CN115424573A - Display module and electronic equipment - Google Patents

Abstract

Embodiments of the present application provide a display module and electronic equipment, which belong to the technical field of displays. The display module includes: a substrate, a working voltage terminal VDD circuit, a common ground terminal VSS circuit and a metal film; the substrate includes a first surface and a second surface, the VDD circuit and the VSS circuit are arranged on the first surface, and the metal film is arranged on the second surface. The surface: the substrate includes at least one through hole penetrating from the first surface to the second surface, and the VDD line is also electrically connected with the metal film through the through hole. In the present application, by disposing a metal film on the second surface of the substrate and electrically connecting the metal film to the VDD line through a through hole, the resistance in the line is reduced and the uniformity of light emission of the display module is improved.

Description

Display module and electronic equipment

technical field

The present application relates to the technical field of displays, in particular to a display module and electronic equipment.

Background technique

With the rapid development of the technical field of displays, display functions are realized by displays in various computer devices. Among them, Micro-light emitting diode (Micro-LED) technology is developing rapidly in the display field.

In the Micro-LED display technology, the LED display unit used needs to be continuously driven by current. Therefore, for the LED display unit at different positions in the display panel, the paths through which the current flows are different, and the different paths are also different. It will correspond to different resistances, so different voltage drops will be formed in the display panel, resulting in the IR-drop problem. The farther the LED display unit is from the voltage input terminal, the greater the resistance the current faces, and the IR-drop problem more serious. Therefore, the voltage drop due to the existence of the resistance will cause the circuit voltages of the LED display units at different positions in the display panel to be different, resulting in different brightness of the LED display units and reducing the uniformity of light emission of the Micro-LED display.

Contents of the invention

The embodiment of the present application provides a display module and electronic equipment, which can reduce the resistance of the display circuit in the display module, improve the IRdrop problem, and improve the uniformity of light emission of the display module.

In one aspect, an embodiment of the present application provides a display module, the display module includes a substrate, a working voltage terminal VDD circuit, a common ground terminal VSS circuit, and a metal film;

The substrate includes a first surface and a second surface, the VDD line and the VSS line are arranged on the first surface, and the metal film is arranged on the second surface;

The substrate includes at least one through hole penetrating from the first surface to the second surface, and the VDD line is also electrically connected to the metal film through the through hole.

As an optional implementation manner of the embodiment of the present application, the display module further includes a driving circuit;

The driving circuit is configured to provide the first voltage signal to the metal film while providing the first voltage signal to the VDD line.

As an optional implementation manner of the embodiment of the present application, the VDD line is in a grid shape, and the VSS line is in a grid shape;

Each grid includes a display unit, the voltage input terminal of the display unit is connected to the VDD line, and the ground terminal of the display unit is connected to the VSS line.

As an optional implementation manner of the embodiment of the present application, each of the display units constitutes a display area, and the at least one through hole penetrating from the first surface to the second surface is formed in the display area. Evenly distributed.

As an optional implementation manner of the embodiment of the present application, the thickness of the metal film is between 100 nm and 100 um.

As an optional implementation manner of the embodiment of the present application, the material of the metal film is any one of aluminum Al material, copper Cu material, silver Ag material, and gold Au material.

As an optional implementation manner of the embodiment of the present application, the material of the substrate is a glass material or a flexible material.

As an optional implementation manner of the embodiment of the present application, the through hole is filled with conductive metal;

The VDD line is connected in parallel with the metal film through the conductive metal in the through hole.

As an optional implementation manner of the embodiment of the present application, the diameter of the through hole is less than 60 um.

In another aspect, an embodiment of the present application provides an electronic device, and the electronic device includes at least one display module as described in the above one aspect.

The technical solutions provided by the embodiments of the present application may at least include the following beneficial effects:

The display module of the present application includes: a substrate, a working voltage terminal VDD circuit, a common ground terminal VSS circuit and a metal film; the substrate includes a first surface and a second surface, the VDD circuit and the VSS circuit are arranged on the first surface, and the metal film is arranged on the first surface. The second surface: the substrate includes at least one through hole penetrating from the first surface to the second surface, and the VDD circuit is also electrically connected with the metal film through the through hole. In the present application, by disposing a metal film on the second surface of the substrate and electrically connecting the metal film to the VDD line through a through hole, the resistance in the line is reduced and the uniformity of light emission of the display module is improved.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the accompanying drawings that need to be used in the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For Those of ordinary skill in the art can also obtain other drawings based on these drawings without making creative efforts.

Fig. 1 is a schematic structural diagram of an LED display unit related to an exemplary embodiment of the present application;

Fig. 2 is a schematic structural diagram of a display module provided by an exemplary embodiment of the present application;

Fig. 3 is an exemplary embodiment of the present application related to a cross-sectional view of Fig. 2 divided by a straight line from AB;

Fig. 4 is a schematic structural diagram of a display module provided by an exemplary embodiment of the present application;

Fig. 5 is a top view related to Fig. 4 according to an exemplary embodiment of the present application;

Fig. 6 is a cross-sectional view related to Fig. 4 according to an exemplary embodiment of the present application;

Fig. 7 is a schematic structural diagram of an electronic device provided by an exemplary embodiment of the present application.

detailed description

In order to better understand the above purpose, features and advantages of the present application, the solution of the present application will be further described below. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

In the following description, a lot of specific details have been set forth in order to fully understand the present application, but the present application can also be implemented in other ways different from those described here; obviously, the embodiments in the description are only a part of the present application, and Not all examples.

The terms "first" and "second" in the specification and claims of the present application are used to distinguish different objects, rather than to describe a specific order of objects. For example, the first camera and the second camera are used to distinguish different cameras, not to describe a specific order of the cameras.

In the embodiments of the present application, words such as "exemplary" or "for example" are used as examples, illustrations or illustrations. Any embodiment or design scheme described as "exemplary" or "for example" in the embodiments of the present application shall not be interpreted as being more preferred or more advantageous than other embodiments or design schemes. To be precise, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific manner. In addition, in the description of the embodiments of the present application, unless otherwise specified, the meaning of "plurality" refers to two one or more.

The solution provided by this application can be used in the application scenario where temperature is collected in computer equipment used in people's daily life. For ease of understanding, some nouns and application architectures involved in the embodiments of this application are briefly introduced below.

With the continuous advancement of science and technology, computer equipment is used more and more frequently in daily life, and people can use these computer equipment to study, entertain, work, etc. in daily life. Among them, the display has become one of the indispensable hardware components in the computer equipment.

At present, there are more and more types of displays, such as light emitting diode (light emitting diode, LED) display, active matrix liquid crystal display (Active Matrix Liquid Crystal Display, AM-LCD), active matrix organic light emitting diode (Active Matrix Organic Light-Emitting Diode,, AM-OLED) display, etc. Active Matrix Liquid Crystal Display (AM-LCD) products are widely used in the flat panel display market. However, AM-LCD products have major disadvantages such as slow response time, poor conversion efficiency, and low color saturation. Therefore, active-matrix organic light-emitting diodes (AM-OLEDs) that can overcome these disadvantages have attracted much attention. Compared with AM-LCD, AM-OLED has the advantages of self-illumination, high contrast, fast response and wide viewing angle. Organic electroluminescent diodes have serious aging problems when they have high current to achieve high brightness. Among them, in the driving mode of the display, there are mainly the following two driving modes: passive addressing drive (PM: Passive Matrix, also known as passive addressing, passive addressing, passive drive, etc.) and active addressing Drive (AM: ActiveMatrix, also known as active addressing, active addressing, active drive, etc.).

Among them, no matter which driving method is used, the LED display unit in the display screen needs the driving circuit to continuously provide current. For the LED display unit at different positions on the display panel, the current flow path will be different due to the different positions. Yes, the longer the path through which the current flows, the greater the resistance, forming different voltage drops, and there is an IR-drop problem.

Please refer to FIG. 1 , which shows a schematic structural diagram of an LED display unit according to an exemplary embodiment of the present application. As shown in FIG. 1 , it includes a first LED unit 101 and a second LED unit 102 . In FIG. 1 , other LED units may be included between the first LED unit 101 and the second LED unit 102 , which are not marked here. After the voltage signal is input to each LED unit through the VDD input line on the glass substrate, each LED unit can start to work.

In the above Figure 1, for the circuit on the glass substrate, the sheet resistance of the Al process made of aluminum Al material is generally 0.08Ω (thickness 0.2 ~ 0.5um), and the Cu process sheet resistance of the copper Cu material is generally 0.01 ~ 0.05Ω (thickness 0.3 ~ 1um), in the display panel composed of each LED display unit, assuming that the line width of the VDD line is 10um, then for a 6-inch display screen, the length of the diagonal line is 152.4mm, the The resistance corresponding to the length reaches 152.4Ω～1kΩ. The current received by the LED unit (such as the first LED unit 101 in FIG. 1 ) that is closer to the VDD input line can reach mA level, or even reach the A level, but with the size of the display panel, other VDD input lines that are closer The remote LED unit (such as the second LED unit 102 in FIG. 1 ) usually receives <1mA from the remote end, and the voltage drop can reach 0.1-5V level.

In order to improve the IR-drop problem in the display panel, it can be improved by increasing the input terminals, reducing the current transmission path, or adopting a new compensation circuit, or adopting an auxiliary electrode design. Among them, for the method of adopting the auxiliary electrode design, the auxiliary electrode introduces an additional layer of metal lines into the circuit of the display panel, and connects the metal lines to the electrodes (VDD) of each LED display unit in the underlying circuit. , the display panel is equivalent to connecting a layer of metal lines in parallel to achieve the purpose of reducing resistance. Due to the limited space of the bottom line, and the auxiliary electrode can only be made into a fixed grid shape due to the limitation of the LED display unit during design, usually due to the limitation of the manufacturing process and the display panel, there will still be IR-drop problems, resulting in The brightness of the LED display unit is different, and the uniformity of the Micro-LED display is not high.

In order to further reduce the resistance of the display circuit in the display module, improve the IR-drop problem, and improve the uniformity of light emission of the display module, this application provides a solution by setting a whole piece of metal film on the back of the substrate and combining with The VDD lines are connected in parallel, thus reducing the resistance.

Please refer to FIG. 2 , which shows a schematic structural diagram of a display module provided by an exemplary embodiment of the present application. As shown in FIG. 2 , the display module includes: a substrate 201 , a working voltage terminal VDD line 202 , a common ground terminal VSS line 203 and a metal film 204 .

Wherein, the substrate 201 includes a first surface 201a and a second surface 201b, the VDD line 202 and the VSS line 203 are disposed on the first surface 201a, and the metal film 204 is disposed on the second surface 201b. Optionally, the present application may integrate the working voltage end VDD line 202 and the common ground end VSS line 203 on the first surface 201a by means of an engraving process.

Wherein, the substrate 201 includes at least one through hole 201c penetrating from the first surface to the second surface, and the VDD line 202 is also electrically connected to the metal film 204 through the through hole 201c. Optionally, the through hole 201c may be in the form of a cylinder, and the substrate manufacturer may customize and integrally form it on the substrate in advance during production.

Please refer to FIG. 3 , which shows an exemplary embodiment of the present application related to a cross-sectional view taken along a line AB in FIG. 2 . As shown in FIG. 3 , it includes a substrate 301 , a VDD line 302 , a VSS line 303 and a metal film 304 . In FIG. 3 , the first surface is the upper surface of the substrate 301, the second surface is the lower surface of the substrate 301, the through hole 305 is arranged inside the substrate 301, and the VDD line 302 on the upper surface passes through the through hole 305 and is connected to the lower surface. The metal film 304 on the surface is electrically connected.

Optionally, in combination with the above-mentioned contents of FIG. 2 and FIG. 3, the VDD line 202 provided on the first surface 201a of the display module is electrically connected to the metal film 204 through each through hole 201c on the substrate, and the display module During use, when power is supplied to each LED unit on the display panel through the VDD line 202, the voltage drop between each LED unit at different positions on the first surface 201a can be reduced through the metal film 204 on the back side, thereby reducing the display die. The resistance of the circuit is displayed in the group to improve the IR-drop problem.

To sum up, the display module of the present application includes: a substrate, a working voltage terminal VDD circuit, a common ground terminal VSS circuit and a metal film; the substrate includes a first surface and a second surface, and the VDD circuit and the VSS circuit are arranged on the first surface , the metal film is disposed on the second surface; the substrate includes at least one through hole penetrating from the first surface to the second surface, and the VDD line is also electrically connected to the metal film through the through hole. In the present application, by disposing a metal film on the second surface of the substrate and electrically connecting the metal film to the VDD line through a through hole, the resistance in the line is reduced and the uniformity of light emission of the display module is improved.

In a possible implementation manner, the display module provided by the present application further includes a driving circuit, and the driving circuit is electrically connected to the VDD line, the VSS line and the metal film in the display module respectively, and supplies power to the VDD line, the VSS line and the metal film. An electrical signal is input into the metal film to make each display unit in the display panel manufactured based on the display module of the present application work.

Please refer to FIG. 4 , which shows a schematic structural diagram of a display module provided by an exemplary embodiment of the present application. As shown in FIG. 4 , the display module includes: a substrate 401 , a working voltage terminal VDD line 402 , a common ground terminal VSS line 403 and a metal film 404 .

Wherein, the substrate 401 includes a first surface 401a and a second surface 401b, the VDD line 402 and the VSS line 403 are disposed on the first surface 401a, and the metal film 404 is disposed on the second surface 401b. Optionally, the present application may integrate the working voltage end VDD line 402 and the common ground end VSS line 403 on the first surface 401a by means of an engraving process.

Wherein, the substrate 401 includes at least one through hole 401c penetrating from the first surface to the second surface, and the VDD line 402 is also electrically connected to the metal film 404 through the through hole 401c. Optionally, the through hole 401c may be in the form of a cylinder, and the substrate manufacturer may customize and integrally form it on the substrate in advance during production.

Optionally, the display module of the present application further includes a driving circuit 405 for providing the first voltage signal to the VDD line 402 and simultaneously providing the first voltage signal to the metal film 404 .

Wherein, the driving circuit 405 serves as the main power source for the display module, the VDD output end of the driving circuit 405 is electrically connected to the VDD line 402 , and the VSS output end of the driving circuit 405 is electrically connected to the VSS line 403 . In this application, the driving circuit 405 is also electrically connected to the metal film 404 on the second surface, and when the first voltage signal is input to VDD, the first voltage signal is also input to the metal film 404 . For example, while the drive circuit 405 inputs a 12V voltage signal to the VDD line through the VDD output terminal, the drive circuit 405 also inputs a 12V voltage signal to the metal film 404, so that the voltage drop between the two is lower, reducing the number of display units at different positions. The difference of the voltage signal received by the VDD line reduces the resistance of the display module.

Optionally, the driving circuit 405 may be directly electrically connected to the metal film 404 through the VDD output terminal, or may be separately provided with an output terminal electrically connected to the metal film 404, so as to realize the above-mentioned provision of the first voltage signal to the VDD line 402. At the same time, the first voltage signal is provided to the metal film 404 , and the method of inputting the first voltage signal into the metal film 404 is not limited in the present application.

Optionally, in this application, the VDD line 402 is grid-shaped, and the VSS line 403 is also grid-shaped; and each grid contains a display unit, and the voltage input end of the display unit is connected to the VDD line, and the display The ground terminal of the unit is connected to the VSS line. That is to say, in this application, each grid can correspond to an LED display unit, and the VDD input terminal and the VSS input terminal of the LED display unit are respectively electrically connected to the VDD line 402 and the VSS line 403 on the substrate, and the LED display unit The driving circuit 405 operates when a voltage signal is input to the VDD line 402 and the VSS line 403 .

Optionally, each of the display units constitutes a display area, and at least one through hole penetrating from the first surface to the second surface is uniformly distributed in the display area. In the present application, each display unit finally constitutes the display area of the display module, and each through hole can be uniformly distributed in the display area in an array. For example, please refer to FIG. 5 , which shows a top view of an exemplary embodiment of the present application related to FIG. 4 . As shown in FIG. 5 , it includes a display area 501 and various through holes 502 . As shown in FIG. 5 , each through hole 502 is uniformly distributed in the display area in a square manner. The arrangement mode may be directly set by the substrate manufacturer when manufacturing the substrate. Optionally, the distribution manner of the above-mentioned squares is also an example, and may also be other regular figures such as triangles, circles, and rectangles in practical applications.

Optionally, in this application, each display unit may also be regarded as each pixel in the display panel, corresponding to each pixel, the number of through holes may be the same as the number of pixels. That is, the number of the above-mentioned through holes can be at most the same as the number of each display unit, so as to reduce the current transmission path when the VDD input voltage signal of each display unit is input, reduce the voltage drop difference between each display unit, and improve the display performance. Uniformity.

Optionally, the thickness of the metal film 404 is between 100nm and 100um. Wherein, in the present application, the thickness of the metal film 404 on the second surface can be made as thick as possible without affecting the warpage of the substrate, so as to improve the effect of reducing the resistance of this solution. Alternatively, in this application, the substrate manufacturer can also pre-calculate the required thickness of the metal film 404 in combination with the IR-drop simulation results and actual product requirements, and increase the resistance reduction effect of this solution by appropriately increasing the thickness. The thickness of the above-mentioned metal film 404 is between 100 nm and 100 um is also exemplary, and can also be adjusted to other thicknesses according to the requirements of actual products, which is not limited in this application.

Optionally, the material of the metal film 404 is any one of aluminum Al material, copper Cu material, silver Ag material, and gold Au material. That is, pure metal materials are used. In this application, in order to increase the light extraction rate of the display module, metal materials with high reflectivity to light can be used, such as Al, Ag, etc., which can increase the reflection of light and increase the light extraction efficiency. In addition, as the metal layer, it also has the function of shielding the electric field existing toward the second surface, which can improve the reliability of the display module. Optionally, the material of the metal film 404 in this application may also be other mixed materials, such as nano-indium tin oxide ITO material and the like.

Optionally, the material of the substrate 401 is glass material or flexible material. That is, in the present application, a customized through-hole glass can be used as the substrate, or a flexible circuit board can be used, and corresponding through holes can be made in the flexible circuit board to implement.

Optionally, conductive metal is poured into the through hole; the VDD line 402 is connected in parallel with the metal film 404 through the conductive metal in the through hole. Wherein, the material of the conductive metal and the metal film 404 may be the same or different. For example, conductive metals such as Fe, Cu, Al, and Au can be poured into the through holes to realize electrical conduction. Optionally, the conductive metal poured into the through hole may or may not fill the entire inner space of the through hole, as long as the VDD line 402 is electrically connected to the metal film 404 . Optionally, the diameter of the above-mentioned through holes is less than 60um.

Please refer to FIG. 6 , which shows a cross-sectional view of an exemplary embodiment of the present application related to FIG. 4 . As shown in FIG. 6 , it includes a VDD line 601 , a substrate 602 , a metal film 603 , a through hole 604 , and a conductive metal 605 . Wherein, as shown in FIG. 6 , the conductive metal 605 poured into the through hole 604 fills the entire inner space of the through hole, the diameter of the above-mentioned through hole is 60 um, and the thickness of the substrate is 300 um. Optionally, for the display module shown in FIG. 6, the manufacturer can first customize the glass substrate 602 with through holes 604, and pour conductive metal 605 into the glass substrate to realize the production of the substrate, and then the substrate in FIG. 6 The VDD line and VSS line are made on the first surface (upper surface) of the substrate, the whole set of process is completed, the LED display unit transfer, packaging and other steps are performed, and then the second surface (lower surface) of the substrate is plated with a metal film 603 by distillation, Finally, a protective film (for example, polyvinyl chloride resin PV, silicon dioxide SiO ₂ , silicon nitride SiNx, etc.) is evaporated on the metal film 603 to improve the oxidation resistance of the metal film. Optionally, in the above manufacturing process, the metal film on the second surface can also be fabricated first, and then the VDD line and VSS line on the first surface can be fabricated to improve the static electricity problem.

Optionally, the shape of the through hole may be cylindrical as shown in the figure above, or may be in the shape of a truncated cone, a cuboid, a cube, a triangle, etc., which is not limited in the present application.

It should be noted that in this application, the method of reducing the resistance by connecting the VDD line and the metal film in parallel is also applicable to the VSS line. For example, the VSS line is connected in parallel with the metal film through the through hole, and the second voltage signal is input to the VSS line through the VSS output terminal of the drive circuit, and the second voltage signal is also input to the metal film, which can also reduce the resistance. effect, which will not be repeated here.

Optionally, the present application can also combine the following methods to further reduce the resistance. For example, thicker metal can be used to reduce impedance, or metal lines can be added to reduce impedance, or metal materials with lower resistivity can be selected, such as Cu metal instead of Al to reduce impedance.

To sum up, the display module of the present application includes: a substrate, a working voltage terminal VDD circuit, a common ground terminal VSS circuit and a metal film; the substrate includes a first surface and a second surface, and the VDD circuit and the VSS circuit are arranged on the first surface , the metal film is disposed on the second surface; the substrate includes at least one through hole penetrating from the first surface to the second surface, and the VDD line is also electrically connected to the metal film through the through hole. In the present application, by disposing a metal film on the second surface of the substrate and electrically connecting the metal film to the VDD line through a through hole, the resistance in the line is reduced and the uniformity of light emission of the display module is improved.

In addition, this application also inputs the same voltage signal as the VDD line to the metal film through the driving circuit, which can further reduce the resistance and improve the IR-drop problem. In this application, the metal film is arranged on the opposite side of the substrate from the VDD line, It is not affected by the width and thickness of the VDD line or the VSS line, and the improvement effect is better.

Fig. 7 is a schematic structural diagram of an electronic device provided by an exemplary embodiment of the present application. As shown in FIG. 7 , the electronic device 700 includes a central processing unit (Central Processing Unit, CPU) 701, a system memory including a random access memory (Random Access Memory, RAM) 702 and a read only memory (Read Only Memory, ROM) 703 704, and a system bus 705 connecting the system memory 704 and the central processing unit 701. The electronic device 700 also includes a basic transmission/output system (Input/Output System, I/O system) 706 that helps to transmit information between various devices in the computer, and is configured to store an operating system 712, an application program 713 and other programs Mass storage device 707 of module 714 .

The basic transmission/output system 706 includes a display 706 configured to display information and a transmission device 709 such as a mouse and a keyboard configured to transmit information to a user. Both the display 706 and the transmission device 709 are connected to the central processing unit 701 through a transmission output controller 710 connected to the system bus 705 . The basic transmission/output system 706 may also include a transmission output controller 710 configured to receive and process transmissions from a number of other devices such as a keyboard, mouse, or electronic stylus. Similarly, transmit output controller 710 also provides output to a display screen, printer, or other type of output device.

The mass storage device 707 is connected to the central processing unit 701 through a mass storage controller (not shown) connected to the system bus 705 . The mass storage device 707 and its associated computer-readable media provide non-volatile storage for the electronic device 700 . That is to say, the mass storage device 707 may include a computer-readable medium (not shown) such as a hard disk or a CD-ROM (Compact Disc Read-Only Memory, CD-ROM) drive.

The computer readable media may include computer storage media and communication media. Computer storage media includes volatile and nonvolatile, removable and non-removable media implemented in any method or technology configured for storage of information such as computer readable instructions, data structures, program modules or other data. Computer storage media include RAM, ROM, EPROM (Erasable Programmable Read Only Memory, erasable programmable read-only memory), EEPROM (Electrically Erasable Programmable Read-Only Memory, electrically erasable programmable read-only memory), flash memory or other solid state Storage technology, CD-ROM, DVD (Digital Video Disc, high-density digital video disc) or other optical storage, cassette, tape, disk storage or other magnetic storage devices. Certainly, those skilled in the art know that the computer storage medium is not limited to the above-mentioned ones. The above-mentioned system memory 704 and mass storage device 707 may be collectively referred to as memory.

The electronic device 700 can be connected to the Internet or other network devices through the network interface unit 711 connected to the system bus 705 . The memory also includes one or more programs stored in the memory.

Optionally, the electronic device provided in the present application may include at least one display module as shown in the embodiment of FIG. 1 or FIG. 2 . Optionally, the above-mentioned electronic devices can be mobile phones, television sets, tablet computers, notebook computers, smart glasses, smart watches, MP3 players (Moving Picture Experts Group Audio Layer III, moving picture experts compression standard audio layer 3), MP4 ( Moving Picture Experts Group Audio Layer IV, moving picture experts compress standard audio layer 4) Players, laptop portable computers, smart wearable devices and other devices with displays.

Optionally, in this application, the driving circuit in the display module can be arranged on a flexible circuit board (FPC) or a glass substrate, and combined with a rigid circuit board (Printed Circuit Board, PCB), each pixel circuit in the MicroLED light board , the display process can refer to the working principle in FIG. 2 or FIG. 3 , which will not be repeated here. In addition, the more the number of the above-mentioned through holes, the cost of the through holes in the present application will increase accordingly, and the size of the through holes will occupy the area on the first surface, and the screen pixel density (Pixels Per Inch, When the PPI) is high, the density of the through holes on the first surface can be appropriately reduced to reduce the number of designed through holes.

The above is an example of a display module and electronic equipment disclosed in the embodiment of the present application. In this paper, an example is used to illustrate the principle and implementation of the present application. The description of the above embodiment is only configured to help understand the application. method and its core idea; at the same time, for those of ordinary skill in the art, according to the idea of this application, there will be changes in the implementation and scope of application. In summary, the content of this specification should not be understood as the limits.

Claims (10)

1. A display module is characterized by comprising a substrate, a working voltage end VDD line, a common ground end VSS line and a metal film;

the substrate comprises a first surface and a second surface, the VDD line and the VSS line are arranged on the first surface, and the metal film is arranged on the second surface;

the substrate comprises at least one through hole penetrating from the first surface to the second surface, and the VDD line is electrically connected with the metal film through the through hole.

2. The display module of claim 1, further comprising a driving circuit;

the driving circuit is used for providing a first voltage signal to the VDD line and simultaneously providing the first voltage signal to the metal film.

3. The display module of claim 1, wherein the VDD line is in a grid pattern and the VSS line is in a grid pattern;

each grid comprises a display unit, the voltage input end of each display unit is connected with the VDD line, and the grounding end of each display unit is connected with the VSS line.

4. The display module of claim 3, wherein each display unit forms a display area, and the at least one through hole penetrating from the first surface to the second surface is uniformly distributed in the display area.

5. The display module of any one of claims 1-4, wherein the thickness of the metal film is between 100nm and 100 um.

6. The display module according to any one of claims 1 to 4, wherein the material of the metal film is any one of an aluminum Al material, a copper Cu material, a silver Ag material and a gold Au material.

7. The display module according to any one of claims 1 to 4, wherein the substrate is made of a glass material or a flexible material.

8. The display module of any one of claims 1 to 4, wherein the through holes are filled with a conductive metal;

the VDD line is connected in parallel with the metal film through the conductive metal in the through hole.

9. The display module of any one of claims 1-4, wherein the diameter of the through hole is less than 60um.

10. An electronic device, comprising at least one display module of any one of claims 1-9.

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