CN115332203A - Uniform-temperature copper pipe liquid cooling plate and processing method thereof - Google Patents
Uniform-temperature copper pipe liquid cooling plate and processing method thereof Download PDFInfo
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Abstract
本发明公开一种均温式铜管液冷板及其加工方法,包括板体和设置在板体内的液冷流道。所述板体包括双层板体,所述液冷流道设置在双层板体之间,所述液冷流道包括之字形冷流道,所述之字形冷流道的拐角处设有开口,所述开口处连接有换液机构,所述换液机构包括抽液泵、加液泵和连接在二者之间的制冷机,本发明的优点在于在之字形冷流道的每道独立支管内的制冷剂均可在弯折处的开口处进行更换,保证该均温式铜管液冷板不会出现局部温度过高大致降温效率下降的问题。
The invention discloses an isothermal copper tube liquid-cooling plate and a processing method thereof, comprising a plate body and a liquid-cooling flow channel arranged in the plate body. The plate body includes a double-layer plate body, and the liquid-cooling flow channel is arranged between the double-layer plate bodies. The liquid-cooling flow channel includes a zigzag-shaped cold flow channel. The opening is connected with a liquid exchange mechanism, and the liquid exchange mechanism includes a liquid suction pump, a liquid addition pump and a refrigerator connected between the two. The advantage of the present invention is that each channel of the zigzag cold flow channel The refrigerant in the independent branch pipe can be replaced at the opening of the bend, so as to ensure that the temperature uniform copper tube liquid-cooling plate will not have the problem that the local temperature is too high and the cooling efficiency is reduced.
Description
技术领域technical field
本发明涉及液冷板领域,具体地说,是一种均温式铜管液冷板及其加工方法。The invention relates to the field of liquid cold plates, in particular to a uniform temperature copper tube liquid cold plate and a processing method thereof.
背景技术Background technique
液冷板具有优良的散热性能,其是对中、高功率密度的设备,液冷板可以有效地带走功率器件、印刷电路板组装件或分机设备中的耗散热量。现有的液冷板如中国专利CN105658027A公开的“用于电子部件冷却的液冷板”,该液冷板包括液冷板基体,液冷板基体的一侧设有冷却液道,同时冷却液道所在侧设置有盖板。使用时将功率元件即发热元件固定于液冷板上,发热元件的产热传递给液冷板,流经冷却液道的冷却介质将热量带走从而实现散热。The liquid cold plate has excellent heat dissipation performance. It is a device with medium and high power density. The liquid cold plate can effectively take away the heat dissipation in power devices, printed circuit board assemblies or extension equipment. Existing liquid cold plates such as the "liquid cold plate for cooling electronic components" disclosed in Chinese patent CN105658027A, the liquid cold plate includes a liquid cold plate base, one side of the liquid cold plate base is provided with a cooling liquid channel, while the cooling liquid A cover plate is arranged on the side where the road is located. When in use, the power element, that is, the heating element, is fixed on the liquid cooling plate, and the heat generated by the heating element is transferred to the liquid cooling plate, and the cooling medium flowing through the cooling liquid channel takes away the heat to realize heat dissipation.
随着光电领域技术的进步,光电产品不断朝着多功能和便携性方向发展,前者使得单位电子芯片集成度不断加大,后者则使封装器件体积不断缩小,芯片数量的不断增加,紧随而来的是电子芯片的发热量的巨大攀升。由于受液冷板自身材料热传导能力的限制,热量的大量产生造成电子器件温度过高、温度分布不均,温度过于集中,发热元件内部将产生热应力和热应变,极易造成电子器件内部的疲劳损坏或永久变形,直接影响到器件的稳定性和可靠性,严重影响其工作效率和使用寿命。With the advancement of optoelectronic technology, optoelectronic products continue to develop in the direction of multi-function and portability. The former makes the integration of unit electronic chips continue to increase, while the latter makes the volume of packaged devices continue to shrink and the number of chips continues to increase. What followed was a huge rise in the heat generation of electronic chips. Due to the limitation of the thermal conductivity of the material of the liquid cold plate itself, the large amount of heat generated will cause the temperature of the electronic device to be too high, the temperature distribution will be uneven, and the temperature will be too concentrated. Thermal stress and thermal strain will be generated inside the heating element, which will easily cause damage to the electronic device. Fatigue damage or permanent deformation directly affects the stability and reliability of the device, and seriously affects its working efficiency and service life.
发明内容Contents of the invention
发明目的:本发明目的在于针对现有技术的不足,提供一种均温式铜管液冷板及其加工方法。Purpose of the invention: The purpose of the invention is to provide a uniform temperature copper tube liquid cooling plate and its processing method for the deficiencies of the prior art.
技术方案:本发明所述一种均温式铜管液冷板,包括板体和设置在板体内的液冷流道,所述板体包括双层板体,所述液冷流道设置在双层板体之间,所述液冷流道包括之字形冷流道,所述之字形冷流道的拐角处设有开口,所述开口处连接有换液机构,所述换液机构包括抽液泵、加液泵和连接在二者之间的制冷机。Technical solution: A uniform temperature copper tube liquid cooling plate according to the present invention includes a plate body and a liquid cooling flow channel arranged in the plate body, the plate body includes a double-layer plate body, and the liquid cooling flow channel is arranged in the Between the double-layer plates, the liquid-cooled runner includes a zigzag cold runner, and an opening is provided at the corner of the zigzag cold runner, and the opening is connected with a liquid changing mechanism, and the liquid changing mechanism includes A suction pump, a liquid filling pump and a refrigerator connected between them.
作为优选的,所述开口处连接有Y形支管,所述Y形支管的两个支管口分别连通抽液泵和加液泵。Preferably, a Y-shaped branch pipe is connected to the opening, and the two branch pipe ports of the Y-shaped branch pipe are respectively connected to the suction pump and the liquid filling pump.
作为优选的,所述Y形支管的两个支管口均设有单向截止阀。Preferably, both branch ports of the Y-shaped branch pipe are provided with one-way stop valves.
作为优选的,所述开口处与Y形支管的连接部处外设有贴合之字形冷流道、Y形支管和板体的密封衬垫。Preferably, the connection between the opening and the Y-shaped branch pipe is provided with a sealing gasket that fits the zigzag cold runner, the Y-shaped branch pipe and the plate body.
一种均温式铜管液冷板的加工方法,包括以下步骤:A method for processing a uniform temperature copper tube liquid cold plate, comprising the following steps:
S1、取铝基板材按预定规格切割制备板材,并根据所需的板体面积设置适当的之字形冷流道并在板材上切割出安装之字形冷流道的流道槽,并对槽体内打磨抛光;S1. Take the aluminum base plate and cut it according to the predetermined specifications to prepare the plate, and set the appropriate zigzag cold runner according to the required plate area and cut out the runner groove for installing the zigzag cold runner on the plate, and install the zigzag cold runner in the groove grinding and polishing;
S2、在槽体内对应密封衬垫的位置开设厚度略薄于密封衬垫的衬垫槽,并对衬垫槽内壁做抛光处理;S2. Set up a gasket groove with a thickness slightly thinner than the sealing gasket at the position corresponding to the sealing gasket in the tank body, and polish the inner wall of the gasket groove;
S3、将密封沉淀套接在之字形冷流道的开口处,并将Y形支管插入密封衬垫中,并将整体嵌入槽体内,密封衬垫对准衬垫槽;S3. Connect the sealing deposit to the opening of the zigzag cold runner, insert the Y-shaped branch pipe into the sealing gasket, and embed the whole into the tank, and align the sealing gasket with the gasket groove;
S4、在板体开设槽体的一面以钢板覆盖并加压使钢板完全贴合板体;S4. Cover the side of the plate body with the groove body with a steel plate and pressurize it so that the steel plate fits the plate body completely;
S5、向Y形支管中注水并封闭所有Y形支管的开口,以液氮对整体装置进行降温,降温至之字形冷流道和Y形支管中的水完全结冰;S5, pour water into the Y-shaped branch pipe and close the openings of all Y-shaped branch pipes, and cool the overall device with liquid nitrogen until the water in the zigzag cold runner and the Y-shaped branch pipe is completely frozen;
S6、对整体装置升温,打开Y形支管开口将水排出;S6, heat up the overall device, open the Y-shaped branch pipe opening to discharge the water;
S7、在Y形支管的开口处安装单项截止阀,同一Y形支管的两开口处的两个单项截止阀反向安装;S7. A single cut-off valve is installed at the opening of the Y-shaped branch pipe, and the two single-way cut-off valves at the two openings of the same Y-shaped branch pipe are installed in reverse;
S8、在内开的单向截止阀处的Y形支管的开口处安装加液泵,在外开的单向截止阀处的Y形支管的开口处安装抽液泵,并在抽液泵和加液泵之间连接制冷机。S8. Install a liquid filling pump at the opening of the Y-shaped branch pipe at the one-way stop valve that is opened inward, and install a liquid pump at the opening of the Y-shaped branch pipe at the one-way stop valve that is opened outward, and install the liquid pump at the opening of the Y-shaped branch pipe at the one-way stop valve that is opened outward, and connect the liquid pump and the filling A refrigerator is connected between the liquid pumps.
本发明相比于现有技术具有以下有益效果:之字形冷流道的每道独立支管内的制冷剂均可在弯折处的开口处进行更换,独立支管中的冷却液经由开口处进入Y形支管,由抽液泵抽入并送入制冷机,同时制冷机将降温完成的冷却液经由加液泵送入Y形支管的另一开口,进而送入之字形冷流道的另一独立支管,进行下一区域的降温,保证该均温式铜管液冷板不会出现局部温度过高大致降温效率下降的问题。Compared with the prior art, the present invention has the following beneficial effects: the refrigerant in each independent branch pipe of the zigzag cold runner can be replaced at the opening of the bend, and the cooling liquid in the independent branch pipe enters the Y through the opening. The Y-shaped branch pipe is sucked in by the pump and sent to the refrigerator. At the same time, the refrigerator sends the cooling liquid that has cooled down to the other opening of the Y-shaped branch pipe through the liquid feeding pump, and then sent to another independent zigzag cold runner. The branch pipe is used to cool down the next area to ensure that the uniform temperature copper tube liquid cold plate will not have the problem of excessive local temperature and reduced cooling efficiency.
附图说明Description of drawings
图1为本发明一种均温式铜管液冷板及其加工方法中装置部分的结构示意图。Fig. 1 is a schematic structural view of the device part in a uniform temperature copper tube liquid cold plate and its processing method of the present invention.
图中:1、板体;2、之字形冷流道;3、Y形支管;4、单项截止阀;5、抽液泵;6、加液泵;7、制冷机。In the figure: 1. Plate body; 2. Zigzag cold runner; 3. Y-shaped branch pipe; 4. Single stop valve; 5. Suction pump; 6. Liquid filling pump; 7. Refrigerator.
具体实施方式Detailed ways
下面将对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
在本发明的描述中,需要理解的是,术语“中心”、“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", " The orientations or positional relationships indicated by "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", and "circumferential" are based on the drawings The orientation or positional relationship shown is only for the convenience of describing the present invention and simplifying the description, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as limiting the scope of the present invention. limit.
在本发明中,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,也可以是成一体;可以是机械连接,也可以是电连接,也可以是通讯连接;可以是直接连接,也可以通过中间媒介的间接连接,可以是两个元件内部的连通或两个元件的相互作用关系,除非另有明确的限定。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本发明中的具体含义。In the present invention, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection" and "fixation" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , can also be integrated; it can be mechanical connection, electrical connection, or communication connection; it can be direct connection or indirect connection through an intermediary, it can be the internal communication of two components or two components interactions, unless otherwise expressly defined. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.
下面以具体地实施例对本发明的技术方案进行详细说明。下面这几个具体的实施例可以相互结合,对于相同或相似的概念或过程可能在某些实施例不再赘述。The technical solution of the present invention will be described in detail below with specific embodiments. The following specific embodiments may be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments.
一种均温式铜管液冷板,包括板体1和设置在板体1内的液冷流道,板体1包括双层板体1,液冷流道设置在双层板体1之间,液冷流道包括之字形冷流道2,之字形冷流道2的拐角处设有开口,开口处连接有换液机构,换液机构包括抽液泵5、加液泵6和连接在二者之间的制冷机7。这一技术方案的优点在于之字形冷流道2的每道独立支管内的制冷剂均可在弯折处的开口处进行更换,独立支管中的冷却液经由开口处进入Y形支管3,由抽液泵5抽入并送入制冷机7,同时制冷机7将降温完成的冷却液经由加液泵6送入Y形支管3的另一开口,进而送入之字形冷流道2的另一独立支管,进行下一区域的降温,保证该均温式铜管液冷板不会出现局部温度过高大致降温效率下降的问题。A uniform temperature copper tube liquid cooling plate, including a
具体的,开口处连接有Y形支管3,Y形支管3的两个支管口分别连通抽液泵5和加液泵6,Y形支管3的两个支管口均设有单向截止阀,通过单项截止阀4的设置将抽液泵5和加液泵6分割成独立通路,避免低温的冷却液和高温的冷却液混合;开口处与Y形支管3的连接部处外设有贴合之字形冷流道2、Y形支管3和板体1的密封衬垫。Specifically, the opening is connected with a Y-
实施例:一种均温式铜管液冷板的加工方法,包括以下步骤:Embodiment: a kind of processing method of uniform temperature type copper tube liquid cooling plate, comprises the following steps:
S1、取铝基板材按预定规格切割制备板材,并根据所需的板体1面积设置适当的之字形冷流道2并在板材上切割出安装之字形冷流道2的流道槽,并对槽体内打磨抛光;S1. Take the aluminum base material and cut it according to the predetermined specifications to prepare the plate, and set the appropriate zigzag
S2、在槽体内对应密封衬垫的位置开设厚度略薄于密封衬垫的衬垫槽,并对衬垫槽内壁做抛光处理;S2. Set up a gasket groove with a thickness slightly thinner than the sealing gasket at the position corresponding to the sealing gasket in the tank body, and polish the inner wall of the gasket groove;
S3、将密封沉淀套接在之字形冷流道2的开口处,并将Y形支管3插入密封衬垫中,并将整体嵌入槽体内,密封衬垫对准衬垫槽;S3. Connect the sealing deposit to the opening of the zigzag
S4、在板体1开设槽体的一面以钢板覆盖并加压使钢板完全贴合板体1;S4. Cover the side of the
S5、向Y形支管3中注水并封闭所有Y形支管3的开口,以液氮对整体装置进行降温,降温至之字形冷流道2和Y形支管3中的水完全结冰;S5, pour water into the Y-shaped
S6、对整体装置升温,打开Y形支管3开口将水排出;S6, heat up the overall device, open the opening of the Y-shaped
S7、在Y形支管3的开口处安装单项截止阀4,同一Y形支管3的两开口处的两个单项截止阀4反向安装;S7, installing single stop valve 4 at the opening of Y-shaped
S8、在内开的单向截止阀处的Y形支管3的开口处安装加液泵6,在外开的单向截止阀处的Y形支管3的开口处安装抽液泵5,并在抽液泵5和加液泵6之间连接制冷机7。S8. Install a
采用如实施例所示的技术方案生产的一种均温式铜管液冷板相比于传统的液冷板降温效率提高了27.1%,各区域温差降低了17.9%,由此可见有效提高了冷却效率。Compared with the traditional liquid cold plate, the cooling efficiency of a kind of uniform temperature copper tube liquid cold plate produced by the technical scheme shown in the embodiment has been improved by 27.1%, and the temperature difference in each area has been reduced by 17.9%. cooling efficiency.
在本发明中,除非另有明确的规定和限定,第一特征在第二特征“上”或“下”可以是第一特征和第二特征直接接触,或第一特征和第二特征通过中间媒介间接接触。而且,第一特征在第二特征“之上”、“上方”和“上面”可以是第一特征在第二特征正上方或斜上方,或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方,或仅仅表示第一特征水平高度低于第二特征。在本说明书的描述中,参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”或“一些示例”等的描述,意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中,对上述术语的示意性表述不必须针对的是相同的实施例或示例。In the present invention, unless otherwise clearly specified and limited, a first feature may be "on" or "under" a second feature in that the first feature and the second feature are in direct contact, or the first feature and the second feature pass through the middle. Media indirect contact. Moreover, "above", "above" and "above" the first feature on the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. "Below", "beneath" and "beneath" the first feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature. In the description of this specification, reference to the description of the terms "one embodiment", "some embodiments", "example", "specific examples" or "some examples" means that specific features described in connection with the embodiment or example , structure, material or feature is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms are not necessarily directed to the same embodiment or example.
而且,描述的具体特征、结构、材料或者特点可以在任意一个或者多个实施例或示例中以合适的方式结合。此外,在不相互矛盾的情况下,本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。Furthermore, the described specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples and features of different embodiments or examples described in this specification without conflicting with each other.
最后应说明的是:以上各实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述各实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或对其中部分或者全部技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例技术方案的范围。Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, rather than limiting them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: It is still possible to modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the various embodiments of the present invention. scope.
Claims (5)
Priority Applications (1)
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Citations (7)
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|---|---|---|---|---|
| JP2003097898A (en) * | 2001-07-16 | 2003-04-03 | Daikin Ind Ltd | Heat exchanger |
| CN1474451A (en) * | 2003-08-07 | 2004-02-11 | 华东船舶工业学院 | Heat exchangin technology suitable for high heat flow temperature uniforming heat radiation |
| JP2008021697A (en) * | 2006-07-11 | 2008-01-31 | Fuji Electric Holdings Co Ltd | Thermal dispersion type heatsink |
| JP2008258340A (en) * | 2007-04-04 | 2008-10-23 | Hitachi Ltd | COOLING DEVICE AND ELECTRONIC DEVICE HAVING THE SAME |
| US20180218961A1 (en) * | 2017-01-28 | 2018-08-02 | Zhanming LI | High Power Gallium Nitride Devices and Structures |
| US20190075681A1 (en) * | 2018-06-03 | 2019-03-07 | Apaltek (Dongguan) Co., Ltd | Integrated liquid-cooled heat dissipation system |
| JP2019179836A (en) * | 2018-03-30 | 2019-10-17 | 日本電産株式会社 | Cooling device |
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- 2022-08-08 CN CN202210941459.6A patent/CN115332203B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003097898A (en) * | 2001-07-16 | 2003-04-03 | Daikin Ind Ltd | Heat exchanger |
| CN1474451A (en) * | 2003-08-07 | 2004-02-11 | 华东船舶工业学院 | Heat exchangin technology suitable for high heat flow temperature uniforming heat radiation |
| JP2008021697A (en) * | 2006-07-11 | 2008-01-31 | Fuji Electric Holdings Co Ltd | Thermal dispersion type heatsink |
| JP2008258340A (en) * | 2007-04-04 | 2008-10-23 | Hitachi Ltd | COOLING DEVICE AND ELECTRONIC DEVICE HAVING THE SAME |
| US20180218961A1 (en) * | 2017-01-28 | 2018-08-02 | Zhanming LI | High Power Gallium Nitride Devices and Structures |
| JP2019179836A (en) * | 2018-03-30 | 2019-10-17 | 日本電産株式会社 | Cooling device |
| US20190075681A1 (en) * | 2018-06-03 | 2019-03-07 | Apaltek (Dongguan) Co., Ltd | Integrated liquid-cooled heat dissipation system |
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