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CN115437225A - Method for drawing photoetching process window - Google Patents

Method for drawing photoetching process window Download PDF

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CN115437225A
CN115437225A CN202211153950.9A CN202211153950A CN115437225A CN 115437225 A CN115437225 A CN 115437225A CN 202211153950 A CN202211153950 A CN 202211153950A CN 115437225 A CN115437225 A CN 115437225A
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process window
judgment result
poisson
convex
curves
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董立松
韦亚一
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Nanjing Chengxin Integrated Circuit Technology Research Institute Co ltd
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Nanjing Chengxin Integrated Circuit Technology Research Institute Co ltd
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G03F7/70558Dose control, i.e. achievement of a desired dose
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274Photolithographic processes

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  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

The invention relates to the technical field of development of a photoetching process, in particular to a method for drawing a photoetching process window, which is used for obtaining exposure results and constraint conditions of a pattern with a specific characteristic size under different defocusing amounts and different exposure doses; drawing two Poisson curves based on the exposure result and the constraint condition; judging whether the two poisson curves and the head and tail points of the poisson curves form the concavity and the convexity of a closed area to obtain a judgment result; and based on the judgment result, drawing the maximum area ellipse in the new closed region according to the convex optimization principle to obtain the process window, wherein the method realizes the rapid drawing of the process window by dividing the irregular closed region into convex sets by utilizing the characteristics of rapidness and high efficiency of convex optimization, draws the elliptical process window at the speed of 0.11s, does not need to designate the starting point of elliptical search at any position, and meets the requirement of rapidly drawing the process window.

Description

一种绘制光刻工艺窗口的方法A Method for Drawing Photolithography Process Window

技术领域technical field

本发明涉及光刻工艺开发技术领域,尤其涉及一种绘制光刻工艺窗口的方法。The invention relates to the technical field of photolithography process development, in particular to a method for drawing a photolithography process window.

背景技术Background technique

光刻技术是集成电路制造中的关键技术,负责将掩模图形转移到硅片上,光刻图形转移的效果受到多种因素的影响,其中离焦量变化、曝光剂量变化是其中常见的两种因素。Lithography technology is a key technology in integrated circuit manufacturing. It is responsible for transferring mask patterns to silicon wafers. The effect of photolithography pattern transfer is affected by many factors, among which the change of defocus amount and the change of exposure dose are two common ones. factors.

在投影光学光刻系统中,对于给定的特征尺寸,能够得到理想线宽的成像位置称为最佳焦面位置。相似地,能够得到理想线宽的曝光剂量称为最佳曝光剂量。实际光刻工艺中,最佳焦面位置容易受到像差、掩模三维效应等影响产生一定的变化,且不同图形对应的最佳曝光剂量是不同的。In the projection optical lithography system, for a given feature size, the imaging position that can obtain the ideal line width is called the best focal plane position. Similarly, the exposure dose that can obtain the ideal line width is called the optimal exposure dose. In the actual photolithography process, the position of the best focal plane is susceptible to certain changes due to aberrations, three-dimensional effects of the mask, etc., and the optimal exposure doses corresponding to different patterns are different.

为了准确的得到最佳曝光剂量和最佳焦面位置,需要对相同的掩模图形在不同的曝光剂量和不同离焦量情形下进行曝光,将所得的光刻胶特征尺寸用点列图表述成泊松曲线的形式。由于工程中一般认为线宽变化的范围在10%以内都是满足成像质量要求,因此从泊松曲线中可以描绘出满足这一质量要求的曝光剂量和离焦量变化范围,为了定量描述工艺窗口的大小,一般在上述范围中描绘出最大面积的椭圆,用椭圆的横轴宽度表示焦深,用纵轴高度表示曝光剂量范围。为了在非规则闭合区域内描绘椭圆,传统方法多采用定点搜索、多轮尝试的方式,具有周期较长的问题。In order to accurately obtain the optimal exposure dose and the optimal focal plane position, it is necessary to expose the same mask pattern under different exposure doses and different defocusing amounts, and the resulting photoresist feature size is expressed in a point diagram in the form of a Poisson curve. Since it is generally believed in engineering that the range of line width variation within 10% meets the imaging quality requirements, the exposure dose and defocus variation range that meets this quality requirement can be depicted from the Poisson curve, in order to quantitatively describe the process window Generally, an ellipse with the largest area is drawn in the above range, the width of the horizontal axis of the ellipse represents the depth of focus, and the height of the vertical axis represents the exposure dose range. In order to draw an ellipse in an irregular closed area, traditional methods mostly use fixed-point search and multiple rounds of trials, which has the problem of a long cycle.

发明内容Contents of the invention

本发明的目的在于提供一种绘制光刻工艺窗口的方法,旨在解决传统椭圆绘制工艺窗口周期长,绘制速度慢的问题。The purpose of the present invention is to provide a method for drawing a photolithography process window, aiming at solving the problems of long period of traditional ellipse drawing process window and slow drawing speed.

为实现上述目的,本发明提供了一种绘制光刻工艺窗口的方法,包括以下步骤:To achieve the above object, the present invention provides a method for drawing a photolithographic process window, comprising the following steps:

获取特定特征尺寸图形在不同离焦量和不同曝光剂量下的曝光结果及约束条件;Obtain the exposure results and constraints of specific feature size graphics under different defocus amounts and different exposure doses;

基于所述曝光结果和所述约束条件绘制两条泊松曲线;drawing two Poisson curves based on the exposure result and the constraints;

判断两条所述泊松曲线和所述泊松曲线的首尾点构成闭合区域的凹凸性,得到判断结果;Judging the concavity and convexity of the closed area formed by the two Poisson curves and the first and last points of the Poisson curves to obtain a judgment result;

基于所述判断结果根据凸优化的原理描绘新闭合区域中的最大面积椭圆,得到工艺窗口。Based on the judgment result, an ellipse with the largest area in the new closed area is drawn according to the principle of convex optimization to obtain the process window.

其中,所述约束条件包括数据的单位、横纵向分布所代表的物理意义和线宽约束范围。Wherein, the constraint condition includes the unit of the data, the physical meaning represented by the horizontal and vertical distribution, and the line width constraint range.

其中,所述线宽约束范围为0.225um~0.275um。Wherein, the line width restriction range is 0.225um˜0.275um.

其中,所述判断结果包括凸多边形和凹多边形中的任意一种。Wherein, the judgment result includes any one of a convex polygon and a concave polygon.

其中,所述基于所述判断结果根据凸优化的原理描绘新闭合区域中的最大面积椭圆,得到工艺窗口的具体方式:Wherein, the specific way of obtaining the process window is to draw the maximum area ellipse in the new closed area according to the principle of convex optimization based on the judgment result:

如果所述判断结果为所述凸多边形,则根据凸优化的原理,描绘新闭合区域中的最大面积椭圆,如果所述判断结果为所述凹多边形,则从所述凹多边形中寻找所述凸多边形,再根据凸优化的原理,描绘新闭合区域中的最大面积椭圆。If the judgment result is the convex polygon, then according to the principle of convex optimization, draw the largest area ellipse in the new closed area, if the judgment result is the concave polygon, then find the convexity from the concave polygon Polygon, and then according to the principle of convex optimization, describe the largest area ellipse in the new closed area.

本发明的一种绘制光刻工艺窗口的方法,获取特定特征尺寸图形在不同离焦量和不同曝光剂量下的曝光结果及约束条件;基于所述曝光结果和所述约束条件绘制两条泊松曲线;判断两条所述泊松曲线和所述泊松曲线的首尾点构成闭合区域的凹凸性,得到判断结果;基于所述判断结果根据凸优化的原理描绘新闭合区域中的最大面积椭圆,得到工艺窗口,该方法建立了一种绘制光刻工艺窗口的方法与流程,综合考虑了光刻成像时不同曝光剂量、不同离焦量下曝光结果的泊松曲线特征,充分利用凸优化快速高效的特点,将不规则的闭合区域分割为凸集的方式实现了工艺窗口的快速绘制,且解决了搜索结果对起点位置的依赖问题,并以0.11s的速度绘制了椭圆工艺窗口,且无需在任何位置指定椭圆搜索的起点,达到了快速绘制工艺窗口的要求,该方法对实验数据或仿真数据进行快速的工艺窗口分析,并结合数据分析结果,快速得到多个图形的重叠工艺窗口大小,解决传统椭圆绘制工艺窗口周期长,绘制速度慢的问题。A method for drawing a photolithography process window of the present invention obtains the exposure results and constraint conditions of graphics with specific feature sizes under different defocus amounts and different exposure doses; draws two Poisson graphs based on the exposure results and the constraint conditions curve; judging two described Poisson curves and the concavo-convexity of the closed area formed by the first and last points of the Poisson curve, and obtaining a judgment result; based on the judgment result, the maximum area ellipse in the new closed area is described according to the principle of convex optimization, The process window is obtained. This method establishes a method and process for drawing the lithography process window, which comprehensively considers the Poisson curve characteristics of the exposure results under different exposure doses and different defocus amounts during lithography imaging, and makes full use of convex optimization to quickly and efficiently The feature of dividing the irregular closed area into convex sets realizes the rapid drawing of the process window, and solves the dependence of the search results on the starting point position, and draws the ellipse process window at a speed of 0.11s, and does not need to be in the Specify the starting point of the ellipse search at any position, which meets the requirements of quickly drawing the process window. This method quickly analyzes the process window of the experimental data or simulation data, and combines the data analysis results to quickly obtain the overlapping process window size of multiple graphics. The problem of traditional ellipse drawing process window is long and drawing speed is slow.

附图说明Description of drawings

为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. Those skilled in the art can also obtain other drawings based on these drawings without creative work.

图1是本发明提供的一种绘制光刻工艺窗口的方法的泊松曲线示意图。FIG. 1 is a schematic diagram of a Poisson curve of a method for drawing a photolithography process window provided by the present invention.

图2是本发明提供的一种绘制光刻工艺窗口的方法所述判断结果的结构示意图。FIG. 2 is a schematic structural diagram of the judgment result of a method for drawing a photolithography process window provided by the present invention.

图3是椭圆工艺窗口分布的结构示意图。Fig. 3 is a schematic structural diagram of the distribution of elliptical process windows.

图4是本发明提供的一种绘制光刻工艺窗口的方法的流程图。FIG. 4 is a flowchart of a method for drawing a photolithography process window provided by the present invention.

图5是特定特征尺寸图形在不同离焦量、不同曝光剂量下的曝光结果图。Fig. 5 is a graph of exposure results of a specific feature size pattern under different defocus amounts and different exposure doses.

具体实施方式detailed description

下面详细描述本发明的实施例,所述实施例的示例在附图中示出,其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的,旨在用于解释本发明,而不能理解为对本发明的限制。Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

请参阅图1至图5,本发明提供一种绘制光刻工艺窗口的方法,包括以下步骤:Please refer to Fig. 1 to Fig. 5, the present invention provides a kind of method of drawing photolithography process window, comprises the following steps:

S1获取特定特征尺寸图形在不同离焦量和不同曝光剂量下的曝光结果及约束条件;S1 Obtain the exposure results and constraints of a specific feature size pattern under different defocus amounts and different exposure doses;

具体的,所述约束条件包括数据的单位、横纵向分布所代表的物理意义和线宽约束范围,特定特征尺寸图形在不同离焦量、不同曝光剂量下的曝光结果如图5所示,图5中第一行表示离焦量,单位为um,第一列表示曝光剂量,单位为mJ/cm2,其余数据表示曝光结果的线宽值,单位为um,所述线宽约束范围为±10%,中心线宽为0.25um,即所述线宽约束范围为0.225um~0.275um。Specifically, the constraints include the unit of data, the physical meaning represented by the horizontal and vertical distribution, and the line width constraint range. The exposure results of specific feature size graphics under different defocus amounts and different exposure doses are shown in Figure 5. In 5, the first line indicates the defocus amount, the unit is um, the first column indicates the exposure dose, the unit is mJ/cm2, and the rest of the data indicate the line width value of the exposure result, the unit is um, and the line width constraint range is ±10 %, the central line width is 0.25um, that is, the line width restriction range is 0.225um-0.275um.

S2基于所述曝光结果和所述约束条件绘制两条泊松曲线;S2 drawing two Poisson curves based on the exposure result and the constraints;

具体的,首先排除数据中第一行和第一列等与曝光结果线宽值无关的数据;然后对所述曝光结果的线宽值进行三次样条插值;然后将介于0.225um和0.275um之间的线宽值置为1,其他值置为0;最后描绘出数值为1区域的边界,获取了满足0.225um和0.275um要求的两条所述泊松曲线,曲线内部的线宽则处于二者之间,如图1所示。Specifically, first exclude the data in the first row and the first column of the data that has nothing to do with the line width value of the exposure result; then perform cubic spline interpolation on the line width value of the exposure result; The line width value between is set to 1, and the other values are set to 0; finally, the boundary of the area with a value of 1 is drawn, and the two Poisson curves meeting the requirements of 0.225um and 0.275um are obtained, and the line width inside the curve is between the two, as shown in Figure 1.

S3判断两条所述泊松曲线和所述泊松曲线的首尾点构成闭合区域的凹凸性,得到判断结果;S3 judging the concavo-convexity of the closed area formed by the two Poisson curves and the first and last points of the Poisson curves, and obtaining a judgment result;

具体的,所述判断结果包括凸多边形和凹多边形中的任意一种。Specifically, the judgment result includes any one of a convex polygon and a concave polygon.

S4基于所述判断结果根据凸优化的原理描绘新闭合区域中的最大面积椭圆,得到工艺窗口。S4 Based on the judgment result, draw an ellipse with the largest area in the new closed area according to the principle of convex optimization to obtain the process window.

具体方式:Specific ways:

S41如果所述判断结果为所述凸多边形,则根据凸优化的原理,描绘新闭合区域中的最大面积椭圆,如果所述判断结果为所述凹多边形,则从所述凹多边形中寻找所述凸多边形,再根据凸优化的原理,描绘新闭合区域中的最大面积椭圆。S41 If the judgment result is the convex polygon, then according to the principle of convex optimization, draw the largest area ellipse in the new closed area, if the judgment result is the concave polygon, then find the concave polygon from the concave polygon. Convex polygon, and then according to the principle of convex optimization, describe the largest area ellipse in the new closed area.

具体的,圆点泊松曲线的顶点限制了多边形的凹凸性,以顶点为起点,描绘出一条直线,即可将该多边形变为所述凸多边形,如下图2所示,根据凸优化的原理,描绘新闭合区域中的最大面积椭圆,凸优化的原理如下所示:Specifically, the vertex of the dot Poisson curve limits the concavo-convexity of the polygon. Using the vertex as the starting point, draw a straight line to convert the polygon into the convex polygon, as shown in Figure 2 below. According to the principle of convex optimization , depicting the largest area ellipse in the new closed area, the principle of convex optimization is as follows:

椭球的一般性公式可以表示为The general formula for an ellipsoid can be expressed as

ε={Bu+d|||u||2≤1}ε={Bu+d|||u|| 2 ≤ 1}

凸多边形的封闭区域可以表示为The enclosed area of a convex polygon can be expressed as

Figure BDA0003857594140000041
Figure BDA0003857594140000041

最大面积的椭圆的求解方式可以表示为The solution to the ellipse with the largest area can be expressed as

maximize log det Bmaximize log det B

Figure BDA0003857594140000042
Figure BDA0003857594140000042

上式中,C表示一般性的封闭区域,i表示顶点的序号,B表示椭圆长轴的半宽度,d表示椭圆中心相对于原点的平移距离,x表示闭合区域的顶点坐标,a和b为根据不等式拟合出来的矩阵和向量,T表示矩阵的转置,m表示闭合区域顶点的数目,椭圆工艺窗口的分布如图3所示。In the above formula, C represents a general closed area, i represents the serial number of the vertex, B represents the half-width of the major axis of the ellipse, d represents the translation distance of the center of the ellipse relative to the origin, x represents the vertex coordinates of the closed area, and a and b are According to the matrix and vector fitted by the inequality, T represents the transposition of the matrix, m represents the number of vertices in the closed area, and the distribution of the ellipse process window is shown in Figure 3.

上图的椭圆绘制用时为0.11s,且无需在任何位置指定椭圆搜索的起点,从图3中可以看出,利用新的椭圆工艺窗口绘制流程,可以实现椭圆的快速绘制,且解决了搜索结果对起点位置的依赖问题。The drawing time of the ellipse in the figure above is 0.11s, and there is no need to specify the starting point of the ellipse search at any position. As can be seen from Figure 3, using the new drawing process of the ellipse process window, the fast drawing of the ellipse can be realized, and the search result can be solved Dependency on the starting position.

以上所揭露的仅为本发明一种专利名称较佳实施例而已,当然不能以此来限定本发明之权利范围,本领域普通技术人员可以理解实现上述实施例的全部或部分流程,并依本发明权利要求所作的等同变化,仍属于发明所涵盖的范围。What is disclosed above is only a preferred embodiment of the patent title of the present invention, and of course it cannot limit the scope of rights of the present invention. Those of ordinary skill in the art can understand the whole or part of the process of realizing the above embodiments, and according to this The equivalent changes made in the claims of the invention still belong to the scope covered by the invention.

Claims (5)

1. A method for drawing a photolithography process window, comprising the steps of:
acquiring exposure results and constraint conditions of the specific feature size graph under different defocus amounts and different exposure doses;
drawing two Poisson curves based on the exposure result and the constraint condition;
judging whether the two poisson curves and the head and tail points of the poisson curves form the concavity and the convexity of a closed area to obtain a judgment result;
and drawing the maximum area ellipse in the new closed region according to the convex optimization principle based on the judgment result to obtain a process window.
2. The method of drawing a photolithography process window of claim 1,
the constraint conditions comprise units of data, physical meanings represented by horizontal and vertical distribution and line width constraint ranges.
3. The method of drawing a photolithography process window of claim 2,
the line width constraint range is 0.225 um-0.275 um.
4. The method of drawing a photolithography process window of claim 1,
the judgment result includes any one of a convex polygon and a concave polygon.
5. The method of drawing a photolithography process window of claim 4,
the specific mode of describing the maximum area ellipse in the new closed region according to the convex optimization principle based on the judgment result to obtain the process window is as follows:
if the judgment result is the convex polygon, depicting the maximum area ellipse in the new closed region according to the convex optimization principle, if the judgment result is the concave polygon, searching the convex polygon from the concave polygon, and depicting the maximum area ellipse in the new closed region according to the convex optimization principle.
CN202211153950.9A 2022-09-21 2022-09-21 Method for drawing photoetching process window Pending CN115437225A (en)

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Publication number Priority date Publication date Assignee Title
EP1434099A1 (en) * 2002-11-28 2004-06-30 ASML Netherlands B.V. Device manufacturing method
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