the circuit control module and output it to the control terminal; The circuit control module is electrically isolated from the control terminal.
根据本发明实施例提供的一种机械手末端执行器晶圆检测的光电传感器,还包括:A photoelectric sensor for wafer detection of a manipulator end effector provided according to an embodiment of the present invention further includes:
通讯模块,分别与所述电路控制模块和交互终端电连接。The communication module is electrically connected with the circuit control module and the interactive terminal respectively.
根据本发明实施例提供的一种机械手末端执行器晶圆检测的光电传感器,所述电路控制模块包括控制器、信号转化单元、滤波单元、比较器和第一电阻,所述控制器的第一连接端与所述信号转化单元的第一连接端连接,所述信号转化单元的第二连接端与所述比较器的第一连接端共接所述控制器的第二连接端,所述比较器的第二连接端、所述滤波单元的第一连接端、所述控制器的第三连接端以及所述第一电阻的第一连接端共接所述感光元件的第一连接端,所述比较器的第三连接端、所述滤波单元的第二连接端、所述感光元件的第二连接端以及所述感光元件的第三连接端共接供电单元,所述感光元件的第四连接端分别与所述控制器的第三连接端以及第四连接端连接,所述第一电阻的第二连接端、所述比较器的第四连接端以及所述控制器的第六连接端均与所述供电单元连接,所述比较器的第五连接端与所述信号放大输出模块连接,所述控制器的第七连接端与所述通讯模块连接。According to a photoelectric sensor for wafer detection of a manipulator end effector provided by an embodiment of the present invention, the circuit control module includes a controller, a signal conversion unit, a filter unit, a comparator and a first resistor, and the first resistor of the controller The connection end is connected to the first connection end of the signal conversion unit, the second connection end of the signal conversion unit and the first connection end of the comparator are connected to the second connection end of the controller, and the comparison The second connection end of the filter, the first connection end of the filter unit, the third connection end of the controller, and the first connection end of the first resistor are commonly connected to the first connection end of the photosensitive element, so The third connection end of the comparator, the second connection end of the filter unit, the second connection end of the photosensitive element and the third connection end of the photosensitive element are connected to the power supply unit in common, and the fourth connection end of the photosensitive element The connection ends are respectively connected to the third connection end and the fourth connection end of the controller, the second connection end of the first resistor, the fourth connection end of the comparator and the sixth connection end of the controller Both are connected to the power supply unit, the fifth connection end of the comparator is connected to the signal amplification output module, and the seventh connection end of the controller is connected to the communication module.
根据本发明实施例提供的一种机械手末端执行器晶圆检测的光电传感器,所述电路控制模块还包括:According to a photoelectric sensor for wafer detection of a manipulator end effector provided in an embodiment of the present invention, the circuit control module further includes:
第二电阻,所述感光元件的第四连接端与所述第二电阻的第一端连接,所述第二电阻的第二端分别与所述控制器的第三连接端以及第四连接端连接。The second resistor, the fourth connection end of the photosensitive element is connected to the first end of the second resistor, and the second end of the second resistor is respectively connected to the third connection end and the fourth connection end of the controller. connect.
根据本发明实施例提供的一种机械手末端执行器晶圆检测的光电传感器,所述控制器为MCU控制器。According to an embodiment of the present invention, there is provided a photoelectric sensor for wafer detection of a manipulator end effector, wherein the controller is an MCU controller.
根据本发明实施例提供的一种机械手末端执行器晶圆检测的光电传感器,所述信号放大输出模块包括放大器和第三电阻,所述第三电阻的第一连接端与所述比较器的第五连接端连接,所述第三电阻的第二连接端与所述放大器的第一端连接,所述放大器的第二端与所述控制终端连接。According to a photoelectric sensor for wafer detection of a manipulator end effector provided in an embodiment of the present invention, the signal amplification output module includes an amplifier and a third resistor, and the first connection end of the third resistor is connected to the first connection end of the comparator. The five connection terminals are connected, the second connection terminal of the third resistor is connected to the first terminal of the amplifier, and the second terminal of the amplifier is connected to the control terminal.
根据本发明实施例提供的一种机械手末端执行器晶圆检测的光电传感器,所述通讯模块的通讯接口为RS232或RS485。According to a photoelectric sensor for wafer detection of a manipulator end effector provided by an embodiment of the present invention, the communication interface of the communication module is RS232 or RS485.
根据本发明实施例提供的一种机械手末端执行器晶圆检测的光电传感器,所述交互终端为PC,所述控制终端为PLC控制模块。According to a photoelectric sensor for wafer detection of a manipulator end effector provided in an embodiment of the present invention, the interactive terminal is a PC, and the control terminal is a PLC control module.
本发明还提供一种机械手,包括机械手末端执行器,还包括上述任意一项所述的机械手末端执行器晶圆检测的光电传感器,所述感光元件嵌设于所述机械手末端执行器。The present invention also provides a manipulator, including a manipulator end effector, and a photoelectric sensor for wafer detection of the manipulator end effector described in any one of the above, wherein the photosensitive element is embedded in the manipulator end effector.
本发明实施例提供的机械手末端执行器晶圆检测的光电传感器,通过电路控制模块将感应信号与阈值进行比对,进而可以确定晶圆的状态;通过对感光元件的输入光的亮度进行调节,并根据感光元件感应的晶圆的规格对阈值进行调节,以使得感光元件可以检测不同规格晶圆的状态,确保感光元件对于不同规格的晶圆都具有较高的准确度,增大了感光元件的使用范围。The photoelectric sensor for wafer detection of the manipulator end effector provided by the embodiment of the present invention compares the sensing signal with the threshold value through the circuit control module, and then can determine the state of the wafer; by adjusting the brightness of the input light of the photosensitive element, And adjust the threshold according to the specifications of the wafer sensed by the photosensitive element, so that the photosensitive element can detect the state of wafers of different specifications, ensure that the photosensitive element has high accuracy for wafers of different specifications, and increase the size of the photosensitive element range of use.
附图说明Description of drawings
为了更清楚地说明本发明或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作一简单地介绍,显而易见地,下面描述中的附图是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the present invention or the technical solutions in the prior art, the accompanying drawings that need to be used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the accompanying drawings in the following description are the present invention. For some embodiments of the invention, those skilled in the art can also obtain other drawings based on these drawings without creative effort.
图1是本发明实施例提供的机械手末端执行器的立体结构示意图;FIG. 1 is a schematic diagram of a three-dimensional structure of a manipulator end effector provided by an embodiment of the present invention;
图2是本发明实施例提供的机械手末端执行器晶圆检测的光电传感器的结构示意图;FIG. 2 is a schematic structural diagram of a photoelectric sensor for wafer detection of a manipulator end effector provided by an embodiment of the present invention;
图3是本发明实施例提供的机械手末端执行器晶圆检测的光电传感器的具体电路图。FIG. 3 is a specific circuit diagram of the photoelectric sensor for wafer detection of the manipulator end effector provided by the embodiment of the present invention.
附图标记:Reference signs:
100、感光元件;110、在位传感器;120、偏移传感器;130、上手臂;140、下手臂;200、电路控制模块;210、控制器;220、信号转化单元;230、滤波单元;250、比较器;260、第一电阻;270、第二电阻;300、信号放大输出模块;310、放大器;320、第三电阻;400、通讯模块;500、供电单元;600、控制终端;700、交互终端。100. Photosensitive element; 110. In-position sensor; 120. Offset sensor; 130. Upper arm; 140. Lower arm; 200. Circuit control module; 210. Controller; 220. Signal conversion unit; 230. Filter unit; 250 , comparator; 260, first resistor; 270, second resistor; 300, signal amplification output module; 310, amplifier; 320, third resistor; 400, communication module; 500, power supply unit; 600, control terminal; 700, interactive terminal.
具体实施方式detailed description
下面结合附图和实施例对本发明的实施方式作进一步详细描述。以下实施例用于说明本发明,但不能用来限制本发明的范围。Embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but should not be used to limit the scope of the present invention.
在本发明实施例的描述中,需要说明的是,术语“中心”、“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明实施例和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明实施例的限制。此外,术语“第一”、“第二”、“第三”仅用于描述目的,而不能理解为指示或暗示相对重要性。In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right" , "vertical", "horizontal", "top", "bottom", "inner", "outer" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing this The embodiments and simplified descriptions of the invention do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be construed as limiting the embodiments of the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and should not be construed as indicating or implying relative importance.
在本发明实施例的描述中,需要说明的是,除非另有明确的规定和限定,术语“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体连接;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连。对于本领域的普通技术人员而言,可以具体情况理解上述术语在本发明实施例中的具体含义。In the description of the embodiments of the present invention, it should be noted that unless otherwise specified and limited, the terms "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection, Or integrated connection; it can be mechanical connection or electrical connection; it can be direct connection or indirect connection through an intermediary. Those of ordinary skill in the art can understand the specific meanings of the above terms in the embodiments of the present invention in specific situations.
在本发明实施例中,除非另有明确的规定和限定,第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触,或第一和第二特征通过中间媒介间接接触。而且,第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方,或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方,或仅仅表示第一特征水平高度小于第二特征。In the embodiments of the present invention, unless otherwise specified and limited, the first feature may be in direct contact with the first feature or the first feature and the second feature may pass through the middle of the second feature. Media indirect contact. Moreover, "above", "above" and "above" the first feature on the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. "Below", "beneath" and "beneath" the first feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is less horizontally than the second feature.
在本说明书的描述中,参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明实施例的至少一个实施例或示例中。在本说明书中,对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且,描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外,在不相互矛盾的情况下,本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。In the description of this specification, descriptions referring to the terms "one embodiment", "some embodiments", "example", "specific examples", or "some examples" mean that specific features described in connection with the embodiment or example , structure, material or feature is included in at least one embodiment or example of the embodiments of the present invention. In this specification, the schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine different embodiments or examples and features of different embodiments or examples described in this specification without conflicting with each other.
下面结合图1-图3描述本发明实施例的机械手末端执行器晶圆检测的光电传感器。The photoelectric sensor for wafer detection of the manipulator end effector according to the embodiment of the present invention will be described below with reference to FIGS. 1-3 .
图1示例了本发明实施例提供的机械手末端执行器的立体结构示意图,如图1所示,本发明的光电传感器设置于机械手末端执行器上,在介绍光电传感器之前,先对机械手末端执行器进行介绍。由于末端执行器是在狭小受限的空间内传送晶圆,因此末端执行器的尺寸是受限的,尤其是厚度。将R-θ大气真空机械手设计成双臂模式,即上手臂130和下手臂140,双臂之间的距离固定为10mm±0.1。如图1所示,光电传感器可以是设置于机械手末端执行器上的在位传感器110,也可以是偏移传感器120。光电传感器嵌入在末端指定器的凹槽内,凹槽的深度小于末端执行器的厚度(3mm),本发明的光电传感器设置于下手臂140时,可避开上手臂130的干涉,提高了检测精度。Fig. 1 illustrates the schematic diagram of the three-dimensional structure of the end effector of the manipulator provided by the embodiment of the present invention. As shown in Fig. 1, the photoelectric sensor of the present invention is arranged on the end effector of the manipulator. Before introducing the photoelectric sensor, the end effector of the manipulator is first Make an introduction. Since the end effector transfers wafers in a small and restricted space, the size of the end effector is limited, especially the thickness. The R-θ atmospheric vacuum manipulator is designed as a double-arm mode, that is, an
图2示例了本发明实施例提供的机械手末端执行器晶圆检测的光电传感器的结构示意图,如图2所示,机械手末端执行器晶圆检测的光电传感器包括感光元件100和电路控制模块200,感光元件100用于感应晶圆的状态并输出感应信号。电路控制模块200与感光元件100电连接,电路控制模块200用于接收感应信号并将感应信号与阈值进行比对,以确定晶圆的状态;还用于调节感光元件100的输入光的亮度,并根据感光元件100感应的晶圆的规格对阈值进行调节。由于不同规格的晶圆的反光率也不相同,在更换不同的晶圆时,晶圆的反光率也会发生变化,因此需要对感光元件100的输入光的亮度和阈值进行调节,以使光电传感器可以对不同规格晶圆的状态进行准确识别。通过对阈值进行调节,可消除上手臂末端执行器背面材料反光产生的影响。FIG. 2 illustrates a schematic structural diagram of a photoelectric sensor for wafer detection of a manipulator end effector provided by an embodiment of the present invention. As shown in FIG. 2 , the photoelectric sensor for wafer detection of a manipulator end effector includes a
本发明实施例提供的机械手末端执行器晶圆检测的光电传感器,通过电路控制模块200将感应信号与阈值进行比对,进而可以确定晶圆的状态;通过对感光元件100的输入光的亮度进行调节,并根据感光元件100感应的晶圆的规格对阈值进行调节,以使得感光元件100可以检测不同规格晶圆的状态,确保感光元件100对于不同规格的晶圆都具有较高的准确度,增大了感光元件100的使用范围。The photoelectric sensor for wafer detection of the manipulator end effector provided by the embodiment of the present invention compares the sensing signal with the threshold value through the
在本发明的实施例中,机械手末端执行器晶圆检测的光电传感器还包括信号放大输出模块300,信号放大输出模块300分别与电路控制模块200和控制终端600电连接,信号放大输出模块300既起到电路控制模块200的输出电路的功能,也起到控制终端600的输入电路的功能。信号放大输出模块300一方面用于对电路控制模块200输出的信号进行放大处理后输出给控制终端600,通过对信号进行放大处理,使得电路控制模块200输出信号满足控制终端600输入模块的接口要求。控制终端600为PLC控制模块,当然控制终端600的类型并不限定于此,还可以为其他类型的控制器210。另一方面,信号放大输出模块300还用于在电路控制模块200与控制终端600之间起到电气隔离的作用。In the embodiment of the present invention, the photoelectric sensor for wafer detection of the manipulator end effector also includes a signal
在本发明的实施例中,机械手末端执行器晶圆检测的光电传感器还包括通讯模块400,通讯模块400分别与电路控制模块200和交互终端700电连接。通讯模块400用于实现电路控制模块200与交互终端700之间的通讯,通讯模块400的通讯接口为RS232或RS485。交互终端700为PC,通讯模块400通过通讯接口直接与PC进行连接,PC设置有显示和人机交互界面,可监控目前的感光量和阈值大小,操作人员可直接通过人机交互界面进行调节。In the embodiment of the present invention, the photoelectric sensor for wafer detection of the manipulator end effector further includes a
在本发明的实施例中,图3示例了本发明实施例提供的机械手末端执行器晶圆检测的光电传感器的具体电路图,如图3所示,电路控制模块200包括控制器210、信号转化单元220、滤波单元230、比较器250和第一电阻260,控制器210的第一连接端与信号转化单元220的第一连接端连接,信号转化单元220的第二连接端与比较器250的第一连接端共接控制器210的第二连接端,比较器250的第二连接端、滤波单元230的第一连接端、控制器210的第三连接端以及第一电阻260的第一连接端共接感光元件100的第一连接端,比较器250的第三连接端、滤波单元230的第二连接端、感光元件100的第二连接端以及感光元件100的第三连接端共接供电单元500,感光元件100的第四连接端分别与控制器210的第三连接端以及第四连接端连接,第一电阻260的第二连接端、比较器250的第四连接端以及控制器210的第六连接端均与供电单元500连接,比较器250的第五连接端与信号放大输出模块300连接,控制器210的第七连接端与通讯接口连接。In an embodiment of the present invention, FIG. 3 illustrates a specific circuit diagram of a photoelectric sensor for wafer detection of a manipulator end effector provided in an embodiment of the present invention. As shown in FIG. 3 , the circuit control module 200 includes a controller 210, a signal conversion unit 220, filter unit 230, comparator 250 and first resistor 260, the first connection end of controller 210 is connected with the first connection end of signal conversion unit 220, the second connection end of signal conversion unit 220 is connected with the first connection end of comparator 250 One connection terminal is connected to the second connection terminal of the controller 210, the second connection terminal of the comparator 250, the first connection terminal of the filter unit 230, the third connection terminal of the controller 210 and the first connection terminal of the first resistor 260 The first connection end of the photosensitive element 100 is connected in common, the third connection end of the comparator 250, the second connection end of the filter unit 230, the second connection end of the photosensitive element 100, and the third connection end of the photosensitive element 100 are commonly connected to the power supply unit 500, the fourth connection end of the photosensitive element 100 is respectively connected with the third connection end and the fourth connection end of the controller 210, the second connection end of the first resistor 260, the fourth connection end of the comparator 250 and the controller 210 The sixth connection end is connected to the power supply unit 500 , the fifth connection end of the comparator 250 is connected to the signal amplification output module 300 , and the seventh connection end of the controller 210 is connected to the communication interface.
在本发明的实施例中,如图3所示,电路控制模块200还包括第二电阻270,感光元件100的第四连接端与第二电阻270的第一端连接,第二电阻270的第二端分别与控制器210的第三连接端以及第四连接端连接。In an embodiment of the present invention, as shown in FIG. 3 , the
在本发明的实施例中,控制器210为MCU控制器210,控制器210一方面用于实现调节感光元件100输入光的亮度,另一方面对比较器250的阈值进行调节,可以让感光元件100因晶圆规格的不同引起反光量的不同,以适应不同环境的需求,进行可靠的检测。同时,该控制器210还能对感光状态和阈值进行检测,参考检测值进行响应调节。In the embodiment of the present invention, the
在本发明的实施例中,如图3所示,信号放大输出模块300包括放大器310和第三电阻320,第三电阻320的第一连接端与比较器250的第五连接端连接,第三电阻320的第二连接端与放大器310的第一端连接,放大器310的第二端与控制终端600连接。实际应用中必须将感光元件100的信号反馈给设备的控制系统,该发明主要将信号接入常用的PLC控制模块中,因此在比较器25信号后面又接入放大器310,第一是设计适合PLC接入模块的电路,第二放大器310使控制电路与PLC控制模块之间起到电气隔离的作用,防止两个模块间的互相干扰。In an embodiment of the present invention, as shown in FIG. 3 , the signal
本发明还提供一种机械手,包括机械手末端执行器,还包括上述任意一项实施例所述的机械手末端执行器晶圆检测的光电传感器,感光元件100嵌设于机械手末端执行器。The present invention also provides a manipulator, including a manipulator end effector, and a photoelectric sensor for wafer detection of the manipulator end effector described in any one of the above embodiments, where the
最后应说明的是:以上实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: it can still be Modifications are made to the technical solutions described in the foregoing embodiments, or equivalent replacements are made to some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.
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