CN115172355A - Package structure and method for manufacturing the same - Google Patents
Package structure and method for manufacturing the same Download PDFInfo
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- CN115172355A CN115172355A CN202210628272.0A CN202210628272A CN115172355A CN 115172355 A CN115172355 A CN 115172355A CN 202210628272 A CN202210628272 A CN 202210628272A CN 115172355 A CN115172355 A CN 115172355A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/18—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of the types provided for in two or more different main groups of the same subclass of H10B, H10D, H10F, H10H, H10K or H10N
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49565—Side rails of the lead frame, e.g. with perforations, sprocket holes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49575—Assemblies of semiconductor devices on lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/4813—Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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Abstract
本发明提供一种封装结构及其制作方法，涉及电子封装技术领域，封装结构包括封装框架和第一芯片，封装框架包括至少一个基岛和分布于基岛周侧的管脚，第一芯片设置于基岛上，第一芯片表面设置有第一焊盘，封装结构包括与第一焊盘通过焊线电性连接的连接焊区；在第一焊盘和连接焊区之间焊线的延伸区域，设置有至少一个焊线转接件，焊线转接件表面设置有导电区，焊线包括多段分焊线，从第一焊盘开始、经导电区至连接焊区，相邻两者之间依次通过一段分焊线电性连接。通过多条分焊线来实现单焊线的功能，能够显著提升分焊线整体的结构强度，降低失效风险，并且分焊线的排布能够灵活调整，可以适应不同的复杂封装结构。
The invention provides a package structure and a manufacturing method thereof, and relates to the technical field of electronic packaging. The package structure includes a package frame and a first chip. The package frame includes at least one base island and pins distributed on the periphery of the base island. The first chip is provided with On the base island, the surface of the first chip is provided with a first pad, and the package structure includes a connection pad that is electrically connected to the first pad through a bonding wire; the extension of the bonding wire between the first pad and the connection pad At least one bonding wire adapter is arranged on the surface of the bonding wire adapter, and the surface of the bonding wire adapter is provided with a conductive area. They are electrically connected in turn through a section of sub-bonding wire. The function of a single bonding wire is realized through multiple sub-bonding wires, which can significantly improve the overall structural strength of the sub-bonding wire, reduce the risk of failure, and the arrangement of the sub-bonding wires can be flexibly adjusted to adapt to different complex packaging structures.
Description
Technical Field
The invention relates to the technical field of electronic packaging, in particular to a packaging structure and a manufacturing method thereof.
Background
With the development of technology, the requirement for functional integration of the chip package structure is higher and higher, so that a large number of chips and chip package structures with large sizes are available, and the length of the bonding wire in the package structure is longer and longer because the bonding wire in the package structure can meet the requirement of the package structure with large size. However, the too long bonding wires are lack of support, so that the structural strength is low, the difficulty of the manufacturing process of the long bonding wires is high, and the problems of unstable bonding wires, wire throwing, wire collapsing and the like are easily caused, so that the packaging structure is invalid.
Disclosure of Invention
The invention aims to provide a packaging structure and a manufacturing method thereof.
The invention provides a packaging structure, which comprises a packaging frame and a first chip, wherein the packaging frame comprises at least one base island and pins distributed on the periphery of the base island;
at least one welding wire adapter is arranged in an extending area of the welding wire between the first welding pad and the connecting welding area, a conductive area is arranged on the surface of the welding wire adapter, the welding wire comprises a plurality of sections of sub-welding wires, and the adjacent welding wires are electrically connected through the sub-welding wires sequentially from the first welding pad to the connecting welding area through the conductive area.
As a further improvement of the present invention, the first chip is provided with the first bonding pad and the second bonding pad, the second bonding pad forms the connection bonding area, the area of the surface of the first chip between the first bonding pad and the second bonding pad is provided with at least one bonding wire adaptor, the bonding wire includes a plurality of segments of bonding wires, and the bonding wires are electrically connected with each other sequentially through a segment of bonding wires from the first bonding pad to the second bonding pad.
As a further improvement of the present invention, the present invention further includes a second chip, a second bonding pad is disposed on the second chip, the second bonding pad forms a connection bonding area, at least one bonding wire adaptor is disposed on a region of the surface of the base island between the first chip and the second chip, the bonding wire includes a plurality of segments of sub-bonding wires, and the sub-bonding wires are electrically connected to the second bonding pad sequentially through a segment of the sub-bonding wire from the first bonding pad through the conductive area.
As a further improvement of the present invention, the package frame includes a first pin, the first pin constitutes the connection pad, a bonding wire adaptor is disposed on a region of the surface of the base island between the first pad and the first pin, the bonding wire includes a first sub-bonding wire and a second sub-bonding wire, and the first pad, the conductive region and the first pin are electrically connected to each other sequentially through a segment of the sub-bonding wire.
As a further improvement of the present invention, the bonding wire adaptor is an adaptor chip, the adaptor chip is disposed on the surface of the first chip and/or the base island in an insulating manner, and a plurality of bonding pads are disposed on the surface of the adaptor chip to form the conductive area.
As a further improvement of the present invention, the bonding wire adaptor is a metal sheet, a surface of the metal sheet forms the conductive area, and the metal sheet is fixed on the surface of the first chip and/or the base island in an insulating manner.
As a further improvement of the present invention, the bonding wire interposer is an interposer, the interposer is fixed on the surface of the first chip and/or the substrate in an insulating manner, the interposer includes a dielectric layer and a metal circuit disposed therebetween, and the metal circuit constitutes a conductive area.
As a further improvement of the present invention, the bonding wire adaptor is attached to the surface of the first chip and/or the base island by an insulating adhesive or an insulating film.
Based on the same inventive concept, the invention also provides a manufacturing method of the packaging structure, which comprises the following steps:
providing a packaging frame, and placing a first chip on a base island of the packaging frame;
at least one bonding wire adapter is arranged between the first bonding pad and the connection welding area on the surface of the first chip;
and bonding wires are sequentially led from the first bonding pad to the connecting bonding area through the conductive area, and the adjacent bonding wires are electrically connected.
As a further improvement of the present invention, at least one bonding wire adaptor is disposed between the first bonding pad and the connection pad on the first chip surface, and specifically includes:
arranging at least one bonding wire adapter positioned on the surface of a first chip between a first bonding pad and a second bonding pad on the surface of the first chip;
and adhering the bonding wire adapter on the surface of the first chip through insulating glue or an insulating film.
As a further improvement of the present invention, the disposing at least one bonding wire interposer between the first bonding pad and the connection pad on the first chip surface specifically includes:
a second chip is disposed on the base island,
arranging at least one bonding wire adapter on the surface of the base island between a first bonding pad on the surface of a first chip and a second bonding pad on the surface of a second chip;
and adhering the bonding wire adapter on the surface of the base island through insulating glue or an insulating film.
As a further improvement of the present invention, the disposing at least one bonding wire interposer between the first bonding pad and the connection pad on the first chip surface specifically includes:
at least one bonding wire adapter positioned on the surface of the base island is arranged between a first bonding pad on the surface of a first chip and a first pin of the lead frame;
and adhering the bonding wire adapter on the surface of the base island through insulating glue or an insulating film.
The invention has the beneficial effects that: according to the invention, a single welding line is decomposed into a plurality of shorter branch welding lines, and the welding line adapter is arranged in the packaging structure to play a role in structural support and electrical switching for the branch welding lines, so that the function of the single welding line is realized through the plurality of branch welding lines, the integral structural strength of the branch welding lines can be obviously improved, the failure risk is reduced, the arrangement of the branch welding lines can be flexibly adjusted, and the packaging structure can be adapted to different complex packaging structures.
Drawings
Fig. 1 is a top view of a package structure in embodiment 1 of the invention.
Fig. 2 is a front view of a package structure in embodiment 1 of the present invention.
Fig. 3 is a top view of a package structure in embodiment 2 of the invention.
Fig. 4 is a front view of a package structure in embodiment 2 of the present invention.
Fig. 5 is a top view of a package structure in embodiment 3 of the invention.
Fig. 6 is a front view of a package structure in embodiment 3 of the present invention.
Fig. 7 is a top view of a package structure in embodiment 4 of the invention.
Fig. 8 is a front view of a package structure in embodiment 4 of the present invention.
Fig. 9 is a schematic view illustrating a manufacturing process of a package structure according to an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more clear, the technical solutions of the present application will be clearly and completely described below with reference to the detailed description of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention and are not to be construed as limiting the present invention.
For convenience in explanation, the description herein uses terms indicating relative spatial positions, such as "upper," "lower," "rear," "front," and the like, to describe one element or feature's relationship to another element or feature as illustrated in the figures. The term spatially relative position may encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "above" other elements or features would then be oriented "below" or "above" the other elements or features. Thus, the exemplary term "below" can encompass both a spatial orientation of below and above.
Example 1
As shown in fig. 1 and fig. 2, embodiment 1 provides a package structure 1, which can decompose a longer bonding wire in the package structure 1 into a shorter sub-bonding wire, so as to improve the strength of the bonding wire structure, thereby reducing the wire breakage problem of the long bonding wire, reducing the failure risk, and reducing the difficulty of the manufacturing process. The package structure 1 includes a package frame 11 and a first chip 12, the package frame 11 includes at least one base island 111 and pins 112 distributed around the base island 111, and the first chip 12 is disposed on the base island 111. Illustratively, in the present embodiment, the package frame 11 includes one rectangular base island 111 and pins 112 disposed on the periphery of the four sides of the base island 111. In other embodiments, a plurality of base islands 111 may be provided according to the functional requirements of the package structure 1, and the location area of the pins 112 may be adjusted accordingly.
The first chip 12 has a first bonding pad 121 disposed on a surface thereof, and the package structure 1 includes a connection pad electrically connected to the first bonding pad 121 through a bonding wire. Specifically, in the present embodiment, the first chip 12 is further provided with a second pad 122, and the second pad 122 constitutes a connection pad. The first bonding pad 121 and the second bonding pad 122 are respectively disposed on two opposite sides of the first chip 12, the first bonding pad 121 and the second bonding pad 122 need to be electrically connected through a bonding wire, when a bonding wire is directly led, the length of the bonding wire is too long, failure risks such as wire collapse are easily caused, and the process implementation difficulty is high.
The surface of the first chip 12 is further provided with other bonding pads, and the bonding pads are electrically connected to the pins 112 through bonding wires, which is a conventional structure and will not be described herein again.
Furthermore, in order to decompose the length of the long bonding wire, at least one bonding wire adapter 13 is arranged in an extending area of the bonding wire between the first bonding pad 121 and the connection bonding area, a conductive area 131 is arranged on the surface of the bonding wire adapter 13, the bonding wire comprises a plurality of sections of sub-bonding wires 14, and the bonding wire is electrically connected with the connection bonding area through the bonding wire adapter 13 from the first bonding pad 121 in sequence through the sub-bonding wires 14. That is, a long bonding wire is divided into a plurality of short sub-bonding wires 14, opposite ends of two adjacent sub-bonding wires 14 are respectively disposed on the conductive region 131 of the bonding wire adapter 13, and the plurality of sub-bonding wires 14 sequentially pass through the bonding wire adapter 13 to form a structure similar to a sequential end-to-end connection.
By decomposing a long welding wire into a plurality of short branch welding wires 14 and taking the welding wire adapter 13 as a middle supporting structure of the branch welding wires 14 and an electrical switching structure, the function of the original single long welding wire is realized by utilizing the plurality of branch welding wires 14, so that the structural strength of the welding wire can be effectively improved, the failure risk is reduced, and the welding wire is easier to realize in the manufacturing process.
The bonding wire adaptor 13 is disposed on the surface of the first chip 12 and/or the base island 111 in an insulating manner, and serves as a structural support and an electrical conduction for the bonding wires 14, which may have various implementations and structures, and is described below with reference to several examples:
the bonding wire adapter 13 is a switching chip 13a, the switching chip 13a is attached to the surface of the first chip 12 and/or the base island 111 through an insulating adhesive or an insulating film, the structural size of the switching chip is much smaller than that of the first chip 12, a plurality of switching pads 131a are arranged on the surface of the switching chip 13a to form a conductive region 131, the switching chip 13a only plays a role in electrical switching, and the bonding wire adapter is simple in structure, high in reliability, and both of the existing mature materials and technologies, easy to implement, and capable of avoiding great influence on the size of the packaging structure 1 by arranging the small switching chip 13 a.
The bonding wire adaptor 13 is a metal sheet, and is attached to the surface of the first chip 12 and/or the base island 111 through an insulating adhesive or an insulating film, etc., the surface of the metal sheet forms a conductive region 131, and the influence of the metal sheet on the size of the package structure 1 can be further reduced by using the metal sheet as the bonding wire adaptor 13. Furthermore, a metal sheet with a composite layer can also be used as the bonding wire adaptor 13, for example, an insulating layer is arranged on the bottom surface of the metal sheet, so that the risk of short circuit is further reduced, and the reliability of the packaging structure 1 is improved.
The bonding wire interposer 13 is an interposer, which is attached to the surface of the first chip 12 and/or the substrate 111 through an insulating adhesive or an insulating film, and includes a dielectric layer and a metal circuit disposed therebetween, where the metal circuit constitutes a conductive region 131.
The bonding wire adapter 13 may also be disposed on the surface of the chip and/or the substrate in an insulating manner by other methods, as long as the elements capable of performing the functions of adapter or bridge connection can be used as the bonding wire adapter 13, which is not limited to the above three bonding wire adapter structures. When a plurality of bonding wire adapters 13 are provided, the bonding wire adapters 13 of different structures may be respectively provided according to functional requirements and structural characteristics of the bonding wire adapters 13 of different structures.
Specifically, in embodiment 1, a relay chip 13a is disposed on a surface of the first chip 12 in a region between the first bonding pad 121 and the second bonding pad 122, the bonding wires include a first bonding wire 141 and a second bonding wire 142, the first bonding pad 121 and the relay chip 13a are electrically connected through the first bonding wire 141, and the relay chip 13a and the second bonding pad 122 are electrically connected through the second bonding wire 142.
The relay chip 13a is disposed at a position between the first bonding pad 121 and the second bonding pad 122, the first bonding wire 141 and the second bonding wire 142 are substantially parallel to each other, and opposite ends of the first bonding wire 141 and the second bonding wire 142 are respectively connected to two sides of the relay bonding pad 131a of the relay chip 13a, so that lengths of the first bonding wire and the second bonding wire can be balanced when the first bonding wire and the second bonding wire are as short as possible, and bonding points of the first bonding wire 141 and the second bonding wire 142 on the relay bonding pad 131a are kept at a longer distance, thereby further improving reliability and reducing risk of short circuit.
In other embodiments, when it is necessary to avoid some functional components in the package structure 1, the position of the adaptor chip 13a on the surface of the first chip 12 may also be adjusted, and the lengths of the first and second bonding wires 141 and 142 are adaptively adjusted, so as to adjust the distribution positions of the first and second bonding wires, so that the structure of the bonding wires 14 can be flexibly adjusted, and more usage scenarios are met.
In summary, in embodiment 1, the through chip 13a is disposed on the first chip 12, and the long bonding wires that originally need to cross the first chip 1 are divided into two shorter sub-bonding wires 14, so that the structural strength of the bonding wires can be effectively improved, the occurrence of wire breakage and other problems can be reduced, and the failure risk can be reduced.
Example 2
As shown in fig. 3 and 4, embodiment 2 provides a package structure 2, which has a general structure similar to that of embodiment 1 and is different from that of embodiment 1 in that:
a plurality of bonding wire adapters 23 are disposed on the surface of the first chip 22 in a region between the first bonding pad 221 and the second bonding pad 222, the bonding wires include a plurality of segments of bonding wires 24, and the first bonding pad 221 and the bonding wire adapter 23 adjacent thereto, two adjacent bonding wire adapters 23, the second bonding pad 222 and the bonding wire adapter 23 adjacent thereto are electrically connected through one segment of bonding wire 24.
Specifically, in embodiment 2, two adapter chips 23a are disposed on the first chip 22, and the two adapter chips 23a are disposed to divide the original bonding wire into three bonding wires 24, so as to further reduce the length of each bonding wire 24, and the positions of the adapter chips 23a on the surface of the first chip 22 can be adjusted, so that the distribution positions of the bonding wires 24 on the surface of the first chip 22 can be flexibly adjusted, and the layout design of the package structure 2 can have higher flexibility.
In other embodiments, more wire bond adapters 23 may be further provided to further resolve long wire bonds, depending on the size of the first chip 22, the distance between the first bonding pad 221 and the second bonding pad 222, and the like.
Example 3
As shown in fig. 5 and 6, embodiment 3 provides a package structure 3, which is similar to embodiment 1 in general structure and is different from embodiment 1 in that:
the package structure 3 further includes a second chip 35, a second bonding pad 351 is disposed on the second chip 35, the second bonding pad 351 forms a connection bonding area, at least one bonding wire adapter 33 is disposed in a region between the first chip 32 and the second chip 35 on the surface of the base island 311, the bonding wire includes a plurality of segments of bonding wires 24, and the bonding wires are electrically connected with the second bonding pad 351 sequentially through the segment of bonding wires 34 from the first bonding pad 321 through the bonding wire adapter 33.
Specifically, in embodiment 3, a transit chip 33a is disposed at a center position of a region between the first bonding pad 321 and the second bonding pad 351 on the surface of the base island, the bonding wires include a first sub-bonding wire 341 and a second sub-bonding wire 342, the first bonding pad 321 and the transit chip 33a are electrically connected through the first sub-bonding wire 341, and the transit chip 33a and the second bonding pad 351 are electrically connected through the second sub-bonding wire 342.
In embodiment 3, the long bonding wires connecting two chips can be separated into two shorter separation bonding wires 3 by disposing the bonding wire interposer 33 between the first chip 32 and the second chip 35 in embodiment 3, compared with embodiments 1 and 2, which separate the long bonding wires disposed across the chip surface.
In other embodiments, a plurality of wire bonding adapters 33 may be disposed according to the distance between the first chip 32 and the second chip 35, and the distribution positions of the wire bonding adapters 33 may be adjusted to further flexibly decompose the long bonding wires. Moreover, when the distance between the first chip 32 and the second chip 35 is large and the length of the first chip 32 and/or the second chip 35 is long, the wire bonding adaptor 33 may be disposed on the surface of the chip and the surface of the base island 311 to resolve long bonding wires.
Example 4
As shown in fig. 7 and 8, embodiment 4 provides a package structure 4, which has a general structure similar to that of embodiment 1 and is different from that of embodiment 1 in that:
the package frame 41 includes a first pin 413, the first pin 413 forms a connection pad, a bonding wire adaptor 43 is disposed on a region of the surface of the base island 411 between the first pad 421 and the first pin 413, the bonding wire includes a first bonding wire 441 and a second bonding wire 442, and the first pad 421 and the second pad 413 are electrically connected to the first pin 413 through the bonding wire adaptor 43 in sequence by a segment of bonding wire 44.
Specifically, in embodiment 4, a transit chip 43a is disposed on the surface of the base island 411 in the center of the region between the first pad 421 and the first pin 413, the bonding wires include a first sub-bonding wire 441 and a second sub-bonding wire 442, the first pad 421 and the transit chip 43a are electrically connected through the first sub-bonding wire 441, and the transit chip 43a and the first pin 413 are electrically connected through the second sub-bonding wire 442.
In comparison with embodiments 1 and 2 in which long bonding wires arranged across the chip surface are separated, embodiment 3 in which long bonding wires arranged between two chips are separated, and embodiment 4 in which a bonding wire adapter 43 is arranged between a first chip 42 and a first pin 413, the long bonding wires connecting the chips and the pins can be separated into two shorter branch bonding wires 24.
In other embodiments, a plurality of wire bonding adapters 43 may be disposed according to the distance between the first chip 42 and the first pin 413, and the distribution positions of the wire bonding adapters 43 may be adjusted to further flexibly resolve long bonding wires. Moreover, when the distance between the first chip 42 and the first pin 413 is large and the length of the first chip 42 is long, the bonding wire adaptor 43 may be disposed on the surface of the first chip 42 and the surface of the base island 411 to resolve long bonding wires.
It is understood that, not limited to the above 4 embodiments, when there are multiple long bonding wires in the package structure, the above embodiments may be combined in a single package structure to form other embodiments as will be understood by those skilled in the art.
Based on the same inventive concept, as shown in fig. 9, the present invention further provides a method for manufacturing a package structure, which includes the steps of:
s1: and providing a packaging frame, and placing the first chip on the base island of the packaging frame.
S2: at least one wire bond interposer is disposed between the first bond pad on the first chip surface and the connection pad.
S3: and the bonding wires are sequentially led from the first bonding pad to the connecting bonding area through the bonding wire adapter piece, so that the adjacent bonding wires are electrically connected.
Specifically, step S2 includes:
s21a: at least one bonding wire adapter piece positioned on the surface of the first chip is arranged between the first bonding pad and the second bonding pad on the surface of the first chip, and the bonding wire adapter piece is attached to the surface of the first chip through insulating glue or an insulating film.
Alternatively, step S2 may also include:
s21b: a second chip is disposed on the base island,
s22b: at least one bonding wire adapter piece positioned on the surface of the base island is arranged between the first bonding pad on the surface of the first chip and the second bonding pad on the surface of the second chip, and the bonding wire adapter piece is attached to the surface of the base island through insulating glue or an insulating film.
Alternatively, step S2 may also include:
s21c: at least one bonding wire adapter piece positioned on the surface of the base island is arranged between the first bonding pad on the surface of the first chip and the first pin of the lead frame, and the bonding wire adapter piece is attached to the surface of the base island through insulating glue or an insulating film.
In summary, in the invention, a single bonding wire is decomposed into a plurality of shorter branch bonding wires, and the bonding wire adapter is arranged in the packaging structure to perform the functions of structural support and electrical connection for the branch bonding wires, so that the function of the single bonding wire is realized through the plurality of branch bonding wires, the overall structural strength of the branch bonding wires can be obviously improved, the failure risk is reduced, the arrangement of the branch bonding wires can be flexibly adjusted, and the packaging structure can be adapted to different complex packaging structures.
It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the technical solutions in the embodiments can also be combined appropriately to form other embodiments understood by those skilled in the art.
The above-listed detailed description is only a specific description of a possible embodiment of the present invention and is not intended to limit the scope of the present invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention are included in the scope of the present invention.
Claims (12)
1. The utility model provides a packaging structure, its includes packaging frame and first chip, packaging frame includes at least one base island and distributes in the base pin of base island week side, first chip set up in on the base island, its characterized in that:
the surface of the first chip is provided with a first bonding pad, and the packaging structure comprises a connection welding area which is electrically connected with the first bonding pad through a welding wire;
at least one welding wire adapter is arranged in a welding wire extending area between the first welding pad and the connecting welding area, a conductive area is arranged on the surface of the welding wire adapter, the welding wire comprises a plurality of sections of sub-welding wires, and the adjacent welding wires are electrically connected with each other sequentially through one section of sub-welding wires from the first welding pad to the connecting welding area through the conductive area.
2. The package structure according to claim 1, wherein the first chip has the first bonding pad and the second bonding pad disposed thereon, the second bonding pad forms the connection pad region, at least one bonding wire interposer is disposed on a region of the first chip surface between the first bonding pad and the second bonding pad, the bonding wires include a plurality of segments of sub-bonding wires, and the bonding wires are electrically connected to the second bonding pad sequentially through the sub-bonding wires from the first bonding pad to the second bonding pad.
3. The package structure according to claim 1, further comprising a second chip, wherein a second bonding pad is disposed on the second chip, the second bonding pad forms a connection pad region, at least one bonding wire adaptor is disposed on a region of the surface of the island between the first chip and the second chip, the bonding wires include a plurality of segments of sub-bonding wires, and the sub-bonding wires are electrically connected to the second bonding pad sequentially through a segment of the sub-bonding wires from the first bonding pad to the second bonding pad.
4. The package structure according to claim 1, wherein the package frame includes a first pin, the first pin forms the connection pad, a bonding wire adaptor is disposed on a region of the surface of the island between the first pad and the first pin, the bonding wire includes a first sub-bonding wire and a second sub-bonding wire, and the first sub-bonding wire and the second sub-bonding wire are electrically connected to each other sequentially through a segment of the sub-bonding wire from the first pad to the first pin through the conductive region.
5. The package structure of claim 1, wherein the bonding wire interposer is a interposer chip, the interposer chip is disposed on the surface of the first chip and/or the substrate, and a plurality of bonding pads are disposed on the surface of the interposer chip to form the conductive area.
6. The package structure of claim 1, wherein the wire bond interposer is a metal sheet, a surface of the metal sheet constitutes the conductive region, and the metal sheet is insulatively fixed to the first chip and/or the surface of the base island.
7. The package structure of claim 1, wherein the wire bond interposer is an interposer, the interposer is insulatively fixed on the surface of the first chip and/or the substrate, the interposer includes a dielectric layer and a metal line disposed therebetween, and the metal line constitutes a conductive region.
8. The package structure according to claim 1, wherein the wire bonding interposer is attached to the surface of the first chip and/or the base island by an insulating adhesive or an insulating film.
9. A manufacturing method of a packaging structure is characterized by comprising the following steps:
providing a packaging frame, and placing a first chip on a base island of the packaging frame;
at least one bonding wire adapter is arranged between the first bonding pad on the surface of the first chip and the connection welding area;
and the bonding wires are sequentially led from the first bonding pad to the connecting bonding area through the conductive area, so that the adjacent two bonding wires are electrically connected.
10. The method for manufacturing a package structure according to claim 9, wherein at least one wire bonding interposer is disposed between the first bonding pad and the connection pad on the first chip surface, and specifically comprises:
at least one bonding wire adapter piece positioned on the surface of the first chip is arranged between the first bonding pad and the second bonding pad on the surface of the first chip, and the bonding wire adapter piece is attached to the surface of the first chip through insulating glue or an insulating film.
11. The method for manufacturing a package structure according to claim 9, wherein at least one bonding wire interposer is disposed between the first bonding pad on the first chip surface and the connection pad, and the method comprises:
a second chip is disposed on the base island,
at least one bonding wire adapter piece positioned on the surface of the base island is arranged between a first bonding pad on the surface of the first chip and a second bonding pad on the surface of the second chip, and the bonding wire adapter piece is attached to the surface of the base island through insulating glue or an insulating film.
12. The method for manufacturing a package structure according to claim 9, wherein at least one wire bonding interposer is disposed between the first bonding pad and the connection pad on the first chip surface, and specifically comprises:
at least one welding wire adapter piece positioned on the surface of the base island is arranged between the first bonding pad on the surface of the first chip and the first pin of the lead frame, and the welding wire adapter piece is attached to the surface of the base island through insulating glue or an insulating film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210628272.0A CN115172355A (en) | 2022-06-06 | 2022-06-06 | Package structure and method for manufacturing the same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210628272.0A CN115172355A (en) | 2022-06-06 | 2022-06-06 | Package structure and method for manufacturing the same |
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| CN115172355A true CN115172355A (en) | 2022-10-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210628272.0A Pending CN115172355A (en) | 2022-06-06 | 2022-06-06 | Package structure and method for manufacturing the same |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024222769A1 (en) * | 2023-04-28 | 2024-10-31 | 维沃移动通信有限公司 | Chip packaging structure, preparation method and electronic device |
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| CN1873965A (en) * | 2005-05-30 | 2006-12-06 | 矽品精密工业股份有限公司 | Lead frame type semiconductor package and its lead frame |
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