CN115172180B - Antenna packaging structure with horizontal radiation direction and preparation method - Google Patents
Antenna packaging structure with horizontal radiation direction and preparation method Download PDFInfo
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- CN115172180B CN115172180B CN202110368756.1A CN202110368756A CN115172180B CN 115172180 B CN115172180 B CN 115172180B CN 202110368756 A CN202110368756 A CN 202110368756A CN 115172180 B CN115172180 B CN 115172180B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/568—Temporary substrate used as encapsulation process aid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
Abstract
本发明提供一种水平辐射方向的天线封装结构及制备方法。制备方法包括步骤：提供支撑基底，形成分离层；于分离层上形成重新布线层；于重新布线层上形成天线阵列层，与金属线层电连接；天线阵列层包括呈阵列排布的多个天线，天线沿水平方向辐射；形成塑封材料层将天线阵列层塑封；去除支撑基底和分离层；于重新布线层背离天线阵列层的表面形成焊球凸块与金属线层电连接；将芯片贴置于焊球凸块上。本发明将天线设计为沿水平方向辐射的结构，天线高度无需做很高，由此可以降低包覆天线层的塑封层的高度，有助于提高天线频率和进一步缩小器件尺寸，同时因天线沿水平方向的拓展空间很大，可以根据器件需求灵活设计天线结构，有助于提高器件性能。
The present invention provides an antenna packaging structure with a horizontal radiation direction and a preparation method. The preparation method includes the following steps: providing a supporting substrate to form a separation layer; forming a rewiring layer on the separation layer; forming an antenna array layer on the rewiring layer, electrically connected to a metal wire layer; the antenna array layer includes a plurality of antennas arranged in an array, and the antenna radiates in a horizontal direction; forming a plastic encapsulation material layer to plastic encapsulate the antenna array layer; removing the supporting substrate and the separation layer; forming a solder ball bump on the surface of the rewiring layer away from the antenna array layer and electrically connected to the metal wire layer; and attaching a chip to the solder ball bump. The present invention designs the antenna to be a structure that radiates in a horizontal direction, and the antenna height does not need to be very high, thereby reducing the height of the plastic encapsulation layer covering the antenna layer, which helps to increase the antenna frequency and further reduce the size of the device. At the same time, because the antenna has a large expansion space in the horizontal direction, the antenna structure can be flexibly designed according to the device requirements, which helps to improve the device performance.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to an antenna packaging structure in a horizontal radiation direction and a preparation method thereof.
Background
With the advent of the 5G communications and artificial intelligence era, the data volume required to be transmitted and processed by high-speed interaction by a chip applied to such related fields is increasing, and demands on the mobile internet and the internet of things are increasing, so that miniaturization and multifunctionalization of electronic terminal products are a major trend of industry development. How to integrate and package different kinds of high-density chips together to form a system with powerful functions and smaller volume power consumption has become a challenge in the advanced packaging field of semiconductor chips.
Fan-out (Fan-out) technology is better than system-in-package (system-in-package) based on carrier, and is widely regarded as application of Fan-out technology in future integrated packaging of 5G rf front-end chips. Fan-Out WAFER LEVEL PACKAGING (FOWLP for short) combines the advantages of Fan-Out package and wafer level package technologies, so as to fully satisfy the needs of people for electronic devices, such as multi-function, high performance, high energy efficiency, low cost and small size, and has become one of the most promising packaging technologies for satisfying the needs of mobile and network application electronic devices.
In order to further reduce the device area, the antenna has been integrated into a fan-out wafer level package structure, but in the prior art, only an antenna design perpendicular to the radiation direction is generally adopted, and due to the process limitation of the molding thickness, the design difficulty of the antenna is increased, which hinders further miniaturization of the device.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an objective of the present invention is to provide an antenna package structure with a horizontal radiation direction and a manufacturing method thereof, so as to solve the problems of the fan-out package structure in the prior art that only the antenna design with a vertical radiation direction is adopted, and the design difficulty of the antenna is increased due to the limitation of the manufacturing process of the plastic package thickness.
To achieve the above and other related objects, the present invention provides a method for manufacturing an antenna package structure with a horizontal radiation direction, comprising the following steps:
Providing a support substrate, and forming a separation layer on the support substrate;
Forming a rewiring layer on the separation layer, wherein the rewiring layer comprises a dielectric layer and a metal line layer positioned in the dielectric layer and on the surface of the dielectric layer;
The antenna array layer comprises a plurality of antennas which are arranged in an array manner, wherein the antennas radiate along the horizontal direction, the antennas comprise a plurality of first metal sheets which extend along a first direction and a plurality of second metal sheets which extend along a second direction, the first metal sheets are arranged at intervals in parallel, the second metal sheets are arranged at intervals in parallel, and two ends of the second metal sheets are respectively connected with the first metal sheets, and the first direction is not parallel to the second direction;
Forming a plastic packaging material layer, wherein the plastic packaging material layer is used for plastic packaging of the antenna array layer;
Removing the support substrate and the separation layer;
Forming a solder ball bump on the surface of the rewiring layer, which is away from the antenna array layer, wherein the solder ball bump is electrically connected with the metal wire layer;
And attaching the chip to the solder ball bump.
Optionally, after removing the support substrate and the separation layer, a step of forming an opening in the dielectric layer, where the opening exposes the metal line layer, and the solder ball bump is formed in the opening.
Optionally, the first metal sheet and the second metal sheet are two, and the first direction and the second direction are perpendicular.
The support substrate comprises a glass substrate, the separation layer comprises a release layer and a protection layer, the release layer is formed on the surface of the support substrate, the protection layer is formed on the surface of the release layer, which faces away from the support substrate, the release layer comprises one or a combination of a carbon material layer, a resin material layer and an organic material layer, and the protection layer comprises a polyimide layer.
Optionally, after the step of forming the rewiring layer, the method further includes a step of forming an under bump metal layer on a surface of the rewiring layer, wherein the under bump metal layer is electrically connected with the metal line layer, and the antenna array layer is formed on a surface of the under bump metal layer and is electrically connected with the under bump metal layer.
The invention further provides an antenna packaging structure in the horizontal radiation direction, which comprises a rewiring layer, an antenna array layer, a plastic packaging material layer, a bump, a solder ball and a solder ball, wherein the rewiring layer is provided with a first surface and a second surface which are opposite, the rewiring layer comprises a dielectric layer and a metal wire layer which is positioned in the dielectric layer and on the surface of the dielectric layer, the antenna array layer is positioned on the first surface of the rewiring layer and is electrically connected with the metal wire layer, the antenna array layer comprises a plurality of antennas which are arranged in an array manner and radiate in the horizontal direction, the antennas comprise a plurality of first metal sheets which extend in the first direction and a plurality of second metal sheets which extend in the second direction, the first metal sheets are arranged in parallel at intervals, the second metal sheets are arranged in parallel at intervals, two ends of the second metal sheets are respectively connected with the first metal sheets, the first direction is not parallel with the second direction, the antenna array layer is positioned on the first surface of the rewiring layer, the antenna array layer is arranged in an array manner, the antennas are arranged in the horizontal direction, the antenna array layer is arranged in the first surface of the rewiring layer, the antenna array layer is connected with the solder ball, the second wire is arranged on the surface of the second bump, and the electrical bump is connected with the surface of the solder ball.
Optionally, the antenna packaging structure in the horizontal radiation direction further includes an under bump metal layer, where the under bump metal layer is located on the second surface of the rewiring layer, and two ends of the under bump metal layer are electrically connected with the metal line layer and the solder ball bump respectively.
Optionally, the horizontal radiation direction antenna structure further comprises an underfill layer, the underfill layer being located between the chip and the solder ball bumps.
Optionally, the first metal sheet and the second metal sheet are two.
Optionally, the first direction and the second direction are perpendicular.
As described above, according to the antenna packaging structure and the preparation method for the antenna in the horizontal radiation direction, the antenna is designed to be a structure radiating in the horizontal direction, and the antenna does not need to be very high, so that the height of the plastic packaging layer of the plastic packaging antenna layer can be reduced, the frequency of the antenna can be improved, the size of a device can be further reduced, and meanwhile, the antenna structure can be flexibly designed according to the device requirement because the expansion space of the antenna in the horizontal direction is very large, and the performance of the device can be improved.
Drawings
Fig. 1 is a flowchart illustrating an exemplary manufacturing process of a manufacturing method of an antenna package structure with a horizontal radiation direction according to the present invention.
Fig. 2 to 10 are schematic structural views of the preparation process according to the preparation process of fig. 1, wherein fig. 10 is a schematic sectional view of an exemplary antenna package structure with a horizontal radiation direction according to the present invention.
Description of element reference numerals
11. Support substrate
12. Release layer
13. Protective layer
14. Dielectric layer
141. An opening
15. Metal line layer
16. Antenna
161. First sheet metal
162. Second sheet metal
17. Plastic packaging material layer
18. Solder ball bump
19. Chip
20. Under bump metal layer
Detailed Description
Other advantages and effects of the present invention will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present invention with reference to specific examples. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention.
As described in detail in the embodiments of the present invention, the cross-sectional view of the device structure is not partially enlarged to a general scale for convenience of explanation, and the schematic drawings are only examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in actual fabrication.
For ease of description, spatially relative terms such as "under", "below", "beneath", "above", "upper" and the like may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that these spatially relative terms are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the figures. Furthermore, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers or one or more intervening layers may also be present. Where in this specification reference is made to numerical ranges, unless otherwise stated, the term "range" is intended to include all such ranges as where appropriate.
In the context of the present application, a structure described as a first feature being "on" a second feature may include embodiments where the first and second features are formed in direct contact, as well as embodiments where additional features are formed between the first and second features, such that the first and second features may not be in direct contact.
It should be noted that, the illustrations provided in the present embodiment merely illustrate the basic concept of the present invention by way of illustration, and only the components related to the present invention are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of each component in actual implementation may be changed at will, and the layout of the components may be more complex.
The conventional fan-out type wafer-level package antenna structure generally adopts a design of only a single vertical radiation direction, and in order to improve the antenna performance, a certain height of the antenna is generally required to be ensured, so that the plastic package material layer of the plastic package antenna is required to be made very thick to ensure the complete plastic package of the antenna, but the conventional plastic package material layer has a limit of thickness manufacturing process, so that the design of the antenna is limited. The present invention proposes an improvement countermeasure.
Specifically, as shown in fig. 1, the present invention provides a method for manufacturing an antenna package structure with a horizontal radiation direction, which includes the following steps:
s1, providing a support substrate 11, forming a separation layer on the support substrate 11, wherein the obtained structure is shown in reference to FIG. 2 and FIG. 3;
S2, forming a rewiring layer on the separation layer, wherein the rewiring layer comprises a dielectric layer 14 and a metal line layer 15 positioned in the dielectric layer 14 and on the surface of the dielectric layer 14, and the obtained structure is shown in figure 4;
S3, forming an antenna array layer on the rewiring layer, wherein the antenna array layer is electrically connected with the metal wire layer 15 (the metal wire layer is used as an antenna feeder line), the antenna array layer comprises a plurality of antennas 16 which are arranged in an array mode, the antennas 16 radiate along the horizontal direction, the antennas 16 comprise a plurality of first metal sheets 161 which extend along the first direction and a plurality of second metal sheets 162 which extend along the second direction, the plurality of first metal sheets 161 are arranged at intervals in parallel, the plurality of second metal sheets 162 are arranged at intervals in parallel, two ends of the second metal sheets 162 are respectively connected with the first metal sheets 161, the first direction and the second direction are not parallel, and the obtained structure is shown by referring to FIG. 5 and FIG. 7;
s4, forming a plastic packaging material layer 17, wherein the plastic packaging material layer 17 is used for plastic packaging of the antenna array layer, and the obtained structure is shown in FIG. 6;
s5, removing the supporting substrate 11 and the separation layer, wherein the obtained structure is shown in FIG. 8;
S6, forming a solder ball bump 18 on the surface of the rewiring layer, which is away from the antenna array layer, wherein the solder ball bump 18 is electrically connected with the metal wire layer 15, and the obtained structure is shown in FIG. 9;
And S7, attaching the chip 19 to the solder ball bump 18, wherein the obtained structure is shown in FIG. 10.
According to the invention, the antenna is designed to be a structure radiating along the horizontal direction (namely radiating along the side surface of the package body), and the antenna height does not need to be very high, so that the height of the plastic package layer of the plastic package antenna layer can be reduced, the frequency of the antenna can be improved, the size of a device can be further reduced, and meanwhile, the antenna structure can be flexibly designed according to the device requirement because the expansion space of the antenna along the horizontal direction is very large, and the performance of the device can be improved.
The supporting base 11 plays a role in supporting, and avoids the defects such as bending deformation and the like in the device manufacturing process. As an example, the support substrate includes, but is not limited to, a glass base, a silicon base, a sapphire base, a ceramic base, a metal base, or the like, which has a certain hardness and is not easily bent and deformed. A transparent substrate such as a glass substrate is preferable in this embodiment, which facilitates subsequent UV light irradiation at the back surface of the self-supporting substrate 11 from which the separation layer is peeled off to peel the supporting substrate 11 off from the separation layer. The support substrate 11 may be washed and dried before the separation layer is prepared.
In an example, the separation layer includes a release layer 12 and a protection layer 13, the release layer 12 is formed on a surface of the support substrate 11, and the protection layer 13 is formed on a surface of the release layer 12 facing away from the support substrate 11, for protecting the release layer 12. Of course, in other examples, the separation layer may be provided with only the release layer 12. In a further example, the release layer 12 includes, but is not limited to, a combination of one or more of a carbon material layer, a resin material layer, and an organic material layer, and the protective layer 13 includes, but is not limited to, a polyimide layer. For example, the supporting substrate 11 is a transparent substrate such as a glass substrate, the release layer 12 is a UV resin layer, and the release layer 12 can be irradiated from the back surface of the supporting substrate 11 to be detached during the subsequent detachment, thereby achieving detachment. The release layer 12 may also be an LTHC light-heat conversion layer, and the subsequent steps may be based on a laser or other methods to heat the LTHC light-heat conversion layer, so that the support substrate 11 is separated from the LTHC light-heat conversion layer, thereby reducing the difficulty of the stripping process and preventing the device from being damaged. The formation method of the release layer 12 and the protective layer 13 may be dependent on the materials thereof, and may be selected from, for example, spin coating, spray coating, direct adhesion, and the like.
As an example, the material of the dielectric layer 14 includes, but is not limited to, epoxy, silica gel, PI, PBO, BCB, silicon oxide, phosphosilicate glass, and combinations of one or more of fluorine-containing glass, and may also be other high K dielectric materials, and the material of the metal line layer 15 includes, but is not limited to, combinations of one or more of metals such as gold, silver, copper, and aluminum. Methods of forming the dielectric layer 14 include, but are not limited to, vapor deposition methods, and methods of forming the metal line layer 15 include, but are not limited to, combinations of one or more of sputtering, electroplating, electroless plating, and the like. In one example, the metal wiring layer is formed by forming the dielectric layer 14 on the separation layer, forming an opening corresponding to the metal line layer 15 in the dielectric layer 14 by using a photolithography etching process, and forming a metal material layer in the opening and on the surface of the dielectric layer 14 to form the metal line layer 15. The dielectric layer 14 and the metal line layer 15 may have a single-layer or multi-layer structure, but it is necessary to ensure that the metal line layers 15 of different layers are electrically connected to each other.
In an example, after the re-wiring layer is formed, the method further includes a step of forming an Under Bump Metal (UBM) layer 20 (under bump metallurgy, abbreviated as UBM) on a surface of the re-wiring layer, the under bump metal layer 20 is electrically connected to the metal line layer 15, and the antenna array layer is formed on a surface of the under bump metal layer 20 and is electrically connected to the under bump metal layer 20. The under bump metal layer 20 may be a single layer or a multi-layer structure, and the method of forming the under bump metal layer 20 includes, but is not limited to, one or a combination of two of a sputtering method and an electroplating method. For example, in one example, the under bump metal layer 20 includes a chromium layer, a chromium-copper (50% -50%) layer, and a copper layer from bottom to top, and a very thin gold layer may be further disposed on the surface of the under bump metal layer 20 to prevent oxidation of the copper layer. The bottom of the ubm layer 20 may be further provided with a diffusion layer, such as a lead-tin alloy layer, and may be optionally provided with a eutectic compound or other composition according to different application requirements, so as to achieve a better electrical contact between the ubm layer 20 and the wire layer 15.
As an example, forming the antenna array layer may include the steps of:
Forming an antenna metal layer on the rewiring layer by adopting a method including but not limited to a sputtering method or an electroplating method, wherein the material of the antenna metal material layer comprises but not limited to single metal or metal alloy such as gold, silver, copper and the like;
Coating a photoresist layer on the antenna metal layer, and exposing and developing the photoresist layer to define the position and the shape of the antenna 16 in the antenna metal layer;
and etching the antenna metal layer to form the antenna array layer.
In an example, as shown in fig. 7, the first metal sheet 161 and the second metal sheet 162 are two, and the first direction and the second direction are perpendicular. The first metal sheet 161 and the second metal sheet 162 extend in a horizontal direction (the length extending in the horizontal direction is greater than the height extending in the longitudinal direction), that is, the surface with relatively large surface area (in this embodiment, the surface is a rectangular surface) is perpendicular to the horizontal plane (the width of the surface parallel to the horizontal plane is small, for example, less than 5000 nm), the first metal sheet 161 has the function of guiding and amplifying electromagnetic waves as an array, the second metal sheet 162 has the function of radiating electromagnetic waves, in operation, the electromagnetic waves are radiated outwards in the horizontal direction, and the plastic package material located between the metal sheets has the function of a propagation medium to propagate the electromagnetic waves radiated from the surface of the second metal sheet 162 out in the horizontal direction (for example, the direction indicated by the arrow in fig. 7). The antenna radiates along the horizontal direction, so that the height of the antenna does not need to be very high, the thickness of the corresponding plastic packaging material layer can be reduced, and the improvement of the frequency of the antenna and the further reduction of the size of a device are facilitated. Meanwhile, the extension length of the antenna is limited only by the length of the device substrate, for example, if the device substrate is a 300mm silicon wafer, the extension length of the antenna along the horizontal direction can be greatly expanded, and the antenna performance is further improved. Of course, in other examples, the antenna may take other configurations, which are not strictly limited.
As an example, the method of forming the molding material layer 17 includes, but is not limited to, one or more of compression molding, transfer molding, liquid sealing molding, vacuum lamination, and spin coating, and the material of the molding material layer 17 may include one or more of polyimide, silicone, and epoxy. After forming the plastic package material layer 17, a grinding or polishing method may be further included to planarize the plastic package material layer 17, so as to facilitate the subsequent process.
After the molding material layer 17 is formed, the support substrate 11 and the separation layer are removed by one or more methods including, but not limited to, a polishing method, a laser irradiation method, a heating method, and the like, depending on the materials of the support substrate 11 and the separation layer. If the aforementioned protective layer is formed, the protective layer may be removed simultaneously in this step.
In an example, after removing the support substrate 11 and the separation layer, a step of forming an opening 141 in the dielectric layer 14 is further included, the opening 141 exposes the metal line layer 15, and the solder ball bump 18 is formed in the opening 141. The openings 141 are formed, for example, by laser etching, and then the ball bumps 18 are formed in the openings 141 by ball mounting (ball mount), which helps to further ensure good electrical contact between the ball bumps 18 and the metal line layer 15. The solder bump 18 is made of tin, gold, copper, or tin, gold, copper alloy, but not limited thereto.
As an example, the die 19 may be soldered to the solder ball bumps 18 using a mechanical compression bond (die bond) method including, but not limited to, flash heat. The chip 19 includes, but is not limited to, various active and passive components such as power devices, resistors, capacitors, etc., and the chip 19 may be single or multiple.
In an example, an underfill layer may be further formed between the solder ball bump 18 and the chip 19 before or after forming the chip 19, so as to provide good protection for the chip 19 and the solder ball bump 18. Such as after attaching the chip 19, a hermetic epoxy layer is formed between the chip 19 and the solder ball bumps 18 using methods including, but not limited to, capillary filling. Or before attaching the chip 19, an underfill layer is formed between the surface of the solder ball bump 18 and the solder ball bump 18, then laser etching is used to form openings exposing the solder ball bump 18 in the underfill layer, and then the chip 19 is soldered to the surface of the solder ball bump 18 through the openings.
The invention also provides an antenna packaging structure in a horizontal radiation direction, which can be prepared by adopting the method in any scheme, so that the description of the antenna packaging structure can be cited to the point in the whole text, and the description is omitted as much as possible for the sake of brevity. Of course, the antenna package structure may be manufactured based on other methods, and is not developed here.
Specifically, as shown in fig. 10, the antenna package structure in the horizontal radiation direction includes a re-wiring layer, which has a first surface and a second surface opposite to each other, and includes a dielectric layer 14 and a metal line layer 15 located in the dielectric layer 14 and on the surface of the dielectric layer 14; the antenna array layer is positioned on the first surface of the rewiring layer and is electrically connected with the metal wire layer 15, the antenna array layer comprises a plurality of antennas 16 which are arranged in an array mode, such as a mode of being arranged in a plurality of rows and columns (such as a mode of being arranged in a 2X2 array mode) or a mode of being arranged in a straight line mode (namely a mode of being arranged in a plurality of rows and columns or a mode of being arranged in a single row mode), the antennas 16 radiate in the horizontal direction, the antennas 16 comprise a plurality of first metal sheets 161 extending in the first direction and a plurality of second metal sheets 162 extending in the second direction, the first metal sheets 161 are arranged in parallel and at intervals, two ends of the second metal sheets 162 are respectively connected with the first metal sheets 161, the first direction is not parallel with the second direction, a plastic packaging material layer 17 is positioned on the first surface of the rewiring layer and is used for plastic packaging (can be completely coated or partially coated), the antennas 16 comprise a plurality of first metal sheets 161 extending in the first direction and a plurality of second metal sheets 162 extending in the second direction, the first metal sheets 161 are arranged in parallel and at intervals, two ends of the second metal sheets 162 are respectively connected with the first metal sheets 161 in parallel with the second direction, the second metal sheets 18 are connected with the solder balls, and the solder balls are connected with the solder balls 19.
By way of example, the dielectric layer 14 includes, but is not limited to, any one or more of an epoxy layer, a silicone layer, a PI layer (polyimide layer), a PBO layer (polyphenylene benzooxazol layer), a BCB layer (benzocyclobutene layer), a silicon oxide layer, a phosphosilicate glass layer, and a fluorine-containing glass layer, and the metal line layer 15 includes, but is not limited to, any one or more of a gold layer, a silver layer, a copper layer, an aluminum layer, and the like.
By way of example, the antenna 16 may be made of a single metal or metal alloy including, but not limited to, gold, silver, copper, and the like.
In an example, the antenna package structure in the horizontal radiation direction further includes an under bump metal layer 20, where the under bump metal layer 20 is located on the second surface of the rewiring layer, and two ends of the under bump metal layer are electrically connected to the metal line layer 15 and the solder ball bump 18, respectively. In one example, the under bump metal layer 20 includes a chromium layer, a chromium-copper (50% -50%) layer, and a copper layer from bottom to top.
In one example, the horizontal radiation direction antenna 16 structure further includes an underfill layer between the chip 19 and the solder ball bumps 18.
As an example, the first metal sheet 161 and the second metal sheet 162 are two. And as an example the first direction and the second direction are perpendicular. The surfaces of the first and second metal sheets 161 and 162 perpendicular to the horizontal plane are rectangular planes, and the areas of the surfaces are much larger than the areas of the surfaces each parallel to the horizontal plane. Alternatively, it may be described that the first and second metal sheets 161 and 162 each include a first surface and a second surface perpendicular to each other, the first surface being a surface parallel to a horizontal plane and the second surface being a surface perpendicular to the horizontal plane, and an area of the second surface being larger than an area of the first surface. That is, the first metal sheet 161 and the second metal sheet 162 are both thin plates, and both have lengths greater than the height and width thereof.
By arranging the antenna to radiate in the horizontal direction, the design of the antenna is not limited by the thickness of the plastic packaging process, and the flexibility of the antenna design can be improved.
In summary, the present invention provides an antenna package structure with a horizontal radiation direction and a method for manufacturing the same, the method for manufacturing the same, comprising providing a supporting substrate, and forming a separation layer on the supporting substrate; the method comprises the steps of forming a separation layer on a substrate, forming a rewiring layer on the separation layer, wherein the rewiring layer comprises a dielectric layer and a metal wire layer which is positioned in the dielectric layer and on the surface of the dielectric layer, forming an antenna array layer on the rewiring layer, wherein the antenna array layer is electrically connected with the metal wire layer, the antenna array layer comprises a plurality of antennas which are arranged in an array mode and radiate along the horizontal direction, the antennas comprise a plurality of first metal sheets which extend along a first direction and a plurality of second metal sheets which extend along a second direction, the first metal sheets are arranged in parallel at intervals, the second metal sheets are arranged in parallel at intervals, two ends of the second metal sheets are respectively connected with the first metal sheets, the first direction is not parallel with the second direction, forming a plastic package material layer, the antenna array layer is plastic-packaged, removing the supporting substrate and the separation layer, forming solder balls on the surface of the rewiring layer, which is away from the antenna array layer, the solder balls are formed on the surface of the antenna array layer, the solder balls are electrically connected with the metal wire layer, and the solder balls are attached on the solder balls. According to the invention, the antenna is designed into a structure radiating along the horizontal direction, and the antenna height does not need to be very high, so that the height of a plastic layer of the plastic package antenna layer can be reduced, the frequency of the antenna can be improved, the size of a device can be further reduced, and meanwhile, the antenna structure can be flexibly designed according to the device requirement due to the large expansion space of the antenna along the horizontal direction, and the performance of the device can be improved.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (8)
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| CN202110368756.1A CN115172180B (en) | 2021-04-06 | 2021-04-06 | Antenna packaging structure with horizontal radiation direction and preparation method |
| US17/704,752 US12283493B2 (en) | 2021-04-06 | 2022-03-25 | Packaging structure radiating electromagnetic waves in horizontal direction and method making the same |
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| CN202110368756.1A CN115172180B (en) | 2021-04-06 | 2021-04-06 | Antenna packaging structure with horizontal radiation direction and preparation method |
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| US10573609B2 (en) * | 2017-12-04 | 2020-02-25 | Sj Semiconductor (Jiangyin) Corporation | Fan-out antenna packaging structure and preparation thereof |
| CN108649019B (en) * | 2018-05-14 | 2020-12-08 | 中国科学院微电子研究所 | Fan-Out Package Structure |
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