CN115377035A - Photoelectric module and processor comprising same - Google Patents
Photoelectric module and processor comprising same Download PDFInfo
- Publication number
- CN115377035A CN115377035A CN202211120978.2A CN202211120978A CN115377035A CN 115377035 A CN115377035 A CN 115377035A CN 202211120978 A CN202211120978 A CN 202211120978A CN 115377035 A CN115377035 A CN 115377035A
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- unit
- optoelectronic module
- substrate
- electrical
- processor
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- 239000000758 substrate Substances 0.000 claims abstract description 29
- 230000005693 optoelectronics Effects 0.000 claims abstract description 25
- 230000003287 optical effect Effects 0.000 claims description 23
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 230000008054 signal transmission Effects 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 6
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 101100406366 Caenorhabditis elegans pad-2 gene Proteins 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The embodiment of the application relates to an optoelectronic module and a processor comprising the same. According to some embodiments of the present application, an optoelectronic module comprises: a substrate including a light unit; and an electrical unit over and coupled with the substrate, wherein at least a portion of the electrical unit is over the light unit. Another embodiment of the present application provides a processor, which includes the foregoing optoelectronic module. The photoelectric module and the processor comprising the same provided by the embodiment of the application can effectively solve the problems in the traditional technology.
Description
Technical Field
The present application relates to the field of optical communication technologies, and in particular, to an optoelectronic module and a processor including the same.
Background
With the increasing demand of high-density and multi-level chip integration, the corresponding integration technology needs to be improved, and especially for the integration technology between different types of chips, due to the differences of precision and performance between products, there are many challenges, such as the increase of wire bonding times, the waste of resources, and the electromagnetic interference.
Based on this, this application proposes a photovoltaic module and contains its treater.
Disclosure of Invention
The present disclosure is directed to solving the above problems, and an object of the present disclosure is to provide an optoelectronic module and a processor including the same, which can solve the problems of effective heat dissipation and electromagnetic interference of the optoelectronic module and interconnection between a chip and a circuit board (e.g., a PCB).
An embodiment of the present application provides an optoelectronic module, which includes:
a substrate including a light unit; and
an electrical unit over and coupled with the substrate, wherein at least a portion of the electrical unit is over the optical unit.
According to some embodiments of the present application, the substrate further comprises a circuit board, the circuit board comprises a main board and a sub-board, and the light unit is located above the main board.
According to some embodiments of the present application, a portion of the electrical unit is located over the light unit and another portion is located over and coupled with the daughter board.
According to some embodiments of the present application, the sub-board is provided with a signal line to connect the electrical unit with a component on the sub-board for signal transmission.
According to some embodiments of the application, wherein at least one of the following devices is disposed above the circuit board: the device comprises a laser, a photodetector, a driver, a signal amplifier and a silicon optical chip.
According to some embodiments of the application, wherein the substrate is provided with a heat dissipation surface.
According to some embodiments of the application, at least a portion of the electrical unit is coupled to the substrate by a ball solder.
According to some embodiments of the present application, it further comprises a housing located above and/or below the substrate.
According to some embodiments of the application, wherein a heat sink is provided within the housing, the light unit and/or the electrical unit is connected to the heat sink.
Another embodiment of the present application also provides a processor including any of the optoelectronic modules described above.
The application provides a photoelectric module and a processor comprising the same. Compared with the traditional technology, the method has low cost and easy operation, and is particularly suitable for packaging ultra-dense Integrated Circuits (ICs).
Drawings
Fig. 1 is a schematic diagram of a photovoltaic module structure according to some embodiments of the present application.
Fig. 2 is a schematic structural diagram of an optoelectronic module according to further embodiments of the present application.
Detailed Description
In order to make the technical means, the technical features, the technical objectives and the functions of the present disclosure easily understood, the optical module and the optical chip based on the optical interconnection unit provided in the present disclosure are specifically described below with reference to the embodiments and the accompanying drawings.
Embodiments of the present application will be described in detail below. Throughout the specification, the same or similar components and components having the same or similar functions are denoted by like reference numerals. The embodiments described herein with respect to the figures are illustrative in nature, are diagrammatic in nature, and are used to provide a basic understanding of the present application. The embodiments of the present application should not be construed as limiting the present application.
In this specification, unless specified or limited otherwise, relative terms such as: the terms "vertical," "lateral," "above," "below," and derivatives thereof (e.g., "upper surface," etc.) should be construed to refer to the orientation as then described in the discussion or as shown in the drawing. These relative terms are for convenience of description only and do not require that the present application be constructed or operated in a particular orientation.
The photoelectric module that this application provided is coupled from top to bottom through light unit and electric unit, has improved the integrated efficiency, has reduced the via hole and has walked the line, and then has improved the module performance.
Fig. 1 is a schematic diagram of a photovoltaic module structure according to some embodiments of the present application.
As shown in fig. 1, an optoelectronic module 100 according to an embodiment of the present disclosure includes: a substrate 110 including a light unit 101; and an electrical unit 120, the electrical unit 120 being located over and coupled to the substrate 110, at least a portion of the electrical unit 120 being located over the optical unit 101.
"coupling" in this application may be understood as electrical or mechanical coupling, e.g. fixing a light unit and an electrical unit, and it is understood that direct coupling or indirect coupling (in other words, coupling without direct contact) may be provided.
The optical unit 101 is disposed on the substrate below the electrical unit 120, so that it is convenient to couple with the electrical unit and has a larger installation space, for example, the optical unit 101 may change the contact position of the Integrated Circuit (IC) circuit (pad 1) by a wafer level metal wiring process and a bump process through re-wiring (RDL) and re-manufacture the contact position into a larger pad2, and may connect between the optical unit and the electrical unit through solder pins (black circles between the electrical unit 120 and the optical unit 101 in fig. 1), for example, the optical unit and the optical unit may be connected through Ball Grid Array (BGA), a high density surface mount packaging (hdp-smt), or the like. In addition, the electrical unit 120 may also be electrically connected to the substrate 110 by BGA packaging technology, and if the optical unit is not in conformity with the surface height of the substrate, the distance between the electrical unit and the substrate may also be adjusted by soldering between the electrical unit and the substrate, so that the integrated electrical unit is parallel to the horizontal plane.
According to other embodiments of the present application, the substrate 110 may include a circuit board 105, for example, a rigid circuit board such as a PCB circuit board, the circuit board 105 may include a main board 102 and a sub-board 103, and the light unit 101 is located above the main board 102. The optical unit can be a high-temperature-resistant material, such as a lithium niobate chip, and is coupled with the electrical unit to realize the optical-electrical communication between the optical unit and the electrical unit.
According to other embodiments of the present application, the sub-board 103 may be provided with signal lines, and the electrical unit 120 may be interconnected with other components on the circuit board 105 through the signal lines of the sub-board 103, for example, the signal lines may be provided on the surface of the sub-board 103 of the substrate 110, which may be used to transmit high frequency signals if the electrical unit includes high frequency devices, and the surface of the sub-board 103 may be provided with extensions through which external devices are connected.
Fig. 2 is a schematic structural diagram of an optoelectronic module according to further embodiments of the present application.
According to other embodiments of the present application, the optoelectronic module 100 further comprises a housing, which is located below the substrate 110 and/or above the substrate 110. The housing above the substrate 110 is an upper housing 11, the housing below the substrate is a lower housing 12, and the outer surface of the upper housing is a main heat dissipation surface.
The sub-board 103 may also be provided with a heat dissipating surface facing the upper housing 11 and thermally conductive connected to the upper housing 11. Through increasing daughter board and last casing interconnection, make most components all accessible go up the casing face heat dissipation on the one hand, effectively improved the heat dispersion of module, also improved the encapsulation space simultaneously for optical unit passes through the 3D structure and is connected with electric unit, has reduced the via hole and has walked the line, has improved the high frequency performance of chip.
If the upper surface of the electric unit is provided with the chip, the chip can be electrically connected with the element on the substrate below the electric unit in a routing mode according to requirements.
According to some embodiments of the application, a heat sink may be provided within the housing, to which the light unit and/or the electrical unit may be connected, e.g. a heat dissipation surface of the electrical unit is in heat conducting connection with the heat sink. The heat sink may be fixed on the inner surface of the upper case, or the heat sink may be integrally formed with the upper case.
At least part of the daughter board can be arranged on the heat sink, and a heat conducting pad can be arranged between the heat radiating surface of the daughter board and the inner surface of the upper shell and connected with the daughter board and the upper shell.
According to other embodiments of the present application, the circuit board may be provided with at least one of the following devices: the device comprises a laser, a photodetector, a driver, a signal amplifier and a silicon optical chip.
According to some embodiments of the present application, one end of the daughter board of the circuit board may be provided with an XRS electrical interface, and one end of the signal lines on the surface of the daughter board is electrically connected to the electrical interface, and the other end is connected to the electrical unit coupled to the daughter board by BGA soldering.
The photoelectric module can integrally package the substrate and the electric unit by arranging the fixing device, thereby effectively ensuring the working stability and reliability of each element on the photoelectric module, prolonging the service life of the photoelectric module and improving the safety and reliability of the photoelectric module.
Other embodiments of the present application further provide a processor, which includes the foregoing optoelectronic module, so that the processor can perform operations and data processing based on the optoelectronic signal, thereby effectively extending the application range of the optoelectronic module.
The photoelectric module and the processor comprising the same have the advantages of simple technology and low cost, can be effectively used in a photoelectric interconnection chip, and improve the high-frequency communication performance between adjacent electric units and optical units, thereby improving the stability and reliability of the use of the photoelectric module.
While the above specification teaches exemplary embodiments of particular arrangements of the embodiments, these embodiments are not intended to be limiting, and the above application presents the best mode of practicing the invention. Various alterations and modifications will no doubt become apparent to those skilled in the art after having read the above description. Therefore, the appended claims should be construed to cover all such changes and modifications as fall within the true spirit and scope of the application. Any and all equivalent ranges and contents within the scope of the claims should be considered to be within the intent and scope of this application.
Claims (10)
1. An optoelectronic module, comprising:
a substrate including a light unit; and
an electrical unit over and coupled with the substrate, wherein at least a portion of the electrical unit is over the light unit.
2. The optoelectronic module of claim 1 wherein the substrate further comprises a circuit board comprising a motherboard and a daughterboard, the optical unit being located above the motherboard.
3. The optoelectronic module of claim 2, wherein a portion of the electrical unit is positioned over the optical unit and another portion is positioned over and coupled with the daughterboard.
4. The optoelectronic module of claim 2, wherein the daughter board is provided with signal lines to connect the electrical units with elements on the daughter board for signal transmission.
5. The optoelectronic module of claim 2, wherein at least one of the following is disposed over the circuit board: the device comprises a laser, a photodetector, a driver, a signal amplifier and a silicon optical chip.
6. The optoelectronic module of claim 1 wherein the substrate is provided with a heat dissipating surface.
7. The optoelectronic module of claim 1 wherein at least a portion of the electrical elements are coupled to the substrate by a ball solder.
8. The optoelectronic module of claim 1 further comprising a housing located above and/or below the substrate.
9. The optoelectronic module of claim 8 wherein a heat sink is provided within the housing, the optical unit and/or the electrical unit being connected to the heat sink.
10. A processor comprising an optoelectronic module according to any one of the preceding claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211120978.2A CN115377035A (en) | 2022-09-15 | 2022-09-15 | Photoelectric module and processor comprising same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211120978.2A CN115377035A (en) | 2022-09-15 | 2022-09-15 | Photoelectric module and processor comprising same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115377035A true CN115377035A (en) | 2022-11-22 |
Family
ID=84072377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211120978.2A Pending CN115377035A (en) | 2022-09-15 | 2022-09-15 | Photoelectric module and processor comprising same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115377035A (en) |
-
2022
- 2022-09-15 CN CN202211120978.2A patent/CN115377035A/en active Pending
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