[go: up one dir, main page]

CN115116882B - Hot plate cooling system - Google Patents

Hot plate cooling system

Info

Publication number
CN115116882B
CN115116882B CN202110285264.6A CN202110285264A CN115116882B CN 115116882 B CN115116882 B CN 115116882B CN 202110285264 A CN202110285264 A CN 202110285264A CN 115116882 B CN115116882 B CN 115116882B
Authority
CN
China
Prior art keywords
temperature information
information
hot plate
state
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202110285264.6A
Other languages
Chinese (zh)
Other versions
CN115116882A (en
Inventor
蔡耀煌
李秘宁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Winbond Electronics Corp
Original Assignee
Winbond Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Winbond Electronics Corp filed Critical Winbond Electronics Corp
Priority to CN202110285264.6A priority Critical patent/CN115116882B/en
Publication of CN115116882A publication Critical patent/CN115116882A/en
Application granted granted Critical
Publication of CN115116882B publication Critical patent/CN115116882B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • H01L21/67109Apparatus for thermal treatment mainly by convection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67248Temperature monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本发明提供一种热板冷却系统,用以对一热板冷却,包括:一腔室以及一冷却模块。热板放置于该腔室中。冷却模块延伸设置于腔室内并朝向热板,用以对热板冷却,包含一喷嘴件、一外壳件以及一排出通道。喷嘴件朝向该热板,用以将一工作流体喷出至该热板。外壳件围绕喷嘴件,且喷嘴件设置于外壳件中。外壳件具有一环绕喷嘴件的盛接槽。排出通道连接外壳件并连通于盛接槽。当喷嘴件喷出工作流体冷却热板时,工作流体经由喷嘴件输送而朝向热板的一表面,且工作流体依序经由盛接槽至排出通道而排出热板冷却系统。

The present invention provides a hot plate cooling system for cooling a hot plate, comprising: a chamber and a cooling module. The hot plate is placed in the chamber. The cooling module is extended in the chamber and faces the hot plate for cooling the hot plate, and comprises a nozzle member, a shell member and an exhaust channel. The nozzle member faces the hot plate and is used to spray a working fluid onto the hot plate. The shell member surrounds the nozzle member, and the nozzle member is arranged in the shell member. The shell member has a receiving groove surrounding the nozzle member. The exhaust channel is connected to the shell member and is connected to the receiving groove. When the nozzle member sprays the working fluid to cool the hot plate, the working fluid is transported through the nozzle member toward a surface of the hot plate, and the working fluid is discharged from the hot plate cooling system in sequence through the receiving groove to the exhaust channel.

Description

Hot plate cooling system
Technical Field
Embodiments of the present invention relate to a platen cooling system, and more particularly, to a platen cooling system with a cooling module.
Background
In semiconductor processes, such as semiconductor wafer processes, a platen capable of controlling a predetermined temperature of a wafer product, such as baking, is required in some given processes, and a hot plate (hot plate) capable of heating is generally used for the platen. Different processing temperatures may be required for different wafer processing, and the process efficiency may be low if natural cooling is relied on for the requirement of cooling from high temperature to low temperature. In view of this, it is an important issue to provide an efficient and intelligent temperature processing and control system.
Disclosure of Invention
According to some embodiments, a platen cooling system is provided for cooling a platen, including a chamber and a cooling module. A hot plate is placed in the chamber. The cooling module is arranged in the cavity in an extending way and faces the hot plate for cooling the hot plate, and comprises a nozzle piece, a shell piece and a discharge channel. The nozzle member faces the hot plate for ejecting a working fluid to the hot plate. The housing member surrounds the nozzle member, and the nozzle member is disposed in the housing member. The housing member has a receiving slot surrounding the nozzle member. The discharge channel is connected with the shell piece and communicated with the containing groove. When the nozzle member ejects the working fluid to cool the hot plate, the working fluid is conveyed towards one surface of the hot plate through the nozzle member, and the working fluid is sequentially discharged out of the hot plate cooling system through the containing groove to the discharge channel.
In some embodiments, the nozzle member has a main flow passage and a nozzle, the nozzle is in communication with the main flow passage, and the nozzle protrudes from the housing member.
In some embodiments, the nozzle member has a plurality of nozzles that are received in the housing member and surrounded by the receiving slot.
In some embodiments, each nozzle has an elongated structure, and the direction of extension of the nozzles is different.
In some embodiments, the cooling module further includes an air pumping device disposed in the exhaust channel for pumping the working fluid flowing to the exhaust channel through the receiving slot.
In some embodiments, the cooling module further includes a pneumatic device disposed in a main flow channel of the nozzle member for ejecting the working fluid from the nozzle member through the main flow channel.
In some embodiments, the platen cooling system includes a receiving unit, a sorting unit, and a servo unit. The receiving unit is used for receiving preset information and sensing temperature information of the hot plate to obtain state information. The classifying unit is electrically connected with the receiving unit and the classifying unit, and the servo unit is electrically connected with the pneumatic device. When the receiving unit compares the preset information and the temperature of the hot plate in the state information, the receiving unit transmits an alarm record to the classifying unit, and the receiving unit transmits the preset information and the state information to the classifying unit. The classifying unit classifies a preset temperature information according to the preset information, classifies a state temperature information according to the state information, and transmits the alarm record, the preset temperature information and the state temperature information to the servo unit. The servo unit transmits a control signal to the pneumatic device according to the alarm record, the preset temperature information and the state temperature information.
In some embodiments, the receiving unit receives status information at a plurality of different time points and passes the status information to the classifying unit. The classifying unit classifies a plurality of state temperature information according to the state information and transmits the state temperature information to the servo unit. When the servo unit compares the state temperature information with the difference and receives the alarm record, the servo unit transmits a control signal to the pneumatic device to start the pneumatic device.
In some embodiments, the plurality of state temperature information includes a first state temperature information and a second state temperature information, and the first state temperature information is received by the servo unit earlier than the second state temperature information. When the trend from the first state temperature information to the preset temperature information is different from the trend from the second state temperature information to the first state preset temperature information, the servo unit transmits an alarm signal to an external control unit.
In some embodiments, the platen cooling system further includes a fluid detection assembly disposed in the main flow passage of the nozzle member and the discharge passage in communication with the housing member.
Drawings
Embodiments of the present invention will be described in detail below with reference to the attached drawings.
FIG. 1 illustrates a schematic view of a platen cooling system according to one embodiment of the present invention.
Fig. 2 shows a schematic view of a partial enlargement of the nozzle member and the working fluid flow.
FIG. 3 shows a schematic diagram of the cooling module sensing and temperature control of the hotplate.
FIG. 4 shows a schematic view of a platen cooling system according to another embodiment of the present invention.
Symbol description
100. A hot plate cooling system;
10. a chamber;
20. a hot plate;
21. the surface of the hot plate;
e1, a first end;
e2, a second end;
30. A cooling module;
301. a receiving unit;
302. a classification unit;
303. a servo unit;
31. a nozzle member;
311. a main flow channel;
32. A housing member;
321. a receiving groove;
33. a discharge passage;
34. a pneumatic device;
35. an air extracting device;
c1, a control signal;
F. A working fluid;
f', collected working fluid after ejection;
GS, a fluid detection assembly;
GS1, GS2, fluid detectors;
MA, alarm signal;
P, a control unit;
SA and alarm record;
SP, accommodation space;
s0, presetting information;
s0', presetting temperature information;
s1, state information;
s1', state temperature information.
Detailed Description
Referring to FIG. 1, a schematic diagram of a platen cooling system 100 according to an embodiment of the present invention is shown. The hot plate cooling system 100 described above may be applied to a platen system in a semiconductor process semiconductor manufacturing process, such as a system for one or more wafer processes.
Platen cooling system 100 includes a chamber 10, a platen 20, and a cooling module 30. The chamber 10 has a receiving space SP in which the hot plate 20 is disposed and is used to heat the wafer. The cooling module 30 is disposed through the accommodating space SP of the chamber 10, or extends from the chamber 10 into the accommodating space SP of the chamber 10, so as to control and regulate the temperature of the hot plate 20, for example, cool the hot plate, so as to allow the process to be performed at a predetermined temperature.
In this embodiment, the cooling module 30 has a plurality of (two) nozzle members 31 respectively disposed at opposite ends corresponding to the hot plate 20, or respectively disposed adjacent to the first end E1 and the second end E2 of the nozzle members 31, and the first end E1 and the second end E2 are opposite. In some embodiments, the nozzle 31 is configured to eject the working fluid F to cool the thermal plate 20. Around each nozzle member 31, a housing member 32 is provided, which surrounds the nozzle member 31, in other words, the nozzle member 31 is provided in the housing member 32.
Referring to fig. 1 and 2, the housing 32 has a receiving groove 321 surrounding the nozzle 31. The cooling module 30 further comprises a discharge channel 33 communicating with the receiving slot 321 of the housing member 32. The receiving groove 321 is used for receiving the working fluid F ejected or output from the nozzle member 31, so as to recover and discharge the working fluid F for controlling the temperature (e.g. dissipating heat) of the thermal plate 20. The receiving groove 321 is connected to the discharge channel 33, so as to smoothly discharge the sprayed working fluid F' out of the hot plate cooling system 100.
In detail, when the nozzle member 31 ejects the working fluid F to cool the hot plate, the working fluid F is transported toward a surface 21 of the hot plate 20 through the nozzle member 31, and then the ejected working fluid F is received by the receiving groove 321, i.e. the working fluid F' is sequentially discharged out of the hot plate cooling system 100 through the receiving groove 321 to the discharge channel 33.
Referring to fig. 2, it should be noted that in the present embodiment, the nozzle member 31 has a main flow channel 311 and a plurality of nozzles 312, and the nozzles 312 are accommodated in the housing member 32 and protrude from the housing member 32, or the height of the nozzles 312 is higher than the height of the housing member 32 (in the Z-axis direction) and is closer to the hot plate 20 (fig. 1), so that the working fluid F cools the hot plate 20, which is beneficial to accelerating the effect of cooling the hot plate 20 and improving the process efficiency. In some embodiments, each nozzle 312 has an elongated structure, and the extending directions of the nozzles 312 are different. In some embodiments, the nozzle member 31 may include a nozzle 312 that ejects working fluid F to cool the platen.
In some embodiments, a pneumatic device 34 is disposed in the main flow channel 311 of the nozzle 31 to rapidly and smoothly spray the working fluid F from the nozzle 312 through the main flow channel 311. The pneumatic device 34 may also be used as an air supply unit for supplying the working fluid F. In some embodiments, the exhaust channel 33 is provided with a suction device 35, such as a blower, for sucking the working fluid F 'flowing through the receiving groove 321 to the exhaust channel 33, so as to accelerate the exhaust of the working fluid F' and collect particles (particles) that may be generated when the working fluid F cools the hot plate 20, thereby improving the process cleanliness.
FIG. 3 illustrates a schematic diagram of sensing and temperature control of platen 20 by cooling module 30 according to some embodiments of the present invention. The cooling module 30 further comprises a receiving unit 301, a sorting unit 302 and a servo unit 303.
The receiving unit 301 may be, for example, an element capable of receiving one or more predetermined formulations, and may be used to sense the current state of the chamber 10 and/or the hot plate 20, such as temperature information, humidity information, and pressure information of the chamber 10 and/or the hot plate 20. In some embodiments, the receiving unit 301 is electrically connected to the classifying unit 302. The classification unit 302 may be a failure detection and classification (Fault Detection and Classification, FDC) unit for collecting data from the receiving unit 301. In some embodiments, the FDC unit may provide univariate and multivariate analysis, respectively, depending on the process state and requirements.
The servo unit 303 is electrically connected to the sorting unit 302 and the pneumatic device 34, and can receive information from the sorting unit 302 and calculate an appropriate control signal according to the information to control the pneumatic device 34.
Specifically, the receiving unit 301 receives a predetermined information S0, such as a predetermined recipe, to determine the process requirement for the temperature of the thermal plate 20, and performs sensing of the thermal plate 20 to determine a status information S1 at least including the temperature status data of the thermal plate 20. In some embodiments, the preset information S0 includes temperature information, humidity information, and pressure information of the chamber 10 and/or the hot plate 20.
Next, comparing the preset information S0 and the state information S1, if the temperature data of the hot plate 20 between the two information S0 and S1 has a difference, an alarm record (alarm log) SA is sent out, and the alarm record SA is transmitted to the classification unit 302 with the preset information S0 and the state information S1, wherein the classification unit 302 obtains or classifies the preset temperature information S0 'and the state temperature information S1' including the hot plate 20 according to the content of the preset information S0 and the state information S1, and transmits the alarm record SA to the servo unit 303. In some embodiments, for the complete default information S0 and status information S1, the classifying unit 302 sends the complete default information S0 and status information S1 to an external control unit P (e.g., a user computer) along with the alarm record SA, so as to enable the operator to know and monitor in real time.
Subsequently, the servo unit 303 receives the alarm record SA and the temperature information S0 '(preset temperature) and S1' (current temperature of the hot plate 20) from the classifying unit 302, and calculates a control signal C1 according to the information, so as to control the brake device 34 to be turned on/off.
In some embodiments, the receiving unit 301 may detect the temperature of the thermal plate 20 at intervals and send the detected temperature to the classifying unit 302 in real time, and the classifying unit 302 may receive the status information S1 at different time points at predetermined intervals. The classifying unit 302 classifies the state information S1 into the parts recorded with the temperature information, and transmits the state temperature information S1' to the servo unit 303 in real time.
In some embodiments, the servo unit 303 controls the pneumatic device 34 to be turned on/off according to the state temperature information S1' of different times before and after the comparison. For example, the servo unit 303 receives a state temperature information S1 'of the current state every second (that is, the receiving unit 301 is set to transmit the state temperature information S1 every second), compares the state temperature information S1' received before and after, when the temperature received by the latter is lower than the former temperature, indicates that the process is about to perform the cooling operation, and compares the preset temperature information S0 'with the state temperature information S1' received by the latter to generate the control signal C1 to start the pneumatic device 34.
In this way, since the signal control is performed from the servo unit 303, and the servo unit 303 generates the control signal according to the information of the receiving unit 301 and the classifying unit 302, compared with the conventional temperature control method using a temperature controller, the embodiment of the invention uses the original sensing state information to perform the temperature control of the hot plate 20, and does not use an additional temperature control signal, so that the overall cooling module is more stable, and the signal attenuation phenomenon can be avoided.
In some embodiments, when the difference between the preset temperature information S0' and the state temperature information S1' received by the servo unit 303 and the difference between the front and back state temperature information S1' do not correspond, an alarm signal MA is sent to the control unit P. For example, the temperature value of the preset temperature information S0' is 90 ℃, the temperature information S1' of the front (first) state is 95 ℃ and indicates that the process is going to go straight to cool down (from 95 ℃ to 90 ℃), but the temperature information S1' of the rear (second) state is 96 ℃ and indicates that the current temperature of the hot plate 20 is in the rising state (95 ℃ to 96 ℃), which is an abnormal state, and the servo unit 303 sends an alarm signal MA to the control unit P for the operator to process. In other words, the plurality of state temperature information S1' at least includes a first state temperature information earlier and a second state temperature information later, and the first state temperature information is received by the servo unit 303 earlier than the second state temperature information. When the trend from the first state temperature information to the preset temperature information S0' is different from the trend from the second state temperature information to the preset temperature information of the first state, the servo unit 303 transmits the alarm signal MA to an external control unit P. In some embodiments, when the servo unit 303 transmits the alarm signal MA, the control signal C1 is also sent to the pneumatic device 34 to turn it off.
In some embodiments, the pneumatic device 34 uses a normally closed valve element (Normal Close Valve) that automatically closes when a power outage or other abnormality occurs to avoid an unexpected situation.
Referring to fig. 4, in other embodiments, fluid detectors GS1 and GS2 are disposed in the main flow channel 311 and the discharge channel 33 of the nozzle 31 to detect the flow or presence of fluid, thereby indicating whether an abnormality occurs. For example, when the valve of the pneumatic device 34 is in the closed state, a flow of fluid in the main flow passage is detected, or the pneumatic device 34 is in the activated mode and the valve thereof is in the open state, but no flow of fluid is detected. In some embodiments, the fluid detector GS is electrically connected to the control unit P, and can transmit an alarm signal to the control unit P when the abnormality occurs. In some embodiments, the fluid detectors GS1, GS2 may constitute a fluid detection assembly GS.
An embodiment of the invention provides a hot plate cooling system for cooling a hot plate, which comprises a chamber and a cooling module. A hot plate is placed in the chamber. The cooling module is arranged in the cavity in an extending way and faces the hot plate for cooling the hot plate, and comprises a nozzle piece, a shell piece and a discharge channel. The nozzle member faces the hot plate for ejecting a working fluid to the hot plate. The housing member surrounds the nozzle member, and the nozzle member is disposed in the housing member. The housing member has a receiving slot surrounding the nozzle member. The discharge channel is connected with the shell piece and communicated with the containing groove. When the nozzle member ejects the working fluid to cool the hot plate, the working fluid is conveyed towards one surface of the hot plate through the nozzle member, and the working fluid is sequentially discharged out of the hot plate cooling system through the containing groove to the discharge channel.
In some embodiments, the platen cooling system includes a receiving unit, a sorting unit, and a servo unit. The receiving unit is used for receiving preset information and sensing temperature information of the hot plate to obtain state information. The classifying unit is electrically connected with the receiving unit and the classifying unit, and the servo unit is electrically connected with the pneumatic device. When the receiving unit compares the preset information and the temperature of the hot plate in the state information, the receiving unit transmits an alarm record to the classifying unit, and the receiving unit transmits the preset information and the state information to the classifying unit. The classifying unit classifies a preset temperature information according to the preset information, classifies a state temperature information according to the state information, and transmits the alarm record, the preset temperature information and the state temperature information to the servo unit. The servo unit transmits a control signal to the pneumatic device according to the alarm record, the preset temperature information and the state temperature information.
The embodiment of the invention has at least one of the following advantages or effects, and by the arrangement of the nozzle piece and the shell piece of the cooling module, the working fluid can smoothly cool the hot plate, and the working fluid can be timely and effectively recovered, so that the rapid and safe cooling effect is achieved. In addition, in some embodiments, the pneumatic device for delivering the working fluid in the cooling module is controlled by the servo unit, and the servo unit generates control signals according to the information of the receiving unit and the classifying unit, compared with the conventional temperature regulation method using the temperature controller, the embodiment of the invention uses the original sensing state information to regulate the temperature of the hot plate, reduces additional temperature control signals, ensures that the whole cooling module is more stable, can avoid the phenomenon of signal weakness, and improves the whole process efficiency and the quality.

Claims (7)

1. A platen cooling system for cooling a platen, comprising:
a chamber in which the hot plate is placed, and
A cooling module extending within the chamber and oriented toward the platen for cooling the platen, comprising:
A nozzle member facing the hot plate for ejecting a working fluid to the hot plate;
A housing member surrounding the nozzle member and disposed therein, wherein the housing member has a receiving slot surrounding the nozzle member, and
A discharge channel connected with the shell member and communicated with the containing groove;
Wherein when the working fluid is sprayed out of the nozzle piece to cool the hot plate, the working fluid is conveyed towards one surface of the hot plate through the nozzle piece, and is discharged out of the hot plate cooling system through the containing groove to the discharge channel in sequence,
The cooling module further comprises a pneumatic device arranged in a main flow channel of the nozzle piece and used for ejecting the working fluid from the nozzle piece through the main flow channel,
The platen cooling system further includes:
the receiving unit is used for receiving preset information and sensing the temperature information of the hot plate to obtain state information;
a classifying unit, and
The classifying unit is electrically connected with the receiving unit and the classifying unit, and the servo unit is electrically connected with the pneumatic device;
When the receiving unit compares the preset information with the temperature of the hot plate in the state information, the receiving unit transmits an alarm record to the classifying unit, and the receiving unit transmits the preset information and the state information to the classifying unit;
the classifying unit classifies a preset temperature information according to the preset information, classifies a state temperature information according to the state information, and transmits the alarm record, the preset temperature information and the state temperature information to the servo unit;
wherein the servo unit transmits a control signal to the pneumatic device according to the alarm record, the preset temperature information and the state temperature information,
The receiving unit receives state information of a plurality of different time points and transmits the state information to the classifying unit:
the classifying unit classifies a plurality of state temperature information according to the state information and transmits the state temperature information to the servo unit;
When the servo unit compares the state temperature information with the state temperature information and receives the alarm record, the servo unit transmits the control signal to the pneumatic device to start the pneumatic device.
2. A platen cooling system according to claim 1 wherein the nozzle member has a main flow passage and a nozzle, the nozzle communicating with the main flow passage and the nozzle protruding from the housing member.
3. A platen cooling system according to claim 1 wherein the nozzle member has a plurality of nozzles, the nozzles being received within the housing member and surrounded by the receiving slots.
4. A platen cooling system according to claim 3, wherein each nozzle has an elongated configuration and the direction of extension of the nozzles is not the same.
5. A platen cooling system according to claim 1, wherein the cooling module further comprises an air extraction device disposed in the exhaust passage for extracting the working fluid flowing through the receiving slot to the exhaust passage.
6. A platen cooling system according to claim 1, wherein the state temperature information includes a first state temperature information and a second state temperature information, and wherein the first state temperature information is received by the servo unit earlier than the second state temperature information;
when the trend from the first state temperature information to the preset temperature information is different from the trend from the second state temperature information to the first state preset temperature information, the servo unit transmits an alarm signal to an external control unit.
7. A platen cooling system according to claim 1, further comprising a fluid detection assembly disposed in a main flow path and the discharge path of the nozzle member.
CN202110285264.6A 2021-03-17 2021-03-17 Hot plate cooling system Active CN115116882B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110285264.6A CN115116882B (en) 2021-03-17 2021-03-17 Hot plate cooling system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110285264.6A CN115116882B (en) 2021-03-17 2021-03-17 Hot plate cooling system

Publications (2)

Publication Number Publication Date
CN115116882A CN115116882A (en) 2022-09-27
CN115116882B true CN115116882B (en) 2025-08-12

Family

ID=83322922

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110285264.6A Active CN115116882B (en) 2021-03-17 2021-03-17 Hot plate cooling system

Country Status (1)

Country Link
CN (1) CN115116882B (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009037299A1 (en) * 2009-08-14 2011-08-04 Leybold Optics GmbH, 63755 Device and treatment chamber for the thermal treatment of substrates
US9320171B2 (en) * 2014-06-05 2016-04-19 Toyota Motor Engineering & Manufacturing North America, Inc. Two-phase cooling systems, power electronics modules, and methods for extending maximum heat flux

Also Published As

Publication number Publication date
CN115116882A (en) 2022-09-27

Similar Documents

Publication Publication Date Title
JP5474030B2 (en) COOLING DEVICE AND OPERATION METHOD FOR FAN CONTROL
JP6905107B2 (en) Manufacturing methods and programs for substrate processing equipment, equipment management controllers, and semiconductor equipment
CN115116882B (en) Hot plate cooling system
JP2000241496A (en) Electronic part test device and test method of electronic part
JP6843273B2 (en) Plasma generator and information processing method
CN108225003B (en) Energy-saving hot air drying system and energy-saving hot air drying method
CN103703227B (en) Aircraft Control and Monitoring Systems
CN215568320U (en) Controller with feedback and electromagnetic pulse valve comprising same
US8315054B2 (en) Rack server center
CN109093649B (en) Heat dissipation device of transfer robot
TWI765571B (en) Hot plate cooling system
CN106468940B (en) Server cooling system
CN107238518A (en) A kind of constant speed flue gas sampling detection means
WO2003006933A2 (en) System and method for detecting occlusions in a semiconductor manufacturing device
CN102189311A (en) Power supply apparatus
CN115950662A (en) Performance test system and method for water separator
TWI505674B (en) Server system and a data transferring method thereof
JP2931641B2 (en) Heat treatment equipment
CN113418046A (en) Controller with feedback and electromagnetic pulse valve comprising same
CN205719674U (en) A kind of novel constant speed flue gas sampling detection device
CN100416042C (en) Method and device for monitoring a turbine cooling air system
CN205719875U (en) A kind of novel constant speed flue gas sampling detection equipment
US9859578B2 (en) Fuel cell assembly and method for operating a fuel cell assembly
JP2023527190A (en) SYSTEM AND METHOD FOR DETECTING OPERATING ABNORMALITY OF PLASMA GENERATOR BASED ON ARTIFICIAL INTELLIGENCE
CN112655280B (en) Plasma generating device and plasma head cooling method

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant