CN115401337B - Ceramic substrate scribing processing method and system based on ultrafast laser - Google Patents
Ceramic substrate scribing processing method and system based on ultrafast laser Download PDFInfo
- Publication number
- CN115401337B CN115401337B CN202110606525.XA CN202110606525A CN115401337B CN 115401337 B CN115401337 B CN 115401337B CN 202110606525 A CN202110606525 A CN 202110606525A CN 115401337 B CN115401337 B CN 115401337B
- Authority
- CN
- China
- Prior art keywords
- laser
- ceramic substrate
- scribing
- crack
- ultrafast laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 144
- 239000000919 ceramic Substances 0.000 title claims abstract description 127
- 238000003672 processing method Methods 0.000 title claims abstract description 14
- 238000012545 processing Methods 0.000 claims abstract description 66
- 238000000034 method Methods 0.000 claims abstract description 48
- 230000000007 visual effect Effects 0.000 claims abstract description 41
- 230000008569 process Effects 0.000 claims abstract description 25
- 239000011521 glass Substances 0.000 claims description 14
- 238000013507 mapping Methods 0.000 claims description 14
- 238000004891 communication Methods 0.000 claims description 7
- 239000013589 supplement Substances 0.000 claims description 4
- 230000007246 mechanism Effects 0.000 description 26
- 230000007306 turnover Effects 0.000 description 24
- 238000001179 sorption measurement Methods 0.000 description 20
- 239000000463 material Substances 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 239000000047 product Substances 0.000 description 5
- 230000035939 shock Effects 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 230000003993 interaction Effects 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 238000003754 machining Methods 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000010330 laser marking Methods 0.000 description 2
- 206010041662 Splinter Diseases 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to the technical field of laser processing, in particular to a ceramic substrate scribing processing method and system based on ultrafast laser. The method comprises the following steps: adjusting the focal position of the ultrafast laser to be positioned on the first surface of the ceramic substrate, and processing a visual positioning mark on the first surface; scribing the first surface according to the first laser processing parameters and the scribing file to generate a first crack combination; turning over the ceramic substrate, and adjusting the focal position of the ultrafast laser to be positioned on the second surface of the ceramic substrate to be diced; enabling the vision system to position coordinate information corresponding to the first crack combination on the second surface according to the vision positioning mark; and performing scribing treatment on the second surface according to the second laser processing parameters and the coordinate information to generate a second crack combination. The invention avoids microcrack generated in the process of double-sided scribing of the ceramic substrate, reduces edge saw teeth and improves scribing efficiency.
Description
Technical Field
The invention relates to the technical field of laser processing, in particular to a ceramic substrate scribing processing method and system based on ultrafast laser.
Background
The chip resistor has the advantages of small volume, light weight, high installation density, strong shock resistance, strong anti-interference capability, good high-frequency characteristic and the like, and is widely applied to computers, mobile phones, medical electronic products and the like. The ceramic material has the advantages of high strength, low dielectric constant, small thermal expansion coefficient, high thermal conductivity, good chemical stability and the like, greatly improves the reliability of the circuit and the wiring density of the circuit, and is an ideal carrier substrate of the chip resistor. At present, a method for dicing a ceramic substrate by a diamond cutter wheel exists, but the dicing method belongs to contact type machining, has large cutter loss and large cutting seam width, is suitable for dicing the ceramic substrate with larger size, but as chip resistors develop towards microminiaturization and high precision, more stringent requirements are put on the dicing process of the ceramic substrate, so that the method for dicing the ceramic substrate by the diamond cutter wheel is not applicable. In the prior art, a mode of scribing the ceramic substrate by nanosecond laser exists, but because the nanosecond laser has longer pulse width and lower frequency, microcracks are easily generated on the ceramic substrate in the scribing process, or the edges of the cracked ceramic substrate are larger in saw teeth, so that the product quality is low.
Disclosure of Invention
The embodiment of the invention provides a ceramic substrate scribing processing method and system based on ultrafast laser, which solve the technical problems of lower efficiency and low product quality of a ceramic substrate scribing mode in the prior art.
A ceramic substrate scribing processing method based on ultrafast laser comprises the following steps:
adjusting the focal position of ultra-fast laser emitted by an ultra-fast laser to be positioned on the first surface to be diced of the ceramic substrate, and processing a visual positioning mark on the first surface through the ultra-fast laser; the ultrafast laser is positioned above the ceramic substrate;
Acquiring a first laser processing parameter and a scribing image file, and carrying out scribing processing on the first surface according to the first laser processing parameter and the scribing image file so as to generate a first crack combination on the first surface;
After the ceramic substrate is turned over, the focal position of the ultrafast laser is adjusted to be positioned on the second surface of the ceramic substrate to be diced; the second surface is arranged opposite to the first surface;
positioning coordinate information corresponding to the first crack combination on the second surface by a vision system according to the vision positioning mark, wherein the vision system is arranged below the ceramic substrate;
and obtaining a second laser processing parameter, and performing scribing processing on the second surface according to the second laser processing parameter and the coordinate information so as to generate a second crack combination on the second surface.
A ceramic substrate scribing processing system based on ultra-fast laser comprises a control module, an ultra-fast laser and a vision system; the ultrafast laser and the vision system are both in communication connection with the control module, and the control module is used for executing the ceramic substrate scribing processing method based on the ultrafast laser.
According to the ceramic substrate scribing processing method and system based on the ultrafast laser, the focal position of the ultrafast laser emitted by the ultrafast laser is adjusted to be positioned on the first surface to be scribed of the ceramic substrate, and the visual positioning mark is processed on the first surface through the ultrafast laser; the ultrafast laser is positioned above the ceramic substrate; acquiring a first laser processing parameter and a scribing image file, and carrying out scribing processing on the first surface according to the first laser processing parameter and the scribing image file so as to generate a first crack combination on the first surface; after the ceramic substrate is turned over, the focal position of the ultrafast laser is adjusted to be positioned on the second surface of the ceramic substrate to be diced; the second surface is arranged opposite to the first surface; positioning coordinate information corresponding to the first crack combination on the second surface by a vision system according to the vision positioning mark, wherein the vision system is arranged below the ceramic substrate; and obtaining a second laser processing parameter, and performing scribing processing on the second surface according to the second laser processing parameter and the coordinate information so as to generate a second crack combination on the second surface.
The invention can finish the double-sided scribing processing of the ceramic substrate only through the positioning of the vision system and the turn-over of the ceramic substrate and the scribing processing of the ultrafast laser, thereby avoiding microcracks generated in the scribing process and not affecting the thermal shock performance of products, meanwhile, the width of cracks generated by the scribing of the ultrafast laser on the ceramic substrate can be as small as 20um, which is beneficial to improving the packaging density, and the scribing processing is carried out by the ultrafast laser, and the invention not only can ensure smaller edge saw teeth of the ceramic substrate after the scribing, but also can greatly improve the scribing speed and efficiency due to the characteristics of high Q frequency and high peak power and narrow pulse width of the ultrafast laser; and the vision system positions on the second surface according to the vision positioning mark, so that the center verticality of the ceramic substrate after double-sided scribing is performed by the ultrafast laser is effectively improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments of the present invention will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of an ultrafast laser-based ceramic substrate dicing system according to an embodiment of the present invention.
FIG. 2 is a flow chart of a method for dicing a ceramic substrate based on ultrafast laser according to an embodiment of the present invention.
Reference numerals in the specification are as follows:
1. an ultrafast laser; 2. an external optical path system; 3. a high-speed vibrating mirror; 4. a focusing field lens; 5. vacuum adsorption jig; 6. a turnover mechanism; 7. a coaxial light source; 8. a vision system; 9. a lifting motor; 10. a control module; 11. and a human-computer interaction interface.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The invention provides an ultrafast laser-based ceramic substrate dicing processing method, as shown in fig. 2, comprising the following steps:
s10, adjusting the focal position of the ultrafast laser emitted by the ultrafast laser 1 to be positioned on the first surface to be diced of the ceramic substrate, and processing a visual positioning mark on the first surface through the ultrafast laser; the ultrafast laser 1 is located above the ceramic substrate.
Before step S10, the ultrafast laser 1 is first kept in an on state, and then emits ultrafast laser light. Preferably, in fig. 1, the ultrafast laser light emitted by the ultrafast laser 1 may be shaped by the external optical path system 2, while the ultrafast laser light is focused by the focusing field lens 4 to obtain a smaller spot and a higher energy density per unit area for processing.
In one embodiment, before step S10, the method further includes: the ceramic substrate loaded with the chip resistor is adsorbed and fixed on a vacuum adsorption jig 5, wherein the vacuum adsorption jig 5 is loaded on an output shaft of a turnover mechanism 6. The ceramic substrate scribing processing system based on the ultrafast laser, as shown in fig. 1, comprises a control module 10, an ultrafast laser 1 and a vision system 8; the ultrafast laser 1 and the vision system 8 are both in communication with the control module 10. Further, the ceramic substrate dicing system based on ultrafast laser shown in fig. 1 further comprises a vacuum adsorption fixture 5 and a turnover mechanism 6, which are all in communication connection with the control module 10. The control module 10 is used for controlling the ultrafast laser 1, the vision system 8 and the like to jointly execute the ultrafast laser-based ceramic substrate dicing processing method of the invention. Wherein, the turnover mechanism 6 (such as a rotating motor and other components capable of driving the ceramic substrate to rotate, in an embodiment, the turnover mechanism 6 is a servo rotating motor, the repeated motion precision of the servo rotating motor is less than or equal to 0.05 mm), a vacuum adsorption jig 5 is mounted on an output shaft of the servo rotating motor, and the ceramic substrate loaded with the chip resistor is adsorbed and fixed on the vacuum adsorption jig 5; meanwhile, the ultrafast laser 1 is mounted above the turnover mechanism 6, that is, above the ceramic substrate, so as to process the upwardly facing surface thereof. Understandably, the vacuum adsorption jig 5 is detachably connected to the turnover mechanism 6, and the invention can firstly install the vacuum adsorption jig 5 on the turnover mechanism 6 and then adsorb and fix the ceramic substrate; the ceramic substrate may be first adsorbed and fixed onto the vacuum adsorption jig 5, and then the vacuum adsorption jig 5 may be mounted onto the turnover mechanism 6. It is understood that, in the present invention, the ceramic substrate may be fixed on the turnover mechanism 6 by other fixing tools, and not necessarily by the vacuum adsorption tool 5, for example, by fastening, interference fit, or the like.
The lifting motor 9 shown in fig. 1 can linearly lift and move, so as to drive the turnover mechanism 6, the vacuum adsorption jig 5 arranged on the turnover mechanism 6, and the ceramic substrate (or glass substrate, etc.), and further assist in adjusting the focal position of the ultrafast laser; meanwhile, the focal position has a large influence on the size of the light spot, the line width and the depth of the crack after the scribing process, so that the focal position error precision is required to be within 0.01 mm. Understandably, before dicing the first surface of the ceramic substrate, calibration of the visual positioning mark is performed by using an ultrafast laser, so as to prepare for accurate positioning of the dicing process of the second surface.
Preferably, the ceramic substrate material used in the present invention is alumina as a main component, and the substrate parameters include: the thickness of the substrate is 0.38mm; the surface roughness Ra of the substrate is less than or equal to 20um; the flatness of the substrate is less than or equal to 0.02mm.
Preferably, the wavelength of the ultrafast laser 1 is 1064nm; the pulse width is less than or equal to 10ps. The ultra-fast laser 1 has the advantages that due to the narrow pulse width, the interaction time between the ultra-fast laser and the ceramic substrate is extremely short, ions are ablated from the surface of the material (namely the ceramic substrate) before transferring energy to the surrounding material at the scribing position, the thermal shock of the ultra-fast laser to the material is reduced, the generation of microcracks in the laser scribing process is effectively avoided, the thermal shock performance of the ceramic substrate is further prevented from being influenced, and the improvement is realized; machining precision and machining quality. In addition, the Q frequency of the ultrafast laser 1 is higher, the range is 100KHz to 4000KHz, and the Q frequency of a general nanosecond laser is lower, the range is below 100KHz, so that the action point density of the ultrafast laser 1 is higher under the condition of the same marking speed, and the saw teeth at the edge of the subsequent splinter are reduced.
S20, acquiring a first laser processing parameter and a scribing picture file, and carrying out scribing processing on the first surface according to the first laser processing parameter and the scribing picture file so as to generate a first crack combination on the first surface; that is, the ultrafast laser 1 is used for emitting ultrafast laser to process the visual positioning mark on the upward first surface of the ceramic substrate adsorbed on the vacuum adsorption fixture 5 and performing scribing treatment, so as to obtain the first crack combination on the first surface. Wherein, the dicing process includes: and controlling the ultra-fast laser to carry out scribing treatment through a high-speed vibrating mirror 3 with repetition precision of +/-2 um and speed of 10000 mm/s. The first scribing track for scribing the first surface may be determined according to the scribing file to ensure that the first combination of cracks generated on the final first surface is consistent with the scribing file. Understandably, the vision system 8 performs photographing calibration visual positioning identification or coordinate mapping processing from the bottom of the ceramic substrate loaded on the turnover mechanism 6, so that the visual field range of the vision system 8 needs to be selected according to the dicing processing range of the ceramic substrate, the unit pixel precision of the vision system 8 is less than or equal to 2um, the error is within 2 pixels, and meanwhile, the first fracture combination and the visual positioning identification are required to be within the visual field range of the vision system 8. Further, the ceramic substrate scribing processing system based on ultra-fast laser further comprises an air blowing and dust collecting device (not shown) connected with the control system, so that dust accumulation in the laser scribing processing process is prevented, and the laser scribing effect is affected.
In an embodiment, the first combination of cracks includes a first transverse crack at a first depth and a first longitudinal crack at a second depth; the first depth is less than the second depth; in the present invention, the width and depth of the first transverse and first longitudinal flaws in the first flaw combination can be controlled by selection of the optical configuration and adjustment of the first laser processing parameters. For example, the beam expander in the external light path system 2 is selected to be a 6-10 times beam expander, the focusing field lens 4 (such as an F- θ focusing lens) can be selected to be a telecentric lens with a focal length of 30-70mm, that is, the widths of the first transverse crack and the first longitudinal crack of the ceramic substrate can be controlled to be in a micrometer level by using ultra-fast laser, specifically, the widths of the first transverse crack and the first longitudinal crack are 20-40um, which is beneficial to improving the packaging density under the widths. Meanwhile, the ceramic substrate scribing process further comprises a plurality of procedures of screen printing, baking, electroplating, strip folding and grain folding, so that the transverse and longitudinal depths of the ultra-fast laser front scribing are inconsistent through adjustment of the first laser processing parameters, namely, longitudinal strip folding is needed and then grain folding is needed, so that transverse splitting cannot be carried out firstly during longitudinal strip folding, and the first depth is smaller than the second depth. In one embodiment, the first laser processing parameters include: marking times range from 5 to 20 times; marking speed ranges from 100 mm/s to 1000mm/s; q frequency ranges from 100KHz to 4000KHz; the laser power is 0.5-4W. Adjusting the first depth to 60um can be achieved by adjusting the first laser processing parameters within the range of the first laser processing parameters; the second depth was adjusted to 80um.
It can be appreciated that in the dicing process, when the ultrafast laser marks each crack, it may be possible to perform hierarchical marking, for example, the first depth of the first transverse crack needs to be finally marked to 60um, at this time, each layer may be marked only 10um, so that the marking of the first transverse crack can be completed only by marking 6 layers (i.e. the number of times of marking the first transverse crack is 6). The number of times of marking may be set according to the material, thickness, depth of crack, etc. of the ceramic substrate.
S30, after the ceramic substrate is turned over (in an embodiment, the ceramic substrate is turned over by a turning mechanism 6), the focal position of the ultrafast laser is adjusted to be positioned on the second surface of the ceramic substrate to be diced; the second surface is arranged opposite to the first surface; that is, the first surface and the second surface are the front surface and the back surface of the ceramic substrate, and the turnover mechanism 6 can drive the first surface to rotate 180 degrees through turnover and then turn downwards.
S40, enabling a vision system 8 to position coordinate information corresponding to the first crack combination on the second surface according to the vision positioning mark, wherein the vision system 8 is arranged below the ceramic substrate; that is, there is a relative positional relationship between the visual positioning mark and the first dicing crack, and the ceramic substrate needs to be subjected to both-sided dicing on the front and back sides (first surface and second surface), and the cracks on the front and back sides (first crack combination and second crack combination mentioned below) should be disposed entirely correspondingly to each other, and therefore, dicing processing is also required on the second surface according to the above-mentioned relative positional relationship. Therefore, after the first image of the first surface captured by the vision system 8 is identified, the relative positional relationship between the visual positioning mark and the first crack combination will correspondingly exist in the first image, and at the same time, the visual positioning mark will also exist the corresponding visual coordinates of the vision system 8 in the first image, and when the dicing process is performed on the second surface, it is necessary to first convert the visual coordinates of the vision system 8 into the corresponding laser coordinates in the second surface, where the laser coordinates correspond to the coordinates in the coordinate system where the ultrafast laser light emitted by the ultrafast laser 1 is located when the dicing process is performed on the second surface.
S50, acquiring a second laser processing parameter, and performing scribing processing on the second surface according to the second laser processing parameter and the coordinate information so as to generate a second crack combination on the second surface. That is, after the first crack combination is generated, the first surface is turned over by the turning mechanism 6 and turned to face down after being turned over by 180 degrees, at this time, since the vision system 8 is installed below the ceramic substrate, the vision system 8 positions coordinate information corresponding to the first crack combination on the second surface according to the vision positioning mark on the first surface and the relative positional relationship between the vision positioning mark and the first crack combination, so that the laser emitted by the ultrafast laser 1 can perform dicing processing on the second surface according to the second laser processing parameter and the coordinate information, and further obtain the second crack combination on the second surface.
Wherein, the dicing process includes: and controlling the ultra-fast laser to carry out scribing treatment through a high-speed vibrating mirror 3 with repetition precision of +/-2 um and speed of 10000 mm/s. The second scribing track for scribing the second surface is determined according to the coordinate information, and because the coordinate information contains the relative position relationship between the first crack combination and the visual positioning mark after being converted into the laser coordinates, the second scribing track generated according to the coordinate information is used for scribing the second surface, and the contact ratio error between the first crack combination of the first surface and the second crack combination of the second surface is less than or equal to 5um. And, carry on the double-sided scribing to ceramic substrate first surface and second surface through the ultrafast laser, the central perpendicularity and parallelism of the end surface favorable to improving the ceramic substrate after splitting, in the invention, the central perpendicularity of the ceramic substrate of double-sided scribing is + -0.01 mm, and the central perpendicularity of single-sided scribing is + -0.05 mm.
In an embodiment, the second combination of cracks includes a second transverse crack at a third depth and a second longitudinal crack at a fourth depth. In the present invention, the width and depth of the second transverse and second longitudinal flaws in the second flaw combination can be controlled by selection of the optical configuration and adjustment of the second laser processing parameters. For example, the beam expander in the external light path system 2 is selected to be a 6-10 times beam expander, the focusing field lens 4 (such as an F- θ focusing lens) can be selected to be a telecentric lens with a focal length of 30-70mm, that is, the widths of the second transverse crack and the second longitudinal crack of the ceramic substrate can be controlled to be in a micrometer level by using ultra-fast laser, specifically, the widths of the second transverse crack and the second longitudinal crack are 20-40um, which is beneficial to improving the packaging density under the widths. Preferably, in the case that the first depth in the first crack combination is smaller than the second depth, the problem of ensuring that the longitudinal folding strips do not crack first in the transverse direction is solved, so in order to avoid that the fourth depth is too deep to enable the ceramic substrate to crack before the folding strips, the depths of the second transverse crack and the second longitudinal crack can be the same, namely the third depth and the fourth depth are 60um. In some embodiments, the first depth, the second depth, the third depth and the fourth depth may be modified according to the requirement, for example, the first depth may be set to be equal to the second depth, the third depth may be smaller than the fourth depth, and the values of the depths may be set according to the thickness of the ceramic substrate.
In an embodiment, the second laser processing parameters include: marking times range from 5 to 20 times; marking speed ranges from 100 mm/s to 1000mm/s; q frequency ranges from 100KHz to 4000KHz; the laser power is 0.5-4W. Adjustment within the range of the second laser processing parameters described above may enable adjustment of the third and fourth depths to 60um. It can be appreciated that in the dicing process, when the ultrafast laser marks each crack, the marking may be performed in a layered manner, for example, the second depth of the second longitudinal crack is finally required to be marked to 60um, and at this time, each layer may be marked only 10um, so that the marking of the second longitudinal crack can be completed only by marking 6 layers (i.e. the number of times of marking the second longitudinal crack is 6). The number of times of marking may be set according to the material, thickness, depth of crack, etc. of the ceramic substrate. In the present invention, it may be preferable that the first laser parameter and the second laser parameter are the same, but the number of times of marking is different.
The invention can finish the double-sided scribing processing of the ceramic substrate by the positioning of the vision system 8, the turn-over of the ceramic substrate and the scribing processing of the ultrafast laser, avoids microcracks generated in the scribing process and does not influence the thermal shock performance of the product, meanwhile, the width of the cracks generated by the scribing of the ultrafast laser on the ceramic substrate can reach 20um at minimum, the invention is beneficial to improving the packaging density, and the dicing process is carried out by the ultrafast laser, and due to the characteristics of high Q frequency, high peak power and narrow pulse width of the ultrafast laser, the invention not only can ensure smaller edge saw teeth of the ceramic substrate after splitting, but also can greatly improve the dicing speed and efficiency; in addition, the vision system 8 performs positioning on the second surface according to the vision positioning mark, so that the center verticality of the ceramic substrate after double-sided scribing by using ultra-fast laser is effectively improved.
In one embodiment, the visual positioning marks comprise two cross positioning marks which are diagonally symmetrically arranged on the ceramic substrate; in the step S40, the positioning the coordinate information corresponding to the first crack combination on the second surface by the vision system 8 according to the vision positioning mark includes:
Shooting a first image which is turned over to face the first surface of the vision system 8 through the vision system 8, wherein the first image comprises the first crack combination and two cross positioning marks; that is, after the first crack combination is generated, the first surface is turned over by the turning mechanism 6 and turned down after being turned over by 180 degrees, at this time, since the vision system 8 is installed under the turning mechanism 6 (i.e. under the ceramic substrate), the vision system 8 needs to first capture a first image including the first crack combination and two cross positioning marks on the first surface, and then position coordinate information corresponding to the first crack combination on the second surface according to the first image.
Determining the relative position relationship between the first crack combination and the two cross positioning marks according to the first image; that is, there is a relative positional relationship between the visual positioning mark in the first image and the first dicing crack, and the ceramic substrate needs to be diced on both sides (first surface and second surface), and the cracks on both sides (first crack combination and second crack combination mentioned below) should be disposed entirely correspondingly and oppositely, and therefore, dicing processing is also required on the second surface according to the above-mentioned relative positional relationship. Further, after the vision system 8 captures a first image of the first surface, a relative positional relationship between the first crack combination and the two cross positioning marks in the first image is first acquired.
Acquiring a preset laser-visual coordinate mapping relation, and determining two laser coordinates on the second surface, which are opposite to the two cross positioning marks, according to the laser-visual coordinate mapping relation; that is, the two cross positioning marks may have two visual coordinates corresponding to the visual system 8 in the first image, and when dicing is performed on the second surface, the two visual coordinates need to be converted by using a preset mapping relationship between laser and visual coordinates, so as to obtain corresponding laser coordinates in the second surface, where the laser coordinates correspond to coordinates in a coordinate system where the ultrafast laser emitted by the ultrafast laser 1 is located when dicing is performed on the second surface, and one laser coordinate in the second surface after flipping corresponds to one visual coordinate in the first surface.
And determining coordinate information corresponding to the first crack combination on the second surface according to the relative position relation and the two laser coordinates. That is, the coordinate position may be determined according to the obtained relative positional relationship and the two laser coordinates determined in the second surface, and further, the laser emitted by the ultrafast laser 1 may be subjected to dicing processing on the second surface according to the second laser processing parameter and the coordinate information, so as to obtain the second crack combination on the second surface.
In an embodiment, before the obtaining the preset mapping relationship between laser and visual coordinates, the method further includes:
The method comprises the steps of adjusting the focal position of ultra-fast laser emitted by an ultra-fast laser 1 to be positioned on an upward ink surface of a glass substrate, and performing ink removal treatment on the ink surface through the ultra-fast laser so as to generate a preset number of transparent mark points on the glass substrate, and simultaneously recording laser coordinates of all the transparent mark points; that is, the ink side of the glass substrate is facing upward to facilitate marking removal by the ultrafast laser, and the location of the ultrafast laser marking removal of the ink will become transparent marking points, each corresponding to one of the laser coordinates on the ink side. The preset number can be set according to requirements, for example, 9 transparent mark points can be set, and the 9 transparent mark points are arranged 3*3. Understandably, before adjusting the focal position of the ultrafast laser light emitted from the ultrafast laser 1 to be located on the ink face of the glass substrate facing upward, the method comprises the steps of: the glass substrate with the ink face facing upwards is adsorbed and fixed on the turnover mechanism 6 (can be adsorbed and fixed by a vacuum adsorption jig). That is, before dicing of the ceramic substrate is started, it is first necessary to determine the laser-visual coordinate mapping relationship between the laser coordinates of the ink surface (the laser coordinates in the second surface correspond to the laser coordinates of the ink surface, which are the coordinates in the coordinate system where the ultrafast laser beam emitted by the ultrafast laser 1 performs laser processing) and the visual coordinates in the ultrafast laser-based ceramic substrate dicing system of the present invention, and in this embodiment, the determination is assisted by the glass substrate with the ink surface.
Causing the vision system 8 to take a second image containing all transparent mark points from the bottom of the glass substrate, and determining the vision coordinates of all transparent mark points according to the second image; that is, since the position of the ultrafast laser marking on the glass substrate from which the ink is removed will become a transparent mark point, the vision system 8 can also take a second image containing the transparent mark point from the bottom of the glass substrate and determine the visual coordinates corresponding to each transparent mark point.
And determining a laser-visual coordinate mapping relation according to the laser coordinates and the visual coordinates of each transparent mark point. That is, according to all laser coordinates and visual coordinates of the preset number of transparent mark points, a laser-visual coordinate mapping relationship between the visual coordinates and the laser coordinates can be established, and stored in the storage area of the control module 10, and then can be called at any time when needed.
In an embodiment, in step S60, before the vision system 8 locates the coordinate information corresponding to the first fracture combination on the second surface according to the visual location identifier, the method further includes:
Controlling the on-state of the coaxial light source 7 to irradiate light emitted by the coaxial light source 7 on the first surface of the ceramic substrate after overturning so as to supplement light to the first surface of the ceramic substrate; the coaxial light source 7 is arranged between the vision system 8 and the tilting mechanism 6. That is, the coaxial light source 7 is disposed between the vision system 8 and the ceramic substrate, and the light emitted by the coaxial light source 7 irradiates the first surface of the ceramic substrate after the turnover, so as to supplement the light, thereby facilitating the vision system 8 to capture the characteristics of the combination of the visual positioning mark and the first crack on the first surface when positioning the coordinate information according to the visual positioning mark on the first surface. Specifically, the specific shape and light source color of the coaxial light source 7 may be set as desired, for example, the light source color may be red or the like.
It should be understood that the sequence number of each step in the foregoing embodiment does not mean that the execution sequence of each process should be determined by the function and the internal logic, and should not limit the implementation process of the embodiment of the present invention.
In one embodiment, as shown in fig. 1, an ultrafast laser-based ceramic substrate dicing system is provided, which corresponds to the ultrafast laser-based ceramic substrate dicing method in the present invention one by one. The ceramic substrate scribing processing system based on the ultrafast laser comprises a control module 10, an ultrafast laser 1 and a vision system 8; the ultrafast laser 1 and the vision system 8 are both in communication connection with the control module 10, and the control module 10 is used for executing the ultrafast laser-based ceramic substrate dicing processing method of the invention.
Further, the ceramic substrate dicing system based on ultrafast laser shown in fig. 1 further comprises a vacuum adsorption fixture 5 and a turnover mechanism 6, which are all in communication connection with the control module 10. Wherein, the output shaft of the turnover mechanism 6 is provided with a vacuum adsorption jig 5, and the vacuum adsorption jig 5 adsorbs and fixes the ceramic substrate loaded with the chip resistor; meanwhile, the ultrafast laser 1 is installed above the turnover mechanism 6 (i.e. above the ceramic substrate) and is used for emitting ultrafast laser to process the visual positioning mark on the upward first surface of the ceramic substrate adsorbed on the vacuum adsorption jig 5 and scribe the mark, so as to obtain a first crack combination on the first surface; then, the first surface is turned over by the turning mechanism 6 to rotate 180 degrees and then turned downwards, at this time, since the vision system 8 is installed below the ceramic substrate, the vision system 8 positions the coordinate information corresponding to the first crack combination on the second surface according to the vision positioning mark on the first surface, so that the laser emitted by the ultrafast laser 1 can scribe the second surface according to the second laser processing parameter and the coordinate information, and further a second crack combination on the second surface is obtained.
Further, in fig. 1, the ultra-fast laser-based ceramic substrate dicing system further includes an external optical path system 2, a high-speed galvanometer 3, a focusing field lens 4, a coaxial light source 7, a lift motor 9, and a man-machine interface 11. The external optical path system 2 is used for shaping the ultra-fast laser emitted by the ultra-fast laser 1; the high-speed vibrating mirror 3 is used for controlling the processing motion trail of the ultra-fast laser, and preferably, the repetition precision of the high-speed vibrating mirror 3 is +/-2 um and the speed is 10000mm/s; the focusing field lens 4 is used for focusing the ultrafast laser to obtain smaller light spots and higher energy density per unit area for processing; the coaxial light source 7 is arranged between the vision system 8 and the ceramic substrate, and the light emitted by the coaxial light source 7 irradiates on the first surface of the ceramic substrate after overturning so as to supplement the light, so that the vision system 8 can capture the characteristics of the combination of the visual positioning mark and the first crack on the first surface when positioning coordinate information is carried out according to the visual positioning mark on the first surface. The vision system 8 includes a vision camera, which may be a CCD (charge coupled device ) camera, for capturing an image of the first surface of the ceramic substrate (or other components adsorbed on the vacuum adsorption fixture 5), so that the captured image becomes a basis for performing positioning or coordinate mapping and other processes by the vision system 8, so as to assist in completing the determining or coordinate mapping process. The lifting motor 9 can linearly lift and move, so as to drive the turnover mechanism 6, the vacuum adsorption jig 5 arranged on the turnover mechanism 6, the ceramic substrate (or the glass substrate and the like) to lift and move, and further assist in adjusting the focal position of the ultrafast laser. The control module 10 is also in communication connection with the external light path system 2, the high-speed galvanometer 3, the focusing field lens 4, the coaxial light source 7, the lifting motor 9, the man-machine interaction interface 11 and the like, wherein the man-machine interaction interface 11 is used for displaying data or images of various movements, laser control and visual positioning and the like so as to facilitate viewing, and meanwhile, the control module 10 can be controlled to send various control instructions according to the displayed contents so as to control other components to realize various functions in the ultra-fast laser-based ceramic substrate dicing processing method.
It will be clear to those skilled in the art that, for convenience and brevity of description, the control module 10 is not described in detail, and in practical application, the functional allocation of the control module 10 may be performed by different functional units or modules with reference to the ultrafast laser-based ceramic substrate dicing method, as required, that is, the internal structure of the system is divided into different functional units or modules, so as to perform all or part of the functions described above.
The above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention, and are intended to be included in the scope of the present invention.
Claims (10)
1. The ceramic substrate scribing processing method based on the ultrafast laser is characterized by comprising the following steps of:
adjusting the focal position of ultra-fast laser emitted by an ultra-fast laser to be positioned on the first surface to be diced of the ceramic substrate, and processing a visual positioning mark on the first surface through the ultra-fast laser; the ultrafast laser is positioned above the ceramic substrate;
Acquiring a first laser processing parameter and a scribing image file, and carrying out scribing processing on the first surface according to the first laser processing parameter and the scribing image file so as to generate a first crack combination on the first surface;
After the ceramic substrate is turned over, the focal position of the ultrafast laser is adjusted to be positioned on the second surface of the ceramic substrate to be diced; the second surface is arranged opposite to the first surface;
positioning coordinate information corresponding to the first crack combination on the second surface by a vision system according to the vision positioning mark, wherein the vision system is arranged below the ceramic substrate;
and obtaining a second laser processing parameter, and performing scribing processing on the second surface according to the second laser processing parameter and the coordinate information so as to generate a second crack combination on the second surface.
2. The ultra-fast laser-based ceramic substrate dicing method of claim 1, wherein the visual positioning marks comprise two cross positioning marks arranged diagonally symmetrically on the ceramic substrate;
The visual system is enabled to locate coordinate information corresponding to the first crack combination on the second surface according to the visual locating mark, and the method comprises the following steps:
Shooting a first image which is turned over to face the first surface of the vision system through the vision system, wherein the first image comprises the first crack combination and two cross positioning marks;
determining the relative position relationship between the first crack combination and the two cross positioning marks according to the first image;
Acquiring a preset laser-visual coordinate mapping relation, and determining two laser coordinates on the second surface, which are opposite to the two cross positioning marks, according to the laser-visual coordinate mapping relation;
and determining coordinate information corresponding to the first crack combination on the second surface according to the relative position relation and the two laser coordinates.
3. The method for scribing a ceramic substrate based on ultrafast laser as recited in claim 2, further comprising, before the acquiring the preset laser-visual coordinate mapping relationship:
Adjusting the focal position of ultrafast laser emitted by an ultrafast laser to be positioned on an upward ink surface of a glass substrate, and performing ink removal treatment on the ink surface through the ultrafast laser so as to generate a preset number of transparent mark points on the glass substrate, and simultaneously recording laser coordinates of all the transparent mark points;
Enabling the vision system to shoot a second image containing all transparent mark points from the bottom of the glass substrate, and determining the vision coordinates of all transparent mark points according to the second image;
And determining a laser-visual coordinate mapping relation according to the laser coordinates and the visual coordinates of each transparent mark point.
4. The ultrafast laser-based ceramic substrate dicing method of claim 2, wherein the first combination of cracks includes a first transverse crack of a first depth and a first longitudinal crack of a second depth; the first depth is less than the second depth;
the second combination of cracks includes a second transverse crack at a third depth and a second longitudinal crack at a fourth depth.
5. The ultra-fast laser based ceramic substrate dicing method of claim 4, wherein the first depth is 60um; the second depth is 80um; the third depth and the fourth depth are both 60um.
6. The method for scribing a ceramic base plate based on ultrafast laser as recited in claim 1, wherein before the vision system locates the coordinate information corresponding to the first crack combination on the second surface according to the vision positioning mark, the method further comprises:
Controlling the on-state of the coaxial light source to irradiate the light emitted by the coaxial light source on the first surface of the ceramic substrate after overturning so as to supplement the light; the coaxial light source is disposed between the vision system and the ceramic substrate.
7. The method for scribing a ceramic base plate based on ultra-fast laser according to claim 1, wherein the wavelength of the ultra-fast laser is 1064nm; the pulse width is less than or equal to 10ps.
8. The ultra-fast laser based ceramic substrate dicing method of claim 1, wherein the first laser processing parameters comprise: marking times range from 5 to 20 times; marking speed ranges from 100 mm/s to 1000mm/s; q frequency ranges from 100KHz to 4000KHz; the laser power is 0.5-4W;
The second laser processing parameters include: marking times range from 5 to 20 times; marking speed ranges from 100 mm/s to 1000mm/s; q frequency ranges from 100KHz to 4000KHz; the laser power is 0.5-4W.
9. The method for dicing a ceramic substrate based on ultrafast laser according to claim 1, wherein the dicing process comprises:
And controlling the ultrafast laser to carry out scribing treatment through a high-speed vibrating mirror with repetition precision of +/-2 um and speed of 10000 mm/s.
10. The ceramic substrate scribing processing system based on the ultrafast laser is characterized by comprising a control module, the ultrafast laser and a vision system; the ultrafast laser and the vision system are both in communication connection with the control module, and the control module is used for executing the ultrafast laser-based ceramic substrate dicing processing method according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110606525.XA CN115401337B (en) | 2021-05-28 | 2021-05-28 | Ceramic substrate scribing processing method and system based on ultrafast laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110606525.XA CN115401337B (en) | 2021-05-28 | 2021-05-28 | Ceramic substrate scribing processing method and system based on ultrafast laser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115401337A CN115401337A (en) | 2022-11-29 |
| CN115401337B true CN115401337B (en) | 2024-08-30 |
Family
ID=84155774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110606525.XA Active CN115401337B (en) | 2021-05-28 | 2021-05-28 | Ceramic substrate scribing processing method and system based on ultrafast laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115401337B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115770962B (en) * | 2022-12-07 | 2024-12-31 | 伯恩高新科技（惠州）有限公司 | Dicing method and optical element |
| CN118875518A (en) * | 2024-08-16 | 2024-11-01 | 武汉华日精密激光股份有限公司 | A method and system for laser cutting three-layer quartz crystal |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108817655A (en) * | 2018-08-14 | 2018-11-16 | 大族激光科技产业集团股份有限公司 | A kind of laser processing and its laser-processing system of ceramics mat surface |
| CN111822879A (en) * | 2020-06-24 | 2020-10-27 | 深圳中科光子科技有限公司 | Ultrafast laser processing device and processing method for ferrite material |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003002289A1 (en) * | 2001-06-28 | 2003-01-09 | Electro Scientific Industries, Inc. | Multistep laser processing of wafers supporting surface device layers |
| US7804043B2 (en) * | 2004-06-15 | 2010-09-28 | Laserfacturing Inc. | Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laser |
| SG187059A1 (en) * | 2010-07-12 | 2013-02-28 | Filaser Inc | Method of material processing by laser filamentation |
| US20150034613A1 (en) * | 2013-08-02 | 2015-02-05 | Rofin-Sinar Technologies Inc. | System for performing laser filamentation within transparent materials |
| CN112238295A (en) * | 2020-09-09 | 2021-01-19 | 大族激光科技产业集团股份有限公司 | Processing method of ultrathin piezoelectric ceramic |
-
2021
- 2021-05-28 CN CN202110606525.XA patent/CN115401337B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108817655A (en) * | 2018-08-14 | 2018-11-16 | 大族激光科技产业集团股份有限公司 | A kind of laser processing and its laser-processing system of ceramics mat surface |
| CN111822879A (en) * | 2020-06-24 | 2020-10-27 | 深圳中科光子科技有限公司 | Ultrafast laser processing device and processing method for ferrite material |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115401337A (en) | 2022-11-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103433619B (en) | The preparation method of laser melting coating printer and wiring board | |
| JP6281328B2 (en) | Laser dicing apparatus and laser dicing method | |
| CN115401337B (en) | Ceramic substrate scribing processing method and system based on ultrafast laser | |
| KR20150050357A (en) | Laser machining apparatus | |
| CN111590197A (en) | Ceramic substrate porous array picosecond laser galvanometer scanning drilling system and method | |
| CN102027352A (en) | In-situ monitoring for laser ablation | |
| WO2012164649A1 (en) | Laser machining method | |
| CN111215765B (en) | Processing method for processing precise photosensitive hole by ultraviolet laser and laser equipment | |
| CN115213572A (en) | Continuous laser micropore drilling method and device | |
| CN111496396A (en) | Ceramic substrate picosecond laser drilling device and method | |
| CN116583030A (en) | Multifunctional precision bonding pad repairing method and repairing equipment | |
| CN216966645U (en) | Laser marking apparatus | |
| JP2011206838A (en) | Laser beam machining method | |
| CN116156778A (en) | Method and device for repairing short circuit of printed circuit board | |
| CN113134681A (en) | Process method and equipment for removing AF coating by laser | |
| CN112238295A (en) | Processing method of ultrathin piezoelectric ceramic | |
| CN102639282A (en) | Laser processing device and laser processing method | |
| JP2008018440A (en) | Laser processing equipment | |
| JP2009006339A (en) | Laser beam machining apparatus and laser beam machining method | |
| JP5536534B2 (en) | Glass plate division method | |
| CN101683703B (en) | Laser processor | |
| JP4702965B1 (en) | Pattern forming device | |
| CN116329770A (en) | Method and system for green ultrafast laser grooving of solar crystalline silicon cells | |
| JP2007044729A (en) | Processing method for flat work | |
| JP6356560B2 (en) | Processing method of transparent plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |