CN1152124A - Non-contact measuring method and equipment of thermal expansion coefficient - Google Patents
Non-contact measuring method and equipment of thermal expansion coefficient Download PDFInfo
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- CN1152124A CN1152124A CN 96115325 CN96115325A CN1152124A CN 1152124 A CN1152124 A CN 1152124A CN 96115325 CN96115325 CN 96115325 CN 96115325 A CN96115325 A CN 96115325A CN 1152124 A CN1152124 A CN 1152124A
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Abstract
The measurement process includes the optical enlargement, optical signal collection with solid CCD camera, optical signal processing and other steps. It features its two-stage optical enlargement with the second stage enlarging only the two edges of image formed in the first enlargement and the enlarged edges being focussed onto one CCD.
Description
The thermal expansivity of material is important physical property, and is all significant to engineering application and scientific research.In recent years, development such as amorphous material, surface coating, Coating Materials, semiconductor film material is very fast, becomes the focus of material science research.Large scale integrated circuit and microelectric technique, hard films, superconducting film, the used Thermal Control Coating Material in space station etc. play an important role in hi-tech.When be applied to be heated, under the hot conditions, hot expansibility is most important.For example, space station used coating material must make the thermal stress between coating material and the matrix material reduce, and makes it be unlikely at high temperature to peel off, and therefore requires the approaching as far as possible or coupling of thermal expansivity between the two.Membraneous material has no rigidity, frangible, flexible characteristics, also is difficult to obtain large-sized sample.Conventional thermal dilatometer such as push rod method, interferometric method can not be carried out the measurement of film thermal expansion.Have about film thermal expansion measurement research report at present: the X-ray method, but be only applicable to crystalline material, and have the more numerous problem of data processing; Single slit diffraction method is only seen the meeting coverage of introducing its principle, does not see the report of instrument moulding; Interfere the Newton ring method, error is very big, reaches 20%, and when the thermal expansivity of film and matrix is close, is restricted; For amorphous ribbon, have by improved mechanical lever method on the differential transformer method basis, thereby and roll of strip got up to form the method that bulk sample is measured, but the thermal expansion measurement of inapplicable thickness no stiffness films below 15 μ m.Up to the present, do not see the maturation method that is useful on the film thermal expansion measurement.
The solid photographic device CCD (ChargeCoupled Device) that utilizes the electric charge lotus root to close principle to make for noncontact, the automatic measurement of realizing thermal expansion provides may.Although the photosensitive first spacing minimum of CCD that application large scale integrated circuit technology is made has only several microns, the resolution of imaging is higher, but still can not satisfy the Testing requirement of thermal expansivity, must break through the restriction of photosensitive first spacing to its resolution.
Carry out company of science of Italian Roma Univ. of having of thermal expansion non-cpntact measurement and Amada Co., Ltd. about using CCD in the world, the wherein research of Roma Univ., sample is the cylindrical rod of former long 20mm, sample is amplified 10 times by integral body, with two CCD device elements positioning as the edge of sample surveyed length, by photosensitive first spacing segmentation of CCD and optics are amplified, survey long resolution and reach 0.15 μ m; In the measuring system of company of science, the former length of sample is 20mm or 40mm, and the linear measure longimetry resolution reaches 1 μ m.The enlargement factor of the measuring system of these two research institutions is lower than 20 times, mainly is the restriction that is subjected to electro-optical system conventional design thought, and volume is big, complex structure, and in addition the cost height, all is at bulk sample.
The object of the present invention is to provide a kind of thermal expansivity non-contact measurement method and device of realizing by the CCD technology, have the high-precision while at assurance device, its compact conformation, volume is little, is easy to Installation and Debugging, and can finish the measurement to the film thermal expansion.
The invention provides a kind of non-contact measurement method of thermal expansivity, comprise that the optics to sample amplifies, with the processing of solid photographic device CCD to light signal collection and photosignal, it is characterized in that: the optics amplifier section adopts secondary to amplify, only amplify respectively once more to two picture edges of the first order imaging second level, and final focal imaging is on a CCD.Because sample need be put into stove and heat, thereby the object distance of optical amplification system is longer.If the whole amplification of sample, light path is very long, must bring doting on of device structure big, therefore can limit the enlargement factor of optical amplification system.Adopted the two poles of the earth amplification for obtaining high enlargement factor, only amplified, to shorten light path, simplified structure to the sample edge is local.In general, paraxial object point imaging has good picture element, thereby the enlargement factor of the first order is unsuitable excessive, be designed to 1: 1, only amplify respectively once more to two picture edges of the first order imaging second level, because object distance can be very little, second level enlargement factor can design very greatly, from 20～100 times, thereby improved the measuring accuracy of length variations greatly.When optical lens designs, considered to require second level lens combination to still have good picture element in the imaging that departs under the primary optical axis situation.Therefore the design of the design of second level lens combination and first order lens group will match each other, and promptly the residual aberration Symbol Design of two-stage becomes opposite, equal and opposite in direction, thus make total aberration little to negligible degree.Measure in the time of in addition to the sample edges at two ends, can obtain absolute expansion elongation, have higher measuring accuracy than monolateral measurement.
The present invention also provides the measurement mechanism of realizing above-mentioned measuring method, comprise illuminator, the specimen mounting system, optical system, electronic system, four major parts, it is characterized in that: design of Optical System is a box-type shell (13), housing (13) porch is provided with first order lens group (6), it is provided with a diaphragm (8) as the place, plane, the second level lens group (9) that fixedly installs two groups of identical enlargement factors behind the diaphragm (8) is provided with two plane mirrors respectively with light path angle at 45, and imaging plane place in the second level is provided with a solid photographic device CCD.Two pieces of quartz glass of specimen mounting system for adjusting with the jackscrew clamping.Being provided with of diaphragm mainly is to overlap on CCD for fear of two light intensity bright fields as the edge, the aliasing of ccd image signal takes place, being provided with of two catoptrons can guarantee to make structure more compact under the prerequisite of light path, and with sample two edges image in simultaneously on a slice CCD.By example in detail the present invention is described in detail below in conjunction with accompanying drawing.
Accompanying drawing 1 is a thermal expansivity non-cpntact measurement apparatus structure synoptic diagram
Accompanying drawing 2 is the specimen mounting synoptic diagram
Accompanying drawing 3 electronic system synoptic diagram
Accompanying drawing 4 is the video amplifier circuit schematic diagram
Accompanying drawing 5 length variations amount calculating program frame charts
Embodiment
This device is attached on the existing pulse laser thermal conductance instrument.
The specimen mounting system
How designing the specimen mounting that is suitable for film sample is important problem, is related to the feasibility of whole experiments of measuring system.Used specimen mounting must be easy to install in the heating furnace on the existing pulse laser thermal conductance instrument, and will guarantee that sample is in the fixed position at center in the heating furnace, makes its object distance for optical system keep certain.
Fig. 4-1 expression is used to measure the specimen mounting synoptic diagram of thermal expansion, the dimensional requirement of sample is 10 * 10mm size, with two thick quartz glass plate clampings, quartz glass plate thickness is 2.5mm, even so at high temperature under the not tight state on screw top, quartz glass still is kept upright, the sample specimen mounting that do not occur bending and deformation is fixed on the cylinder that interior diameter is 16mm with screw thread, its length is 10cm, used interior diameter is a part behind the specimen mounting of 18mm with measuring thermal conductivity again, fuse by screw thread, whole specimen mounting is screwed on the specimen mounting carriage in heating furnace.Has cooling water pipe in the carriage, the deflection about can avoiding at high temperature taking place about specimen mounting.Fig. 4-2 and Fig. 4 the-the 3rd, the photo when specimen mounting integral body and installation.
The accuracy of thermometric is very big to the thermal expansion measurement influence, in order to obtain consistent temperature with sample, when generally using thermocouple temperature measurement, thermopair is welded on the sample.And for film, coating sample, the welding heat galvanic couple can damage sample, and thermocouple wire can have little distortion power effect to sample in addition, and sample can freely not stood on the table top of specimen mounting fully, will influence the length variations measuring accuracy.Therefore, Ni-Cr/Ni-Al temperature thermocouple (Ф 0.2mm) point is welded on the stainless steel circle sheet of diameter less than 2mm, in the middle of the quartz glass plate bottom of back, grind the semicircle orifice of Ф 4mm, as thermocouple sheath, front end is fixed on the platform of specimen mounting with filament with the quartz glass tubule.The Thin Stainless Steel disk of band thermopair can uprightly can move freely again in the horizontal direction, and it is closely contacted with the sample rear surface, and sample measured temperature and sample actual temperature are approaching like this
2. illuminator
Selecting halogen lamp for use is lighting source, and its rated voltage is 24V, and the maximum voltage of stabilized voltage supply is 30V full scale electric current 10A.For the short distance lighting condition, this light source belongs to intense light source, is applicable to the application scenario that high power optics amplifies.Shown in Fig. 4-4, face mirror (2) is thrown in the light line focus that halogen lamp (1) produces, and is radiated on the frosted glass plate (3), and frosted glass plate is positioned at the focal position of focus lens group (4), forms parallel beam.The design of illuminator has taken into full account the very little characteristics of the distinctive incident diaphragm of photoeletric measuring system and has obtained the sample of maximal illumination as the edge as far as possible.
2. optical system
If the whole amplification of sample, light path is very long.In order to shorten light path, adopt two stage optical to amplify double mirror light path, first order imaging in 1: 1, amplification imaging is only distinguished once more to two picture edges of first order imaging in the second level, enlargement factor is 40, and after two mirror reflects, focal imaging is on a CCD.First order lens group is made up of 4 camera lenses, compose two groups, distance is 2-8mm between two groups, can be used for accurate focusing, first order imaging and second level lens combination distance are 8.3mm, be provided with a diaphragm at this as the planimetric position, on CCD, overlap, the aliasing of the picture signal of CCD takes place for fear of the light intensity bright field of two pictures.
Second level enlarging lens group is two groups of identical lens combination, and short burnt by 4 respectively, the camera lens of big numerical aperture is formed.The optical axis of lens combination and the distance of primary optical axis are 5.25mm, and the field range of each lens combination is 0.30mm, and the elongation that causes for the thermal expansion of the sample that is a bit larger tham the former length of 10mm is measured and is sufficient for sb.'s need.Fig. 4-the 5th, the sheet of stinging of optics amplification imaging system.
Another characteristics of this light path secondary imaging are expansion elongations of sample, through be imaged on for twice be transformed into sample on the CCD target surface the picture edge by both sides end moving to the center, therefore only use the long photoelectricity scale of 35mm of a slice CCD device formation of 5000 * 7 μ m, can finish two on sample is sampled simultaneously as edge image.Take sample two to sample simultaneously, its objective is in order to obtain absolute expansion elongation to have higher measuring accuracy than monolateral measurement as edge image.Little to the influence of measuring to negligible degree, and needn't carry out special correction.
Electronic system
Electronic system partly is made up of CCD device, driving circuit, the video amplifier, data acquisition etc.Finally finish the processing of data with computing machine, see Fig. 3.
In general, measurement range and measuring accuracy are to select the main foundation of CCD device.The size of the former length of this measurement system tested sample is about 10mm, and the enlargement ratio of optical system is 40 times, and tested expansion elongation precision prescribed is higher, should be 0.1 μ m, and its corresponding precision on image planes is 4 μ m.Measure the needs of sensitivity according to CCD, 4 μ m are less than the bulk of 1 CCD light sensitive pixels.Select TCD141C model C CD can satisfy the requirement of measurement range and precision.
What its driving circuit was that TCD141C requires is the circuit of core with the WQ2801 module.
Adjust the gain multiple for continuous, and the self-sustained oscillation phenomenon does not take place, the video amplification has adopted three grades of amplifications to see Fig. 4.
The first order adopts the LF357 operational amplifier, is used for anti-phasely, and enlargement factor is 1: 1, and purpose is the negative pulse vision signal of CCD output, converts the positive pulse vision signal to, so that further handle and the A/D collection.
The second level is that the current potential of CCD video pulse signal is adjusted, and also promptly adjusts the level that the U3W potentiometer can change bright field and details in a play not acted out on stage, but told through dialogues simultaneously equally, its objective is the zero point of adjusting A/D conversion quantized value, to reducing noise certain effect is arranged in addition.Used is the LF356 operational amplifier.
The third level is the positive amplifier section, employing be the LF357 operational amplifier, U5W2 can adjust the gain multiple of signal continuously, and the self-sustained oscillation phenomenon does not take place, and makes to send signal before the A/D acquisition system can transfer to the upper limit of dynamic range.
Adopt 8 high-speed AD converter AD3318, static storage SRAM62256, one time acquisition starts, continuous acquisition six width of cloth CCD electronic images, computing machine carries out data processing, collection degree C language compilation.
The data processing of picture edge dislocation amount
Because influences such as a large amount of various noises and the response of photosensitive unit are inhomogeneous, sample can be distorted as the edge, adopts the medium filtering software approach to carry out smoothing processing, the elimination influence of making an uproar, adopt the multiple spot criterion to look like the calculating of edge dislocation amount, ask average again, further reduce stochastic error.Each measurement point is repeatedly measured and is asked average, improves measuring accuracy.Flow chart as shown in Figure 5.
Claims (4)
1. the non-contact measurement method of a thermal expansivity, comprise that the optics to sample amplifies, with the treatment step of solid-state image pickup CCD to light signal collection and photosignal, it is characterized in that: the optics amplifier section adopts secondary to amplify, only amplify respectively once more to two picture edges of the first order imaging second level, and final focal imaging is on a CCD.
2. by the non-contact measurement method of the described thermal expansivity of claim 1, it is characterized in that: first order enlargement factor is 1 times, and second level enlargement factor is 20～100 times.
3. thermal expansivity non-cpntact measurement device of realizing the described measuring method of claim 1, comprise illuminator, the specimen mounting system, optical system, electronic system, four major parts, it is characterized in that: design of Optical System is a box-type shell (13), housing (13) porch is provided with first order lens group (6), it is provided with a diaphragm (8) as the place, plane, the second level lens group (9) that fixedly installs two groups of identical enlargement factors behind the diaphragm (8) is provided with two plane mirrors respectively with light path angle at 45, and imaging plane place in the second level is provided with a solid photographic device CCD.
4. by the described thermal expansivity non-cpntact measurement of claim 3 device, it is characterized in that two pieces of quartz glass of described specimen mounting system for regulating with the jackscrew clamping.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 96115325 CN1069133C (en) | 1996-05-22 | 1996-05-22 | Non-contact measuring method and equipment of thermal expansion coefficient |
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| Application Number | Priority Date | Filing Date | Title |
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| CN 96115325 CN1069133C (en) | 1996-05-22 | 1996-05-22 | Non-contact measuring method and equipment of thermal expansion coefficient |
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| CN1152124A true CN1152124A (en) | 1997-06-18 |
| CN1069133C CN1069133C (en) | 2001-08-01 |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101140249B (en) * | 2007-10-23 | 2010-09-01 | 北京科技大学 | Double light beam laser interferometry method of material thermal expansion coefficient |
| CN101063604B (en) * | 2006-04-24 | 2011-08-03 | 贝尔-热分析有限公司 | Optical dilatometer |
| CN103018111A (en) * | 2012-11-30 | 2013-04-03 | 清华大学 | Non-contact experimental method for measuring heat constant of high-temperature material |
| CN104297285A (en) * | 2014-09-10 | 2015-01-21 | 董赫 | Metal linear expansion coefficient measuring device based on Michelson interference method |
| CN104359938A (en) * | 2014-11-25 | 2015-02-18 | 中国建筑材料科学研究总院 | Method for testing thermal expansion coefficient of coating |
| CN105181737A (en) * | 2015-09-09 | 2015-12-23 | 哈尔滨工业大学 | Non-contact in-situ test method and device for super-high temperature thermal expansion factor |
| CN105973926A (en) * | 2016-04-28 | 2016-09-28 | 华南理工大学 | Apparatus for measuring thermal expansion coefficient of powder material, and method thereof |
| CN106932434A (en) * | 2017-03-03 | 2017-07-07 | 武汉科技大学 | A kind of nanometer of method of the thermal conductivity factor of imaging technique measurement sample |
| CN108051182A (en) * | 2017-11-07 | 2018-05-18 | 扬州莱达光电技术有限公司 | A kind of laser subsystem integral test system |
| CN108279252A (en) * | 2017-01-06 | 2018-07-13 | 鞍钢股份有限公司 | Method for measuring and calculating thermal expansion and cold contraction coefficient of oriented silicon steel coil in diameter direction during high-temperature annealing |
| CN109490307A (en) * | 2019-01-24 | 2019-03-19 | 沈阳工程学院 | Device based on pinhole imaging system metal linear expansion coefficient measurement |
| CN113447515A (en) * | 2020-03-26 | 2021-09-28 | 日本株式会社日立高新技术科学 | Sample container and thermal analysis device |
-
1996
- 1996-05-22 CN CN 96115325 patent/CN1069133C/en not_active Expired - Fee Related
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101063604B (en) * | 2006-04-24 | 2011-08-03 | 贝尔-热分析有限公司 | Optical dilatometer |
| CN101140249B (en) * | 2007-10-23 | 2010-09-01 | 北京科技大学 | Double light beam laser interferometry method of material thermal expansion coefficient |
| CN103018111A (en) * | 2012-11-30 | 2013-04-03 | 清华大学 | Non-contact experimental method for measuring heat constant of high-temperature material |
| CN103018111B (en) * | 2012-11-30 | 2014-11-26 | 清华大学 | Non-contact experimental method for measuring heat constant of high-temperature material |
| CN104297285A (en) * | 2014-09-10 | 2015-01-21 | 董赫 | Metal linear expansion coefficient measuring device based on Michelson interference method |
| CN104359938A (en) * | 2014-11-25 | 2015-02-18 | 中国建筑材料科学研究总院 | Method for testing thermal expansion coefficient of coating |
| CN105181737A (en) * | 2015-09-09 | 2015-12-23 | 哈尔滨工业大学 | Non-contact in-situ test method and device for super-high temperature thermal expansion factor |
| CN105181737B (en) * | 2015-09-09 | 2017-10-24 | 哈尔滨工业大学 | The method and device of superhigh temperature thermal coefficient of expansion noncontact in-situ test |
| CN105973926A (en) * | 2016-04-28 | 2016-09-28 | 华南理工大学 | Apparatus for measuring thermal expansion coefficient of powder material, and method thereof |
| CN108279252A (en) * | 2017-01-06 | 2018-07-13 | 鞍钢股份有限公司 | Method for measuring and calculating thermal expansion and cold contraction coefficient of oriented silicon steel coil in diameter direction during high-temperature annealing |
| CN106932434A (en) * | 2017-03-03 | 2017-07-07 | 武汉科技大学 | A kind of nanometer of method of the thermal conductivity factor of imaging technique measurement sample |
| CN108051182A (en) * | 2017-11-07 | 2018-05-18 | 扬州莱达光电技术有限公司 | A kind of laser subsystem integral test system |
| CN108051182B (en) * | 2017-11-07 | 2020-02-21 | 扬州科莱光电技术有限公司 | A kind of laser subsystem comprehensive test equipment |
| CN109490307A (en) * | 2019-01-24 | 2019-03-19 | 沈阳工程学院 | Device based on pinhole imaging system metal linear expansion coefficient measurement |
| CN109490307B (en) * | 2019-01-24 | 2023-11-03 | 沈阳工程学院 | Device for measuring metal linear expansion coefficient based on small hole imaging |
| CN113447515A (en) * | 2020-03-26 | 2021-09-28 | 日本株式会社日立高新技术科学 | Sample container and thermal analysis device |
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|---|---|
| CN1069133C (en) | 2001-08-01 |
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