CN115148923B

CN115148923B - Flexible electroluminescent device product, electroluminescent device and preparation method thereof

Info

Publication number: CN115148923B
Application number: CN202210765317.9A
Authority: CN
Inventors: 郭立雪; 朱映光; 张国辉; 胡永岚
Original assignee: Beijing Yiguang Medical Technology Research Institute Co ltd
Current assignee: Beijing Yiguang Medical Technology Research Institute Co ltd
Priority date: 2022-07-01
Filing date: 2022-07-01
Publication date: 2025-02-21
Anticipated expiration: 2042-07-01
Also published as: CN115148923A

Abstract

The application discloses a flexible electroluminescent device product, an electroluminescent device and a preparation method thereof, wherein the electroluminescent device product sequentially comprises a substrate, a first electrode layer, a luminescent functional layer, a second electrode layer and a packaging layer, wherein the outer side of the substrate and the outer side of the packaging layer are respectively provided with a repairing layer, when the electroluminescent device product is sheared, edges of the two repairing layers are contacted and self-repaired to form side packaging, the repairing layer adjacent to the substrate is provided with a plurality of first conductive plates in a penetrating way, the repairing layer adjacent to the packaging layer is provided with a plurality of second conductive plates in a penetrating way, the substrate is provided with a plurality of conductive columns penetrating through two sides of the substrate and used for electrically connecting the first electrode layer and the first conductive plates, and the packaging layer is provided with a plurality of conductive columns penetrating through two sides of the packaging layer and used for electrically connecting the second electrode layer and the second conductive plates. The technical scheme of the application realizes any design shape of the flexible electroluminescent device in a simple form with low cost and simple process.

Description

Flexible electroluminescent device product, electroluminescent device and preparation method thereof

Technical Field

The present disclosure relates generally to the technical field of flexible light emitting devices, and more particularly to flexible electroluminescent device products, electroluminescent devices, and methods of making the same.

Background

The flexibility of flexible electroluminescent devices, such as OLED products, is a great advantage in their application, enabling a variety of shapes and designs. And is suitable for different application scenes. However, the basic shape is fixed at the beginning of design, that is, the structure of the substrate and the packaging layer corresponding to the design shape is determined by laser etching, then the design of the pixelated electrode is carried out on the substrate, and then each functional layer (the first electrode, the luminous functional layer, the second electrode, etc.) is formed by gradually evaporating or etching or other processes on the substrate. When the shape is abnormal, the control program of the process is influenced and adjusted, namely, after the shape of the product is customized, the process is customized and adjusted, and the process is complex and has high cost.

If the shape is to be changed in the later use process, the shape is generally realized by folding and other modes, and the mode can cause irreversible damage to the screen body.

Disclosure of Invention

In view of the foregoing drawbacks or shortcomings in the prior art, it is desirable to provide a flexible electroluminescent device product comprising, in order, a substrate, a first electrode layer, a light emitting functional layer, a second electrode layer, and a package layer, wherein both the outside of the substrate and the outside of the package layer are provided with repair layers;

The repair layer adjacent to the substrate is provided with a plurality of first conductive plates in a penetrating manner, the repair layer adjacent to the packaging layer is provided with a plurality of second conductive plates in a penetrating manner, the substrate is provided with a plurality of conductive columns on two sides of the substrate in a penetrating manner, the conductive columns are used for electrically connecting the first electrode layer and the first conductive plates, and the packaging layer is provided with a plurality of conductive columns on two sides of the packaging layer in a penetrating manner, and the conductive columns are used for electrically connecting the second electrode layer and the second conductive plates.

According to the technical scheme provided by the embodiment of the application, the first electrode layer comprises a plurality of pixelated first electrodes arranged on the substrate, auxiliary electrodes and a fusing type short-circuit protection device connected between the pixelated first electrodes and the auxiliary electrodes.

According to the technical scheme provided by the embodiment of the application, the thickness of the repair layer is larger than the total thickness between the outer side of the substrate and the outer side of the packaging layer.

According to the technical scheme provided by the embodiment of the application, when the electroluminescent device product emits light from the substrate side, the first conductive disc is made of a transparent material, and when the electroluminescent device product emits light from the packaging layer side, the second conductive pad is made of a transparent material.

According to the technical scheme provided by the embodiment of the application, the conductive base material of the conductive column extends to the outer surface of the substrate or the packaging layer to form a grounding area, and the first conductive bonding pad and the second conductive bonding pad are welded in the grounding area.

According to the technical scheme provided by the embodiment of the application, the conductive column is filled with the protective material.

According to the technical scheme provided by the embodiment of the application, the repair layer comprises a polymer matrix, and microcapsules and a polymer reaction catalyst which are doped in the polymer matrix, wherein polymer precursors are wrapped in the microcapsules.

According to the technical scheme provided by the embodiment of the application, the protective layer is made of stretchable elastomer material, and the elastomer material positioned in the protective area contains CF3 groups.

According to the technical scheme provided by the embodiment of the application, the inner side of the substrate and/or the inner side of the packaging layer is provided with the repairing layer, the repairing layer positioned at the inner side of the substrate is internally provided with the conductive substance or the conductive structure for electrically connecting the first electrode layer and the conductive column in the substrate, and the repairing layer positioned at the inner side of the packaging layer is internally provided with the conductive substance or the conductive structure for electrically connecting the second electrode layer and the conductive column in the packaging layer.

According to the technical scheme provided by the embodiment of the application, the repair layer is doped with the water absorbing material.

According to the technical scheme provided by the embodiment of the application, the visible light transmittance of the self-repairing material is more than 80%.

In a second aspect, the present application provides a method for manufacturing a flexible electroluminescent device, comprising the steps of:

Determining a cutting outline on the flexible electroluminescent device product according to the design shape, wherein the cutting outline at least comprises a first conductive disc and a second conductive pad;

And cutting the flexible electroluminescent device product along the cutting outline to obtain the flexible electroluminescent device with the designed shape.

In a third aspect, the present application provides a flexible electroluminescent device, characterized in that it is prepared by the above method.

According to the technical scheme, the self-repairing material layers are designed on the outer sides of the existing electroluminescent device products, so that the self-repairing material layers on the two sides of the outer sides of the electroluminescent device products can be repaired to form side packages after being sheared, the OLED devices formed after shearing can work independently as the self-forming products, and the flexible electroluminescent device can be designed in any shape in a simple mode with low cost and simple technology.

According to the technical scheme, through the mode that the substrate and the packaging layer are provided with the conductive columns, each conductive column is electrically connected with the conductive pad (the first conductive pad and the second conductive pad) arranged outside, the mode that the original electric connection mode of the electroluminescent device is arranged on the same plane side by side with the original functional structure of the electroluminescent device is better in vertical superposition arrangement, so that the structure of the electroluminescent device is more flexible in cutting, the electroluminescent device can be suitable for small electroluminescent devices obtained through cutting in any shape, and the electroluminescent device has the electric connection structure connected with an external power supply circuit.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the detailed description of non-limiting embodiments, made with reference to the accompanying drawings in which:

FIG. 1 is a schematic structural diagram of embodiment 1 of the present application;

FIG. 2 is a schematic diagram of a conductive pillar according to embodiment 1 of the present application;

Fig. 3 is a schematic diagram of a second structure of the conductive pillar in embodiment 1 of the present application;

FIG. 4 is a schematic diagram of the structure of a cut edge of the electroluminescent device product in embodiment 1 of the present application;

FIG. 5 is a schematic top view of a substrate of an electro-active device product according to embodiment 1 of the present application;

fig. 6 is a schematic top view of the first electrode layer in embodiment 1 of the present application;

FIG. 7 is a schematic structural diagram of embodiment 2 of the present application;

FIG. 8 is a schematic structural diagram of embodiment 3 of the present application;

fig. 9 is a schematic plan view of embodiment 7 of the present application as seen from the substrate side;

FIG. 10 is a schematic top view of embodiment 7 of the present application from the package layer side;

Fig. 11 is a schematic view of the electrical connection structure of the cut electroluminescent device.

10. The light-emitting diode comprises a substrate 10, 20, a first electrode layer, 30, a light-emitting functional layer, 40, a second electrode layer, 50, a packaging layer, 70, a side package, 60, a repairing layer, 81, a first conductive disk, 82, a second conductive disk, 21, a pixelated first electrode, 22, an auxiliary electrode, 24, a fusing type short-circuit protection device, 12, a conductive column, 13, a power receiving area, 61, a conductive material, 62, a first auxiliary power receiving column, 63 and a second auxiliary power receiving column.

Detailed Description

The application is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the application and are not limiting of the application. It should be noted that, for convenience of description, only the portions related to the application are shown in the drawings.

It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other. The application will be described in detail below with reference to the drawings in connection with embodiments.

Example 1

Referring to fig. 1, the embodiment provides an electroluminescent device product, which is an OLED device and sequentially comprises a substrate 10, a first electrode layer 20, a light emitting functional layer 30, a second electrode layer 40 and a packaging layer 50, wherein the outsides of the substrate 10 and the packaging layer 50 are respectively provided with a repairing layer 60;

the substrate is made of PI, PET and other flexible materials, and the packaging layer can be made of metal foil or PI, PET and other materials.

The repair layer 60 adjacent to the substrate is provided with a plurality of first conductive plates 81 in a penetrating manner, the repair layer 60 adjacent to the packaging layer 50 is provided with a plurality of second conductive plates 82 in a penetrating manner, the substrate 10 is provided with a plurality of conductive posts 12 on two sides of the penetrating manner for electrically connecting the first electrode layer 20 and the first conductive plates 81, and the packaging layer 50 is provided with a plurality of conductive posts 12 on two sides of the penetrating manner for electrically connecting the second electrode layer 40 and the second conductive plates 82.

The conductive posts 12 may be formed by, for example, plating, by first punching holes in the substrate 20 and the encapsulation layer 50, for example, by laser punching to form plated holes having a diameter of 0.5mm or less, then coating the surfaces of the substrate and the encapsulation layer with a protective film to expose only the plated holes and the edge regions (regions within 3mm from the plated holes), and then forming the conductive posts 12 in the plated holes after plating. The material for electroplating may be copper.

As shown in fig. 2, the conductive post 12 may have a hollow structure after the plating, i.e., the conductive base material (copper plated) is attached only to the sidewall of the plated hole, and when the conductive post 12 has a hollow structure, the encapsulating material, such as silicone resin or fluorine type glue, is further filled into the hollow conductive post.

As shown in fig. 3, the conductive posts 12 may also be formed into a solid structure after plating, i.e., the conductive substrate (electroplated copper) plugs the plated holes;

preferably, as shown in fig. 2 and 3, the conductive substrate of the conductive post 12 extends to the outer surface of the substrate or the encapsulation layer to form the electrical connection region 13, and the first conductive pad 81 and the second conductive pad 82 are soldered to the electrical connection region 13.

In this embodiment, as shown in fig. 6, the first electrode layer 20 is an anode, and is made of ITO or metal foil, and is composed of a plurality of pixelated first electrodes 21, all of the pixelated first electrodes 21 are electrically connected to the auxiliary electrode 22 located between the pixelated first electrodes 21, wherein in this embodiment, the auxiliary electrode 22 is electrically connected to the conductive post 12 on the substrate 10 corresponding to the auxiliary electrode 22, the second electrode layer 40 is a cathode, and the entire surface of the second electrode layer is continuously provided, and may also be made of ITO or metal foil, and in other embodiments, the first electrode layer 20 may also be a cathode, and the second electrode layer is an anode.

The light emitting functional layer 30 may include, for example, an electron transporting functional layer, a light emitting layer, and a hole transporting functional layer, and the specific implementation of the light emitting functional layer 30 in this embodiment is not limited as long as the material and structure of the organic electroluminescence can be realized.

The repairing layer comprises a polymer matrix, microcapsules are doped in the polymer matrix of at least one repairing layer, polymer precursors are wrapped in the microcapsules, and a polymer reaction catalyst is doped in the polymer matrix of at least one repairing layer.

The repair layer may be provided in any of the following ways:

1. the repair layers on the outer side of the substrate and the outer side of the packaging layer are polymer matrixes simultaneously doped with microcapsules and polymer reaction catalysts.

2. The repairing layer outside the substrate is a polymer matrix doped with the microcapsule and the polymer reaction catalyst, and the repairing layer outside the packaging layer is a polymer matrix doped with the microcapsule.

3. The repairing layer outside the substrate is a polymer matrix doped with the microcapsule and the polymer reaction catalyst, and the repairing layer outside the packaging layer is a polymer matrix doped with the polymer reaction catalyst.

4. The repairing layer outside the substrate is a polymer matrix doped with microcapsules, and the repairing layer outside the packaging layer is a polymer matrix doped with microcapsules and a polymer reaction catalyst.

5. The repairing layer outside the substrate is a polymer matrix doped with a polymer reaction catalyst, and the repairing layer outside the packaging layer is a polymer matrix doped with a microcapsule and a polymer reaction catalyst.

6. The repairing layer outside the substrate is a polymer matrix doped with microcapsules, and the repairing layer outside the packaging layer is a polymer matrix doped with a polymer reaction catalyst.

7. The repairing layer outside the substrate is a polymer matrix doped with a polymer reaction catalyst, and the repairing layer outside the packaging layer is a polymer matrix doped with microcapsules.

In the above manner, the repair layer contains at least two substances (polymer matrix+polymer reaction catalyst and/or microcapsules), and thus the realization of the repair layer is optionally made in the following manner:

the first mode is that all substances are doped and then directly coated outside the substrate and the packaging layer to form a repairing layer.

And secondly, coating the contained substances layer by layer outside the substrate or the packaging layer to form a repairing layer.

Wherein the microcapsule is optionally made by any one of the following modes:

a. The microcapsule is prepared by wrapping cyclopentadiene dimer in urea resin, and the polymerization catalyst is a metal ruthenium-based catalyst. In certain embodiments, the metal ruthenium-based catalyst may also be encapsulated in urea formaldehyde resin, with the cyclopentadiene dimer being doped in the matrix.

B. The microcapsule is prepared by wrapping epoxy resin in urea resin, and the polymerization catalyst is a metal ruthenium-based catalyst. In some embodiments, the metal ruthenium-based catalyst may also be encapsulated in urea-formaldehyde resin, with the epoxy resin doped in the matrix, or the epoxy resin used directly as the polymer matrix.

C. The microcapsule is made by wrapping oligomeric organosiloxane in resin, and the catalyst is a supported platinum-based catalyst. The catalyst is supported on reinforcing particles or fibrous fillers.

As shown in fig. 4, when the electroluminescent device product is sheared due to the microcapsule design, the microcapsule breaks allowing the polymer precursor to flow out to react with the polymerization catalyst, and self-repair of the break occurs, thereby forming the side encapsulation 70.

In certain embodiments of the present application, the visible light transmittance of the self-healing material is greater than 80%.

In some embodiments of the present application, the repair layer 60 has a thickness greater than the total thickness between the outside of the substrate and the outside of the encapsulation layer. As shown in fig. 1, the repair layer 60 has a thickness h1, and the total thickness between the outside of the substrate and the outside of the encapsulation layer is h2, where h1 is greater than h2. The thickness design of the repair layer ensures that when cutting is performed, the adhesion contact area of the repair layers on the two sides of the outer part is larger, the thickness is larger, and the side packaging effect formed after self-repairing is better.

In certain embodiments of the application, the repair layer is doped with a water absorbing material, such as calcium oxide particles. The water absorbing material may further increase the effectiveness of the self-healing side encapsulation.

If the octagonal device shape is to be cut out on the electroluminescent device product shown in fig. 5, it is then cut out according to the dashed outline shown in fig. 5.

Since the first conductive pad 81 and the second conductive pad 82 are stacked with other functional layers (the first electrode layer, the light emitting functional layer, and the second electrode layer) in this embodiment, there is a greater degree of freedom in clipping, for example, this embodiment can provide clipping of triangles, pentagrams, and polygons.

In other embodiments, the electroluminescent device shape may also be tailored to form a wide variety of shapes such as a tree, crescent, diamond, etc.

The technical scheme of the embodiment realizes the simplified design of the shape of the electroluminescent device, and greatly reduces the cost and the process difficulty compared with the scheme of carrying out shape design at the beginning of the preparation of the electroluminescent device in the earlier stage. Provides convenience for large-area popularization and application of the electroluminescent device.

In the cutting process, the pixelated first electrode and the second electrode may be adhered at the cutting edge, in order to ensure that the cut device can work normally, in this embodiment, a fusing type short-circuit protection device is provided, the pixel is connected between the pixelated first electrode and the auxiliary electrode, and when the pixels at the edge are in short circuit due to adhesion, the pixels can be disconnected on the circuit by themselves, so that the normal operation of other pixel areas is not affected.

In this embodiment, as shown in fig. 6, the first electrode layer 20 includes a plurality of pixelated first electrodes 21, auxiliary electrodes 22 and a fuse-type short-circuit protection device 24 disposed on a substrate. The fuse type short-circuit protection device 24 is connected with the pixelated first electrode and the auxiliary electrode, and the implementation mode of the fuse type short-circuit protection device 24 can be realized by adopting an elongated resistance wire as described in Chinese patent publication No. CN109698222B, when a pixel is shorted, the fuse type short-circuit protection device 24 is preferentially fused, so that a pixel circuit at the location is disconnected, and the normal operation of other pixels of the device is ensured.

Example 2

The application is based on example 1, wherein the material of the repair layer is made of (polymer matrix + polymer reaction catalyst and/or microcapsule) instead of stretchable elastomer material, which contains CF3 groups.

In this embodiment, the elastomer material is a perfluoroelastomer synthesized using a copolymer of TFEMA and HFBA. Fluorinated polymers generally have high transparency due to their low refractive index. Furthermore, they have hydrophobicity and chemical stability under aqueous conditions, where highly polar CF3 groups can also interact with each other to promote the self-healing process. In this polymer system, all monomers contain CF3 groups. An elastomer with ultra-high density CF3 groups to maximize dipole-dipole and ion-dipole interactions, enabling self-healing of the material.

In this example, a polymer having a dipole-dipole interaction fluoroelastomer is used as the polymer matrix, which utilizes the strong interaction between dipoles to achieve self-healing and hydrophobic effects.

Example 3

As shown in fig. 7, in the present embodiment, a repair layer is provided on the inner side of the substrate 10 and/or the inner side of the encapsulation layer 50, based on embodiment 1. A conductive material is disposed in the repair layer inside the substrate 10 for electrically connecting the first electrode layer 20 with the conductive pillars 12 in the substrate 10, and a conductive material is disposed in the repair layer inside the package layer 50 for electrically connecting the second electrode layer 40 with the conductive pillars 12 in the package layer.

In this embodiment, the conductive material is a conductive material, and in this case, the repair layer located inside the substrate or inside the encapsulation layer is doped with a conductive material 61, and the conductive material is, for example, a metal powder such as silver or nickel.

In other embodiments, the conductive material 61 may also be conductive microcapsules made of conductive particles encased in a resin. The conductive particles may be, for example, graphene, and the resin coating the graphene may be, for example, urea resin, epoxy resin, or the like. When an electroluminescent device such as an OLED is sheared, the conductive microcapsules are ruptured, the conductive particles therein flow out, the repair layer near the inside of the substrate 10 is electrically connected to the auxiliary electrode of the first electrode layer 20, and the repair layer near the inside of the encapsulation layer 50 is electrically connected to the second electrode layer 40. The conductive particles in the conductive microcapsules flow within the repair layer where they are located, thereby electrically connecting the conductive pillars 12 in the substrate 10 to the auxiliary electrode 22 and electrically connecting the conductive pillars in the encapsulation layer to the second conductive layer 40.

The repair layer provided on the inner side of the substrate 10 and/or the inner side of the encapsulation layer 50 may be selected from any of the following ways:

A. The repair layers on the inner side of the substrate and the inner side of the packaging layer are polymer matrixes simultaneously doped with conductive materials, microcapsules and polymer reaction catalysts.

B. the repairing layer on the inner side of the substrate is a polymer matrix doped with conductive materials, microcapsules and a polymer reaction catalyst, and the repairing layer in the packaging layer is a polymer matrix doped with the conductive materials and the microcapsules.

C. The repairing layer on the inner side of the substrate is a polymer matrix doped with conductive materials, microcapsules and polymer reaction catalysts, and the repairing layer in the packaging layer is a polymer matrix doped with the conductive materials and the polymer reaction catalysts.

D. The repairing layer on the inner side of the substrate is a polymer matrix doped with conductive materials and microcapsules, and the repairing layer in the packaging layer is a polymer matrix doped with conductive materials, microcapsules and polymer reaction catalysts.

E. The repairing layer on the inner side of the substrate is a polymer matrix doped with conductive materials and polymer reaction catalysts, and the repairing layer in the packaging layer is a polymer matrix doped with conductive materials, microcapsules and polymer reaction catalysts.

F. The repairing layer on the inner side of the substrate is a polymer matrix doped with conductive materials and microcapsules, and the repairing layer in the packaging layer is a polymer matrix doped with conductive materials and polymer reaction catalysts.

G. The repairing layer on the inner side of the substrate is a polymer matrix doped with conductive materials and polymer reaction catalysts, and the repairing layer in the packaging layer is a polymer matrix doped with conductive materials and microcapsules.

H. the repair layer on the inner side of the substrate and the inner side of the packaging layer are both polymer matrixes doped with conductive materials and polymer reaction catalysts.

I. the repair layer on the inner side of the substrate and the inner side of the packaging layer are both polymer matrixes doped with conductive materials and microcapsules.

In this embodiment, the repair layer is also disposed on the inner side of the package layer and the substrate, and the adhesion self-repair between the repair layers on the inner side after cutting can further increase the effect of the side package.

Through the arrangement of the substrate and the repair layer at the inner side of the packaging layer, especially when the inner repair layer contains microcapsules, the concentration of the microcapsules at the inner side can be set higher than that of the microcapsules at the repair layer at the outer side, and the microcapsules are transferred, so that the strength of the external repair layer is relatively improved on the premise of ensuring the total quantity of the microcapsules.

Example 4

As shown in fig. 8, in the embodiment 3, a repair layer is disposed on the inner side of the substrate 10 and/or the inner side of the package layer 50, a conductive structure is disposed in the repair layer disposed on the inner side of the substrate 10 and used for electrically connecting the first electrode layer 20 and the conductive column 12 in the substrate 10, and a conductive structure is disposed in the repair layer disposed on the inner side of the package layer 50 and used for electrically connecting the second electrode layer 40 and the conductive column 12 in the package layer.

The conductive structure specifically comprises a first auxiliary conductive column and a second auxiliary conductive column, and specifically comprises:

The conductive post 12 on the substrate 10 is electrically connected with a first auxiliary conductive post 62 extending toward the first electrode layer, the first auxiliary conductive post 62 is used for electrically connecting the conductive post 12 on the substrate 10 and the auxiliary electrode 22 on the first electrode layer 20, and the repair layer 60 on the inner side of the substrate 10 bypasses the first auxiliary conductive post 62 for coating during coating. The first auxiliary conductive column is made of tin, copper or the like, and has a contact pad 64 at its end with a larger diameter than its body for surface contact with the auxiliary electrode 22.

The conductive pillars 12 on the encapsulation layer 50 are electrically connected to second auxiliary conductive pillars 63 protruding toward the second electrode layer, and the second auxiliary conductive pillars 63 are used for electrically connecting the conductive pillars 12 on the encapsulation layer 50 and the second electrode layer 40. The second auxiliary conductive post 63 is made of tin, copper, or the like, and has a contact pad 64 at its end with a larger diameter than its body for surface contact with the second electrode layer 40.

At this time, the inner side of the substrate 10 and the inner side of the encapsulation layer 50 are provided with a repair layer, optionally in the following arrangement:

A. The repair layer on the inner side of the substrate and the inner side of the packaging layer is a polymer matrix which is simultaneously doped with the microcapsule and the polymer reaction catalyst.

B. The repairing layer on the inner side of the substrate is a polymer matrix doped with microcapsules and a polymer reaction catalyst, and the repairing layer in the packaging layer is a polymer matrix doped with the microcapsules.

C. The repairing layer on the inner side of the substrate is a polymer matrix doped with a microcapsule and a polymer reaction catalyst, and the repairing layer in the packaging layer is a polymer matrix doped with a polymer reaction catalyst.

D. The repairing layer on the inner side of the substrate is a polymer matrix doped with microcapsules, and the repairing layer in the packaging layer is a polymer matrix doped with microcapsules and a polymer reaction catalyst.

E. The repairing layer on the inner side of the substrate is a polymer matrix doped with a polymer reaction catalyst, and the repairing layer in the packaging layer is a polymer matrix doped with a microcapsule and a polymer reaction catalyst.

F. the repairing layer on the inner side of the substrate is a polymer matrix doped with microcapsules, and the repairing layer in the packaging layer is a polymer matrix doped with a polymer reaction catalyst.

G. the repairing layer on the inner side of the substrate is a polymer matrix doped with a polymer reaction catalyst, and the repairing layer in the packaging layer is a polymer matrix doped with microcapsules.

H. The repair layer on the inner side of the substrate and the inner side of the packaging layer are both polymer matrixes doped with polymer reaction catalysts.

I. The repair layer on the inner side of the substrate and the inner side of the packaging layer are both polymer matrixes doped with microcapsules.

Example 5

On the basis of example 3, the materials of the substrate and the repair layer inside the encapsulation layer were replaced with stretchable elastomer materials in example 2, which contained CF3 groups, and the conductive substances in example 3.

Example 6

On the basis of example 4, the materials of the substrate and the repair layer inside the encapsulation layer were replaced with stretchable elastomeric materials containing CF3 groups as in example 2.

Example 7

The embodiment provides a method for manufacturing an electroluminescent device, which comprises the following steps:

S1, determining a cutting outline on the electroluminescent device products of the embodiment 1-4 according to the design shape, wherein the cutting outline at least comprises a first conductive disc and a second conductive disc.

S2, cutting the electroluminescent device product along the cutting outline to obtain the electroluminescent device with the design shape.

Example 6

As shown in fig. 9, this embodiment provides an electroluminescent device (from a top view on the substrate side) cut by the method described in embodiment 5.

As shown in fig. 10, corresponding to fig. 9, a first conductive pad 81 and a second conductive pad 82 are correspondingly disposed on the outer side of the whole device in a top view on the side of the package layer, and when the cut device is electrically connected with the external electricity, the cut device is preferably electrically connected with the conductive pad by the edge, for example, any one of the three dotted line boxes 81 in fig. 9 is selected to be connected with the positive electrode of the power supply, and any one of the second conductive pads 82 in fig. 10 is selected to be connected with the negative electrode of the power supply.

When the cut conductive plates of the electroluminescent device are all located in the middle, the external power supply is required to be led out from the conductive plates through the transparent conductive material 83, as shown in fig. 11, in which the first conductive plate 81 is located in the middle of the device and led out to the edge through the long transparent conductive material 83 to be connected with the positive electrode of the power supply, and correspondingly, the connection between the second conductive plate and the negative electrode of the power supply is also in this way. The transparent conductive material may be, for example, ITO.

In some embodiments of the present application, after the cut electroluminescent device is cut and after the setting of the power connection to the external power circuit is completed, a protective layer is applied to the outer surface of the device by spraying or coating.

The above description is only illustrative of the preferred embodiments of the present application and of the principles of the technology employed. It will be appreciated by persons skilled in the art that the scope of the application referred to in the present application is not limited to the specific combinations of the technical features described above, but also covers other technical features formed by any combination of the technical features described above or their equivalents without departing from the inventive concept. Such as the above-mentioned features and the technical features disclosed in the present application (but not limited to) having similar functions are replaced with each other.

Claims

1. A flexible electroluminescent device product, characterized in that the electroluminescent device product comprises a substrate, a first electrode layer, a light-emitting functional layer, a second electrode layer and an encapsulation layer in sequence; a repair layer is provided on the outside of the substrate and the outside of the encapsulation layer; when the electroluminescent device product is sheared, the edges of the two layers of the repair layer contact and self-repair to form a side encapsulation; the repair layer comprises a polymer matrix and microcapsules doped in the polymer matrix and a polymer reaction catalyst or is made of a stretchable elastomeric material; wherein the microcapsules contain a polymer precursor, and the elastomeric material contains a CF3 group;

A plurality of first conductive plates are provided through the repair layer adjacent to the substrate; a plurality of second conductive plates are provided through the repair layer adjacent to the packaging layer; a plurality of conductive pillars are provided through both sides of the substrate for electrically connecting the first electrode layer and the first conductive plate; a plurality of conductive pillars are provided through both sides of the packaging layer for electrically connecting the second electrode layer and the second conductive plate.

2. The flexible electroluminescent device product according to claim 1, characterized in that the thickness of the repair layer is greater than the total thickness between the outer side of the substrate and the outer side of the encapsulation layer.

3. The flexible electroluminescent device product according to claim 1 is characterized in that when the electroluminescent device product emits light from the substrate side, the first conductive plate is made of a transparent material; when the electroluminescent device product emits light from the packaging layer side, the second conductive plate is made of a transparent material; the conductive substrate of the conductive column extends to the outer surface of the substrate or the packaging layer to form a power connection area, and the first conductive plate and the second conductive plate are welded in the power connection area; the conductive column is filled with protective material.

4. The flexible electroluminescent device product according to claim 1 is characterized in that a repair layer is provided on the inner side of the substrate and/or the inner side of the encapsulation layer; a conductive material or a conductive structure is provided in the repair layer located on the inner side of the substrate, which is used to electrically connect the first electrode layer with the conductive column in the substrate; a conductive material or a conductive structure is provided in the repair layer located on the inner side of the encapsulation layer, which is used to electrically connect the second electrode layer with the conductive column in the encapsulation layer.

5. The flexible electroluminescent device product according to claim 4, characterized in that the inner side of the substrate and/or the inner repair layer of the encapsulation layer comprises a polymer matrix: the polymer matrix of at least one inner repair layer is doped with microcapsules and/or a polymer reaction catalyst, and the microcapsules contain a polymer precursor;

The concentration of microcapsules in the inner side of the substrate and/or the inner side repair layer of the encapsulation layer is higher than the concentration of microcapsules in the outer side of the substrate and/or the outer side repair layer of the encapsulation layer.

6. The flexible electroluminescent device product according to any one of claims 1 to 3, characterized in that the visible light transmittance of the self-healing material is greater than 80%; and the repair layer is doped with a water-absorbing material.

7. A method for preparing a flexible electroluminescent device, characterized in that it comprises the following steps:

A cutting outline is determined on the flexible electroluminescent device product according to any one of claims 1 to 6 according to the designed shape; the cutting outline includes at least a first conductive plate and a second conductive plate; and the flexible electroluminescent device product is cut along the cutting outline to obtain a flexible electroluminescent device with a designed shape.

8. A flexible electroluminescent device, characterized in that it is prepared by the method according to claim 7.