CN115410956A - Wafer preheating device for degassing preheating cavity and manufacturing method thereof - Google Patents
Wafer preheating device for degassing preheating cavity and manufacturing method thereof Download PDFInfo
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- CN115410956A CN115410956A CN202210853522.0A CN202210853522A CN115410956A CN 115410956 A CN115410956 A CN 115410956A CN 202210853522 A CN202210853522 A CN 202210853522A CN 115410956 A CN115410956 A CN 115410956A
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- 238000007872 degassing Methods 0.000 title claims abstract description 73
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 238000007789 sealing Methods 0.000 claims abstract description 155
- 238000010438 heat treatment Methods 0.000 claims abstract description 92
- 229910052751 metal Inorganic materials 0.000 claims description 30
- 239000002184 metal Substances 0.000 claims description 30
- 238000003466 welding Methods 0.000 claims description 28
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 15
- 239000000395 magnesium oxide Substances 0.000 claims description 14
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 13
- 229910000838 Al alloy Inorganic materials 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 238000003756 stirring Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 230000035515 penetration Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 238000009434 installation Methods 0.000 abstract description 7
- 235000012431 wafers Nutrition 0.000 description 22
- 230000000694 effects Effects 0.000 description 12
- 239000012212 insulator Substances 0.000 description 4
- 229910052573 porcelain Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
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Abstract
The invention provides a wafer preheating device for a degassing preheating cavity, which comprises a lining (1) matched with the degassing preheating cavity in shape, a flexible heating pipe (2) and a sealing device (3), wherein a spiral groove (101) is formed in the outer side surface of the lining (1), the spiral groove (101) uniformly extends towards the upper end and the lower end of the lining (1), the shape of the spiral groove (101) is matched with that of the flexible heating pipe (2), the flexible heating pipe (2) is embedded in the spiral groove (101) and arranged around the outer side surface of the lining (1), and the sealing device (3) is hermetically sleeved on the flexible heating pipe (2). The invention also provides a manufacturing method of the wafer preheating device for the degassing preheating cavity. When the preheating device is used, the original degassing preheating cavity is not required to be removed, the wafer can be preheated, the preheating is more uniform, the installation and the removal are more convenient, the vacuum degree of the degassing preheating cavity can be ensured, and the degassing efficiency and the yield of the wafer are effectively improved.
Description
Technical Field
The invention relates to the field of semiconductor equipment, in particular to a wafer preheating device for a degassing preheating cavity and a manufacturing method thereof.
Background
In a semiconductor manufacturing process, when a wafer is subjected to an etching process, the wafer needs to be degassed by placing the wafer in a degassing chamber and heating the wafer to remove water vapor, oxygen and volatile liquid substances on the wafer. If the removal is not complete, the residual substances can prevent the efficiency of the film formation on the surface of the wafer by the process and influence the quality of the film formation, thus leading to the rapid increase of the rejection rate. In order to promote the degasification effect and improve degasification efficiency, place the wafer in the degasification before the degasification and preheat the intracavity earlier and preheat, what conventional degasification preheats the chamber and adopts is stainless steel, utilizes the radiation of stainless steel mirror surface to heat, but this scheme has the inhomogeneous condition of temperature, seriously influences the yields of degasification efficiency and product, and the degasification preheats the chamber demolish the degree of difficulty big to it is big to maintain clean degree of difficulty. Therefore, a new technical solution is needed to solve at least one of the above problems.
Disclosure of Invention
The invention aims to provide a wafer preheating device for a degassing preheating cavity, which can preheat wafers without dismantling the original degassing preheating cavity, has more uniform preheating and more convenient installation and dismantling, can ensure the vacuum degree of the degassing preheating cavity, and effectively improves the degassing efficiency and the yield of the wafers. The invention also provides a manufacturing method of the wafer preheating device for the degassing preheating cavity, which is used for manufacturing the preheating device.
In order to achieve the technical purpose and achieve the technical requirements, the invention adopts the technical scheme that: the utility model provides a wafer preheating device for degasification preheating chamber, includes and preheats chamber shape assorted inside lining, flexible heating pipe, sealing device with the degasification, the lateral surface of inside lining is equipped with spiral groove, spiral groove evenly extends to the upper and lower both ends of inside lining, the shape of spiral groove and the shape phase-match of flexible heating pipe, flexible heating pipe inlays to be established in spiral groove to set up around the lateral surface of inside lining, sealing device seal cover is established on flexible heating pipe.
Preferably, the liner is square, and the spiral grooves are arranged along 4 outer sides of the liner.
As the preferred technical scheme, the sealing device comprises a sealing shaft, a sealing plate fixedly sleeved on the sealing shaft, a sealing pipe and a fixing plate, wherein the sealing plate is connected with the fixing plate through the sealing pipe, the sealing shaft is sleeved on the flexible heating pipe in a sealing manner, one end of the flexible heating pipe penetrates through the fixing plate, and the sealing plate is connected with the sealing shaft in a sealing manner.
According to a preferable technical scheme, the sealing tube is a metal corrugated tube, the metal corrugated tube is arranged between the sealing plate and the fixing plate, and two ends of the metal corrugated tube are fixedly connected with the sealing plate and the fixing plate respectively.
As the preferred technical scheme, both ends of the sealing shaft are provided with threaded sections, the threaded sections are sleeved with screw caps, and the sealing plate is arranged between 2 screw caps.
Preferably, the sealing plate has a stepped structure.
According to a preferable technical scheme, the flexible heating pipe is an armored heating pipe, and the armored heating pipe comprises a shell, a magnesium oxide knob insulator arranged in the shell, a heating wire arranged in the magnesium oxide knob insulator and a thermocouple wire arranged in the magnesium oxide knob insulator.
As the preferred technical scheme, the lining is made of aluminum alloy.
The invention also provides a manufacturing method of the wafer preheating device for the degassing preheating cavity, which comprises the following steps:
s1, processing according to the size of the degassing preheating cavity to obtain a lining;
s2, selecting the type of the flexible heating pipe, and processing a spiral groove on the outer surface of the lining according to the size of the flexible heating pipe;
s3, embedding the flexible heating pipe into the spiral groove, so that the flexible heating pipe is wound on the outer surface of the lining;
and S4, processing according to a drawing to obtain a sealing device, and laser welding the sealing device to the flexible heating pipe. .
As a preferred technical solution, the step S1 specifically operates as follows: the lining is made of aluminum alloy, the size of the lining is determined according to the size of the degassing preheating cavity, the lining is split into a plurality of rolled aluminum plates, and then the rolled aluminum plates are subjected to penetration welding forming by friction stir welding.
The beneficial effects of the invention are:
1) The shape of the lining is matched with that of the degassing preheating cavity, the lining can be directly placed into the degassing preheating cavity, the original degassing preheating cavity does not need to be removed, the spiral grooves are uniformly formed, the flexible heating pipe can be uniformly wound on the outer side surface of the lining, the preheating temperature is more uniform, the inlet of the flexible heating pipe is sealed through the sealing device to ensure enough vacuum degree, meanwhile, the installation and the disassembly are more convenient, the flexible heating pipe is integrally removed when the flexible heating pipe needs to be cleaned, and then the flexible heating pipe is removed to directly clean the lining, so that the degassing efficiency and the yield of wafers can be effectively improved by the preheating device;
2) Preferably, the flexible heating pipe is sealed and sleeved with the sealing shaft to form sealing, and then the sealing plate is sleeved on the sealing shaft and flexibly connected with the fixing plate, so that the position of the fixing plate can be adjusted, the fixing plate is conveniently connected with the outer part of the degassing preheating cavity, further, the sealing plate is connected with the fixing plate through the metal corrugated pipe, and the metal corrugated pipe has flexibility, good temperature resistance, good pressure resistance and good sealing performance and has a good compensation effect;
3) Preferably, the sealing plate is clamped through the nut, so that the fixing effect is good, and the mounting and the dismounting are convenient;
4) Preferably, after the screw cap is screwed down, the stress of the step structure is more reasonable;
5) Preferably, the armored heating pipe is high-temperature resistant, high in integration level, good in flexibility, good in heating effect and long in service life;
6) Preferably, the aluminum alloy material has light weight and better heating uniformity.
Drawings
FIG. 1 is a three-dimensional view of one embodiment provided by the present invention;
FIG. 2 is a partial block diagram of a spiral groove in one embodiment of the present invention;
FIG. 3 is a front view of a sealing device in one embodiment provided by the present invention;
FIG. 4 isbase:Sub>A cross-sectional view A-A of FIG. 3;
in fig. 1-4, 1, the liner; 101. a spiral groove; 2. a flexible heating tube; 201. a housing; 202. a magnesia knob insulator; 203. heating wires; 204. a thermocouple wire; 3. a sealing device; 301. a seal shaft; 302. a sealing plate; 3021. a connecting portion; 3022. a two-section step part; 3023. a sealing groove; 303. sealing the tube; 304. a fixing plate; 305. a nut; 4. and (5) sealing rings.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
Referring to fig. 1-4, the invention provides a wafer preheating device for a degassing preheating chamber, comprising a lining 1 matched with the degassing preheating chamber in shape, a flexible heating tube 2 and a sealing device 3, wherein the outer side surface of the lining 1 is provided with a spiral groove 101, the spiral groove 101 uniformly extends towards the upper end and the lower end of the lining 1, the flexible heating tube is circular, the shape of the spiral groove 101 is arc-shaped and is matched with the shape of the flexible heating tube 2, the flexible heating tube 2 is embedded in the spiral groove 101 and is arranged around the outer side surface of the lining 1, the sealing device 3 is hermetically sleeved on the flexible heating tube 2, because the original preheating chamber has the problem of uneven preheating, in order to achieve a good preheating effect under the condition that the original degassing preheating chamber is not removed, the lining 1 in the preheating device is designed according to the size of the degassing preheating chamber, so that the lining 1 can be placed in a degassing preheating cavity, in order to realize the uniform preheating effect of the lining 1, the outer side surface of the lining 1 is provided with a spiral groove 101, a flexible heating pipe 2 is embedded in the spiral groove 101, the spiral groove 101 uniformly extends to the upper end and the lower end of the lining 1 to form an equidistant spiral structure, the flexible heating pipe 2 is uniformly wound on the outer side surface of the lining 1, the good uniform preheating effect can be realized, the degassing preheating cavity is provided with a through hole for the flexible heating pipe 2 to extend out, the through hole is blocked by a sealing device 3, the sealing performance is good, the vacuum degree is better, the integral installation and disassembly are more convenient, when in need of cleaning, the lining 1 is taken up, then the flexible heating pipe 2 is disassembled, and the lining 1 can be disassembled and cleaned, the preheating device of the invention does not need to disassemble the original degassing preheating cavity, the preheating device is simple to operate, is more uniform in preheating, is good in preheating effect, is convenient to clean, and effectively improves the degassing efficiency and the yield of wafers.
As shown in fig. 1 to 4, in some embodiments, the liner 1 is square, the spiral groove 101 is disposed along 4 outer side surfaces of the liner 1, and the degassing preheating chamber is mostly square, so that the liner 1 is made into a square structure matching with the degassing preheating chamber, and two ends of the spiral groove 101 extend around the 4 outer side surfaces to the upper and lower ends of the liner 1 respectively.
As shown in fig. 1 to 4, in some embodiments, the sealing device 3 includes a sealing shaft 301, a sealing plate 302 fixedly fitted on the sealing shaft 301, a sealing tube 303, and a fixing plate 304, the sealing plate 302 is connected to the fixing plate 304 through the sealing tube 303, the sealing shaft 301 is sealingly fitted on the flexible heating tube 2, one end of the flexible heating tube 2 passes through the fixing plate 304, the sealing plate 302 is sealingly connected to the sealing shaft 301, further, the sealing device 3 includes a sealing shaft 301, a sealing plate 302 fixedly fitted on the sealing shaft 301, a sealing tube 303, and a fixing plate 304, the sealing plate 302 is connected to the fixing plate 304 through the sealing tube 303, the sealing shaft 301 is sealingly fitted on the flexible heating tube 2, one end of the flexible heating tube 2 passes through the sealing shaft 301, the sealing tube 303, and the fixing plate 304, the sealing plate 302 is sealingly connected to the sealing shaft 301, the fixing plate 304 is provided with a plurality of threaded holes which are uniformly arrayed in a circumference based on the central axis of the fixing plate 304, the sealing shaft 301 and the flexible heating tube 2 are connected by laser welding to ensure the sealing performance, meanwhile, the sealing plate 302 is arranged on the sealing shaft 301, a metal corrugated tube is arranged between the fixing plate 304 and the sealing plate 302, two ends of the metal corrugated tube are respectively welded with the sealing plate 302 and the fixing plate 304 together, the outer diameter of the sealing plate 302 is smaller than that of the fixing plate 304 and is not larger than that of the sealing plate 302, the metal corrugated tube is hermetically matched with the through hole on the degassing preheating cavity to form sealing, the fixing plate 304 is arranged on the outer surface of the degassing preheating cavity and is tightly connected with the degassing preheating cavity through a bolt, the fixing plate 304 is compensated and connected due to the flexibility of the metal corrugated tube, and the fixing plate 304 is prevented from being well attached and tightly connected with the degassing preheating cavity, the installation flexibility is better, and metal bellows also has better compensation effect when preheating simultaneously, and metal bellows sealing performance is good.
As shown in fig. 1 to 4, in some embodiments, the sealing shaft 301 has two ends and a threaded section, the threaded section is sleeved with a nut 305, the sealing plate 302 is disposed between 2 nuts 305, and the sealing plate 302 is fixed between 2 nuts 305 by tightening the nuts 305, so that the sealing plate is convenient to mount and dismount and has a good fixing effect.
As shown in fig. 1 to 4, in some embodiments, the sealing plate 302 has a step structure, and further, the sealing plate 302 includes a connecting portion 3021, 2 two step portions 3022 are symmetrically disposed on two sides of the connecting portion 3021, the connecting portion 3021 is connected to the metal bellows, and the two step portions 3022 abut against the nut 305 to form a limit, so as to fix the sealing plate 302.
Further, the inner wall of closing plate 302 is equipped with seal groove 3023, the embedded sealing washer 4 that is equipped with of seal groove 3023, it is further, the quantity of seal groove 3023 is 2, and the quantity of sealing washer 4 is 2, and closing plate 302 has fine sealed effect with sealed axle 301 like this, makes sealing device 3 have good sealing performance through closing plate 302 and the cooperation of corrugated metal pipe to through sealed axle 301 and 2 laser weldings of flexible heating pipe, make whole sealing performance better, the vacuum is good.
As shown in fig. 1 to 4, in some embodiments, the flexible heating pipe 2 is an armored heating pipe, the armored heating pipe includes a housing 201, a magnesium oxide knob 202 disposed in the housing 201, a heating wire 203 disposed in the magnesium oxide knob 202, and thermocouple wires 204 disposed in the magnesium oxide knob 202, the armored heating pipe is high temperature resistant, high in integration level, good in flexibility, good in heating effect, and long in service life, further, the magnesium oxide knob 202 is of a four-core structure, the number of the heating wire 203 is 2, the number of the thermocouple wires 204 is 2, and a temperature probe is further integrated in the armored heating pipe, and the temperature probe is electrically connected to the thermocouple wires 204 for measuring temperature.
As shown in fig. 1-4, in some embodiments, the material of the liner 1 is an aluminum alloy, which has a thermal conductivity far better than that of stainless steel, and has better preheating uniformity.
The invention also provides a manufacturing method of the wafer preheating device for the degassing preheating cavity, which comprises the following steps:
s1, processing according to the size of the degassing preheating cavity to obtain a lining 1, further, selecting an aluminum alloy as a material of the lining 1, splitting the lining 1 into a plurality of rolled aluminum plates after determining the size of the lining 1 according to the size of the degassing preheating cavity, and then performing penetration welding forming on the plurality of rolled aluminum plates by using friction stir welding, wherein the friction stir welding has the characteristics of low welding temperature, small joint residual stress, small deformation of a welding workpiece and the like, and is suitable for a welding process of an aluminum alloy sheet;
s2, selecting the type of the flexible heating pipe 2, processing equidistant spiral grooves 101 on the outer surface of the lining 1 according to the size of the flexible heating pipe 2, wherein the spiral grooves 101 are fully arranged on the outer side surface of the lining 1 as much as possible, so that the flexible heating pipe 2 is more fully preheated after being installed;
s3, placing the lining 1 into a degassing preheating cavity, wherein a through hole is formed in the degassing preheating cavity, extending the flexible heating pipe 2 into the through hole, and then embedding the flexible heating pipe 2 into the spiral groove 101, so that the flexible heating pipe 2 is wound on the outer surface of the lining 1;
s4, processing according to a drawing to obtain a sealing device 3, laser welding the sealing device 3 to the flexible heating pipe 2, further, the sealing device 3 comprises a sealing shaft 301, a sealing plate 302 fixedly sleeved on the sealing shaft 301, a metal corrugated pipe and a fixing plate 304, manufacturing the sealing shaft 301, the sealing plate 302, the metal corrugated pipe and the fixing plate 304 according to the drawing, laser welding the sealing shaft 301 to the heating pipe, installing a sealing ring 4 in a sealing groove 3023 of the sealing plate 302, sleeving the sealing plate 302 on the sealing shaft 301, screwing nuts 305 on thread portions at two ends of the sealing shaft 301 to fix the sealing plate 302, sleeving the metal corrugated pipe, welding one end of the metal corrugated pipe with the sealing plate 302, and welding the other end of the metal corrugated pipe with the fixing plate 304 to obtain the preheating device.
Examples
Referring to fig. 1-4, a wafer preheating device for degassing preheating chamber comprises a square lining 1, an armored heating tube and a sealing device 3, wherein 4 outer side surfaces of the lining 1 are wound with spiral grooves 101, the spiral grooves 101 uniformly extend to the upper end and the lower end of the lining 1, the shape of the spiral grooves 101 is matched with that of the flexible heating tube 2, the armored heating tube comprises a shell 201, a magnesium oxide porcelain column 202 arranged in the shell 201, a heating wire 203 arranged in the magnesium oxide porcelain column 202, and a thermocouple wire 204 arranged in the magnesium oxide porcelain column 202, the armored heating tube is embedded in the spiral grooves 101 and arranged around the outer side surface of the lining 1, the sealing device 3 comprises a sealing shaft 301, a sealing plate 302 fixedly sleeved on the sealing shaft 301, a metal corrugated tube and a fixing plate 304, the sealing plate 302 is connected with the fixing plate 304 through the metal corrugated tube, the metal corrugated pipe is arranged between the sealing plate 302 and the fixing plate 304, two ends of the metal corrugated pipe are respectively connected with the sealing plate 302 and the fixing plate 304, the sealing shaft 301 is sleeved on the armored heating pipe and is connected with the armored heating pipe through laser welding, one end of the armored heating pipe penetrates through the fixing plate 304, the sealing plate 302 is in sealing connection with the sealing shaft 301, two ends of the sealing shaft 301 are provided with threaded sections, the threaded sections are sleeved with nuts 305, the sealing plate 302 is arranged between 2 nuts 305, the sealing plate 302 comprises a connecting part 3021, 2 two-section step parts 3022 are symmetrically arranged on two sides of the connecting part 3021, the connecting part 3021 is connected with the metal corrugated pipe, the two-section step parts 3022 are abutted to form limit, and the lining 1 is made of aluminum alloy.
A manufacturing method of a wafer preheating device for a degassing preheating cavity comprises the following steps:
s1, determining the size of a lining 1 according to the size of a degassing preheating cavity, splitting the lining 1 into a plurality of rolled aluminum plates, and then performing penetration welding forming on the plurality of rolled aluminum plates by using friction stir welding, wherein the friction stir welding has the characteristics of low welding temperature, small joint residual stress, small deformation of a welding workpiece and the like, and is suitable for a welding process of an aluminum alloy sheet;
s2, selecting the type of the armored heating pipe, processing equidistant spiral grooves 101 on the outer surface of the lining 1 according to the size of the armored heating pipe, and winding the spiral grooves 101 on 4 outer side surfaces of the lining 1 as full as possible;
s3, placing the lining 1 into a degassing preheating cavity, wherein a through hole is formed in the degassing preheating cavity, extending the flexible heating pipe 2 into the through hole, and then embedding the flexible heating pipe 2 into the spiral groove 101, so that the flexible heating pipe 2 is wound on the outer surface of the lining 1;
s4, manufacturing a sealing shaft 301, a sealing plate 302, a metal corrugated pipe and a fixing plate 304 according to a drawing, laser welding the sealing shaft 301 to a heating pipe, installing a sealing ring 4 in a sealing groove 3023 of the sealing plate 302, sleeving the sealing plate 302 on the sealing shaft 301, screwing a nut 305 on a threaded portion at two ends of the sealing shaft 301 to fix the sealing plate 302, sleeving the metal corrugated pipe, welding one end of the metal corrugated pipe with the sealing plate 302, and welding the other end of the metal corrugated pipe with the fixing plate 304 to obtain the preheating device.
The sealed cooperation of the through-hole on the preheating device of this embodiment's the bellows and the degasification preheating chamber, then pass through the bolt, preheat chamber fastening connection with fixed plate and degasification, whole sealing device just can fix like this, and sealed axle and the bellows form double seal, vacuum is better, the installation is accomplished the back, open the armor heating pipe and preheat, learn through the practice, the preheating device cost control of this embodiment is good, light in weight, the installation is maintained conveniently, need not to change original degasification and preheat the chamber and just can realize better temperature distribution, good cleanliness factor and vacuum have, through even effectual preheating, can promote the efficiency and the yields of wafer degasification by a wide margin.
Performance testing
1. Temperature uniformity and maximum operating temperature
5-7 areas are divided and selected on the lining, the preheating device works for 30 +/-5 min, a thermodetector is used for measuring the temperature of the areas, the temperature difference change is less than +/-1.5%, the temperature uniformity is good, and the highest working temperature is 200 ℃.
2. Air release rate
During operation, the volatile condensables collected were < 0.1% and the total mass lost was < 1%.
3. Sealing property
After the preheating device in the embodiment is installed, the sealing device is correctly installed in place, the degassing preheating cavity is integrally subjected to conventional sealing treatment, a helium leak detector is used for testing, and the leakage rate is measured to be less than 1 × 10E-9 STD CC/SEC.
4. Degree of vacuum
After the preheating device in the embodiment is installed, the degassing preheating cavity is integrally subjected to conventional sealing treatment, and the vacuum degree of the degassing preheating cavity is 10-8torr.
The foregoing examples are given solely for the purpose of illustrating the invention and are not to be construed as limiting the embodiments, and other variations and modifications in form thereof will be suggested to those skilled in the art upon reading the foregoing description, and it is not necessary or necessary to exhaustively enumerate all embodiments and all such obvious variations and modifications are deemed to be within the scope of the invention.
Claims (10)
1. The utility model provides a wafer preheating device for degasification preheating chamber, its characterized in that includes and preheats chamber shape assorted inside lining (1), flexible heating pipe (2), sealing device (3) with the degasification, the lateral surface of inside lining (1) is equipped with spiral groove (101), spiral groove (101) evenly extend to the upper and lower both ends of inside lining (1), the shape of spiral groove (101) and the shape phase-match of flexible heating pipe (2), flexible heating pipe (2) inlay and establish in spiral groove (101) to the lateral surface setting around inside lining (1), sealing device (3) sealing cover is established on flexible heating pipe (2).
2. The wafer preheating device for degassing preheating chamber according to claim 1, wherein the liner (1) is square, and the spiral groove (101) is disposed along 4 outer side surfaces of the liner (1).
3. The wafer preheating device for the degassing preheating chamber according to claim 1, wherein the sealing device (3) comprises a sealing shaft (301), a sealing plate (302) fixedly sleeved on the sealing shaft (301), a sealing tube (303), and a fixing plate (304), the sealing plate (302) is connected with the fixing plate (304) through the sealing tube (303), the sealing shaft (301) is hermetically sleeved on the flexible heating tube (2), one end of the flexible heating tube (2) penetrates through the fixing plate (304), and the sealing plate (302) is hermetically connected with the sealing shaft (301).
4. The wafer preheating apparatus for degassing preheating chamber as claimed in claim 3, wherein the sealing tube (303) is a metal bellows, the metal bellows is disposed between the sealing plate (302) and the fixing plate (304), and two ends of the metal bellows are respectively fixedly connected to the sealing plate (302) and the fixing plate (304).
5. The wafer preheating device for degassing preheating chamber according to claim 4, wherein the sealing shaft (301) has a threaded portion at both ends, the threaded portion is sleeved with a nut (305), and the sealing plate (302) is disposed between 2 nuts (305).
6. The wafer preheating apparatus for degas preheating chamber as set forth in claim 5, wherein the sealing plate (302) is a step structure.
7. The wafer preheating device for the degassing preheating cavity according to claim 1, wherein the flexible heating tube (2) is an armored heating tube, and the armored heating tube comprises a shell (201), a magnesium oxide knob (202) arranged in the shell (201), a heating wire (203) arranged in the magnesium oxide knob (202), and a thermocouple wire (204) arranged in the magnesium oxide knob (202).
8. A wafer preheating device for degassing preheating chamber according to any one of claims 1 to 7, characterized in that the material of the lining (1) is selected from aluminum alloy.
9. The method as claimed in claim 1, further comprising the steps of:
s1, processing according to the size of the degassing preheating cavity to obtain a lining (1);
s2, selecting the type of the flexible heating pipe (2), and processing a spiral groove (101) on the outer surface of the lining (1) according to the size of the flexible heating pipe (2);
s3, embedding the flexible heating pipe (2) into the spiral groove (101), so that the flexible heating pipe (2) is wound on the outer surface of the lining (1);
and S4, processing according to a drawing to obtain a sealing device (3), and laser welding the sealing device (3) to the flexible heating pipe (2).
10. The manufacturing method according to claim 9, wherein the step S1 is specifically operated as follows: the lining (1) is made of aluminum alloy, the size of the lining (1) is determined according to the size of the degassing preheating cavity, the lining (1) is split into a plurality of rolled aluminum plates, and then the rolled aluminum plates are subjected to penetration welding forming by friction stir welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05157463A (en) * | 1991-12-02 | 1993-06-22 | Mitsubishi Heavy Ind Ltd | Heating furnace |
| US6008477A (en) * | 1997-02-18 | 1999-12-28 | Tokyo Electron Limited | Heat treatment apparatus |
| CN201895389U (en) * | 2010-07-29 | 2011-07-13 | 深圳市精控机电有限公司 | Embedded heating hot nozzle structure used for precisely controlling hot runner |
| CN210341006U (en) * | 2019-08-14 | 2020-04-17 | 佛山市顺德区矗泰金属热处理有限公司 | Tempering device for heat treatment production of corrugated shaft |
| CN213260947U (en) * | 2020-09-11 | 2021-05-25 | 苏州拓福热流道系统有限公司 | Ultra-thin heating jacket for high-glass-fiber plastic molding |
-
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- 2022-07-09 CN CN202210853522.0A patent/CN115410956B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05157463A (en) * | 1991-12-02 | 1993-06-22 | Mitsubishi Heavy Ind Ltd | Heating furnace |
| US6008477A (en) * | 1997-02-18 | 1999-12-28 | Tokyo Electron Limited | Heat treatment apparatus |
| CN201895389U (en) * | 2010-07-29 | 2011-07-13 | 深圳市精控机电有限公司 | Embedded heating hot nozzle structure used for precisely controlling hot runner |
| CN210341006U (en) * | 2019-08-14 | 2020-04-17 | 佛山市顺德区矗泰金属热处理有限公司 | Tempering device for heat treatment production of corrugated shaft |
| CN213260947U (en) * | 2020-09-11 | 2021-05-25 | 苏州拓福热流道系统有限公司 | Ultra-thin heating jacket for high-glass-fiber plastic molding |
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| CN115410956B (en) | 2024-03-01 |
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